Coil substrate for image stabilization

Abstract

A coil substrate according to an embodiment includes: an insulating layer; a first coil pattern portion disposed on one surface of the insulating layer; a second coil pattern portion disposed on another surface of the insulating layer; and a pad portion disposed on the one surface of the insulating layer and connected to the first coil pattern portion, wherein the first coil pattern portion includes: an inner coil pattern portion; and an outer coil pattern portion spaced apart from the inner coil pattern portion and disposed outside the inner coil pattern portion, wherein the pad portion is disposed between the inner coil pattern portion and the outer coil pattern portion.

Description

Technical Field

[0001] The embodiments relate to a coil substrate for image stabilization and a camera module including the coil substrate. Background Technology

[0002] With the widespread use of various portable terminals and the commercialization of wireless internet services, consumer demands related to portable terminals have diversified, leading to the installation of various add-on devices in portable terminals.

[0003] One representative example is the camera module, which can capture objects in photos or moving images, store image data, and then edit and transmit the image data as needed.

[0004] In recent years, there has been an increasing demand for small camera modules for various multimedia applications (e.g., laptop computers, camera phones, PDAs, smart devices, toys, etc.) and image input devices (e.g., information terminals for surveillance cameras and video recorders).

[0005] Traditional camera modules can be roughly divided into types such as fixed-focus (FF), autofocus (AF), and optical image stabilization (OIS).

[0006] Meanwhile, the OIS type may include a coil pattern disposed on a circuit board as a component for implementing the anti-shake function. In this case, the coil pattern includes multiple curved areas, and the photosensitive pattern collapses in the curved areas during the process, causing the coil electrodes included in the coil pattern to short-circuit with each other.

[0007] Therefore, there is a need for a coil pattern that can improve reliability by solving the above problems, and a camera module that includes the coil pattern. Summary of the Invention

[0008] Technical issues

[0009] The embodiments are intended to provide a coil substrate with improved reliability and a camera module including the coil substrate.

[0010] The embodiments aim to provide a coil substrate and a camera module including the coil substrate, the coil substrate having a structure that maximizes the Lorentz force generated in the coil substrate within a limited space.

[0011] The embodiments aim to provide a coil substrate and a camera module including the coil substrate, the coil substrate having a structure in which pad portions and coil patterns are disposed on the same layer.

[0012] The technical problems to be solved by the embodiments are not limited to the above-mentioned technical problems. Those skilled in the art to which this invention pertains can clearly understand another technical problem not mentioned through the following description.

[0013] Technical solution

[0014] According to an embodiment, a coil substrate includes: an insulating layer; a first coil pattern portion disposed on one surface of the insulating layer; a second coil pattern portion disposed on another surface of the insulating layer; and a pad portion disposed on the one surface of the insulating layer and connected to the first coil pattern portion, wherein the first coil pattern portion includes: an inner coil pattern portion; and an outer coil pattern portion spaced apart from the inner coil pattern portion and disposed outside the inner coil pattern portion, wherein the pad portion is disposed between the inner coil pattern portion and the outer coil pattern portion.

[0015] Furthermore, the second coil pattern portion is formed by winding from the inside out on another surface of the insulating layer in the same direction as the inner coil pattern portion and the outer coil pattern portion.

[0016] In addition, the pad portion includes: a first pad portion connected to one end of the outer coil pattern portion; and a second pad portion connected to the other end of the inner coil pattern portion.

[0017] Furthermore, the first pad portion includes: a first-1 unit pad connected to one end of the outer coil pattern portion; a first-2 unit pad spaced apart from the first-1 unit pad; and a first connecting pattern connecting the first-1 unit pad and the first-2 unit pad; wherein the second pad portion includes: a second-1 unit pad connected to the other end of the inner coil pattern portion; a second-2 unit pad spaced apart from the second-1 unit pad; and a second connecting pattern connecting the second-1 unit pad and the second-2 unit pad.

[0018] In addition, the coil substrate further includes: a first via through the insulating layer, one surface of the first via being connected to the other end of the outer coil pattern portion, and the other surface of the first via being connected to the other end of the second coil pattern portion; and a second via through the insulating layer, one surface of the second via being connected to one end of the inner coil pattern portion, and the other surface of the second via being connected to one end of the second coil pattern portion.

[0019] Furthermore, the outer width of the first coil pattern portion corresponding to the outer width of the outer coil pattern portion is the same as the outer width of the second coil pattern portion, and the inner width of the first coil pattern portion corresponding to the inner width of the inner coil pattern portion is the same as the inner width of the second coil pattern portion.

[0020] In addition, the coil substrate further includes: a first virtual pattern portion disposed on one surface of the insulating layer and spaced apart from the first coil pattern portion; and a second virtual pattern portion disposed on the other surface of the insulating layer and spaced apart from the second coil pattern portion.

[0021] Furthermore, the first virtual pattern portion is formed between the outer coil and the inner coil.

[0022] Furthermore, at least one of the first coil pattern portion and the second coil pattern portion includes: a first region extending along a first direction; a second region extending along a second direction different from the first direction; and a third region in which the orientation of the coil pattern portion changes between the first region and the second region; wherein the spacing between the coil pattern portions in the third region is larger than the spacing between the coil pattern portions in the first region or the second region.

[0023] Furthermore, at least one of the inner coil pattern portion, the outer coil pattern portion, and the second coil pattern portion includes: a first portion disposed on the innermost side; a second portion disposed on the outermost side; and a third portion disposed between the first portion and the second portion; and wherein at least one of the line width of the first portion and the line width of the second portion is larger than the line width of the third portion.

[0024] On the other hand, the camera module according to an embodiment includes: a first mover disposed on a side surface of a lens portion to move the lens portion; a second mover disposed opposite to the first mover on the side surface of the first mover; a stator disposed opposite to the lower side of the second mover to move the second mover, and the stator having a through hole formed in the center corresponding to the lens portion; and a base supporting the stator and the second mover, and the base having a hollow hole in the center corresponding to the through hole of the second mover; wherein the stator includes a drive substrate and two or more coil substrates disposed on the drive substrate, wherein each of the coil substrates includes: an insulating layer; a first coil pattern portion disposed on one surface of the insulating layer; a second coil pattern portion disposed on another surface of the insulating layer; and a pad portion disposed on one surface of the insulating layer and connected to the first coil pattern portion, wherein the first coil... The pattern portion includes: an inner coil pattern portion; and an outer coil pattern portion, the outer coil pattern portion being spaced apart from the inner coil pattern portion by a predetermined interval and disposed outside the inner coil pattern portion, wherein the pad portion includes: a first through-hole, the first through-hole passing through the insulating layer, and one surface of the first through-hole being connected to the other end of the outer coil pattern portion, and the other surface of the first through-hole being connected to the other end of the second coil pattern portion; and a second through-hole, the second through-hole passing through the insulating layer, one surface of the second through-hole being connected to one end of the inner coil pattern portion, and the other surface of the second through-hole being connected to one end of the second coil pattern portion.

[0025] Beneficial effects

[0026] According to an embodiment, the coil substrate includes a first coil pattern portion 820 disposed on the lower surface of the insulating layer 810 and a second coil pattern portion 830 disposed on the upper surface of the insulating layer 810. In this case, the first coil pattern portion 820 and the second coil pattern portion 830 can be wound from the inside out in the same direction. Therefore, by forming the first coil pattern portion 820 and the second coil pattern portion 830 to be wound from the inside out in the same direction, the process of forming the coil pattern on the insulating layer 810 in this embodiment can be simplified. Furthermore, since the current flows in the same direction in the inner / outer coil of the first coil pattern portion 820 in this embodiment, the Lorentz force generated according to the rotation direction of the coil can be maximized. In addition, the Lorentz force for OIS can be ensured using only two layers of coil pattern.

[0027] Furthermore, the first coil pattern portion 820 of this embodiment includes: an outer coil pattern portion 821 disposed on its outer side, with a first pad portion 840a and a second pad portion 840b located between them; and an inner coil pattern portion 822 disposed on its inner side. In this embodiment, the coil pattern portion and the pad portion are disposed on the same layer, thus eliminating the need for a separate layer to form the pad portion, thereby simplifying the manufacturing process and reducing manufacturing costs. Furthermore, since the number of turns in the first coil pattern portion 820 can be increased, the Lorentz force generated by the first coil pattern portion 820 can be maximized, thus ensuring the operational reliability of the OIS with only a two-layer structure.

[0028] Furthermore, the coil pattern portion of this embodiment includes an inner coil pattern portion 822 and an outer coil pattern portion 821. The inner coil pattern portion 822 and the outer coil pattern portion 821 are respectively disposed on the outer and inner sides of the first pad portion 840a and the second pad portion 840b, rather than on one side of the first pad portion 840a and the second pad portion 840b. Therefore, the overall width of the outer side of the first coil pattern portion 820 can be kept to the maximum, thereby increasing the strength of the Lorentz force. In addition, by disposing of the inner coil pattern portion 822 and the outer coil pattern portion 821 on each of the outer and inner sides of the first pad portion 840a and the second pad portion 840b, the position can be balanced with the magnet portion in the vertical direction of the embodiment. In other words, the phenomenon that the Lorentz force generated when the first coil exists only on one side of the inner / outer side is minimized, thus improving the reliability of OIS operation.

[0029] Furthermore, the bonding between the drive substrate 410 and the coil substrate is not performed using only a single unit pad, but rather using multiple unit pads to perform bonding at multiple locations between the terminals of the drive substrate 410 and the coil substrate. Therefore, the contact area between the terminals of the drive substrate and the pad portions of the coil substrate according to the embodiment can be increased, thereby improving mutual electrical connectivity.

[0030] Furthermore, in this embodiment, the first virtual pattern portion 850 and the second virtual pattern portion 860 are formed in the areas on the upper and lower surfaces of the insulating layer 810 where the first coil pattern portion 820 and the second coil pattern portion 830 are not provided. Therefore, by forming the first virtual pattern portion 850 and the second virtual pattern portion 860, the electroplating area performed in the entire area of ​​the insulating layer can be made uniform, and thus the plating thickness of the first coil pattern portion 820 and the second coil pattern portion 830 can be uniformly controlled.

[0031] Therefore, the thickness of the coil pattern portion used to prevent hand shake in the camera module according to the embodiment can be sufficiently ensured, thereby reducing the resistance of the coil substrate. Consequently, the electromotive force of the coil substrate can be sufficiently generated, thereby improving the characteristics of the coil substrate and enhancing the hand shake prevention characteristics of the camera module including the coil substrate.

[0032] Furthermore, the spacing of the coil pattern portions can be formed differently for each region in the coil substrate of the embodiment. Specifically, the coil pattern portions can be formed such that the spacing between patterns in the curved region is larger than the spacing between patterns in other regions. Therefore, when forming the coil pattern portions of the embodiment, the linewidth of the photosensitive pattern can be increased, thereby preventing the photosensitive pattern, which is weakly supported in the curved region, from collapsing. Specifically, by forming a photosensitive pattern larger than that in other regions in the curved region achieved with the fine linewidth of this embodiment, the photosensitive pattern can be stably formed even in the curved region. Therefore, the coil substrate according to the embodiment can prevent short circuits between coil patterns in the curved region, thereby improving reliability.

[0033] Furthermore, the linewidths of the innermost and / or outermost coil pattern portions in the coil substrate of the embodiment can be formed to be different from the linewidths of the patterns disposed between them. Specifically, the linewidths of the innermost and / or outermost coil pattern portions in the embodiment can be formed to be larger than the linewidths of the patterns disposed between them. Therefore, in the embodiment, the resistance can be reduced by increasing the pattern linewidth, which is a variable in the resistance of the coil pattern portion. Attached Figure Description

[0034] Figure 1 This is a perspective view of a camera module according to an embodiment;

[0035] Figure 2 This is an exploded perspective view of the camera module according to an embodiment;

[0036] Figure 3a This is an exploded perspective view showing a partial configuration of a camera module according to an embodiment;

[0037] Figure 3b yes Figure 3a A view showing the combination of the driving substrate and the coil substrate;

[0038] Figure 3c yes Figure 3a A schematic cross-sectional view of the coil substrate;

[0039] Figure 4 This is a top view of the coil substrate according to the first embodiment;

[0040] Figure 5 This is a bottom view of the coil substrate according to the first embodiment;

[0041] Figure 6 This is a view used to illustrate an example of the arrangement of the first coil pattern section according to the comparative example;

[0042] Figure 7a This is a top view of a variant of the coil substrate;

[0043] Figure 7b This is a bottom view of a variant of the coil substrate;

[0044] Figure 8a This is a top view of a coil substrate according to another embodiment. Figure 8b This is a bottom view of a coil substrate according to another embodiment;

[0045] Figure 9 This is a view showing a variant example of the first pad portion and the second pad portion according to the embodiment;

[0046] Figure 10a This is a top view showing a coil substrate according to an exemplary embodiment;

[0047] Figure 10b It is along Figure 10a A sectional view taken from region A-A';

[0048] Figure 10c It is along Figure 10a A sectional view taken from region B-B';

[0049] Figure 10d yes Figure 10a A magnified view of region R1;

[0050] Figure 11a This is a bottom view showing a coil substrate according to an exemplary embodiment;

[0051] Figure 11b This illustrates the following according to an exemplary embodiment: Figure 11a The view of the section view taken from region C-C';

[0052] Figure 11c This illustrates the following according to another embodiment: Figure 11a The view of the section view taken from region C-C';

[0053] Figure 11d yes Figure 11a A magnified view of region R2. Detailed Implementation

[0054] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0055] However, the spirit and scope of this disclosure are not limited to the embodiments described, and may be implemented in a variety of other forms, and one or more elements of the embodiments may be selectively combined and replaced within the spirit and scope of this disclosure.

[0056] Furthermore, unless otherwise explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of this disclosure are to be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains, and terms (e.g., terms defined in common dictionaries, etc.) are to be interpreted as having a meaning consistent with their meaning in the relevant technical context. Moreover, the terminology used in the embodiments of this invention is for descriptive purposes only and is not intended to limit the invention.

[0057] In this specification, unless specifically stated in the phrase, the singular form may also include the plural form, and may include at least one of all combinations of A, B, and C that can be combined when describing “at least one (or more) of A, B, and C”. Furthermore, when describing elements of embodiments of this disclosure, terms such as first, second, A, B, (a), and (b) may be used.

[0058] These terms are used only to distinguish an element from other elements, and are not limited to the nature, order, or sequence of the elements. Furthermore, when an element is described as being “connected,” “coupled,” or “linked” to another element, it may include not only cases where the element is directly “connected,” “coupled,” or “linked” to the other element, but also cases where the element is “connected,” “coupled,” or “linked” to another element through which the element connects to that other element.

[0059] Furthermore, when described as being formed or disposed "above" or "below" each element, "above" or "below" can include not only the case where two elements are directly connected to each other, but also the case where one or more other elements are formed or arranged between the two elements. Moreover, when expressed as "above" or "below," it can include not only the case based on the upward direction of an element, but also the case based on the downward direction of an element.

[0060] In the following description, a circuit board according to an embodiment will be described with reference to the accompanying drawings.

[0061] Figure 1 This is a perspective view of the camera module according to an embodiment. Figure 2 This is an exploded perspective view of the camera module according to an embodiment. Figure 3a This is an exploded perspective view showing a partial configuration of the camera module according to an embodiment. Figure 3b yes Figure 3a A view showing the combination of the driving substrate and the coil substrate. Figure 3c yes Figure 3a A schematic cross-sectional view of the coil substrate.

[0062] In the following text, "optical axis direction" can be defined as the optical axis direction of the lens module when the lens module is combined with the camera module. Furthermore, "optical axis direction" can be used interchangeably with "vertical direction," "z-axis direction," and "vertical direction."

[0063] As used below, "autofocus function" can be defined as the function of automatically matching the focus relative to the object by adjusting the distance from the image sensor by moving the lens module in the direction of the optical axis. "Autofocus" can be used interchangeably with "AF". "Shake correction function" as used below can be defined as the function of moving or tilting the lens module in a direction perpendicular to the optical axis to counteract vibrations (movements) caused by external forces on the image sensor. "Shake correction" can be used interchangeably with "OIS (Optical Image Stabilization)".

