A nickel plating device and a nickel plating method for electroplating

Abstract

The present application relates to electroplating nickel equipment technical field, specifically to a kind of electroplating is with nickel plating device and nickel plating method, including electroplating tank, still including hanger, first pipeline, pump body, second pipeline and deflector, wherein, hanger includes vertical pole, multiple clamping units are equipped on vertical pole, clamping unit includes first clamping plate, second clamping plate and bolt, bolt is connected with first clamping plate by screwing through second clamping plate;Two ends of first pipeline are set in the two sides inside electroplating tank;Pump body is connected in series on first pipeline;Second pipeline is vertically arranged and is installed in one end of first pipeline close to hanger, second pipeline has multiple liquid outlets;Deflector is arc plate, and hanger is located inside deflector.The present application can make the electroplating solution with high nickel ion concentration circulate around the plated part, while it can also improve the tangential velocity of the electroplating solution on the surface of the plated part, thereby reducing the overall diffusion layer thickness around the plated part, and further improving the deposition rate of the plated layer.

Description

Technical Field

[0001] This invention relates to the field of nickel electroplating equipment technology, and in particular to a nickel plating apparatus and method for nickel plating. Background Technology

[0002] Nickel plating exhibits good ductility, high hardness, corrosion resistance, and contamination resistance, making it a common undercoat for fine plating and chromium plating. In nickel plating processes, increasing the deposition rate can significantly improve labor productivity; therefore, further enhancing the deposition rate of electroplated nickel has become a hot topic in nickel plating technology research.

[0003] Patent application number CN202121825897.3 discloses a nickel plating device for a nickel plating process, including a box body. The nickel plating device mainly consists of a box body and a box cover, and the inside of the box cover is hollow. The inside of the box body is provided with an electroplating tank, which is divided into several sections. An electric pump is installed on one side of the inner wall of the electroplating tank. The inside of the box body has a through hole. The surface edge of the box body has a connecting groove. A vent pipe is installed on the top of the surface of the box cover and passes through the middle of the box cover to connect to the inside of the nickel plating device. Heat dissipation vents are provided on both edges of the surface of the box cover, and a base is welded to the bottom of the box body.

[0004] The above-mentioned device improves the deposition rate of electroplated nickel by stirring with stirring blades. However, the stirring area of ​​this method is limited, resulting in a large difference in the thickness of the diffusion layer around the product, which affects the deposition rate of the plating layer. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a nickel plating apparatus and method for electroplating, so as to solve the problem that existing nickel plating apparatuses cause large differences in the thickness of the diffusion layer around the product, which affects the deposition rate of the plating layer.

[0006] To achieve the above objectives, the present invention provides a nickel plating apparatus for electroplating, comprising an electroplating tank, a plating fixture, a first pipe, a pump body, a second pipe, and a guide plate, wherein...

[0007] The hanger includes a vertical rod, on which multiple clamping units are provided. Each clamping unit includes a first clamping plate, a second clamping plate, and a bolt. The bolt passes through the second clamping plate and is threadedly connected to the first clamping plate.

[0008] The two ends of the first pipe are located on both sides inside the electroplating tank;

[0009] The pump body is connected in series with the first pipeline;

[0010] The second pipe is vertically installed at the end of the first pipe near the hanger, and the second pipe has multiple liquid outlets;

[0011] The guide plate is an arc-shaped plate, and the hanger is located inside the guide plate. The hanger serves as the cathode, and metallic nickel serves as the anode. When the pump is working, it extracts the portion of the electroplating solution with a high nickel ion concentration near the anode from the electroplating tank and sprays it into the inner side of the guide plate through the second pipe. The electroplating solution with a high nickel ion concentration flows along the interior of the guide plate, increasing the tangential flow velocity of the electroplating solution on the surface of the plated part and reducing the thickness of the diffusion layer.

[0012] Optionally, the guide plate has multiple through holes on the side near the anode, the inner wall of the electroplating tank is provided with a baffle, and the inner wall of the electroplating tank has a first arc-shaped protrusion. The electroplating solution flowing out along the guide plate flows to the anode through the guiding effect of the baffle and the first arc-shaped protrusion, and pushes a portion of the electroplating solution with a high nickel ion concentration at the anode to the cathode through the through holes.

