A display panel, a manufacturing method of the display panel, and a display device

Abstract

The application relates to the technical field of display devices, and discloses a display panel, a manufacturing method of the display panel and a display device. The display panel comprises a flexible substrate, a driving device layer located on the flexible substrate, a planar layer located on the driving device layer, a light-emitting device layer located on the planar layer, and an encapsulation layer located on the light-emitting device layer. The material of the flexible substrate is an inorganic material, the planar layer has a via hole, and the light-emitting device layer is connected with the driving device layer through the via hole. The display panel can realize smaller bending and can improve the transmittance of the display panel.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] The current flexible organic electroluminescent OLED display technology uses polyimide as a plastic substrate. After the device preparation is completed on the top, the polyimide and the carrier glass are separated to obtain a flexible display device. The presence of a plastic substrate can provide good physical protection for devices based on inorganic materials, but the presence of a polyimide plastic substrate also reduces the transmittance. Although colorless and transparent polyimide is being developed, there is still a problem of reduced optical performance of the plastic substrate after the high-temperature process of the display panel driver device layer. In order to achieve a smaller bending radius (R1, R0.1, R0.01) in a folding display panel, it is usually necessary to reduce the overall thickness of the device. The thickness of the plastic substrate is usually thicker, which will affect the bending radius of the folding display. Summary of the Invention

[0003] The present invention provides a display panel, a method for manufacturing the display panel, and a display device. The display panel can achieve smaller bending diameter change and improve the transmittance of the display panel.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A display panel comprises a flexible substrate, a driving device layer located on the flexible substrate, a planar layer located on the driving device layer, a light emitting device layer located on the planar layer, and an encapsulation layer located on the light emitting device layer;

[0006] The flexible substrate is made of an inorganic material, the flat layer has a via hole, and the light-emitting device layer is connected to the driving device layer through the via hole.

[0007] The display panel provided by the above-mentioned embodiment of the invention includes a flexible substrate, a driving device layer located on the flexible substrate, a flat layer located on the driving device layer, a light-emitting device layer located on the flat layer, and an encapsulation layer located on the light-emitting device layer; wherein, since the material of the flexible substrate is an inorganic material, compared with the existing technology, the plastic substrate can be removed, and a layer of inorganic material layer between the original driving device layer and the plastic substrate can be used as a flexible substrate, or a new inorganic material layer can be used as a flexible substrate. In this way, the flexible substrate can be an inorganic thin film, which can significantly reduce the thickness of the display panel, so that the folded display panel can achieve a smaller bending diameter change. Moreover, when the display panel is a transparent display panel, the use of a flexible substrate made of inorganic material can avoid the problem of optical performance degradation of the plastic substrate after the high-temperature process of the driving device layer, thereby improving the transmittance of the display panel.

[0008] Optionally, the material of the flexible substrate is any one of silicon oxide, silicon nitride, hydrogenated amorphous silicon, indium tin oxide, gallium oxide and gallium oxynitride.

[0009] Optionally, the material of the planar layer is polyimide.

[0010] Optionally, an adhesive layer is further included between the planar layer and the driving device layer.

[0011] Optionally, the material of the adhesive layer is hydrogenated amorphous silicon or a coupling modifier.

[0012] The present invention further provides a display device, comprising any one of the display panels provided in the above technical solutions.

[0013] The present invention also provides a method for manufacturing a display panel, comprising:

[0014] forming a flexible substrate on a rigid substrate, wherein the flexible substrate is made of an inorganic material;

[0015] forming a driving device layer on the flexible substrate;

[0016] forming a planar layer on the driving device layer, wherein the planar layer has a via hole;

[0017] forming a light-emitting device layer on the planar layer, wherein the light-emitting device layer is connected to the driving device layer through the via hole;

[0018] forming an encapsulation layer on the light-emitting device layer;

[0019] The rigid substrate is peeled off.

