Semiconductor manufacturing apparatus

Abstract

A semiconductor manufacturing device comprises a bearing table and a lifting mechanism, the lifting mechanism comprises a base, a clamping groove is formed on the base, and a groove is formed on the inner wall of the clamping groove in the circumferential direction; the connecting part comprises a first connecting part and a second connecting part, the first connecting part comprises a connecting body and a connecting cover, the connecting cover is connected to one end of the connecting body, the connecting cover has a through hole structure, the connecting body has a cylindrical structure, the connecting body comprises a first cylinder wall and a second cylinder wall, the first cylinder wall is composed of a plurality of elastic sheets that are not connected to each other, the elastic sheet has a clamping leg at the end away from the connecting cover, the clamping leg is matched with the groove, and the second cylinder wall has a semi-cylindrical structure; the second connecting part has a flat plate structure, and one end of the second connecting part is connected to the outer wall of the second cylinder wall. The connecting part is provided with a plurality of elastic sheet structures arranged at intervals, the connecting part is clamped in the clamping groove of the base through the clamping leg on the elastic sheet, and when the connecting part is installed or disassembled, only the elastic deformation of the connecting part is needed, without the help of additional tools.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically, to a semiconductor manufacturing apparatus. Background Technology

[0002] In the semiconductor manufacturing industry, wafer fabrication requires placing wafers on thin-film deposition machines to perform processes such as thin-film deposition. However, after long-term use, these machines require maintenance and cleaning, especially the various components in the machine's lifting mechanism. Timely cleaning is an important guarantee for the normal operation of the machine.

[0003] Currently, machine tool lifting mechanisms typically use an insertion method to fix the lifting rod in the lifting rod support. The lifting rod support is then connected to the base via a connecting part, which is fastened to the base's slot with bolts. This method of fixing the connecting part requires removing the bolts and pushing the lifting mechanism laterally out of the slot on the base before it can be removed. Due to the extremely limited operating space in the machine tool, the space for removing the bolts is limited, making bolt removal very difficult and requiring high-quality disassembly tools.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a semiconductor manufacturing apparatus that solves the problem of difficult disassembly of the connecting part in the machine tool lifting mechanism. The connecting part can be removed from the slot of the base without additional tools, saving disassembly time and improving disassembly efficiency.

[0006] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0007] According to one aspect of this disclosure, a semiconductor manufacturing apparatus is provided, the apparatus comprising a reaction chamber for manufacturing semiconductor devices, the apparatus including:

[0008] A support platform is located inside the reaction chamber and is used to support the semiconductor device.

[0009] A lifting mechanism is provided, comprising a lifting rod, a support part, a connecting part, and a base. One end of the lifting rod is disposed inside the support platform, and the other end of the lifting rod is inserted into the support part. The support part is connected to the base through the connecting part. The lifting mechanism is used to control the distance between the semiconductor device and the support platform.

[0010] The base has a slot, and the inner wall of the slot has a groove in the circumferential direction.

[0011] The connecting part includes a first connecting part and a second connecting part installed in the slot;

[0012] The first connecting part includes a connecting body and a connecting cover. The connecting cover is connected to one end of the connecting body and has a through-hole structure. The supporting part passes through the through-hole.

[0013] The connector has a cylindrical structure and includes a first cylindrical wall and a second cylindrical wall. The first cylindrical wall is composed of multiple non-connected spring pieces. The end of each spring piece away from the connecting cover has a locking foot, which cooperates with the groove. The second cylindrical wall has a semi-cylindrical structure.

[0014] The second connecting part has a flat plate structure, and one end of the second connecting part is connected to the outer wall of the second cylinder wall.

[0015] In some embodiments of this disclosure, based on the foregoing scheme, the height of the first connecting portion is greater than the depth of the card slot.

[0016] In some embodiments of this disclosure, based on the foregoing scheme, the height of the second connecting portion is less than or equal to the depth of the slot.

[0017] In some embodiments of this disclosure, based on the foregoing scheme, the connecting portion is made of a resilient material.

[0018] In some embodiments of this disclosure, based on the foregoing scheme, the materials of the first connecting portion and the second connecting portion may be the same or different.

[0019] In some embodiments of this disclosure, based on the foregoing scheme, the connector and the connector cover are integrally formed.

