Cable assembly, signal transmission assembly, and communication system

Abstract

The application discloses a cable assembly, a signal transmission assembly and a communication system. The signal transmission assembly comprises a first chip, a first circuit board and a cable module. The first circuit board is provided with a first through hole. The cable module comprises a first fixing seat and a cable. The first fixing seat is fixed to the first circuit board and at least partially located in the first through hole. The first end of the cable is fixed to the first fixing seat. The first end of the cable can be directly electrically connected to the first signal pin of the first chip. In this way, the first end of the cable and the first chip are substantially connected at zero distance. The signal loss between the first chip and the first end of the cable is low. In addition, compared with a conventional signal transmission assembly, the signal transmission assembly of the application eliminates an electric connector. The layout space of the first circuit board can be greatly improved.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a cable assembly, a signal transmission assembly, and a communication system. Background Technology

[0002] In recent years, with the increase in signal bandwidth of communication systems, lower requirements have been placed on communication channel loss. Traditional communication systems include chips, printed circuit boards (PCBs), electrical connectors, and cables. Chips and electrical connectors are fixed to the PCB. Cables are electrically connected to the chips via electrical connectors. However, electrical connectors occupy a significant amount of space on the PCB, resulting in low space utilization. Summary of the Invention

[0003] This application provides a cable assembly, a signal transmission assembly, and a communication system with high PCB space utilization.

[0004] In a first aspect, this application provides a signal transmission component. The signal transmission component includes a first chip, a first circuit board, and a cable module. The first chip includes a first signal pin and a second signal pin arranged on the same side. The first circuit board has a first through-hole. The second signal pin is electrically connected to the first circuit board. The cable module includes a first mounting bracket and a cable. The first mounting bracket is fixed to the first circuit board and is at least partially located within the first through-hole. A first end of the cable is fixed to the first mounting bracket and is electrically connected to the first signal pin.

[0005] Understandably, compared to traditional signal transmission components, the first signal pin of the signal transmission component in this embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can achieve a near-zero-distance connection, meaning that a section of PCB connection and electrical connector connection can be omitted between the first signal pin of the first chip and the cable. This reduces signal loss caused by PCB traces (or PCB vias) and electrical connectors. It should be understood that by reducing signal loss from PCB traces (or PCB vias) and electrical connectors, the loss of the signal transmission component can be significantly reduced, which is crucial for meeting low-loss requirements.

[0006] Furthermore, compared to traditional signal transmission components, in this embodiment, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, the connection points between the first signal pin and the PCB, the PCB and the electrical connector, and the electrical connector and the cable can be eliminated. This reduces the number of connection points between the first signal pin and the first end of the cable, resulting in fewer discontinuities in the signal channel, which helps improve insertion loss fluctuations and resonance in the signal channel.

[0007] Furthermore, compared to traditional signal transmission components, the signal transmission component of this embodiment eliminates the need for via encapsulation between the first signal pin and the PCB, via encapsulation between the electrical connector and the PCB, and encapsulation between the electrical connector and the cable. The structure of the signal transmission component of this embodiment is relatively simple.

[0008] In addition, when the number of connection points between the first signal pin and the first end of the cable is reduced, and the number of discontinuities in the signal channel is smaller, signals from outside the signal transmission component are less likely to couple into the signal transmission component through the connection points between the first signal pin and the first end of the cable. This reduces the number of signal crosstalk coupling points and thus significantly reduces signal crosstalk.

[0009] Furthermore, since the cables of traditional signal transmission components are electrically connected to the PCB via electrical connectors, the placement of these connectors around the chip severely interferes with the chip's heat dissipation airflow and occupies PCB layout space. The signal transmission component of this embodiment eliminates the need for electrical connectors. Therefore, the heat dissipation airflow of the first chip is no longer interfered with by the electrical connectors. Additionally, the PCB layout space can be significantly improved, thus increasing the PCB's space utilization rate.

[0010] In one possible implementation, there is one cable used to transmit a high-speed signal; or, there are multiple cables used to transmit a high-speed signal, with at least one cable used to transmit a high-speed signal.

[0011] Understandably, when signal transmission components are used to transmit high-speed signals, communication systems demand lower loss from these components. An improperly designed signal transmission component can significantly increase loss, preventing it from meeting the low-loss requirements of the communication system. In this embodiment, a novel signal transmission component structure is used to minimize signal loss between the first chip and the cable, thereby meeting the low-loss requirements of the communication system. Furthermore, the maximum transmission bandwidth of the signal transmission component in this embodiment can reach 112 Gbps.

[0012] Furthermore, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, high-speed signals do not need to be transmitted to the cable via a PCB and electrical connectors. Thus, on the one hand, this embodiment no longer needs to consider the impact of low-grade substrate materials on the loss and degradation of high-speed signals on the first circuit board; that is, the material of the first circuit board can be low-grade substrate material, thereby significantly reducing the cost of the first circuit board. On the other hand, the first chip can use lower active driving costs to achieve signal transmission, thereby reducing system power consumption.

[0013] In one possible implementation, the first circuit board is used to transmit low-speed signals, power, or high-speed signals.

[0014] It is understandable that low-speed signals experience less transmission loss on the first circuit board, so directly transmitting low-speed signals through the first circuit board can meet the low-loss requirements of the communication system. Furthermore, transmitting low-speed signals and power directly through the first circuit board is relatively simple, as it eliminates the need for holes in the circuit board, resulting in lower costs.

[0015] Furthermore, although transmitting high-speed signals through the first circuit board results in significant signal loss, it can still meet communication requirements for some high-speed signals with lower channel loss requirements. This transmission method is relatively simple, requiring no holes in the first circuit board, thus reducing costs. Of course, some high-speed signals with high channel loss requirements can also be transmitted through the first circuit board. While this transmission method may not fully meet communication requirements, signal loss can be reduced through other improvements, thereby enabling it to meet those requirements.

[0016] In one possible implementation, the cable includes an inner conductor, a dielectric layer, and an outer conductor. The dielectric layer encloses the inner conductor. The outer conductor encloses the dielectric layer. The inner conductor is electrically connected to a first signal pin. The first chip also includes a first ground pin. The first ground pin provides a ground reference for the first signal pin. The first ground pin is electrically connected to the outer conductor. It is understood that this type of cable can generally form a coaxial cable. This type of cable offers better signal shielding. When the inner conductor of the cable is used to transmit signals, it is less susceptible to interference from other signals.

[0017] In one possible implementation, the cable module further includes a first pad. A portion of the first pad is fixed to the end face of the first end of the inner conductor. Another portion of the first pad is fixed to the end face of the first end of the dielectric layer. The first pad is electrically connected to the inner conductor of the cable and insulated from the outer conductor of the cable. The first pad is electrically connected to a first signal pin. It is understood that by providing the first pad on the end face of both the first end of the inner conductor and the first end of the dielectric layer, the connection area between the first signal pin and the inner conductor can be significantly increased, thereby reducing the difficulty of connecting the first signal pin to the inner conductor.

[0018] In one possible implementation, the cable module further includes a first spring contact. The first spring contact is fixed to a first solder pad. The first spring contact is electrically connected to a first signal pin.

[0019] Understandably, in the scheme where the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first mounting bracket, on the one hand, fixing the first signal pin to the first pad is difficult; on the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first pad to be at the same level as the pins of the first circuit board. Thus, if the distance between the pins of the first circuit board and the second signal pin is a standard distance, the distance between the first signal pin and the first pad is not likely to be a standard distance, meaning the distance between the first signal pin and the first pad is prone to error. Therefore, it is not easy to fix the first signal pin to the first pad. In this embodiment, by fixing a first spring contactor to each first pad, on the one hand, although the first spring contactor and the first signal pin are located between the first chip and the first mounting bracket, the first spring contactor is elastic, allowing for stable electrical connection through contact with the first signal pin. Thus, the electrical connection method between the first spring contactor and the first signal pin is simpler. On the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first pad to be at the same level as the third signal pin of the first circuit board. At this time, because the first spring is elastic, it can absorb the error in the distance between the first spring and the first signal pin, thereby ensuring that the first signal pin can be stably electrically connected to the first spring.

[0020] Furthermore, by setting a first spring contact on the first pad, the assembly method of the signal transmission component can be changed, thereby reducing the assembly difficulty of the signal transmission component. Specifically, when the first fixing seat is inserted into the first through hole of the first circuit board, the first fixing seat is not initially fixed to the first circuit board with adhesive. After multiple first spring contacts make contact with multiple first signal pins one-to-one, the first fixing seat is then fixed to the first circuit board with adhesive. In this way, compared to fixing the first fixing seat to the first circuit board first and then fixing the first signal pins to the first spring contact, this embodiment does not need to consider whether the pins of the first spring contact and the first circuit board are at the same level in advance, that is, it does not need to consider too much flatness issues between the first fixing seat and the first circuit board. In this way, the connection method between the first chip and the first circuit board and cable module is simpler. Therefore, by setting a first spring contact on the first pad, the flexibility of the connection between the first chip and the first circuit board and cable module can be increased.

[0021] In one possible implementation, the cable module further includes a first grounding layer. A portion of the first grounding layer is located on the surface of the first mounting base. Another portion of the first grounding layer is located on the end face of the first end of the outer conductor. The first grounding layer is electrically connected to the outer conductor of the cable and is insulated from the inner conductor of the cable. The first grounding layer is electrically connected to a first grounding pin.

[0022] It is understandable that by providing a first grounding layer on the surface of the first fixed base and the end face of the first end of the outer conductor, the contact area between the first grounding pin and the first end of the outer conductor can be increased, thereby reducing the difficulty of connecting the first grounding pin and the first end of the outer conductor.

[0023] In one possible implementation, the cable module further includes a second pad. The second pad is fixed to the surface of the first ground plane away from the first mounting base. The second pad is electrically connected to the first ground plane. The second pad is also electrically connected to the first ground pin. It is understood that providing a second pad on the first ground plane facilitates a fixed connection between the first ground pin and the first ground plane.

[0024] In one possible implementation, the signal transmission component further includes a socket connector. The socket connector is disposed between the first chip and the first circuit board. The socket connector includes a first signal spring and a second signal spring. One side of the first signal spring is electrically connected to a first signal pin, and the other side is electrically connected to a first end of a cable. One side of the second signal spring is electrically connected to a second signal pin, and the other side is electrically connected to the first circuit board.

[0025] Understandably, for the scheme where the first signal pin is directly fixed to the first end of the cable, on the one hand, fixing the first signal pin to the first end of the cable is difficult; on the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first end of the cable to be at the same level as the pin of the first circuit board. Thus, if the distance between the pin of the first circuit board and the second signal pin is a standard distance, the distance between the first signal pin and the first end of the cable is not likely to be a standard distance, meaning the distance between the first signal pin and the first end of the cable is prone to error. Therefore, it is not easy to fix the first signal pin to the first end of the cable. In this embodiment, by providing a socket connector between the first chip and the first circuit board, on the one hand, because the first signal spring is elastic, the first signal spring can achieve a stable electrical connection through contact with the first signal pin, and also through contact with the first end of the cable. Thus, the electrical connection method between the first signal spring and the first signal pin is simpler. The electrical connection method between the first signal spring and the first end of the cable is also simpler. On the other hand, when the first mounting bracket is fixed to the first circuit board, it is still difficult for the first signal spring to be at the same level as the pin of the first circuit board. Because the first signal spring is elastic, it can absorb the error in the distance between the first signal spring and the first signal pin, thus ensuring that the first signal spring can be fixed to the first signal pin. It can also absorb the error in the distance between the first signal spring and the first end of the cable, thus ensuring that the first signal spring can be fixed to the first end of the cable.

[0026] Furthermore, by providing a connector between the first chip and the circuit board, the assembly method of the signal transmission components can be changed, thereby reducing the assembly difficulty of the signal transmission components. Specifically, when the first fixing base is inserted into the first through hole of the first circuit board, the first fixing base is not initially fixed to the first circuit board with adhesive. After the multiple first signal springs and multiple first signal pins have made contact one-to-one, the first fixing base is then fixed to the first circuit board with adhesive. In this way, compared to fixing the first fixing base to the first circuit board first and then fixing the first signal pins to the first signal springs, this embodiment does not need to consider whether the pins of the first signal springs and the first circuit board are at the same level beforehand, that is, it does not need to consider too much about the flatness of the first fixing base and the first circuit board. In this way, the connection method between the first chip, the first circuit board, and the cable module is simpler. Therefore, by providing a connector between the first chip and the circuit board, the flexibility of the connection between the first chip, the first circuit board, and the cable module can be increased.

[0027] In one possible implementation, one side of the first signal spring is electrically connected to a first signal pin, and the other side is electrically connected to a first pad. One side of the second signal spring is electrically connected to a second signal pin, and the other side is electrically connected to a third signal pin on the first circuit board.

[0028] Understandably, in the scheme where the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first mounting bracket, on the one hand, fixing the first signal pin to the first pad is difficult; on the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first pad to be at the same level as the third signal pin of the first circuit board. Thus, if the distance between the third signal pin and the second signal pin of the first circuit board is a standard distance, the distance between the first signal pin and the first pad is not likely to be a standard distance, meaning the distance between the first signal pin and the first pad is prone to error. Therefore, it is not easy to fix the first signal pin to the first pad. In this embodiment, by setting a socket connector between the first chip and the first circuit board, on the one hand, although the first signal spring, the first signal pin, and the first pad are still located between the first chip and the first mounting bracket, because the first signal spring is elastic, it can achieve a stable electrical connection with either the first signal pin or the first pad through contact. Thus, the electrical connection method between the first signal spring and the first signal pin is simpler. The electrical connection between the first signal spring and the first pad is relatively simple. However, when the first mounting bracket is fixed to the first circuit board, it is still difficult for the first signal spring to be level with the pins of the first circuit board. Because the first signal spring is elastic, it can absorb errors in the distance between itself and the first signal pin, thus ensuring that the first signal spring can be fixed to the first signal pin, and it can also absorb errors in the distance between itself and the first pad, thus ensuring that the first signal spring can be fixed to the first pad.

[0029] In one possible implementation, the first fixing seat is interference-fitted with the wall of the first through hole. This provides a better connection between the first fixing seat and the first circuit board, and simplifies the assembly process.

[0030] In one possible implementation, the first chip further includes a second ground pin. The second ground pin provides a ground reference for the second signal pin. The second ground pin is electrically connected to the first circuit board and grounded through the first circuit board. It is understood that the second ground pin can shield signals on other signal pins (e.g., the first signal pin), thereby improving the second signal pin's immunity to signal crosstalk.

[0031] In one possible implementation, the cable module further includes a second mounting bracket. The middle portion of the cable is fixed to the second mounting bracket along its extension direction. It is understood that securing the middle portion of the cable with the second mounting bracket allows for neater arrangement of multiple cables.

[0032] In one possible implementation, the signal transmission component further includes a second circuit board and a second chip. The second chip includes a first signal terminal and a second signal terminal disposed on the same side. The second circuit board has a third through-hole. The second signal terminal is electrically connected to the second circuit board. The cable module further includes a third mounting bracket. The third mounting bracket is fixed to the second circuit board and is at least partially located within the third through-hole. The second end of the cable is fixed to the third mounting bracket and is electrically connected to the first signal terminal. It is understood that high-speed signals, low-speed signals, and power can be transmitted between the first circuit board and the second circuit board, i.e., through inter-board jumpers.

[0033] In one possible implementation, the second circuit board and the first circuit board are integrally formed, meaning they are a single unit. This allows high-speed signals, low-speed signals, and power to be transmitted between the first and second chips on the same circuit board, i.e., via internal jumpers.