[0020] Optionally, forming a flexible substrate on a rigid substrate includes:

[0021] forming a metal material layer by evaporation on a rigid substrate;

[0022] depositing the flexible substrate on the metal material layer;

[0023] The step of peeling off the rigid substrate comprises:

[0024] A catalyst is used to separate the metal material layer from the flexible substrate.

[0025] Optionally, the material of the metal material layer is nickel, the material of the flexible substrate is silicon oxide, and the catalyst is water.

[0026] Optionally, peeling off the rigid substrate includes:

[0027] The flexible substrate is irradiated with laser light from a side of the rigid substrate away from the flexible substrate, so as to separate the rigid substrate from the flexible substrate.

[0028] Optionally, the material of the flexible substrate is any one of hydrogenated amorphous silicon, indium tin oxide, gallium oxide and gallium oxynitride.

[0029] Optionally, forming a planar layer on the driving device layer includes:

[0030] forming an organic material layer on the driving device layer;

[0031] Depositing an inorganic layer on the surface of the organic material layer, and forming a mask opening on the inorganic layer by an exposure and etching process;

[0032] The via hole is formed on the organic material layer by adopting a dry etching process to form the planar layer.

[0033] Optionally, forming an organic material layer on the driving device layer includes:

[0034] A polyimide solution is coated on the driving device layer and heated to form the organic material layer.

[0035] Optionally, before forming the planar layer on the driving device layer, the method further includes:

[0036] An adhesive layer is formed on the driving device layer.

[0037] Optionally, forming an adhesive layer on the driving device layer includes:

[0038] An adhesion layer whose material is a coupling modifier is formed on the driving device layer by steam; or an adhesion layer whose material is amorphous silicon is formed on the driving device layer by vapor deposition. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0040] Figure 2 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0041] Figure 3 A flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0042] Figure 4-10 A schematic diagram of the manufacturing process of a display panel provided by an embodiment of the present invention.

[0043] icon:

[0044] 1-flexible substrate; 2-driving device layer; 21-channel layer; 22-first gate insulation layer; 23-first gate metal layer; 24-second gate insulation layer; 25-second gate metal layer; 26-interlayer dielectric layer; 27-source and drain metal layer; 3-flat layer; 31-via; 4-light-emitting device layer; 41-first electrode layer; 42-pixel defining layer; 43-light-emitting layer; 44-second electrode layer; 5-encapsulation layer; 51-first inorganic thin film encapsulation layer; 52-organic thin film encapsulation layer; 53-second inorganic thin film encapsulation layer; 6-adhesive layer; 100-rigid substrate. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0046] Please refer to Figure 1 The present invention provides a display panel, comprising a flexible substrate 1, a driving device layer 2 located on the flexible substrate 1, a planar layer 3 located on the driving device layer 2, a light-emitting device layer 4 located on the planar layer 3, and an encapsulation layer 5 located on the light-emitting device layer 4;

[0047] The flexible substrate 1 is made of an inorganic material, the flat layer 3 has a via hole 31 , and the light-emitting device layer 4 is connected to the driving device layer 2 through the via hole 31 .

[0048] The display panel provided by the above-mentioned embodiment of the invention includes a flexible substrate 1, a driving device layer 2 located on the flexible substrate 1, a flat layer 3 located on the driving device layer 2, a light-emitting device layer 4 located on the flat layer 3, and an encapsulation layer 5 located on the light-emitting device layer 4; wherein, since the material of the flexible substrate 1 is an inorganic material, compared with the prior art, the plastic substrate can be removed, and a layer of inorganic material between the original driving device layer and the plastic substrate can be used as the flexible substrate, or a new inorganic material layer can be used as the flexible substrate. In this way, the flexible substrate can be an inorganic thin film, which can significantly reduce the thickness of the display panel, so that the foldable display panel can achieve a smaller bending diameter change. Moreover, when the display panel is a transparent display panel, the use of a flexible substrate 1 made of an inorganic material can avoid the problem of optical performance degradation of the plastic substrate after the high-temperature process of the driving device layer 2, thereby improving the transmittance of the display panel.