[0020] In some embodiments of this disclosure, based on the foregoing scheme, the spacing between adjacent spring pieces is 0.4mm-0.8mm.

[0021] In some embodiments of this disclosure, based on the foregoing scheme, the spacing between the plurality of spring pieces may be the same or different.

[0022] In some embodiments of this disclosure, based on the foregoing scheme, the second connecting portion is integrally formed with the first connecting portion.

[0023] In some embodiments of this disclosure, based on the foregoing scheme, the second connecting portion is welded to the outer wall of the second cylinder wall.

[0024] In some embodiments of this disclosure, based on the foregoing scheme, the number of connecting parts is at least three, the number of slots is equal to the number of connecting parts, and the slots correspond one-to-one with the connecting parts.

[0025] In some embodiments of this disclosure, based on the foregoing scheme, the card slot includes a first card slot and a second card slot, the first card slot and the second card slot intersect to form the card slot, and the groove is circumferentially disposed on the inner wall of the first card slot.

[0026] In some embodiments of this disclosure, based on the foregoing scheme, the locking foot is a boss structure with a protrusion, the protrusion cooperating with the groove, and the height of the protrusion being less than or equal to the depth of the groove.

[0027] In some embodiments of this disclosure, based on the foregoing scheme, the width of the boss is less than or equal to the width of the groove.

[0028] In some embodiments of this disclosure, based on the foregoing scheme, the support portion has a mating end that cooperates with the connecting portion, and the height of the connecting body is the same as the height of the mating end.

[0029] The semiconductor manufacturing apparatus disclosed herein has several advantages. First, the connecting part of the apparatus is configured with a structure having multiple spring contacts, each with a locking pin. The locking pins are engaged with the slots on the base by means of elastic clamping. When the connecting part needs to be installed or removed, only the elastic deformation of the spring contacts in the connecting part is required, which improves the efficiency of the connecting part. Second, since the fixing between the connecting part and the base slot does not require additional connecting parts, the force accumulation on additional connecting parts is reduced. The connecting part can be installed and removed without the need for tools, so that the installation and removal of the connecting part is not limited by tools and installation space. Third, the connecting part also includes a second connecting part with a flat plate shape. By connecting the second connecting part to the cylindrical wall of the first connecting part, the connecting part can be limited in the circumferential direction after it is engaged with the base slot, ensuring that the connecting part does not rotate during the operation of the apparatus.

[0030] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0032] Figure 1 This is a schematic diagram illustrating the working principle of a top rod lifting mechanism in an exemplary embodiment of this disclosure.

[0033] Figure 2 This is an exploded view of a semiconductor manufacturing apparatus according to an exemplary embodiment of the present disclosure.

[0034] Figure 3 This is a schematic diagram of the overall structure of a connecting part in an exemplary embodiment of the present disclosure.

[0035] Figure 4 This is a partial structural diagram of a base according to an exemplary embodiment of the present disclosure.

[0036] Figure 5 This is a top view of a connection portion in an exemplary embodiment of this disclosure.

[0037] Figure 6 This is a side view of a first connecting portion in an exemplary embodiment of this disclosure.

[0038] Figure 7 This is a side view of a first connection portion in an exemplary embodiment of this disclosure.

[0039] Figure 8 This is a cross-sectional view of a locking pin in an exemplary embodiment of this disclosure.

[0040] Figure 9 This is a top view of a connecting cover according to an exemplary embodiment of the present disclosure.

[0041] Figure 10 This is a top view of a second connection portion in an exemplary embodiment of this disclosure.

[0042] Figure 11 This is a schematic diagram of the structure of a lifting rod according to an exemplary embodiment of the present disclosure.

[0043] Figure 12 This is a schematic diagram of the structure of a support portion in an exemplary embodiment of the present disclosure.