[0034] Secondly, this application provides a communication system. The communication system includes a connector and a signal transmission component as described above. The connector electrically connects to a second end of a cable. The connector is also electrically connected to a first circuit board for electrical connection to a second signal pin via the first circuit board.

[0035] It is understandable that when signal transmission components are applied to communication systems, the signal loss of the communication system is low and the PCB space utilization is high.

[0036] In one possible implementation, the connector is a backplane connector. The backplane connector includes a female backplane connector socket and a male backplane connector socket. The female backplane connector socket is fixed to a first circuit board. The female backplane connector socket is electrically connected to a second end of a cable for electrical connection to a first signal pin via the cable. The female backplane connector socket is also electrically connected to the first circuit board for electrical connection to a second signal pin via the first circuit board. The communication system also includes a backplane. The male backplane connector socket is fixed to and electrically connected to the backplane. The female backplane connector socket is electrically connected to the male backplane connector socket.

[0037] In one possible implementation, the connector is an I / O connector. The communication system also includes a system circuit board and functional modules. The I / O connector is electrically connected to the system circuit board. The functional modules are fixed to the system circuit board. The functional modules are electrically connected to the system circuit board to connect to the I / O connector via the system circuit board.

[0038] Thirdly, this application provides a cable assembly. The cable assembly includes a first circuit board and a cable module. The first circuit board has a first through hole. The first circuit board is used for electrical connection with a second signal pin of a first chip. The cable module includes a first mounting bracket and a cable. The first mounting bracket is fixed to the first circuit board and is at least partially located within the first through hole. A first end of the cable is fixed to the first mounting bracket. The first end of the cable is used for electrical connection with a first signal pin of the first chip.

[0039] Understandably, compared to traditional signal transmission components, the first signal pin of the first chip in this embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can achieve a near-zero-distance connection, meaning that a section of PCB connection and electrical connector connection can be omitted between the first signal pin of the first chip and the cable. This reduces signal loss caused by PCB traces (or PCB vias) and electrical connectors. It should be understood that by reducing signal loss from PCB traces (or PCB vias) and electrical connectors, the loss of the signal transmission component can be significantly reduced, which is crucial for meeting low-loss requirements.

[0040] Furthermore, compared to traditional signal transmission components, in this embodiment, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, the connection points between the first signal pin and the PCB, the PCB and the electrical connector, and the electrical connector and the cable can be eliminated. This reduces the number of connection points between the first signal pin and the first end of the cable, resulting in fewer discontinuities in the signal channel, which helps improve insertion loss fluctuations and resonance in the signal channel.

[0041] Furthermore, compared to traditional signal transmission components, the signal transmission component of this embodiment eliminates the need for via encapsulation between the first signal pin and the PCB, via encapsulation between the electrical connector and the PCB, and encapsulation between the electrical connector and the cable. The structure of the signal transmission component of this embodiment is relatively simple.

[0042] In addition, when the number of connection points between the first signal pin and the first end of the cable is reduced, and the number of discontinuities in the signal channel is smaller, signals from outside the signal transmission component are less likely to couple into the signal transmission component through the connection points between the first signal pin and the first end of the cable. This reduces the number of signal crosstalk coupling points and thus significantly reduces signal crosstalk.

[0043] Furthermore, since the cables of traditional signal transmission components are electrically connected to the PCB via electrical connectors, the placement of these connectors around the chip severely interferes with the chip's heat dissipation airflow and occupies PCB layout space. The signal transmission component of this embodiment eliminates the need for electrical connectors. Therefore, the heat dissipation airflow of the first chip is no longer interfered with by the electrical connectors. Additionally, the PCB layout space can be significantly improved, thus increasing the PCB's space utilization rate.

[0044] In one possible implementation, there is one cable used to transmit a high-speed signal; or, there are multiple cables used to transmit a high-speed signal, with at least one cable used to transmit a high-speed signal.

[0045] Understandably, when signal transmission components are used to transmit high-speed signals, communication systems demand lower loss from these components. An improperly designed signal transmission component can significantly increase loss, preventing it from meeting the low-loss requirements of the communication system. In this embodiment, a novel signal transmission component structure is used to minimize signal loss between the first chip and the cable, thereby meeting the low-loss requirements of the communication system. Furthermore, the maximum transmission bandwidth of the signal transmission component in this embodiment can reach 112 Gbps.

[0046] Furthermore, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, high-speed signals do not need to be transmitted to the cable via a PCB and electrical connectors. Thus, on the one hand, this embodiment no longer needs to consider the impact of low-grade substrate materials on the loss and degradation of high-speed signals on the first circuit board; that is, the material of the first circuit board can be low-grade substrate material, thereby significantly reducing the cost of the first circuit board. On the other hand, the first chip can use lower active driving costs to achieve signal transmission, thereby reducing system power consumption.

[0047] In one possible implementation, the first circuit board is used to transmit low-speed signals, power, or high-speed signals.

[0048] It is understandable that low-speed signals experience less transmission loss on the first circuit board, so directly transmitting low-speed signals through the first circuit board can meet the low-loss requirements of the communication system. Furthermore, transmitting low-speed signals and power directly through the first circuit board is relatively simple, as it eliminates the need for holes in the circuit board, resulting in lower costs.

[0049] Furthermore, although transmitting high-speed signals through the first circuit board results in significant signal loss, it can still meet communication requirements for some high-speed signals with lower channel loss requirements. This transmission method is relatively simple, requiring no holes in the first circuit board, thus reducing costs. Of course, some high-speed signals with high channel loss requirements can also be transmitted through the first circuit board. While this transmission method may not fully meet communication requirements, signal loss can be reduced through other improvements, thereby enabling it to meet those requirements.

[0050] In one possible implementation, the cable includes an inner conductor, a dielectric layer, and an outer conductor. The dielectric layer wraps around the inner conductor, and the outer conductor wraps around the dielectric layer. The inner conductor is used for electrical connection to a first signal pin of a first chip. The outer conductor is used for electrical connection to a first ground pin of the first chip. The first ground pin provides a ground reference for the first signal pin. It is understood that this type of cable can generally be formed as a coaxial cable. This type of cable offers better signal shielding. When the inner conductor of the cable is used to transmit signals, it is less susceptible to interference from other signals.

[0051] In one possible implementation, the cable module further includes a first pad. A portion of the first pad is fixed to the end face of the first end of the inner conductor. Another portion of the first pad is fixed to the end face of the first end of the dielectric layer. The first pad is electrically connected to the inner conductor of the cable and insulated from the outer conductor of the cable. The first pad is used for electrical connection to a first signal pin of the first chip. It is understood that by providing the first pad on the end face of the first end of the inner conductor and the end face of the first end of the dielectric layer, the connection area between the first signal pin and the inner conductor can be significantly increased, thereby reducing the difficulty of connecting the first signal pin to the inner conductor.

[0052] In one possible implementation, the cable module further includes a first spring contact. The first spring contact is fixed to a first pad. The first spring contact is used for electrical connection with a first signal pin of the first chip.

[0053] Understandably, in the scheme where the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first mounting bracket, on the one hand, fixing the first signal pin to the first pad is difficult; on the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first pad to be at the same level as the pins of the first circuit board. Thus, if the distance between the pins of the first circuit board and the second signal pin is a standard distance, the distance between the first signal pin and the first pad is not likely to be a standard distance, meaning the distance between the first signal pin and the first pad is prone to error. Therefore, it is not easy to fix the first signal pin to the first pad. In this embodiment, by fixing a first spring contactor to each first pad, on the one hand, although the first spring contactor and the first signal pin are located between the first chip and the first mounting bracket, the first spring contactor is elastic, allowing for stable electrical connection through contact with the first signal pin. Thus, the electrical connection method between the first spring contactor and the first signal pin is simpler. On the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first pad to be at the same level as the third signal pin of the first circuit board. At this time, because the first spring is elastic, it can absorb the error in the distance between the first spring and the first signal pin, thereby ensuring that the first signal pin can be stably electrically connected to the first spring.

[0054] Furthermore, by setting a first spring contact on the first pad, the assembly method of the signal transmission component can be changed, thereby reducing the assembly difficulty of the signal transmission component. Specifically, when the first fixing seat is inserted into the first through hole of the first circuit board, the first fixing seat is not initially fixed to the first circuit board with adhesive. After multiple first spring contacts make contact with multiple first signal pins one-to-one, the first fixing seat is then fixed to the first circuit board with adhesive. In this way, compared to fixing the first fixing seat to the first circuit board first and then fixing the first signal pins to the first spring contact, this embodiment does not need to consider whether the pins of the first spring contact and the first circuit board are at the same level in advance, that is, it does not need to consider too much flatness issues between the first fixing seat and the first circuit board. In this way, the connection method between the first chip and the first circuit board and cable module is simpler. Therefore, by setting a first spring contact on the first pad, the flexibility of the connection between the first chip and the first circuit board and cable module can be increased.

[0055] In one possible implementation, the cable module further includes a first grounding layer. A portion of the first grounding layer is located on the surface of the first mounting base. Another portion of the first grounding layer is located on the end face of the first end of the outer conductor. The first grounding layer is electrically connected to the outer conductor of the cable. The first grounding layer is also insulated from the inner conductor of the cable. The first grounding layer is used for electrical connection to the first grounding pin of the first chip. It is understood that by providing the first grounding layer on the surface of the first mounting base and the end face of the first end of the outer conductor, the contact area between the first grounding pin and the first end of the outer conductor can be increased, thereby reducing the difficulty of connecting the first grounding pin to the first end of the outer conductor.

[0056] In one possible implementation, the cable module further includes a second pad. The second pad is fixed to the surface of the first ground layer away from the first mounting base. The second pad is electrically connected to the first ground layer. The second pad is insulated from the inner conductor of the cable. The second pad is used for electrical connection to the first ground pin of the first chip. It is understood that providing a second pad on the first ground layer facilitates a fixed connection between the first ground pin and the first ground layer.

[0057] In one possible implementation, the cable assembly further includes a socket connector. The socket connector is located on the same side of the first circuit board and the first mounting base. The socket connector includes a first signal spring and a second signal spring. One side of the first signal spring is electrically connected to a first signal pin, and the other side is electrically connected to a first end of the cable. One side of the second signal spring is electrically connected to a second signal pin, and the other side is electrically connected to the first circuit board.

[0058] In one possible implementation, one side of the first signal spring is electrically connected to a first signal pin, and the other side is electrically connected to a first pad. One side of the second signal spring is electrically connected to a second signal pin, and the other side is electrically connected to a third signal pin on the first circuit board.

[0059] Understandably, in the scheme where the first signal pin is directly fixed to the first pad, since the first signal pin and the first pad are located between the first chip and the first mounting bracket, on the one hand, fixing the first signal pin to the first pad is difficult; on the other hand, when the first mounting bracket is fixed to the first circuit board, it is difficult for the first pad to be at the same level as the third signal pin of the first circuit board. Thus, if the distance between the third signal pin and the second signal pin of the first circuit board is a standard distance, the distance between the first signal pin and the first pad is not likely to be a standard distance, meaning the distance between the first signal pin and the first pad is prone to error. Therefore, it is not easy to fix the first signal pin to the first pad. In this embodiment, by setting a socket connector between the first chip and the first circuit board, on the one hand, although the first signal spring, the first signal pin, and the first pad are still located between the first chip and the first mounting bracket, because the first signal spring is elastic, it can achieve a stable electrical connection with either the first signal pin or the first pad through contact. Thus, the electrical connection method between the first signal spring and the first signal pin is simpler. The electrical connection between the first signal spring and the first pad is relatively simple. However, when the first mounting bracket is fixed to the first circuit board, it is still difficult for the first signal spring to be level with the third signal pin of the first circuit board. Because the first signal spring is elastic, it can absorb errors in the distance between itself and the first signal pin, thus ensuring that the first signal spring can be fixed to the first signal pin, and it can also absorb errors in the distance between itself and the first pad, thus ensuring that the first signal spring can be fixed to the first pad.

[0060] Furthermore, by providing a connector between the first chip and the circuit board, the assembly method of the signal transmission components can be changed, thereby reducing the assembly difficulty of the signal transmission components. Specifically, when the first fixing base is inserted into the first through hole of the first circuit board, the first fixing base is not initially fixed to the first circuit board with adhesive. After the multiple first signal springs and multiple first signal pins have made contact one-to-one, the first fixing base is then fixed to the first circuit board with adhesive. In this way, compared to fixing the first fixing base to the first circuit board first and then fixing the first signal pins to the first signal springs, this embodiment does not need to consider whether the first signal springs and the third signal pins of the first circuit board are at the same level in advance, that is, it does not need to consider too much about the flatness of the first fixing base and the first circuit board. In this way, the connection method between the first chip, the first circuit board, and the cable module is simpler. Therefore, by providing a connector between the first chip and the circuit board, the flexibility of the connection between the first chip, the first circuit board, and the cable module can be increased.

[0061] In one possible implementation, the first fixing seat is interference-fitted with the wall of the first through hole. This provides a better connection between the first fixing seat and the first circuit board, and simplifies the assembly process.

[0062] In one possible implementation, the cable module further includes a second mounting bracket. The middle portion of the cable is fixed to the second mounting bracket along its extension direction. It is understood that securing the middle portion of the cable with the second mounting bracket allows for neater arrangement of multiple cables.

[0063] In one possible implementation, the cable assembly further includes a second circuit board. The second circuit board has a third through-hole. The second circuit board is used for electrical connection to a second signal terminal of the second chip. The cable module also includes a third mounting bracket. The third mounting bracket is fixed to the second circuit board and is at least partially located within the third through-hole. A second end of the cable is fixed to the third mounting bracket. The second end of the cable is used for electrical connection to a first signal terminal of the second chip.

[0064] In one possible implementation, the second circuit board and the first circuit board are integrally formed.

[0065] Fourthly, this application provides a signal transmission component. The signal transmission component includes a first chip and a cable module. The first chip includes a first signal pin. The cable module includes a first mounting base and a cable. A first end of the cable is fixed to the first mounting base and electrically connected to the first signal pin.

[0066] Understandably, compared to traditional signal transmission components, the first signal pin of the signal transmission component in this embodiment can be directly electrically connected to the first end of the cable. The first chip and the cable can achieve a near-zero-distance connection, meaning that a section of PCB connection and electrical connector connection can be omitted between the first signal pin of the first chip and the cable. This reduces signal loss caused by PCB traces (or PCB vias) and electrical connectors. It should be understood that by reducing signal loss from PCB traces (or PCB vias) and electrical connectors, the loss of the signal transmission component can be significantly reduced, which is crucial for meeting low-loss requirements.

[0067] Furthermore, compared to traditional signal transmission components, in this embodiment, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, the connection points between the first signal pin and the PCB, the PCB and the electrical connector, and the electrical connector and the cable can be eliminated. This reduces the number of connection points between the first signal pin and the first end of the cable, resulting in fewer discontinuities in the signal channel, which helps improve insertion loss fluctuations and resonance in the signal channel.

[0068] Furthermore, compared to traditional signal transmission components, the signal transmission component of this embodiment eliminates the need for via encapsulation between the first signal pin and the PCB, via encapsulation between the electrical connector and the PCB, and encapsulation between the electrical connector and the cable. The structure of the signal transmission component of this embodiment is relatively simple.

[0069] In addition, when the number of connection points between the first signal pin and the first end of the cable is reduced, and the number of discontinuities in the signal channel is smaller, signals from outside the signal transmission component are less likely to couple into the signal transmission component through the connection point between the first signal pin and the first end of the cable. This reduces the number of signal crosstalk coupling points and thus significantly reduces signal crosstalk.