[0049] Specifically, the material of the flexible substrate 1 can be silicon oxide, silicon nitride, hydrogenated amorphous silicon, indium tin oxide (ITO), gallium oxide (Ga x O y) and gallium oxynitride (GaON), etc., or it can be other inorganic materials or a combination of inorganic materials. There is no specific limitation here and it depends on the actual situation.

[0050] In the embodiment of the present invention, a buffer layer is further provided between the driving device layer 2 and the flexible substrate 1; Figure 1 As shown, the driver device layer 2 may include a channel layer 21, a first gate insulating layer 22, a first gate metal layer 23, a second gate insulating layer 24, a second gate insulating layer 24, an interlayer dielectric layer 26 (ILD), and a source / drain metal layer 27, which are stacked in sequence. The source and drain electrodes in the source / drain metal layer 27 are connected to the channel layer 21 through vias, and the region of the channel layer 21 connecting to the source and drain electrodes is an ion-doped conductive region. Alternatively, the driver device layer 2 may have other film layer structures, which are not limited here and may be determined based on actual circumstances.

[0051] In an embodiment of the present invention, the material of the flat layer 3 can be polyimide. The material of the flat layer 3 needs to be an organic material. Using existing conventional flat layer materials may result in poor mechanical support performance of the flat layer. However, using conventional polyimide materials for making flexible substrates to make the flat layer 3 can improve the mechanical properties of the flat layer 3, and the flat layer 3 can become the force-bearing support layer of the entire display panel. For example, the material of the flat layer 3 can be selected from non-photosensitive polyimide with good mechanical properties, which can provide excellent force support. Optionally, the material of the flat layer can also be other polyimide materials, which are not limited here and can be determined according to actual conditions.

[0052] Specifically, if the display panel is a transparent display panel, the material of the above-mentioned flat layer 3 can be colorless and transparent polyimide. Since the flat layer 3 is manufactured after the driver device layer 2, it does not need to undergo high-temperature treatment when manufacturing the driver device layer 2, such as a high temperature of 400°C. Even if the colorless and transparent polyimide material has a lower temperature resistance, the optical performance will not be reduced after the subsequent high-temperature treatment of the driver device layer 2 (lower than the high-temperature treatment temperature for manufacturing the driver device layer 2). The material of the flat layer 3 has a lower demand for the expansion coefficient, which can save manufacturing costs and greatly improve the optical properties of the display panel. In addition, if the display panel does not need to be a transparent display panel, the material of the flat layer 3 does not need to be transparent polyimide, for example, it can be yellow polyimide. The specific material of the flat layer 3 is not limited here and can be selected according to actual conditions.

[0053] In the embodiment of the present invention, Figure 2As shown, the display panel may further include an adhesive layer 6 located between the planar layer 3 and the driver device layer 2. The interlayer dielectric layer 26 of the driver device layer 2 is stacked on the planar layer 3. The material of the interlayer dielectric layer 26 is an inorganic material. The organic film layer formed by coating on the interlayer dielectric layer 26 usually has weak adhesion and is prone to poor separation. The adhesive layer 6 is formed between the driver device layer 2 and the planar layer 3 to enhance the adhesion between the driver device layer 2 and the planar layer 3.

[0054] Specifically, the material of the bonding layer 6 may be hydrogenated amorphous silicon or a coupling modifier, etc. The coupling modifier may be a silicon-containing alkoxysilane, an amino-containing alkoxysilane compound, etc. For example, the silicon-containing alkoxysilane may be 3-aminopropyltriethoxysilane (gamma-Aminopropyltriethoxy Silane, γ-APS), and the amino-containing alkoxysilane compound may be 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-phenylaminopropyltrimethoxysilane, 2-aminophenyltrimethoxysilane, 3-aminophenyltrimethoxysilane, etc.

