Periscopic continuous light variation module and corresponding multi-camera module

Abstract

The present application relates to a periscopic continuous light variable module, comprising: a fixed optical assembly comprising a reflecting element, the incident light side and the outgoing light side of the reflecting element having a first optical axis and a second optical axis perpendicular to each other respectively; a first moving optical assembly comprising at least two first lenses and a first driver driving the first lenses to translate along the second optical axis; a second moving optical assembly comprising at least two second lenses and a second driver driving the second lenses to translate along the second optical axis, the second moving optical assembly being located at the rear end of the first moving optical assembly; and a photosensitive assembly comprising a base, a circuit board, a photosensitive chip and a third driver, the third driver being located between the photosensitive chip and the base, the third driver being used to drive the photosensitive chip to move in at least one direction. The present application also provides a corresponding multi-camera module. The present application can realize optical anti-shake of the periscopic continuous light variable module at a small space cost.

Description

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202010356453.3, filed on April 29, 2020, entitled "Periscope Continuous Optical Variation Module and Corresponding Multi-Camera Module", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of camera module technology, and more specifically, to a periscope continuous optical zoom module and a corresponding multi-camera module. Background Technology

[0004] With the widespread adoption of mobile electronic devices, the technology behind camera modules used in these devices to help users capture images (such as videos or photos) has developed rapidly. In recent years, camera modules have been widely used in numerous fields, including medical, security, and industrial production. Currently, in the consumer electronics field (such as mobile phones), optical image stabilization (OIS) has become a common feature of camera modules. When electronic devices (such as smartphones) take pictures, shaking is inevitable due to various reasons. For example, when shooting with a smartphone, the photographer often finds it difficult to hold the phone steady for an extended period, and button presses during shooting can also cause instability. These situations all lead to image shake in the viewfinder, affecting the image quality of the camera module. Currently, optical image stabilization is usually achieved through optical image stabilizers (OIS). In existing technology, camera modules with optical image stabilization typically incorporate an OIS within the optical lens. Specifically, in order to improve the imaging quality of camera modules, most current solutions involve equipping the lens with a voice coil motor. The voice coil motor drives the movement of the lens, corrects lens shake, and effectively improves image quality.

[0005] On the other hand, with rising living standards, consumers have increasingly higher demands for the camera functions of mobile phones, tablets, and other terminal devices. They not only require effects such as background blur and night shooting, but also demand telephoto capabilities, needing devices that can clearly capture distant scenes. To achieve shooting at different distances, current terminal devices on the market use an array module consisting of a wide-angle lens and a telephoto lens to achieve zoom shooting. However, since these lenses are usually fixed-focus lenses, their focal length cannot be adjusted. Digital zoom is achieved only by using algorithms such as interpolation to capture images from the image sensor, resulting in poor image quality. Even though some terminal devices use lenses with AF (Auto Focus) functions to automatically focus and improve shooting effects, focusing usually only optimizes the image captured by the lens and still cannot adjust the focal length of the optical system, failing to meet consumers' zoom shooting needs. Continuous optical zoom (COZ), on the other hand, changes the focal length of the lens by altering the distance between the optical elements to achieve zoom. It can capture distant objects more clearly, and the image quality is relatively high. Continuous optical zoom modules generally consist of at least two lens groups, and at least one of the lens groups has a certain amount of space to move. Therefore, optical zoom modules generally have a large axial dimension (i.e., the dimension in the optical axis direction). This results in traditional configuration continuous optical zoom camera modules having an excessively large height, making it difficult to install them in smart electronic terminal devices such as mobile phones and tablets.

[0006] To address the aforementioned issues, periscope modules can be used to reduce the height of continuous optical zoom modules. However, in such periscope modules, at least one lens group still requires a certain amount of space to move along its optical axis, resulting in a relatively large module size. Therefore, periscope modules currently available for smart electronic devices are often fixed-focus modules. However, in smart electronic devices, periscope modules are often used as telephoto lenses with telephoto capabilities. In telephoto scenarios, camera shake has a more significant impact on the captured image, making the demand for optical image stabilization in telephoto scenarios even stronger.

[0007] How to achieve optical image stabilization in a periscope continuous optical zoom module with minimal space consumption is a major challenge that urgently needs to be solved. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide an optical image stabilization solution for a miniaturized periscope continuous optical zoom module.

[0009] To address the aforementioned technical problems, this invention provides a periscope-type continuous optical scaling module, comprising: a fixed optical component including a reflective element, wherein the incident light side and the outgoing light side of the reflective element have mutually perpendicular first and second optical axes, respectively; a first movable optical component including at least two first lenses and a first driver for driving the at least two first lenses to translate along the second optical axis, the first movable optical component being located at the rear end of the fixed optical component; a second movable optical component including at least two second lenses and a second driver for driving the at least two second lenses to translate along the second optical axis, the second movable optical component being located at the rear end of the first movable optical component; and a photosensitive component including a base, a circuit board, a photosensitive chip, and a third driver, the third driver being located between the photosensitive chip and the base, the third driver being used to drive the photosensitive chip to move in at least one direction, wherein the at least one direction is at least one of the translational direction of the X-axis, Y-axis, and Z-axis, and the rotational direction around the X-axis, Y-axis, and Z-axis, wherein the X-axis is parallel to the second optical axis, the Z-axis is parallel to the first optical axis, and the Y-axis is perpendicular to both the X-axis and the Z-axis.

[0010] The back of the photosensitive chip is mounted on the circuit board, the third driver is located between the circuit board and the base, and the third driver is adapted to drive the assembly of the circuit board and the photosensitive chip to move in at least one direction.

[0011] The photosensitive chip has a central mounting base fabricated using semiconductor technology mounted on its back side. A third driver is located between the central mounting base and the base. The third driver is adapted to drive the assembly of the central mounting base and the photosensitive chip to move in at least one direction. The circuit board is mounted on the back side of the base.

[0012] The third driver is used to drive the photosensitive chip to move in at least one direction to compensate for the tilt relative to the second optical axis formed by the at least two first lenses and / or the at least two second lenses during zoom movement.

[0013] The reflective element is a reflective prism, which has an incident surface and an exit surface. The fixed optical assembly further includes a first fixed lens mounted on the incident surface and / or a second fixed lens mounted on the exit surface.

[0014] The fixed optical assembly further includes a fixed lens group disposed at the rear end of the reflective element. The fixed lens group is separate from the reflective element, and the reflective element can rotate around the Z-axis and / or Y-axis under the drive of the reflective element driver.

[0015] Wherein, the first moving optical component is a zoom optical component, which is adapted to move along the X-axis to change the effective focal length of the periscope optical zoom lens; the second moving optical component is a compensation optical component, which is adapted to move along the X-axis to focus the optical system of the periscope optical zoom module during zooming, thereby reducing the movement of the image plane of the optical system in the X-axis direction caused by the movement of the zoom optical component.

[0016] The back of the photosensitive chip is mounted on the circuit board, and the third driver is located between the circuit board and the base. The base includes a base plate and an annular support portion extending upward from the periphery of the base plate, the support portion surrounding the circuit board.

[0017] The third driver includes multiple sub-drive modules installed between the bottom surface of the circuit board and the base. Each sub-drive module is adapted to drive the circuit board to move up and down relative to the base, and the direction of the up and down movement is consistent with the X-axis direction.

[0018] The circuit board bottom surface and the base have an elastic support shaft, and the plurality of sub-drive modules surround the elastic support shaft. The plurality of sub-drive modules cooperate with each other to drive the circuit board to rotate around the Y-axis and / or around the Z-axis.

[0019] The photosensitive component also includes a metal suspension wire, the top end of which is connected to the edge area of ​​the bottom surface of the circuit board, and the bottom end is connected to the base plate.

[0020] The photosensitive component further includes an elastic support member, the two ends of which are respectively connected to the inner side of the support portion and the circuit board.

