Stabilized crystal bonding device

Abstract

This invention relates to a stable die bonding apparatus, comprising: a transfer member, a flexible connection member, and a die holding assembly. In a predetermined die bonding direction, a displacement actuator of the transfer member transports the die toward a substrate. During die transport, a buffer member of the flexible connection member undergoes a shape change by tilting and oscillating relative to the predetermined die bonding direction to absorb deviations caused by a moving guide member, and a pressure actuator of the telescopic abutment assembly of the flexible connection member displaces relative to a pressure stator along the predetermined die bonding direction to apply pressure to the die, thereby pressurizing and bonding the die to the substrate.

Description

Technical Field

[0001] This invention relates to the field of chip transfer equipment technology, specifically to a stable die bonding device. Background Technology

[0002] After the chip is placed on the substrate, pressure still needs to be applied to the chip to ensure that the chip is completely bonded to the substrate. Specifically, the chip is moved above the substrate by a transfer device, and once the chip has been moved to a predetermined position on the substrate, the transfer device pushes the chip onto the substrate and applies pressure.

[0003] However, the die bonding quality of existing technologies is easily affected by the track accuracy of the transfer device. Furthermore, factors such as the assembly accuracy of the track, the quality of the track, and the angular tolerances of the substrate or chip can all generate lateral forces acting on the chip during die bonding pressure, leading to deviations in the die bonding angle position. On the other hand, even if the track is of good quality, allowing the chip to be pushed onto the substrate parallel to it, a reaction force will still be generated during the pressing process, causing deviations in the die bonding angle position. Summary of the Invention

[0004] Therefore, the purpose of this invention is to provide a stable die bonding device that can compensate for die bonding deviations caused by the assembly accuracy and quality of the track.

[0005] The present invention addresses the problems of the prior art by providing a stable die bonding device, comprising: a transfer member having a displacement stator and a displacement mover, the displacement mover being disposed on a transfer guide and extending and retracting relative to the displacement stator in a predetermined die bonding direction to transfer a chip toward a substrate; a flexible connection member connected to the end of the displacement mover of the transfer member to cooperate with the displacement mover in transferring the chip to a die bonding position adjacent to the substrate along the predetermined die bonding direction, the flexible connection member having a buffer and a telescopic abutment assembly, the end of the displacement mover being rigidly connected to a pressure stator of the telescopic abutment assembly along the predetermined die bonding direction, the pressure stator being connected to the buffer and flexibly connected to a pressure mover that moves relative to the pressure stator; and a chip holding assembly connected to the outer surface of the buffer of the flexible connection member along the predetermined die bonding direction to hold the flexible connection member... The telescopic abutment assembly is located between the displacement element of the transfer member and the chip holding assembly, and the pressure actuator of the telescopic abutment assembly is connected to the inner edge surface of the buffer in a manner corresponding to the chip holding assembly in position. The chip holding assembly holds the chip with its holding end facing the predetermined die placement direction. In the predetermined die placement direction, the displacement element of the transfer member drives the chip holding assembly via the flexible connection member to transfer the chip to a die placement position adjacent to the substrate. During the transfer of the chip, the buffer changes shape by tilting and swinging relative to the predetermined die placement direction to absorb the deviation caused by the moving guide. The pressure actuator of the telescopic abutment assembly displaces angularly relative to the pressure stator as the shape of the buffer changes, and the pressure actuator displaces relative to the pressure stator along the predetermined die placement direction to apply pressure to the chip so that the chip is pressurized and bonded to the substrate.

[0006] In one embodiment of the present invention, a stable die bonding device is provided, wherein the telescopic abutment assembly of the flexible connection member is a piston cylinder assembly, the pressure stator is the cylinder body of the piston cylinder assembly and is connected to the inner edge surface of the buffer member in a manner corresponding to the end of the displacement element in position, and the pressure mover is the piston rod of the piston cylinder assembly and is connected to the inner edge surface of the buffer member in a manner corresponding to the chip holding assembly in position. After the shape change of the buffer member absorbs the deviation caused by the moving guide, the cylinder body increases the pressure to make the piston rod extend out of the cylinder body along the predetermined die bonding direction, thereby pressurizing and bonding the chip to the substrate.

