A dual-path laser-assisted processing system

Abstract

The present invention provides a dual-path laser-assisted processing system, comprising: a tool, a first laser emitting device and a second laser emitting device, wherein the first laser emitting device can emit laser to the processing surface of a workpiece and form a first irradiation area, and the second laser emitting device can emit laser to the processing surface of the workpiece and form a second irradiation area, the first irradiation area and the second irradiation area have an overlapping area, the processing point of the tool on the processing surface falls within the overlapping area, and the angle between the projection of the first laser emitting device and the tool connecting line on the processing surface and the projection of the second laser emitting device and the tool connecting line on the processing surface is not 0°. The dual-path laser-assisted processing system disclosed by the present invention, by setting two laser generating devices, makes the two laser irradiation areas overlap and complement each other, greatly reduces the blind area, realizes the softening of the area to be processed, and completes the high-precision processing of hard and brittle materials.

Description

Technical Field

[0001] The present invention relates to the technical field of machining, and in particular to a dual-path laser-assisted machining system. Background Art

[0002] Hard and brittle materials such as cemented carbide have extremely broad application prospects in aerospace, space technology, medicine, precision manufacturing and other fields due to their low density, high strength, high temperature resistance, wear resistance and other excellent properties. Key components made of these materials have a longer service life and application characteristics compared to traditional materials due to their excellent mechanical properties.

[0003] Hard and brittle materials must be processed by precision machining to achieve high dimensional and shape accuracy requirements. Due to their high hardness, brittleness and low fracture toughness, they are very difficult to process during precision machining. Laser-assisted cutting uses high-energy laser beams to heat and generate local high temperatures to soften the workpiece material in the area to be processed, reduce the hardness of the material, and increase its plasticity, thereby improving the cutting performance of the material.

[0004] However, the auxiliary laser is blocked by the tool, forming a blind spot on the side of the tool far away from the laser light source. The part in the blind spot cannot be heated and softened by the laser. During high-precision and complex machining, the tool has flexible movement direction and changeable movement trajectory. The blind spot that cannot be irradiated by the laser will affect the tool's processing of the workpiece. Summary of the invention

[0005] The present invention provides a dual-path laser-assisted processing system to solve the above-mentioned problem.

[0006] A dual-path laser-assisted processing system comprises: a tool, a first laser emitting device and a second laser emitting device, wherein the first laser emitting device is capable of emitting laser light to a processing surface of a workpiece and forming a first irradiation area, and the second laser emitting device is capable of emitting laser light to a processing surface of the workpiece and forming a second irradiation area, wherein the first irradiation area and the second irradiation area have an overlapping area, wherein a processing point of the tool on the processing surface falls within the overlapping area, and an angle between a projection of a line connecting the first laser emitting device and the tool on the processing surface and a projection of a line connecting the second laser emitting device and the tool on the processing surface is not 0°.

[0007] Furthermore, the first laser emitting device and the second laser emitting device are respectively arranged on both sides of the tool, and the first laser emitting device, the second laser emitting device and the tool axis are coplanar.

[0008] Furthermore, the first laser emitting device and the second laser emitting device are installed at different heights. Assume that the position of the first laser emitting device is point p1, the position of the second laser emitting device is point p2, the center of the tool is point o, the radius of the tool is r, the distance between the first laser emitting device and the second laser emitting device is l, l1 is the distance between point p1 and point o, l2 is the distance between point p2 and point o, angle c is the angle of p1op2, h1 is the distance from p1 to the processing surface, h2 is the distance from p2 to the processing surface,

[0009]

[0010]

[0011]

[0012]

[0013] When c <= (pi-(c1+c2)),

[0014]

[0015] Among them, pi is π, and a is the maximum blind area.

[0016] Furthermore, the first laser emitting device and the second laser emitting device are installed at different heights. Assume that the position of the first laser emitting device is point p1, the position of the second laser emitting device is point p2, the center of the tool is point o, the radius of the tool is r, the distance between the first laser emitting device and the second laser emitting device is l, l1 is the distance between point p1 and point o, l2 is the distance between point p2 and point o, angle c is the angle of p1op2, h1 is the distance from p1 to the processing surface, h2 is the distance from p2 to the processing surface,

[0017]

[0018]

[0019]

[0020]

[0021] When c>(pi-(c1+c2)),

[0022]

[0023] and

[0024]

[0025] Among them, pi is π, and a is the maximum blind area.

[0026] Furthermore, the laser emitted by the first laser emitting device is used to heat the workpiece, and the laser emitted by the second laser emitting device is used to heat treat the surface of the workpiece.

[0027] Furthermore, the first laser emitting device is used to detect the wear amount of the tool.

[0028] Furthermore, the first laser emitting device is used to trim the tool.