[0021] The third driver includes a lateral movement drive module, which includes an SMA line and a bottom extension extending from the bottom surface of the circuit board. The two ends of the SMA line are respectively connected to the inner side of the bottom extension and the support. The SMA line can be extended or retracted under the adjustment of current, thereby driving the circuit board to move laterally relative to the base. The lateral movement includes translation along the Z-axis or translation along the Y-axis.

[0022] The third driver includes a plurality of the aforementioned lateral movement drive modules, wherein a portion of the lateral movement drive modules are adapted to drive the circuit board to translate along the Z-axis, and another portion of the lateral movement drive modules are adapted to drive the circuit board to translate along the Y-axis.

[0023] The third driver further includes a lateral movement drive module adapted to drive the circuit board to rotate around the X-axis.

[0024] When the circuit board is in the reference position, the distance between the circuit board and the support is less than or equal to 1000 μm.

[0025] Wherein, the dimension of the base in the Z-axis direction is less than or equal to the dimension of the fixed optical component in the Z-axis direction.

[0026] Wherein, the gap between the circuit board and the support in the Y-axis direction is greater than or equal to the gap between them in the Z-axis direction.

[0027] The annular support includes four sidewalls, at least one of which has a groove on its inner surface or at least one of which has a hollow structure.

[0028] The periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section. During zooming, the photosensitive chip moves along the X-axis under the drive of the third driver to make the photosensitive surface and the imaging surface aligned on the X-axis. When the zoom magnification is in the telephoto section, the circuit board is positioned on the X-axis directly opposite the groove or the hollow structure on the sidewall. Furthermore, for the telephoto section, in the Z-axis or Y-axis translation direction, the third driver is configured to drive the circuit board to move within a first movement range. For the non-telephoto section, in the Z-axis or Y-axis translation direction, the third driver is configured to drive the circuit board to move within a second movement range, where the first movement range is greater than the second movement range.

[0029] The annular support includes a top sidewall, a bottom sidewall, a front sidewall, and a rear sidewall. The top sidewall and the bottom sidewall are perpendicular to the Z-axis, and the front sidewall and the rear sidewall are perpendicular to the Y-axis. The inner surfaces of the top sidewall and the bottom sidewall have grooves, or the top sidewall and the bottom sidewall have hollow structures.

[0030] The periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section. During zooming, the photosensitive chip moves along the Z-axis under the drive of the third driver to make the photosensitive surface and the imaging surface aligned on the Z-axis. When the zoom magnification is in the telephoto section, the photosensitive chip and the circuit board are positioned directly opposite the groove or the hollow structure on the sidewall on the Z-axis. Furthermore, for the telephoto section, the third driver is configured to drive the circuit board to move within a first movement range in the Z-axis translation direction, and for the non-telephoto section, the third driver is configured to drive the circuit board to move within a second movement range in the Z-axis translation direction, wherein the first movement range is greater than the second movement range.

[0031] According to another aspect of this application, a multi-camera module is also provided, comprising: the aforementioned periscope continuous optical zoom module, and a wide-angle module, wherein the effective focal length of the periscope continuous optical zoom module is more than 4 times that of the wide-angle module, and continuous zoom can be achieved within an interval of more than 4 times the effective focal length of the wide-angle module.

[0032] According to another aspect of this application, a multi-camera module is also provided, comprising: the aforementioned periscope-type continuous optical zoom module, which can continuously zoom within an equivalent focal length range of 120–300 mm; a wide-angle fixed-focus module, whose equivalent focal length is a fixed value within a range of 20–30 mm; and a mid-focus module, whose equivalent focal length is within a range of 50–80 mm, wherein the mid-focus module is a fixed-focus module or a continuous zoom module.

[0033] Compared with the prior art, this application has at least one of the following technical effects:

[0034] 1. This application can achieve optical image stabilization of a periscope continuous optical zoom module with relatively small space requirements. 2. In some embodiments of this application, only one module, the photosensitive chip, needs to be driven to move, while keeping other modules within the optical system relatively stable, thereby preventing significant shifts in the fixed group, reflector, and moving group relative to the optical axis.

[0035] 3. In some embodiments of this application, the image stabilization effect can be improved by giving the photosensitive chip more degrees of freedom of movement (i.e., the photosensitive chip has more controlled movement directions) without adding an image stabilization driver to the movement group of the optical system.

[0036] 4. In some embodiments of this application, only one module of the photosensitive chip needs to be driven to move, and its driving logic and anti-shake mechanism are relatively simple, which can achieve better anti-shake effect.

[0037] 5. In some embodiments of this application, driving the photosensitive chip to move can compensate for the tilt caused by the moving group during zoom movement. Specifically, the moving group may tilt relative to the second optical axis during zoom movement, and driving the photosensitive chip to move can compensate for problems such as image plane tilt (the image plane forms an angle relative to the photosensitive surface) caused by this tilt.

[0038] 6. In this application, the third driver used to drive the photosensitive chip only needs to provide a small force to drive the photosensitive chip, thereby helping to reduce the size of the third driver itself, and thus reducing the volume of the periscope module.

[0039] 7. In some embodiments of this application, the height (Z direction) of the third driver can be small, so that the height of the periscope continuous optical zoom module as a telephoto module can not exceed 10 mm. In a preferred embodiment, the height of the periscope continuous optical zoom module as a telephoto module can not exceed 9 mm.

[0040] 8. In some embodiments of this application, the range of motion of the photosensitive chip can reach 50 to 500 μm on one side, that is, the position of the photosensitive chip has a large adjustable range, thus improving the image stabilization effect.

[0041] 9. In some embodiments of this application, the periscope continuous optical zoom module can provide a greater height than the fixed-focus periscope module. This height can provide more space for the image sensor to have a greater range of movement. For example, the movement stroke of the image sensor can be greater than or equal to 200μm, thereby compensating for greater amplitude of shake and improving the image stabilization effect.

[0042] 10. In some embodiments of this application, the base height h of the periscope module is less than or equal to the lens height H, which helps to reduce the thickness of the electronic device equipped with the periscope module. Attached Figure Description

[0043] Figure 1 A perspective view of a periscope continuous optical zoom camera module according to one embodiment of this application is shown;

[0044] Figure 2 This paper shows a side cross-sectional schematic diagram of a periscope continuous optical zoom camera module according to an embodiment of the present application;

[0045] Figure 3a A perspective view of the translational movement direction of the circuit board and photosensitive chip in one embodiment of this application is shown;

[0046] Figure 3b A perspective view of the rotational movement direction of the circuit board and photosensitive chip in one embodiment of this application is shown;

[0047] Figure 4aA schematic diagram showing the offset of lens imaging in the photosensitive area in one embodiment of this application is illustrated;

[0048] Figure 4b This illustrates a volumetric misalignment between the lens imaging and the photosensitive area in one embodiment of this application;

[0049] Figure 4c This diagram illustrates an embodiment of the present application in which the orientation of the image is deflected relative to the photosensitive surface;

[0050] Figure 5 A side view schematic diagram of a photosensitive component with a third driver according to one embodiment of this application is shown;

[0051] Figure 6 The diagram shows a plurality of sub-driving modules in one embodiment of the present application from a top-down perspective;

[0052] Figure 7 A side view schematic diagram of a single sub-driver module in one embodiment of this application is shown;

[0053] Figure 8 A third driver based on SMA lines is shown in another embodiment of this application;

[0054] Figure 9 A side view schematic diagram of a photosensitive component in a modified embodiment of this application is shown;

[0055] Figure 10 This illustration shows the degree of freedom of movement of the photosensitive chip in the rotational direction of a periscope continuous optical scaling module according to an embodiment of this application;

[0056] Figure 11a A side view schematic diagram of a photosensitive assembly with an elastic support member according to one embodiment of this application is shown;

[0057] Figure 11b A side view schematic diagram of a photosensitive assembly with an elastic support member according to another embodiment of this application is shown;

[0058] Figure 12 A side cross-sectional schematic diagram of a periscope-type continuous optical variable module according to another embodiment of this application is shown;

[0059] Figure 13 This shows a side cross-sectional view of a periscope-type continuous optical variable module with a groove provided in the support portion according to one embodiment of the present application;

[0060] Figure 14 This shows a side cross-sectional view of a periscope-type continuous optical zoom module with a grooved support portion in a telephoto state, according to one embodiment of this application.