[0044] The reference numerals in the attached figures are explained as follows:

[0045] 1': Base; 2': Top rod lifting mechanism; 3': Wafer; 4': Robotic arm; 21': Top rod; 1: Support platform; 2: Lifting mechanism; 3: Semiconductor device; 21: Lifting rod; 22: Support part; 23: Connecting part; 24: Base; 25: Gasket; 231: First connecting part; 232: Second connecting part; 2311: Connecting body; 2312: Connecting cover; 2312': Through hole; 2311': First cylinder wall; 2311”: Second cylinder wall; 233: Spring piece; 234: Clamping foot; 2341: Protrusion; 241: Slot; 2411: First slot; 2412: Second slot; 242: Groove; 2321: Recess; 221: First end of support part; 222: Second end of support part. Detailed Implementation

[0046] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0047] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0048] The fabrication of semiconductor devices involves steps such as wafer dicing and processing, chip bonding, injection molding, curing, and annealing. Wafer processing is fundamental to semiconductor device fabrication and includes processes like thin-film deposition (TFT) or sputtering. These processes are typically performed in a thin-film reactor. A TFT reactor has a reaction chamber for processing the wafer. Inside the reaction chamber are bases; typically, one reaction chamber has four bases. Each base has a pushrod lifting mechanism. The pushrods in the lifting mechanism are connected to the bases. The relative movement of the pushrod lifting mechanism and the bases allows the wafer placed on the base to be lifted, creating an operating space between the wafer and the base. An external robotic arm can then transfer the wafer within this operating space.

[0049] The specific movement process of the base and lifting mechanism of the thin film reactor is as follows: Figure 1As shown, in Figure 1 In section A, wafer 3' is placed on base 1', and base 1' is connected to push rod 21' in push rod lifting mechanism 2', with push rod 21' penetrating base 1'; Figure 1 In B, 1C, and 1D, when wafer 3' needs to be transferred, the push rod lifting mechanism 2' is pushed by a control device (not shown in the figure) connected to it to move towards the wafer 3' relative to the base 2'. The wafer 3' is lifted by the push rod 21', and the external robotic arm 4' extends under the wafer 3'. After lifting and transferring the wafer 3', the control device controls the push rod lifting mechanism 2' to move away from the wafer 3' relative to the base 2' until the top of the push rod 21' is flush with the top of the base 1'.

[0050] During long-term use of the machine, in order to ensure the normal operation of the top rod lifting mechanism and the base, it is necessary to maintain and clean the top rod lifting mechanism. This requires disassembling the components in the top rod lifting mechanism. In the top rod lifting mechanism, the top rod is connected to the base through a bracket and a cap. When disassembling the top rod, the cap must be removed first. In current machines, the cap is fixed to the base by pressing the edge of the cap with screws. However, the operating space between the top rod lifting mechanism and the base in the machine is small. When removing the cap, tools must be used to remove the screws first. Moreover, if the screws are stripped, the base must be removed from the machine before the screws can be removed, which is time-consuming and labor-intensive.

[0051] Therefore, this disclosure provides a semiconductor manufacturing apparatus in which a connecting part is secured to a base by means of a spring clip. When the connecting part is disassembled, no additional tools or large operating controls are required, making the maintenance of the machine tool time-saving and labor-saving.

[0052] This disclosure provides a semiconductor manufacturing apparatus, such as... Figure 2 As shown, the semiconductor device has a reaction chamber for manufacturing semiconductor devices, and the semiconductor manufacturing device includes a support stage 1 and a lifting mechanism 2.

[0053] The support platform 1 is located inside the reaction chamber (not shown in the figure) and is used to support the semiconductor device 3.

[0054] The support platform 1 is a support device with a support surface. Its shape can be a table-like structure or a table-like structure, allowing the semiconductor device 3 to be placed on the support platform 1. The support platform 1 provides support for the processing of the semiconductor device 3. Inside the support platform 1, there is also a connecting part that cooperates with the lifting mechanism 2. The function of this connecting part is to connect the lifting rod in the lifting mechanism 2 to the connecting part, and the lifting rod can move up and down relative to the support platform 1 through the connecting part, so that a relative displacement occurs between the lifting mechanism 2 and the support platform 1. It should be understood that the support platform 1 is not only a table-like structure with a connecting part, but also has corresponding structures for connecting with other devices or components, which will not be described in detail here.

[0055] The semiconductor device 3 in this disclosure may be a wafer, or a device other than a wafer that is suitable for semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus provided in this disclosure is used for, but is not limited to, wafers.