[0013] During operation, the electroplating solution flowing out along the guide plate will flow towards the anode through the guiding effect of the baffle and the first arc-shaped protrusion. This will push a portion of the electroplating solution with a high nickel ion concentration at the anode to the cathode through the through hole, thereby further reducing the thickness of the diffusion layer and increasing the coating deposition rate.

[0014] Optionally, the first clamping plate is provided with hooks for placing plated parts that are easy to hang.

[0015] Optionally, the first pipe is provided with a branch pipe, a first solenoid valve is connected in series on the branch pipe, a second solenoid valve is connected in series on the first pipe, the top of the guide plate has a cavity, the cavity is connected to the branch pipe, and multiple outlet pipes are connected to the cavity. The electroplating solution with high nickel ion concentration at the anode flows downward through the outlet pipes and passes over the plated parts, thereby increasing the tangential flow velocity of the electroplating solution on the surface of the plated parts and reducing the thickness of the diffusion layer.

[0016] Optionally, the bottom of the electroplating tank is provided with a second arc-shaped protrusion, which is located below the guide plate. The electroplating liquid sprayed from the outlet pipe flows downward and is guided to the anode by the second arc-shaped protrusion.

[0017] Optionally, the device includes a cleaning unit for cleaning oil stains on the plated parts.

[0018] Optionally, the cleaning unit includes a cleaning tank and a transfer unit. The bottom of the cleaning tank is rotatably connected to a first base. The outer surface of the cleaning tank is provided with a first tooth. The first tooth meshes with a first gear. The first gear is driven by a first motor. The transfer unit is used to transfer the hanger from the cleaning tank to the electroplating tank.

[0019] Optionally, the transfer unit includes a second base, on which a hydraulic cylinder is rotatably connected. A bracket is provided on the telescopic shaft of the hydraulic cylinder, and the hanger is mounted on the bracket. A second convex tooth is fixedly sleeved on the hydraulic cylinder, and the second convex tooth meshes with a second gear. The second gear is driven by a second motor.

[0020] Optionally, the cleaning tank is equipped with multiple cleaning balls, which enhance the cleaning effect of the plated parts through friction between the cleaning balls and the plated parts.

[0021] Based on the same invention, the present invention also provides a nickel plating method using a nickel plating apparatus for electroplating, comprising:

[0022] Install the plated part onto the hanger;

[0023] The mounting bracket serves as the cathode, and metallic nickel serves as the anode;

[0024] During the electroplating process, the pump extracts the portion of the electroplating solution with a high nickel ion concentration near the anode from the electroplating tank. This portion of the electroplating solution passes through the first pipe and is then sprayed onto the inner side of the guide plate through the second pipe. The electroplating solution with a high nickel ion concentration flows along the inside of the guide plate, increasing the tangential flow velocity of the electroplating solution on the surface of the plated part, thereby reducing the thickness of the diffusion layer.

[0025] When using this device to plate nickel on a workpiece, an appropriate amount of electroplating solution is added to the electroplating tank. The workpiece is clamped between the first and second clamping plates by rotating the bolts. The hanger serves as the cathode, and metallic nickel serves as the anode. During the electroplating process, the pump works to extract the portion of the electroplating solution with a high nickel ion concentration near the anode from the electroplating tank. This portion of the electroplating solution passes through the first pipe and is then sprayed onto the inner side of the guide plate through the second pipe. The electroplating solution with a high nickel ion concentration flows along the inside of the guide plate, increasing the tangential flow velocity of the electroplating solution on the surface of the workpiece, thereby reducing the thickness of the diffusion layer.

[0026] As can be seen from the above, the present invention enables the electroplating solution with a high nickel ion concentration to surround the plated part, and at the same time can increase the tangential flow rate of the electroplating solution on the surface of the plated part, thereby reducing the overall diffusion layer thickness around the plated part and thus increasing the deposition rate of the plating layer. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a top view of the electroplating tank according to an embodiment of the present invention;

[0029] Figure 2 This is a side view of the second pipe in an embodiment of the present invention;

[0030] Figure 3 This is a front view of the electroplating tank according to an embodiment of the present invention;

[0031] Figure 4 This is a top view of the liquid outlet pipe according to an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the clamping unit according to an embodiment of the present invention;

[0033] Figure 6 This is a top view of the cleaning tank according to an embodiment of the present invention;

[0034] Figure 7 This is a front view of the cleaning tank according to an embodiment of the present invention.

