A server chip water cooling plate stirring cooling system

Abstract

This invention relates to a server chip water-cooled plate stirring cooling system, belonging to the field of server cooling technology. It includes a substrate mounted on a server motherboard chip, covered by a water-cooled plate with a box structure. A stirring mechanism is installed inside the water-cooled plate. The internal spaces of two water-cooled plates are connected by a connecting pipe. One water-cooled plate is connected to a water inlet pipe with an inlet at one end, and the other water-cooled plate is connected to an water outlet pipe with an outlet at one end. The stirring mechanism agitates the refrigerant liquid introduced into the water-cooled plate, disturbing the liquid and promoting strong convection and heat conduction heat transfer. This agitation and strong convection significantly improves heat transfer efficiency, resulting in higher equipment heat transfer efficiency, higher energy efficiency ratio, and lower chip surface temperature, greatly enhancing the server's computing density and performance.

Description

Technical Field

[0001] This invention relates to a stirring cooling system for a server chip water-cooled plate, belonging to the field of server cooling technology. Background Technology

[0002] With the development of high-performance computing, the increasing density of data centers, and the growing requirements for energy conservation and environmental protection, single air cooling can no longer meet the heat dissipation needs of servers. Cooling systems are evolving towards water cooling, liquid cooling, and hybrid air-water cooling. In hybrid air-water cooling systems, water cooling is used to dissipate heat from high-power components, removing most of the server's heat, while the remaining low-power components are cooled by air. This type of cooling system has the advantages of high economy, high heat dissipation efficiency, and environmental friendliness.

[0003] Traditional water-cooled plates typically use copper or aluminum to form cold plates and fins for heat exchange with water. Conventional cold plate heatsinks are rectangular or stepped, and these products, like similar ones, have poor heat transfer efficiency. Conventional cold plates are used in series or parallel connections for heat exchange. When multiple cold plates are connected in series, the liquid's temperature rises after being preheated by the preceding cold plates, reducing the cooling capacity of the subsequent cold plates. If a parallel connection is used, holes need to be drilled in the mainboard to install brackets to fix the manifold, requiring modification of the mainboard; it cannot be shared with air-cooled mainboards.

[0004] Therefore, how to provide a solution to the above-mentioned technical problems is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned problems by providing a server chip water-cooled plate stirring cooling system. This system utilizes a stirring mechanism to agitate the refrigerant liquid introduced into the water-cooled plate, achieving strong convection and heat conduction heat exchange. This agitation-induced strong convection heat exchange significantly improves heat exchange efficiency. Consequently, higher equipment heat exchange efficiency, a higher energy efficiency ratio, and lower chip surface temperature are achieved, greatly enhancing the server's computing density and performance.

[0006] This invention is achieved through the following technical solution:

[0007] A server chip water-cooled plate stirring and cooling system includes a substrate disposed on a server motherboard chip, a water-cooled plate with a box structure covering the substrate, a stirring mechanism inside the water-cooled plate, and the internal spaces of two water-cooled plates being connected by a connecting pipe. One water-cooled plate is connected to a water inlet pipe with a water inlet at one end, and the other water-cooled plate is connected to a water outlet pipe with a water outlet at one end.

[0008] The refrigerant liquid introduced into the water-cooled plate is stirred by a stirring mechanism, which agitates the refrigerant liquid in the water-cooled plate to achieve strong convection and heat conduction heat exchange. The strong convection heat exchange after stirring greatly improves the heat exchange efficiency, thereby obtaining higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, which greatly improves the computing density and performance of the server.

[0009] A further improvement of the present invention is that the stirring mechanism includes a stirring shaft with stirring blades mounted on it. The stirring shaft extends from the upper end of the water-cooled plate and is connected to a stirring motor. The stirring motor drives the stirring shaft and stirring blades to rotate, disturbing the refrigerant liquid inside the water-cooled plate, achieving strong convection and heat transfer through heat conduction. Strong convection heat transfer occurs after stirring.