[0061] Figure 15A perspective view of a base with a hollowed-out structure on the top and bottom sidewalls is shown in one embodiment of this application;

[0062] Figure 16 A perspective view of a base with a hollowed-out structure on the top and bottom sidewalls is shown in another embodiment of this application;

[0063] Figure 17 A cross-sectional schematic diagram of a photosensitive component with image stabilization function according to another embodiment of this application is shown. Detailed Implementation

[0064] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0065] It should be noted that in this specification, the terms "first," "second," etc., are used only to distinguish one feature from another and do not imply any limitation on the features. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.

[0066] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0067] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to an example or illustration.

[0068] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0069] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0070] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0071] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0072] Figure 1 A perspective view of a periscope continuous optical zoom camera module according to one embodiment of this application is shown. (Reference) Figure 1 In this embodiment, the periscope continuous optical zoom camera module includes a fixed group 100 with a reflective element, a first movable group 200 and a second movable group 300 that can move along their respective optical axes, and a photosensitive component 400 with image stabilization function. The fixed group 100 may include a reflective element 110, which may be a reflective prism. The fixed group 100 may also include a first lens 120 (or a first lens group) disposed on the light-incident surface of the reflective prism and a second lens 130 (or a second lens group) disposed on the light-outcrystal surface of the reflective prism. Figure 2 A side cross-sectional schematic diagram of a periscope continuous optical zoom camera module according to an embodiment of this application is shown. (Referring to the reference...) Figure 2 In this embodiment, the optical axis of the first lens 120 (or the first lens group) is perpendicular to the optical axis of the second lens 130 (or the second lens group). For ease of description, the optical axis of the first lens 120 (or the first lens group) is referred to as the first optical axis 121, and the optical axis of the second lens 130 (or the second lens group) is referred to as the second optical axis 131. The optical axis of the second lens 130 (or the second lens group) is substantially consistent with the optical axis direction of the first moving group 200 and the second moving group 300, that is, the second optical axis 131 can be regarded as the optical axis of the first moving group 200 and the second moving group 300. Both the first moving group 200 and the second moving group 300 can move along the second optical axis 131 to achieve continuous optical zoom. The first moving group 200 may include at least two lenses, and the second moving group 300 may include at least two lenses. The first moving group 200 and the second moving group 300 can be driven by a first driver and a second driver, respectively (these two drivers are in...). Figure 2(Not shown in the diagram) The effective focal length (EFL) of the entire zoom module is changed by moving in the same direction or in the opposite direction. In this embodiment, the EFL of the periscope continuous optical zoom module varies between 15 and 35 mm. The first driver and the second driver can be located on one side or both sides of the first moving group and the second moving group, respectively, to reduce the height of the zoom module. Specifically, the first driver and the second driver can avoid the positions of the top or bottom surfaces of the first moving group 200 and the second moving group 300, thereby avoiding increasing the height of the module in the direction of (i.e., ...) Figure 2 The dimensions (in the Z direction) are as follows. The first moving group 200, the second moving group 300, the first driver, and the second driver can all be covered by the driver housing. The fixed group can be fixed to the module housing. In this embodiment, the driver housing can be directly used as part of the module housing 500. During zooming, the first moving group 200 and the second moving group 300 can have different moving distances, and both the first moving group 200 and the second moving group 300 change position relative to the fixed group 100 (i.e., relative to the module housing 500). Further, in this embodiment, the photosensitive component 400 includes a base 410, a third driver 420, a circuit board 430, a photosensitive chip 440, a lens mount 450, and a color filter 460. The color filter 460 is mounted on the lens mount 450, and the lens mount 450 is attached to the module housing 500 (e.g., the driver housing of the first driver and the second driver). The photosensitive chip 440 can be mounted (e.g., attached to) the surface (front side) of the circuit board 430 and electrically connected to the circuit board 430 (e.g., through wire bonding). A third driver 420 is located between the circuit board 430 and the base 410. Under the action of the third driver 420, the photosensitive chip 440 can change position relative to the module housing 500 and the base 410. Specifically, the third driver 420 can drive the photosensitive chip 440 and the circuit board 430 to move parallel to the YZ plane (see reference). Figure 1 The image sensor moves on a plane, or drives the photosensitive chip to rotate around at least one of the X, Y, and Z axes, thereby achieving image stabilization in at least one direction. In this embodiment, the base 410 is used to support the third driver 420, the photosensitive chip 440, and the circuit board 430, and the bottom of the lens mount 450 can be attached to the base 410. The base 410 may include a base plate 411 and a support portion 412 (refer to reference). Figure 2 and Figure 5The base plate 411 can extend upwards to form an annular support portion 412. This support portion 412 can surround the circuit board 430 and has a certain distance from the outer surface of the circuit board 430 to allow the circuit board to translate in the YZ plane. The bottom of the mirror mount 450 can be mounted on the top surface of the support portion 412. In this embodiment, a color filter 460 can be mounted on the mirror mount 450, and in the optical path, this color filter is located between the photosensitive chip and the second moving group. (Reference) Figure 2 In this embodiment, for the entire periscope module, the module height H in the Z direction is the distance from the top of the fixed group to the bottom of the reflector, while the base height h is the distance from the top of the base to its bottom. The base height h can be less than or equal to the module height H.

[0073] Further, in one embodiment of this application, the first moving group can constitute a first moving optical component, which is a zoom optical component adapted to move along the X-axis to change the effective focal length of the periscope optical zoom lens. The second moving group can constitute a second moving optical component, which is a compensation optical component adapted to move along the X-axis to focus the optical system of the periscope optical zoom module during zooming, thereby reducing the movement of the image plane of the optical system in the X-axis direction caused by the movement of the zoom optical component. Preferably, the movement of the compensation optical component can keep the position of the image plane of the optical system substantially unchanged in the X-axis direction, that is, reduce the amount of movement of the image plane of the optical system in the X-axis direction to within a tolerable tolerance range.

[0074] Furthermore, Figure 3a A perspective view showing the translational movement direction of the circuit board and photosensitive chip in one embodiment of this application is shown. Figure 3b This is a perspective view showing the rotational movement direction of the circuit board and photosensitive chip in one embodiment of this application. (Reference) Figure 3a and Figure 3bIn one embodiment of this application, two adjacent sides of the photosensitive chip 440 are parallel to the Y-axis and Z-axis directions, respectively. The third driver can drive the photosensitive chip 440 to move in a plane parallel to the YZ plane (i.e., along the Y-axis and Z-axis directions) for image stabilization. In this embodiment, using the third driver to drive the photosensitive chip 440 for image stabilization avoids increasing the height of the optical zoom module. This is because the height and volume occupied by the photosensitive component are smaller than those of the first or second moving groups located in front of it. Therefore, without changing the module height, the photosensitive chip 440 and the circuit board in the photosensitive component have sufficient space to move for optical image stabilization. Furthermore, since the weight of the photosensitive chip 440 and the circuit board is much smaller than that of the first or second moving groups, the driving force required by the third driver can be relatively small, which also helps to reduce the volume occupied by the third driver itself. Furthermore, since both the first and second motion groups need to perform the axial movement required for optical zoom, the corresponding first and second drivers already occupy a certain amount of space. Adding drivers for optical image stabilization (e.g., drivers that move the first and second motion groups along the Y and Z axes, or drivers that rotate the first and second motion groups around the X, Y, and Z axes) to the first and second motion groups would significantly increase design complexity and size. In this embodiment, optical image stabilization is achieved by using a third driver to drive the movement of the circuit board and the photosensitive chip 440. This cleverly avoids the problem of the motion groups being difficult to drive with minimal space constraints, thus helping the periscope continuous optical zoom module achieve optical image stabilization with less space requirements.