[0007] In one embodiment of the present invention, a stable die bonding device is provided, wherein the telescopic abutment assembly of the flexible connection member is a voice coil motor, the pressure stator is the body of the voice coil motor and is connected to the inner edge surface of the buffer in a manner corresponding to the end of the displacement element, and the pressure mover is the protrusion of the voice coil motor and is connected to the inner edge surface of the buffer in a manner corresponding to the chip holding assembly. After the shape change of the buffer absorbs the deviation caused by the moving guide, the voice coil motor increases the current to make the protrusion extend out of the body along the predetermined die bonding direction, thereby pressurizing and bonding the chip to the substrate.

[0008] In one embodiment of the present invention, a stable die bonding device is provided, wherein the transfer member includes a slider, and the displacement element of the transfer member is disposed on the movement guide via the slider.

[0009] In one embodiment of the present invention, a stable die bonding device is provided, wherein the chip holding component is a vacuum nozzle.

[0010] In one embodiment of the present invention, a stable die bonding device is provided, wherein the chip holding component is a clamp.

[0011] In one embodiment of the present invention, a stable crystal-fixing device is provided, wherein the buffer is a hollow elastic body, the end of the displacement element is connected to the outer surface of the buffer along the predetermined crystal-fixing direction, the telescopic abutment assembly is disposed in the internal space of the buffer so that the pressure stator is connected to the inner surface of the buffer and rigidly coupled to the displacement element, and the pressure stator is connected to the inner edge surface of the buffer in such a way that it corresponds to the end of the displacement element in position.

[0012] In one embodiment of the present invention, a stable crystal bonding device is provided, wherein the buffer is an elastic body with an opening, and the opening of the buffer faces the pressure stator so that the end of the pressure stator is connected to the opening of the buffer along the predetermined crystal bonding direction.

[0013] In one embodiment of the present invention, a stable die bonding device is provided, wherein the buffer has two buffer fixing members and a buffer connecting member, one of the buffer fixing members is connected to the end of the pressure stator, the other buffer fixing member is connected to the chip holding assembly, and the buffer connecting member is connected between the two buffer fixing members.

[0014] The following technical effects are achieved through the technical means employed in the stable die-bonding apparatus of the present invention. The buffer member undergoes shape change or compression deformation by tilting and oscillating relative to a predetermined die-bonding direction, thereby absorbing die-bonding deviations caused by low assembly accuracy or quality of the moving guide member, or by the reaction force during the pressure application process. Furthermore, the present invention can apply pressure to the chip by displacing the pressure-applying mover of the flexible connection member relative to the pressure-applying stator along the predetermined die-bonding direction, thereby bonding the chip to the substrate. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a stabilizing die-bonding device according to an embodiment of the present invention.

[0016] Figure 2 This is a schematic diagram of the die bonding device used in an embodiment of the present invention.

[0017] Figure 2A This is a schematic diagram of a stabilizing die-bonding device with a first-type buffer element according to an embodiment of the present invention.

[0018] Figure 2B This is a schematic diagram of a stabilizing die-bonding device with a second type of buffer element according to an embodiment of the present invention.

[0019] Figure 2C This is a schematic diagram of a stabilizing die-bonding device with a third type of buffer element according to an embodiment of the present invention.

[0020] Figure 3 This is another schematic diagram of the stable die-bonding device according to an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of a stable die-bonding apparatus according to another embodiment of the present invention.

[0022] Figure 5 This is another schematic diagram of a stable die-bonding apparatus according to another embodiment of the present invention.