[0056] The lifting mechanism 2 includes a lifting rod 21, a support part 22, a connecting part 23, and a base 24. One end of the lifting rod 21 is located inside the support platform 1, and the other end of the lifting rod 21 is inserted into the support part 22. The support part 22 is connected to the base 24 through the connecting part 23. The lifting mechanism 2 is used to control the distance between the semiconductor device 3 and the support platform 1.

[0057] like Figure 4 As shown, combined with Figure 2 The base 24 has a slot 241, and the inner wall of the slot 241 has a groove 242. The slot 241 includes a first slot 2411 and a second slot 2412. The first slot 2411 and the second slot 2412 intersect to form the slot 241. The groove 242 is formed on the inner wall of the first slot 2411. Specifically, the groove 242 is formed at a position slightly below the middle of the first slot 2411. When the groove 242 is engaged with the connecting part 23, it can ensure that the depth of the connecting part 23 in the first slot 2411 is not too shallow, so as to ensure that the connecting part 23 and the base 24 have a suitable effective contact area.

[0058] In this disclosure, the base 24 can have a ring-shaped structure. For example, the base can be in the shape of a ring or hoop. This ring-shaped structure cooperates with other parts of the machine. The end face of the ring structure of the base 24 is provided with a slot 241, and the number of slots 241 is multiple, specifically 2, 3 or 4, etc. The multiple slots 241 can be evenly distributed on the base 24. Preferably, there are 3 slots 241. The 3 slots 241 can cooperate with 3 lifting rods 21 respectively. When the lifting rods 21 provide support force for the semiconductor device 3, the triangular structure formed by the three lifting rods 21 has stability and can keep the semiconductor device 3 in a force balance position without slipping off the support platform 1. The number of slots 241 must also be the same as the number of connecting parts 23, that is, the number of slots 241, connecting parts 23 and lifting rods 21 are equal, and the three are in a one-to-one correspondence relationship, that is, one lifting rod 21 is connected to one connecting part 23, and one connecting part 23 is connected to one slot 241.

[0059] In some embodiments, the cross-sections of the first slot 2411 and the second slot 2412 can be circular, and the cross-section of the slot 241 is the surface formed by the intersection of two circles. The cross-sections of the first slot 2411 and the second slot 2412 can also be rectangular, and the cross-section of the slot 241 is the surface formed by the intersection of two rectangles. In addition, the first slot 2411 and the second slot 2412 can be the same shape or different shapes. In this disclosure, the shape of the first slot 2411 and the second slot 2412 can be selected according to the actual design requirements of the device, and the area where the first slot 2411 and the second slot 2412 intersect can also be determined according to the actual design and usage requirements of the machine tool.

[0060] In some embodiments, the depths of the first slot 2411 and the second slot 2412 may be the same or different. For example, the depth of the first slot 2411 may be equal to the depth of the second slot 2412, or the depth of the first slot 2411 may be greater than the depth of the second slot 2412. Preferably, for the convenience of manufacturing process, the two depths are usually made to be the same. When slotting on the base 24, if the depths of the first slot 2411 and the second slot 2412 are the same, the slot 241 can be processed in one processing step.

[0061] like Figure 3 As shown, combined with Figure 2 , Figures 5 to 8The connecting part 23 includes a first connecting part 231 and a second connecting part 232 installed in the slot 241. The first connecting part 231 includes a connecting body 2311 and a connecting cover 2312. The connecting cover 2312 is connected to one end of the connecting body 2311 and has a through hole structure. The support part 22 passes through the through hole 2312'. The connecting body 2311 has a cylindrical structure and includes a first cylindrical wall 2311' and a second cylindrical wall 2311'". The first cylindrical wall 2311' is composed of a plurality of non-connected spring pieces 233. The end of the spring piece 233 away from the connecting cover 2312 has a locking foot 234, which cooperates with the groove 242. The second cylindrical wall 2311' has a semi-cylindrical structure. The second connecting part 232 has a flat plate structure, and one end of the second connecting part 232 is connected to the outer wall of the second cylindrical wall 2311'.

