Diffusion Plate Applied to Mini LED Display Module, Its Preparation Mold and Preparation Process

Abstract

The present invention discloses a diffusion plate applied to a mini LED display module, its preparation mold and preparation process. A mold for preparing a diffusion plate includes a front mold and a rear mold; the front mold includes a top plate, a clamping plate and a bottom plate; the clamping plate is arranged at the bottom of the top plate; the bottom plate is arranged at the bottom of the clamping plate; a glue injection port is formed in the top plate; a first groove is formed in the clamping plate; a hot runner assembly is arranged in the clamping plate; the hot runner assembly is located in the first groove; a textured insert and a gate insert are arranged on the bottom plate; the rear mold includes a base, a support plate and a movable plate; a diffusion plate preparation process includes: drying the raw materials; heating the raw materials; closing the mold; injecting; compressing; opening the mold; ejecting; taking out the product; a diffusion plate is obtained by the mold for preparing a diffusion plate or is obtained by the diffusion plate preparation process. The present invention has advantages such as high preparation efficiency, good product quality and low defective rate that are not possessed by the prior art.

Description

Technical Field

[0001] The present invention relates to the field of lamp manufacturing. More specifically, the present invention relates to a diffusion plate applied to a mini-LED display module, a preparation mold thereof, and a preparation process thereof. Background Art

[0002] Diffusion plates are widely used in liquid crystal displays, LED lighting, imaging, and other systems. Its main function is to fully scatter the incident light to achieve a softer and more uniform illumination effect.

[0003] The existing diffusion plate preparation process is mainly the extrusion molding and roller embossing composite technology, combined with the post-processing slitting process. However, the above process has problems such as complex manufacturing processes, low automation, and low efficiency. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a diffusion plate applied to a mini-LED display module, a preparation mold thereof, and a preparation process thereof, which have the characteristics of high production efficiency and good product quality.

[0005] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0006] A mold for preparing a diffusion plate applied to a mini-LED display module includes a front mold and a rear mold; the front mold is arranged above the rear mold; the front mold includes a top plate, a clamping plate, and a bottom plate; the clamping plate is arranged at the bottom of the top plate; the bottom plate is arranged at the bottom of the clamping plate; a glue injection port is opened on the top plate; a first groove is opened on the clamping plate; a hot runner assembly is arranged in the clamping plate; the hot runner assembly is located in the first groove; a textured insert and a gate insert are arranged on the bottom plate; the surface of the textured insert is designed with microstructures for light scattering; the rear mold includes a base, a support plate, and a movable plate; the movable plate is arranged at the bottom of the bottom plate; the support plate is arranged on the base; the movable plate is arranged on the support plate; a second groove is opened on the movable plate; a movable core is arranged in the second groove.

[0007] In the above structure, a blind hole is opened on the support plate; a first spring is arranged in the blind hole; the other end of the first spring abuts against the bottom of the movable plate; a screw hole is opened on the movable plate; a limit screw is arranged at the screw hole part; the bottom of the limit screw is connected to the support plate; a positioning hole is opened on the gate insert; the hot runner system is connected to the positioning hole. Adjusting blocks are arranged on the sides of the textured insert and the gate insert; the adjusting blocks are arranged in a shape that is narrower at the top and wider at the bottom.

[0008] In the above structure, a splicing part is arranged in the second groove; a glue inlet is formed in the splicing part; the splicing part surrounds the periphery of the movable core; a stepped position is arranged on the side wall of the second groove; the splicing part is fixed on the stepped position; a supporting block is arranged at the bottom of the movable core; the supporting block is arranged on the supporting plate; a power interface is arranged on the side surface of the clamping plate.

[0009] In the above structure, a first through hole is formed in the movable plate and the supporting plate; a first support column is arranged on the base; the movable plate and the supporting plate are sleeved on the first support column through the first through hole; a second spring is arranged between the base and the supporting plate; the second spring is wound around the first support column. A second support column is arranged on the base; second through holes are formed in the bottom plate, the movable plate and the supporting plate; the bottom plate, the movable plate and the supporting plate are sleeved on the second support column through the second through holes.

[0010] A preparation process of a diffusion plate applied to a mini LED display module includes the following steps:

[0011] Step S1, drying the raw materials, drying the plastic particles to reduce the water content in the plastic particles;

[0012] Step S2, heating the raw materials, melting the plastic particles to make the plastic particles melt into a sol;

[0013] Step S3, clamping the mold, performing a clamping action on the front mold and the rear mold of the mold;

[0014] Step S4, injecting, injecting the sol into the mold;

[0015] Step S5, compressing, compressing the front mold and the rear mold;

[0016] Step S6, opening the mold, separating the front mold and the rear mold;

[0017] Step S7, ejecting, ejecting the product from the mold;

[0018] Step S8, taking out the product, taking out the product from the mold.