[0023] Figure Labels

[0024] 100 Stabilized Die Bonding Device

[0025] 100A Stabilized Die Bonding Device

[0026] 100X Stabilized Die Bonding Device

[0027] 100Y Stabilized Die Bonding Device

[0028] 100Z Stabilized Die Bonding Device

[0029] 1 Transfer components

[0030] 11 Displacement stator

[0031] 12-bit mover

[0032] 13 Sliding parts

[0033] 2 Flexible connection components

[0034] 2A Flexible connection member

[0035] 21. Buffer

[0036] 21X buffer

[0037] 21Y buffer

[0038] 21Z buffer

[0039] 211Y Buffer Fixture

[0040] 211Z Buffer Fixture

[0041] 212Y Buffer Connector

[0042] 212Z Buffer Connector

[0043] 22 Telescopic abutment assembly

[0044] 22A Telescopic Abutment Assembly

[0045] 221 Pressurized stator

[0046] 221A Pressurized Stator

[0047] 222 Pressurized mover

[0048] 222A Pressurized Motor

[0049] 3. Chip holding components

[0050] 31. Fixed End

[0051] C chip

[0052] R Moving guide

[0053] S substrate

[0054] W - Predetermined crystal placement direction Detailed Implementation

[0055] The following is based on Figures 1 to 5 This description illustrates one embodiment of the present invention. It is not intended to limit the scope of the invention, but rather to provide one possible embodiment.

[0056] like Figures 1 to 3As shown, a die-bonding device 100 according to an embodiment of the present invention includes: a transfer member 1, a flexible connection member 2, and a die-holding assembly 3. Therefore, the present invention can apply a pushing force to the die C by driving the die-holding assembly 3 through the flexible connection member 2, and during the application of the pushing force, the flexible connection member 2 undergoes shape changes and displacement to compensate for deviations caused by track accuracy and mass. Furthermore, to highlight that the moving guide member R is tilted at an angle relative to the predetermined die-bonding direction W due to assembly accuracy and track mass, it is schematically shown in the accompanying drawings disclosed in the present invention.

[0057] like Figures 1 to 3 As shown, the transfer member 1 has a displacement stator 11 and a position mover 12. The position mover 12 is disposed on the movement guide R and moves telescopically relative to the displacement stator 11 in a predetermined crystal placement direction W to transfer the chip C to the substrate S.

[0058] In detail, such as Figures 1 to 3 As shown, a stabilizing die-bonding apparatus according to an embodiment of the present invention includes a transfer member 1 comprising a slider 13. A displacement element 12 of the transfer member 1 is disposed on the moving guide member R via the slider 13. For example, the slider 13 disclosed in the present invention can be a sliding block, and the moving guide member R can be a slide rail, so that the slider 13 performs linear displacement movement on the moving guide member R. Of course, the present invention is not limited to this in specific implementations; the slider 13 can also perform linear displacement movement on the moving guide member R by: using a ball bushing to engage with a shaft; using a linear bushing to engage with a shaft; or using crossed rollers to engage with a guide rail.

[0059] like Figures 1 to 3 As shown, the flexible connection member 2 is connected to the end of the displacement element 12 of the transfer member 1, so as to cooperate with the displacement element 12 to transfer the chip C to a die-bonding position adjacent to the substrate S along the predetermined die-bonding direction W. The die-bonding position adjacent to the substrate S means that the chip C contacts the substrate S, or the chip C maintains a predetermined distance (e.g., 1 μm to 3 μm) from the substrate S. Furthermore, the flexible connection member 2 has a buffer member 21 and a telescopic abutment assembly 22.

[0060] like Figures 1 to 3 As shown, the end of the position mover 12 is rigidly connected to the pressure stator 221 of the telescopic abutment assembly 22 along the predetermined crystal placement direction W. The pressure stator 221 is connected to the buffer member 21, and the pressure stator 221 is flexibly connected to the pressure mover 222 that moves relative to the pressure stator 221.

[0061] like Figure 1 , Figure 2 as well as Figure 3As shown, the buffer 21 is further described as a hollow elastic body. Furthermore, the buffer 21 can be a hollow body of any shape (e.g., rectangular or elliptical), and is not limited to being a hollow sphere. The end of the position mover 12 is connected to the outer surface of the buffer 21 along the predetermined crystal placement direction W.