[0070] Furthermore, since the cables of traditional signal transmission components are electrically connected to the PCB via electrical connectors, the placement of these connectors around the chip severely interferes with the chip's heat dissipation airflow and occupies PCB layout space. The signal transmission component of this embodiment eliminates the need for electrical connectors. Therefore, the heat dissipation airflow of the first chip is no longer interfered with by the electrical connectors. Additionally, the PCB layout space can be significantly improved, thus increasing the PCB's space utilization rate.

[0071] In one possible implementation, there is one cable used to transmit high-speed signals; or, there are multiple cables used to transmit high-speed signals, with at least one cable used to transmit high-speed signals.

[0072] Understandably, when signal transmission components are used to transmit high-speed signals, communication systems demand lower loss from these components. An improperly designed signal transmission component can significantly increase loss, preventing it from meeting the low-loss requirements of the communication system. In this embodiment, a novel signal transmission component structure is used to minimize signal loss between the first chip and the cable, thereby meeting the low-loss requirements of the communication system. Furthermore, the maximum transmission bandwidth of the signal transmission component in this embodiment can reach 112 Gbps.

[0073] Furthermore, since the first signal pin of the first chip can be directly electrically connected to the first end of the cable, high-speed signals do not need to be transmitted to the cable via a PCB and electrical connectors. Thus, on the one hand, this embodiment no longer needs to consider the impact of low-grade substrate materials on the loss and degradation of high-speed signals on the first circuit board; that is, the material of the first circuit board can be low-grade substrate material, thereby significantly reducing the cost of the first circuit board. On the other hand, the first chip can use lower active driving costs to achieve signal transmission, thereby reducing system power consumption.

[0074] In one possible implementation, the first circuit board is used to transmit low-speed signals, power, or high-speed signals.

[0075] It is understandable that low-speed signals experience less transmission loss on the first circuit board, so directly transmitting low-speed signals through the first circuit board can meet the low-loss requirements of the communication system. Furthermore, transmitting low-speed signals and power directly through the first circuit board is relatively simple, as it eliminates the need for holes in the circuit board, resulting in lower costs.

[0076] Furthermore, although transmitting high-speed signals through the first circuit board results in significant signal loss, it can still meet communication requirements for some high-speed signals with lower channel loss requirements. This transmission method is relatively simple, requiring no holes in the first circuit board, thus reducing costs. Of course, some high-speed signals with high channel loss requirements can also be transmitted through the first circuit board. While this transmission method may not fully meet communication requirements, signal loss can be reduced through other improvements, thereby enabling it to meet those requirements.

[0077] In one possible implementation, the cable includes an inner conductor, a dielectric layer, and an outer conductor. The dielectric layer encloses the inner conductor. The outer conductor encloses the dielectric layer. The inner conductor is electrically connected to a first signal pin. The first chip also includes a first ground pin. The first ground pin provides a ground reference for the first signal pin. The first ground pin is electrically connected to the outer conductor. It is understood that this type of cable can generally form a coaxial cable. This type of cable offers better signal shielding. When the inner conductor of the cable is used to transmit signals, it is less susceptible to interference from other signals.

[0078] In one possible implementation, the cable module further includes a first pad. A portion of the first pad is fixed to the end face of the first end of the inner conductor. Another portion of the first pad is fixed to the end face of the first end of the dielectric layer. The first pad is electrically connected to the inner conductor of the cable and insulated from the outer conductor of the cable. The first pad is electrically connected to a first signal pin. It is understood that by providing the first pad on the end face of both the first end of the inner conductor and the first end of the dielectric layer, the connection area between the first signal pin and the inner conductor can be significantly increased, thereby reducing the difficulty of connecting the first signal pin to the inner conductor.

[0079] In one possible implementation, the cable module further includes a first spring contact. The first spring contact is fixed to a first solder pad. The first spring contact is electrically connected to a first signal pin.

[0080] In one possible implementation, the cable module further includes a first grounding layer. A portion of the first grounding layer is located on the surface of the first mounting base. Another portion of the first grounding layer is located on the end face of the first end of the outer conductor. The first grounding layer is electrically connected to the outer conductor of the cable and is insulated from the inner conductor of the cable. The first grounding layer is electrically connected to a first grounding pin.

[0081] It is understandable that by providing a first grounding layer on the surface of the first fixed base and the end face of the first end of the outer conductor, the contact area between the first grounding pin and the first end of the outer conductor can be increased, thereby reducing the difficulty of connecting the first grounding pin and the first end of the outer conductor.

[0082] In one possible implementation, the cable module further includes a second pad. The second pad is fixed to the surface of the first ground layer away from the first mounting base. The second pad is electrically connected to the first ground layer. The second pad is also electrically connected to the first ground pin. It is understood that providing a second pad on the first ground layer facilitates a fixed connection between the first ground pin and the first ground layer.

[0083] In one possible implementation, the signal transmission component further includes a socket connector. The socket connector is disposed between the first chip and the cable module. The socket connector includes a first signal spring. One side of the first signal spring is electrically connected to a first signal pin. The other side is electrically connected to a first end of the cable.

[0084] In one possible implementation, one side of the first signal spring is electrically connected to the first signal pin, and the other side is electrically connected to the first pad.

[0085] In one possible implementation, the cable module further includes a second mounting bracket. The middle portion of the cable is fixed to the second mounting bracket along its extension direction. It is understood that securing the middle portion of the cable with the second mounting bracket allows for neater arrangement of multiple cables.

[0086] In one possible implementation, the signal transmission component further includes a second chip. The second chip includes a first signal terminal. The cable module also includes a third mounting bracket. A second end of the cable is fixed to the third mounting bracket and electrically connected to the first signal terminal.

[0087] In one possible implementation, the second circuit board and the first circuit board are integrally formed, that is, the first circuit board and the second circuit board are a whole. Attached Figure Description

[0088] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0089] Figure 1a This is a schematic diagram of one embodiment of the electronic device provided in this example;

[0090] Figure 1b This is a schematic diagram of another implementation of the electronic device provided in this embodiment;

[0091] Figure 1c yes Figure 1a The diagram shows a partial structural schematic of the electronic device.

[0092] Figure 1d This is a schematic diagram of one embodiment of the signal transmission component provided in this application;

[0093] Figure 2 yes Figure 1d An exploded view of the signal transmission components shown.

[0094] Figure 3 yes Figure 2 The diagram shows the structure of the first chip from another angle.

[0095] Figure 4 yes Figure 2 The diagram shows the structure of the first circuit board from another angle;

[0096] Figure 5 yes Figure 1d The diagram shows a partial cross-sectional view of the signal transmission component at line AA.

[0097] Figure 6 yes Figure 2 The diagram shown is an exploded view of the cable module.

[0098] Figure 7 yes Figure 6 The diagram shows the structure of the first mounting bracket of the cable module at another angle.

[0099] Figure 8 yes Figure 6 The diagram shows the cable structure of the cable module shown.

[0100] Figure 9a yes Figure 8 The diagram shows an enlarged view of the cable at line B1.

[0101] Figure 9b yes Figure 8 The diagram shows a cross-sectional view of the cable at line B2-B2.

[0102] Figure 10 yes Figure 2 The diagram shows the structure of the cable module from another angle;

[0103] Figure 11 yes Figure 10 The diagram shows an enlarged view of the cable module at point C.

[0104] Figure 12 yes Figure 2 The diagram shows an enlarged view of the cable module at point D.

[0105] Figure 13 yes Figure 12 The diagram shows a cross-sectional view of the cable module at EE.

[0106] Figure 14 yes Figure 1d The diagram shows a cross-sectional view of the signal transmission component at line AA.

[0107] Figure 15a yes Figure 1d A cross-sectional schematic diagram of another embodiment of the signal transmission component shown at line AA;

[0108] Figure 15b yes Figure 15a The diagram shows an enlarged view of the signal transmission component at point F.

[0109] Figure 16 This is a schematic diagram of the structure of the socket connector provided in the embodiments of this application;

[0110] Figure 17 yes Figure 1d A cross-sectional schematic diagram of another embodiment of the signal transmission component shown at line AA;

[0111] Figure 18 yes Figure 2 A schematic diagram of another embodiment of the cable module shown;

[0112] Figure 19 This is a schematic diagram of one embodiment of the communication system provided in this application.

[0113] Figure 20 This is a schematic diagram of another implementation of the communication system provided in this application;

[0114] Figure 21 This is a schematic diagram of another embodiment of the signal transmission component provided in this application;

[0115] Figure 22 yes Figure 21 An exploded view of the signal transmission components shown.

[0116] Figure 23 yes Figure 22 The diagram shows the structure of the second chip.

[0117] Figure 24 This is a schematic diagram of another embodiment of the signal transmission component provided in this application.

[0118] Figure 25 yes Figure 24 The diagram shows an exploded view of the signal transmission components. Detailed Implementation

[0119] To facilitate understanding of the communication system provided in the embodiments of this application, the relevant terms used in this application are explained as follows:

[0120] Gbps: A unit of data transfer rate, meaning that 10 bits of data are transmitted per second per unit of time. 9 Bit.

[0121] Crosstalk: Crosstalk refers to the coupling effect that allows harmful signals to travel from one network to another.

[0122] Loss: Loss refers to the energy loss that occurs when a signal propagates along a transmission line. It can be caused by five factors: dielectric loss, conductor loss, external radiation, impedance mismatch reflection, and external coupling to neighboring networks. Loss is usually characterized and measured by S-parameters.

[0123] Impedance: mainly refers to the characteristic impedance of a transmission line, which is defined as the ratio of voltage to current at any point on the transmission line.

[0124] PCB packaging refers to the arrangement of pads and vias on a printed circuit board that correspond to the pins of components such as Ball Grid Array Package (BGA) chips and electrical connectors. It provides a via and pad arrangement scheme for a region and is the part of the printed circuit board that mates with the components.

[0125] Ground: A transmission line is generally composed of two conductors of a certain length. One conductor serves as the signal path to transmit the signal, and the other serves as the return path to transmit the return current of the signal. This return path is usually called "ground".

[0126] The embodiments of this application are described below with reference to the accompanying drawings.

[0127] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed" means that the devices are connected to each other and their relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" means at least two.

[0128] Please see Figure 1a and Figure 1b , Figure 1a This is a schematic diagram of one embodiment of the electronic device 2000 provided in this example. Figure 1b This is a schematic diagram of another embodiment of the electronic device 2000 provided in this example. The electronic device 2000 can be a switch, router, server, wavelength division multiplexing (WDM), optical line terminal (OLT), or optical network terminal (ONT), etc. Furthermore, the electronic device 2000 can be a chassis-type device (e.g., a chassis switch, chassis router, etc.) or a box-type device (e.g., a box switch, box router, etc.). In this embodiment, Figure 1a The structure of the electronic device 2000 is schematically shown as a chassis switch. Figure 1b The structure of the electronic device 2000 is schematically shown as a box-type switch.

[0129] Please see Figure 1c , Figure 1c yes Figure 1aThe diagram shows a partial structural schematic of the electronic device 2000. The electronic device 2000 includes a housing 2100 and a functional board 2200. The functional board 2200 is disposed within the housing 2100. The housing 2100 houses the functional board 2200. The functional board 2200 can be used to transmit signals. The functional board 2200 includes a first chip, a first circuit board, a cable module, and a connector, which will be mentioned below. Specific details will be described below in conjunction with the accompanying drawings. Further details will not be repeated here. It should be noted that this application will provide a communication system. The communication system can be a system composed of multiple electronic devices 2000 (e.g., a system composed of multiple electronic devices of the same type, or a system composed of multiple electronic devices of different types), a system composed of a single electronic device 2000, or a system composed of some components of the electronic device 2000 (e.g., the functional board 2200, or a portion of the functional board 2200). The functional board 2200 may include a main control board, a switching board, or a line card, etc., depending on its functional implementation. There is no specific limit to the number of main control boards, switching boards, or line cards.

[0130] Please see Figure 1d , Figure 1d This is a schematic diagram of one embodiment of the signal transmission component 100 provided in this application. The signal transmission component 100 is used to transmit high-speed signals and low-speed signals. High-speed signals can be signals with a transmission rate greater than or equal to 1Gbps, and a rise and fall time less than or equal to 350ps. For example, high-speed signals can be Ethernet SerDes or PCIe 5.0, etc. Low-speed signals can be signals with a transmission rate less than 1Gbps, and a rise and fall time greater than 350ps. For example, low-speed signals can be I2C signals, SPI signals, or Cat5 network cable signals, etc. The signal transmission component 100 has low loss and good anti-crosstalk capability. Specific details will be described in detail below, and will not be repeated here. In this embodiment, the signal transmission component 100 has multiple configuration methods. The following will describe the signal transmission component 100 of various embodiments in detail with reference to the relevant accompanying drawings.

[0131] First implementation method: Please refer to Figure 2 and combined Figure 1d As shown, Figure 2 yes Figure 1dThe diagram shows an exploded view of the signal transmission component 100. The signal transmission component 100 includes a first chip 10, a first circuit board 20, and a cable module 30. The first circuit board 20 and the cable module 30 cooperate to form a cable assembly 101. The first chip 10 is used to transmit high-speed and low-speed signals. This application does not specifically limit the type of the first chip 10. The first circuit board 20 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The first circuit board 20 can use an FR-4 dielectric substrate, a Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc. Here, FR-4 is a designation for a flame-retardant material grade. A Rogers dielectric substrate is a high-frequency board. This application also does not specifically limit the type of the first circuit board 20.

[0132] Please see Figure 3 , Figure 3 yes Figure 2 The diagram shows the structure of the first chip 10 from another angle. The first chip 10 includes a first chip body 11, a plurality of first signal pins 12, a plurality of first ground pins 13, a plurality of second signal pins 14, and a plurality of second ground pins 15.

[0133] It should be noted that, Figure 3 The first signal pin 12, the first ground pin 13, the second signal pin 14, and the second ground pin 15 are illustrated using different fillers. In this embodiment, the structures of the multiple first signal pins 12 are identical, and all first signal pins 12 can use the same reference numerals. Furthermore, for the sake of simplicity in the drawings, Figure 3 This diagram only shows one first signal pin 12. In other embodiments, the structures of multiple first signal pins 12 may differ. The first signal pins 12 may use different labels. The labeling methods for the first ground pin 13, the second signal pin 14, and the second ground pin 15 can be found in the labeling method for the first signal pin 12. Furthermore, when multiple identical components appear below, their labeling methods can also refer to the labeling method for the first signal pin 12. Specific details will not be elaborated further below.

[0134] In other embodiments, the number of first signal pins 12 may also be one. The number of first ground pins 13 may also be one. The number of second signal pins 14 may also be one. The number of second ground pins 1 may also be one. Specifically, this embodiment is not limited.

[0135] The first signal pin 12 can be a solder ball, a solder pad, a spring-loaded pin, or a spring pin, etc. This application does not impose any specific limitations, and the choice can be flexible according to product requirements. In this embodiment, the first signal pin 12 is described using a solder ball as an example. Furthermore, the configuration methods of the first ground pin 13, the second signal pin 14, and the second ground pin 15 can all refer to the configuration method of the first signal pin 12.

[0136] Please refer to it again. Figure 3 The first chip body 11 includes an upper surface 111 facing opposite directions (see [reference]). Figure 2 The lower end surface 112 of the first chip body 11 has a first region 1121, a second region 1122, and a third region 1123 connected in sequence. It should be noted that... Figure 3 The first region 1121, the second region 1122, and the third region 1123 are schematically distinguished by dashed lines. It should be understood that in this embodiment, the number, position, shape, and size of the first region 1121, the second region 1122, and the third region 1123 are not subject to... Figure 3 Limited by.