[0010] A further improvement of the present invention is that the top end of the stirring shaft is provided with two channel steels, and the stirring motor is mounted on the two channel steels. The water-cooling plate has a thin-walled structure, and the channel steels at the top end of the water-cooling plate, on which the stirring motor is mounted, can improve the stability of the stirring mechanism during operation.

[0011] A further improvement of this invention is that each water-cooled plate contains four stirring mechanisms, with four stirring motors evenly distributed at the top of the water-cooled plate. The internal space of the water-cooled plate is flat and relatively low in height. When only one stirring mechanism is used, to effectively agitate the refrigerant liquid within the water-cooled plate, the stirring blades need to be very large, placing a heavy burden on the stirring motor and making it prone to malfunction. By evenly arranging four stirring mechanisms at the top of the water-cooled plate, the blade size can be significantly reduced, lowering the burden on the stirring motors and making the stirring mechanisms less prone to failure.

[0012] A further improvement of the present invention is that the water inlet pipe is connected to the water-cooling plate by a pipe clamp. Because the water inlet pipe is relatively long, using a pipe clamp to fix the water inlet pipe can prevent it from accidentally falling off.

[0013] A further improvement of the present invention is that the inlet and outlet of the water-cooled plate are arranged diagonally. The refrigerant liquid enters the water-cooled plate from one corner and exits from the opposite corner, which helps to improve the stirring effect of the stirring mechanism on the refrigerant liquid and further improves the heat exchange efficiency.

[0014] A further improvement of the present invention is that a serpentine groove is provided on the bottom surface of the substrate, and a serpentine heat exchange tube is arranged within the serpentine groove. Two serpentine heat exchange tubes are connected by a connecting pipe II. One of the serpentine heat exchange tubes is connected to a water inlet pipe II, and the end of the water inlet pipe II is provided with a water inlet II. The other serpentine heat exchange tube is connected to a water outlet pipe II, and the end of the water outlet pipe II is provided with a water outlet II. The serpentine heat exchange tubes are in direct contact with the server chip below the substrate. Refrigerant liquid is introduced into the serpentine heat exchange tubes to further improve the heat exchange efficiency, thereby obtaining higher equipment heat exchange efficiency, higher energy efficiency ratio, and lower chip surface temperature, thus improving the computing density and performance of the server.

[0015] A further improvement of the present invention is that the second water inlet pipe is connected to the base plate by a pipe clamp. Because the second water inlet pipe is relatively long, using a pipe clamp to fix the second water inlet pipe can prevent the second water inlet pipe from accidentally falling off.

[0016] A further improvement of the present invention is that the inlet and outlet of the serpentine heat exchange tube are arranged diagonally within the substrate. The refrigerant liquid enters through the inlet of the serpentine heat exchange tube and flows out through the outlet, which helps to improve heat exchange efficiency and facilitates the arrangement of pipelines.

[0017] A further improvement of the present invention is that the substrate is mounted on the server motherboard using screws.

[0018] Compared with the prior art, the beneficial effects of this invention are:

[0019] The refrigerant liquid introduced into the water-cooled plate is stirred by a stirring mechanism, which agitates the refrigerant liquid in the water-cooled plate to achieve strong convection and heat conduction heat exchange. The strong convection heat exchange after stirring greatly improves the heat exchange efficiency, thereby obtaining higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, which greatly improves the computing density and performance of the server. Attached Figure Description

[0020] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a structural schematic diagram of a specific embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the stirring mechanism according to a specific embodiment of the present invention.

[0023] Figure 3 This is a bottom view of the substrate according to a specific embodiment of the present invention.

[0024] Figure 4 This is a bottom view of the substrate and serpentine heat exchange tube according to a specific embodiment of the present invention.