[0062] like Figure 1 , Figure 2 as well as Figure 3 As shown, the telescopic abutment assembly 22 is disposed in the internal space of the buffer member 21, so that the pressure stator 221 is connected to the inner surface of the buffer member 21 and rigidly coupled to the position mover 12. Furthermore, the pressure stator 221 is connected to the inner edge surface of the buffer member 21 in such a way that its position corresponds to the end of the position mover 12.

[0063] The present invention is not limited to the above-described connection method between the buffer member 21 and the pressure stator 221. The connection method between the buffer member and the pressure stator can be as follows: Figure 2A As shown, in the stabilizing die-bonding device 100X, the buffer member 21X is an elastic body with an opening, and the opening of the buffer member 21X faces the pressure stator 221, so that the end of the pressure stator 221 is connected to the opening of the buffer member 21X along the predetermined die-bonding direction; as Figure 2B As shown, the stabilizing die bonding device 100Y includes a buffer member 21X comprising two buffer fixing members 211Y and a buffer connecting member 212Y. One of the buffer fixing members 211Y is connected to the end of the pressure-applying stator 221, the other buffer fixing member 211Y is connected to the chip holding assembly 3, and the buffer connecting member 212Y is connected between the two buffer fixing members 211Y; or, as shown... Figure 2C As shown, the stabilizing die bonding device 100Z includes a buffer member 21Z with two buffer fixing members 211Z and a buffer connector 212Z. One of the buffer fixing members 211Z is connected to the end of the pressure stator 221, and the other buffer fixing member 211Z is connected to the chip holding assembly 3. The buffer connector 212Z is ​​connected between the two buffer fixing members 211Z. The buffer connector 212Z has a flexible structure with a bent shape, which is processed by a CNC machining machine.

[0064] like Figures 1 to 3As shown, the chip holding assembly 3 is connected to the outer surface of the buffer 21 of the flexible connection member 2 along the predetermined die placement direction W, so that the flexible connection member 2 is positioned between the displacement element 12 of the transfer member 1 and the chip holding assembly 3. Furthermore, the pressure actuator 222 of the telescopic abutment assembly 22 is connected to the inner edge surface of the buffer 21 in a manner corresponding to the chip holding assembly 3. The chip holding assembly 3 holds the chip C with its holding end 31 facing the predetermined die placement direction W. Further, in the specific implementation of this invention, the chip surface of the chip C is adjusted to be parallel to the substrate surface of the substrate S to ensure smooth die bonding.

[0065] like Figures 1 to 3 As shown, specifically, in one embodiment of the die bonding apparatus 100 according to the present invention, the chip holding component 3 is a vacuum nozzle. Of course, the present invention is not limited to the chip holding component 3 being a vacuum nozzle; in the die bonding apparatus 100 according to the embodiments of the present invention, the chip holding component may also be a gripper.

[0066] like Figures 1 to 3 As shown, specifically, in the predetermined die placement direction W, the displacement element 12 of the transfer member 1 drives the chip holding component 3 via the flexible connection member 2 to transfer the chip C to the die bonding position adjacent to the substrate S. Specifically, as... Figure 2 As shown, when the chip C is transferred to the die-bonding position of the substrate S, the slider 13 is energized and remains fixed on the moving guide R. Furthermore, during the transfer of the chip C, the buffer 21 undergoes a shape change by tilting and oscillating relative to the predetermined die-bonding direction W, thereby absorbing the deviation caused by the moving guide R (i.e., die-bonding deviation caused by low assembly accuracy or quality of the slide rail). Additionally, the pressure stator 221 of the telescopic abutment assembly 22 is rigidly engaged with the displacement element 12, and the pressure actuator 222 undergoes angular displacement relative to the pressure stator 221. In other words, since the pressure stator 221 and the pressure mover 222 are flexibly connected (for example, there is a connection gap between the pressure stator 221 and the pressure mover 222), the pressure mover 222 will generate an angular displacement relative to the pressure stator 221 as the buffer 21 tilts and swings relative to the predetermined crystal placement direction W.

