Server water-cooling plate structure and server heat dissipation system

Abstract

This invention discloses a server water-cooled plate structure and server heat dissipation system, belonging to the field of CPU heat dissipation technology. It includes a first cooling medium inlet pipe, a first cooling medium outlet pipe, a second cooling medium inlet pipe, a second cooling medium outlet pipe, and a cold plate shell. The cold plate shell is divided into several first cavities by fins. The first cooling medium inlet pipe and the first cooling medium outlet pipe are connected to the first cavities. A second cavity is formed within the fins. The second cavities are connected by connecting pipes, forming two counter-directionally spaced second medium channels. The second cooling medium inlet pipe and the second cooling medium outlet pipe are respectively connected to the inlet and outlet of the two second medium channels. The first cooling medium inlet pipe introduces the first medium into the first cavities. Through multi-contact convection heat exchange between the first and second media, the heat absorbed by the CPU by the second medium is carried away, improving heat exchange capacity, achieving higher equipment heat exchange efficiency, higher energy efficiency ratio, and lower and more uniform CPU surface temperature, ensuring reliable CPU operation.

Description

Technical Field

[0001] This invention belongs to the field of CPU heat dissipation technology, specifically a server water-cooled plate structure and server heat dissipation system. Background Technology

[0002] With the development of high-performance computing, the increase in data center density, and the increasing requirements for energy conservation and environmental protection, single air cooling can no longer meet the heat dissipation needs of servers. Cooling systems are developing towards water cooling, liquid cooling, and hybrid air-water cooling.

[0003] In a hybrid air-cooled / water-cooled heat dissipation system, water cooling is used to dissipate heat from high-power components, removing most of the server's heat, while the remaining low-power components are cooled by air. This type of system offers advantages such as high economy, high heat dissipation efficiency, and environmental friendliness. Traditional water-cooled plates are mostly made of copper or aluminum, with fins to exchange heat with water for heat dissipation. Their heatsinks use rectangular or stepped structures, resulting in poor heat transfer efficiency. Furthermore, due to the directional flow of the heat exchange medium in conventional water-cooled plates, the CPU surface temperature becomes uneven, with significant temperature differences between the front and back positions, reducing the overall heat transfer capacity and leading to unstable CPU performance. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a server water-cooled plate structure and a server heat dissipation system that can provide balanced heat dissipation for the CPU, ensure consistent CPU surface temperature, improve the overall heat exchange efficiency and energy efficiency ratio of the cold plate, and significantly enhance the CPU's computing density and performance.

[0005] This invention is achieved, in one respect, through the following technical solution:

[0006] A server water-cooled plate structure includes a first cooling medium inlet pipe, a first cooling medium outlet pipe, a second cooling medium inlet pipe, a second cooling medium outlet pipe, and a cold plate shell with a rectangular shell structure. The internal space of the cold plate shell is divided into several first cavities by several fins. The first cooling medium inlet pipe and the first cooling medium outlet pipe are respectively connected to the front and rear ends of the several first cavities. The fins are hollow and form second cavities inside. The several second cavities are connected by connecting pipes disposed at the ends and form two S-shaped second medium channels distributed in opposite directions. The second cooling medium inlet pipe is connected to the inlet end of the two second medium channels respectively, and the second cooling medium outlet pipe is connected to the outlet end of the two second medium channels respectively.

[0007] A further improvement of the present invention includes a second medium circulation pump connected to the inlet end of the second cooling medium inlet pipe and the outlet end of the second cooling medium outlet pipe.

[0008] A further improvement of the present invention is that the second medium in the circulation system formed by the second medium circulation pump, the second cooling medium inlet pipe, the two second medium channels, and the second cooling medium outlet pipe is Freon.

[0009] A further improvement of the present invention is that electromagnetic flow valves are respectively provided at the communication positions between the second cooling medium inlet pipe and the second cavity of the two fins.

[0010] A further improvement of the present invention is that the inlet end of the first cooling medium inlet pipe and the outlet end of the first cooling medium outlet pipe are connected to an external cooling circulation system.