[0035] The diagram is marked as follows:

[0036] 1. Electroplating tank; 2. First pipe; 3. Pump body; 4. Second pipe; 5. Guide plate; 6. Vertical rod; 7. First clamping plate; 8. Second clamping plate; 9. Bolt; 10. Through hole; 11. Baffle; 12. First arc-shaped protrusion; 13. Hook; 14. Branch pipe; 15. First solenoid valve; 16. Second solenoid valve; 17. Discharge pipe; 18. Second arc-shaped protrusion; 19. Cleaning tank; 20. First base; 21. First tooth; 22. First gear; 23. First motor; 24. Second base; 25. Hydraulic cylinder; 26. Bracket; 27. Second tooth; 28. Second gear; 29. ​​Second motor; 30. Cleaning ball. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments.

[0038] It should be noted that, unless otherwise defined, the technical or scientific terms used in this invention should have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0039] Increasing the deposition rate of plating coatings can significantly improve labor productivity; therefore, how to further improve the deposition rate of electroplated nickel has become one of the hot topics in nickel plating process research. The deposition rate is related to the current density; the higher the current density, the faster the nickel ions move, and the faster the deposition rate.

[0040] According to electrodeposition theory, during electroplating, nickel ions adsorbed on the cathode surface gain electrons and are reduced to nickel atoms, which lowers the concentration of nickel ions near the cathode. Therefore, a nickel ion concentration gradient forms near the cathode. The electroplating solution with a lower nickel ion concentration than the main plating solution forms the diffusion layer. A thicker diffusion layer results in a lower current density, which affects the deposition rate. Therefore, this invention aims to improve the deposition rate by reducing the overall thickness of the diffusion layer.

[0041] like Figures 1 to 3 As shown, a nickel plating apparatus for electroplating includes an electroplating tank 1, a hanger, a first pipe 2, a pump body 3, a second pipe 4, and a guide plate 5, wherein...

[0042] The hanger includes a vertical rod 6, on which multiple clamping units are provided. Each clamping unit includes a first clamping plate 7, a second clamping plate 8, and a bolt 9. The bolt 9 passes through the second clamping plate 8 and is threadedly connected to the first clamping plate 7.

[0043] The two ends of the first pipe 2 are located on both sides inside the electroplating tank 1;

[0044] Pump body 3 is connected in series with first pipe 2;

[0045] The second pipe 4 is vertically installed and located at the end of the first pipe 2 near the hanger. The second pipe 4 has multiple liquid outlets.

[0046] The guide plate 5 is an arc-shaped plate, and the hanger is located inside the guide plate 5. The hanger serves as the cathode, and metallic nickel serves as the anode. When the pump body 3 is working, it extracts the part of the electroplating solution with a high nickel ion concentration near the anode in the electroplating tank 1 and sprays it into the inner side of the guide plate 5 through the second pipe 4. The electroplating solution with a high nickel ion concentration flows along the inside of the guide plate 5, increasing the tangential flow velocity of the electroplating solution on the surface of the plated part and reducing the thickness of the diffusion layer.

[0047] When using this device to plate nickel on a workpiece, an appropriate amount of electroplating solution is added to the electroplating tank 1. The workpiece is clamped between the first clamping plate 7 and the second clamping plate 8 by rotating the bolt 9. The hanger serves as the cathode, and metallic nickel serves as the anode. During the electroplating process, the pump 3 operates to extract the portion of the electroplating solution with a high nickel ion concentration near the anode in the electroplating tank 1. This portion of the electroplating solution passes through the first pipe 2 and is then sprayed through the second pipe 4 onto the inner side of the guide plate 5. The electroplating solution with a high nickel ion concentration flows along the inside of the guide plate 5, increasing the tangential flow velocity of the electroplating solution on the surface of the workpiece, thereby reducing the thickness of the diffusion layer.