[0064] The configuration of an optical device including a camera module according to this embodiment will be described below.

[0065] The optical device according to this embodiment can be a mobile phone, a smartphone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), a PMP (portable multimedia player), and a navigation device, but the embodiment is not limited to these, and may include any device capable of capturing images or photographs.

[0066] The optical device according to this embodiment may include a main body (not shown), a display unit (not shown) disposed on a surface of the main body to display information, and a camera (not shown) mounted on the main body for capturing images or photographs and having a camera module (not shown).

[0067] The configuration of the camera module according to this embodiment will be described below.

[0068] The camera module may also include a lens module (not shown), an infrared cutoff filter (not shown), a PCB (printed circuit board, not shown), an image sensor (not shown), and a controller (not shown).

[0069] A lens module may include at least one or more lenses. A lens module may include lenses and a lens barrel. A lens module may include one or more lenses (not shown) and a lens barrel housing the one or more lenses. However, an element of the lens module is not limited to the lens barrel; any retainer structure capable of supporting one or more lenses is sufficient. The lens module may be coupled to a camera module and move with the camera module. For example, the lens module may be coupled internally to the camera module. For example, the lens module may be threaded onto the camera module. For example, the lens module may be coupled to the camera module using an adhesive (not shown). Meanwhile, light passing through the lens module can illuminate the image sensor.

[0070] An infrared cut-off filter can be used to prevent light in the infrared region from entering the image sensor. For example, an infrared cut-off filter can be inserted between the lens module and the image sensor. The infrared cut-off filter can be located in a retainer member (not shown) formed separately from the base 500. However, the infrared filter can be mounted in a through-hole 510 formed in the center of the base 500. For example, the infrared cut-off filter can be formed of a film material or a glass material. For example, the infrared cut-off filter can be formed by coating an infrared cut-off coating material onto a plate-shaped optical filter such as an imaging plane protective cover glass or a cover glass.

[0071] A PCB (Printed Circuit Board) can support the camera module. An image sensor can be mounted on the PCB. As an example, the image sensor can be located inside the upper surface of the PCB, and a sensor holder (not shown) can be located outside the upper surface of the PCB. The camera module can be located on the sensor holder. Alternatively, the camera module can be located outside the upper surface of the PCB, and the image sensor can be located inside the upper surface of the PCB. With this structure, light passing through the lens module housed within the camera module can illuminate the image sensor mounted on the PCB.

[0072] The PCB can power the camera module. Additionally, the controller used to control the camera module can be located on the PCB.

[0073] An image sensor can be mounted on a PCB. The image sensor can be positioned to coincide with the optical axis of the lens module. In this way, the image sensor can capture light passing through the lens module. The image sensor can output an image from the incident light. Image sensors can be, for example, charge-coupled devices (CCDs), metal-oxide-semiconductor (MOS), CPDs, and CIDs. However, the type of image sensor is not limited to these.

[0074] The controller can be mounted on the PCB. It can be located on the outside of the camera module, or it can be located on the inside. The controller can individually control the direction, intensity, and amplitude of the current supplied to each component forming the camera module. The controller can perform either the AF (autofocus) or OIS (optical isolation) functions of the camera module. That is, the controller can move the lens module towards the optical axis or tilt it in a direction orthogonal to the optical axis.

[0075] Furthermore, the controller can perform one or more feedback controls in the AF and OIS functions. More specifically, by receiving the position of the spool 210 or housing 310 detected by the sensor unit (not shown), the controller controls the current or power supplied to the first drive unit 220 to the third drive unit 420, thereby enabling the controller to provide more accurate autofocus and OIS functions.

[0076] Specifically, the camera module according to the embodiment may include a cover member 100, a first mover 200, a second mover 300, a stator 300, a base 500, a support member 600, and a sensor unit. However, the camera module according to the exemplary embodiment may omit any one of the cover member 100, the first mover 200, the second mover 300, the stator 300, the support member 600, and the sensor unit. In particular, the sensor unit may be omitted because it is an element used for AF feedback and / or OIS feedback functions.

[0077] The cover member 100 can form the appearance of the camera module. The cover member 100 can be a cube shape with an opening at the bottom. However, the shape of the cover member 100 is not limited to this.

[0078] For example, the cover member 100 can be formed of a metallic material. More specifically, the cover member 100 can be formed of a metal plate. In this case, the cover member 100 can prevent EMI (electromagnetic interference). Due to this property of the cover member 100, the cover member 100 can be referred to as an "EMI shield". The cover member 100 can prevent electromagnetic waves generated from the outside of the camera module from entering the interior of the cover member 100. Furthermore, the cover member 100 can prevent electromagnetic waves generated from the interior of the cover member 100 from being emitted to the outside of the cover member 100. However, the material of the cover member 100 is not limited to this.

[0079] The cover member 100 may include an upper plate 101 and a side plate 102. The cover member 100 may include an upper plate 101 and a side plate 102 extending from the outer periphery of the upper plate 101 to a lower side. The lower end of the side plate 102 of the cover member 100 may be mounted on a base 500. The cover member 100 may be mounted on the base 500 by attaching its inner surface to a portion or all of the side surface of the base 500. A first mover 200, a second mover 300, a stator 300, and a support member 600 may be disposed within the internal space formed by the cover member 100 and the base 500. With this configuration, the cover member 100 can protect internal components from external impacts while preventing the penetration of external foreign objects. However, the embodiment is not limited to this; the lower end of the side plate 102 of the cover member 100 may be directly coupled to a PCB disposed on the lower side of the base 500.

[0080] The cover member 100 may include an opening 110 formed in the upper plate 101 to expose the lens module. The opening 110 may be shaped to correspond to the shape of the lens module. The size of the opening 110 may be larger than the diameter of the lens module to allow the lens module to be assembled through the opening 110. Simultaneously, light introduced through the opening 110 can pass through the lens module. The light that has passed through the lens module can then be captured as an image by an image sensor.

[0081] The first mover 200 can be integrated with the lens module. The lens module can be housed inside the first mover 200. The inner peripheral surface of the first mover 200 can be integrated with the outer peripheral surface of the lens module. The first mover 200 can move integrally with the lens module by interacting with the second mover 300 and / or the stator 400. That is, the first mover 200 can move together with the lens module.

[0082] The first mover 200 may include a spool 210 and a first drive unit 220. The first mover 200 may include a spool 210 coupled to a lens module. The first mover 200 may include a first drive unit 220 disposed at the spool 210 to move by interacting with a second drive unit 320.

[0083] The spool 210 can be combined with the lens module. More specifically, the inner circumferential surface of the spool 210 can be combined with the outer circumferential surface of the lens module. The first drive unit 220 can be combined with the spool 210. The upper part of the spool 210 can be combined with the upper support member 610. The spool 210 can be positioned inside the housing 310. The spool 210 can move relative to the housing 310 in the optical axis direction.

[0084] The spool 210 may include a lens receiving portion 211, a first drive portion connecting portion 212, and an upper connecting portion 213.

[0085] The spool 210 may have a lens receiving portion 211 with upper and lower openings on its inner side. The spool 210 may include the lens receiving portion 211 formed on its inner side. The lens receiving portion 211 can be combined with a lens module. The inner peripheral surface of the lens receiving portion 211 may be threaded, and the shape of this thread corresponds to the shape of the thread formed on the outer peripheral surface of the lens module. That is, the lens receiving portion 211 can be threadedly connected via the lens module. An adhesive may be inserted between the lens module and the spool 210. In this case, the adhesive may be an epoxy resin that is cured by UV and heat. That is, the lens module and the spool 210 can be bonded together using UV-cured epoxy resin and / or heat-cured epoxy resin.

[0086] The spool 210 may include a first drive portion coupling portion 212 on which a first drive portion 220 is provided. The first drive portion coupling portion 212 may be integrally formed with the outer peripheral surface of the spool 210. Furthermore, the first drive portion coupling portion 212 may be formed continuously along the outer peripheral surface of the spool 210, or it may be formed by spacing it from the outer peripheral surface of the spool 210. For example, the first drive portion coupling portion 212 may be formed by recessing a portion of the outer peripheral surface of the spool 210 in a shape corresponding to the shape of the first drive portion 220. In this case, the coil of the first drive portion 220 can be directly wound onto the first drive portion coupling portion 212. In a variation, the first drive portion coupling portion 212 may be formed with an upper opening or a lower opening. In this case, the coil of the first drive portion 220 can be inserted through the opening and coupled to the first drive portion coupling portion 212 when the coil is in a pre-wound state.

[0087] The spool 210 may include an upper connecting portion 213 that engages with the upper support member 610. The upper connecting portion 213 may engage with the inner peripheral surface 612 of the upper support member 610. For example, a lug (not shown) of the upper connecting portion 213 may be engaged by inserting it into a groove or hole (not shown) in the inner peripheral surface 612 of the upper support member 610. In this case, the lug of the upper connecting portion 213 may be welded to fix the upper support member 610 while it is inserted into the hole in the inner peripheral surface 612.

[0088] The first drive unit 220 may be provided at the spool 210. The first drive unit 220 may be positioned facing the second drive unit 320. The first drive unit 220 may move the spool 210 relative to the housing 310 through electromagnetic interaction with the second drive unit 320.

[0089] The first drive unit 220 may include a coil. Here, the first drive unit 220 may be referred to as an AF (autofocus) coil unit. Furthermore, the first drive unit 220 may be referred to as a "first coil unit" to distinguish it from other elements formed as coil units. The AF coil unit may be disposed at the spool 210. The AF coil unit can be wound around the outer peripheral surface of the spool 210 by being guided to the first drive unit coupling 212. Furthermore, in another exemplary embodiment, the AF coil unit may be formed by four (4) independent coils, each spaced apart, and the four coils may be disposed at the outer peripheral surface of the spool 210 to allow a 90° angle between adjacent coils. The AF coil unit may face the drive magnet unit of the second drive unit 320. That is, the AF coil unit may be configured to electromagnetically interact with the drive magnet unit.

[0090] The AF coil section may include a pair of lead cables for power supply. In this case, the pair of lead cables on the AF coil section can be electrically coupled to a first upper support unit 614 and a second upper support unit 615, which are separate elements of the upper support member 610. That is, the AF coil section can receive power through the upper support member 610. At the same time, when power is supplied to the AF coil section, an electromagnetic field can be generated around the AF coil section. In a variation, the first drive section 220 may include a magnet section.

[0091] At this time, the second drive unit 320 may include a coil unit.

[0092] The second mover 300 is movable to perform the OIS function. The second mover 300 may be positioned outside the first mover 200, facing the first mover 200, and may move the first mover 200 or move together with it. The second mover 300 may be movably supported by a stator 300 and / or a base 500 disposed on the lower side. The second mover 300 may be located within the internal space of the cover member 100.

[0093] The second mover 300 may include a housing 310 and a second drive unit 320. The second mover 300 may include a housing 310 disposed on the outside of the tubing 210. In addition, the second mover 300 may include a second drive unit 320, which is configured to face the first drive unit 220 and is fixed to the housing 310.

[0094] At least a portion of the outer casing 310 can be formed in a shape corresponding to the inner peripheral surface of the cover member 100. Specifically, the outer peripheral surface of the outer casing 310 can be formed in a shape corresponding to the inner peripheral surface of the side plate 102 of the cover member 100. The outer casing 310 can be a cubic shape including four side surfaces. However, the outer casing 310 can be of any shape, as long as it can be accommodated in the cover member 100. Considering productivity, the outer casing 310 can be formed as an injection-molded article.

[0095] The housing 310 can be disposed on the upper side of the base 500. The housing 310 is a movable part for OIS driving and can be spaced apart from the cover member 100 by a predetermined distance. However, in the AF model, the housing 310 can be fixed to the base 500. Alternatively, in the AF model, the housing 310 can be omitted, and the second drive unit 320 can be fixed to the cover member 100.

[0096] The upper surface of the outer casing 310 can be combined with the upper support member 610.

[0097] The housing 310 may include an internal space 311, a second drive unit joint 312, and an upper joint 313.

[0098] The outer casing 310 may have openings on the upper and lower sides to allow the first drive unit 200 to move vertically. The outer casing 310 may have an internal space 311 with upper and lower openings. The spool 210 may be movably disposed within the internal space 311. That is, the through hole 311 may be formed in a shape corresponding to the shape of the spool 210. Furthermore, the inner peripheral surface of the outer casing 310 forming the internal space 311 may be spaced apart from the outer peripheral surface of the spool 210.

[0099] The housing 310 may include a second drive unit coupling portion 312 on its side surface, the second drive unit coupling portion 312 being shaped to correspond to the shape of the second drive unit 320 to accommodate the second drive unit 320. That is, the second drive unit coupling portion 312 can accommodate and fix the second drive unit 320. The second drive unit 320 can be fixed to the second drive unit coupling portion 312 using an adhesive (not shown). Simultaneously, the second drive unit coupling portion 312 may be provided on the inner circumferential surface of the housing 310. In this case, this structural configuration can provide advantageous electromagnetic interaction with the first drive unit 220 disposed inside the second drive unit 320. Furthermore, for example, the second drive unit coupling portion 312 may be open at the bottom. In this case, advantageous electromagnetic interaction can be achieved between the third drive unit 420 disposed below the second drive unit 320 and the second drive unit 320. For example, four second drive unit coupling portions 312 may be formed. Each of the four second drive unit coupling portions 312 can be coupled to the second drive unit 320. Meanwhile, the second drive unit joint 312 may be formed at the corner where it meets the side surface of the adjacent housing 310. Alternatively, the second drive unit joint 312 may be formed on the side surface of the housing 310.

[0100] The housing 310 may include an upper engagement portion 313 that engages with the upper support member 610. The upper engagement portion 313 may engage with the outer surface 611 of the upper support member 610. For example, a lug of the upper engagement portion 313 may engage with a groove or hole in the outer surface 611 of the upper support member 610 by being inserted into a groove or hole. In this case, the lug of the upper engagement portion 313 may be welded when inserted into the hole in the outer surface 611 to secure the upper support member 610.

[0101] The housing 310 may include an upper stop 315 projecting from one surface of the housing 310. The housing 310 may include an upper stop 315 projecting upward from its upper surface. An upper stop 316 may project upward from the housing 310. The upper stop 316 may overlap with the cover member 100 in the vertical direction. When the housing 310 moves upward through this structure, the upper stop 316 and the cover member 100 begin to contact to limit the movement of the housing 310. That is, the upper stop 316 may limit the upper limit of movement due to the mechanical structure of the housing 310.

[0102] The second driving part 320 can be positioned facing the first driving part 220. The second driving part 320 can move the first driving part 220 through electromagnetic interaction with it. The second driving part 320 may include a magnet part. In this case, the second driving part 320 is a magnet part for driving, and can be referred to as a "driving magnet part". The driving magnet part can be disposed at the housing 310. The driving magnet part can be fixed to the second driving part coupling part 312. As an example, such as Figure 2 As shown, the driving magnet section can be provided in the housing 310 by independently forming four magnets, such that a 90° angle is formed between two adjacent magnets. That is, the driving magnet section can promote efficient utilization of the internal volume by mounting magnets at equal intervals on the four side surfaces of the housing 310. However, the embodiment is not limited to this. At the same time, as explained in the foregoing discussion, the first driving section 220 may include a magnet section, and the second driving section 320 may include a coil section.

[0103] The stator 300 can be disposed below the second mover 300. The stator 300 can face the second mover 300. The stator 300 can movably support the second mover 300. The stator 300 can move the second mover 300. At this time, the first mover 200 can also move together with the second mover 300. In addition, the stator 300 can be provided with through holes 411 and 412 corresponding to the lens module at its center.

[0104] The stator 300 may include a drive substrate 410 and a third drive section 420. The stator 300 may include a drive substrate 410 inserted between the third drive section 420 and the base 500. In addition, the stator 300 may include a third drive section 420 facing the second drive section 320 on the lower side of the second drive section 320.