[0137] In this configuration, multiple first signal pins 12 and multiple first ground pins 13 are located within a first region 1121. The first ground pins 13 are located around the periphery of the first signal pins 12. The multiple first signal pins 12 and multiple first ground pins 13 can be arranged in an array. It should be understood that the arrangement of the first signal pins 12 and first ground pins 13 in the first region 1121 is not limited to... Figure 3 The intended arrangement.

[0138] Furthermore, multiple second signal pins 14 and multiple second ground pins 15 are located within the third region 1123. The second signal pins 14 and the first signal pins 12 are located on the same side of the first chip body 11. The second ground pins 15 are located around the second signal pins 14. The multiple second signal pins 14 and multiple second ground pins 15 can be arranged in multiple rows and columns. It should be understood that the arrangement of the second signal pins 14 and second ground pins 15 in the third region 1123 is not limited to... Figure 3 The intended arrangement.

[0139] Furthermore, the second region 1122 is a blank area, meaning that no pins or other structures are provided in the second region 1122. In this way, the first signal pin 12 and the first ground pin 13 can be separately configured from the second signal pin 14 and the second ground pin 15 through the second region 1122. In other embodiments, the first chip body 11 may not include the second region 1122. In this case, the first region 1121 is directly connected to the third region 1123.

[0140] In this embodiment, the first signal pin 12 is used to transmit high-speed signals. For example, the first signal pin 12 is used to transmit high-speed signals greater than or equal to 25Gbps. The first ground pin 13 is the ground reference for the first signal pin 12, i.e., the return path for the high-speed signal. The first ground pin 13 can shield signals on other signal pins (e.g., the second signal pin 14), thereby improving the immunity of the first signal pin 12 to signal crosstalk. In other embodiments, the signal transmitted by the first signal pin 12 is not specifically limited.

[0141] It should be understood that in this embodiment, there are multiple first signal pins 12. Each first signal pin 12 is used to transmit a high-speed signal. In other embodiments, when there is only one first signal pin 12, one first signal pin 12 can transmit a high-speed signal. When there are multiple first signal pins 12, at least one first signal pin 12 is used to transmit a high-speed signal. For example, when there are two first signal pins 12, one first signal pin 12 is used to transmit a high-speed signal, and the other first signal pin 12 is used to transmit a low-speed signal or power.

[0142] In this embodiment, the second signal pin 14 is used to transmit low-speed signals or power. The second ground pin 15 serves as a ground reference for the second signal pin 14. The second ground pin 15 can shield signals on other signal pins (e.g., the first signal pin 12), thereby improving the immunity of the second signal pin 14 to signal crosstalk. In other embodiments, the signals transmitted by the second signal pin 14 are not specifically limited.

[0143] In other embodiments, by fixing a heat sink (not shown) to the upper end surface 111 of the first chip body 11, the heat sink can reduce the temperature of the first chip body 11 when the first chip body 11 generates heat, thereby improving the reliability of the first chip 10.

[0144] Please see Figure 4 and combined Figure 2 As shown, Figure 4 yes Figure 2 The diagram shows the structure of the first circuit board 20 from another angle. The first circuit board 20 includes an upper end face 21 and a lower end face 22 facing opposite directions (see [reference]). Figure 2 The first circuit board 20 is provided with a first through hole 23. The first through hole 23 extends from the upper end face 21 of the first circuit board 20 to the lower end face 22 of the first circuit board 20, that is, the first through hole 23 penetrates both the upper end face 21 and the lower end face 22 of the first circuit board 20. The position, size, and shape of the first through hole 23 are not limited to... Figure 2 and Figure 4 The indicated location, size, and shape.

[0145] In addition, the first circuit board 20 has multiple third signal pins 24 and multiple third ground pins 25. The third signal pins 24 can be pads, solder balls, spring-loaded pins, or other similar devices. This application does not impose specific limitations and the choice can be flexible according to product requirements. In this embodiment, the third signal pin 24 is described using a pad as an example. Furthermore, the arrangement of the third ground pins 25 can be found in the section on the arrangement of the third signal pins 24.

[0146] Additionally, multiple third signal pins 24 and multiple third ground pins 25 are located on the upper surface 21 of the first circuit board 20. The multiple third signal pins 24 and multiple third ground pins 25 are arranged around the first through-hole 23. The multiple third signal pins 24 and multiple third ground pins 25 can be arranged in multiple rows and columns. The third ground pins 25 are located around the periphery of the third signal pins 24. For example, the arrangement of the third signal pins 24 on the first circuit board 20 is similar to that of the second signal pins 14 (see [link to documentation]). Figure 3 ) In the first chip body 11 (see Figure 3 The third ground pin 25 is arranged in the same way as the second ground pin 15 on the first circuit board 20. Figure 3 The arrangement of the first chip body 11 is the same.

[0147] Please see Figure 5 and combined Figure 3 and Figure 4 As shown, Figure 5 yes Figure 1d The diagram shows a partial cross-sectional view of the signal transmission component 100 at line AA. A first chip 10 is fixed to and electrically connected to a first circuit board 20. The lower end face 112 of the first chip body 11 is opposite to the upper end face 21 of the first circuit board 20, meaning the upper end face 21 of the first circuit board 20 faces the first chip 10. The upper end face 111 of the first chip body 11 is opposite to the upper end face 21 of the first circuit board 20. The lower end face 22 of the first circuit board 20 is opposite to the lower end face 112 of the first chip body 11. Furthermore, a first region 1121 of the first chip body 11 is opposite to a first through-hole 23 of the first circuit board 20.

[0148] Furthermore, the plurality of second signal pins 14 of the first chip 10 are fixed and electrically connected to the plurality of third signal pins 24 of the first circuit board 20 in a one-to-one correspondence. For example, the second signal pins 14 can be connected to the third signal pins 24 using processes such as laser welding or induction welding. In this case, low-speed signals or power from the first chip 10 can be transmitted to the first circuit board 20 through the second signal pins 14 and the third signal pins 24.

[0149] Furthermore, the plurality of second ground pins 15 of the first chip 10 are fixed and electrically connected to the plurality of third ground pins 25 of the first circuit board 20 in a one-to-one correspondence. For example, the second ground pins 15 can be connected to the third ground pins 25 using processes such as laser welding or induction welding. In this way, the second ground pins 15 can be grounded through the third ground pins 25.

[0150] Please see Figure 6 , Figure 6 yes Figure 2 The diagram shows an exploded view of the cable module 30. The cable module 30 includes a first mounting base 31 and multiple cables 32. It should be understood that the number, size, and shape of the cables 32 are not limited to... Figure 6 The quantity, size, and shape are shown. For example, the number of cables 32 is the same as the number of first signal pins 12.

[0151] Please see Figure 7 and combined Figure 6 As shown, Figure 7 yes Figure 6 The diagram shows the structure of the first mounting base 31 of the cable module 30 from another angle. The first mounting base 31 includes an upper end face 311 and a lower end face 312 facing opposite directions. The first mounting base 31 is provided with a plurality of second through holes 313. Each second through hole 313 extends from the upper end face 311 of the first mounting base 31 to the lower end face 312 of the first mounting base 31, that is, each second through hole 313 penetrates both the upper end face 311 and the lower end face 312 of the first mounting base 31. It should be understood that the position, size, and shape of the second through holes 313 are not limited to... Figure 6 and Figure 7 The indicated location, size, and shape.

[0152] For example, the number of second vias 313 is the same as the number of cables 32. The arrangement of the second vias 313 is the same as that of the first signal pins 12 (see [link]). Figure 3 The arrangement of ) is the same.

[0153] Please refer to it again. Figure 7 and combined Figure 6 As shown, the first fixing base 31 is made of liquid crystal polymer (LCP). This gives the first fixing base 31 superior strength, corrosion resistance, and electrical insulation. In other embodiments, the first fixing base 31 may be made of other plastic materials or insulating materials.

[0154] For example, the first fixing seat 31 can be formed by injection molding. In this case, the first fixing seat 31 has fewer steps to form and the processing cost is lower.

[0155] For example, the first fixed base 31 can also be formed by a computerized numerical control machine (CNC). In this way, the dimensions of the first fixed base 31 and the dimensions of the second through hole 313 are more accurate.

[0156] Please see Figure 8 , Figure 8 yes Figure 6 The diagram shows the structure of cable 32 in cable module 30. Since the structure of each cable 32 in this embodiment is identical, the following description will use one cable 32 as an example. Cable 32 includes a first end 321, a middle portion 322, and a second end 323 connected sequentially. It should be noted that the distinction between the first end 321, the middle portion 322, and the second end 323 of cable 32 is not strictly defined.

[0157] Please see Figure 9a and Figure 9b , Figure 9a yes Figure 8 The diagram shown is an enlarged view of the cable at line B1. Figure 9b yes Figure 8 The diagram shows a cross-sectional view of cable 32 at line B2-B2. Cable 32 includes an inner conductor 324, a dielectric layer 325, and an outer conductor 326. The dielectric layer 325 surrounds and encloses the outer peripheral surface 3241 of the inner conductor 324. The outer conductor 326 surrounds and encloses the outer peripheral surface 3251 of the dielectric layer 325. The dielectric layer 325 is located between the inner conductor 324 and the outer conductor 326, separating them. At this point, cable 32 is approximately coaxial. It should be noted that since the inner conductor 324 and the dielectric layer 325 are located inside cable 32, Figure 9a The inner conductor 324 and the dielectric layer 325 are indicated by different dashed lines.

[0158] Please refer to it again. Figure 9a and combined Figure 8As shown, the first end 321 of the cable 32 includes the first end 3242 of the inner conductor 324, the first end 3252 of the dielectric layer 325, and the first end 3261 of the outer conductor 326. The end face 3211 of the first end 321 of the cable 32 includes the end face 3243 of the first end 3242 of the inner conductor 324, the end face 3253 of the first end 3252 of the dielectric layer 325, and the end face 3262 of the first end 3261 of the outer conductor 326. Similarly, the middle portion 322 and the second end 323 of the cable 32 also respectively include the inner conductor 324, the dielectric layer 325, and the outer conductor 326. Specific details will not be elaborated here.

[0159] In this embodiment, the inner conductor 324 consists of a single wire. In another embodiment, the inner conductor 324 may also consist of multiple wires. Multiple wires may be intertwined to form a single unit.

[0160] In this embodiment, the inner conductor 324 can be made of a conductive metallic material. For example, the inner conductor 324 can be made of copper, tin, aluminum, gold, silver, or a copper-nickel alloy.

[0161] In this embodiment, the dielectric layer 325 is made of an insulating material. The dielectric layer 325 provides electrical insulation between the inner conductor 324 and the outer conductor 326. For example, the dielectric layer 325 can be made of fluorinated ethylene propylene (FEP) or polyolefin.

[0162] In this embodiment, the outer conductor 326 can be made of a conductive metallic material. For example, the outer conductor 326 can be made of copper, nickel, gold, silver, or a copper-nickel alloy. The outer conductor 326 can be formed on the outer peripheral surface 3251 of the dielectric layer 325 by an electroplating process. In this case, the connection between the outer conductor 326 and the dielectric layer 325 is relatively strong.

[0163] In other embodiments, cable 32 further includes a protective layer (not shown). The protective layer surrounds and encloses the outer conductor 326. In this case, the protective layer can be used to protect the outer conductor 326. The protective layer can be made of polyethylene terephthalate (PET) or mylar (a tough polyester polymer).

[0164] Please see Figure 10 and Figure 11 , Figure 10 yes Figure 2 The diagram shows the structure of the cable module 30 from another angle. Figure 11 yes Figure 10 The diagram shows an enlarged view of the cable module 30 at point C. The first end 321 of each cable 32 is fixed to the first fixing base 31. Specifically, the first ends 321 of multiple cables 32 are fixed one-to-one within multiple second through holes 313 of the first fixing base 31; that is, the first end 321 of one cable 32 is fixed to the wall of one second through hole 313. It should be understood that the first ends 321 of the cables 32 can be entirely located within the second through holes 313, or partially located within the second through holes 313. In this embodiment, the first ends 321 of the cables 32 are partially located within the second through holes 313.

[0165] The connection between the first end 321 of the cable 32 and the first fixing base 31 can be achieved in several ways:

[0166] In one embodiment, after the first fixing base 31 is formed, the first end 321 of each cable 32 is inserted into a second through hole 313. Adhesive is then filled between the first end 321 of the cable 32 and the wall of the second through hole 313. After the adhesive cures, the first end 321 of the cable 32 is fixed within the second through hole 313.

[0167] In one embodiment, multiple cables 32 are bundled together as a whole. Then, the first ends 321 of the multiple cables 32 are injection molded using a mold. After the plastic material cures, a first fixing seat 31 is formed. At this time, the first ends 321 of the multiple cables 32 are also fixed on the first fixing seat 31.

[0168] In this embodiment, due to the arrangement of the second via 313 and the first signal pin 12 (see [link]), Figure 3 The arrangement of the first ends 321 of the multiple cables 32 is the same as that of the first signal pins 12. When the first ends 321 of the multiple cables 32 are fixed one-to-one in the multiple second through holes 313 of the first fixing seat 31, the arrangement of the first ends 321 of the multiple cables 32 is the same as that of the first signal pins 12.

[0169] In this embodiment, by fixing the first end 321 of each cable 32 to the first fixing base 31, multiple cables 32 can be combined and fixed into a whole. Figure 2 and Figure 10 The illustrations show that the second end 323 of each cable 32 is an open end, meaning that the second end 323 of the cable 32 is not provided with the first fixing seat 31. In other embodiments, the cable module 30 may also include a third fixing seat. The third fixing seat fixes the second end 323 of the cable 32. This solution will be described in detail below with reference to the relevant drawings. It will not be repeated here.

[0170] Please refer to it again. Figure 11 and combined Figure 9aAs shown, when the first end 321 of the cable 32 is fixed to the first fixing base 31, the end face 3243 of the first end 3242 of the inner conductor 324, the end face 3253 of the first end 3252 of the dielectric layer 325, and the end face 3262 of the first end 3261 of the outer conductor 326 are all exposed relative to the upper end face 311 of the first fixing base 31.

[0171] For example, the end face 3243 of the first end 3242 of the inner conductor 324, the end face 3253 of the first end 3252 of the dielectric layer 325, and the end face 3262 of the first end 3261 of the outer conductor 326 are flush with the upper end face 311 of the first fixing base 31. In this way, the inner conductor 324, the dielectric layer 325, and the outer conductor 326 will not significantly affect the flatness of the upper end face 311 of the first fixing base 31.

[0172] It should be understood that when the first ends 321 of multiple cables 32 are fixed to the first fixing base 31, the first fixing base 31 and the multiple cables 32 can be cut to expose the inner conductor 324, the dielectric layer 325, and the outer conductor 326 relative to the upper end face 311 of the first fixing base 31. At this time, the first fixing base 31, the inner conductor 324, the dielectric layer 325, and the outer conductor 326 are then polished so that the end face 3243 of the first end 3242 of the inner conductor 324, the end face 3253 of the first end 3252 of the dielectric layer 325, and the end face 3262 of the first end 3261 of the outer conductor 326 are flush with the upper end face 311 of the first fixing base 31.