[0067] like Figures 1 to 3 As shown, the present invention absorbs the deviation caused by the moving guide R through the shape change of the buffer 21, thereby forming a flat and pressed state between the chip C and the substrate S. Then, the pressure mover 222 is displaced relative to the pressure stator 221 along the predetermined crystal placement direction W to apply pressure to the chip C, so that the chip C is pressurized and bonded to the substrate S.

[0068] like Figures 1 to 3 As shown, specifically, in the die-bonding device 100 according to an embodiment of the present invention, the telescopic abutment assembly 22 of the flexible connection member 2 is a piston-cylinder assembly. The pressure stator 221 is the cylinder of the piston-cylinder assembly and is connected to the inner edge surface of the buffer member 21 in a manner corresponding to the end of the displacement member 12. Furthermore, the pressure actuator 222 is the piston rod of the piston-cylinder assembly and is connected to the inner edge surface of the buffer member 21 in a manner corresponding to the chip holding assembly 3. That is, after the shape change of the buffer member 21 absorbs the deviation caused by the moving guide member R, the cylinder increases pressure to cause the piston rod to extend out of the cylinder along the predetermined die-bonding direction W, thereby pressurizing and bonding the chip C to the substrate S.

[0069] Of course, the configuration of the telescopic contact assembly 22 as a piston-cylinder assembly is not limited to the above. Furthermore, the pressure stator 221 may also be the piston rod of the piston-cylinder assembly, connected to the inner edge surface of the buffer member 21 in a manner corresponding to the end of the position mover 12 (not shown in the accompanying drawings). And the pressure actuator 222 is the cylinder of the piston-cylinder assembly, connected to the inner edge surface of the buffer member 21 in a manner corresponding to the chip holding assembly 3 (not shown in the accompanying drawings). In other words, after the shape change of the buffer member 21 absorbs the deviation caused by the moving guide R, the cylinder moves away from the piston rod along the predetermined crystal placement direction W, thereby pressurizing and bonding the chip C to the substrate S.

[0070] Furthermore, the embodiments of the flexible connecting member 2 of the present invention are not limited to the above description, such as... Figure 4 as well as Figure 5 As shown, in another embodiment of the present invention, the stabilizing die-bonding device 100A includes a telescopic abutment assembly 22A of the flexible connection member 2A, which is a voice coil motor. Specifically, the pressure stator 221A is the body of the voice coil motor and is connected to the inner edge surface of the buffer member 21 in a manner corresponding to the end of the displacement member 12. Furthermore, the pressure actuator 222A is the protrusion of the voice coil motor and is connected to the inner edge surface of the buffer member 21 in a manner corresponding to the chip holding assembly 3. In other words, after the shape change of the buffer member 21 absorbs the deviation caused by the moving guide member R, the voice coil motor increases the current to cause the protrusion to extend out of the body along the predetermined die-bonding direction W, thereby pressurizing and bonding the chip C to the substrate S.

[0071] Of course, the configuration of the telescopic contact assembly 22A as a voice coil motor is not limited to the above. Specifically, the pressure stator 221A may also be a protrusion of the voice coil motor connected to the inner edge surface of the buffer 21 in a manner corresponding to the end of the position mover 12 (not shown in the accompanying drawings). Furthermore, the pressure actuator 222A is the body of the voice coil motor connected to the inner edge surface of the buffer 21 in a manner corresponding to the chip holding assembly 3 (not shown in the accompanying drawings). In other words, after the shape change of the buffer 21 absorbs the deviation caused by the moving guide R, the body moves away from the protrusion along the predetermined crystal placement direction W, thereby pressurizing and bonding the chip C to the substrate S.