[0105] The driving substrate 410 may include a flexible printed circuit board (FPCB). The driving substrate 410 can be inserted between the base 500 and the housing 310. The driving substrate 410 can be inserted between the third driving unit 420 and the base 500. The driving substrate 410 can supply power to the third driving unit 420. The driving substrate 410 can supply power to both the first driving unit 220 and the third driving unit 320. The driving substrate 410 can supply power to the AF coil unit via the side support member 630 and the upper support member 610. Furthermore, the substrate 410 can supply power to the AF sensor unit (not shown) via the side support member 630 and the upper support member 610.

[0106] The driving substrate 410 may include, for example, a through hole 411 and a terminal portion 412. The substrate 410 may include the through hole 411, which allows light passing through the lens module to pass through. The substrate 410 may include a terminal portion 412 that is bent downward and exposed to the outside. At least a portion of the terminal portion 412 may be exposed to the outside for connection to an external power source, and the driving substrate 410 may be powered by the external power source.

[0107] The third drive unit 420 can move the second drive unit 320 via electromagnetic interaction. The third drive unit 420 may include a coil portion. Preferably, the third drive unit 420 may include a coil substrate. In this case, the third drive unit 420 may be referred to as an OIS coil substrate (Optical Image Stabilizing Coil Substrate). Furthermore, the third drive unit 420 may be referred to as the "second coil portion" to distinguish it from the first coil portion. Of course, the coil portion of the third drive unit 420 may be referred to as the first coil portion, and the coil portion of the first drive unit 220 may be referred to as the second coil portion. The OIS coil substrate may be located on the drive substrate 410. The OIS coil substrate may be located between the base 500 and the housing 310. The OIS coil substrate may face the drive magnet portion. When power is applied to the OIS coil substrate, the second drive unit 320 and the housing 310 on which the second drive unit 320 is fixed may move integrally due to the interaction between the OIS coil substrate and the drive magnet portion. The OIS coil substrate may be formed from a finely patterned coil (FP coil) mounted on an insulating layer.

[0108] On the other hand, it may be effective in miniaturizing the camera module (reducing its height in the z-axis direction, which is the optical axis). For example, the OIS coil substrate can be formed to minimize interference with the OIS sensor section 700 located below it. The OIS coil substrate can be positioned so that it does not overlap with the OIS sensor section 700 in the vertical direction.

[0109] The OIS coil substrate may include first to fourth coil units 422, 423, 424, and 425. The first coil unit 422 may be located at a first corner 506 of the base 500. The second coil unit 423 may be located at a third corner 505 of the base 500. The third coil unit 424 may be located at a second corner 508 of the base 500. The fourth coil unit 425 may be positioned at a fourth corner 507 of the base 500. In this case, each of the first to fourth coil units 422, 423, 424, and 425 according to the first embodiment may include an insulating layer separate from each other and a coil pattern disposed on the insulating layer. Alternatively, the first to fourth coil units 422, 423, 424, and 425 according to the second embodiment may include a substrate and four coil patterns, the substrates being connected to each other while having a centrally formed through-hole 421, and the four coil patterns being disposed at a corner of the substrate. Furthermore, the first to fourth coil units 422, 423, 424, and 425 may include coil patterns disposed on two or three insulating layers, respectively. This will be described in detail below.

[0110] like Figure 3a As shown, the first coil unit 422 and the second coil unit 423 can be positioned diagonally. Furthermore, as... Figure 3a As shown, the third coil unit 424 and the fourth coil unit 425 can be positioned diagonally. As an example, such as... Figure 3a As shown, the first coil unit 422, the second coil unit 423, the third coil unit 424 and the fourth coil unit 425 can be arranged in a counterclockwise order.

[0111] Meanwhile, as described above, each of the first to fourth coil units 422, 423, 424 and 425 in the first embodiment may include an insulating layer separate from each other and a coil pattern disposed on the insulating layer.

[0112] Furthermore, the first to fourth coil units 422, 423, 424, and 425 can be disposed on the driving substrate 410. In this case, each of the first to fourth coil units 422, 423, 424, and 425 according to the first embodiment includes a coil pattern portion disposed on an insulating layer that is separate from each other. Furthermore, the first to fourth coil units 422, 423, 424, and 425 can be disposed on the driving substrate 410 at predetermined intervals. Therefore, an opening region can be provided between the first to fourth coil units 422, 423, 424, and 425.

[0113] That is, such as Figure 3a As shown in 3B, a first opening region 426 may be formed between the first coil unit 422 and the second coil unit 423. Furthermore, a second opening region 427 may be formed between the second coil unit 423 and the third coil unit 424. Additionally, a third opening region 428 may be formed between the third coil unit 424 and the fourth coil unit 425. Moreover, a fourth opening region 429 may be formed between the first coil unit 422 and the fourth coil unit 425.

[0114] In this configuration, when the drive substrate 410 is coupled with the first to fourth coil units 422, 423, 424, and 425, each of the first to fourth opening regions 426, 427, 428, and 429 can expose a portion of the upper surface of the drive substrate 410. Furthermore, devices can be mounted on the upper surface regions of the drive substrate 410 exposed through the first to fourth opening regions 426, 427, 428, and 429.

[0115] That is, the first device 413 can be mounted on the first upper surface of the driving substrate 410 corresponding to the first opening region 426. Furthermore, the second device 414 can be mounted on the second upper surface of the driving substrate 410 corresponding to the second opening region 427. Furthermore, the third device 415 can be mounted on the third upper surface of the driving substrate 410 corresponding to the third opening region 428. Furthermore, the fourth device 416 can be mounted on the fourth upper surface of the driving substrate 410 corresponding to the fourth opening region 429. Here, the first to fourth upper surfaces corresponding to the first to fourth opening regions 426, 427, 428, and 429 can refer to the regions on the upper surface of the driving substrate 410 that are aligned (or overlap) with the first to fourth opening regions 426, 427, 428, and 429 along the optical axis direction. The first to fourth devices 413, 414, 415, and 416 can be passive or active devices. For example, the first to fourth devices 413, 414, 415, 416 may be part of a controller (not shown) for controlling the overall operation of the camera module in the embodiment, and a part of the controller in the embodiment may be disposed on the stator of the camera module.

[0116] Therefore, in this embodiment, it is not necessary to provide separate substrates for mounting the first to fourth devices 413, 414, 415 and 416, and the overall size of the camera module can be reduced by arranging the first to fourth devices 413, 414, 415 and 416 in the first to fourth opening regions 426, 427, 428 and 429.

[0117] On the other hand, the coil substrate of a conventional camera module includes coil patterns corresponding to the first to fourth coil units simultaneously formed in each of the four corners of an insulating layer. In this case, pads connected to the coil patterns and having input or output current functions are provided in areas (e.g., bridging portions) on the upper surface of an insulating layer where no coil patterns are provided. Therefore, the devices in a conventional camera module must be mounted on a separate substrate in addition to the upper surfaces of the drive substrate and the coil substrate, thus increasing the overall thickness of the camera module.

[0118] Therefore, the coil substrate in this embodiment includes multiple coil units as four separate substrates, and the opening area between the multiple coil units can be used as a device mounting space.

[0119] In addition, such as Figure 3cAs shown, each of the first coil unit 422, the second coil unit 423, the third coil unit 424, and the fourth coil unit 425 includes an insulating layer 810, a first coil pattern portion 820 disposed on one surface of the insulating layer 810, and a second coil pattern portion 830 disposed on the other surface of the insulating layer 810. This will be described in more detail below.

[0120] The vertical distance (optical axis direction) between the driving magnet and the OIS coil substrate can be 100 μm. Alternatively, the vertical distance can be between 80 and 120 μm. The distance between the driving magnet and the OIS coil substrate affects the electromagnetic interaction between them, ensuring electromagnetic interaction for OIS driving even if the number of turns on the OIS coil is reduced according to this exemplary embodiment, by decreasing the distance between the driving magnet and the OIS coil substrate.

[0121] The third driving unit 420 may be provided with a through hole 421 through which light from the lens module can pass. The diameter of the through hole 421 may correspond to the diameter of the lens module. The diameter of the through hole 421 of the third driving unit 420 may correspond to the diameter of the through hole 411 of the driving substrate 410. The diameter of the through hole 421 of the third driving unit 420 may correspond to the diameter of the through hole 510 of the base 500. For example, the through hole may be circular. However, the embodiment is not limited to this.

[0122] The base 500 can be disposed on the underside of the line cylinder 210. The base 500 can be disposed on the underside of the housing 310. The base 500 can support the second mover 300. The PCB can be disposed on the underside of the base 500. The base 500 can perform the function of a sensor holder to protect the image sensor mounted on the PCB.

[0123] The base 500 may include a through hole 510, an extension 520, a sensor mounting portion 530, and a foreign matter collection portion (not shown). The base 500 may include a through hole 510 formed at a position corresponding to the lens receiving portion 211 of the spool 210. The through hole 510 of the base 500 may be combined with an IR (infrared) filter. However, the IR filter may be combined with a separate sensor holder disposed on the lower surface of the base 500.

[0124] The base 500 may include an extension 520 extending upward from its upper surface. The extension 520 may project upward from the upper surface of the base 500. The extension 520 may be located at a first corner 505. The extension 520 may include a first lug to a fourth lug formed at the first to fourth corners 505, 506, 507, and 508 of the base 500, respectively. The outer peripheral surface of the housing 310 may be formed with a first groove to a fourth groove corresponding to the first lug to the fourth lug, respectively. The first lug to the fourth lug may be received in pairs in the first groove to the fourth groove. That is, at least a portion of the housing 310 may be located inside the extension 520. With this structure, the movement of the housing 310 can be restricted in the horizontal direction (the direction perpendicular to the optical axis). That is, the extension 520 of the base 500 can be used as a stop for the lateral movement of the housing 310.

[0125] A damper (not shown) may be inserted between the extension 520 of the base 500 and the housing 310. The damper can prevent resonance phenomena that may be caused by autofocus feedback control and / or OIS feedback control.

[0126] The base 500 may include a sensor mounting section 530 connected to the OIS sensor section 700. That is, the OIS sensor section 700 may be mounted on the sensor mounting section 530. In this case, the OIS sensor section 700 can detect horizontal movement or tilting of the housing 310 by detecting the second drive section 320 connected to the housing 310. For example, two sensor mounting sections 530 may be formed. Each of the two sensor mounting sections 530 may be provided with an OIS sensor section 700. The OIS sensor section 700 may include a first axis sensor 710 and a second axis sensor 720 to detect movement of the housing 310 in both the x-axis and y-axis directions.

[0127] The base 500 may include a foreign matter collection section that collects foreign matter introduced into the interior of the cover member 100. The foreign matter collection section may be located on the upper surface of the base 500 and includes an adhesive material to collect foreign matter in the interior space formed by the cover member 100 and the base 500.

[0128] The base 500 may include first to fourth side surfaces 501, 502, 503, and 504, each side surface being arranged sequentially and adjacently. Specifically, the first side surface 501 may be formed adjacent to the second side surface 502 and the fourth side surface 504. The second side surface 502 may be formed adjacent to the first side surface 501 and the third side surface 503. The third side surface 503 may be formed adjacent to the second side surface 502 and the fourth side surface 504. The fourth side surface 504 may be formed adjacent to the third side surface 503 and the first side surface 501. The base 500 may include first to fourth corner portions 505, 506, 507, and 508, which are disposed between the first to fourth side surfaces 501, 502, 503, and 504. That is, the first corner portion 505 can be disposed between the first side surface 501 and the second side surface 502. The second corner portion 506 can be disposed between the second side surface 502 and the third side surface 503. The third corner portion 507 can be disposed between the third side surface 503 and the fourth side surface 504. The fourth corner portion 508 can be disposed between the fourth side surface 504 and the first side surface 501.

[0129] The support member 600 can connect any one of two or more of the first mover 200, the second mover 300, the stator 300, and the base 500. The support member 600 can elastically connect any one of the first mover 200, the second mover 300, the stator 300, and the base 500 to support relative movement between each element. The support member 600 can be configured to be elastic in at least a portion thereof. In this case, the support member 600 can be referred to as an elastic member or a spring.

[0130] For example, the support member 600 may include an upper support member 610 and a side support member 630. In this case, the upper support member 610 may be referred to as an "autofocus spring," "AF elastic member," etc. Furthermore, the side support member 630 may be referred to as an "OIS spring," "OIS elastic member," etc. Additionally, the support member 600 may also include a lower support member (not shown).

[0131] The upper support member 610 can be coupled to the spool 210 and the housing 310. The upper support member 610 can elastically support the spool 210 relative to the housing 310. For example, the upper support member 610 may include an outer portion 611, an inner portion 612, and a connecting portion 613. The upper support member 610 may include an outer portion 611 coupled to the housing 310, an inner portion 612 coupled to the spool 210, and a connecting portion 613 elastically connecting the outer portion 611 and the inner portion 612.

[0132] The upper support member 610 can be connected to the upper surface of the first mover 200 and the upper surface of the second mover 300. More specifically, the upper support member 610 can be coupled to the upper surface of the spool 210 and the upper surface of the housing 310. The interior 612 of the upper support member 610 can be coupled to the upper coupling portion 213 of the spool 210, and the exterior 611 of the upper support member 610 can be coupled to the upper coupling portion 313 of the housing 310.

[0133] The upper support member 610 can be divided into a pair for supplying power to the AF coil section, etc. The upper support member 610 may include a first upper support unit 614 and a second upper support unit 615 spaced apart from each other. The first upper support unit 614 may be electrically connected to one end of the AF coil section, and the second upper support unit 615 may be electrically connected to the other end of the AF coil section. The upper support member 610 can supply power to the AF coil section through this structure. The upper support member 610 can receive power from the substrate 410 through the side support member 630. For example, the upper support member 610 can be arranged in six (6) upper support members. In this case, four of the six upper support members 610 can be electrically connected to the AF sensor section, and the remaining two upper support members can be electrically connected to the AF coil section.

[0134] The lower support member may include an exterior, an interior, and a connecting portion. The lower support member may include an exterior coupled to the housing 310, an interior coupled to the bobbin 210, and a connecting portion that resiliently connects the exterior and interior. The lower support member may be integrally formed. However, the embodiments are not limited thereto. In one variation, the lower support members may be divided into a pair for supplying power to the AF coil section, etc.

[0135] The side support member 630 can be coupled to the base 500 and the housing 310. For example, the side support member 630 can elastically support the housing 310 relative to the base 500. The side support member 630 can be coupled to the stator 300 and / or the base 500 on one side, and can be coupled to the upper support member 610 and / or the housing 310 on the other side. For example, the side support member 630 can be coupled to the base 500 on one side, and can be coupled to the housing 310 on the other side. Furthermore, in another exemplary embodiment, the side support member 630 can be coupled to the stator 300 on one side, and can be coupled to the upper support member 610 on the other side. With this structure, the side support member 630 can elastically support the second mover 300 relative to the stator 300, so that the second mover 300 can move horizontally or tilt. For example, the side support member 630 can include a leaf spring. Alternatively, as a variation, the side support member 630 can include multiple wirings. Meanwhile, the side support member 630 can be integrally formed with the upper support member 610.

[0136] The side support member 630 may include a lower portion 631, an upper portion 632, and a connecting portion 633. The side support member 630 may include a lower portion 631 that engages with the base 500. The side support member 630 may include an upper portion 632 that engages with the housing 310. The side support member 630 may include a connecting portion 633 that connects the lower connecting portion 631 and the upper connecting portion 632.

[0137] The OIS coil substrate 420 according to the embodiment will be described in detail below. The OIS coil substrate 420 described below can also be used as a substrate on which an AF coil is mounted, and is therefore described as "coil substrate 420".

[0138] The coil substrate 420 in the first embodiment may include four independent coil units. For example, the coil substrate 420 may include first coil units to fourth coil units 422, 423, 424 and 425 respectively disposed at the four corners of the driving substrate 410.