[0173] Please see Figure 12 and Figure 13 , Figure 12 yes Figure 2 The diagram shows an enlarged view of the cable module 30 at point D. Figure 13 yes Figure 12 The diagram shows a cross-sectional view of the cable module 30 at EE. The cable module 30 also includes a first grounding layer 314. A portion of the first grounding layer 314 is located on the upper end face 311 of the first mounting base 31. Another portion of the first grounding layer 314 is located on the end face 3262 of the first end 3261 of the outer conductor 326. The first grounding layer 314 can be made of conductive materials such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

[0174] In this configuration, the first grounding layer 314 is fixed to the outer conductor 326 of each cable 32. At this time, the outer conductors 326 of two adjacent cables 32 are fixed through the first grounding layer 314. Furthermore, the first grounding layer 314 is also electrically connected to the outer conductor 326 of each cable 32, meaning that the first grounding layer 314 and the outer conductor 326 of each cable 32 are mutually conductive. Thus, when the first grounding layer 314 is grounded, the outer conductor 326 of each cable 32 is also grounded.

[0175] For example, the first ground layer 314 is fixed and electrically connected to the outer conductor 326 of each cable 32 by means of electroplating, sputtering, deposition or evaporation.

[0176] Furthermore, the first grounding layer 314 is also insulated from the inner conductor 324 of each cable 32. Exemplarily, this is achieved by disconnecting the first grounding layer 314 from the inner conductor 324 of each cable 32, i.e., by not contacting the inner conductor 324 of each cable 32. In this way, the first grounding layer 314 is insulated from the inner conductor 324 of each cable 32.

[0177] In other embodiments, the cable module 30 may also omit the first grounding layer 314.

[0178] Please refer to it again. Figure 12 and Figure 13 The cable module 30 includes a plurality of first pads 315. The first pads 315 and the first ground layer 314 are located on the same side of the first mounting base 31. The shape of the first pads 315 is not limited to... Figure 12 The design is a disc-shaped pad. The first pad 315 can be made of conductive materials such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

[0179] Furthermore, multiple first pads 315 are fixed one-to-one with the inner conductors 324 of multiple cables 32. The multiple first pads 315 are electrically connected to the inner conductors 324 of multiple cables 32, meaning that one first pad 315 and one inner conductor 324 of a cable 32 can be electrically connected to each other. Taking one first pad 315 as an example, a portion of the first pad 315 is fixed to the end face 3243 of the first end 3242 of the inner conductor 324. Another portion of the first pad 315 is fixed to the end face 3253 of the first end 3252 of the dielectric layer 325.

[0180] Furthermore, each first pad 315 is also insulated from the first ground layer 314. Exemplarily, the first ground layer 314 is insulated from each first pad 315 by disconnecting it from each first pad 315, that is, by not contacting each first pad 315 with the first ground layer 314.

[0181] For example, the first pad 315 is fixed on the inner conductor 324 of each cable 32 by processes such as electroplating, sputtering, deposition or vapor deposition, and the first pad 315 is electrically connected.

[0182] In this embodiment, due to the arrangement of the multiple cables 32 and the first signal pin 12 (see [link]), Figure 3The arrangement of the first pads 315 is the same as that of the first signal pins 12. When multiple first pads 315 are fixed one-to-one with the inner conductors 324 of multiple cables 32, the arrangement of the first pads 315 is also the same as that of the first signal pins 12.

[0183] In other embodiments, the cable module 30 may also omit the first pad 315.

[0184] Please refer to it again. Figure 12 and Figure 13 The cable module 30 includes a plurality of second pads 316. The shape of the second pads 316 is not limited to... Figure 12 The design is a circular disk. The material of the second pad 316 can be conductive materials such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

[0185] Additionally, multiple second pads 316 are fixed to the surface of the first ground layer 314 away from the first mounting base 31. In this case, the multiple second pads 316 and the first ground layer 314 form a single unit. Furthermore, each second pad 316 is electrically connected to the first ground layer 314. When the first ground layer 314 is grounded, each second pad 316 can also be grounded.

[0186] For example, each second pad 316 is fixed to the first ground layer 314 by processes such as electroplating, sputtering, deposition or vapor deposition.

[0187] Furthermore, the plurality of second pads 316 are insulated from each first pad 315. Exemplarily, each second pad 316 is insulated from each first pad 315 by disconnecting each second pad 316 from each first pad 315, that is, by not contacting each first pad 315.

[0188] For example, the arrangement of the second pad 316 is the same as that of the first ground pin 13 (see [link]). Figure 3 The arrangement of ) is the same.

[0189] In other embodiments, the cable module 30 may also omit the second pad 316.

[0190] Please see Figure 14 , Figure 14 yes Figure 1d The diagram shows a cross-sectional view of the signal transmission assembly 100 at the AA line. At least a portion of the first mounting base 31 of the cable module 30 is located within the first through hole 23 of the first circuit board 20, and the first mounting base 31 secures the first circuit board 20. The first mounting base 31 may be partially or entirely located within the first through hole 23. Figure 14The diagram shows that part of the first fixing seat 31 is located inside the first through hole 23. In addition, the end face 3211 of the first end 321 of the cable 32 faces the first chip 10, that is, the end face 3211 of the first end 321 of the cable 32 and the upper end face 21 of the first circuit board 20 both face the same side of the first fixing seat 31.

[0191] It should be understood that there are multiple ways in which the first mounting bracket 31 can be fixed to the first circuit board 20.

[0192] In one embodiment, the first fixing seat 31 is fixed to the wall of the first through hole 23 by an interference fit.

[0193] In one embodiment, the first fixing seat 31 is fixed to the first circuit board 20 by means of structural components or locking components.

[0194] For example, by providing adhesive (such as glue or double-sided tape) between the first fixing seat 31 and the hole wall of the first through hole 23, the first fixing seat 31 is bonded to the first circuit board 20.

[0195] For example, the first mounting base 31 is locked to the first circuit board 20 by fasteners (such as screws, bolts, or pins). It should be understood that the shape of the first mounting base 31 can be flexibly adjusted as needed, thereby facilitating the fasteners to lock the first mounting base 31 to the first circuit board 20.

[0196] In this embodiment, when the first mounting base 31 of the cable module 30 fixes the first circuit board 20, the cable module 30 and the first circuit board 20 form a whole, namely the cable assembly 101. The cable assembly 101 can be a separate product.

[0197] Please refer to it again. Figure 14 Multiple first pads 315 are fixed one-to-one with multiple first signal pins 12, meaning one first pad 315 can be fixed to one first signal pin 12. Furthermore, the multiple first pads 315 are electrically connected one-to-one with the multiple first signal pins 12, meaning one first pad 315 can be electrically connected to one first signal pin 12. For example, the first signal pin 12 can be fixed to the first pad 315 using processes such as laser soldering or induction soldering. In this case, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pin 12 and the first pad 315.

[0198] In this embodiment, there are multiple cables 32. The inner conductor 324 of each cable 32 is used to transmit high-speed signals. In other embodiments, when there is only one cable 32, the inner conductor 324 of the single cable 32 can transmit high-speed signals. When there are multiple cables 32, at least one cable 32's inner conductor 324 is used to transmit high-speed signals. For example, when there are two cables 32, one cable 32's inner conductor 324 is used to transmit high-speed signals, and the other cable 32's inner conductor 324 is used to transmit low-speed signals or power.

[0199] In other embodiments, when the cable module 30 is not provided with the first pad 315, the plurality of first signal pins 12 of the first chip 10 are fixed one-to-one with the inner conductors 324 of the plurality of cables 32. In addition, the plurality of first signal pins 12 of the first chip 10 are electrically connected one-to-one with the inner conductors 324 of the plurality of cables 32.

[0200] Please refer to it again. Figure 14 Multiple second pads 316 are fixed one-to-one with multiple first ground pins 13, that is, one second pad 316 is fixed to one first ground pin 13. Furthermore, the multiple second pads 316 are electrically connected one-to-one with the multiple first ground pins 13, that is, one second pad 316 is electrically connected to one first ground pin 13. In this way, the first ground pin 13 can be electrically connected to the outer conductor 326 of the cable 32 through the second pads 316 and the first ground layer 314.

[0201] For example, the first grounding pin 13 can be fixed to the second pad 316 using processes such as laser welding or induction welding.

[0202] In other embodiments, when the cable module 30 is not provided with the second pad 316, all of the first ground pins 13 are fixed to the first ground layer 314. In addition, all of the first ground pins 13 are electrically connected to the first ground layer 314.

[0203] In other embodiments, when the cable module 30 is not provided with a first grounding layer 314, the first grounding pin 13 can be directly electrically connected to the outer conductor 326 of the cable 32.

[0204] The structure of a signal transmission component 100 has been described in detail above with reference to the accompanying drawings. The signal transmission component 100 can transmit high-speed signals. The maximum transmission bandwidth of the high-speed signal can reach 112Gbps. It should be understood that when the signal transmission component 100 can transmit high-speed signals, the communication system requires the signal transmission component 100 to have lower loss. For example, the CEI-112G-LR-PAM4 standard requires the signal transmission component to have a loss of 28dB@fb / 2 (where fb is the Nyquist frequency of the signal). In other words, although the maximum transmission bandwidth of the signal transmission component can reach 112Gbps, if the loss of the signal transmission component is greater than 28dB@fb / 2, the signal transmission component cannot be used in a communication system. In this embodiment, by setting a completely new structure for the signal transmission component 100, the first signal pin 12 (the pin used to transmit high-speed signals) of the first chip 10 can be directly electrically connected to the cable 32, thereby achieving a maximum transmission bandwidth of 112Gbps for the signal transmission component 100 while significantly reducing signal loss, meeting the low-loss requirements of the communication system. Specifically:

[0205] First, a cable module 30 structure is provided. The cable module 30 includes a first fixing base 31 and multiple cables 32. The first fixing base 31 is provided with multiple second through holes 313. Each second through hole 313 extends from the upper end face 311 of the first fixing base 31 to the lower end face 312 of the first fixing base 31, that is, each second through hole 313 penetrates both the upper end face 311 and the lower end face 312 of the first fixing base 31. The first ends 321 of the multiple cables 32 are fixed one-to-one in the multiple second through holes 313 of the first fixing base 31.

[0206] Secondly, a first circuit board 20 structure is provided. The first circuit board 20 is provided with a first through hole 23. The first through hole 23 extends from the upper end face 21 of the first circuit board 20 to the lower end face 22 of the first circuit board 20, that is, the first through hole 23 penetrates the upper end face 21 and the lower end face 22 of the first circuit board 20.

[0207] Finally, a signal transmission component 100 structure is provided. The first mounting base 31 of the cable module 30 is fixed in the first through hole 23 of the first circuit board 20. The multiple first signal pins 12 of the first chip 10 are electrically connected to the inner conductors 324 of the multiple cables 32 in a one-to-one correspondence.

[0208] It should be understood that, compared to traditional signal transmission components, the first signal pin 12 of the signal transmission component 100 in this embodiment can be directly electrically connected to the inner conductor 324 of the cable 32. The first chip 10 and the cable 32 can achieve a near-zero-distance connection, meaning that a PCB connection and electrical connector connection can be omitted between the first signal pin 12 of the first chip 10 and the cable 32. This reduces signal loss caused by PCB traces (or PCB vias) and electrical connectors between the first signal pin 12 and the inner conductor 324 of the cable 32. It should be understood that by reducing signal loss from PCB traces (or PCB vias) and electrical connectors, the loss of the signal transmission component 100 can be significantly reduced, which is extremely important for the signal transmission component 100 to meet low-loss requirements.

[0209] Secondly, the signal transmission component 100 of this embodiment can also solve some technical problems. Specifically:

[0210] Compared to traditional signal transmission components, in this embodiment, since the first signal pin 12 of the first chip 10 can be directly electrically connected to the inner conductor 324 of the cable 32, the connection points between the first signal pin 12 and the PCB, the PCB and the electrical connector, and the electrical connector and the cable 32 can be eliminated. Thus, there are fewer connection points between the first signal pin 12 and the inner conductor 324 of the cable 32, resulting in fewer discontinuities in the signal channel, which helps to improve insertion loss fluctuations and resonance in the signal channel.

[0211] Furthermore, compared to traditional signal transmission components, the signal transmission component 100 of this embodiment eliminates the need for via encapsulation of the first signal pin 12 to the PCB, via encapsulation of the electrical connector to the PCB, and encapsulation of the electrical connector to the cable. The structure of the signal transmission component 100 of this embodiment is relatively simple.

[0212] In addition, when the number of connection points between the first signal pin 12 and the inner conductor 324 of the cable 32 is reduced, and the number of discontinuities in the signal channel is smaller, signals from outside the signal transmission component 100 are less likely to couple into the signal transmission component 100 through the connection points between the first signal pin 12 and the inner conductor 324 of the cable 32. This reduces the number of signal crosstalk coupling points and thus significantly reduces signal crosstalk.

[0213] Furthermore, since the first signal pin 12 of the first chip 10 can be directly electrically connected to the inner conductor 324 of the cable 32, the high-speed signal does not need to be transmitted to the cable 32 via the PCB and electrical connector. Thus, on the one hand, this embodiment no longer needs to consider the impact of the low-grade substrate material of the first circuit board 20 on the loss and degradation of the high-speed signal; that is, the material of the first circuit board 20 can be low-grade substrate material, thereby significantly reducing the cost of the first circuit board 20. On the other hand, the first chip 10 can use a lower active driving cost to achieve signal transmission, thereby reducing system power consumption.

[0214] Furthermore, since conventional signal transmission components use cables electrically connected to the PCB via connectors, these connectors, located around the chip, severely interfere with the chip's heat dissipation and occupy PCB layout space. The signal transmission component 100 of this embodiment eliminates the need for connectors. Therefore, the heat dissipation of the first chip 10 is no longer interfered with by the connectors. Additionally, the PCB layout space can be significantly improved, thus increasing the PCB's space utilization rate.

[0215] In this embodiment, the signal transmission component 100 also has some advantages. Specifically:

[0216] First, the cable module 30 also includes multiple first solder pads 315. Each of the multiple first solder pads 315 is fixed one-to-one with the inner conductors 324 of the multiple cables 32. This allows the inner conductors 324 of the multiple cables 32 to be fixed one-to-one with the multiple first signal pins 12 by fixing the multiple first solder pads 315 to each of the multiple first signal pins 12. It should be understood that the first solder pads 315 can increase the end face area of ​​the inner conductors 324 of the cables 32. The connection process between the first solder pads 315 and the first signal pins 12 is simpler, which helps reduce the assembly difficulty of the cable module 30.

[0217] Furthermore, a first grounding layer 314 is provided on the upper end face 311 of the first fixing base 31, and the first grounding layer 314 is fixed to the outer conductor 326 of each cable 32. The first grounding layer 314 can connect the outer conductors 326 of each cable 32 to form a whole. In this way, by fixing the first grounding layer 314 to multiple first grounding pins 13 of the first chip 10, the multiple first grounding pins 13 are connected to the outer conductors 326 of multiple cables 32. It should be understood that the first grounding layer 314 can increase the end face area of ​​the outer conductors 326 of the cable 32. The connection process between the first grounding layer 314 and the first grounding pins 13 is simpler, which helps to reduce the assembly difficulty of the cable module 30.

[0218] Additionally, the cable module 30 includes a plurality of second pads 316. The plurality of second pads 316 are fixed to the surface of the first ground layer 314 away from the first mounting base 31. The second pads 316 facilitate the fixed connection of the first ground pin 13 to the first ground layer 314.