[0055] In the embodiment of the present invention, Figure 1 and Figure 2 As shown, the above-mentioned light-emitting device layer 4 may include a first electrode layer 41, a pixel defining layer 42, a light-emitting layer 43 and a second electrode layer 44. The first electrode layer 41 may include a first electrode distributed in an array, and the first electrode is connected to the source and drain metal layer 27 of the driving device layer 2 through a via on the flat layer 3. The pixel defining layer 42 is formed on the first electrode layer 41, and the area corresponding to the first electrode has an opening to expose the first electrode. The light-emitting layer 43 is located in the opening of the pixel defining layer 42, and the second electrode layer 44 covers the pixel defining layer 42. Among them, the first electrode can be an anode, and the second electrode layer can be a cathode. Specifically, the film structure of the light-emitting device layer 4 can also have other structures, which are not limited here and can be selected according to actual conditions.

[0056] In the embodiment of the present invention, the encapsulation layer 5 may include an inorganic thin film encapsulation layer and an organic thin film encapsulation layer that are sequentially stacked in an alternating manner, and both sides of the encapsulation layer 5 are inorganic thin film encapsulation layers. Figure 1 and Figure 2 As shown, the encapsulation layer 5 includes a first inorganic thin film encapsulation layer 51 , an organic thin film encapsulation layer 52 and a second inorganic thin film encapsulation layer 53 which are stacked.

[0057] Specifically, the display panel may further include a protective film disposed on the encapsulation layer 5 , which is not limited here and depends on actual conditions.

[0058] Based on the same inventive concept, the present invention further provides a display device, comprising any one of the display panels provided in the above technical solutions.

[0059] Based on the same inventive concept, the present invention also provides a method for manufacturing a display panel, such as Figure 3 As shown, the following steps are included:

[0060] S301: forming a flexible substrate 1 on a rigid substrate 100. The material of the flexible substrate 1 is an inorganic material, such as Figure 4 As shown;

[0061] S302: forming a driving device layer 2 on the flexible substrate 1, such as Figure 5 As shown;

[0062] S303: forming a flat layer 3 on the driving device layer 2, wherein the flat layer 3 has a via hole 31, such as Figure 6 As shown;

[0063] S304: forming a light emitting device layer 4 on the flat layer 3, and connecting the light emitting device layer 4 to the driving device layer 2 through the via hole 31, as shown in FIG. Figure 7 As shown;

[0064] S305: forming an encapsulation layer 5 on the light emitting device layer 4, such as Figure 8 As shown;

[0065] S306: peeling off the rigid substrate 100, such as Figure 1 shown.

[0066] The method for manufacturing a display panel provided by the above-mentioned embodiment of the invention includes forming a flexible substrate 1 on a rigid substrate 100, forming a driver device layer 2 on the flexible substrate 1, forming a flat layer 3 on the driver device layer 2, forming a light-emitting device layer 4 on the flat layer 3, forming an encapsulation layer 5 on the light-emitting device layer 4, and finally peeling off the rigid substrate 100. Since the material of the flexible substrate 1 is an inorganic material, compared with the existing technology, a plastic substrate does not need to be made during manufacturing. An inorganic material layer between the original driver device layer and the plastic substrate can be used as a flexible substrate, or a new inorganic material layer can be used as a flexible substrate. This can significantly reduce the thickness of the display panel, allowing the foldable display panel to achieve a smaller bending diameter change. In addition, when the display panel is a transparent display panel, using a flexible substrate 1 made of an inorganic material can avoid the problem of decreased optical performance of the plastic substrate after the high-temperature process of the driver device layer 2, thereby improving the transmittance of the display panel.

[0067] The rigid substrate 100 can be a glass substrate. Since the flexible substrate 1 is made of a flexible material in the embodiment, the process of peeling the rigid substrate 100 from the flexible substrate 1 cannot use the existing peeling process of the rigid substrate from the plastic substrate, and a new peeling method is needed to peel the rigid substrate 100 from the flexible substrate 1 made of an inorganic material.