[0029] The invention discloses a dual-path laser-assisted processing system, which sets two laser generating devices so that two laser irradiation areas overlap and complement each other, greatly reduces the blind area, realizes softening of the processing area, and completes high-precision processing of hard and brittle materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 This is a schematic diagram of the structure of a dual-path laser-assisted processing system disclosed in Example 1 of the present invention;

[0032] Figure 2 This is a schematic diagram of the laser irradiation range of a dual-path laser-assisted processing system disclosed in Example 1 of the present invention;

[0033] Figure 3 This is a schematic diagram of a processing state of a dual-path laser-assisted processing system disclosed in Embodiment 1 of the present invention;

[0034] Figure 4 This is a schematic diagram of the processing status of a dual-path laser-assisted processing system disclosed in Example 2 of the present invention.

[0035] In the figure: 1. tool; 2. first laser emitting device; 3. second laser emitting device; 4. first irradiation area; 5. second irradiation area; 6. slide; 7. first optical path; 8. second optical path; 9. detection optical path. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] like Figure 1-3 As shown, a dual-path laser-assisted processing system includes: a tool 1, a first laser emitting device 2 and a second laser emitting device 3, wherein the first laser emitting device 2 can emit laser to the processing surface of a workpiece and form a first irradiation area 4, and the second laser emitting device 3 can emit laser to the processing surface of the workpiece and form a second irradiation area 5, the first irradiation area 4 and the second irradiation area 5 have an overlapping area, the processing point of the tool 1 on the workpiece falls within the overlapping area, and the angle between the projection of the line connecting the first laser emitting device 2 and the tool 1 on the processing surface and the projection of the line connecting the second laser emitting device 3 and the tool 1 on the processing surface is not 0°.

[0038] The laser irradiation position is controlled by the machine tool control system so that the laser irradiates the workpiece area to be processed. Before tool processing, the temperature of the workpiece area to be processed is increased and softened by laser irradiation. In this embodiment, two laser emitting devices are provided, namely, a first laser emitting device 2 and a second laser emitting device 3. The connecting line between the first laser emitting device 2 and the tool 1 is the connecting line between the laser emitting point of the first laser emitting device 2 and the tool tip of the tool 1. The connecting line between the second laser emitting device 3 and the tool 1 is the connecting line between the laser emitting point of the second laser emitting device 2 and the tool tip of the tool 1. The processing surface is the surface of the workpiece to be processed. The projections of the two connecting lines on the processing surface are still two straight lines, and the angle between the two straight lines is not 0°. The laser emitting device has a blind area that cannot be irradiated on the side of the tool away from the laser emitting device. The angle between the projections of the two connecting lines is not 0°, and the blind areas that cannot be irradiated by the two laser emitting devices are different. When the tool is processing the workpiece, if the next processing point is located in the blind area of ​​one laser emitting device, the processing point can be heated by another laser emitting device, so that the temperature of the area to be processed where the next processing point is located is increased and softened, and the processing continues.

[0039] In this embodiment, the first laser emitting device 2 and the second laser emitting device 3 are both installed on the slide 6, and move using the machine tool coordinate system. At the same time, they are controlled by the machine tool numerical control system, and the laser emitting angle can be changed.

[0040] Furthermore, the first laser emitting device 2 and the second laser emitting device 3 are respectively arranged on both sides of the tool 1 , and the first laser emitting device 2 , the second laser emitting device 3 and the axis of the tool 1 are coplanar.

[0041] The laser emitting device moves with the machine tool coordinate system, and its relative position with the tool is fixed. When the first laser emitting device 2, the second laser emitting device 3 and the axis of the tool 1 are coplanar, the projection of the first laser emitting device 2 on the processing surface, the projection of the second laser emitting device 3 on the processing surface and the projection of the tool 1 on the processing surface are colinear. When the height of the first laser emitting device and the second laser emitting device from the processing surface is equal, the blind area of ​​the first laser emitting device 2 can be compensated by the second laser emitting device 3 to the greatest extent, such as Figure 2 As shown, the first irradiation area 4 and the second irradiation area 5 both form blind areas represented by shadows on the side of the tool 1 away from the laser emitting device, and the blind areas generated by the two laser emitting devices can be covered by the other laser emitting device.

[0042] Furthermore, in order to adapt to different structures of different machine tools, the first laser emitting device 2 and the second laser emitting device 3 are installed at different heights.