[0048] As can be seen from the above, the present invention enables the electroplating solution with a high nickel ion concentration to surround the plated part, and at the same time can increase the tangential flow rate of the electroplating solution on the surface of the plated part, thereby reducing the overall diffusion layer thickness around the plated part and thus increasing the deposition rate of the plating layer.

[0049] The table below shows the relationship between the plating solution flow rate and the deposition rate in the pump body.

[0050] Deposition rate 0.2μm / min 0.4μm / min 0.5μm / min 0.4μm / min

[0051] In some embodiments, the guide plate 5 has a plurality of through holes 10 on the side near the anode, the inner wall of the electroplating tank 1 is provided with a baffle 11, and the inner wall of the electroplating tank 1 has a first arc-shaped protrusion 12. The electroplating liquid flowing out along the guide plate 5 flows to the anode through the guiding effect of the baffle 11 and the first arc-shaped protrusion 12, and pushes a portion of the electroplating liquid with a high nickel ion concentration at the anode to the cathode through the through holes 10.

[0052] During operation, the electroplating solution flowing out along the guide plate 5 will flow towards the anode through the guiding effect of the baffle 11 and the first arc-shaped protrusion 12. This will push a portion of the electroplating solution with a high nickel ion concentration at the anode to the cathode through the through hole 10, thereby further reducing the thickness of the diffusion layer and increasing the deposition rate of the coating.

[0053] In some embodiments, the first clamping plate 7 is provided with hooks 13 for placing plated parts that are easy to hang. Some plated parts are relatively thin and have holes, making them unsuitable for fixing by the clamping unit, but easy to hang. The design of the hooks 13 allows for the placement of plated parts that are easy to hang.

[0054] like Figure 4 and Figure 5As shown, in some embodiments, a branch pipe 14 is provided on the first pipe 2, a first solenoid valve 15 is connected in series on the branch pipe 14, a second solenoid valve 16 is connected in series on the first pipe 2, the top of the guide plate 5 has a cavity, the cavity is connected to the branch pipe 14, and multiple outlet pipes 17 are connected to the cavity. The electroplating solution with high nickel ion concentration at the anode flows downward through the outlet pipes 17 and passes over the plated parts, thereby increasing the tangential flow velocity of the electroplating solution on the surface of the plated parts and reducing the thickness of the diffusion layer.

[0055] For plated parts with a high concentration of nickel ions at the anode, if the plating solution flows tangentially towards the part horizontally, it can cause the part to wobble and become unstable. To solve this problem, this invention closes the second solenoid valve 16 and opens the first solenoid valve 15 during operation. The plating solution with a high concentration of nickel ions at the anode flows from the first pipe 2 to the branch pipe 14, then from the branch pipe 14 into the cavity, and then from the cavity into the outlet pipe 17. From the outlet pipe 17, it flows downwards past the plated part. This downward flow prevents the plated part from wobbling from side to side, improving the stability of the part. Simultaneously, it increases the tangential flow velocity of the plating solution on the surface of the plated part, reducing the thickness of the diffusion layer. This, in turn, improves the plating deposition rate.

[0056] In some embodiments, the bottom of the electroplating tank 1 is provided with a second arc-shaped protrusion 18, which is located below the guide plate 5. The electroplating liquid sprayed from the outlet pipe 17 flows downward and is guided to the anode by the second arc-shaped protrusion 18.

[0057] During operation, the electroplating solution sprayed from the outlet pipe 17 flows downward and is guided to the anode by the second arc-shaped protrusion 18. This allows a portion of the electroplating solution with a high nickel ion concentration at the anode to be pushed to the cathode through the through hole 10, which can further reduce the thickness of the diffusion layer and increase the deposition rate of the coating.

[0058] In some embodiments, the apparatus includes a cleaning unit for cleaning oil stains on the plated parts. Oil stains on the plated parts can affect the electroplating effect, so the plated parts must be cleaned before electroplating. To clean the plated parts, the present invention designs a cleaning unit.