[0139] Furthermore, each of the first to fourth coil units 422, 423, 424, and 425 may include an insulating layer and a coil pattern disposed on each of the upper and lower surfaces of the insulating layer. In this case, the respective insulating layers forming the respective coil units are separated from each other. Therefore, the embodiment can construct a drive unit for OIS operation by manufacturing a plurality of coil units and arranging such a plurality of coil units in the respective corners of the drive substrate 410.

[0140] Furthermore, according to another embodiment, the coil substrate 420 may include an insulating layer and coil patterns disposed on the upper and lower surfaces of the four corners of the insulating layer. That is, according to another embodiment, the coil substrate 420 can be configured as a drive unit for OIS operation by co-fabricating four coil units on an insulating layer and correspondingly arranging the co-fabricated coil substrate on the drive substrate 410.

[0141] Figure 4 This is a top view of the coil substrate according to the first embodiment. Figure 5 This is a bottom view of the coil substrate according to the first embodiment.

[0142] refer to Figure 4 and Figure 5 The coil substrate 420 may include four coil units respectively disposed at the four corners as described above. In addition, the four coil units may include an insulating layer 810, a first coil pattern portion 820 disposed on the lower surface of the insulating layer 810, a second coil pattern portion 830 disposed on the upper surface of the insulating layer 820, and pad portions 840a and 840b disposed on the lower surface of the insulating layer 810 and spaced apart from the first coil pattern portion 820 by a predetermined interval.

[0143] The insulating layer 810 may have a shape corresponding to the corner of the driving substrate 410. For example, the insulating layer 810 may have a triangular planar shape. However, the embodiments are not limited to this, and the insulating layer 810 may be deformed into a rectangle, a circle, a polygon, or an ellipse, and the insulating layer 810 may be disposed at the corner of the driving substrate 410.

[0144] The insulating layer 810 may include polyimide (PI). However, the embodiments are not limited thereto, and the insulating layer 810 may be formed of a polymer material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). Therefore, the driving substrate 410 including the insulating layer 810 can be used in various electronic devices in which a curved display device is provided.

[0145] The insulating layer 810 can be referred to as an insulating substrate or a support substrate, and is used to support the first coil pattern portion 820, the second coil pattern portion 830, and the pad portions 840a and 840b and to insulate the first coil pattern portion 820, the second coil pattern portion 830, and the pad portions 840a and 840b.

[0146] The insulating layer 810 can have a thickness of 20 μm to 100 μm. For example, the insulating layer 810 can have a thickness of 25 μm to 50 μm. For example, the insulating layer 810 can have a thickness of 30 μm to 40 μm. When the thickness of the insulating layer 810 exceeds 100 μm, the overall thickness of the coil substrate increases. Furthermore, when the thickness of the insulating layer 810 is less than 20 μm, problems with heat / pressure may occur during the formation of the first coil pattern portion 820 or the second coil pattern portion 830 on the insulating layer 810.

[0147] The first coil pattern portion 820 may be disposed on the lower surface of the insulating layer 810. Preferably, the first coil pattern portion 820 may be disposed on the lower surface of the insulating layer 810 facing the driving substrate 410.

[0148] Furthermore, the second coil pattern portion 830 may be disposed on the upper surface of the insulating layer 810. Preferably, the second coil pattern portion 830 may be disposed on the upper surface of the insulating layer 810 opposite to the lower surface of the insulating layer 810 on which the first coil pattern portion 820 is disposed.

[0149] The first coil pattern portion 820 and the second coil pattern portion 830 can be wound in one direction while having multiple bending regions on the upper and lower surfaces of the insulating layer 810, respectively. Therefore, each of the first coil pattern portion 820 and the second coil pattern portion 830 can have a coil shape as a whole. For example, the first coil pattern portion 820 and the second coil pattern portion 830 can have a coil shape while being wound in one direction from the outside to the inside or from the inside to the outside.

[0150] In this case, the winding direction of the first coil pattern portion 820 can be the same as the winding direction of the second coil pattern portion 830. For example, the first coil pattern portion 820 can be wound clockwise from the inside out. Furthermore, the second coil pattern portion 830 can be wound clockwise from the inside out in the same manner as the first coil pattern portion 820. Therefore, the embodiment simplifies the process of forming coil patterns on the insulating layer 810 by winding and forming both the first coil pattern portion 820 and the second coil pattern portion 830 in the same direction.

[0151] However, the direction of the current flowing through the first coil pattern section 820 may be different from the direction of the current flowing through the second coil pattern section 830. Preferably, the direction 820 of the current flowing through the first coil pattern section may be opposite to the direction of the current flowing through the second coil pattern section 830.

[0152] The second coil pattern portion 830 has a shape corresponding to the shape of the insulating layer 810 and can be disposed on the upper surface of the insulating layer 810. For example, the second coil pattern portion 830 can have a trapezoidal shape, which includes a region parallel to the three sidewalls of the insulating layer 810. However, the embodiment is not limited to this; the second coil pattern portion 830 can have a triangular or circular shape and can be disposed on the insulating layer 810. On the other hand, the number of turns of the second coil pattern portion 830 and the first coil pattern portion 820 should be increased to maximize the Lorentz force within a limited space. Therefore, each of the second coil pattern portion 830 and the first coil pattern portion 820 can be configured to have a shape corresponding to the planar shape of the insulating layer 810.

[0153] The first coil pattern portion 820 and the second coil pattern portion 830 can be formed of a metallic material including copper (Cu). However, the embodiments are not limited to this, and the first coil pattern portion 820 and the second coil pattern portion 830 can include at least one of copper (Cu), aluminum (Al), chromium (Cr), nickel (Ni), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof. Meanwhile, although not shown in the figures, a surface treatment layer (not shown) can be provided on the surfaces of the first coil pattern portion 820 and the second coil pattern portion 830. The surface treatment layer can include tin (Sn), which has excellent corrosion resistance. The surface treatment layer can prevent oxidation of the first coil pattern portion 820 and the second coil pattern portion 830, thereby improving the reliability of the coil substrate.

[0154] The first coil pattern section 820 and the second coil pattern section 830 generate an electromotive force (EMF) by changing the magnetic flux due to changes in current. The magnetic flux generated in the first coil pattern section 820 and the second coil pattern section 830 can be proportional to the inductance and the flowing current, as shown in the following equation. Furthermore, the EMF is affected by the resistance of the circuit, and the resistance decreases as the cross-sectional area of ​​the first coil pattern section 820 and the second coil pattern section 830 increases.

[0155] [Equation 1]

[0156] Φ=Ll

[0157] [Equation 2]

[0158] L=(μN2A) / l

[0159] [Equation 3]

[0160] Resistance = l / (conductivity) * A

[0161] (In equations 1 to 3, Φ is the magnetic flux, L is the inductance, N is the number of turns in the coil pattern, l is the length of the coil, and A is the area (linewidth * thickness of the coil pattern).)

[0162] In other words, the cross-sectional area of ​​the first coil pattern portion 820 and the second coil pattern portion 830 should be increased to reduce the resistance of the circuit, and the line width and thickness of the first coil pattern portion 820 and the second coil pattern portion 830 should be increased to increase the cross-sectional area of ​​the first coil pattern portion 820 and the second coil pattern portion 830.

[0163] Meanwhile, after the first coil pattern portion 820 and the second coil pattern portion 830 form photosensitive patterns made of photosensitive film on the insulating layer 810, a predetermined thickness is formed between the photosensitive patterns by electrolysis or chemical plating process.

[0164] Meanwhile, each of the first coil pattern portion 820 and the second coil pattern portion 830 can have a thickness of 20 μm to 60 μm, and can be respectively disposed on the upper and lower surfaces of the insulating layer 810. More specifically, the first coil pattern portion 820 and the second coil pattern portion 830 can be configured to have a thickness of 30 μm to 50 μm. More specifically, the first coil pattern portion 820 and the second coil pattern portion 830 can be configured to have a thickness of 35 μm to 45 μm.

[0165] When the thickness of the first coil pattern portion 820 and the second coil pattern portion 830 is less than 20 μm, the resistance of the first coil pattern portion 820 and the second coil pattern portion 830 will increase. When the thickness of the first coil pattern portion 820 and the second coil pattern portion 830 exceeds 60 μm, it may be difficult to achieve fine patterns.

[0166] Furthermore, each of the first coil pattern portion 820 and the second coil pattern portion 830 may have a linewidth of 10 μm to 30 μm. More specifically, the first coil pattern portion 820 and the second coil pattern portion 830 may have a linewidth of 12 μm to 27 μm. More specifically, the first coil pattern portion 820 and the second coil pattern portion 830 may have a linewidth of 15 μm to 25 μm.

[0167] When the linewidth of the first coil pattern portion 820 and the second coil pattern portion 830 is less than 10 μm, the resistance of the first coil pattern portion 820 and the second coil pattern portion 830 will increase. When the linewidth of the first coil pattern portion 820 and the second coil pattern portion 830 exceeds 30 μm, it may be difficult to achieve fine patterns.

[0168] Furthermore, each of the first coil pattern portion 820 and the second coil pattern portion 830 can be wound in one direction while being spaced apart from each other by an interval of 5 μm to 15 μm. More specifically, each of the first coil pattern portion 820 and the second coil pattern portion 830 can be arranged with an interval of 7 μm to 13 μm. More specifically, each of the first coil pattern portion 820 and the second coil pattern portion 830 can be arranged with an interval of 9 μm to 11 μm.

[0169] When the interval between each of the first coil pattern portion 820 and the second coil pattern portion 830 is less than 5 μm, during the formation of the first coil pattern portion 820 and the second coil pattern portion 830, the photosensitive pattern collapses and short-circuits due to the reduction in linewidth, and therefore the linewidth of each coil pattern portion may become uneven. Furthermore, when the interval between each of the first coil pattern portion 820 and the second coil pattern portion 830 exceeds 15 μm, the line length of each of the first coil pattern portion 820 and the second coil pattern portion 830 may increase overall.

[0170] Meanwhile, the first coil pattern section 820 and the second coil pattern section 830 can be electrically connected to each other through through holes V1 and V2.

[0171] Specifically, the first coil pattern section 820 includes an outer coil pattern section 821 and an inner coil pattern section 822.

[0172] The inner coil pattern section 822 can be wound around the central area of ​​the lower surface of the insulating layer 810 a predetermined number of times.

[0173] The inner side of the outer coil pattern portion 821 is spaced apart from the outer side of the inner coil pattern portion 822 by a predetermined interval, so that the inner coil pattern portion 822 can be wound around at the position where the predetermined interval is separated by a predetermined number of times.

[0174] In this case, the inner coil pattern section 822 and the outer coil pattern section 821 are not directly connected to each other. Here, not directly connected means that the current flowing from the inner coil pattern section 822 is transmitted to the outer coil pattern section 821, but the current is not directly supplied from the inner coil pattern section 822 to the outer coil pattern section 821, or the current is not directly supplied from the outer coil pattern section 821 to the inner coil pattern section 822.

[0175] Meanwhile, pads 840a and 840b are provided on the lower surface of the insulating layer 810.

[0176] That is, pad portions 840a and 840b can be disposed in the region between the inner coil pattern portion 822 and the outer coil pattern portion 821. For example, pad portions 840a and 840b can be located between the outer side of the inner coil pattern portion 822 and the inner side of the outer coil pattern portion 821.

[0177] Therefore, the inner coil pattern portion 822 can be located inside the area on the lower surface of the insulating layer 810 where the pad portions 840a and 840b are formed, and the outer coil pattern portion 821 can be located outside the area on the lower surface of the insulating layer 810 where the pad portions 840a and 840b are formed.

[0178] That is, in this embodiment, the coil substrate 420 should be electrically connected to the drive substrate 410. Therefore, a pad portion should be formed on the coil substrate 420 to be electrically connected to the drive substrate 410 and to receive current from the drive substrate 410.

[0179] Therefore, a space must be provided on the lower surface of the insulating layer 810 for forming pad portions 840a and 840b that are electrically connected to the drive substrate 410. In this case, when the insulating layer 810 is formed as a multilayer, an additional layer on which the pad portions 840a and 840b are formed can be provided, but there is a problem of increased thickness of the coil substrate.

[0180] Furthermore, when the coil pattern is set together with the pads 840a and 840b on a single layer, the number of rotations of the coil pattern (or the length of the coil pattern or the arrangement area of ​​the coil pattern) reduces the arrangement area of ​​the pads 840a and 840b, thus reducing the Lorentz force.

[0181] Therefore, the embodiments enable the formation of coil patterns for generating maximum Lorentz force within a limited space.

[0182] That is, the Lorentz force generated by the coil pattern can increase or decrease proportionally to the size of the outer width Wo of the coil pattern. In the accompanying drawings, the outer width Wo is defined as the width of the coil pattern in the horizontal direction, but this is just an example, and the outer width Wo can also be defined as the width of the coil pattern in the vertical direction.

[0183] Therefore, the outer width Wo of the first coil pattern portion 820 located below the insulating layer 810 can be determined based on the positions of the pad portions 840a and 840b, and the intensity of the Lorentz force generated in the first coil pattern portion 820 can be determined based on the outer width Wo.

[0184] Figure 6 This is a view used to illustrate an example of the arrangement of the first coil pattern section according to the comparative example.

[0185] At this time, as Figure 6 As shown in (a), when pad portions 840a and 840b are provided in the outer region of the lower surface of the insulating layer 810, and the first coil pattern portion 820 corresponding to the inner coil pattern portion of this embodiment is only provided inside the pad portions 840a and 840b, the rotation speed and outer width Wo1 of the inner coil pattern portion decrease in the area where the pad portions 840a and 840b are provided. That is, as Figure 6 As shown in (a), compared to this embodiment, the width Wo1 between the outermost edges of the coil pattern can reduce the pad placement area, and the Lorentz force reduces this difference.

[0186] Or, such as Figure 6 As shown in (b), the pad portion is disposed inside the lower surface of the insulating layer 810, so the outer coil portion surrounding the pad portions 840a and 840b can be disposed only on the lower surface of the insulating layer 810. In this case, it can have an outer width Wo2 that is substantially the same as the outer width Wo of the first coil pattern portion 820 in this embodiment, and can generate a corresponding Lorentz force.

[0187] However, as Figure 6 As shown in (a) and (b), the first coil pattern portion disposed on the lower surface of the insulating layer 810 does not completely overlap with the second coil pattern portion disposed on the upper surface in the vertical direction, but only overlaps with the second coil pattern portion disposed on the upper surface in the outer or inner region. In other words, the first coil pattern portion disposed on the lower surface of the insulating layer 810 can have a structure in which the second coil pattern portion is offset inward or outward in the lower region of the second coil pattern portion.

[0188] At this time, as Figure 6 As shown in (b), when the first coil pattern portion disposed on the lower surface of the insulating layer overlaps only in the vertical direction with the outer region of the second coil pattern portion disposed on the upper surface of the insulating layer, a Lorentz force is generated unevenly throughout the entire region of the second coil pattern portion, and a concentrated Lorentz force is generated in the outer region of the second coil pattern portion. This may reduce the operational reliability of implementing the OIS function. For example, in Figure 6In the case of structure (b), the Lorentz force may concentrate in the outer region of the second coil pattern section, which may disrupt the balance with the magnet placed thereon.

[0189] Alternatively, in this embodiment, by providing the outer coil pattern portion 821 and the inner coil pattern portion 822 on each of the inner and outer sides of the pad portions 840a and 840b, a uniform Lorentz force can be generated in the inner and outer regions of the second coil pattern portion 830, thereby improving the reliability of the OIS function.

[0190] Therefore, the first coil pattern portion 820 is disposed on the lower surface of the insulating layer 810, and the second coil pattern portion 830 is disposed on the upper surface of the insulating layer 810.

[0191] In this configuration, the first coil pattern portion 820 includes an inner coil pattern portion 822 and an outer coil pattern portion 821. Furthermore, the outer coil pattern portion 821 may overlap with the outer region of the second coil pattern portion 830 disposed on the upper surface of the insulating layer 810 in the vertical direction (optical axis direction). Similarly, the inner coil pattern portion 822 may overlap with the inner region of the second coil pattern portion 830 disposed on the upper surface of the insulating layer 810 in the vertical direction (optical axis direction).