[0219] The signal transmission component 100 has been described in detail above with reference to the accompanying drawings. The following section describes a method for fabricating the signal transmission component 100. The method for fabricating the signal transmission component 100 includes:

[0220] Please refer to it again. Figure 11 and combined Figure 9a The first end 321 of the cable 32 is fixed to the first fixing base 31, wherein the end face 3211 of the first end 321 of the cable 32 is exposed relative to the first fixing base 31;

[0221] For example, the first ends 321 of multiple cables 32 are injection molded using a mold. After the plastic material cures, a first fixing seat 31 is formed. At this time, the first ends 321 of the multiple cables 32 are also fixed to the first fixing seat 31. The first fixing seat 31 and the multiple cables 32 are then cut so that the end face of the first end 321 of each cable 32 is exposed relative to the first fixing seat 31.

[0222] For example, the first mounting base 31 is formed by CNC machining. The first end 321 of each cable 32 is inserted into a second through hole 313 and exposed relative to the first mounting base 31. Adhesive is then filled between the first end 321 of the cable 32 and the wall of the second through hole 313. After the adhesive cures, the first end 321 of the cable 32 is fixed in the second through hole 313.

[0223] Please refer to it again. Figure 14 The first fixing seat 31 is fixed in the first through hole 23 of the first circuit board 20, wherein the first through hole 23 passes through the upper end face 21 and the lower end face 22 of the first circuit board 20.

[0224] For example, the first fixing seat 31 is fixed to the wall of the first through hole 23 by an interference fit.

[0225] Exemplarily, the first fixing seat 31 is fixed to the first circuit board 20 by structural components or locking components. For example, the first fixing seat 31 is bonded to the first circuit board 20 by applying adhesive (e.g., glue or double-sided tape) between the first fixing seat 31 and the wall of the first through hole 23. Alternatively, the first fixing seat 31 is locked to the first circuit board 20 by fasteners (e.g., screws, bolts, or pins). It should be understood that the shape of the first fixing seat 31 can be flexibly adjusted according to requirements, thereby facilitating the fasteners to lock the first fixing seat 31 to the first circuit board 20.

[0226] In one embodiment, prior to the step of "fixing the first end 321 of the cable 32 to the first fixing base 31", the method for manufacturing the signal transmission assembly 100 further includes:

[0227] Please refer to it again. Figure 9a A dielectric layer 325 is formed on the outer peripheral surface 3241 of the inner conductor 324. The inner conductor 324 can be made of a conductive metallic material. For example, the inner conductor 324 can be made of copper, tin, aluminum, gold, silver, or a copper-nickel alloy. The dielectric layer 325 is made of an insulating material. For example, the dielectric layer 325 can be made of FEP or polyolefin.

[0228] Please refer to it again. Figure 9a An outer conductor 326 is formed on the outer peripheral surface 3251 of the dielectric layer 325. The dielectric layer 325 provides electrical insulation between the inner conductor 324 and the outer conductor 326. For example, the outer conductor 326 can be formed on the outer peripheral surface 3251 of the dielectric layer 325 by an electroplating process. In this case, the connection between the outer conductor 326 and the dielectric layer 325 is stronger.

[0229] Combination Figure 9a and Figure 11 As shown, when the first end 321 of the cable 32 is fixed to the first fixing base 31, the end face 3243 of the first end 3242 of the inner conductor 324, the end face 3253 of the first end 3252 of the dielectric layer 325, and the end face 3262 of the first end 3261 of the outer conductor 326 can all be exposed relative to the first fixing base 31.

[0230] In one embodiment, after the step of "fixing the first end 321 of the cable 32 to the first fixing base 31", the method for manufacturing the signal transmission assembly 100 further includes:

[0231] Please see Figure 12 and Figure 13 A first pad 315 is formed on the end face 3243 of the first end 3242 of the inner conductor 324 and the end face 3253 of the first end 3252 of the dielectric layer 325. The first pad 315 is electrically connected to the inner conductor 324 of the cable 32 and is also insulated from the first ground layer 314. Exemplarily, the first pad 315 is formed on the end face 3243 of the first end 3242 of the inner conductor 324 and the end face 3253 of the first end 3252 of the dielectric layer 325 by processes such as electroplating, sputtering, deposition, or vapor deposition.

[0232] In one embodiment, after the step of "fixing the first end 321 of the cable 32 to the first fixing base 31", the method for manufacturing the signal transmission assembly 100 further includes:

[0233] Please see Figure 12 and Figure 13 A first grounding layer 314 is formed on the upper end surface 311 of the first fixing base 31. The first grounding layer 314 is fixed to and electrically connected to the outer conductor 326 of the cable 32. The first grounding layer 314 is also insulated from the inner conductor 324 of the cable 32. Exemplarily, the first grounding layer 314 is formed on the upper end surface 311 of the first fixing base 31 by processes such as electroplating, sputtering, deposition, or vapor deposition, and is fixed to the outer conductor 326 of the cable 32.

[0234] It is understandable that the first grounding layer 314 can be interconnected with the outer conductor 326 of the cable 32. Thus, when the first grounding layer 314 is grounded, the outer conductor 326 of the cable 32 is also grounded.

[0235] In one embodiment, after the step of "forming a first ground layer 314 on the upper end surface 311 of the first fixing base 31", the method for fabricating the signal transmission component 100 further includes:

[0236] Please see Figure 12 and Figure 13 A second pad 316 is formed on the surface of the first ground layer 314 away from the first mounting base 31. Exemplarily, the second pad 316 is formed on the surface of the first ground layer 314 away from the first mounting base 31 by processes such as electroplating, sputtering, deposition, or vapor deposition.

[0237] In one embodiment, after "fixing the first mounting base 31 into the first through hole 23 of the first circuit board 20", the method for manufacturing the signal transmission component 100 further includes:

[0238] Please see Figure 5 The second signal pin 14 and the second ground pin 15 of the first chip 10 are fixed to and electrically connected to the first circuit board 20. For example, the second signal pin 14 can be connected to the third signal pin 24 using laser welding or induction welding. The second ground pin 15 can be connected to the third ground pin 25 using laser welding or induction welding.

[0239] In other embodiments, the step “the second signal pin 14 and the second ground pin 15 of the first chip 10 are fixed to the first circuit board 20 and electrically connected to the first circuit board 20” can also be performed before the step “fixing the first fixing seat 31 in the first through hole 23 of the first circuit board 20”.

[0240] Please see Figure 14The first signal pin 12 of the first chip 10 is fixed to and electrically connected to the inner conductor 322 of the cable 32. Exemplarily, multiple first signal pins 12 are soldered to multiple first pads 315 one-to-one using processes such as laser soldering or induction soldering. In this case, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pins 12 and the first pads 315.

[0241] The preceding text, with reference to the accompanying drawings, details a signal transmission component 100 and its fabrication method, and explains how the signal transmission component 100 can solve some technical problems of traditional signal transmission components 100. The following text, with reference to the accompanying drawings, will further introduce several configuration methods for the signal transmission component 100. The signal transmission component 100 described below not only solves the technical problems mentioned above but also addresses some additional technical issues.

[0242] The second implementation method, which shares the same technical content as the first implementation method, will not be described again: Please refer to... Figure 15a and Figure 15b , Figure 15a yes Figure 1d A cross-sectional schematic diagram of another embodiment of the signal transmission component 100 at line AA, as shown. Figure 15b yes Figure 15a The diagram shows an enlarged view of the signal transmission component 100 at point F. The cable module 30 includes a plurality of first spring contacts 317. The shape of the first spring contacts 317 is not limited to... Figure 15a and Figure 15b The first spring 317 can be made of conductive materials such as copper, tin, aluminum, gold, silver, or copper-nickel alloy.

[0243] Each first pad 315 has a first groove 3151. The opening of the first groove 3151 faces away from the cable 32. The shape of the first groove 3151 is not limited to... Figure 15b The shape shown is rectangular.

[0244] In addition, multiple first spring pieces 317 are fixed to multiple first pads 315 in a one-to-one correspondence, and a portion of the first spring piece 317 is disposed within the first groove 3151.

[0245] In this embodiment, the first spring 317 and the first solder pad 315 have multiple connection methods.

[0246] For example, the first spring 317 can be interference-fitted with the groove wall of the first groove 3151.

[0247] For example, the first spring piece 317 can be fixed to the groove wall of the first groove 3151 by welding.

[0248] It should be understood that by opening a first groove 3151 in the first pad 315 and fixing part of the first spring piece 317 in the first groove 3151, the connection area between the first spring piece 317 and the first pad 315 can be increased, thereby increasing the connection area between the first spring piece 317 and the first pad 315 and improving the connection stability between the first spring piece 317 and the first pad 315.

[0249] In other embodiments, the first pad 315 may not have the first groove 3151. In this case, the multiple first springs 317 can be directly fixed to the multiple first pads 315 one by one.

[0250] Please refer to it again. Figure 15a and Figure 15b Multiple first contact springs 317 are in contact with multiple first signal pins 12 in a one-to-one correspondence. At this time, the multiple first contact springs 317 and the multiple first signal pins 12 can also achieve electrical connection. Thus, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pins 12, the first contact springs 317, and the first pads 315. It should be noted that in this embodiment, the first signal pins 12 are in the form of pads, which can increase the contact area between the first signal pins 12 and the first contact springs 317, which is beneficial to improving the stability of the electrical connection between the first signal pins 12 and the first contact springs 317. In other embodiments, the first signal pins 12 can also adopt other structural forms.

[0251] It should be understood that for the scheme where the first signal pin 12 is directly fixed to the first pad 315, since the first signal pin 12 and the first pad 315 are located between the first chip body 11 and the first mounting bracket 31, on the one hand, fixing the first signal pin 12 and the first pad 315 is relatively difficult; on the other hand, when the first mounting bracket 31 is fixed to the first circuit board 20, it is difficult for the first pad 315 to be at the same level as the third signal pin 24 of the first circuit board 20. Thus, if the distance between the third signal pin 24 and the second signal pin 14 is a standard distance, the distance between the first signal pin 12 and the first pad 315 is not likely to be a standard distance, meaning that the distance between the first signal pin 12 and the first pad 315 is prone to error. Therefore, it is not easy to fix the first signal pin 12 to the first pad 315. In this embodiment, by fixing a first spring contact 317 to each first pad 315, on the one hand, although the first spring contact 317 and the first signal pin 12 are located between the first chip body 11 and the first mounting base 31, the first spring contact 317 is elastic, and a stable electrical connection can be achieved through contact with the first signal pin 12. Thus, the electrical connection between the first spring contact 317 and the first signal pin 12 is relatively simple. On the other hand, when the first mounting base 31 is fixed to the first circuit board 20, it is difficult for the first pad 315 to be at the same level as the third signal pin 24 of the first circuit board 20. At this time, because the first spring contact 317 is elastic, it can absorb the error in the distance between the first spring contact 317 and the first signal pin 12, thereby ensuring that the first signal pin 12 can be stably electrically connected to the first spring contact 317.

[0252] Furthermore, by providing the first spring contact 317 on the first pad 315, the assembly method of the signal transmission component 100 can be changed, thereby reducing the assembly difficulty of the signal transmission component 100. Specifically, when the first fixing seat 31 is inserted into the first through hole 23 of the first circuit board 20, the first fixing seat 31 is not fixed to the first circuit board 20 with adhesive at first. After the multiple first spring contact 317s make contact with the multiple first signal pins 12 one by one, the first fixing seat 31 is then fixed to the first circuit board 20 with adhesive. In this way, compared with fixing the first fixing seat 31 to the first circuit board 20 first and then fixing the first signal pins 12 to the first spring contact 317, this embodiment does not need to consider in advance whether the first spring contact 317 and the third signal pin 24 are at the same level, that is, it does not need to consider too much about the flatness of the first fixing seat 31 and the first circuit board 20. In this way, the connection method between the first chip 10, the first circuit board 20, and the cable module 30 is simpler. Therefore, by setting the first spring 317 on the first pad 315, the flexibility of the connection between the first chip 10 and the first circuit board 20 and the cable module 30 can be increased.

[0253] Please refer to it again. Figure 15a The cable module 30 also includes multiple second spring contacts 318. Each second spring contact 318 is fixed to a corresponding second pad 316. The second spring contacts 318 can be located on the side of the second pad 316 away from the first ground layer 314. The arrangement of the second spring contacts 318 can be referenced to the arrangement of the first spring contact 317. The connection method between the second spring contact 318 and the second pad 316 can be referenced to the connection method between the first spring contact 317 and the first pad 315. The connection method between the second spring contact 318 and the first ground pin 13 of the first chip 10 can be referenced to the connection method between the first spring contact 317 and the first signal pin 12. Specific details will not be elaborated here.

[0254] The third implementation method, which shares the same technical content as the first implementation method, will not be repeated here: Please refer to... Figure 16 and Figure 17 , Figure 16 This is a schematic diagram of the structure of the socket connector 40 provided in the embodiments of this application. Figure 17 yes Figure 1d The diagram shows a cross-sectional view of another embodiment of the signal transmission assembly 100 at the AA line. The socket connector 40 includes a base 41, a plurality of first signal springs 42, a plurality of first ground springs 43, a plurality of second signal springs 44, and a plurality of second ground springs 45. It should be noted that... Figure 16 The first signal spring 42, the first grounding spring 43, the second signal spring 44, and the second grounding spring 45 are illustrated using different filling materials. It should be noted that... Figure 16 and Figure 17 Only some of the components included in the socket connector 40 are shown schematically; the actual shape, size, and construction of these components are not subject to change. Figure 16 and Figure 17 limited.

[0255] Please refer to it again. Figure 16 and Figure 17 The base 41 includes an upper end face 411 and a lower end face 412 facing opposite directions. The base 41 includes a first part 4121, a second part 4122, and a third part 4123 connected in sequence. It should be noted that... Figure 16 and Figure 17 The base 41 is schematically divided into a first part 4121, a second part 4122, and a third part 4123 by dashed lines. It should be understood that... Figure 16 Only one embodiment of the first part 4121, the second part 4122, and the third part 4123 is shown schematically. The number, position, shape, and size of the first part 4121, the second part 4122, and the third part 4123 are not subject to change. Figure 16 and Figure 17Limited by.

[0256] In this embodiment, multiple first signal springs 42 and multiple first grounding springs 43 are located within the first portion 4121. The first grounding springs 43 are located around the first signal springs 42. In this embodiment, the arrangement of the first signal springs 42 is the same as the arrangement of the first signal pins 12. The arrangement of the first grounding springs 43 is the same as the arrangement of the first grounding pins 13. In other embodiments, the arrangement of the first signal springs 42 and the arrangement of the first signal pins 12 may be different. The arrangement of the first grounding springs 43 and the arrangement of the first grounding pins 13 may also be different.

[0257] Additionally, multiple second signal springs 44 and multiple second grounding springs 45 are located within the third portion 4123. The second grounding springs 45 are located around the second signal springs 44. In this embodiment, the arrangement of the second signal springs 44 is the same as the arrangement of the second signal pins 14. The arrangement of the second grounding springs 45 is the same as the arrangement of the second grounding pins 15. In other embodiments, the arrangement of the second signal springs 44 may differ from the arrangement of the second signal pins 14. The arrangement of the second grounding springs 45 may also differ from the arrangement of the second grounding pins 15.

[0258] Furthermore, the second part 4122 is a blank area, meaning that no spring contact structure is provided in the second part 4122. Thus, the multiple first signal spring contacts 42 and the multiple first grounding spring contacts 43 can be separately arranged through the second part 4122, the multiple second signal spring contacts 44, and the multiple second grounding spring contacts 45. In other embodiments, the base 41 may not include the second part 4122. In this case, the first part 4121 is directly connected to the third part 4123.