[0062] Among them, such as Figure 3 , Figure 5 and Figure 6 As shown, the first connecting part 231 has multiple spring pieces 233, which constitute the first cylindrical wall 2311'. The multiple spring pieces 233 are distributed circumferentially along the first cylindrical wall 2311'. The multiple spring pieces 233 are not connected to each other, and there is a gap between two adjacent spring pieces 233. Each gap can be the same or different. The gap between two adjacent spring pieces 233 can be in the range of 0.4mm-0.8mm. For example, the gap can be 0.4mm, 0.6mm or 0.8mm. When the gap between two adjacent spring pieces 233 is in the range of 0.4mm-0.8mm, it can ensure that the connecting part 23 has sufficient elastic deformation during installation so that the connecting part 23 can be installed on the base 24. It can also ensure that the connecting part 23 has sufficient strength and rigidity so that the connecting part 23 will not deform or tear when the lifting mechanism 2 is working.

[0063] like Figure 8 As shown, combined with Figures 2 to 5 The side of the spring clip 233 away from the connecting cover 2312 has a locking foot 234, in Figure 7 In the cross-sectional view shown, the locking foot 234 is located at the bottom end of the spring piece 233 and protrudes from the outer wall of the first cylinder wall 2311'.

[0064] like Figure 8 As shown, the locking foot 234 is a boss structure with a protrusion 2341. The protrusion 2341 mates with a groove 242 formed on the inner wall of the locking slot 241 on the base 24. The height of the protrusion 2341 is less than or equal to the depth of the groove 242. Figure 8In the diagram, taking the direction shown as an example, "H" represents the height of the protrusion 2341, and "W" represents the width of the protrusion 2341. Since the protrusion 2341 of the latch 234 is an effective part that engages with the groove 242, the latch 234 needs to have dimensions that match the groove 242. Specifically, the height H of the protrusion 2341 of the latch 234 needs to be less than or equal to the depth of the groove 242 to ensure that the protrusion 2341 can extend into the interior of the groove 242. It should be noted here that... It is clear that the height H of the protrusion 2341 should not be too small to avoid making the contact area between the protrusion 2341 and the groove 242 too small; the width W of the protrusion 2341 needs to be less than or equal to the width of the groove 242 to ensure that the protrusion 2341 can be inserted into the groove 242 during assembly. Through the cooperation between the protrusion 2341 of the clamp 234 and the groove 242, the first connecting part 231 is limited in the axial direction so that the connecting part 23 will not be displaced in the vertical direction of the device.

[0065] It should be noted that, in Figure 8 In the cross-sectional view of the shown clip 234, chamfers are provided on the left and right sides of the bottom of the clip 234 and on the top of the protrusion 2341 (described according to the positional relationship in the attached figure). On the one hand, when the clip 234 is assembled in the groove 242, the chamfers of the clip 234 make the assembly between the clip 234 and the groove 242 easier and prevent the clip 234 from getting stuck in the groove 242. On the other hand, the chamfered clip 234 is easier to process and manufacture. The chamfer on the clamp 234 can be selected according to specific needs. For example, the degree of the top chamfer can be 20° to 40°, the degree of the left chamfer (outer side of the clamp 234) can be 135° to 165°, and the degree of the right chamfer (inner side of the clamp 234) can be 25° to 65°. Preferably, the top chamfer is 30°, the left chamfer is 150°, and the right chamfer is 45°, which can ensure the processing and assembly process of the clamp 234.

[0066] like Figure 7 As shown, combined with Figure 2 and Figure 5The first connecting portion 231 also includes a second cylindrical wall 2311”. The second cylindrical wall 2311” and the first cylindrical wall 2311’ form a cylindrical first connecting portion 231. The second cylindrical wall 2311” is semi-cylindrical. For example, if the first cylindrical wall 2311’ occupies a larger proportion in the first connecting portion 231, the second cylindrical wall 2311” is a cylindrical wall with a short arc cross-section; if the first cylindrical wall 2311’ occupies a smaller proportion in the first connecting portion 231, the second cylindrical wall 2311” is a cylindrical wall with a long arc cross-section; if the two occupy equal proportions in the first connecting portion 231, the second cylindrical wall 2311” is a cylindrical wall with a semi-circular cross-section. It should be noted that the proportion of the two in the first connecting portion 231 will not be too large or too small. Usually, the two are equal, that is, the first cylindrical wall 2311’ and the second cylindrical wall 2311” are both semi-cylindrical.