[0192] Meanwhile, the outer width of the first coil pattern portion 820, defined as the outer coil pattern portion 821 in the embodiment, can be the same as the outer width of the second coil pattern portion 830. Furthermore, the inner width of the first coil pattern portion 820, defined as the inner coil pattern portion 822 in the embodiment, can be the same as the inner width of the second coil pattern portion 830. Here, the outer width can correspond to the width in one direction between the outermost edges of the coil pattern portions. And the inner width can correspond to the width in one direction between the innermost edges of the coil pattern portions. Therefore, with the first pad portion 840a and the second pad portion 840b provided, the outer and inner widths of the first coil pattern portion 820 in this embodiment can be formed to be the same as the outer and inner widths of the second coil pattern portion 830, thus improving operational reliability.

[0193] Meanwhile, pad portions 840a and 840b are disposed on the lower surface of the insulating layer 810. Pad portions 840a and 840b may include a first pad portion 840a and a second pad portion 840b.

[0194] The first pad portion 840a and the second pad portion 840b can be connected to the driving substrate 410. In this case, the first pad portion 840a can be a current input pad connected to an input terminal (not shown) of the driving substrate 410. Furthermore, the second pad portion 840b can be a current output pad connected to an output terminal (not shown) of the driving substrate 410. For example, the first pad portion 840a can be a positive (+) current pad that transmits positive (+) current. Furthermore, the second pad portion 840b can be a negative (-) current pad that transmits negative (-) current. While this embodiment uses the first pad portion 840a as a current input pad and the second pad portion 840b as a current output pad, this embodiment is not limited to this. For example, the first pad portion 840b can be used as a current output pad, and the second pad portion 840b can be used as a current input pad.

[0195] The first pad portion 840a and the second pad portion 840b can be electrically connected to the first coil pattern portion 820.

[0196] Specifically, the first pad portion 840a can be directly connected to one end of the outer coil pattern portion 821 of the first coil pattern portion 820. In addition, the second pad portion 840b can be directly connected to the other end of the inner coil pattern portion 822 of the first coil pattern portion 820.

[0197] That is, the outer coil pattern portion 821 of the first coil pattern portion 820 can be wound clockwise from the inside out. Therefore, the outer coil pattern portion 821 may include one innermost end and one outermost end. Furthermore, the first pad portion 840a is located between the innermost end of the outer coil pattern portion 821 and the outermost end of the inner coil pattern portion 822. Therefore, the first pad portion 840a can be directly connected to the end of the outer coil pattern portion 821 that is adjacent to the first pad portion 840a.

[0198] Furthermore, the inner coil pattern portion 822 of the first coil pattern portion 820 can be wound clockwise from the inside out. Therefore, the inner coil pattern portion 822 can include an innermost end and an outermost end. Additionally, the second pad portion 840b is located between the outermost end of the inner coil pattern portion 822 and the innermost end of the outer coil pattern portion 821. Therefore, the second pad portion 840b can be directly connected to the other end of the inner coil pattern portion 822 that is adjacent to the second pad portion 840b.

[0199] Therefore, the outer coil pattern portion 821 of the first coil pattern portion 820 can receive current supplied from the first pad portion 840a at one end. In addition, the inner coil pattern portion 822 of the first coil pattern portion 820 can output current to the second pad portion 840b at the other end.

[0200] Meanwhile, the other end of the outer coil pattern portion 821 is connected to the first through hole V1. The first through hole V1 is configured to pass through the insulating layer 810. The first through hole V1 can electrically connect the first coil pattern portion 820 disposed on the lower surface of the insulating layer 810 and the second coil pattern portion 830 disposed on the upper surface of the insulating layer 810.

[0201] Furthermore, one end of the inner coil pattern portion 822 is connected to the second through hole V2. The second through hole V2 is configured to pass through the insulating layer 810. The second through hole V2 can electrically connect the first coil pattern portion 820 provided on the lower surface of the insulating layer 810 and the second coil pattern portion 830 provided on the upper surface of the insulating layer 810.

[0202] The first through hole V1 and the second through hole V2 can be formed by filling the interior of the via hole (not shown) that passes through the insulating layer 810 with a conductive material.

[0203] When a through hole is formed by machining, methods such as milling, drilling, and wiring can be used. When a through hole is formed by laser processing, UV or CO2 laser methods can be used. When a through hole is formed by chemical treatment, drugs containing aminosilanes, ketones, etc. can be used, thereby opening the insulating layer 810.

[0204] On the other hand, laser processing is a cutting method that melts and evaporates a portion of the material by concentrating light energy on a surface to form the desired shape. It can easily process complex shapes through computer programs and can process composite materials that are difficult to cut by other methods.

[0205] Furthermore, laser processing can achieve a cutting diameter of at least 0.005 mm and offers a wide range of advantages across a possible thickness range. YAG (yttrium aluminum garnet) lasers, CO2 lasers, or ultraviolet (UV) lasers are preferred as laser processing drill bits. YAG lasers can process both copper foil layers and insulating layers, while CO2 lasers can only process insulating layers.

[0206] When forming vias, a first via V1 and a second via V2 are formed by filling the interior of the via with a conductive material. The metallic material forming the first via V1 and the second via V2 can be any material selected from copper (Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd). The conductive material can be filled using any one or a combination of electroless plating, electrolytic plating, screen printing, sputtering, evaporation, inkjet printing, and dispensing. Alternatively, a seed layer can be formed inside the via through by electroless plating of palladium / nickel / chromium, followed by filling with metallic material using electroplating, screen printing, or other methods to form the via.

[0207] Specifically, the lower surface of the first through hole V1 can be connected to the other end of the outer coil pattern portion 821. In addition, the upper surface of the first through hole V1 can be connected to the other end of the second coil pattern portion 830 provided on the upper surface of the insulating layer 810.

[0208] That is, the second coil pattern portion 830 is formed by winding it clockwise from the inside to the outside. Therefore, one end of the second coil pattern portion 830 can be located at the innermost side, and the other end can be located at the outermost side. In addition, the other end located at the outermost side of the second coil pattern portion 830 can be connected to the upper surface of the first through hole V1 formed through the insulating layer 810.

[0209] Therefore, the outer coil pattern portion 821 of the first coil pattern portion 820 and the second coil pattern portion 830 can be electrically connected to each other through the first through hole V1.

[0210] Simultaneously, one end of the inner coil pattern portion 822 of the first coil pattern portion 820 can be connected to the second through hole V2. Specifically, the lower surface of the second through hole V2 can be connected to one end of the inner coil pattern portion 822. Furthermore, the upper surface of the second through hole V2 can be connected to one end of the second coil pattern portion 830 disposed on the upper surface of the insulating layer 810. Therefore, the second coil pattern portion 830 and the inner coil pattern portion 822 can be electrically connected to each other through the second through hole V2.

[0211] Summarizing the overall structure of the OIS coil portion including the first coil pattern portion 820 and the second coil pattern portion 830 as described above, one end of the outer coil pattern portion 821 of the first coil pattern portion 820 is connected to the first pad portion 840a. Furthermore, the other end of the outer coil pattern portion 821 of the first coil pattern portion 820 is connected to the lower surface of the first through hole V1. Additionally, the other end of the second coil pattern portion 830 is connected to the upper surface of the first through hole V1. Furthermore, one end of the second coil pattern portion 830 is connected to the upper surface of the second through hole V2. Furthermore, one end of the inner coil pattern portion 822 of the first coil pattern portion 820 is connected to the lower surface of the second through hole V2. Furthermore, the other end of the inner coil pattern portion 822 of the first coil pattern portion 820 is connected to the second pad portion 840b.

[0212] Therefore, when the first pad portion 840a is a current input pad and the second pad portion 840b is a current output pad, the current input through the first pad portion 840a can flow clockwise from one end of the outer coil pattern portion 821 to the other end of the outer coil pattern portion 821. Furthermore, the current supplied to the other end of the outer coil pattern portion 821 can be supplied through the first through-hole V1 to the other end of the second coil pattern portion 830 disposed on the upper surface of the insulating layer 810. Furthermore, the current supplied to the other end of the second coil pattern portion 830 can flow counterclockwise from the other end of the second coil pattern portion 830 to one end of the second coil pattern portion 830. Furthermore, the current supplied to one end of the second coil pattern portion 830 can be supplied through the second through-hole V2 to one end of the inner coil pattern portion 822 of the first coil pattern portion 820 disposed on the lower surface of the insulating layer 810. Furthermore, the current supplied to one end of the inner coil pattern portion 822 can flow clockwise from one end of the inner coil pattern portion 822 to the other end of the inner coil pattern portion 822. Furthermore, the current supplied to the other end of the inner coil pattern section 822 can be output through the second pad section 840b.

[0213] Meanwhile, the first pad portion 840a can be a current output pad, and the second pad portion 840b can be a current input pad. Furthermore, when the first pad portion 840a is a current output pad and the second pad portion 840b is a current input pad, the current input through the second pad portion 840b can flow counterclockwise from one end of the inner coil pattern portion 822 to one end of the inner coil pattern portion 822. Additionally, the current supplied to one end of the inner coil pattern portion 822 can be supplied to one end of the second coil pattern portion 830 disposed on the upper surface of the insulating layer 810 through the second through-hole V2. Furthermore, the current supplied to one end of the second coil pattern portion 830 can flow clockwise from one end of the second coil pattern portion 830 to the other end of the second coil pattern portion 830. Furthermore, the current supplied to the other end of the second coil pattern portion 830 can be supplied to the other end of the outer coil pattern portion 821 of the first coil pattern portion 820 disposed on the lower surface of the insulating layer 810 through the first through-hole V1. Furthermore, the current supplied to the other end of the outer coil pattern section 821 can flow counterclockwise from the other end of the outer coil pattern section 821 to one end of the outer coil pattern section 821. Additionally, the current supplied to one end of the outer coil pattern section 821 can be output through the first pad section 840a.

[0214] In this way, by winding the inner coil pattern portion 822 and the outer coil pattern portion 821 of the first coil pattern formed on one surface of the substrate in the same direction and providing current in the same direction, the Lorentz force can be maximized, and maximum efficiency can be guaranteed with only two layers of structure.

[0215] Meanwhile, the first pad portion 840a includes a first-1 unit pad 841a, a first-2 unit pad 842a, and a first-3 unit pad 843a. The first-1 unit pad 841a, the first-2 unit pad 842a, and the first-3 unit pad 843a can be disposed on the lower surface of the insulating layer 810, spaced apart from each other by a predetermined interval.

[0216] Furthermore, connection patterns are provided between the first-1 unit pad 841a, the first-2 unit pad 842a, and the first-3 unit pad 843a to electrically connect them to each other. For example, the first-1 connection pad 844a may be located between the first-1 unit pad 841a and the first-2 unit pad 842a. The first-1 connection pad 844a may be electrically connected between the first-1 unit pad 841a and the first-2 unit pad 842a. For example, the first-2 connection pad 845a may be located between the first-2 unit pad 842a and the first-3 unit pad 843a. The first-2 connection pad 845a may be electrically connected between the first-2 unit pad 842a and the first-3 unit pad 843a.

[0217] Each of the first-unit pad 841a, the first-unit pad 842a, and the first-unit pad 843a may have a circular shape. Each of the first-unit pad 841a, the first-unit pad 842a, and the first-unit pad 843a may have a diameter of 0.5mm ± 0.1mm, but is not limited thereto.

[0218] The operational reliability of the camera module in the embodiment is determined based on the connection state between the drive substrate 410 and the coil substrate. In this case, the electrical connection between the drive substrate 410 and the coil substrate can be performed by bonding the first pad portion 840a to a first terminal (not shown) formed on the drive substrate 410. In this case, the connectivity between the drive substrate 410 and the coil substrate is improved due to the increased contact area between the first pad portion 840a and the first terminal. Therefore, the bonding in the embodiment is not performed using only one unit pad to bond to the first terminal of the drive substrate 410, but as shown, multiple unit pads separated from each other are used at multiple locations to bond to the first terminal of the drive substrate 410. Therefore, the embodiment can increase the contact area between the first terminal and the first pad portion 840a and increase the design freedom of the terminal position of the drive substrate during module assembly, thereby improving the mutual electrical connection.

[0219] Accordingly, the first pad portion 840b includes a second-first unit pad 841b, a second-second unit pad 842b, and a second-third unit pad 843b. The second-second unit pad 841b, the second-second unit pad 842b, and the second-third unit pad 843b can be disposed on the lower surface of the insulating layer 810, spaced apart from each other by a predetermined interval.

[0220] Furthermore, connection patterns are provided between the second-first unit pad 841b, the second-second unit pad 842b, and the second-third unit pad 843b to electrically connect them to each other. For example, the second-first connection pad 844b may be located between the second-first unit pad 841b and the second-second unit pad 842b. The second-first connection pad 844b can electrically connect the second-first unit pad 841b and the second-second unit pad 842b. For example, the second-second connection pad 845b may be located between the second-second unit pad 842b and the second-third unit pad 843b. The second-second connection pad 845b can electrically connect the second-second unit pad 842b and the second-third unit pad 843b.

[0221] Unit 2-1 pad 841b, unit 2-2 pad 842b, and unit 2-3 pad 843b may each have a circular shape. Each of the unit 2-1 pad 841b, unit 2-2 pad 842b, and unit 2-3 pad 843b may have a diameter of 0.5mm ± 0.1mm, but is not limited thereto.

[0222] In other words, the electrical connection between the drive substrate 410 and the coil substrate can be performed by bonding the second pad portion 840b to the second terminal (not shown) formed on the drive substrate 410. In this case, the connectivity between the drive substrate 410 and the coil substrate is improved because the contact area between the second pad portion 840b and the second terminal is increased. Therefore, in this embodiment, the bonding is not performed using only one unit pad to bond to the second terminal of the drive substrate 410, but as shown in the figure, multiple unit pads separated from each other are used at multiple locations to perform the bonding to the second terminal of the drive substrate 410. Therefore, this embodiment can increase the contact area between the second terminal and the second pad portion 840b, thereby improving the mutual electrical connectivity.

[0223] The following text will describe variations of the above coil pattern.

[0224] Figure 4 and 5 The coil substrate in the coil consists of four units. In other words, Figure 4 and 5The coil substrate includes insulating layers that are separated from each other, and first coil units 422, 423, 424 and 425 of first coil pattern portions 820 and second coil pattern portions 830 disposed on the upper and lower surfaces of each of the separated insulating layers.

[0225] Optionally, all four coil units 422, 423, 424 and 425 in the coil substrate can be disposed on an insulating layer.

[0226] Figure 7a and Figure 7b It is shown Figure 4 and 5 A view of a variant of the coil substrate shown.

[0227] Figure 7a This is a top view of the coil substrate. Figure 7b This is a bottom view of the coil substrate.

[0228] refer to Figure 7a In addition to 7B, the coil substrate may include an insulating layer 810a. The insulating layer 810a may include a curved surface. The inner side of the insulating layer 810a may include a curved surface. The through hole 811 may pass through the upper and lower surfaces of the center of the insulating layer 810a. The through hole 811 may be the area corresponding to the aforementioned lens portion.

[0229] A bonding hole h can be formed in the corner region of the insulating layer 810a. The bonding hole h can be used to bond the coil substrate including the insulating layer 810a to the drive substrate 410.

[0230] The insulating layer 810a may have a rectangular shape as a whole on a plane, but is not limited to this.

[0231] The insulating layer 810a may include four corner portions. In addition, a first coil pattern portion 820, a second coil pattern portion 830, a first pad portion 840a, and a second pad portion 840b, including the first coil units to the fourth coil units 422, 423, 424, and 425, may be provided at the four corners of the insulating layer 810a.