[0019] Further, the specific method for drying the raw materials is: the drying temperature is 120 °C, the drying time is 5 - 10 hours, and the moisture content of the plastic particles ≤ 200 ppm; the specific method for heating the raw materials is: the melting temperature is 280 - 330 °C, and the melting time is 2 - 6 cm 3 / s.

[0020] Further, the specific method for clamping the mold is: the clamping force of the front mold and the rear mold is 0.392 - 0.784 ton / cm 2; The clamping force tolerance is ±1 ton; The specific injection method is as follows: The injection pressure of the molten resin into the mold is 1500 - 2000 kgf / cm 2 ; The injection speed of the molten resin is 200 - 500 mm / s; The injection pressure tolerance is ±5%; The injection speed tolerance is ±5%.

[0021] Furthermore, the specific compression method is as follows: The initial compression force is 30 - 50 ton; The specific mold opening method is as follows: The mold opening time of the front mold and the rear mold is 1 - 2 S.

[0022] Furthermore, the specific ejection method is as follows: The ejection time of the product is 1 - 3 S; The specific product removal method is as follows: The removal speed is 300 mm / s; The product is removed from the mold and transported to a CNC shearing and polishing integrated machine.

[0023] Furthermore, it also includes mold temperature maintenance. The temperature of the mold is 80 - 100 °C; The mold temperature is maintained at 80 - 100 °C; The temperature tolerance is ±1 °C; It also includes edge trimming processing. The edge of the product is machined by a CNC shearing and polishing integrated machine; The surface roughness of the product is ≤1.0 um; It also includes product inspection. The appearance of the product is inspected by an AOI automatic inspection machine to reject defective products.

[0024] A diffuser plate applied to a mini LED display module is obtained by the mold for preparing the diffuser plate, or is obtained by the diffuser plate preparation process.

[0025] The beneficial effects of the present invention are as follows: The present invention provides a diffusion plate applied to a mini LED display module, its preparation mold and preparation process; A mold for preparing a diffusion plate applied to a mini LED display module, including a front mold and a rear mold; The front mold is arranged above the rear mold; The front mold includes a top plate, a clamping plate and a bottom plate; The clamping plate is arranged at the bottom of the top plate; The bottom plate is arranged at the bottom of the clamping plate; A glue injection port is opened on the top plate; A first groove is opened on the clamping plate; A hot runner assembly is arranged in the clamping plate; The hot runner assembly is located in the first groove; A textured insert and a gate insert are arranged on the bottom plate; The surface of the textured insert is designed with microstructures for light scattering; The rear mold includes a base, a support plate and a movable plate; The movable plate is arranged at the bottom of the bottom plate; The support plate is arranged on the base; The movable plate is arranged on the support plate; A second groove is opened on the movable plate; A movable core is arranged in the second groove. A preparation process for a diffusion plate applied to a mini LED display module includes the following steps: Step S1, drying the raw materials, drying the plastic particles to reduce the water content in the plastic particles; Step S2, heating the raw materials, melting the plastic particles to make the plastic particles melt into a sol; Step S3, closing the mold, the front mold and the rear mold of the mold perform a closing action; Step S4, injecting, injecting the sol into the mold; Step S5, compressing, compressing the front mold and the rear mold; Step S6, opening the mold, separating the front mold and the rear mold; Step S7, ejecting, ejecting the product from the mold; Step S8, taking out the product, taking out the product from the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the drawings and embodiments.

[0027] Figure 1 is the assembly schematic diagram of the mold in the present invention;

[0028] Figure 2 is the assembly schematic diagram of the mold in the present invention (excluding the top plate);

[0029] Figure 3 is the assembly schematic diagram of the rear mold, the textured insert and the gate insert of the mold in the present invention;

[0030] Figure 4 is the assembly schematic diagram of the rear mold of the mold in the present invention;

[0031] Figure 5 is the assembly schematic diagram of the base and the support plate of the mold in the present invention;

[0032] Figure 6 is the process flow chart of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The concept, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with embodiments and the accompanying drawings to fully understand the purpose, features and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts shall fall within the scope of protection of the present invention. In addition, all connection / linkage relationships involved in the patent do not simply refer to direct connection of components, but refer to more optimal connection structures that can be formed by adding or reducing connection accessories according to specific implementation situations. Each technical feature in the present invention can be interactively combined on the premise of not conflicting with each other.