[0067] In this disclosure, the second cylindrical wall 2311” is an integral structure, meaning it does not have openings or other structures. The second cylindrical wall 2311” has the same height as the first cylindrical wall 2311’, allowing them to fit together as a cylindrical unit. Furthermore, the second cylindrical wall 2311” provides a connection point for the connection of the first connecting portion 231 and the second connecting portion 232. The second connecting portion 232 is connected to the second cylindrical wall 2311”, but it does not have a connection relationship with the outer side of the first cylindrical wall 2311’.

[0068] like Figure 9 As shown, combined with Figure 5 and Figure 6 The first connecting part 231 includes a connecting cover 2312, such as Figure 9 In the top view, the connecting cover 2312 has a through-hole structure, and the support part 22 passes through the through-hole 2312'. Specifically, the connecting cover 2312 can be a ring. The connecting cover 2312 is connected to the end of the connecting body 2311 away from the base 24. The connecting cover 2312 serves as a connecting end, connecting the first cylindrical wall 2311' and the second cylindrical wall 2311" in the connecting body 2311. The size of the through-hole 2312' on the connecting cover 2312 corresponds to the size of the support part 22, that is, the size of the through-hole 2312' is larger than the size of one end of the support part 22 and smaller than the size of the other end of the support part 22. This ensures that the support part 22 can pass through the through-hole 2312' into the first connecting part 231, and also allows the connecting cover 2312 to limit the support part 22 in the vertical direction.

[0069] The outer diameter of the connecting cover 2312 is the same as that of the connecting body 2311. The outer diameter of the connecting body 2311 does not include the size of the clamp 234. The inner diameter of the connecting cover 2312 needs to match the size of the support part 22. Specifically, the outer diameter of the connecting cover 2312 can be 9.3mm to 9.4mm, and the inner diameter can be 4.9mm to 5.2mm. The above dimensions are exemplary dimensions, and the dimensions of the connecting cover provided in this disclosure include, but are not limited to, the above dimensions.

[0070] In some embodiments, the connecting body 2311 and the connecting cover 2312 in the first connecting portion 231 can be integrally formed or formed separately and then connected. Preferably, in order to reduce processing steps, the structure of integrally forming the connecting cover 2312 and the connecting body 2311 is selected. The first connecting portion 231 after integrally forming the connecting body 2311 and the connecting cover 2312 has higher strength. Alternatively, the first connecting portion 231 can be formed by separately manufacturing the connecting cover 2312, the second cylinder wall 2311” and a plurality of spring pieces 233, and then connecting the plurality of spring pieces 233 and the second cylinder wall 2311” to the connecting cover 2312. However, the strength of the first connecting portion 231 manufactured by this method is low at each connection point. This disclosure only provides the above-mentioned exemplary manufacturing method of the first connecting portion and does not represent all methods. Other manufacturing methods and combinations thereof are also applicable to this disclosure.

[0071] The height of the first connecting part 231 needs to be greater than the depth of the slot 241. Furthermore, the height of the first connecting part 231 needs to be greater than the depth of the first slot 2411. When the connecting part 23 is installed on or removed from the base 42, the first connecting part 231 is a deformable part. Under the action of external force, the first connecting part 231 is deformed by elastic force and then locked in the slot 241. Therefore, for ease of operation, the first connecting part 231 needs to be higher than the top surface of the base 24. This dimensional relationship makes it easier for the operator to install and remove the first connecting part 231.

[0072] like Figure 10 As shown, combined with Figures 2 to 4The second connecting part 232 has a flat plate structure. One end of the second connecting part 232 is a recessed part 2321, which mates with and connects to the outer wall of the second cylindrical wall 2311” of the first connecting part 231. The second connecting part 232 can be regarded as the bottom extension of the second cylindrical wall 2311” of the first connecting part 231, that is, the second connecting part 232 is connected to the bottom of the second cylindrical wall 2311”. The second connecting part 232 is installed in the second slot 2412, and the outer dimensions of the second connecting part 232 are the same as those of the second slot 2412. After the connecting part 232 is installed in the slot 241, the second connecting part 232 ensures that the first connecting part 231 will not rotate within the first slot 2411. At the same time, the second connecting part 232 can also prevent the first connecting part 231 from sliding laterally. The second connecting part 232 has the function of limiting and fixing the first connecting part. Figure 10 The shape of the second connecting part 232 is adapted to the shape of the second slot 2412. In other embodiments, the second connecting part 232 may also have other regular or irregular shapes, but it must have the same function as the second connecting part 232 described above.