[0011] A further improvement of the present invention is that the first cooling medium inlet pipe, the first cavity, the first cooling medium outlet pipe, and the first medium in the cooling circulation system are pure water.

[0012] A further improvement of the present invention is that a water distributor communicating with several first cavities is provided at the outlet end of the first cooling medium inlet pipe, and a water collector communicating with several first cavities is provided at the inlet end of the first cooling medium outlet pipe.

[0013] A further improvement of the present invention is that the cold plate housing includes a lower heat-conducting plate, two end plates and an upper cover plate that can be attached and installed to the upper side of the CPU; fin supports are disposed between the lower heat-conducting plate and the upper cover plate, and the two end plates are fastened to the two ends of several fins; the upper cover plate has several liquid replenishment ports arranged in an array that communicate with the upper side of the second cavity inside the fins.

[0014] A further improvement of the present invention is that the connecting tube is installed on the end plate by means of a snap-fit.

[0015] Another aspect of the present invention is achieved through the following solution:

[0016] A server cooling system includes a motherboard, a plurality of CPUs mounted on the motherboard, and a plurality of server water-cooled plate structures as described in any one of claims 1-9; the cold plate shell is attached to the upper side of the CPU, and the second cooling medium inlet pipe and the second cooling medium outlet pipe on the plurality of cold plate shells are arranged in series or in parallel, and the first cooling medium inlet pipe and the first cooling medium outlet pipe on the plurality of cold plate shells are arranged in series or in parallel.

[0017] As can be seen from the above technical solutions, the beneficial effects of the present invention are:

[0018] The overall structure is simple, easy to implement, and highly practical. The cold plate shell is attached to the upper side of the CPU. The second medium enters two S-shaped second medium channels with opposite spacing through the second cooling medium inlet pipe. The second medium exchanges heat with the CPU in the second cavity of the fins. The outlets of the two second medium channels are connected in parallel to the second cooling medium outlet pipe to form a circulation of the second medium. At the same time, the first medium is introduced into the first cavity formed between adjacent fins through the first cooling medium inlet pipe. Through multi-contact convection heat exchange between the first and second media, the heat absorbed by the CPU by the second medium is carried away, which greatly improves the heat exchange capacity. This results in higher equipment heat exchange efficiency, higher energy efficiency ratio, and lower and more uniform CPU surface temperature, ensuring reliable and stable operation of the CPU. Attached Figure Description

[0019] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram illustrating the installation of the cold plate and CPU in accordance with a specific embodiment of the present invention.

[0021] Figure 2 This is a top view schematic diagram of a cold plate according to a specific embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram illustrating the usage state of a specific embodiment of the present invention.

[0023] In the attached diagram: 1. CPU, 2. Cold plate, 21. Fins, 22. End plate, 23. Top cover plate, 24. First cooling medium inlet pipe, 25. First cooling medium outlet pipe, 26. Second cooling medium inlet pipe, 27. Second cooling medium outlet pipe, 28. Lower heat conduction plate, 29. Liquid replenishment port, 3. Main board, 4. Second medium circulation pump. Detailed Implementation

[0024] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this patent, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this patent.

[0025] like Figure 1-3As shown, this invention discloses a server water-cooled plate structure, including a first cooling medium inlet pipe 24, a first cooling medium outlet pipe 25, a second cooling medium inlet pipe 26, a second cooling medium outlet pipe 27, and a cold plate 2. The cold plate 2 includes a cold plate shell with a rectangular shell structure. The internal space of the cold plate shell is divided into several first cavities by several fins 21. The first cooling medium inlet pipe 24 and the first cooling medium outlet pipe 25 are respectively connected to the front and rear ends of the several first cavities. The fins 21 are hollow and form second cavities inside. The several second cavities are connected by connecting pipes provided at the ends, forming two S-shaped second medium channels distributed in opposite directions. The second cooling medium inlet pipe 26 is connected to the inlet end of the two second medium channels, and the second cooling medium outlet pipe 27 is connected to the outlet end of the two second medium channels.