[0232] For example, the second coil pattern portion 830a of the first coil unit 422 may be provided at a first corner portion of the upper surface of the insulating layer 810a. For example, the second coil pattern portion 830b of the second coil unit 423 may be provided at a second corner portion of the upper surface of the insulating layer 810a. For example, the second coil pattern portion 830c of the third coil unit 424 may be provided at a third corner portion of the upper surface of the insulating layer 810a. For example, the second coil pattern portion 830d of the fourth coil unit 422 may be provided at a fourth corner portion of the upper surface of the insulating layer 810a.

[0233] For example, the inner coil pattern portion 822a, outer coil pattern portion 821a, first pad portion 840a1, and second pad portion 840b1 of the first coil pattern portion 820a of the first coil unit 422 can be provided at a first corner portion of the lower surface of the insulating layer 810. For example, the inner coil pattern portion 822b, outer coil pattern portion 821b, first pad portion 840a2, and second pad portion 840b2 of the first coil pattern portion 820b of the second coil unit 423 can be provided at a second corner portion of the lower surface of the insulating layer 810. For example, the inner coil pattern portion 822c, outer coil pattern portion 821c, first pad portion 840a3, and second pad portion 840b3 of the first coil pattern portion 820c of the third coil unit 424 can be provided at a third corner portion of the lower surface of the insulating layer 810. For example, the inner coil pattern portion 822d, the outer coil pattern portion 821d, the first pad portion 840a4, and the second pad portion 840b4 of the first coil pattern portion 820d of the fourth coil unit 425 can be provided at the fourth corner portion of the lower surface of the insulating layer 810.

[0234] Figure 8a This is a top view of a coil substrate according to another embodiment. Figure 8b This is a bottom view of a coil substrate according to another embodiment.

[0235] refer to Figure 8a In configuration 8B, the coil substrate includes an insulating layer 810. Furthermore, a first coil pattern portion 820 is disposed on the lower surface of the insulating layer 810. In this case, the first coil pattern portion 820 includes an inner coil pattern portion 822 and an outer coil pattern portion 821. Furthermore, a second coil pattern portion 830 is disposed on the upper surface of the insulating layer 810. Furthermore, a first pad portion 840a and a second pad portion 840b are disposed on the lower surface of the insulating layer 810 between the inner coil pattern portion 822 and the outer coil pattern portion 821. Furthermore, a first through-hole V1 connecting the outer coil pattern portion 821 and the second coil pattern portion 830 is formed in the insulating layer 810. Additionally, a second through-hole V2 connecting the inner coil pattern portion 822 and the second coil pattern portion 830 is formed in the insulating layer 810.

[0236] Because this has already been referenced above. Figure 4 and 5 A detailed description has been provided, so it will be omitted.

[0237] Meanwhile, the lower surface of the insulating layer 810 may include a first region and a second region other than the first region, and the first coil pattern portion 820, the first pad portion 840a, the second pad portion 840b, the first through hole V1 and the second through hole V2 are disposed in the first region.

[0238] In addition, the upper surface of the insulating layer 810 may include a first region and a second region other than the first region, and the second coil pattern portion 830, the first through hole V1 and the second through hole V2 are disposed in the first region.

[0239] For example, the upper and lower surfaces of the insulating layer 810 may include a first region and a second region other than the first region, with a pattern for transmitting electrical signals disposed in the first region.

[0240] Furthermore, as the area of ​​the second region increases, it may be difficult to uniformly form the thickness of the first coil pattern portion 820 and the second coil pattern portion 830. For example, the thickness of the pattern portion located in the first region adjacent to the second region (region 1-1) may differ from the thickness of the pattern portion located in the first region (region 1-2) excluding region 1-1. Moreover, due to the uneven thickness of the pattern portions, the resistance of the pattern portions may increase, thus reducing the overall Lorentz force. Therefore, virtual pattern portions corresponding to the first coil pattern portion 820 and the second coil pattern portion 830 in the embodiment are formed in the second region.

[0241] The virtual pattern section can refer to a wiring that has the same metal material and shape as the first coil pattern section 820 and the second coil pattern section 830 but does not transmit electrical signals.

[0242] For example, a first virtual pattern portion 850 that is not electrically connected to the first coil pattern portion 820 may be provided on the lower surface of the insulating layer 810. For example, the first virtual pattern portion 850 may be provided in a second region of the lower surface of the insulating layer 810.

[0243] For example, a second virtual pattern portion 860 that is not electrically connected to the second coil pattern portion 830 may be provided on the upper surface of the insulating layer 810. For example, the second virtual pattern portion 860 may be provided in a second region on the upper surface of the insulating layer 810.

[0244] The first virtual pattern portion 850 can be formed simultaneously by extending or winding in the same direction as the first coil pattern portion 820. Alternatively, the first virtual pattern portion 850 can be formed by extending or winding in a direction different from the direction in which the first coil pattern portion 820 extends or winds.

[0245] The second virtual pattern portion 860 can be formed simultaneously by extending or winding in the same direction as the direction in which the second coil pattern portion 830 extends or winds. Alternatively, the second virtual pattern portion 860 can be formed by extending or winding in a direction different from the direction in which the second coil pattern portion 830 extends or winds.

[0246] The first virtual pattern portion 850 can be selectively formed in areas where the first coil pattern portion 820 is not provided, so that the plating thickness of the first coil pattern portion 820 formed on the lower surface of the insulating layer 810 is uniform.

[0247] The second virtual pattern portion 860 can be selectively formed in areas where the second coil pattern portion 830 is not provided, so that the plating thickness of the second coil pattern portion 830 formed on the upper surface of the insulating layer 810 is uniform.

[0248] Specifically, when the photosensitive pattern used to form the first coil pattern portion 820 or the second coil pattern portion 830 is formed only on the upper or lower surface of the insulating layer 810, it may be difficult to uniformly control the plating thickness of the first coil pattern portion 820 or the second coil pattern portion 830 as a whole. Therefore, photosensitive patterns for forming the first virtual pattern portion 850 and the second virtual pattern portion 860 of this embodiment can be additionally formed, thereby making the plating area to be plated in each region of the insulating layer uniform. Therefore, the plating thickness of the first coil pattern portion 820 and the second coil pattern portion 830 can be uniformly controlled by additionally forming the first virtual pattern portion 850 and the second virtual pattern portion 860.

[0249] Meanwhile, the spacing of the first coil pattern portion 820 may differ from the spacing of the first virtual pattern portion 850. Furthermore, the spacing of the second coil pattern portion 830 may differ from the spacing of the second virtual pattern portion 860. This will be described in more detail below.

[0250] Figure 9 This is a view showing a variant example of the first pad portion and the second pad portion according to an embodiment.

[0251] refer to Figure 5 The first pad portion 840a according to an exemplary embodiment includes a plurality of unit pads. Furthermore, the second pad portion 840b according to an exemplary embodiment also includes a plurality of unit pads. This is to increase the contact area between the pad portion and the terminals of the drive substrate 410.

[0252] refer to Figure 9 According to another embodiment, the first pad portion 840a' and the second pad portion 840b' may include only one unit pad.

[0253] That is, the first pad portion 840a' can have an elliptical shape and an elongated strip shape in one direction. In this case, the width of the first pad portion 840a' in the major axis direction can be 1.0 mm to 2.0 mm, but is not limited thereto. Furthermore, the second pad portion 840b' can have an elliptical shape and an elongated strip shape in one direction. In this case, the width of the second pad portion 840b' in the major axis direction can be 1.0 mm to 2.0 mm, but is not limited thereto.

[0254] At the same time, Figure 9 In this embodiment, the first pad portion 840a' and the second pad portion 840b' each include only one strip-shaped unit pad with an elliptical shape, but the embodiment is not limited to this. For example, each of the first pad portion 840a' and the second pad portion 840b' may include multiple unit pads in a strip shape with an elliptical shape.

[0255] In the following text, the thickness, line width, and spacing of each of the first coil pattern portion 820, the second coil pattern portion 830, the first virtual pattern portion 850, and the second virtual pattern portion 860 according to the embodiment will be described in detail.

[0256] Figure 10a This is a top view showing a coil substrate according to an exemplary embodiment. Figure 10b It is along Figure 10a A sectional view taken from region A-A'. Figure 10c It is along Figure 10a A sectional view taken from region B-B'. Figure 10d yes Figure 10a A magnified view of region R1. Refer to the following text. Figures 10a to 10d The second coil pattern portion 830 and the second virtual pattern portion 860 are described on the upper surface of the insulating layer 810.

[0257] refer to Figure 10a The second coil pattern portion 830 can be formed by winding the upper surface of the insulating layer 810 in a clockwise direction from one inner end to the other outer end. In addition, the second virtual pattern portion 860 can be selectively provided on the upper surface of the insulating layer 810 in areas where the second coil pattern portion 830 is not provided.

[0258] refer to Figure 10b The second coil pattern portion 830 can be divided into multiple parts depending on its arrangement position. For example, when the area near the center of the second coil pattern portion 830 is defined as the inner side and the area away from the center is defined as the outer side, the second coil pattern portion 830 can be divided into a first part 831 disposed on the innermost side, a second part 832 disposed on the outermost side, and a third part 833 between the first part 831 and the second part 832.

[0259] The first portion 831 may be disposed adjacent to the center of the second coil pattern portion 830. The first portion 831 may be disposed at a position spaced apart from the center of the second coil pattern portion 830, surrounding the central region of the second coil pattern portion 830. The third portion 833 may be disposed around the first portion 831 at a position spaced apart from the first portion 831. The second portion 832 may be disposed around the outermost portion of the second portion 832 at a position spaced apart from the third portion 833. Therefore, the first portion 831 may include one end of the second coil pattern portion 830, and the second portion 832 may include the other end of the second coil pattern portion 830, and the third portion 833 may be the portion between the one end and the other end.

[0260] The first part 831, the second part 832, and the third part 833 can be defined as regions that overlap with the upper magnet part. For example, the first part 831, the second part 832, and the third part 833 can be configured to overlap with the magnet part in the vertical direction or the optical axis direction.

[0261] The first portion 831, the second portion 832, and the third portion 833 of the second coil pattern portion 830 described above can have corresponding thicknesses T1. For example, in the embodiment, the first portion 831, the second portion 832, and the third portion 833 of the second coil pattern portion 830 can have the same thickness T1 by providing the second virtual pattern portion 860 on the upper surface of the insulating layer 810. For example, the first portion 831, the second portion 832, and the third portion 833 can have a thickness T1 of 20 μm to 60 μm and are provided on the upper surface of the insulating layer 810. More specifically, the first portion 831, the second portion 832, and the third portion 833 can have a thickness T1 of 30 μm to 50 μm. More specifically, the first portion 831, the second portion 832, and the third portion 833 can have a thickness T1 of 35 μm to 45 μm.

[0262] The first part 831 can be configured to be spaced apart from the third part 833 by a predetermined interval. For example, the first part 831 can be configured to be spaced apart from the innermost third part 833 by a predetermined interval. For example, the first part 831 can be configured to be spaced apart from the innermost third part 833 by a first interval d1.

[0263] The second part 832 can be configured to be spaced apart from the third part 833 by a predetermined interval. For example, the second part 832 can be configured to be spaced apart from the outermost third part of the third part 833 by a predetermined interval. For example, the second part 832 can be configured to be spaced apart from the outermost third part of the third part 833 by a second interval d2.

[0264] Furthermore, the third portion 833 can be formed by winding (or rotating or bending) between the first portion 831 and the second portion 832 multiple times. In this case, the third portion 833 can be set to be spaced apart from the first portion 832 and the second portion 833 by a third interval d3.

[0265] The first interval d1, the second interval d2, and the third interval d3 can be formed to have the same or similar dimensions to each other.

[0266] For example, the first interval d1, the second interval d2, and the third interval d3 can satisfy a range of 5 μm to 15 μm. Specifically, the first interval d1, the second interval d2, and the third interval d3 can satisfy a range of 7 μm to 13 μm. More specifically, the first interval d1, the second interval d2, and the third interval d3 can satisfy a range of 9 μm to 11 μm.

[0267] When the first interval d1, the second interval d2, and the third interval d3 are less than 5 μm, the photosensitive pattern may collapse because the linewidth of the photosensitive pattern decreases during the formation of the second coil pattern portion 830, and therefore the linewidth of each part of the second coil pattern portion 830 may become uneven. Furthermore, when the first interval d1, the second interval d2, and the third interval d3 exceed 15 μm, the overall length of the second coil pattern portion 830 may increase.

[0268] Furthermore, the coil of at least one of the first part 831, the second part 832, and the third part 833 may be different from the coil of the others. For example, the first part 831 may have a first line width w1. Additionally, the second part 832 may have a second line width w2. Furthermore, the third part 833 may have a third line width w3. In this case, the first line width w1 of the first part 831 may be larger than the third line width w3 of the third part 833. Furthermore, the second line width w2 of the second part 832 may be larger than the third line width w3 of the third part 833. For example, the first line width w1 of the first part 831 may be the same as the second line width w2 of the second part 832.

[0269] For example, the first line width w1 of the first part 831 and the second line width w2 of the second part 832 can be in the range of 1.1 to 10 times the third line width w3 of the third part 833.

[0270] When the first linewidth w1 of the first part 831 and the second linewidth w2 of the second part 832 are less than 1.1 times the third linewidth w3 of the third part 833, the resistance reduction effect caused by the linewidths of the first part 831 and the second part 832 may not be achieved. When the first linewidth w1 of the first part 831 and the second linewidth w2 of the second part 832 exceed 10 times the third linewidth w3 of the third part 833, the resistance reduction effect caused by the linewidths of the first part 831 and the second part 832 is not significant, and the overall volume of the coil substrate may increase.

[0271] Meanwhile, the linewidth w3 of the third part 833 can be from 22μm to 33μm. In addition, the linewidth w1 of the first part 831 and the linewidth w2 of the second part 832 can be from 30μm to 330μm.

[0272] The first line width w1 of the first part 831 and the second line width w2 of the second part 832 can be configured to be larger than the line width w1 of the first part 831 within the aforementioned line width range.

[0273] refer to Figure 10c The second virtual pattern section 860 can be configured to be adjacent to the first part 831 and the third part 833 of the second coil pattern section 830.

[0274] In this case, the intervals d1, d2, and d3 between the portions of the second coil pattern portion 830 in the embodiment may be different from the interval d4 between the second coil pattern portion 830 and the second virtual pattern portion 860. In this case, the interval d4 between the second coil pattern portion 830 and the second virtual pattern portion 860 may refer to the interval between the first portion 831 and the adjacent second virtual pattern portion 860 or the interval between the third portion 833 and the adjacent second virtual pattern portion 860.

[0275] The spacing d4 between the second coil pattern portion 830 and the second virtual pattern portion 860 can be from 3 μm to 1000 μm. The range of spacing d4 between the second coil pattern portion 830 and the second virtual pattern portion 860 is taken into account the thickness and reliability of the second coil pattern portion 830. Specifically, when the spacing d4 between the second coil pattern portion 830 and the second virtual pattern portion 860 is less than 3 μm, the linewidth of the second coil pattern portion 830 and the second virtual pattern portion 860 is too small, and therefore the photosensitive pattern may collapse. Furthermore, when the photosensitive pattern collapses, the second coil pattern portion 830 and the second virtual pattern portion 860 may come into contact with each other, thus the linewidth of the second coil pattern portion 830 becomes uneven, and therefore the function of the second virtual pattern portion 860 cannot be fully performed. Furthermore, when the interval d4 between the second coil pattern portion 830 and the second virtual pattern portion 860 exceeds 1000 μm, the interval between the second coil pattern portion 830 and the second virtual pattern portion 860 becomes too far, and therefore the electroplating uniformity effect based on the second virtual pattern portion 860 cannot be fully achieved.

[0276] refer to Figure 10d As described above, the second coil pattern portion 830 can be divided into multiple parts according to its position, but unlike that, it can be divided into multiple regions according to its extension direction.

[0277] For example, the second coil pattern portion 830 can be divided into multiple regions according to its orientation. For example, the second coil pattern portion 830 includes a first region 830-1 extending along a first direction, a second region 830-2 extending along a second direction, and a third region 830-3 whose orientation changes between the first region 830-1 and the second region 830-2.