[0072] In other words, the technical means adopted in this invention is to provide a stable die bonding device 100, comprising: a transfer member 1 having a displacement stator 11 and a position mover 12, the position mover 12 being disposed on a moving guide R and telescopically moving relative to the displacement stator 11 in a predetermined die bonding direction W to transfer the chip C toward the substrate S; flexible connecting members 2 and 2A, connected to the ends of the position mover 12 of the transfer member 1, to cooperate with the position mover 12 to transfer the chip C to a die bonding position adjacent to the substrate S along the predetermined die bonding direction W, the flexible connecting members 2 and 2A having a buffer 21 and telescopic abutment groups 22 and 22A. The buffer 21 is a hollow elastic body. The end of the position mover 12 is connected to the outer surface of the buffer 21 along the predetermined crystal placement direction W. The telescopic abutment assemblies 22 and 22A are disposed in the internal space of the buffer 21 and have pressure stators 221 and 221A and pressure movers 222 and 222A that move relative to the pressure stators 221 and 221A in a flexible connection. The pressure stators 221 and 221A are connected to the inner edge surface of the buffer 21 in a manner corresponding to the end of the position mover 12 in position and are rigidly connected to the position mover 12. The chip holding assembly 3 is also located along the predetermined crystal placement direction. W is connected to the outer surface of the buffer 21 of the flexible connection members 2 and 2A, so that the flexible connection members 2 and 2A are positioned between the displacement element 12 of the transfer member 1 and the chip holding assembly 3. The pressure actuators 222 and 222A of the telescopic abutment groups 22 and 22A are connected to the inner edge surface of the buffer 21 in a manner corresponding to the chip holding assembly 3. The chip holding assembly 3 holds the chip C with its holding end 31 facing the predetermined crystal placement direction W. In the predetermined crystal placement direction W, the displacement element 12 of the transfer member 1 drives the chip holding assembly via the flexible connection members 2 and 2A. 3. To transfer the chip C to the die-bonding position adjacent to the substrate S, during the transfer of the chip C, the buffer 21 changes shape by tilting and swinging relative to the predetermined die-bonding direction W to absorb the deviation caused by the moving guide R. The pressure movers 222 and 222A of the telescopic abutment group 22 and 22A change shape with the buffer 21 and move relative to the pressure stators 221 and 221A. The pressure movers 222 and 222A move relative to the pressure stator 221 along the predetermined die-bonding direction W and apply pressure to the chip C so that the chip C is pressure bonded to the substrate S.

[0073] As described above, the stabilizing die-bonding device 100 of this embodiment of the invention absorbs the deviation caused by the moving guide member R by causing the buffer member 21 of the flexible connection member 2 to tilt and swing relative to the predetermined die-bonding direction W, thereby absorbing the reaction force of the die-bonding pressure process through the compressive deformation of the buffer member 21. Furthermore, the invention allows the pressure actuator 222 of the telescopic abutment assembly 22 of the flexible connection member 2 to generate an angular displacement relative to the pressure stator 221. Therefore, the invention can apply pressure to the chip C by displacing the pressure actuator 222 of the flexible connection member 2 along the predetermined die-bonding direction W relative to the pressure stator 221, thereby die-bonding the chip C to the substrate S.

[0074] The above description and explanation are merely illustrative of preferred embodiments of the present invention. Those skilled in the art can make other modifications based on the protection scope defined above and the above description, but these modifications should still be within the inventive spirit of the present invention and within the protection scope of the present invention.

[0075] In this specification, the invention has been described with reference to specific embodiments thereof. However, it will be apparent that various modifications and variations can be made without departing from the spirit and scope of the invention. Therefore, the specification and drawings should be considered illustrative rather than restrictive.