[0034] Referring to Figures 1-5 , a mold for preparing a diffusion plate applied to a mini LED display module, comprising a front mold and a rear mold; the front mold is arranged above the rear mold; the front mold includes a top plate 01, a clamping plate 02 and a bottom plate 03; the clamping plate 02 is arranged at the bottom of the top plate 01; the bottom plate 03 is arranged at the bottom of the clamping plate 02; a glue injection port 07 is opened on the top plate 01; the sol enters the front mold through the glue injection port 07.

[0035] A first groove 25 is opened on the clamping plate 02; a hot runner assembly 11 is arranged in the clamping plate 02; the hot runner assembly 11 is located in the first groove 25; the hot runner assembly 11 can reduce the pressure loss during injection molding, improve the production cycle of the diffusion plate, and at the same time, for large-size diffusion plates, the product can be set at the center of the mold, so that the sol can obtain a relatively uniform pressure distribution during injection and mold closing.

[0036] A texturing insert 15 and a gate insert 14 are arranged on the bottom plate 03; the surface of the texturing insert 15 is designed with microstructures for light scattering; after injection molding, corresponding microstructure shapes are left on the diffusion plate to meet the optical requirements of the product.

[0037] The rear mold includes a base 06, a support plate 05 and a movable plate 04; the movable plate 04 is arranged at the bottom of the bottom plate 03; the support plate 05 is arranged on the base 06; the movable plate 04 is arranged on the support plate 05; a second groove 26 is opened on the movable plate 04; a movable core 18 is arranged in the second groove 26.

[0038] A blind hole 23 is opened on the support plate 05; a first spring 24 is arranged in the blind hole 23; the other end of the first spring 24 abuts against the bottom of the movable plate 04; the movable plate 04 can compress the first spring 24 to move downward to reduce the depth of the mold cavity, and the movable core 18 also enables the entire product to be evenly subjected to the mold closing pressure, making the internal stress of the product equivalent as a whole and improving the product quality.

[0039] The movable plate 04 is provided with screw holes; a limit screw 21 is arranged at the screw hole part; when the first spring 24 rebounds to make the movable plate 04 move upward, the limit screw 21 can limit the upward movement range of the movable plate 04; the bottom of the limit screw 21 is connected to the support plate 05.

[0040] The glue inlet insert 14 is provided with a positioning hole 16; the hot runner assembly 11 is connected to the positioning hole 16, and the hot runner assembly 11 is communicated with the rear mold cavity to achieve the purpose of injecting molten plastic between the movable core 18 and the texturing insert 15.

[0041] A fitting 19 is arranged in the second groove 26; a glue inlet 20 is arranged on the fitting 19; the molten plastic flows from the glue inlet 20 to the movable core 18; the fitting 19 surrounds the movable core 18 on all sides.

[0042] Adjusting blocks 17 are arranged on the sides of the texturing insert 15 and the glue inlet insert 14; the adjusting blocks 17 are arranged in a shape that is narrower at the top and wider at the bottom; the adjusting blocks 17 can be used to fix the texturing insert 15 and the glue inlet insert 14, and when using texturing inserts 15 and glue inlet inserts 14 of different sizes, the penetration depth of the adjusting blocks 17 into the bottom plate 03 can be changed.

[0043] A stepped position is arranged on the side wall of the second groove 26; the fitting 19 is fixed on the stepped position.

[0044] A support block 22 is arranged at the bottom of the movable core 18, and the support block 22 is used to support the movable core 18; the support block 22 is arranged on the support plate 05.

[0045] First through holes are arranged on the movable plate 04 and the support plate 05; a first support column 09 is arranged on the base 06; the movable plate 04 and the support plate 05 are passed through the first support column 09 through the first through holes; a second spring 10 is arranged between the base 06 and the support plate 05; the second spring 10 is wound around the first support column 09.

[0046] A second support column 13 is arranged on the base 06; second through holes are arranged on the bottom plate 03, the movable plate 04 and the support plate 05; the bottom plate 03, the movable plate 04 and the support plate 05 are passed through the second support column 13 through the second through holes.

[0047] A power interface 08 is arranged on the side of the clamping plate 02; the power interface 08 is electrically connected to the hot runner assembly 11.