[0073] The height (equivalent to the thickness) of the second connecting part 232 needs to be less than or equal to the depth of the slot 241. Furthermore, the height of the second connecting part 232 needs to be less than or equal to the depth of the second slot 2412. The second connecting part 232 provides a limiting and fixing function for the first connecting part 231. During the use of the connecting part 23, there is no requirement for the second connecting part 232 to be elastically deformable. In order to ensure that the second connecting part 232 will not affect the connection between the first connecting part 231 and the support part 22, or that the second connecting part 232 will not affect the operation of the entire device, the second connecting part 232 is lower than or flush with the top surface of the base 24.

[0074] In this disclosure, the bottom shape of the connecting part 23 is the same as the shape of the slot 241 on the base 24, so that the connecting part 23 can be completely installed inside the slot 241. The first connecting part 231 cooperates with the first slot 2411, and the second connecting part 232 cooperates with the second slot 2412. In some embodiments, the first connecting part 231 and the second connecting part 232 can be integrally formed, or they can be connected by welding, riveting, or other methods. In the process of manufacturing the connecting part 23, a mold can be used to cast the connecting part 23. The specific manufacturing method of the connecting part 23 can be selected according to the actual situation. It should be noted that when the first connecting part 231 and the second connecting part 232 adopt an integrally formed structure, the stress strength of the connection part between the two will be greater than or equal to the stress strength of the connection part when they are welded. However, in the manufacturing process, there can be multiple ways to connect the two.

[0075] The connecting part 23 is made of a flexible (metallic) material with a surface roughness of 2.8 to 3.6. Specifically, the connecting part 23 can be made of an alloy material, such as Haynes 242, with a surface roughness of 3.2. This alloy material has good thermal stability and high corrosion resistance. The connecting part 23 made of this alloy has good durability. The connecting part 23 can also be made of high-stability and high-strength plastic casting.

[0076] In some embodiments, the first connecting part 231 and the second connecting part 232 may be made of the same or different materials. Furthermore, the elasticity or elastic deformation and working strength of the material used to make the first connecting part 231 must be greater than those of the material used to make the second connecting part 232. However, for the convenience of the manufacturing process, both can be made of the same material.

[0077] In this disclosure, such as Figure 11 As shown, the device also includes a lifting rod 21, one end of which is disposed inside the support platform 1. The lifting rod 21 can move vertically inside the support platform 1. In addition, the outside of the lifting rod 21 is covered by a gasket 25. The function of the gasket 25 is to increase the sealing between the lifting rod 21 and the support platform 1 and to prevent the lifting rod 21 from directly contacting the components inside the support platform 1 and causing wear. The other end of the lifting rod 21 is inserted into the support part 22, and the lifting rod 21 is pushed relative to the support platform 1 by the base 24 connected to the support part 22.

[0078] The semiconductor manufacturing apparatus also includes a support section 22, such as Figure 12 As shown, the first end 221 of the support has a funnel-shaped structure, and the second end 222 of the support has a cylindrical structure. The first end 221 of the support is the mounting end of the lifting rod 21, which is inserted into the first end 221 of the support. The second end 222 of the support cooperates with the connecting part 23, that is, the second end 222 of the support is the cooperating end. Specifically, the second end 222 of the support is disposed in the cavity of the connecting body 2311 of the first connecting part 231. Furthermore, the height of the connecting body 2311 is the same as the height of the second end 222 of the support.

[0079] The semiconductor manufacturing apparatus disclosed herein, by providing a connector with a structure having multiple spring tabs, allows for easy installation of the connector by simply squeezing the spring tabs, causing the connector to elastically deform and then placing it into the slot of the base. This ensures that the spring tabs' locking feet tightly engage with the grooves of the slot, allowing the connector to fit securely onto the base. This connector structure facilitates the installation and removal of the connector from the base, is not limited by installation space, and is easy to operate. Furthermore, the engagement of the second connector with the second slot provides a limiting effect on the connector, eliminating the need for additional fastening components and making the installation and removal of the connector even faster. In addition, since the connector is elastically locked into the groove of the base, it also acts as a buffer against thermal expansion caused by high temperatures during device operation.