[0025] In the diagram: 1. Server motherboard; 2. Base plate; 3. Water-cooled plate; 4. Inlet 1; 5. Inlet pipe 1; 6. Outlet 1; 7. Outlet pipe 1; 8. Connecting pipe 1; 9. Pipe clamp; 10. Stirring mechanism; 11. Inlet 2; 12. Inlet pipe 2; 13. Outlet 2; 14. Outlet pipe 2; 15. Connecting pipe 2; 16. Stirring shaft; 17. Channel steel; 18. Stirring motor; 19. Stirring blades; 20. Serpentine groove; 21. Serpentine heat exchange tube. Detailed Implementation

[0026] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0027] like Figures 1 to 4 The server chip water-cooled plate stirring cooling system shown includes a substrate 2 disposed on a chip on a server motherboard 1, a water-cooled plate 3 with a box structure covering the substrate 2, a stirring mechanism 10 disposed inside the water-cooled plate 3, and the internal spaces of the two water-cooled plates 3 being connected by a connecting pipe 8. One water-cooled plate 3 is connected to a water inlet pipe 5, and the end of the water inlet pipe 5 is provided with a water inlet 4. The other water-cooled plate 3 is connected to a water outlet pipe 7, and the end of the water outlet pipe 7 is provided with a water outlet 6.

[0028] The stirring mechanism 10 stirs the refrigerant liquid introduced into the water-cooled plate 3, disturbing the refrigerant liquid in the water-cooled plate 3 to carry out strong convection and heat conduction heat exchange. Through strong convection heat exchange after stirring, the heat exchange efficiency is greatly improved, thereby obtaining higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, which greatly improves the computing density and performance of the server.

[0029] A further improvement of the present invention is that the stirring mechanism 10 includes a stirring shaft 16, on which stirring blades 19 are mounted. The stirring shaft 16 extends from the upper end of the water-cooled plate 3 and is connected to a stirring motor 18. The stirring motor 18 drives the stirring shaft 16 and the stirring blades 19 to rotate, disturbing the refrigerant liquid in the water-cooled plate 3, and performing strong convection and heat transfer. Strong convection heat transfer occurs after stirring.

[0030] The stirring shaft 16 has two channel steels 17 at its top, and the stirring motor 18 is mounted on the two channel steels 17. The water-cooled plate 3 has a thin-walled structure, and the channel steels 17 at the top of the water-cooled plate 3, on which the stirring motor 18 is mounted, can improve the stability of the stirring mechanism 10 during operation.

[0031] Each water-cooled plate 3 contains four stirring mechanisms 10, and four stirring motors 18 are evenly distributed at the top of the water-cooled plate 3. The internal space of the water-cooled plate 3 is flat and low in height. When only one stirring mechanism 10 is used, to effectively agitate the refrigerant liquid within the water-cooled plate 3, the stirring blades 19 need to be very large, placing a heavy burden on the stirring motors 18 and making them prone to failure. Evenly arranging four stirring mechanisms 10 at the top of the water-cooled plate 3 significantly reduces the size of the stirring blades 19, lowers the burden on the stirring motors 18, and makes the stirring mechanisms 10 less prone to failure.

[0032] The water inlet pipe 5 is connected to the water cooling plate 3 via a pipe clamp 9. Because the water inlet pipe 5 is relatively long, the pipe clamp 9 is used to fix the water inlet pipe 5 in order to prevent it from accidentally falling off.

[0033] In this design, the inlet and outlet of the water-cooled plate 3 are arranged diagonally. The refrigerant liquid enters the water-cooled plate 3 from one corner and exits from the opposite corner, which helps to improve the stirring effect of the stirring mechanism 10 on the refrigerant liquid and further improves the heat exchange efficiency.