[0278] Specifically, the first region 830-1 and the second region 830-2 may include portions of the second coil pattern portion 830 extending in one direction (e.g., a straight line). Furthermore, the third region 830-3 may be a region where the orientation of the second coil pattern portion 830 changes from one direction to another. For example, the third portion 830-3 may include a curved portion of the second coil pattern portion 830.

[0279] In this case, the quantity of the third region 830-3 can vary according to the orientation of the first region 830-1 and the second region 830-2, for example, as Figure 10a As shown, the third region 830-3 can include eight regions.

[0280] Here, the spacing d5 between patterns in the third region 830-3 may be different from the spacing d1 between patterns in the first region 830-1 or the second region 830-2. For example, the spacing d5 between patterns in the third region 830-3 may be different from the spacing d1 between patterns in the first region 830-1 or the second region 830-2.

[0281] In other words, in order to form a pattern in the third region 830-3, it is necessary to bend and form a corresponding photosensitive pattern. However, due to the properties of the material of the photosensitive pattern, it may easily collapse when bent. Therefore, in this embodiment, the width of the photosensitive pattern in the third region 830-3 is larger than the width of the photosensitive pattern in other regions, thereby preventing the collapse of the photosensitive pattern in the bent region and thus improving the reliability of the pattern.

[0282] For example, the spacing d1 can be from 5 μm to 15 μm. When the spacing d1 is less than 5 μm, the photosensitive pattern may collapse and the linewidth may become uneven because the linewidth of the photosensitive pattern decreases during the formation of the second coil pattern portion 830. Furthermore, when the spacing d1 is greater than 15 μm, the area of ​​the second coil pattern portion 830 may increase overall.

[0283] Furthermore, the spacing d5 in the third region 830-3 can be from 30 μm to 70 μm. When the spacing d5 is less than 30 μm, the photosensitive pattern may collapse in the curved region, and the linewidth of the pattern may become uneven. In addition, when the spacing d2 is greater than 70 μm, the curvature of the pattern in the curved region becomes too large, thereby potentially increasing the overall area of ​​the second coil pattern portion 830.

[0284] The first coil pattern portion 820 will be described below. However, in the following description of the first coil pattern portion 820, detailed descriptions of portions substantially the same as those of the aforementioned second coil pattern portion 830 will be omitted. For example, the interval between the first coil pattern portion 820 and the first virtual pattern portion 850 may correspond to the aforementioned interval between the second coil pattern portion 830 and the second virtual pattern portion.

[0285] Figure 11a This is a bottom view showing a coil substrate according to an exemplary embodiment. Figure 11b This illustrates the process according to an exemplary embodiment. Figure 11a The view of the section view taken from region C-C'. Figure 11c This illustrates the process according to an exemplary embodiment. Figure 11a The view of the section view taken from region C-C'. Figure 11d yes Figure 11a A magnified view of region R2.

[0286] The basic structural features of the first coil pattern section 820 can correspond to the basic structural features of the second coil pattern section 830. However, unlike the second coil pattern section 830, the first coil pattern section 820 includes an outer coil pattern section 821 and an inner coil pattern section 822.

[0287] Therefore, the outermost portion of the first coil pattern portion 820 may only include the outermost portion of the outer coil pattern portion 821 in the entire region where the outer coil pattern portion 821 and the inner coil pattern portion 822 are combined. Alternatively, the outermost portion of the first coil pattern portion 820 may include both the outermost portion of the outer coil pattern portion 821 and the outermost portion of the inner coil pattern portion 822 in the partitioned region dividing each of the outer coil pattern portion 821 and the inner coil pattern portion 822. Therefore, the characteristics of the outermost portion in the portion describing the structural features of the second coil pattern portion 830 may apply only to the outermost portion of the outer coil pattern portion 821, or it may apply to both the outermost portion of the outer coil pattern portion 821 and the outermost portion of the inner coil pattern portion 822. Furthermore, the characteristics of the innermost portion in the portion describing the structural features of the second coil pattern portion 830 may apply only to the innermost portion of the outer coil pattern portion 821, or it may apply to both the innermost portion of the outer coil pattern portion 821 and the innermost portion of the inner coil pattern portion 822.

[0288] First, the characteristics of the outermost and innermost portions of the second coil pattern portion 830 described above will be applied only to the outermost portion of the outer coil pattern portion 821 and the innermost portion of the inner coil pattern portion 822.

[0289] refer to Figure 11a On the lower surface of the insulating layer 810, an inner coil pattern portion 822 is provided inside the area where the first pad portion 840a and the second pad portion 840b are provided; on the lower surface of the insulating layer 810, an outer coil pattern portion 821 is provided outside the area where the first pad portion 840a and the second pad portion 840b are provided. Furthermore, each of the inner coil pattern portion 822 and the outer coil pattern portion 821 can be formed by winding in a clockwise direction from one end to the other. Additionally, on the lower surface of the insulating layer 810, a first virtual pattern portion 850 can be selectively provided in areas where the inner coil pattern portion 822 and the outer coil pattern portion 821 are not provided.

[0290] refer to Figure 11bThe inner coil pattern portion 822 and the outer coil pattern portion 821 can be divided into multiple parts according to their arrangement. For example, when the area near the center of the first coil pattern portion 820 is defined as the inner side and the area away from the center is defined as the outer side, the outer coil pattern portion 821 may include a first part 821-1 disposed on the innermost side, a second part 821-2 disposed on the outermost side, and a third part 821-3 disposed between them. Similarly, the inner coil pattern portion 822 may include a first part 821-1 disposed on the innermost side, a second part 822-2 disposed on the outermost side, and a third part 822-3 disposed between them.

[0291] In this case, since the division of each part of the inner coil pattern section 822 and the outer coil pattern section 821 has already been described in the second coil pattern section 830, its detailed description will be omitted.

[0292] The first portion 821-1, the second portion 821-2, and the third portion 821-3 of the outer coil pattern portion 821 may have a thickness T1 corresponding to each other. Similarly, the first portion 822-1, the second portion 822-2, and the third portion 822-3 of the inner coil pattern portion 822 may have a thickness T1 corresponding to each other. For example, the thickness of each portion of the outer coil pattern portion 821 may be the same as the thickness of each portion of the inner coil pattern portion 822. For example, the thickness of each portion of the outer coil pattern portion 821 may be the same as the thickness of each portion of the second coil pattern portion 830. For example, the thickness of each portion of the inner coil pattern portion 822 may be the same as the thickness of each portion of the second coil pattern portion 830.

[0293] For example, the thickness of each portion of the inner coil pattern portion 822 and the outer coil pattern portion 821 in this embodiment can be controlled to be uniform by disposing the first virtual pattern portion 850 on the lower surface of the insulating layer 810. For example, each portion of the inner coil pattern portion 822 and each portion of the outer coil pattern portion 821 may have a thickness T1 of 30 μm to 50 μm. More specifically, each portion of the inner coil pattern portion 822 and each portion of the outer coil pattern portion 821 may have a thickness T1 of 35 μm to 45 μm.

[0294] The first portion 821-1 of the outer coil pattern portion 821 can be configured to be spaced apart from the third portion 821-3 of the outer coil pattern portion 821 by a predetermined interval. For example, the first portion 821-1 of the outer coil pattern portion 821 can be configured to be spaced apart from the innermost third portion of the third portion 821-3 by a predetermined interval. For example, the first portion 821-1 of the outer coil pattern portion 821 can be configured to be spaced apart from the innermost third portion of the third portion 821-3 by a first interval d1'.

[0295] The second portion 821-2 of the outer coil pattern portion 821 can be configured to be spaced apart from the third portion 821-3 by a predetermined interval. For example, the second portion 821-2 of the outer coil pattern portion 821 can be configured to be spaced apart from the outermost third portion of the third portion 821-3 by a predetermined interval. For example, the second portion 821-2 of the outer coil pattern portion 821 can be configured to be spaced apart from the outermost third portion of the third portion 821-3 by a second interval d2'.

[0296] Furthermore, the third portion 821-3 of the outer coil pattern portion 821 can be wound (or rotated or bent) multiple times between the first portion 821-1 and the second portion 821-2. In this case, the third portion 821-3 of the outer coil pattern portion 821 can be set to be spaced apart from each other by a third interval d3' between the first portion 821-2 and the second portion 821-3.

[0297] The first interval d1', the second interval d2', and the third interval d3' can have the same or similar size.

[0298] For example, the first spacing d1', the second spacing d2', and the third spacing d3' can satisfy a range of 5 μm to 15 μm. Specifically, the first spacing d1', the second spacing d2', and the third spacing d3' can satisfy a range of 7 μm to 13 μm. More specifically, the first spacing d1', the second spacing d2', and the third spacing d3' can satisfy a range of 9 μm to 11 μm.

[0299] When the first interval d1', the second interval d2', and the third interval d3' are less than 5 μm, the photosensitive pattern may collapse due to the reduced linewidth during the processing of the outer coil pattern section 821, thus the linewidth of each part of the outer coil pattern section 821 may become uneven. Furthermore, when the first interval d1', the second interval d2', and the third interval d3' exceed 15 μm, the overall length of the outer coil pattern section 821 may increase.

[0300] Simultaneously, the line width of at least one of the first portion 821-1, the second portion 821-2, and the third portion 821-3 of the outer coil pattern portion 821 may be different from the line widths of the others. For example, the first portion 821-1 of the outer coil pattern portion 821 may have a first line width w1'. Furthermore, the second portion 821-2 of the outer coil pattern portion 821 may have a second line width w2'. Furthermore, the third portion 821-3 of the outer coil pattern portion 821 may have a third line width w3'. In this case, the first line width w1' of the first portion 821-1 of the outer coil pattern portion 821 may correspond to the third line width w3' of the third portion 821-3. Furthermore, the second line width w2' of the second portion 821-2 of the outer coil pattern portion 821 may be larger than the third line width w3' of the third portion 821-3 and the first line width w1' of the first portion 821-1.

[0301] For example, the second line width w2' of the second part 821-2 can be in the range of 1.1 to 10 times the first line width w1' of the first part 821-1 and the third line width w3' of the third part 821-3.

[0302] When the second linewidth w2' of the second part 821-2 is less than 1.1 times the first linewidth w1' and the third linewidth w3' of the first part 831, the resistance reduction effect caused by the linewidth of the second part 821-2 cannot be achieved. When the second linewidth w2' of the second part 821-2 exceeds 10 times the first linewidth w1' of the first part 821-1 and the third linewidth w3' of the third part 821-3, the resistance reduction effect caused by the linewidth of the second part 821-2 is not significant, and may even increase the overall volume of the coil substrate.

[0303] Meanwhile, the first linewidth w1' of the first part 821-1 and the linewidth w3' of the third part 821-3 can be from 22μm to 33μm. In addition, the linewidth w2' of the second part 821-2 can be from 30μm to 330μm.

[0304] Meanwhile, the first portion 822-1 of the inner coil pattern portion 822 can be configured to be spaced apart from the third portion 822-3 of the inner coil pattern portion 822 by a predetermined interval. For example, the first portion 822-1 of the inner coil pattern portion 822 can be configured to be spaced apart from the innermost third portion of the third portion 822-3 by a predetermined interval. For example, the first portion 822-1 of the inner coil pattern portion 822 can be configured to be spaced apart from the innermost third portion of the third portion 822-3 by a first interval d1.

[0305] The second portion 822-2 of the inner coil pattern portion 822 can be configured to be spaced apart from the third portion 822-3 by a predetermined interval. For example, the second portion 822-2 of the inner coil pattern portion 822 can be configured to be spaced apart from the outermost third portion of the third portion 822-3 by a predetermined interval. For example, the second portion 822-2 of the inner coil pattern portion 822 can be configured to be spaced apart from the outermost third portion of the third portion 822-3 by a second interval d2.

[0306] Furthermore, the third portion 822-3 of the inner coil pattern portion 822 can be wound (or rotated or bent) multiple times between the first portion 822-1 and the second portion 822-2. In this case, the third portion 822-3 of the inner coil pattern portion 822 can be set to be spaced apart from each other by a third interval d3 between the first portion 822-2 and the second portion 822-3.

[0307] The first interval d1”, the second interval d2”, and the third interval d3” are substantially the same as the first interval d1’, the second interval d2’, and the second interval d3’, and their detailed descriptions will be omitted.

[0308] Meanwhile, the line width of at least one of the first portion 822-1, the second portion 822-2, and the third portion 822-3 of the inner coil pattern portion 822 may be different from the line widths of the others. For example, the first portion 822-1 of the inner coil pattern portion 822 may have a first line width w1". Furthermore, the second portion 822-2 of the inner coil pattern portion 822 may have a second line width w2". Furthermore, the third portion 822-3 of the inner coil pattern portion 822 may have a third line width w3". In this case, the first line width w1" is substantially the same as the line width w1 of the innermost portion of the second coil pattern portion 830 and the line width w2' of the outermost portion of the outer coil pattern portion 821, and its detailed description will be omitted.

[0309] Furthermore, the line width w2” of the second part 822-2 and the line width w3” of the third part 822-3 of the inner coil pattern section 822 can be the same as each other, and since this has already been described above, its detailed description will be omitted.

[0310] On the other hand, when the inner coil pattern portion 822 and the outer coil pattern portion 821 mentioned above are considered as a combined coil, only the outermost and innermost portions change the line width of the pattern.

[0311] Or, such as Figure 11c As shown, the inner coil pattern portion 822 and the outer coil pattern portion 821 are each considered as separate coils. Therefore, the line width of the outermost and innermost portions of the inner coil pattern portion 822 can be changed, and correspondingly, the line width of the outermost and innermost portions of the outer coil pattern portion 821 can be changed.

[0312] For example, the coil of at least one of the first portion 821-1a, the second portion 821-2, and the third portion 821-3 of the outer coil pattern portion 821 can be different from the coils of the others. For example, the first portion 821-1 of the outer coil pattern portion 821 can have a first line width w1a'. Furthermore, the second portion 821-2 of the outer coil pattern portion 821 can have a second line width w2'. Furthermore, the third portion 821-3 of the outer coil pattern portion 821 can have a third line width w3'. At this time, since the second line width w2' and the third line width w3' are already... Figure 11b The description is already provided, so its detailed description will be omitted.

[0313] However, Figure 11b The first line width w1' and the third line width w3 are the same, but Figure 11c The line width w1a' of the first part 821-1a of the outer coil pattern part 821 can be the same as the line width w2' of the second part 821-2 located on the outermost side, and is greater than the line width w3' of the third part 821-3.

[0314] Furthermore, at least one of the first portion 822-1, the second portion 822-2a, and the third portion 822-3 of the inner coil pattern portion 821 may have a different line width than the others. For example, the first portion 822-1 of the inner coil pattern portion 822 may have a first line width w1". Furthermore, the second portion 822-2a of the inner coil pattern portion 822 may have a second line width w2a". Furthermore, the third portion 822-3 of the inner coil pattern portion 822 may have a third line width w3'. At this time, since the first line width w1" and the third line width w3" are already... Figure 11b The description is already provided, so its detailed description will be omitted.

[0315] However, Figure 11b The second line width w2” is the same as the third line width w3, but Figure 11c The line width w2a” of the second part 822-2a of the inner coil pattern part 822 can be the same as the line width w1” of the first part 822-1 located on the innermost side, and is greater than the line width w3” of the third part 822-3.

[0316] refer to Figure 11d As described above, the first coil pattern portion 820 can be divided into multiple parts according to its position, but unlike that, it can be divided into multiple regions according to its extension direction.

[0317] For example, the outer coil pattern section 821 can be divided into multiple regions according to its orientation. For example, the outer coil pattern section 821 includes a first region 821-4 extending along a first direction, a second region 821-5 extending along a second direction, and a third region 821-6 that changes direction between the first region 821-4 and the second region 821-5.