[0048] As Figure 6As shown in the figure, the working principle of a mold for preparing a diffusion plate is as follows: The molten glue enters the hot runner assembly 11 from the glue injection port 07, and the hot runner assembly 11 injects the molten glue into the space between the movable core 18 and the textured insert 15 through the positioning hole 16 on the gate insert 14.

[0049] During injection molding, the movable plate 04 is subjected to the elastic force of the first spring 24 and moves upward. The limit screw 21 limits the upward movement distance of the movable plate 04. The split part 19 is driven by the movable plate 04 to move upward, so that the split part 19 is higher than the movable core 18 to form a cavity with a certain depth. The molten glue enters the cavity. When the molten glue is filled to a certain amount, the mold performs a clamping action, and the movable plate 04 moves downward, reducing the depth of the cavity. The movable core 18 also enables the entire product to be evenly subjected to the clamping pressure, making the internal stress of the product uniform and improving the product quality.

[0050] A preparation process for a diffusion plate applied to a mini LED display module includes the following steps:

[0051] Step S1, drying the raw materials, drying the plastic particles to reduce the water content in the plastic particles; the drying temperature is 120 °C, the drying time is 5 - 10 hours, and the water content of the plastic particles ≤ 200 ppm;

[0052] Step S2, heating the raw materials, melting the plastic particles to make the plastic particles melt into a molten glue; the melting temperature is 280 - 330 °C, and the melting time is 2 - 6 cm 3 / s;

[0053] Step S3, clamping the mold, the front mold and the rear mold of the mold perform a clamping action; the clamping force of the front mold and the rear mold is 0.392 - 0.784 ton / cm 2 ; the clamping force tolerance is ±1 ton;

[0054] Step S4, injecting, injecting the molten glue into the mold; the injection pressure of the molten glue injected into the mold is 1500 - 2000 kgf / cm 2 ; the injection speed of the molten glue is 200 - 500 mm / s; the injection pressure tolerance is ±5%; the injection speed tolerance is ±5%;

[0055] Step S5, compressing, compressing the front mold and the rear mold; the initial compression force is 30 - 50 ton;

[0056] Step S6, opening the mold, separating the front mold and the rear mold; the opening time of the front mold and the rear mold is 1 - 2 S;

[0057] Step S7, ejecting, ejecting the product from the mold; the ejection time of the product is 1 - 3 S;

[0058] Step S8, take out the product, take out the product from the mold; the take-out speed is 300 mm / s; the product is taken out from the mold and transported to the CNC shearing and polishing integrated machine.

[0059] The preparation process of a diffusion plate applied to a mini LED display module further includes maintaining the mold temperature, and the temperature of the mold is 80-100 °C; the mold temperature is maintained at 80-100 °C; the temperature tolerance is ±1 °C.

[0060] The preparation process of a diffusion plate applied to a mini LED display module further includes edge trimming, and the edge of the product is processed by cutting using a CNC shearing and polishing integrated machine; the surface roughness of the product is ≤1.0 um.

[0061] The preparation process of a diffusion plate applied to a mini LED display module further includes product inspection, and an AOI automatic detector is used to perform appearance inspection on the product to eliminate defective products.

[0062] A diffusion plate applied to a mini LED display module is obtained by using the mold for preparing the diffusion plate applied to the mini LED display module, or it is obtained by using the preparation process of the diffusion plate applied to the mini LED display module.

[0063] This mold and preparation process adopt a high-precision mold injection molding integrated process. The optical microstructure transfer rate can reach more than 99%, the dimensional accuracy is increased by 50%, and the injection molding processing and detection equipment are connected for operation. The line automation rate can reach more than 95%.

[0064] The above has specifically described the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A mold for preparing a diffusion plate applied to a mini LED display module, characterized in that: It includes a front mold and a rear mold; the front mold is arranged above the rear mold; the front mold includes a top plate, a clamping plate and a bottom plate; the clamping plate is arranged at the bottom of the top plate; the bottom plate is arranged at the bottom of the clamping plate; a glue injection port is opened on the top plate; a first groove is opened on the clamping plate; a hot runner assembly is arranged in the clamping plate; the hot runner assembly is located in the first groove; a textured insert and a gate insert are arranged on the bottom plate, and a positioning hole is opened on the gate insert; the hot runner assembly is connected to the positioning hole; the surface of the textured insert is designed with a microstructure for scattering light; the rear mold includes a base, a support plate and a movable plate; the movable plate is arranged at the bottom of the bottom plate; the support plate is arranged on the base; a blind hole is opened on the support plate; a first spring is arranged in the blind hole; the other end of the first spring abuts against the bottom of the movable plate; the movable plate is arranged on the support plate; a second groove is opened on the movable plate; a movable core is arranged in the second groove; a split piece is arranged in the second groove; a gate is opened on the split piece; the split piece surrounds the movable core.