[0075] Furthermore, still referencing Figure 3a In one embodiment of this application, the third driver can drive the photosensitive chip 440 to move in one or more of the aforementioned directions to achieve different image stabilization effects. Specifically, driving the photosensitive chip to move along the Z-axis and Y-axis can reduce the offset of the lens image in the photosensitive area. Figure 4a A schematic diagram illustrating the offset of lens imaging in the photosensitive area according to one embodiment of this application is shown. (Reference) Figure 4a The image formed by the lens 600 is significantly offset relative to the photosensitive area 441 of the image sensor 440. This offset direction has the positive Z-axis direction (i.e., Figure 4a The upward direction of the middle axis and the negative direction of the Y-axis (i.e., the upward direction of the middle axis) and Figure 4a The offset component (to the left) in the image. Here, lens imaging 600 refers to the imaging of a continuous optical zoom lens. A continuous optical zoom lens is a lens composed of a fixed group, a first moving group, and a second moving group. This will not be elaborated further below. Figure 4b This illustration shows a volumetric misalignment between the lens imaging area and the photosensitive area in one embodiment of this application. (Reference) Figure 4b The image plane of the lens imaging 600 is tilted relative to the photosensitive area 411 of the photosensitive chip 440; this phenomenon can also be called image plane tilt. In this embodiment, the third driver can drive the photosensitive chip 440 to move in the X and Y axes, thereby reducing the volumetric misalignment tilt angle between the lens imaging 600 and the photosensitive area 441. Furthermore, the third driver can also drive the photosensitive chip to move in the X and Z axes, thereby reducing the volumetric misalignment tilt angle between the lens imaging and the photosensitive area. In this embodiment, the camera module or the electronic device equipped with the camera module can detect the offset of the lens imaging in the photosensitive area and the volumetric misalignment tilt between the lens imaging and the photosensitive area, and then adjust the position of the photosensitive chip accordingly through the third driver to reduce the aforementioned offset or misalignment, thereby achieving optical image stabilization. Furthermore, in this embodiment, the third driver only needs to provide the translational driving force for the photosensitive chip and circuit board in the X, Y, and Z axes, which helps to reduce the module size.

[0076] Furthermore, in one embodiment of this application, in the periscope continuous optical zoom module, when the fixed group and two moving groups cooperate to perform continuous zoom and long-range shooting, since its effective focal length is constantly changing during the zoom process, the image obtained after imaging by the optical zoom lens mainly moves in the X direction. Driving the photosensitive chip to move along the X direction ensures that the image always falls on the photosensitive area of ​​the photosensitive chip, thereby keeping the image clear at all times.

[0077] Furthermore, in another embodiment of this application, in the periscope continuous optical scaling module, the photosensitive chip 440 in the photosensitive component can have the following characteristics: Figure 3b The degrees of freedom of movement are shown. That is, the image sensor 440 can be driven to rotate about at least one axis, such as driving the image sensor 440 to rotate about the Y-axis, driving the image sensor 440 to rotate along the X-axis, or driving the image sensor 440 to rotate about the Z-axis. The third driver drives the image sensor 440 to rotate in one or more of the above directions, which can achieve different image stabilization effects. For example, driving the image sensor to rotate about the Z-axis or Y-axis can reduce the misalignment angle between the lens image and the photosensitive area, that is, it can solve the problem of... Figure 4b The image plane tilt problem is shown. Driving the image sensor to rotate around the X-axis can reduce the plane misalignment problem between the lens imaging and the photosensitive area. Figure 4c A schematic diagram illustrating the orientation of the image relative to the photosensitive surface in one embodiment of this application is shown. (Refer to reference...) Figure 4a and Figure 4c Assuming Figure 4a The imaging orientation shown as 601 (i.e., the Z-axis direction) is the correct orientation. Figure 4cThe imaging orientation 601 shown has a surface deflection misalignment relative to the photosensitive area 441. At this time, driving the photosensitive chip 440 to rotate around the X-axis can reduce or solve the surface deflection misalignment problem between the lens imaging and the photosensitive area.

[0078] Furthermore, in other embodiments of this application, the driving direction of the third driver can be configured as various combinations of the aforementioned six degrees of freedom to achieve corresponding anti-shake effects. These six degrees of freedom are as follows: Figure 3a and Figure 3b The diagram shows translations along the X, Y, and Z axes, as well as rotations around the X, Y, and Z axes.

[0079] Furthermore, in one embodiment of this application, in the periscope continuous optical variable module, the third driver can be disposed between the back of the circuit board and the base. Figure 5 A side view schematic diagram of a photosensitive component with a third driver according to one embodiment of this application is shown. (Reference) Figure 5 In this embodiment, the photosensitive assembly may include a base 410, a circuit board 430, and a photosensitive chip 440 mounted on the surface of the circuit board. The photosensitive chip 440 is electrically connected to the circuit board 430 via a wire bonding process. The photosensitive chip 440 and the circuit board 430 can move as a whole. A support shaft 470 is provided on the back of the circuit board 430. The top end of the support shaft 470 is connected to the circuit board 430, and the bottom end is connected to the base 410. The third driver 420 includes a plurality of sub-driver modules surrounding the support shaft 470. Figure 6 This diagram illustrates a plurality of sub-driving modules in one embodiment of the present application from a top-down perspective. (Reference) Figure 6 Multiple sub-drive modules 421 are distributed at different locations on the support shaft 470. (Refer to reference...) Figure 5 In this embodiment, each sub-drive module can drive the corresponding position of the circuit board to rise and fall relative to the base, thereby adjusting the tilt angle of the circuit board 430 relative to the base 410 in the corresponding position. Since the base 410 is fixed to the module housing and the circuit board 430 is fixed to the photosensitive chip 440, the tilt angle of the photosensitive chip 440 relative to the continuous zoom lens can be adjusted by the third driver 420. Simultaneously controlling multiple sub-drive modules allows the photosensitive chip to obtain the required tilt angle, thereby compensating for the image plane tilt of the continuous zoom lens and achieving optical image stabilization. Note that... Figure 5The lifting direction is actually the X-axis direction in the aforementioned embodiment, and all lifting directions mentioned below are consistent with this, so they will not be repeated here. Furthermore, in this embodiment, the support shaft 470 can be an elastic support shaft. This elastic support shaft has sufficient rigidity to support the circuit board and the photosensitive chip, and also has sufficient elasticity to bend under the action of the third driver, thereby facilitating the third driver to adjust the tilt angle of the photosensitive chip.

[0080] Furthermore, Figure 7 A side view schematic diagram of a single sub-driver module in one embodiment of this application is shown. (Reference) Figure 7 In this embodiment, the third driver may include multiple sub-driving modules 421. Each sub-driving module 421 can be divided into upper and lower parts, with the upper part connected to the circuit board 430 and the lower part connected to the base 410. The upper and lower parts of the sub-driving module 421 can be a coil 421a and a magnet 421b, respectively, thereby realizing electromagnetic force-driven lifting and lowering motion. Furthermore, by changing the current in the coil, the magnitude of the driving force can be controlled, thereby realizing quantitative adjustment of the circuit board tilt angle. In other embodiments of this application, the upper and lower parts of the sub-driving module can be a magnet and a coil, respectively, or both the upper and lower parts of the sub-driving module can be coils. These implementations can also realize electromagnetic force-driven lifting and lowering motion.