[0026] The cold plate shell is attached to the upper side of the CPU1. The second medium enters two S-shaped second medium channels spaced in opposite directions through the second cooling medium inlet pipe 26. The second medium exchanges heat with the CPU1 within the second cavity of the fins 21. The outlets of the two second medium channels are connected in parallel to the second cooling medium outlet pipe 27, forming a circulation of the second medium. Simultaneously, the first medium is introduced into the first cavity formed between adjacent fins 21 through the first cooling medium inlet pipe 24. Through multi-contact convection heat exchange between the first and second media, the heat absorbed by the CPU1 by the second medium is carried away, greatly improving the heat exchange capacity. This results in higher equipment heat exchange efficiency, higher energy efficiency ratio, and a lower and more uniform surface temperature of the CPU1, ensuring reliable and stable operation of the CPU1. The overall structure is simple, easy to implement, and highly practical.

[0027] The server water-cooled plate structure also includes a second medium circulation pump 4 connected to the inlet end of the second cooling medium inlet pipe 26 and the outlet end of the second cooling medium outlet pipe 27. The second medium is circulated back and forth by the second medium circulation pump 4, ensuring continuous convective heat exchange between the second medium in the two second medium channels and the first medium in the first cavity, greatly improving the heat exchange capacity and ensuring the reliable and stable operation of CPU1.

[0028] The second medium in the circulation system, consisting of the second medium circulation pump 4, the second cooling medium inlet pipe 26, two second medium channels, and the second cooling medium outlet pipe 27, uses Freon as the second medium. Freon is a medium that readily undergoes phase change, existing in both gas and liquid states within the second cavity. This ensures both good heat absorption on the CPU1 surface and good heat exchange with the first medium in the first cavity.

[0029] Electromagnetic flow valves are installed at the communication points between the second cooling medium inlet pipe 26 and the second cavities of the two fins 21. The CPU1 chip temperature is transmitted to the control system via a temperature sensor. The control system regulates the flow rate of the circulating medium (second medium) in the two second medium channels through the electromagnetic flow valves to ensure the uniformity and efficiency of heat absorption by the second medium in the two second medium channels, thereby achieving a very small surface temperature difference (within 1°C) for the CPU1 and ensuring reliable and stable operation of the CPU1.

[0030] The inlet end of the first cooling medium inlet pipe 24 and the outlet end of the first cooling medium outlet pipe 25 are connected to an external cooling circulation system. The external cooling circulation system includes a first medium circulation pump and a first medium radiator, which are connected in series and respectively connected to the first cooling medium inlet pipe 24 and the first cooling medium outlet pipe 25. After the first medium and the second medium exchange heat in the cold plate shell, they are circulated by the first medium circulation pump and cooled by the first medium radiator, ensuring reliable and stable heat exchange capacity and ensuring reliable and stable operation of CPU1.

[0031] The first cooling medium inlet pipe 24, the first cavity, the first cooling medium outlet pipe 25, and the first medium in the cooling circulation system are all made of pure water. Through heat exchange between the pure water first medium and the Freon second medium, heat is effectively removed from the second medium, and pure water is readily available and easily replenished.

[0032] The first cooling medium inlet pipe 24 has a water distributor at its outlet end that communicates with several first cavities, and the first cooling medium outlet pipe 25 has a water collector at its inlet end that communicates with several first cavities. Each branch of the water distributor is equipped with a flow regulating valve. The water distributor introduces the first medium into several first cavities, and the water collector collects the first medium output from several first cavities. The flow regulating valves on each branch of the water distributor control the flow rate of the first medium in each first cavity, thereby flexibly adjusting the heat exchange capacity of the first medium in each first cavity, thus maintaining a uniform surface temperature across the entire CPU1.

[0033] Among them, such as Figure 2As shown, the cold plate housing includes a lower heat-conducting plate 28, two end plates 22, and an upper cover plate 23 that can be attached to the upper side of the CPU1. Fins 21 are supported between the lower heat-conducting plate 28 and the upper cover plate 23, and the two end plates 22 are fastened to the ends of several fins 21. The cold plate housing has a rectangular shell structure, and the internal space of the cold plate housing is divided by several fins 21 (forming several first cavities). Several liquid inlets 29 are arrayed on the upper cover plate 23, communicating with the upper side of the second cavities within the fins 21. The liquid inlets 29 are sealed by one-way valves. Multiple temperature sensors can be arrayed on the CPU and connected to the control system. The temperature of various points on the CPU1 is monitored by the temperature sensors. When the temperature at a certain point is too high, liquid can be manually added through the corresponding liquid inlet 29 to achieve rapid and targeted cooling, flexibly responding to temperature changes and ensuring reliable and stable operation of the CPU1.