Claims

1. A stable die-bonding device, characterized in that, The aforementioned stabilizing die-bonding device comprises: A transfer member has a displacement stator and a position mover, the position mover being disposed on a movement guide and being telescopically moved relative to the displacement stator in a predetermined crystal placement direction to transfer the chip toward the substrate. A flexible connection member is connected to the end of the displacement element of the transfer member to cooperate with the displacement element to transfer the chip to a die-bonding position adjacent to the substrate along the predetermined die-setting direction. The flexible connection member has a buffer and a telescopic abutment assembly. The end of the displacement element is rigidly connected to the pressure stator of the telescopic abutment assembly along the predetermined die-setting direction. The pressure stator is connected to the buffer and is flexibly connected to a pressure mover that moves relative to the pressure stator. as well as, A chip holding assembly is connected to the outer surface of the buffer of the flexible connection member along the predetermined die placement direction, such that the flexible connection member is positioned between the displacement element of the transfer member and the chip holding assembly. The pressure actuator of the telescopic abutment assembly is connected to the inner edge surface of the buffer in a manner corresponding to the chip holding assembly in position. The chip holding assembly holds the chip with its holding end facing the predetermined die placement direction. In the predetermined die placement direction, the displacement element of the transfer member drives the chip holding assembly via the flexible connection member to transfer the chip to a die bonding position adjacent to the substrate. During the transfer of the chip, the buffer changes shape by tilting and oscillating relative to the predetermined crystal placement direction to absorb the deviation caused by the moving guide. The pressure mover of the telescopic abutment assembly displaces angularly relative to the pressure stator as the shape of the buffer changes, and the pressure mover displaces relative to the pressure stator along the predetermined crystal placement direction to apply pressure to the chip so that the chip is pressure bonded to the substrate.

2. The stabilizing and solidifying device according to claim 1, characterized in that, The flexible connection member's telescopic contact assembly is a piston-cylinder assembly. The pressure stator is the cylinder body of the piston-cylinder assembly, connected to the inner edge surface of the buffer in a manner corresponding to the end of the displacement actuator. The pressure mover is the piston rod of the piston-cylinder assembly, connected to the inner edge surface of the buffer in a manner corresponding to the chip holding assembly. After the shape change of the buffer absorbs the deviation caused by the moving guide, the cylinder body increases pressure to cause the piston rod to extend out of the cylinder body along the predetermined crystal placement direction, thereby pressurizing and bonding the chip to the substrate.

3. The stabilizing and solidifying device according to claim 1, characterized in that, The flexible connection member's telescopic contact assembly is a voice coil motor. The pressure stator is the body of the voice coil motor and is connected to the inner edge surface of the buffer in a manner corresponding to the end of the displacement actuator. The pressure mover is the protrusion of the voice coil motor and is connected to the inner edge surface of the buffer in a manner corresponding to the chip holding assembly. After the shape change of the buffer absorbs the deviation caused by the moving guide, the voice coil motor increases the current to make the protrusion extend out of the body along the predetermined crystal placement direction, thereby pressurizing and bonding the chip to the substrate.

4. The stabilizing and bonding apparatus according to claim 1, characterized in that, The transfer member includes a slider, wherein the displacement element of the transfer member is disposed on the moving guide member via the slider.

5. The stabilizing and solidifying device according to claim 1, characterized in that, The chip holding component is a vacuum nozzle.

6. The stabilizing and solidifying device according to claim 1, characterized in that, The chip holding component is a gripper.

7. The stabilizing and bonding apparatus according to claim 1, characterized in that, The buffer is a hollow elastic body. The end of the displacement actuator is connected to the outer surface of the buffer along the predetermined crystal orientation. The telescopic abutment assembly is disposed in the internal space of the buffer so that the pressure stator is connected to the inner surface of the buffer and rigidly coupled to the displacement actuator. The pressure stator is connected to the inner edge surface of the buffer in a manner corresponding to the end of the displacement actuator in position.

8. The stabilizing die-bonding apparatus according to claim 1, characterized in that, The buffer is an elastic body with an opening, and the opening of the buffer faces the pressure stator so that the end of the pressure stator is connected to the opening of the buffer along the predetermined crystal placement direction.

9. The stabilizing and bonding apparatus according to claim 1, characterized in that, The buffer component has two buffer fixing components and one buffer connecting component. One of the buffer fixing components is connected to the end of the pressure stator, the other buffer fixing component is connected to the chip holding assembly, and the buffer connecting component is connected between the two buffer fixing components.

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