[0081] Furthermore, in some modified embodiments of the present invention, the sub-driving module can also be implemented based on a MEMS electrostatic comb structure. In such embodiments, both the upper and lower parts of the sub-driving module can adopt a MEMS electrostatic comb structure, wherein the upper part is fixed to the circuit board and the lower part is fixed to the base.

[0082] Furthermore, in some modified embodiments of the present invention, the sub-drive module can also be implemented based on SMA wires. SMA is a shape memory alloy; by energizing the SMA wire (or other SMA components), its temperature can be changed, causing it to expand and contract accordingly, thereby driving the circuit board. In one example, the SMA component can be disposed between the bottom surface of the circuit board and the upper surface of the base, with its top connected to the bottom surface of the circuit board and its bottom connected to the upper surface of the base. The SMA component itself can have a certain rigidity; when energized, the SMA component will expand or contract, thereby achieving driving in the lifting direction.

[0083] In the above embodiments, the third driver includes multiple sub-driver modules capable of lifting and lowering. However, it should be noted that the structure of this third driver is not unique. Figure 8 A third driver based on SMA lines is shown in another embodiment of this application. Reference Figure 8The third driver includes a bottom extension 431 extending downward from the bottom surface of the circuit board 430 and an SMA cable 422 connecting the bottom extension 431 and the support portion 412 of the base 410. The SMA cable 422 can contract under temperature influence when energized, thereby moving the circuit board horizontally. The support shaft has a certain degree of elasticity in the horizontal direction, allowing the circuit board to move horizontally under the drive of the SMA cable. It should be noted that horizontal movement... Figure 1 The movement along the Y-axis or Z-axis will not be discussed further below.

[0084] Furthermore, Figure 9 A side view schematic diagram of a photosensitive component in one modified embodiment of this application is shown. (Reference) Figure 9 In this embodiment, the circuit board 430, photosensitive chip 440, filter 460, and gold wire are molded and encapsulated as a single unit. When vibration occurs, this encapsulated structure moves as a whole. Specifically, in this embodiment, the photosensitive chip 440 is directly fixed to the upper surface of the circuit board 430. The photosensitive chip 440 and the circuit board 430 are connected by gold wire (i.e., connected via wire bonding). The gold wire is encapsulated using a molding process (the molding process forms a molding portion 461, which encapsulates the gold wire) to protect the gold wire from potential breakage due to frequent movement of the circuit board 430. In this embodiment, the base 410 of the photosensitive component can be directly attached to the driver housing. In this embodiment, the driver housing refers to the driver housing of a movable assembly. Specifically, the top surface of the annular support portion 412 of the base 410 can be directly attached to the driver housing. The molding portion 461 is not connected to the driver housing.

[0085] Furthermore, still referencing Figure 6 In one embodiment of this application, the third driver may include multiple sub-driver modules, and the number of sub-driver modules may be, for example, eight. Furthermore, the first sub-driver module 1, the fourth sub-driver module 4, the third sub-driver module 3, and the sixth sub-driver module 6 may be sub-lift drive modules (e.g., Figure 7 As shown), these sub-drive modules can control the rotation of the photosensitive chip around the Y-axis and Z-axis (see reference). Figure 10 , Figure 10 This application illustrates the degree of freedom of movement of the photosensitive chip in the rotational direction of a periscope continuous optical zoom module according to an embodiment of the present application. The photosensitive chip can also be controlled to move along the X-axis (see reference). Figure 1 The second sub-driver module 2, the fifth sub-driver module 5, the seventh sub-driver module 7, and the eighth sub-driver module 8 can control the photosensitive chip to translate along the Y-axis and Z-axis. Each of these sub-driver modules can employ methods such as... Figure 8The drive structure shown is based on SMA lines to achieve horizontal translation. Furthermore, in some embodiments, the second sub-drive module 2, the fifth sub-drive module 5, the seventh sub-drive module 7, and the eighth sub-drive module 8 can also control the photosensitive chip to rotate around the X-axis.

[0086] Furthermore, still referencing Figure 6 In one embodiment of this application, in the periscope continuous optical zoom module, the single-sided gap between the circuit board and the support of the base in the module height direction (Z direction) is 'a', and the single-sided gap between the circuit board and the support of the base in the lateral direction (Y direction) is 'b'. 'a' and 'b' determine the distance the photosensitive chip can move in the Z and Y directions, respectively. Since the effective focal length (EFL) changes when at least two moving groups move during zooming in the continuous optical zoom module, the image will have a relatively large shift in the Y direction. Therefore, this embodiment implements a larger image stabilization distance in the Y direction, thus providing a relatively large gap 'b' (i.e., b ≥ a) to allow the photosensitive chip a larger movement distance in the Y direction. On the other hand, b ≥ a also reduces the height of the base in the Z direction, thereby reducing the size of the camera module. Simultaneously, for electronic devices equipped with this periscope module, reducing the height of the module in the Z direction also helps to reduce the thickness of the electronic device.

[0087] Furthermore, in one embodiment of this application, when the circuit board is in the reference position, the distance between the circuit board and the support (referring to the distance on one side) can be less than or equal to 1000 μm to reduce the module size. Preferably, when the circuit board is in the reference position, the distance between the circuit board and the support can be less than or equal to 600 μm and greater than 500 μm. This design allows the unilateral movement of the photosensitive chip to reach more than 400 μm. For example, in one example, the unilateral movement of the photosensitive chip reaches 500 μm. In some embodiments of this application, the movement range of driving the photosensitive chip can be 50 to 500 μm on one side, that is, the movement range of driving the photosensitive chip can be designed to be 50 μm on one side, 400 μm on one side, or 500 μm on one side. For different movement range designs, the distance between the circuit board and the support can also be designed accordingly to allow the circuit board or photosensitive chip to move within the designed range while minimizing the module size as much as possible.

[0088] Furthermore, in one embodiment of this application, the support shaft in the photosensitive component can be replaced by other types of elastic support members. Figure 11a A side view schematic diagram of a photosensitive assembly with an elastic support member according to one embodiment of this application is shown. (Reference) Figure 11aIn this embodiment, the support shaft located between the bottom surface of the circuit board 430 and the base 410 is eliminated, and its function is replaced by an elastic support 471 connecting the inner sides of the support portion 412 between the circuit board 430 and the base 410. This elastic support 471 can provide better four-sided support and stability. Furthermore, the elastic support 471 in this embodiment can be energized, and the base 410 can have a connector to connect to electronic devices. In this way, electrical signals from the photosensitive chip 440 or the circuit board 430 can be transmitted to the electronic devices through the elastic support 471 and the base 410, and the electronic devices can also transmit electrical signals to the photosensitive chip 440 or the circuit board 430 through the base 410 and the elastic support 471.

[0089] Figure 11b A side view schematic diagram of a photosensitive assembly with an elastic support member according to another embodiment of this application is shown. (Reference) Figure 11b In this embodiment, multiple elastic supports 471 are disposed on the edge region of the bottom surface of the circuit board 430. The elastic supports 471 can be metal suspension wires, with one end connected to the bottom surface of the circuit board 430 and the other end connected to the upper surface of the base 410. Multiple metal suspension wires can be distributed along the edge region of the bottom surface of the circuit board 430 to provide better lateral support and stability. Furthermore, the elastic supports 471 can be powered, and connectors on the base connect to electronic devices; electrical signals can be transmitted through the base 410, the elastic supports 471, and the circuit board 430.