[0043] Assume that the position of the first laser emitting device (2) is point p1, the position of the second laser emitting device (3) is point p2, the center of the tool circle is point o, the radius of the tool is r, the distance between the first laser emitting device (2) and the second laser emitting device (3) is l, l1 is the distance between point p1 and point o, l2 is the distance between point p2 and point o, angle c is the angle of p1op2, h1 is the distance from p1 to the processing surface, h2 is the distance from p2 to the processing surface,

[0044]

[0045]

[0046]

[0047]

[0048] When c <= (pi-(c1+c2)), the blind area exists only on one side of the tool. The conditions that need to be met at this time are:

[0049]

[0050] Among them, pi is π, a is the maximum blind area, and h1 and h2 are both greater than 0.

[0051] The maximum blind area is the maximum area not irradiated by the laser when the tool can work normally during the machine tool processing. When the blind area is smaller than the maximum blind area, the machine tool can work normally.

[0052] When c>(pi-(c1+c2)), the blind area exists on both sides of the tool. The conditions that need to be met at this time are:

[0053]

[0054] and

[0055]

[0056] Among them, pi is π, a is the maximum blind area, and h1 and h2 are both greater than 0.

[0057] The maximum blind area is the maximum area not irradiated by the laser when the tool can work normally during the machine tool processing. When the blind area is smaller than the maximum blind area, the machine tool can work normally.

[0058] like Figure 3 As shown, this embodiment also discloses a milling machine with dual-path laser-assisted processing, wherein the tool 1 is a milling cutter, the laser emitted by the first laser emitting device 2 irradiates the workpiece to be processed along the first optical path 7 for heating the workpiece, and the laser emitted by the second laser emitting device 3 irradiates the processed area along the second optical path 8 for heat treatment of the workpiece surface. When the tool moves to the blind area of ​​the first laser emitting device 2, the second laser emitting device 3 irradiates the area to be processed for heating.

[0059] The first laser emitting device 2 may also be a laser measuring device or a laser trimming device. When the first laser emitting device 2 is a laser measuring device, it can be used to detect the wear of the tool 1; when the first laser emitting device 2 is a laser trimming device, it can be used to trim the tool 1. A third laser emitting device may also be provided to detect the wear of the tool 1 or trim the tool 1.

[0060] Example 2

[0061] like Figure 4 As shown, the difference between this embodiment and embodiment 1 is that this embodiment discloses a lathe with dual-path laser assisted processing, the laser emitted by the first laser emitting device irradiates the area to be processed of the workpiece along the optical path 7 for heating the workpiece, and the laser emitted by the second laser emitting device 3 irradiates the processed area along the second optical path 8 for heat treatment of the workpiece surface. The first laser emitting device can also use a laser measuring device to detect the wear amount of the tool 1.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dual-path laser-assisted processing system, characterized in that: include: A tool (1), a first laser emitting device (2) and a second laser emitting device (3), wherein the first laser emitting device (2) is capable of emitting laser light to a processing surface of a workpiece and forming a first irradiation area (4), and the second laser emitting device (3) is capable of emitting laser light to a processing surface of the workpiece and forming a second irradiation area (5), the first irradiation area (4) and the second irradiation area (5) have an overlapping area, a processing point of the tool (1) on the processing surface falls within the overlapping area, and an angle between a projection of a line connecting the first laser emitting device (2) and the tool (1) on the processing surface and a projection of a line connecting the second laser emitting device (3) and the tool (1) on the processing surface is not 0°, The first laser emitting device (2) and the second laser emitting device (3) are installed at different heights. The position of the first laser emitting device (2) is assumed to be point p1, the position of the second laser emitting device (3) is assumed to be point p2, the center of the tool circle is point o, the radius of the tool is r, the distance between the first laser emitting device (2) and the second laser emitting device (3) is l, l1 is the distance between point p1 and point o, l2 is the distance between point p2 and point o, angle c is the angle of p1op2, h1 is the distance from p1 to the processing surface, h2 is the distance from p2 to the processing surface, When c <= (pi-(c1+c2)), Among them, pi is π, and a is the maximum blind area.

2. A dual-path laser-assisted processing system according to claim 1, characterized in that: The first laser emitting device (2) and the second laser emitting device (3) are respectively arranged on both sides of the tool (1), and the first laser emitting device (2), the second laser emitting device (3) and the axis of the tool (1) are coplanar.

3. A dual-path laser-assisted processing system according to claim 1, characterized in that: When c>(pi-(c1+c2)), and Among them, pi is π, and a is the maximum blind area.

4. A dual-path laser-assisted processing system according to claim 1, characterized in that: The laser light emitted by the first laser emitting device (2) is used to heat the workpiece, and the laser light emitted by the second laser emitting device (3) is used to heat treat the surface of the workpiece.

5. A dual-path laser-assisted processing system according to claim 1, characterized in that: The first laser emitting device (2) is used to detect the wear amount of the tool (1).

6. A dual-path laser-assisted processing system according to claim 1, characterized in that: The first laser emitting device (2) is used for trimming the tool (1).

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