[0068] Specifically, the step S301 can include the following steps.

[0069] S3011: evaporating a metal material layer on the rigid substrate 100; the metal material layer can be patterned into a size of a display panel using an OPEN Mask;

[0070] S3012: depositing the flexible substrate 1 on the metal material layer;

[0071] At this time, the step S306 of peeling the rigid substrate 100 can include the following step.

[0072] The process of peeling the rigid substrate 100 is a metal-inorganic interface separation technology, which can form an interface between the metal material layer and the flexible substrate 1, and then separate the interface without stress by adding a catalyst.

[0073] For example, in the metal-inorganic interface separation technology, the metal material layer can be made of nickel, the flexible substrate 1 can be made of silicon oxide, and the catalyst can be water. The materials of the metal material layer, the flexible substrate 1, and the catalyst can also be other combinations, which are not limited herein and can be determined according to actual conditions.

[0074] Alternatively, when the material of the flexible substrate 1 is a high-temperature-resistant inorganic compound material, the step S306 of peeling the rigid substrate 100 can include the following step: irradiating the flexible substrate 1 from the side of the rigid substrate 100 away from the flexible substrate 1 using a laser to separate the rigid substrate 100 from the flexible substrate 1. The inorganic compound material can resist high temperature and generate gas after laser irradiation, and the pressure of the gas can separate the flexible substrate 1 made of an inorganic material from the rigid substrate 100. The flat layer 3 can be used as a mechanical support of the display panel, so that the gas generated after laser irradiation will not cause the flexible substrate 1 to break.

[0075] Specifically, the material of the flexible substrate 1 can be any one of high-temperature-resistant hydrogenated amorphous silicon, indium tin oxide (ITO), gallium oxide (Ga x O y ) and gallium oxynitride (GaON), and can also be other materials or combinations of materials, which are not limited herein and can be determined according to actual conditions.

[0076] In the embodiment of the present invention, the step 302 of forming the driving device layer 2 on the flexible substrate 1 may specifically include:

[0077] S3021: depositing an amorphous silicon layer on the flexible substrate 1, and performing a high-temperature dehydrogenation process and an excimer laser annealing process on the amorphous silicon layer to convert the amorphous silicon layer into a polycrystalline silicon layer;

[0078] S3022: performing an exposure and etching process on the polysilicon layer to form a pattern of the channel layer 21, and performing a doping process on a portion of the channel layer 21 to form a conductive region;

[0079] S3023: forming a first gate insulating layer 22 on the channel layer 21;

[0080] S3024: forming a first metal layer on the first gate insulating layer 22, and patterning the first metal layer to form a first gate metal layer 23;

[0081] S3025: forming a second gate insulating layer 24 on the first gate metal layer 23;

[0082] S3026: forming a second metal layer on the second gate insulating layer 24, and patterning the second metal layer to form a second gate metal layer 25;

[0083] S3027: forming an interlayer dielectric layer 26 on the second gate metal layer 25, and exposing and etching the interlayer dielectric layer 26 to form a via hole opposite to the conductive area;

[0084] S3028: forming a third metal layer on the interlayer dielectric layer 26, and patterning the third metal layer to form a source-drain metal layer 27, wherein the source and drain in the source-drain metal layer 27 are connected to the conductive area of ​​the channel layer 21 through vias, such as Figure 5 shown.

[0085] Specifically, before forming the driving device layer 2 on the flexible substrate 1 in step S302 , the following steps may be further performed: depositing a buffer layer on the flexible substrate 1 ; wherein the material of the buffer layer may be silicon nitride and silicon oxide.