[0259] Please refer to it again. Figure 17 A socket connector 40 is disposed between the first chip 10 and the first circuit board 20. The socket connector 40 is also disposed between the first chip 10 and the cable module 30. In this case, the socket connector 40 is located on the same side of the first circuit board 20 and the first mounting base 31. Additionally, the base 41 includes an upper end face 411 and a lower end face 412 facing opposite directions. The upper end face 411 of the base 41 faces the first chip 10. The lower end face 412 of the base 41 faces the first circuit board 20. A first signal spring 42, a first ground spring 43, a second signal spring 44, and a second ground spring 45 all penetrate the upper end face 411 and the lower end face 412 of the base 41, and all extend relative to the upper end face 411 and the lower end face 412 of the base 41.

[0260] In this configuration, one side of each of the multiple first signal springs 42 is in contact with a corresponding number of first signal pins 12. The other side of each of the multiple first signal springs 42 is in contact with a corresponding number of first pads 315. At this time, the high-speed signal of the first chip 10 can be transmitted to the inner conductor 324 of the cable 32 through the first signal pins 12, the first signal springs 42, and the first pads 315.

[0261] In addition, one side of each of the multiple first grounding springs 43 is in contact with a corresponding number of first grounding pins 13. The other side of each of the multiple first grounding springs 43 is in contact with a corresponding number of second pads 316. In this way, the first grounding pins 13 can be electrically connected to the first grounding layer 314 through the first grounding springs 43 and the second pads 316, and can be electrically connected to the outer conductor 326 of the cable 32 through the first grounding layer 314.

[0262] In addition, one side of each of the multiple second signal springs 44 is in contact with a corresponding number of second signal pins 14. The other side of each of the multiple second signal springs 44 is in contact with a corresponding number of third signal pins 24. At this time, low-speed signals or power signals and other non-high-speed signals from the first chip 10 can be transmitted to the first circuit board 20 through the second signal pins 14, the second signal springs 44 and the third signal pins 24.

[0263] In addition, one side of each of the multiple second grounding springs 45 is in contact with a corresponding number of second grounding pins 15. The other side of each of the multiple second grounding springs 45 is in contact with a corresponding number of third grounding pins 25. In this way, the second grounding pins 15 can be electrically connected to the ground of the first circuit board 20 through the second grounding springs 45 and the third grounding pins 25.

[0264] It should be understood that for the scheme where the first signal pin 12 is directly fixed to the first pad 315, since the first signal pin 12 and the first pad 315 are located between the first chip body 11 and the first mounting bracket 31, on the one hand, fixing the first signal pin 12 and the first pad 315 is relatively difficult; on the other hand, when the first mounting bracket 31 is fixed to the first circuit board 20, it is difficult for the first pad 315 to be at the same level as the third signal pin 24 of the first circuit board 20. Thus, if the distance between the third signal pin 24 and the second signal pin 14 is a standard distance, the distance between the first signal pin 12 and the first pad 315 is not likely to be a standard distance, meaning that the distance between the first signal pin 12 and the first pad 315 is prone to error. Therefore, it is not easy to fix the first signal pin 12 to the first pad 315. In this embodiment, by providing a socket connector 40 between the first chip 10 and the first circuit board 20, on the one hand, although the first signal spring 42, the first signal pin 12, and the first pad 315 are still located between the first chip body 11 and the first fixing base 31, the first signal spring 42 is elastic, allowing it to achieve a stable electrical connection with either the first signal pin 12 or the first pad 315 through contact. This simplifies the electrical connection between the first signal spring 42 and the first signal pin 12. On the other hand, when the first fixing base 31 is fixed to the first circuit board 20, it is still difficult for the first signal spring 42 to be at the same level as the third signal pin 24 of the first circuit board 20. Because the first signal spring 42 is elastic, it can absorb the error in the distance between the first signal spring 42 and the first signal pin 12, thereby ensuring that the first signal spring 42 can be fixed to the first signal pin 12. It can also absorb the error in the distance between the first signal spring 42 and the first pad 315, thereby ensuring that the first signal spring 42 can be fixed to the first pad 315.

[0265] Furthermore, by providing a connector 40 between the first chip 10 and the first circuit board 20, the assembly method of the signal transmission component 100 can be changed, thereby reducing the assembly difficulty of the signal transmission component 100. Specifically, when the first fixing base 31 is inserted into the first through hole 23 of the first circuit board 20, the first fixing base 31 is not initially fixed to the first circuit board 20 with adhesive. After the multiple first signal springs 42 have made contact with the multiple first signal pins 12 one by one, the first fixing base 31 is then fixed to the first circuit board 20 with adhesive. In this way, compared to fixing the first fixing base 31 to the first circuit board 20 first and then fixing the first signal pins 12 to the first signal springs 42, this embodiment does not need to consider in advance whether the first signal springs 42 and the third signal pins 24 are at the same level, that is, it does not need to consider too much about the flatness of the first fixing base 31 and the first circuit board 20. In this way, the connection method between the first chip 10, the first circuit board 20, and the cable module 30 is simpler. Therefore, by providing a socket connector 40 between the first chip 10 and the first circuit board 20, the flexibility of the connection between the first chip 10, the first circuit board 20, and the cable module 30 can be increased.

[0266] The fourth implementation method, which shares the same technical content as the first implementation method, will not be described again: Please refer to... Figure 18 , Figure 18 yes Figure 2 The diagram shows another embodiment of the cable module 30. The cable module 30 also includes a second fixing base 34. The structure of the second fixing base 34 can be referred to the structure of the first fixing base 31. It will not be described again here.

[0267] In this configuration, the middle portion 322 of each cable 32 passes through the second fixing seat 34. Along the extension direction of the cable 32, the second fixing seat 34 is used to fix the middle portion 322 of the cable 32, thereby making the multiple cables 32 more neatly arranged. The method of forming the second fixing seat 34 can be referred to the method of forming the first fixing seat 31. The method of assembling the second fixing seat 34 with the multiple cables 32 can be referred to the method of assembling the first fixing seat 31 with the multiple cables 32. It will not be described further here.

[0268] In other embodiments, the cable module 30 may further include a third fixing seat, a fourth fixing seat, ..., or an Mth fixing seat, where M is greater than or equal to 3. The third fixing seat, the fourth fixing seat, ..., or the Mth fixing seat can all be used to fix the middle portion 322 of each cable 32, thereby ensuring that the multiple cables 32 are more neatly arranged.

[0269] The preceding text, with reference to the accompanying drawings, details several signal transmission components 100. The following text, with reference to the accompanying drawings, details several implementation methods of the communication system 1000.

[0270] Please see Figure 19 , Figure 19 This is a schematic diagram of one embodiment of the communication system 1000 provided in this application. The communication system 1000 includes a signal transmission component 100, a backplane 200, and a backplane connector 300. It should be noted that... Figure 19 The components of the communication system 1000 are shown only schematically; their actual shape, size, location, and construction are not subject to change. Figure 19 Limited. Additionally... Figure 19 The illustration shows two signal transmission components 100, one backplane 200, and two backplane connectors 300. In other embodiments, the number of transmission components 100, the number of backplanes 200, and the number of backplane connectors 300 are not specifically limited.

[0271] The backplane 200 can be a rigid backplane, a flexible backplane, or a combination of rigid and flexible backplanes. The backplane 200 can be an FR-4 substrate, a Rogers substrate, a hybrid substrate of Rogers and FR-4, etc. This application does not specifically limit the type of backplane 200.

[0272] Additionally, the backplane connector 300 includes a backplane connector female socket 310 and a backplane connector female socket 320. The backplane connector female socket 310 is fixed to and electrically connected to the first circuit board 20 of the signal transmission assembly 100. At this time, the backplane connector female socket 310 is electrically connected to the second signal pin 14 of the first chip 10 via the first circuit board 20. Low-speed signals or power from the first chip 10 can be transmitted to the backplane connector female socket 310 via the first circuit board 20.

[0273] Please refer to it again. Figure 19 , combined Figure 8 and Figure 9a As shown, the backplane connector female socket 310 is also electrically connected to the second ends 323 of multiple cables 32 of the cable module 30. Specifically, the inner conductor 324 of each cable 32 is electrically connected to the signal terminal (not shown) of the backplane connector female socket 310, and the outer conductor 326 of each cable 32 is electrically connected to the ground terminal (not shown) of the backplane connector female socket 310. At this time, the backplane connector female socket 310 is electrically connected to the first signal pin 12 of the first chip 10 through the cables 32. The high-speed signal of the first chip 10 can be transmitted to the backplane connector female socket 310 through the inner conductors 324 of each cable 32. The first ground pin 13 of the first chip 10 can be electrically connected to the ground terminal of the backplane connector female socket 310 through the outer conductor 326 of the cables 32.

[0274] Additionally, the male backplane connector 320 is fixed to and electrically connected to the backplane 200. The female backplane connector 310 can be plugged into the male backplane connector 320. Thus, on the one hand, low-speed signals or power from the first chip 10 can be transmitted to the backplane 200 via the first circuit board 20, the female backplane connector 310, and the male backplane connector 320. On the other hand, high-speed signals from the first chip 10 can also be transmitted to the backplane 200 via multiple cables 32 of the cable module 30, the female backplane connector 310, and the male backplane connector 320.

[0275] In other embodiments, the positions of the backplane connector female socket 310 and the backplane connector male socket 320 can be interchanged. In this case, the backplane connector male socket 320 is fixed to and electrically connected to the first circuit board 20 of the signal transmission assembly 100. The backplane connector male socket 320 is also electrically connected to the second ends 323 of the multiple cables 32 of the cable module 30. The backplane connector female socket 310 is fixed to and electrically connected to the backplane 200.

[0276] Please see Figure 20 , Figure 20 This is a schematic diagram of another embodiment of the communication system 1000 provided in this application. The communication system 1000 includes a signal transmission component 100, an input / output (I / O) connector 400, a system circuit board 500, and functional modules 600. It should be noted that... Figure 20 The components of the communication system 1000 are shown only schematically; their actual shape, size, location, and construction are not subject to change. Figure 20 limited.

[0277] The system circuit board 500 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The system circuit board 500 can use FR-4 dielectric substrates, Rogers dielectric substrates, or hybrid dielectric substrates of Rogers and FR-4, etc. This application does not specifically limit the type of system circuit board 500.

[0278] In addition, functional module 600 can be a photoelectric conversion chip.

[0279] Please refer to it again. Figure 20 The I / O connector 400 is fixed to and electrically connected to the first circuit board 20 of the signal transmission assembly 100. At this time, the I / O connector 400 is electrically connected to the second signal pin 14 of the first chip 10 via the first circuit board 20. Low-speed signals or power from the first chip 10 can be transmitted to the I / O connector 400 via the first circuit board 20.

[0280] Please refer to it again. Figure 20 , combined Figure 8 and Figure 9a As shown, the I / O connector 400 is also electrically connected to the second ends 323 of the multiple cables 32 of the cable module 30. Specifically, the inner conductor 324 of each cable 32 is electrically connected to the signal terminal (not shown) of the I / O connector 400, and the outer conductor 326 of each cable 32 is electrically connected to the ground terminal (not shown) of the I / O connector 400. At this time, the I / O connector 400 is electrically connected to the first signal pin 12 of the first chip 10 via the cables 32. The high-speed signal of the first chip 10 can also be transmitted to the I / O connector 400 via the multiple cables 32 of the cable module 30.

[0281] Additionally, the functional module 600 is fixed to and electrically connected to the system circuit board 500. The system circuit board 500 can be electrically connected to the I / O connector 400. In this case, the functional module 600 is electrically connected to the I / O connector 400 through the system circuit board 500. Low-speed signals or power from the first chip 10 can be transmitted to the functional module 600 via the first circuit board 20, the I / O connector 400, and the system circuit board 500. Furthermore, high-speed signals from the first chip 10 can also be transmitted to the functional module 600 via multiple cables 32 of the cable module 30, the I / O connector 400, and the system circuit board 500.

[0282] In other embodiments, the communication system 1000 may not include the system circuit board 500 and the functional module 600.

[0283] In other embodiments, the communication system 1000 may also include a second circuit board (not shown). The second circuit board is disposed separately from the first circuit board 20. The I / O connector 400 is fixed to the second circuit board and electrically connected to the second circuit board.

[0284] The preceding text, with reference to the accompanying drawings, details several implementation methods of the communication system 1000. The following text, with reference to the accompanying drawings, further details several implementation methods of the signal transmission component 100.

[0285] The fifth implementation method, which shares the same technical content as the first implementation method, will not be repeated here: Please refer to [link to relevant documentation]. Figure 21 and Figure 22 , Figure 21 This is a schematic diagram of another embodiment of the signal transmission component 100 provided in this application. Figure 22 yes Figure 21The diagram shows an exploded view of the signal transmission assembly 100. The cable module 30 also includes a third fixing base 33. The third fixing base 33 is used to fix the second end 323 of each cable 32. The arrangement of the third fixing base 33 (e.g., the structure of the third fixing base 33, the formation of the third fixing base 33) can be referred to the arrangement of the first fixing base 31. The connection method between the third fixing base 33 and the second end 323 of each cable 32 can also be referred to the connection method between the first fixing base 31 and the first end 321 of each cable 32. Specific details will not be elaborated here.

[0286] The signal transmission component 100 also includes a second circuit board 50 and a second chip 60. The second circuit board 50 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The second circuit board 50 can use an FR-4 dielectric substrate, a Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc.

[0287] Additionally, the second circuit board 50 includes an upper end face 51 and a lower end face 52 facing opposite directions. The second circuit board 50 is provided with a third through hole 53. The third through hole 53 extends from the upper end face 51 of the second circuit board 50 to the lower end face 52 of the second circuit board 50; that is, the third through hole 53 penetrates both the upper end face 51 and the lower end face 52 of the second circuit board 50. The location, size, and shape of the third through hole 53 are not limited to... Figure 21 and Figure 22 The indicated location, size, and shape.

[0288] In this embodiment, the structure of the second circuit board 50 is the same as that of the first circuit board 20. In other embodiments, the structure of the second circuit board 50 may differ from that of the first circuit board 20.

[0289] At least a portion of the third fixing base 33 of the cable module 30 is disposed within the third through hole 53, and the second circuit board 50 is fixed therein. The connection method between the third fixing base 33 and the second circuit board 50 can be referred to the connection method between the first fixing base 31 and the first circuit board 20. Specific details will not be elaborated here. Thus, the end face of the second end 323 of the cable 32 and the upper end face 51 of the second circuit board 50 both face the same side of the third fixing base 33.

[0290] In this embodiment, the second chip 60 may be the same as or different from the first chip 10. This application does not specifically limit the type of the second chip 60.

[0291] Please see Figure 23 , Figure 23 yes Figure 22The diagram shows the structure of the second chip 60. The second chip 60 includes a second chip body 61, multiple first signal terminals 62, multiple first ground terminals 63, multiple second signal terminals 64, and multiple second ground terminals 65. All the multiple first signal terminals 62, multiple first ground terminals 63, multiple second signal terminals 64, and multiple second ground terminals 65 are disposed on the second chip body 61. The arrangement of the multiple first signal terminals 62, multiple first ground terminals 63, multiple second signal terminals 64, and multiple second ground terminals 65 on the second chip body 61 is not limited to... Figure 23 The arrangement shown is intentional. This application does not specify the arrangement of the multiple first signal terminals 62, multiple first ground terminals 63, multiple second signal terminals 64, and multiple second ground terminals 65 on the second chip body 61.

[0292] Additionally, the first signal terminal 62 is used to transmit high-speed signals and transmit them to the second chip body 61. The first ground terminal 63 serves as the ground reference for the first signal terminal 62. The first ground terminal 63 can shield signals from other signal terminals (e.g., the second signal terminal 64), thereby improving the first signal terminal 62's ability to resist signal crosstalk.