[0059] like Figure 6 and Figure 7 As shown, optionally, the cleaning unit includes a cleaning tank 19 and a transfer unit. The bottom of the cleaning tank 19 is rotatably connected to a first base 20. The outer surface of the cleaning tank 19 is provided with a first tooth 21. The first tooth 21 meshes with a first gear 22. The first gear 22 is driven by a first motor 23. The transfer unit is used to transfer the hanger from the cleaning tank 19 to the electroplating tank 1.

[0060] Optionally, the transfer unit includes a second base 24, on which a hydraulic cylinder 25 is rotatably connected. A bracket 26 is provided on the telescopic shaft of the hydraulic cylinder 25, and a hanger is provided on the bracket 26. A second tooth 27 is fixedly sleeved on the hydraulic cylinder 25, and the second tooth 27 meshes with a second gear 28. The second gear 28 is connected to a second motor 29.

[0061] During cleaning, the plated parts are mounted on a hanger, which is placed in the cleaning tank 19. Water and cleaning solution are added to the cleaning tank 19. Then, the first motor 23 drives the first gear 22 to rotate, which in turn drives the first tooth 21 to rotate, thereby driving the cleaning tank 19 to rotate. This causes relative movement between the plated parts and the water, thus cleaning the plated parts. After cleaning and rinsing are completed, the hydraulic cylinder 25 extends to move the hanger away from the cleaning tank 19. Then, the second motor 29 drives the second gear 28 to rotate, which in turn drives the second tooth 27 to rotate, thereby driving the hydraulic cylinder 25 and the bracket 26 to rotate, so that the hanger is positioned above the electroplating tank 1. Then, the hydraulic cylinder 25 retracts, causing the hanger to fall into the electroplating tank 1 for electroplating.

[0062] As can be seen from the above, the present invention can clean the plated parts before electroplating. By rotating the cleaning tank 19, the water flow can generate relative motion with the plated parts, allowing the water flow to pass through some holes designed on the plated parts, thereby improving the cleaning effect of the plated parts.

[0063] In some embodiments, the cleaning tank 19 is provided with a plurality of cleaning balls 30, which improve the cleaning effect of the plated parts through friction between the cleaning balls 30 and the plated parts. When the cleaning tank 19 rotates, it causes the cleaning balls 30 to move relative to the plated parts, and at this time the cleaning balls 30 will rub against the plated parts, thereby improving the cleaning effect on the surface and pores of the plated parts.

[0064] To further implement the present invention, the present invention also provides a nickel plating method using a nickel plating apparatus for electroplating, comprising:

[0065] Install the plated parts onto the hanger;

[0066] The mounting bracket serves as the cathode, and metallic nickel serves as the anode.

[0067] During the electroplating process, the pump 3 works to extract the portion of the electroplating solution with a high concentration of nickel ions near the anode in the electroplating tank 1. This portion of the electroplating solution passes through the first pipe 2 and is then sprayed through the second pipe 4 onto the inner side of the guide plate 5. The electroplating solution with a high concentration of nickel ions flows along the inside of the guide plate 5, increasing the tangential flow velocity of the electroplating solution on the surface of the plated part, thereby reducing the thickness of the diffusion layer.

[0068] This method enables the high-nickel-ion-concentration electroplating solution to surround the workpiece, while also increasing the tangential flow rate of the electroplating solution on the workpiece surface, thereby reducing the overall diffusion layer thickness around the workpiece and thus increasing the coating deposition rate.

[0069] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the invention (including the claims) is limited to these examples; within the framework of the invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in the details for the sake of brevity.