[0080] In this disclosure, the semiconductor manufacturing apparatus is assembled in the following order, combined with Figures 2 to 12 Insert the support rod 22 into the through hole of the connecting cover 2312 of the first connecting part 231, so that the second end 222 of the support rod is located in the cavity of the first connecting part 231; align the first connecting part 231 with the first slot 2411 and the second connecting part 232 with the second slot 2412; pinch the spring piece 233 of the first connecting part 231 to make the spring piece 233 elastically deform, and lock the locking foot 234 of the spring piece 233 into the groove 242 on the inner wall of the slot 241; then release the spring piece 233 to allow the first connecting part 231 to return to its shape. At this time, the connecting part 23 is connected to the base 24 by elastic locking; insert one end of the lifting rod 21 into the first end 221 of the support part, and the other end of the lifting rod 21 is fitted into the inside of the support platform 1; the device installation is complete.

[0081] After the semiconductor manufacturing equipment has been in operation for a long time, it is necessary to maintain the equipment. At this time, the lifting mechanism 2 is separated from the support platform 1, and then the lifting rod 21 is pulled out from the support part. By squeezing the spring piece 233 of the first connecting part 231, the first connecting part 231 is elastically deformed, and the locking foot 234 is disengaged from the groove 242. The connecting part 23 is then removed from the base 24, and the lifting rod 21 and the support part 22 can be cleaned.

[0082] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0083] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A semiconductor manufacturing apparatus comprising a reaction chamber for manufacturing semiconductor devices, characterized in that, include: A support platform is located inside the reaction chamber and is used to support the semiconductor device. A lifting mechanism is provided, comprising a lifting rod, a support part, a connecting part, and a base. One end of the lifting rod is disposed inside the support platform, and the other end of the lifting rod is inserted into the support part. The support part is connected to the base through the connecting part. The lifting mechanism is used to control the distance between the semiconductor device and the support platform. The base has a slot, and the inner wall of the slot has a groove in the circumferential direction. The connecting part includes a first connecting part and a second connecting part installed in the slot; The first connecting part includes a connecting body and a connecting cover. The connecting cover is connected to one end of the connecting body and has a through-hole structure. The supporting part passes through the through-hole. The connector has a cylindrical structure and includes a first cylindrical wall and a second cylindrical wall. The first cylindrical wall is composed of multiple non-connected spring pieces. The end of each spring piece away from the connecting cover has a locking foot, which cooperates with the groove. The second cylindrical wall has a semi-cylindrical structure. The second connecting part has a flat plate structure, and one end of the second connecting part is connected to the outer wall of the second cylinder wall.

2. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The height of the first connecting part is greater than the depth of the slot.

3. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The height of the second connecting part is less than or equal to the depth of the slot.

4. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The connecting part is made of a flexible material.

5. The semiconductor manufacturing apparatus according to claim 4, characterized in that, The first connecting part and the second connecting part may be made of the same or different materials.

6. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The connector and the connector cover are integrally formed.

7. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The spacing between adjacent spring pieces is 0.4mm-0.8mm.

8. The semiconductor manufacturing apparatus according to claim 7, characterized in that, The spacing between the multiple spring pieces may be the same or different.

9. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The second connecting part is integrally formed with the first connecting part.

10. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The second connecting part is welded to the outer wall of the second cylinder.

11. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The number of connecting parts is at least three, the number of slots is equal to the number of connecting parts, and the slots correspond one-to-one with the connecting parts.

12. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The card slot includes a first card slot and a second card slot, the first card slot and the second card slot intersect to form the card slot, and the groove is arranged around the inner wall of the first card slot.

13. The semiconductor manufacturing apparatus according to claim 12, characterized in that, The locking foot is a boss structure with a protruding part, which cooperates with the groove, and the height of the protruding part is less than or equal to the depth of the groove.

14. The semiconductor manufacturing apparatus according to claim 13, characterized in that, The width of the boss is less than or equal to the width of the groove.

15. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The support portion has a mating end that cooperates with the connecting portion, and the height of the connecting body is the same as the height of the mating end.

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