[0034] The substrate 2 has a serpentine groove 20 on its bottom surface, within which a serpentine heat exchange tube 21 is arranged. Two serpentine heat exchange tubes 21 are connected by a connecting pipe 15. One of the serpentine heat exchange tubes 21 is connected to a water inlet pipe 12, with a water inlet 11 at its end. The other serpentine heat exchange tube 21 is connected to a water outlet pipe 14, with a water outlet 13 at its end. The serpentine heat exchange tubes 21 are in direct contact with the server chip below the substrate 2. Refrigerant liquid is introduced into the serpentine heat exchange tubes 21 to further improve heat exchange efficiency, thereby achieving higher equipment heat exchange efficiency, higher energy efficiency ratio, and lower chip surface temperature, thus improving the server's computing density and performance.

[0035] The second water inlet pipe 12 is connected to the base plate 2 via a pipe clamp 9. Because the second water inlet pipe 12 is relatively long, the pipe clamp 9 is used to fix the second water inlet pipe 12 to prevent it from accidentally falling off.

[0036] The inlet and outlet of the serpentine heat exchange tube 21 are arranged diagonally within the substrate 2. The refrigerant liquid enters through the inlet of the serpentine heat exchange tube 21 and flows out through the outlet, which helps to improve heat exchange efficiency and facilitates the arrangement of pipelines.

[0037] The base plate 2 is mounted on the server motherboard 1 using screws.

[0038] The server motherboard also includes a temperature sensor and control device. The chip's temperature is transmitted to the control device via the temperature sensor, automatically adjusting the rotation speed of the stirring mechanism 10 and the flow rate of the liquid entering and exiting the server. This allows for strong convection heat transfer within a fixed internal component structure, improving heat dissipation capacity by 25%. Furthermore, the internal temperature can be automatically controlled by adjusting the rotation speed of the stirring shaft 16 and the flow rate at the liquid inlet based on the temperature signal detected by the sensor. The enhanced stirring and disturbance significantly improves the heat exchange capacity between hot and cold liquids, greatly increasing heat exchange efficiency and ensuring the safe operation of heat-generating components throughout the server, thus extending the lifespan of internal components.

[0039] Working principle:

[0040] The stirring mechanism 10 stirs the refrigerant liquid introduced into the water-cooled plate 3, disturbing the refrigerant liquid in the water-cooled plate 3 to carry out strong convection and heat conduction heat exchange. Through strong convection heat exchange after stirring, the heat exchange efficiency is greatly improved, thereby obtaining higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature, which greatly improves the computing density and performance of the server.

[0041] The present invention also includes a cooling structure utilizing serpentine heat exchange tubes 21. A serpentine groove 20 is provided on the bottom surface of the substrate 2, and serpentine heat exchange tubes 21 are arranged within the groove. Two serpentine heat exchange tubes 21 are connected by a connecting pipe 2 15. One serpentine heat exchange tube 21 is connected to a water inlet pipe 2 12, with a water inlet 2 11 at its end. The other serpentine heat exchange tube 21 is connected to a water outlet pipe 2 14, with a water outlet 2 13 at its end. The serpentine heat exchange tubes 21 are in direct contact with the server chip below the substrate 2. Refrigerant liquid is introduced into the serpentine heat exchange tubes 21. Based on the stirring cooling mechanism, the heat exchange efficiency is further improved, thereby achieving higher equipment heat exchange efficiency, higher energy efficiency ratio, and lower chip surface temperature, thus improving the server's computing density and performance.

[0042] The server motherboard also features a temperature sensor and control device. The chip's temperature is transmitted to the control device via the temperature sensor, automatically adjusting the rotation speed of the stirring mechanism 10 and the flow rate of the inlet and outlet liquids. This allows for strong convection heat transfer within a fixed internal component structure, improving heat dissipation capacity by 25%. Furthermore, the internal temperature can be automatically controlled by adjusting the rotation speed of the stirring shaft 16 and the inlet flow rate based on the temperature signal detected by the sensor. The enhanced stirring and agitation significantly improves the heat exchange capacity between hot and cold liquids, greatly increasing heat exchange efficiency and ensuring the safe operation of heat-generating components throughout the server, thus extending the lifespan of internal components.