[0090] Figure 12 A side cross-sectional schematic diagram of a periscope-type continuous optical scaling module according to another embodiment of this application is shown. (Reference) Figure 12 In this embodiment, the reflective element can be separated from the fixed lens group (referred to as the fixed group). For example, all the fixed lenses 140 of the fixed group can be placed behind the reflective element 110. Furthermore, the reflective element 110 can rotate around the Y-axis and / or around the Z-axis, which, in conjunction with the image stabilization of the photosensitive chip 440 in the Z-axis translation direction and / or the Y-axis translation direction, can provide better image stabilization. Specifically, due to the size limitations of the camera module, the movement distance of the photosensitive chip 440 in the Z and / or Y directions is limited. When the camera module shakes significantly, the movement of the photosensitive chip 440 may not be sufficient to compensate for the blurring caused by the camera module shake. In this case, adding rotational image stabilization of the reflective element in these two directions can cooperate with the photosensitive chip 440 to achieve better image stabilization. For example, the rotation of the reflector around the Y-axis can help compensate for the offset of the imaging area (relative to the photosensitive surface) of the optical system in the Z-axis direction, and the rotation of the reflector around the Z-axis can help compensate for the offset of the imaging area (relative to the photosensitive surface) of the optical system in the Y-axis direction.

[0091] Furthermore, Figure 13This diagram shows a side cross-sectional view of a periscope-type continuous optical scaling module with a grooved support portion, according to one embodiment of this application. (See reference) Figure 13 In this embodiment, the annular support portion of the base 410 includes four side walls ( Figure 13 (Only the top and bottom sidewalls are shown), wherein at least one sidewall has a groove 412a on its inner surface. In this embodiment, the zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section; during zooming, the photosensitive chip moves along the X-axis under the drive of the third driver to make the photosensitive surface and the imaging surface aligned on the X-axis, thereby achieving better image quality. Generally, during zooming, due to the use of compensating optical components for focusing, even if the photosensitive chip does not move along the optical axis, the photosensitive chip can still produce a relatively clear image within a certain depth of field. However, for telephoto scenes, when the user has higher requirements for image quality, the photosensitive chip can adjust its position in the X-axis direction during zooming to better match the position of the imaging surface of the optical system with that of the photosensitive surface, thereby making the telephoto image clearer. Further, in this embodiment, when the zoom magnification is in the telephoto section, the circuit board can be positioned directly opposite the groove of the sidewall on the X-axis, thus providing greater clearance for the movement of the circuit board. Figure 14 This diagram shows a side cross-sectional view of a periscope-type continuous optical zoom module with a grooved support portion, as shown in a telephoto view, according to one embodiment of this application. (Reference) Figure 14 In contrast Figure 13 state, Figure 14The circuit board 430's position on the X-axis has changed, and its position on the X-axis is directly opposite the groove 412a on the sidewall, thus providing greater clearance for the circuit board 430's movement in the Z-axis direction, thereby achieving better image stabilization. Further, in this embodiment, for the telephoto section, in the Z-axis or Y-axis translation direction, the third driver is configured to drive the circuit board to move within a first movement range; for the non-telephoto section, in the Z-axis or Y-axis translation direction, the third driver is configured to drive the circuit board to move within a second movement range, where the first movement range is larger than the second movement range. In high-magnification telephoto scenarios, even extremely small shakes of the shooting device (e.g., a mobile phone) can cause blurry images or noticeable shaking in video recordings, resulting in a poor user experience. In this embodiment, by setting a larger image stabilization movement range (or image stabilization dynamic range) for the circuit board (or image sensor chip) in the telephoto section, the image stabilization capability of the telephoto section can be effectively improved, thereby enhancing the user experience. Furthermore, this embodiment achieves better Z-axis image stabilization in telephoto mode without increasing the size of the photosensitive component. Simultaneously, since the circuit board and photosensitive chip have a relatively small range of movement in non-telephoto mode, the size of the grooves or perforations on the sidewalls can be minimized (as long as sufficient clearance is provided at the circuit board location in telephoto mode), thus ensuring the structural strength of the base and providing good reliability. It should be noted that in other embodiments of the invention, the grooves on the inner side of the sidewalls can be replaced by perforations. Similar to grooves, perforations can also provide clearance for the movement of the circuit board. Figure 15 A perspective view of a base with a hollowed-out structure on the top and bottom sidewalls is shown in one embodiment of this application. Figure 16 A perspective view of a base with a hollowed-out structure on the top and bottom sidewalls is shown in another embodiment of this application. Figure 15 In the middle, the openwork structure 412b is a window-type structure. Figure 16 In the middle, the hollow structure 412b is a groove-shaped structure. At this time, the top and bottom side walls of the support part 412 of the base 410 are completely hollowed out, and the support part 412 actually only has two side walls.

[0092] Furthermore, in one embodiment of this application, the annular support includes a top sidewall, a bottom sidewall, a front sidewall, and a rear sidewall. The top and bottom sidewalls are perpendicular to the Z-axis, and the front and rear sidewalls are perpendicular to the Y-axis. The inner surfaces of the top and bottom sidewalls have grooves (or the top and bottom sidewalls have hollow structures). The Y-axis dimension of the periscope-type continuous optical variable module can be larger than its Z-axis dimension, allowing for a larger gap between the circuit board and the front sidewall, and between the circuit board and the rear sidewall (for example, this gap can be larger than the gap between the circuit board and the top sidewall, or larger than the gap between the circuit board and the bottom sidewall). Therefore, in this embodiment, the front and rear sidewalls may not have grooves (nor hollow structures or any other clearance structures). Furthermore, the zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section. During zooming, the photosensitive chip moves along the Z-axis under the drive of the third driver, so that the photosensitive surface and the imaging surface are aligned on the Z-axis. When the zoom magnification is in the telephoto section, the photosensitive chip and the circuit board are positioned directly opposite the groove or the hollow structure on the sidewall on the Z-axis. Furthermore, for the telephoto section, in the Z-axis translation direction, the third driver is configured to drive the circuit board to move within a first movement range; for the non-telephoto section, in the Z-axis translation direction, the third driver is configured to drive the circuit board to move within a second movement range, where the first movement range is greater than the second movement range. This embodiment can achieve better Z-axis image stabilization in telephoto mode without increasing the Z-axis size of the photosensitive component. Meanwhile, since the circuit board and photosensitive chip can have a relatively small Z-axis movement range when not in telephoto mode, the size of the grooves or hollow structures on the side wall can be minimized, thus ensuring the structural strength of the base and providing good reliability.

[0093] Still referencing Figure 13 In one embodiment of this application, in the fixed optical assembly, fixed lenses may be arranged on the light-incident side of the reflective prism, while fixed lenses may not be arranged on the light-outcrystal side of the reflective prism.

[0094] Figure 17 A cross-sectional schematic diagram of a photosensitive component with image stabilization functionality according to another embodiment of this application is shown. (Reference) Figure 17In this embodiment, a middle seat 442 fabricated using semiconductor technology is mounted on the back of the photosensitive chip 440. The third driver 420 is located between the middle seat 442 and the base 410. The third driver 420 is adapted to drive the assembly of the middle seat 442 and the photosensitive chip 440 to move in at least one direction. The circuit board 430 is mounted on the back of the base 410. An elastic support member 472 connects the middle seat 442 and the base 410 at both ends, thereby providing elastic support for the middle seat 442 and the photosensitive chip 440. Specifically, the elastic support member 472 can be disposed on the outer side of the middle seat 442 and the inner side of the support portion 412 of the base 410. In this embodiment, the third driver 420 does not need to drive the circuit board 430 to move, thereby reducing the driving force required to move the photosensitive chip 440 and helping to reduce the size of the photosensitive assembly. It should be noted that in this embodiment, the third driver 420 is not disposed on the back of the circuit board 430, which differs from other embodiments described above.