[0293] Additionally, the second signal terminal 64 is used to transmit low-speed signals or power, and to transmit the low-speed signals or power to the second chip body 61. The second ground terminal 65 serves as the ground reference for the second signal terminal 64. The second ground terminal 65 can shield signals from other signal terminals (e.g., the first signal terminal 62), thereby improving the second signal terminal 64's ability to resist signal crosstalk.

[0294] Please refer to it again. Figure 23 and combined Figure 21 and Figure 22 As shown, multiple second signal terminals 64 and multiple second ground terminals 65 are fixed to and electrically connected to the second circuit board 50. The second circuit board 50 is electrically connected to the first circuit board 20. The connection method between the second signal terminals 64 and the second circuit board 50 can be found in the second signal pin 14 of the first chip 10 (see [link to relevant documentation]). Figure 5 The connection method between the second ground terminal 65 and the first circuit board 20 can be found in the second ground pin 15 of the first chip 10 (see [link]). Figure 5 The connection method between the first chip 10 and the first circuit board 20 is not detailed here. In this way, the low-speed signal or power of the first chip 10 can be transmitted to the second chip 60 via the first circuit board 20 and the second circuit board 50.

[0295] Furthermore, a plurality of first signal terminals 62 are fixed one-to-one with the second ends 323 of a plurality of cables 32. For example, the plurality of first signal terminals 62 are fixed to the inner conductors 324 of the plurality of cables 32 (see [link to documentation]). Figure 9a The connection between the first signal pin 62 and the second end 323 of the cable 32 is shown in the first signal pin 12 of the first chip 10 (see [reference]). Figure 14 The connection method between the first chip 10 and the first end 321 of the cable 32 is not detailed here. In this way, the high-speed signal of the first chip 10 can also be transmitted to the second chip 60 through the multiple cables 32 of the cable module 30.

[0296] Additionally, multiple first grounding terminals 63 are electrically connected to the outer conductor 326 of the cable 32 (see [link]). Figure 9a The connection method between the first grounding terminal 63 and the outer conductor 326 of the cable 32 can be found in the first grounding pin 13 of the first chip 10 (see [link]). Figure 14 The connection method between the outer conductor 326 of the cable 32 and the cable 32 is not detailed here.

[0297] In this embodiment, high-speed signals, low-speed signals, and power can be transmitted between the first circuit board 10 and the second circuit board 50, i.e., through inter-board jumpers.

[0298] In other embodiments, the second end 323 of the cable 32 may also be electrically connected to the second chip 60 via an electrical connector and the second circuit board 50, or the second end 323 of the cable 32 may be electrically connected to the second chip 60 using other conventional methods. Thus, the cable module 30 may not include the third mounting bracket 33. The second circuit board 50 may not have the third through-hole 53.

[0299] The sixth implementation method, which shares the same technical content as the fifth implementation method, will not be repeated here: Please refer to [link to relevant documentation]. Figure 24 and Figure 25 , Figure 24 This is a schematic diagram of another embodiment of the signal transmission component 100 provided in this application. Figure 25 yes Figure 24 The diagram shows an exploded view of the signal transmission component 100. The first circuit board 20 and the second circuit board 50 are integrally formed, that is, the first circuit board 20 and the second circuit board 50 are a single unit. Figure 24 and Figure 25 The first circuit board 20 and the second circuit board 50 are identified by a single label. In this way, high-speed signals, low-speed signals, and power can be transmitted between the first chip 10 and the second chip 60 on the same circuit board, i.e., through internal jumpers.

[0300] The above text, with reference to the accompanying drawings, describes two types of signal transmission components 100. These signal transmission components 100 can implement inter-board jumpers or intra-board jumpers, thus enriching their applications.

[0301] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A signal transmission component (100), characterized in that, It includes a first chip (10), a first circuit board (20), and a cable module (30); The first chip (10) includes a first signal pin (12) and a second signal pin (14) arranged on the same side. The first circuit board (20) is provided with a first through hole (23), the first through hole (23) is disposed opposite to the first chip (10), and the second signal pin (14) is electrically connected to the first circuit board (20). The cable module (30) includes a first fixing base (31) and a cable (32). The first fixing base (31) is fixed to the first circuit board (20) and is at least partially located in the first through hole (23). The first end (321) of the cable (32) is fixed to the first fixing base (31) and electrically connected to the first signal pin (12). The cable module (30) further includes a first pad (315), which is fixed and electrically connected to the inner conductor (324) of the cable (32), and is also fixed and electrically connected to the first signal pin (12).

2. The signal transmission component (100) as claimed in claim 1, characterized in that, The number of cables (32) is one, and one cable (32) is used to transmit high-speed signals; or, the number of cables (32) is multiple, and at least one cable (32) is used to transmit high-speed signals.

3. The signal transmission component (100) as described in claim 1 or 2, characterized in that, The first circuit board (20) is used to transmit low-speed signals, power or high-speed signals.

4. The signal transmission component (100) as described in any one of claims 1 to 3, characterized in that, The cable (32) includes an inner conductor (324), a dielectric layer (325), and an outer conductor (326), wherein the dielectric layer (325) wraps the inner conductor (324), and the outer conductor (326) wraps the dielectric layer (325). The inner conductor (324) is electrically connected to the first signal pin (12). The first chip (10) also includes a first ground pin (13), which is used to provide a ground reference for the first signal pin (12). The first ground pin (13) is electrically connected to the outer conductor (326).

5. The signal transmission component (100) as described in claim 4, characterized in that, A portion of the first pad (315) is fixed to the end face (3243) of the first end (3242) of the inner conductor (324), and another portion of the first pad (315) is fixed to the end face (3253) of the first end (3252) of the dielectric layer (325). The first pad (315) is insulated from the outer conductor (326) of the cable (32).

6. The signal transmission component (100) as claimed in claim 5, characterized in that, The cable module (30) further includes a first spring (317), which is fixed to the first pad (315) and electrically connected to the first signal pin (12).

7. The signal transmission component (100) as described in any one of claims 4 to 6, characterized in that, The cable module (30) further includes a first grounding layer (314), a portion of which is located on the surface of the first mounting base (31), and another portion of which is located on the end face (3262) of the first end (3261) of the outer conductor (326). The first grounding layer (314) is electrically connected to the outer conductor (326) of the cable (32) and is insulated from the inner conductor (324) of the cable (32). The first grounding layer (314) is electrically connected to the first grounding pin (13).

8. The signal transmission component (100) as claimed in claim 7, characterized in that, The cable module (30) further includes a second pad (316), which is fixed to the surface of the first ground layer (314) away from the first mounting base (31); The second pad (316) is electrically connected to the first ground layer (314), and the second pad (316) is electrically connected to the first ground pin (13).

9. The signal transmission component (100) as claimed in any one of claims 1 to 8, characterized in that, The signal transmission component (100) further includes a socket connector (40) disposed between the first chip (10) and the first circuit board (20); The socket connector (40) includes a first signal spring (42) and a second signal spring (44). One side of the first signal spring (42) is electrically connected to the first signal pin (12), and the other side is electrically connected to the first end (321) of the cable (32). One side of the second signal spring (44) is electrically connected to the second signal pin (14), and the other side is electrically connected to the first circuit board (20).

10. The signal transmission component (100) as claimed in any one of claims 1 to 9, characterized in that, The first fixing seat (31) is interference-fitted with the wall of the first through hole (23).

11. The signal transmission component (100) as claimed in any one of claims 1 to 10, characterized in that, The first chip (10) further includes a second ground pin (15), which is used to provide a ground reference for the second signal pin (14). The second ground pin (15) is electrically connected to the first circuit board (20) and grounded through the first circuit board (20).

12. The signal transmission component (100) as claimed in any one of claims 1 to 11, characterized in that, The cable module (30) also includes a second fixing seat (34), and the middle part (322) of the cable (32) is fixed to the second fixing seat (34) along the extension direction of the cable (32).

13. The signal transmission component (100) as claimed in any one of claims 1 to 12, characterized in that, The signal transmission component (100) also includes a second circuit board (50) and a second chip (60); The second chip (60) includes a first signal terminal (62) and a second signal terminal (64) disposed on the same side. The second circuit board (50) is provided with a third through hole (53), and the second signal terminal (64) is electrically connected to the second circuit board (50); The cable module (30) further includes a third fixing seat (33), which is fixed to the second circuit board (50) and at least partially located in the third through hole (53). The second end (323) of the cable (32) is fixed to the third fixing seat (33) and electrically connected to the first signal terminal (62).

14. The signal transmission component (100) as claimed in claim 13, characterized in that, The second circuit board (50) and the first circuit board (20) are integrally formed.

15. A communication system (1000), characterized in that, Includes a connector and a signal transmission component (100) as claimed in any one of claims 1 to 12; The connector is electrically connected to the second end (323) of the cable (32) and is also electrically connected to the first circuit board (20) to be electrically connected to the second signal pin (14) through the first circuit board (20).

16. The communication system (1000) as described in claim 15, characterized in that, The connector is a backplane connector (300), which includes a backplane connector female (310) and a backplane connector male (320). The backplane connector female (310) is fixed to the first circuit board (20). The backplane connector female (310) is electrically connected to the second end (323) of the cable (32) to be electrically connected to the first signal pin (12) through the cable (32). The backplane connector female (310) is also electrically connected to the first circuit board (20) to be electrically connected to the second signal pin (14) through the first circuit board (20). The communication system (1000) also includes a backplate (200), the male connector (320) of the backplate is fixed to the backplate (200) and electrically connected to the backplate (200), and the female connector (310) of the backplate is electrically connected to the male connector (320).

17. The communication system (1000) as described in claim 15, characterized in that, The connector is an I / O connector (400); The communication system (1000) also includes a system circuit board (500) and a functional module (600), and the I / O connector (400) is electrically connected to the system circuit board (500). The functional module (600) is fixed to the system circuit board (500) and is electrically connected to the system circuit board (500) so as to be electrically connected to the I / O connector (400) through the system circuit board (500).

18. A cable assembly (101), characterized in that, Includes a first circuit board (20) and a cable module (30); The first circuit board (20) is provided with a first through hole (23), and the first circuit board (20) is used to electrically connect to the second signal pin (14) of the first chip (10); The cable module (30) includes a first fixing base (31) and a cable (32). The first fixing base (31) is fixed to the first circuit board (20) and is at least partially located in the first through hole (23). The first end (321) of the cable (32) is fixed to the first fixing base (31) and is used to electrically connect to the first signal pin (12) of the first chip (10). The cable module (30) further includes a first pad (315), which is fixed and electrically connected to the inner conductor (324) of the cable (32), and the first pad (315) is also used to be fixed and electrically connected to the first signal pin (12) of the first chip (10).

19. The cable assembly (101) as claimed in claim 18, characterized in that, The cable (32) includes an inner conductor (324), a dielectric layer (325), and an outer conductor (326), wherein the dielectric layer (325) wraps the inner conductor (324), and the outer conductor (326) wraps the dielectric layer (325). The inner conductor (324) is used to electrically connect to the first signal pin (12) of the first chip (10), and the outer conductor (326) is used to electrically connect to the first ground pin (13) of the first chip (10). The first ground pin (13) is used to provide a ground reference for the first signal pin (12).

20. The cable assembly (101) as claimed in claim 19, characterized in that, A portion of the first pad (315) is fixed to the end face (3243) of the first end (3242) of the inner conductor (324), and another portion of the first pad (315) is fixed to the end face (3253) of the first end (3252) of the dielectric layer (325). The first pad (315) is insulated from the outer conductor (326) of the cable (32).

21. The cable assembly (101) as claimed in claim 20, characterized in that, The cable module (30) further includes a first spring (317); the first spring (317) is fixed to the first pad (315), and the first spring (317) is used to electrically connect to the first signal pin (12) of the first chip (10).

22. The cable assembly (101) as claimed in any one of claims 19 to 21, characterized in that, The cable module (30) further includes a first grounding layer (314), a portion of which is located on the surface of the first mounting base (31), and another portion of which is located on the end face (3262) of the first end (3261) of the outer conductor (326). The first ground layer (314) is electrically connected to the outer conductor (326) of the cable (32), and the first ground layer (314) is also insulated from the inner conductor (324) of the cable (32). The first ground layer (314) is used to be electrically connected to the first ground pin (13) of the first chip (10).

23. The cable assembly (101) as claimed in claim 22, characterized in that, The cable module (30) further includes a second pad (316), which is fixed to the surface of the first ground layer (314) away from the first mounting base (31); The second pad (316) is electrically connected to the first ground layer (314), the second pad (316) is insulated from the inner conductor (324) of the cable (32), and the second pad (316) is used to be electrically connected to the first ground pin (13) of the first chip (10).

24. The cable assembly (101) as claimed in any one of claims 18 to 23, characterized in that, The cable assembly (101) further includes a socket connector (40) disposed on the same side of the first circuit board (20) and the first mounting base (31); The socket connector (40) includes a first signal spring (42) and a second signal spring (44). One side of the first signal spring (42) is used to be electrically connected to the first signal pin (12), and the other side is electrically connected to the first end (321) of the cable (32). One side of the second signal spring (44) is used to be electrically connected to the second signal pin (14), and the other side is electrically connected to the first circuit board (20).

25. The cable assembly (101) as claimed in any one of claims 18 to 24, characterized in that, The first fixing seat (31) is interference-fitted with the wall of the first through hole (23).

26. The cable assembly (101) as claimed in any one of claims 18 to 25, characterized in that, The cable module (30) also includes a second fixing seat (34), and the middle part (322) of the cable (32) is fixed to the second fixing seat (34) along the extension direction of the cable (32).

27. The cable assembly (101) as claimed in any one of claims 18 to 26, characterized in that, The cable assembly (101) further includes a second circuit board (50), which has a third through hole (53) and is used to electrically connect to the second signal terminal (64) of the second chip (60); The cable module (30) further includes a third fixing seat (33), which is fixed to the second circuit board (50) and is at least partially located in the third through hole (53). The second end (323) of the cable (32) is fixed to the third fixing seat (33) and is used to electrically connect to the first signal terminal (62) of the second chip (60).

28. The cable assembly (101) as claimed in any one of claims 18 to 27, characterized in that, The number of cables (32) is one, and one cable (32) is used to transmit high-speed signals; or, the number of cables (32) is multiple, and at least one cable (32) is used to transmit high-speed signals.

29. A signal transmission component (100), characterized in that, Includes a first chip (10) and a cable module (30); The first chip (10) includes a first signal pin (12), and the cable module (30) includes a first fixing base (31) and a cable (32). The first end (321) of the cable (32) is fixed to the first fixing base (31) and electrically connected to the first signal pin (12). The cable module (30) further includes a first pad (315), which is fixed and electrically connected to the inner conductor (324) of the cable (32), and is also fixed and electrically connected to the first signal pin (12).

30. The signal transmission component (100) as claimed in claim 29, characterized in that, The number of cables (32) is one, and one cable (32) is used to transmit high-speed signals; or, the number of cables (32) is multiple, and at least one cable (32) is used to transmit high-speed signals.

31. The signal transmission component (100) as claimed in claim 29 or 30, characterized in that, The cable (32) includes an inner conductor (324), a dielectric layer (325), and an outer conductor (326), wherein the dielectric layer (325) wraps the inner conductor (324), and the outer conductor (326) wraps the dielectric layer (325). The inner conductor (324) is electrically connected to the first signal pin (12). The first chip (10) also includes a first ground pin (13), which is used to provide a ground reference for the first signal pin (12). The first ground pin (13) is electrically connected to the outer conductor (326).

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