[0086] In the embodiment of the present invention, the above step S303 of forming the flat layer 3 on the driving device layer 2 may specifically include the following steps:

[0087] S3031: forming an organic material layer on the driver device layer 2; for example, forming an organic material layer on the source and drain metal layer 27 of the driver device layer 2;

[0088] S3032: depositing an inorganic layer on the surface of the organic material layer, and forming a mask opening on the inorganic layer by an exposure and etching process; wherein the material of the inorganic layer may be silicon oxide;

[0089] S3033: using a dry etching process, forming a via hole 31 on the organic material layer to form a flat layer 3; the source and drain patterns in the source and drain metal layer 27 can be exposed from the via hole, such as Figure 6 shown.

[0090] In particular, step S3031 forms an organic material layer on the driver device layer 2. Specifically, this can be accomplished by coating a polyimide solution on the driver device layer 2 and heating it to form the organic material layer. For example, a polyimide solution can be coated on the source / drain metal layer 27 of the driver device layer 2 and heated to form the organic material layer. Using a conventional polyimide material, such as that used to make a substrate, to make the flattening layer 3 can improve the mechanical properties of the flattening layer 3, allowing the flattening layer 3 to serve as a load-bearing support layer for the entire display panel. Specifically, the material of the flattening layer 3 can be a non-photosensitive polyimide with excellent mechanical properties.

[0091] In addition, the polyimide solution used to form the flat layer 3 can be a colorless and transparent polyimide solution, in which case the display panel can be a transparent display panel, or a colored polyimide solution, such as a yellow polyimide solution, in which case the display panel is not a transparent display panel. The type of polyimide solution can be determined based on actual conditions and is not limited here.

[0092] In the embodiment of the present invention, before forming the flat layer 3 on the driving device layer 2 in step S303, the following steps are further included: S3029: forming an adhesive layer 6 on the driving device layer 2, such as Figure 9 The adhesive layer 6 can be formed on the interlayer dielectric layer 26 of the driver device layer 2 except for the area where the source and drain metal layer 27 patterns are located, so that the patterns of the source and drain metal layer 27 can be exposed.

[0093] Specifically, the above step S3029 forms an adhesive layer 6 on the driver device layer 2, which can be specifically: forming an adhesive layer 6 made of a coupling modifier on the driver device layer 2 by vapor deposition, for example, forming an adhesive layer 6 made of a coupling modifier on the source-drain metal layer 27 by vapor deposition; or forming an adhesive layer 6 made of amorphous silicon on the driver device layer 2 by vapor deposition, for example, forming an adhesive layer 6 made of amorphous silicon on the source-drain metal layer 27 by vapor deposition. Subsequent production can form a flat layer 3 on the adhesive layer 6, and the dry etching process in the above step S3033 can simultaneously etch away the adhesive layer 6 on the drain, so that the drain is exposed from the via 31, as shown in FIG. Figure 10 shown.

[0094] In the embodiment of the present invention, the above step S304 forms the light emitting device layer 4 on the flat layer 3, and the specific steps may include:

[0095] S3041: depositing an ITO / AG / ITO material on the flat layer 3 and patterning to form a first electrode layer 41 , wherein the first electrode layer 41 has a plurality of first electrodes;

[0096] S3042: forming a pixel defining layer 42, wherein the pixel defining layer 42 has an opening corresponding to the first electrode;

[0097] S3043: forming a light-emitting layer 43 in the opening of the pixel defining layer 42 by using an evaporation process;

[0098] S3043: forming a second electrode layer 44 on the pixel definition layer 42 by using an evaporation process to form a light emitting structure, such as Figure 7 shown.

[0099] In the embodiment of the present invention, the above step S305 forms the encapsulation layer 5 on the light emitting device layer 4, including: forming an inorganic thin film encapsulation layer and an organic thin film encapsulation layer in sequence and alternately on the second electrode layer 42. Figure 8 As shown, the encapsulation layer 5 includes a first inorganic thin film encapsulation layer 51 , an organic thin film encapsulation layer 52 and a second inorganic thin film encapsulation layer 53 .