[0095] Furthermore, in one embodiment of this application, the periscope continuous optical zoom module can be a telephoto camera module. In electronic devices such as mobile phones, tablets, and drones, at least one wide-angle camera module and at least one telephoto camera module can be configured, and the wide-angle and telephoto camera modules can be combined to form a multi-camera continuous zoom module. In this embodiment, the effective focal length (EFL) of the telephoto camera module can continuously vary within the range of 15–40 mm, its equivalent focal length (P1) can continuously vary within the range of 120–300 mm, and its field of view (FOV) also varies within the range of 8–20 degrees. The effective focal length (P2) of the wide-angle module can be a fixed value within the range of 20–30 mm, and its field of view (FOV) can be a fixed value within the range of 60–80 degrees. Combining a telephoto camera module and a wide-angle camera module yields a continuous optical zoom multi-camera module. This module can be configured as follows: when 4 ≤ P1 / P2 ≤ 10, it achieves 4–10x continuous optical zoom; when 5 ≤ P1 / P2 ≤ 10, it achieves 5–10x continuous optical zoom; when 6 ≤ P1 / P2 ≤ 10, it achieves 6–10x continuous optical zoom; and when 6 ≤ P1 / P2 ≤ 15, it achieves 6–15x continuous optical zoom. However, the continuous optical zoom multi-camera module of this invention is not limited to the aforementioned continuous optical zoom ratios. In other embodiments of this invention, P1 / P2 can be other ranges to achieve at least 4x continuous zoom capability.

[0096] Furthermore, in one embodiment of this application, the continuous optical zoom module may include: a wide-angle fixed-focus module with an equivalent focal length of 20-30mm, a mid-range fixed-focus module with an equivalent focal length of 50-80mm (or a mid-range module with continuous zoom with an equivalent focal length of 50-90mm), and a telephoto module with continuous zoom with an equivalent focal length of 120-300mm, to achieve multi-camera continuous zoom. The telephoto module may be a periscope-type continuous optical zoom module with image stabilization as described in the above embodiments. This telephoto module can change its field of view within 8-20 degrees by moving at least two movement groups. Even slight shaking will cause blurring in this case, making image stabilization particularly important. In this embodiment, the optical system of the telephoto module consists of at least three modules, including at least one fixed group, one reflector, and at least two moving groups. When the periscope continuous zoom module zooms and takes pictures, both the moving groups and the photosensitive chip are driven to move. The photosensitive chip can perform controlled movements in multiple directions under the drive to achieve optical image stabilization.

[0097] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A periscope-type continuous optical variable module, characterized in that, include: A fixed optical assembly includes a reflective element, wherein the incident light side and the outgoing light side of the reflective element have a first optical axis and a second optical axis that are perpendicular to each other, respectively. A first movable optical component includes at least two first lenses and a first driver that drives the at least two first lenses to translate along the second optical axis, the first movable optical component being located at the rear end of the fixed optical component; The second movable optical component includes at least two second lenses and a second driver that drives the at least two second lenses to translate along the second optical axis. The second movable optical component is located at the rear end of the first movable optical component. as well as A photosensitive assembly includes a base, a circuit board, a photosensitive chip, and a third driver, wherein the photosensitive chip is mounted on the surface of the circuit board, the third driver is located between the photosensitive chip and the base, and is used to drive the photosensitive chip to move in at least one direction, wherein the base carries the third driver, the photosensitive chip, and the circuit board; The photosensitive chip is mounted on the back of the circuit board. The third driver is located between the circuit board and the base, and is adapted to drive the assembly of the circuit board and the photosensitive chip to move in at least one direction. The base includes a base plate and an annular support extending upward from the periphery of the base plate. The annular support includes four sidewalls, at least one of which has a groove on its inner surface or a hollow structure. The zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section. When the zoom magnification is in the telephoto section, the circuit board is positioned on the X-axis directly opposite the groove or hollow structure of the sidewall. For the telephoto section, in the Z-axis or Y-axis translation direction, the third driver is configured to drive the circuit board to move within a first movement range. For the non-telephoto section, in the Z-axis or Y-axis translation direction, the third driver is configured to drive the circuit board to move within a second movement range, and the first movement range is greater than the second movement range.

2. The periscope-type continuous optical variable module according to claim 1, characterized in that, The third driver is used to drive the photosensitive chip to move in at least one direction to compensate for the tilt relative to the second optical axis formed by the at least two first lenses and / or the at least two second lenses during zoom movement. The at least one direction is at least one of the translation direction of the X-axis, Y-axis, and Z-axis, and the rotation direction around the X-axis, Y-axis, and Z-axis. The X-axis is parallel to the second optical axis, the Z-axis is parallel to the first optical axis, and the Y-axis is perpendicular to both the X-axis and the Z-axis.

3. The periscope-type continuous optical variable module according to claim 1, characterized in that, The reflective element is a reflective prism, which has an incident surface and an exit surface. The fixed optical assembly further includes a first fixed lens mounted on the incident surface and / or a second fixed lens mounted on the exit surface.

4. The periscope-type continuous optical variable module according to claim 1, characterized in that, The fixed optical assembly further includes a fixed lens group disposed at the rear end of the reflective element. The fixed lens group is separate from the reflective element, and the reflective element can rotate around the Z-axis and / or Y-axis under the drive of the reflective element driver.

5. The periscope-type continuous optical variable module according to claim 1, characterized in that, The first moving optical component is a zoom optical component, which is adapted to move along the X-axis to change the effective focal length of the periscope continuous optical zoom module. The second moving optical component is a compensation optical component, which is adapted to move along the X-axis to focus the optical system of the periscope continuous optical zoom module during zooming, thereby reducing the movement of the image plane of the optical system in the X-axis direction caused by the movement of the zoom optical component.

6. The periscope-type continuous optical variable module according to claim 1, characterized in that, The support surrounds the circuit board.

7. The periscope-type continuous optical variable module according to claim 6, characterized in that, The third driver includes multiple sub-drive modules installed between the bottom surface of the circuit board and the base. Each sub-drive module is adapted to drive the circuit board to move up and down relative to the base, and the direction of the up and down movement is consistent with the X-axis direction.

8. The periscope-type continuous optical variable module according to claim 7, characterized in that, An elastic support shaft is provided between the bottom surface of the circuit board and the base. The plurality of sub-drive modules surround the elastic support shaft and cooperate with each other to drive the circuit board to rotate around the Y-axis and / or around the Z-axis.

9. The periscope-type continuous optical variable module according to claim 6, characterized in that, The photosensitive component also includes a metal suspension wire, the top end of which is connected to the edge area of ​​the bottom surface of the circuit board, and the bottom end is connected to the base plate.

10. The periscope-type continuous optical variable module according to claim 6, characterized in that, The photosensitive component also includes an elastic support member, the two ends of which are respectively connected to the inner side of the support portion and the circuit board.

11. The periscope-type continuous optical variable module according to claim 6, characterized in that, The third driver includes a lateral movement drive module, which includes an SMA line and a bottom extension extending from the bottom surface of the circuit board. The two ends of the SMA line are respectively connected to the inner side of the bottom extension and the support. The SMA line can be extended or retracted under the adjustment of current, thereby driving the circuit board to move laterally relative to the base. The lateral movement includes translation along the Z-axis or translation along the Y-axis.

12. The periscope-type continuous optical variable module according to claim 7, characterized in that, The third driver includes multiple lateral movement drive modules, some of which are adapted to drive the circuit board to translate along the Z-axis, and others are adapted to drive the circuit board to translate along the Y-axis.

13. The periscope-type continuous optical variable module according to claim 12, characterized in that, The third driver also includes the lateral movement drive module adapted to drive the circuit board to rotate about the X-axis.

14. The periscope-type continuous optical variable module according to claim 6, characterized in that, When the circuit board is in the reference position, the distance between the circuit board and the support is less than or equal to 1000 μm.

15. The periscope-type continuous optical variable module according to claim 6, characterized in that, The dimension of the base in the Z-axis direction is less than or equal to the dimension of the fixed optical component in the Z-axis direction.

16. The periscope-type continuous optical variable module according to claim 6, characterized in that, The gap between the circuit board and the support in the Y-axis direction is greater than or equal to the gap between them in the Z-axis direction.

17. The periscope-type continuous optical variable module according to claim 6, characterized in that, The periscope-type continuous optical zoom module can continuously zoom within the equivalent focal length range of 120-300mm.