[0070] This invention is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A nickel plating apparatus for electroplating, comprising an electroplating tank (1), characterized in that, It also includes a hanger, a first pipe (2), a pump body (3), a second pipe (4), and a guide plate (5). The hanger includes a vertical rod (6), on which multiple clamping units are provided. Each clamping unit includes a first clamping plate (7), a second clamping plate (8), and a bolt (9). The bolt (9) passes through the second clamping plate (8) and is threadedly connected to the first clamping plate (7). The two ends of the first pipe (2) are located on both sides inside the electroplating tank (1). The pump body (3) is connected in series to the first pipe (2). The second pipe (4) is vertically arranged and installed at the end of the first pipe (2) near the hanger. The second pipe (4) has multiple liquid outlets. The guide plate (5) is an arc-shaped plate. The hanger is located inside the guide plate (5). The hanger serves as... The cathode is made of metallic nickel as the anode. When the pump body (3) is working, it draws out the part of the electroplating solution with a high nickel ion concentration near the anode in the electroplating tank (1) and sprays it into the inner side of the guide plate (5) through the second pipe (4). The electroplating solution with a high nickel ion concentration flows along the inside of the guide plate (5), increasing the tangential flow velocity of the electroplating solution on the surface of the plated part and reducing the thickness of the diffusion layer. The guide plate (5) has multiple through holes (10) on the side near the anode. The inner wall of the electroplating tank (1) is provided with a baffle (11) and the inner wall of the electroplating tank (1) has a first arc-shaped protrusion (12). The electroplating solution flowing out along the guide plate (5) flows to the anode through the guiding effect of the baffle (11) and the first arc-shaped protrusion (12), pushing a part of the electroplating solution with a high nickel ion concentration at the anode to the cathode through the through holes (10).

2. The nickel plating apparatus for electroplating according to claim 1, characterized in that, The first clamping plate (7) is provided with a hook (13), which is used to place the plated parts that are easy to hang.

3. The nickel plating apparatus for electroplating according to claim 2, characterized in that, The first pipe (2) is provided with a branch pipe (14), a first solenoid valve (15) is connected in series on the branch pipe (14), a second solenoid valve (16) is connected in series on the first pipe (2), the top of the guide plate (5) has a cavity, the cavity is connected to the branch pipe (14), and multiple outlet pipes (17) are connected to the cavity. The electroplating solution with high nickel ion concentration at the anode flows downward through the outlet pipes (17) and passes over the plated parts, thereby increasing the tangential flow velocity of the electroplating solution on the surface of the plated parts and reducing the thickness of the diffusion layer.

4. The nickel plating apparatus for electroplating according to claim 3, characterized in that, The bottom of the electroplating tank (1) is provided with a second arc-shaped protrusion (18), which is located below the guide plate (5). The electroplating liquid sprayed from the liquid outlet pipe (17) flows downward to the anode through the guiding effect of the second arc-shaped protrusion (18).

5. The nickel plating apparatus for electroplating according to claim 1, characterized in that, The device includes a cleaning section for cleaning oil stains on the plated parts.

6. The nickel plating apparatus for electroplating according to claim 5, characterized in that, The cleaning unit includes a cleaning tank (19) and a transfer unit. The bottom of the cleaning tank (19) is rotatably connected to a first base (20). The outer surface of the cleaning tank (19) is provided with a first tooth (21). The first tooth (21) meshes with a first gear (22). The first gear (22) is driven by a first motor (23). The transfer unit is used to transfer the hanger from the cleaning tank (19) to the electroplating tank (1).

7. The nickel plating apparatus for electroplating according to claim 6, characterized in that, The transfer unit includes a second base (24), on which a hydraulic cylinder (25) is rotatably connected. A bracket (26) is provided on the telescopic shaft of the hydraulic cylinder (25). The hanger is mounted on the bracket (26). A second tooth (27) is fixedly sleeved on the hydraulic cylinder (25). The second tooth (27) meshes with a second gear (28). The second gear (28) is connected to a second motor (29).

8. A nickel plating apparatus for electroplating according to claim 6, characterized in that, The cleaning tank (19) is equipped with multiple cleaning balls (30), and the cleaning effect of the plated parts is improved by the friction between the cleaning balls (30) and the plated parts.

9. A nickel plating method using a nickel plating apparatus according to any one of claims 1-8, characterized in that, include: The plated part is installed on the hanger; the hanger serves as the cathode and metallic nickel serves as the anode; during the electroplating process, the pump (3) works to extract the portion of the electroplating solution with a high nickel ion concentration near the anode in the electroplating tank (1). This portion of the electroplating solution passes through the first pipe (2) and is then sprayed through the second pipe (4) onto the inner side of the guide plate (5). The electroplating solution with a high nickel ion concentration flows along the inside of the guide plate (5), increasing the tangential flow velocity of the electroplating solution on the surface of the plated part, thereby reducing the thickness of the diffusion layer.

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