[0043] Each water-cooled plate 3 is equipped with one or four stirring mechanisms 10. Because the internal space of the water-cooled plate 3 is flat and low in height, when only one stirring mechanism 10 is installed, the stirring blades 19 need to be very large to effectively agitate the refrigerant liquid within the water-cooled plate 3. This places a heavy burden on the stirring motor 18, making it prone to failure. Installing four stirring mechanisms 10 significantly reduces the size of the stirring blades 19, lowers the burden on the stirring motor 18, and makes the stirring mechanisms 10 less prone to failure.

[0044] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0045] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0046] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A server chip water cold plate stirred cooling system, characterized in that, It includes a substrate (2) set on the chip of the server motherboard (1), a water-cooled plate (3) with a box structure covered on the substrate (2), a stirring mechanism (10) is provided inside the water-cooled plate (3), the internal spaces of the two water-cooled plates (3) are connected by a connecting pipe (8), one of the water-cooled plates (3) is connected to a water inlet pipe (5), the end of the water inlet pipe (5) is provided with a water inlet (4), and the other water-cooled plate (3) is connected to a water outlet pipe (7), the end of the water outlet pipe (7) is provided with a water outlet (6). The stirring mechanism (10) includes a stirring shaft (16), on which stirring blades (19) are installed. The stirring shaft (16) extends from the upper end of the water-cooled plate (3) and is connected to a stirring motor (18). The top of the stirring shaft (16) is provided with two channel steels (17), and the stirring motor (18) is installed on the two channel steels (17); Each water-cooled plate (3) is equipped with four stirring mechanisms (10), and four stirring motors (18) are evenly distributed at the top of the water-cooled plate (3); The server motherboard is also equipped with a temperature sensor and a control device. The temperature of the chip is transmitted to the control device through the temperature sensor, thereby automatically adjusting the speed of the stirring mechanism (10) and the flow rate of the liquid entering and leaving the machine. Under the condition that the internal component structure of the server is fixed, strong convection heat exchange is achieved, and the heat dissipation capacity is increased by 25%. The internal temperature is automatically controlled by automatically adjusting the speed of the stirring shaft (16) and the flow rate of the liquid inlet through the temperature signal detected by the sensor. The stirring enhances the disturbance, improves the heat exchange capacity and efficiency of the hot and cold liquids, ensures the safe operation of the heat-generating components in the entire server and increases the service life of the internal components.

2. The server chip water-cooled plate stirring cooling system according to claim 1, characterized in that, The water inlet pipe (5) is connected to the water cooling plate (3) via a pipe clamp (9).

3. The server chip water-cooled plate stirring cooling system according to claim 1, characterized in that, The water inlet and outlet of the water-cooled plate (3) are arranged diagonally.

4. The server chip water-cooled plate stirring cooling system according to claim 1, characterized in that, The substrate (2) has a serpentine groove (20) on its bottom surface. A serpentine heat exchange tube (21) is arranged in the serpentine groove (20). The two serpentine heat exchange tubes (21) are connected by a connecting pipe (15). One of the serpentine heat exchange tubes (21) is connected to a water inlet pipe (12), and the end of the water inlet pipe (12) is provided with a water inlet (11). The other serpentine heat exchange tube (21) is connected to a water outlet pipe (14), and the end of the water outlet pipe (14) is provided with a water outlet (13).

5. The server chip water-cooled plate stirring cooling system according to claim 4, characterized in that, The second water inlet pipe (12) is connected to the base plate (2) via a pipe clamp (9).

6. The server chip water-cooled plate stirring cooling system according to claim 4, characterized in that, The inlet and outlet of the serpentine heat exchange tube (21) are arranged diagonally within the substrate (2).

7. The server chip water-cooled plate stirring cooling system according to claim 4, characterized in that, The substrate (2) is mounted on the server motherboard (1) using screws.

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