2. The mold for preparing a diffusion plate applied to a mini LED display module according to claim 1, characterized in that: A screw hole is opened on the movable plate; a limit screw is arranged at the screw hole part; the bottom of the limit screw is connected to the support plate; adjusting blocks are arranged on the sides of the textured insert and the gate insert; the adjusting blocks are arranged in a shape that is narrow at the top and wide at the bottom.

3. The mold for preparing a diffusion plate applied to a mini LED display module according to claim 1, characterized in that: A stepped position is arranged on the side wall of the second groove; the split piece is fixed on the stepped position; a support block is arranged at the bottom of the movable core; the support block is arranged on the support plate; a power interface is arranged on the side of the clamping plate.

4. The mold for preparing a diffusion plate applied to a mini LED display module according to claim 1, characterized in that: First through holes are opened on the movable plate and the support plate; a first support column is arranged on the base; the movable plate and the support plate are passed through the first support column through the first through holes; a second spring is arranged between the base and the support plate; the second spring is wound around the first support column, and a second support column is arranged on the base; second through holes are opened on the bottom plate, the movable plate and the support plate; the bottom plate, the movable plate and the support plate are passed through the second support column through the second through holes.

5. A preparation process for a diffusion plate applied to a mini LED display module, using the mold for preparing a diffusion plate applied to a mini LED display module according to claim 1, characterized in that: It includes the following steps: Step S1, drying the raw materials, drying the plastic particles to reduce the water content in the plastic particles; Step S2, heating the raw materials, melting the plastic particles to make the plastic particles melt into a sol; Step S3, closing the mold, performing a mold closing action on the front mold and the rear mold of the mold; Step S4, injecting, injecting the sol into the mold; Step S5, compressing, compressing the front mold and the rear mold; Step S6, opening the mold, separating the front mold and the rear mold; Step S7, ejecting, ejecting the product from the mold; Step S8, taking out the product, taking out the product from the mold.

6. The preparation process for a diffusion plate applied to a mini LED display module according to claim 5, characterized in that: The specific method for drying the raw materials is: the drying temperature is 120 °C, the drying time is 5 - 10 hours, and the water content of the plastic particles ≤ 200 ppm; the specific method for heating the raw materials is: the melting temperature is 280 - 330 °C, and the melting time is 2 - 6 cm3 / s.

7. The preparation process for a diffusion plate applied to a mini LED display module according to claim 5, characterized in that: The specific method of mold clamping is as follows: the mold clamping force of the front mold and the rear mold is 0.392 - 0.784 ton / cm2; the tolerance of the mold clamping force is ±1 ton; the specific method of injection is as follows: the injection pressure of the molten resin into the mold is 1500 - 2000 kgf / cm2; the injection speed of the molten resin is 200 - 500 mm / s; the tolerance of the injection pressure is ±5%; the tolerance of the injection speed is ±5%.

8. The preparation process for a diffusion plate applied to a mini LED display module according to claim 5, characterized in that: The specific method of compression is as follows: the initial compression force is 30 - 50 ton; the specific method of mold opening is as follows: the mold opening time of the front mold and the rear mold is 1 - 2S; the specific method of ejection is as follows: the ejection time of the product is 1 - 3S; the specific method of taking out the product is as follows: the taking out speed is 300 mm / s; the product is taken out from the mold and transported to a CNC shearing and polishing integrated machine.

9. The preparation process for a diffusion plate applied to a mini LED display module according to claim 5, characterized in that: It also includes mold temperature maintenance, the temperature of the mold is 80 - 100 °C; the mold temperature is maintained at 80 - 100 °C; the temperature tolerance is ±1 °C; it also includes edge trimming, using a CNC shearing and polishing integrated machine to perform cutting processing on the edge of the product; the surface roughness of the product is ≤1.0 um; it also includes product inspection, using an AOI automatic inspection machine to perform appearance inspection on the product to eliminate defective products.

10. A diffusion plate applied to a mini LED display module, characterized in that: It is obtained by using the mold for preparing a diffusion plate applied to a mini LED display module according to any one of claims 1 - 4, or it is obtained by using the preparation process of a diffusion plate applied to a mini LED display module according to any one of claims 5 - 9.

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