[0318] In detail, the first region 821-4 and the second region 821-5 of the outer coil pattern portion 821 may include portions of the outer coil pattern portion 821 extending in one direction (e.g., a straight line). Furthermore, the third region 821-6 of the outer coil pattern portion 821 may be a region where the directionality of the outer coil pattern portion 821 changes from one direction to another. For example, the third portion 821-6 of the outer coil pattern portion 821 may include a curved portion of the outer coil pattern portion 821.

[0319] In this case, the number of third regions 821-6 of the outer coil pattern portion 821 can vary according to the orientation of the first region 821-4 and the second region 821-5, for example, as Figure 10a As shown, the third region 821-6 can include eight regions.

[0320] Here, the spacing d5' between the patterns in the third region 821-6 of the outer coil pattern section 821 may be different from the spacing d1' between the patterns in the first region 821-4 or the second region 821-5. For example, the spacing d5' between the patterns in the third region 821-6 of the outer coil pattern section 821 may be different from the spacing d1' between the patterns in the first region 821-4 or the second region 821-5.

[0321] In other words, in order to form a pattern in the third region 821-5 of the outer coil patterning section 821, it is also necessary to bend and form a corresponding photosensitive pattern. However, due to the characteristics of the photosensitive pattern material, it may easily collapse when bent. Therefore, in this embodiment, the width of the photosensitive pattern in the third region 821-6 of the outer coil patterning section 821 is greater than the width of the photosensitive pattern in other regions, thus preventing the collapse of the photosensitive pattern in the bending region and thereby improving the reliability of the pattern.

[0322] For example, the inner coil pattern portion 822 can be divided into multiple regions according to its orientation. For example, the inner coil pattern portion 822 includes a first region 822-4 extending along a first direction, a second region 822-5 extending along a second direction, and a third region 822-6 that changes direction between the first region 822-4 and the second region 822-5.

[0323] Specifically, the first region 822-4 and the second region 822-5 of the inner coil pattern portion 822 may include portions of the inner coil pattern portion 822 extending in one direction (e.g., a straight line). Furthermore, the third region 822-6 of the inner coil pattern portion 822 may be a region where the directionality of the inner coil pattern portion 822 changes from one direction to another. For example, the third portion 822-6 of the inner coil pattern portion 822 may include a curved portion of the inner coil pattern portion 822.

[0324] In this case, the number of third regions 822-6 of the inner coil pattern portion 822 can vary according to the orientation of the first region 822-4 and the second region 822-5, for example, as Figure 10a As shown, the third region 822-6 can include four regions.

[0325] Here, the spacing d5” between patterns in the third region 822-6 of the inner coil pattern section 822 may be different from the spacing d1” between patterns in the first region 822-4 or the second region 822-5. For example, the spacing d5” between patterns in the third region 822-6 of the inner coil pattern section 822 may be different from the spacing d1” between patterns in the first region 822-4 or the second region 822-5.

[0326] In other words, in order to form a pattern in the third region 822-5 of the inner coil patterning section 822, it is also necessary to bend and form a corresponding photosensitive pattern. However, due to the characteristics of the photosensitive pattern material, it may easily collapse when bent. Therefore, in this embodiment, the width of the photosensitive pattern in the third region 822-6 of the inner coil patterning section 822 is greater than the width of the photosensitive pattern in other regions, thus preventing the collapse of the photosensitive pattern in the bending region and thereby improving the reliability of the pattern.

[0327] According to an embodiment, the coil substrate includes a first coil pattern portion 820 disposed on the lower surface of the insulating layer 810 and a second coil pattern portion 830 disposed on the upper surface of the insulating layer 810. In this case, the first coil pattern portion 820 and the second coil pattern portion 830 can be wound from the inside out in the same direction. Therefore, by forming the first coil pattern portion 820 and the second coil pattern portion 830 to be wound from the inside out in the same direction, the process of forming a coil pattern on the insulating layer 810 of the embodiment can be simplified. Furthermore, since the current flows in the same direction in the inner / outer coil of the first coil pattern portion 820 of the embodiment, the Lorentz force generated according to the rotation direction of the coil can be maximized. In addition, the Lorentz force for OIS can be ensured using only two layers of coil pattern.

[0328] Furthermore, the first coil pattern portion 820 of the embodiment includes an outer coil pattern portion 821 disposed on its outer side and an inner coil pattern portion 822 disposed on its inner side, with a first pad portion 840a and a second pad portion 840b located between them. Since the coil pattern portion and the pad portion of the embodiment are disposed on the same layer, it is not necessary to configure a separate layer to form the pad portion, thus simplifying the manufacturing process and reducing manufacturing costs. Moreover, since the number of turns of the first coil pattern portion 820 can be increased, the Lorentz force generated by the first coil pattern portion 820 can be maximized, and therefore the operational reliability of the OIS can be ensured with only a two-layer structure.

[0329] Furthermore, the coil pattern portion of the embodiment includes an inner coil pattern portion 822 and an outer coil pattern portion 821, which are respectively disposed on the outer and inner sides of the first pad portion 840a and the second pad portion 840b, rather than on one side of the first pad portion 840a and the second pad portion 840b. Therefore, the overall width of the outer side of the first coil pattern portion 820 can be kept to its maximum, thereby increasing the strength of the Lorentz force. Furthermore, by disposing of the inner coil pattern portion 822 and the outer coil pattern portion 821 on the outer and inner sides of the first pad portion 840a and the second pad portion 840b, the position of the embodiment in the vertical direction can be kept balanced with the position of the magnet portion. In other words, the phenomenon that the Lorentz force generated when the first coil exists only on one side (inner / outer) can be minimized, thus improving the reliability of OIS operation.

[0330] Furthermore, the bonding between the drive substrate 410 and the coil substrate is not performed using only a single unit pad, but rather using multiple unit pads at multiple locations to perform bonding between the terminals of the drive substrate 410 and the coil substrate. Therefore, the contact area between the terminals of the drive substrate and the pad portions of the coil substrate according to the embodiment can be increased, thereby improving mutual electrical connectivity.

[0331] Furthermore, in this embodiment, the first virtual pattern portion 850 and the second virtual pattern portion 860 are formed in areas on the upper and lower surfaces of the insulating layer 810 where the first coil pattern portion 820 and the second coil pattern portion 830 are not provided. Accordingly, by forming the first virtual pattern portion 850 and the second virtual pattern portion 860, the electroplating area performed in the entire area of ​​the insulating layer can be made uniform, and thus the plating thickness of the first coil pattern portion 820 and the second coil pattern portion 830 can be controlled to be uniform.

[0332] Therefore, the thickness of the coil pattern portion used to prevent hand shake in the camera module according to the embodiment can be sufficiently ensured, thereby reducing the resistance of the coil substrate. Consequently, the electromotive force of the coil substrate can be sufficiently generated, thereby improving the characteristics of the coil substrate and enhancing the hand shake prevention characteristics of the camera module including the coil substrate.

[0333] Furthermore, the spacing of the coil pattern portions can be formed differently for each region in the coil substrate of the embodiment. Specifically, the coil pattern portions can be formed such that the spacing between patterns in the curved region is larger than the spacing between patterns in other regions. Therefore, when forming the coil pattern portions of the embodiment, the linewidth of the photosensitive pattern can be increased, thereby preventing the photosensitive pattern, which is weakly supported in the curved region, from collapsing. Specifically, by forming a larger photosensitive pattern in the curved region implemented with the fine linewidth of this embodiment than in other regions, the photosensitive pattern can be stably formed even in the curved region. Therefore, the coil substrate according to the embodiment can prevent short circuits between coil patterns in the curved region, thereby improving reliability.

[0334] Furthermore, the linewidths of the innermost and / or outermost portions of the coil pattern in the coil substrate of the embodiment can be formed to be different from the linewidths of the patterns disposed between them. Specifically, the linewidths of the innermost and / or outermost portions of the coil pattern in the embodiment can be formed to be greater than the linewidths of the patterns disposed between them. Therefore, in the embodiment, the resistance can be reduced by increasing the pattern linewidth, which is a variable of the resistance of the coil pattern.

[0335] The features, structures, effects, etc., described in the above embodiments are included in at least one implementation and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., shown in the embodiments can be combined or modified by those skilled in the art for other embodiments. Therefore, content related to such combinations and variations should be interpreted as being included within the scope of the embodiments.

[0336] The above description mainly focuses on the embodiments, but this is merely an example and does not limit the scope of these embodiments. Those skilled in the art will understand that various modifications and applications not shown above are possible without departing from the basic characteristics of these embodiments. For example, the various components specifically shown in this embodiment can be implemented through modifications. Furthermore, the differences associated with these modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

Claims

1. A coil substrate, comprising: Insulating layer; A first coil pattern portion is disposed on one surface of the insulating layer; A second coil pattern portion is disposed on another surface of the insulating layer; and The pad portion is disposed on one surface of the insulating layer and connected to the first coil pattern portion. The first coil pattern portion includes: Inner coil pattern section; and The outer coil pattern portion is spaced apart from the inner coil pattern portion by a predetermined interval and is positioned to surround the outer side of the inner coil pattern portion. The pad portion is disposed between the outer side of the inner coil pattern portion and the inner side of the outer coil pattern portion, and The inner coil pattern portion is electrically connected to the second coil pattern portion through a first through hole. The outer coil pattern portion is electrically connected to the second coil pattern portion through a second through hole. The inner coil pattern portion, the outer coil pattern portion, and the second coil pattern portion are each formed by winding in a direction from the inside to the outside, and the winding directions of the inner coil pattern portion, the outer coil pattern portion, and the second coil pattern portion are the same. The pad portion includes multiple unit pads and a connection pattern connecting the multiple unit pads.

2. The coil substrate according to claim 1, wherein, The pad portion includes: A first solder pad portion, the first solder pad portion being connected to one end of the outer coil pattern portion; and The second pad portion is connected to the other end of the inner coil pattern portion.

3. The coil substrate according to claim 2, wherein, The first pad portion includes: The first-1 unit pad is connected to one end of the outer coil pattern portion; The first and second unit pads are spaced apart from the first and first unit pads; and A first connection pattern connects the first-1 unit pad and the first-2 unit pad; The second pad portion includes: The second-1 unit pad is connected to the other end of the inner coil pattern portion; The second-2 unit pad is spaced apart from the second-1 unit pad; and The second connection pattern connects the 2-1 unit pad and the 2-2 unit pad.

4. The coil substrate according to claim 2, wherein, The first through-hole passes through the insulating layer, one surface of the first through-hole is connected to the other end of the outer coil pattern portion, and the other surface of the first through-hole is connected to the other end of the second coil pattern portion; and The second through-hole passes through the insulating layer, one surface of the second through-hole is connected to one end of the inner coil pattern portion, and the other surface of the second through-hole is connected to one end of the second coil pattern portion. The inner coil pattern portion is electrically connected to the outer coil pattern portion through the first through hole, the second through hole, and the second coil pattern portion.

5. The coil substrate according to claim 1, wherein, The outer width of the first coil pattern portion, corresponding to the outer width of the outer coil pattern portion, is the same as the outer width of the second coil pattern portion, and Wherein, the inner width of the first coil pattern portion, which corresponds to the inner width of the inner coil pattern portion, is the same as the inner width of the second coil pattern portion.

6. The coil substrate according to claim 1, further comprising: A first virtual pattern portion is disposed on one surface of the insulating layer and spaced apart from the first coil pattern portion; as well as The second virtual pattern portion is disposed on the other surface of the insulating layer and spaced apart from the second coil pattern portion.

7. The coil substrate according to claim 6, wherein, The first virtual pattern portion is disposed on one surface of the insulating layer at a position spaced apart from the outer coil pattern portion and the inner coil pattern portion, between the outer coil pattern portion and the inner coil pattern portion.

8. The coil substrate according to claim 1, wherein, At least one of the first coil pattern portion and the second coil pattern portion includes: A first region, which extends along a first direction; A second region, the second region extending along a second direction different from the first direction; and The third region, in which the orientation of the coil pattern portion changes between the first region and the second region; The spacing between the coil pattern portions in the third region is larger than the spacing between the coil pattern portions in the first region or the second region.

9. The coil substrate according to claim 1, wherein, At least one of the inner coil pattern portion, the outer coil pattern portion, and the second coil pattern portion includes: The first part, the first part is located on the innermost side; The second part, which is located on the outermost side; and The third part is located between the first part and the second part; and Wherein, at least one of the line widths of the first part and the second part is greater than the line width of the third part.

10. The coil substrate according to claim 1, wherein, The inner coil pattern portion and the outer coil pattern portion of the first coil pattern portion are disposed on the same plane on one surface of the insulating layer.

11. The coil substrate according to claim 10, wherein, The upper surface of the inner coil pattern portion and the upper surface of the outer coil pattern portion are located on the same plane.

12. The coil substrate according to claim 10, wherein, The lower surface of the inner coil pattern portion and the lower surface of the outer coil pattern portion are located on the same plane.

13. The coil substrate according to claim 1, wherein, The second coil pattern portion includes: A first region, which overlaps perpendicularly with the inner coil pattern portion; The second region, which overlaps perpendicularly with the outer coil pattern portion; and The third region overlaps perpendicularly with the gap between the inner coil pattern portion and the outer coil pattern portion.

14. The coil substrate according to claim 13, wherein, The third region of the second coil pattern includes a portion that overlaps perpendicularly with the pad portion.

15. A camera module, comprising: A first moving element is disposed on a side surface of the lens portion to move the lens portion; The second mover is configured to be opposite to the first mover and disposed on the side surface of the first mover; A stator is disposed opposite to the lower side of the second mover to allow the second mover to move, and the stator has a through hole formed in the center corresponding to the lens portion; as well as A base that supports the stator and the second rotor, and the base having a hollow hole at its center corresponding to the through hole of the second rotor; The stator includes a driving substrate and two or more coil substrates disposed on the driving substrate. Each of the coil substrates includes: Insulating layer; A first coil pattern portion is disposed on one surface of the insulating layer; A second coil pattern portion is disposed on another surface of the insulating layer; and The pad portion is disposed on one surface of the insulating layer and connected to the first coil pattern portion. The first coil pattern portion includes: Inner coil pattern section; and An outer coil pattern portion, which is spaced apart from the inner coil pattern portion by a predetermined distance and is positioned to surround the outer side of the inner coil pattern portion, and The pad portion is disposed between the outer side of the inner coil pattern portion and the inner side of the inner coil pattern portion, and The inner coil pattern portion is electrically connected to the second coil pattern portion through a first through hole. The outer coil pattern portion is electrically connected to the second coil pattern portion through a second through hole. The inner coil pattern portion, the outer coil pattern portion, and the second coil pattern portion are each formed by winding in a direction from the inside to the outside, and the winding directions of the inner coil pattern portion, the outer coil pattern portion, and the second coil pattern portion are the same. The pad portion includes multiple unit pads and a connection pattern connecting the multiple unit pads.

16. The camera module according to claim 15, wherein, The first through hole passes through the insulating layer, one surface of the first through hole is connected to the other end of the outer coil pattern portion, and the other surface of the first through hole is connected to the other end of the second coil pattern portion; The second through-hole passes through the insulating layer, one surface of the second through-hole is connected to one end of the inner coil pattern portion, and the other surface of the second through-hole is connected to one end of the second coil pattern portion. The inner coil pattern portion is electrically connected to the outer coil pattern portion through the first through hole, the second through hole, and the second coil pattern portion.

17. The camera module according to claim 15, wherein, The inner coil pattern portion and the outer coil pattern portion of the first coil pattern portion are disposed on the same plane on one surface of the insulating layer.

18. The camera module according to claim 17, wherein, At least one of the upper and lower surfaces of the inner coil pattern portion is located on the same plane as at least one of the upper and lower surfaces of the outer coil pattern portion.

19. The camera module according to claim 15, wherein, The second coil pattern portion includes: A first region, which overlaps perpendicularly with the inner coil pattern portion; The second region, which overlaps perpendicularly with the outer coil pattern portion; and The third region overlaps perpendicularly with the gap between the inner coil pattern portion and the outer coil pattern portion.

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