[0100] Specifically, after the above step S305 , the following step may further include: forming a protective film on the encapsulation layer 5 .

[0101] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display panel, characterized in that: The invention comprises a flexible substrate, a driving device layer located on the flexible substrate, a planar layer located on the driving device layer, a light emitting device layer located on the planar layer, and an encapsulation layer located on the light emitting device layer; Wherein, the material of the flexible substrate is an inorganic material, the flat layer has a via hole, and the light-emitting device layer is connected to the driving device layer through the via hole; The flexible substrate comprises only one film layer, and the flexible substrate is formed by removing the rigid substrate from an inorganic thin film layer between the rigid substrate and the driving device layer. The material of the flexible substrate is any one of silicon oxide, silicon nitride, hydrogenated amorphous silicon, indium tin oxide, gallium oxide, and gallium oxynitride; The material of the flat layer is non-photosensitive polyimide, and the flat layer is the force-bearing support layer of the entire display panel; The driving device layer includes a channel layer, which is formed by a polysilicon layer. The channel layer is in direct contact with the flexible substrate.

2. The display panel according to claim 1, wherein: An adhesive layer is also included between the planar layer and the driving device layer.

3. The display panel according to claim 2, wherein: The material of the adhesive layer is hydrogenated amorphous silicon or a coupling modifier.

4. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 3.

5. A method for manufacturing a display panel, characterized in that: include: forming a flexible substrate on a rigid substrate, wherein the flexible substrate comprises only one film layer and is made of an inorganic material; wherein the flexible substrate is made of any one of hydrogenated amorphous silicon, indium tin oxide, gallium oxide, and gallium oxynitride; forming a driving device layer on the flexible substrate, wherein the driving device layer includes a channel layer, the channel layer is formed by a polysilicon layer, and the channel layer is in direct contact with the flexible substrate; forming a flat layer on the driving device layer, wherein the flat layer has a via hole; the material of the flat layer is non-photosensitive polyimide, and the flat layer serves as a force-bearing support layer for the entire display panel; forming a light-emitting device layer on the planar layer, wherein the light-emitting device layer is connected to the driving device layer through the via hole; forming an encapsulation layer on the light-emitting device layer; The rigid substrate is peeled off.

6. The manufacturing method according to claim 5, characterized in that: The forming of a flexible substrate on a rigid substrate comprises: forming a metal material layer by evaporation on a rigid substrate; depositing the flexible substrate on the metal material layer; The step of peeling off the rigid substrate comprises: A catalyst is used to separate the metal material layer from the flexible substrate.

7. The production method according to claim 6, characterized in that: The material of the metal material layer is nickel, the material of the flexible substrate is silicon oxide, and the catalyst is water.

8. The manufacturing method according to claim 5, characterized in that: The step of peeling off the rigid substrate comprises: The flexible substrate is irradiated with laser light from a side of the rigid substrate away from the flexible substrate, so as to separate the rigid substrate from the flexible substrate.

9. The manufacturing method according to claim 5, characterized in that: The forming of a planar layer on the driving device layer comprises: forming an organic material layer on the driving device layer; Depositing an inorganic layer on the surface of the organic material layer, and forming a mask opening on the inorganic layer by an exposure and etching process; The via hole is formed on the organic material layer by adopting a dry etching process to form the planar layer.

10. The manufacturing method according to claim 9, characterized in that: The forming of an organic material layer on the driving device layer comprises: A polyimide solution is coated on the driving device layer and heated to form the organic material layer.

11. The production method according to any one of claims 5 to 10, characterized in that: Before forming the planar layer on the driving device layer, the method further includes: An adhesive layer is formed on the driving device layer.

12. The manufacturing method according to claim 11, characterized in that: The step of forming an adhesive layer on the driving device layer comprises: An adhesion layer whose material is a coupling modifier is formed on the driving device layer by steam; or an adhesion layer whose material is amorphous silicon is formed on the driving device layer by vapor deposition.

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