18. The periscope-type continuous optical variable module according to claim 1, characterized in that, During zooming, the photosensitive chip moves along the X-axis under the drive of the third driver so that the photosensitive surface and the imaging surface are aligned on the X-axis.

19. The periscope-type continuous optical variable module according to claim 6, characterized in that, The annular support includes a top sidewall, a bottom sidewall, a front sidewall, and a rear sidewall. The top sidewall and the bottom sidewall are perpendicular to the Z-axis, and the front sidewall and the rear sidewall are perpendicular to the Y-axis. The inner surfaces of the top sidewall and the bottom sidewall have grooves, or the top sidewall and the bottom sidewall have hollow structures.

20. The periscope-type continuous optical variable module according to claim 19, characterized in that, The zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section; during zooming, the photosensitive chip moves along the Z-axis under the drive of the third driver so that the photosensitive surface and the imaging surface are aligned on the Z-axis. When the zoom level is in the telephoto section, the image sensor and the circuit board are positioned directly opposite the groove or the cutout structure on the sidewall along the Z-axis; and, for the telephoto section, the third driver is configured to drive the circuit board to move within a first movement range in the Z-axis translation direction, and for the non-telephoto section, the third driver is configured to drive the circuit board to move within a second movement range in the Z-axis translation direction, wherein the first movement range is greater than the second movement range.

21. A multi-camera module, characterized in that, include: The periscope-type continuous optical variable module according to any one of claims 1-20; as well as The periscope-type continuous optical zoom module has an effective focal length that is more than 4 times that of the wide-angle module, and can achieve continuous zoom within a range that is more than 4 times the effective focal length of the wide-angle module.

22. A multi-camera module, characterized in that, include: The periscope-type continuous optical zoom module according to any one of claims 1-20, which continuously zooms within the equivalent focal length range of 120-300mm; Wide-angle fixed-focus module, its equivalent focal length is a fixed value within the range of 20-30mm; and The mid-focus module has an equivalent focal length in the range of 50 to 80 mm. The mid-focus module is either a fixed-focus module or a continuous zoom module.

23. A photosensitive component for a periscope continuous optical zoom module, comprising: Circuit board; A photosensitive chip, wherein the photosensitive chip is mounted on the surface of the circuit board; Base; and A driver, located between the photosensitive chip and the base, is used to drive the photosensitive chip to move in at least one direction, wherein the base carries the driver, the photosensitive chip, and the circuit board; The back of the photosensitive chip is mounted on the circuit board. The driver is located between the circuit board and the base, and the driver is adapted to drive the assembly of the circuit board and the photosensitive chip to move in at least one direction. The base includes a base plate and an annular support extending upward from the periphery of the base plate. The annular support includes four sidewalls, wherein at least one sidewall has a groove on its inner surface or at least one sidewall has a hollow structure. The zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section. When the zoom magnification is in the telephoto section, the circuit board is positioned on the X-axis directly opposite the groove or hollow structure of the sidewall. For the telephoto section, in the Z-axis or Y-axis translation direction, the driver is configured to drive the circuit board to move within a first movement range. For the non-telephoto section, in the Z-axis or Y-axis translation direction, the driver is configured to drive the circuit board to move within a second movement range, and the first movement range is greater than the second movement range.

24. The photosensitive component according to claim 23, characterized in that, The driver is used to drive the photosensitive chip to move in the at least one direction to compensate for the tilt relative to the second optical axis formed by at least two first lenses and / or at least two second lenses during zoom movement.

25. The photosensitive component according to claim 23, characterized in that, The base includes a base plate and an annular support portion extending upward from the periphery of the base plate, the support portion surrounding the circuit board.

26. The photosensitive component according to claim 25, characterized in that, The driver includes multiple sub-drive modules installed between the bottom surface of the circuit board and the base. Each sub-drive module is adapted to drive the circuit board to move up and down relative to the base, and the direction of the up and down movement is consistent with the X-axis direction.

27. The photosensitive component according to claim 26, characterized in that, An elastic support shaft is provided between the bottom surface of the circuit board and the base. The plurality of sub-drive modules surround the elastic support shaft and cooperate with each other to drive the circuit board to rotate around the Y-axis and / or around the Z-axis.

28. The photosensitive component according to claim 25, characterized in that, The photosensitive component also includes a metal suspension wire, the top end of which is connected to the edge area of ​​the bottom surface of the circuit board, and the bottom end is connected to the base plate.

29. The photosensitive component according to claim 25, characterized in that, The photosensitive component also includes an elastic support member, the two ends of which are respectively connected to the inner side of the support portion and the circuit board.

30. The photosensitive component according to claim 25, characterized in that, The driver includes a lateral movement drive module, which includes an SMA line and a bottom extension extending from the bottom surface of the circuit board. The two ends of the SMA line are respectively connected to the inner side of the bottom extension and the support. The SMA line can be extended or retracted under the adjustment of current, thereby driving the circuit board to move laterally relative to the base. The lateral movement includes translation along the Z-axis or translation along the Y-axis.

31. The photosensitive component according to claim 26, characterized in that, The driver includes multiple lateral movement drive modules, some of which are adapted to drive the circuit board to translate along the Z-axis, and others are adapted to drive the circuit board to translate along the Y-axis.

32. The photosensitive component according to claim 31, characterized in that, The driver also includes a lateral movement drive module adapted to drive the circuit board to rotate about the X-axis.

33. The photosensitive component according to claim 25, characterized in that, When the circuit board is in the reference position, the distance between the circuit board and the support is less than or equal to 1000 μm.

34. The photosensitive component according to claim 25, characterized in that, The dimension of the base in the Z-axis direction is less than or equal to the dimension of the fixed optical component of the periscope continuous optical variable module in the Z-axis direction.

35. The photosensitive component according to claim 25, characterized in that, The gap between the circuit board and the support in the Y-axis direction is greater than or equal to the gap between them in the Z-axis direction.

36. The photosensitive component according to claim 25, characterized in that, The annular support includes four sidewalls, wherein at least one sidewall has a groove on its inner surface or at least one sidewall has a hollow structure.

37. The photosensitive component according to claim 36, characterized in that, The zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section; during zooming, the photosensitive chip moves along the X-axis under the drive of the driver so that the photosensitive surface and the imaging surface are aligned on the X-axis. When the zoom level is in the telephoto section, the circuit board is positioned on the X-axis directly opposite the groove or the cutout structure on the sidewall; and, for the telephoto section, in the Z-axis or Y-axis translation direction, the driver is configured to drive the circuit board to move within a first movement range, and for the non-telephoto section, in the Z-axis or Y-axis translation direction, the driver is configured to drive the circuit board to move within a second movement range, wherein the first movement range is greater than the second movement range.

38. The photosensitive component according to claim 25, characterized in that, The annular support includes a top sidewall, a bottom sidewall, a front sidewall, and a rear sidewall. The top sidewall and the bottom sidewall are perpendicular to the Z-axis, and the front sidewall and the rear sidewall are perpendicular to the Y-axis. The inner surfaces of the top sidewall and the bottom sidewall have grooves, or the top sidewall and the bottom sidewall have hollow structures.

39. The photosensitive component according to claim 38, characterized in that, The zoom range of the periscope continuous optical zoom module includes a telephoto section and a non-telephoto section with a zoom magnification less than that of the telephoto section; during zooming, the photosensitive chip moves along the Z-axis under the drive of the driver so that the photosensitive surface and the imaging surface are aligned on the Z-axis. When the zoom level is in the telephoto section, the image sensor and the circuit board are positioned directly opposite the groove or the cutout structure on the sidewall along the Z-axis; and, for the telephoto section, the driver is configured to drive the circuit board to move within a first range of motion in the Z-axis translation direction, and for the non-telephoto section, the driver is configured to drive the circuit board to move within a second range of motion in the Z-axis translation direction, wherein the first range of motion is greater than the second range of motion.

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