[0034] The connecting pipes are installed on the end plate 22 using snap-fit ​​positioning. This ensures reliable positioning of multiple connecting pipes and guarantees reliable communication between the two second cavities.

[0035] like Figure 3 As shown, this invention also discloses a server cooling system, including a motherboard 3, two CPUs 1 mounted on the motherboard 3, and two server water-cooled plate structures. The cold plate housings are attached to the upper side of the CPUs 1. The second cooling medium inlet pipe 26 and the second cooling medium outlet pipe 27 on the two cold plate housings are connected in series, and the first cooling medium inlet pipe 24 and the first cooling medium outlet pipe 25 on the two cold plate housings are also connected in series. The two cold plate housings are connected in series, and the second medium circulation pump 4 ensures the reliability of the second medium circulation by circulating the medium through the second medium channel within the two cold plate housings. An external cooling circulation system ensures the reliability of the first medium circulation by circulating the medium through the first cavity within the two cold plate housings.

[0036] The second medium circulation pump 4 is installed on the chassis adjacent to the motherboard and is located between the two CPUs 1. The external cooling circulation system is led out to the inner wall of the chassis or the outside of the chassis through pipes.

[0037] In another embodiment, the cold plate housing is attached to the upper side of the CPU1. The second cooling medium inlet pipe 26 and the second cooling medium outlet pipe 27 on the two cold plate housings are arranged in parallel, and the first cooling medium inlet pipe 24 and the first cooling medium outlet pipe 25 on the two cold plate housings are also arranged in parallel. The parallel arrangement of the two cold plate housings allows for medium circulation through the second medium circulation pump 4 within the second medium channels of the two cold plate housings, and for medium circulation within the first cavity of the two cold plate housings through an external cooling circulation system, ensuring the uniformity of heat exchange between the two cold plate housings.

[0038] This server water-cooled plate structure and heat dissipation system features a cold plate shell attached to the upper side of the CPU1. A second medium enters two counter-clockwise spaced S-shaped second medium channels through a second cooling medium inlet pipe 26. The second medium exchanges heat with the CPU1 within the second cavity of the fins 21. The outlets of the two second medium channels are connected in parallel to the second cooling medium outlet pipe 27, forming a circulation of the second medium. Simultaneously, a first medium is introduced through a first cooling medium inlet pipe 24 into the first cavity formed between adjacent fins 21. Through multi-contact convection heat exchange between the first and second media, the heat absorbed by the CPU1 is carried away by the second medium, significantly improving heat exchange capacity. This results in higher equipment heat exchange efficiency, a higher energy efficiency ratio, and a lower and more uniform CPU1 surface temperature, ensuring reliable and stable operation of the CPU1. The overall structure is simple, easy to implement, and highly practical.

[0039] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0040] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0041] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A server water-cooled plate structure, comprising a first cooling medium inlet pipe (24), a first cooling medium outlet pipe (25), a second cooling medium inlet pipe (26), a second cooling medium outlet pipe (27), and a cold plate shell with a rectangular shell structure, characterized in that, The internal space of the cold plate shell is divided into several first cavities by several fins (21). The first cooling medium inlet pipe (24) and the first cooling medium outlet pipe (25) are respectively connected to the front and rear ends of several first cavities. The fins (21) have a hollow structure and form a second cavity inside. Several second cavities are connected by connecting pipes set at the ends and form two S-shaped second medium channels with opposite intervals. The second cooling medium inlet pipe (26) is connected to the inlet end of the two second medium channels respectively, and the second cooling medium outlet pipe (27) is connected to the outlet end of the two second medium channels respectively. The server water-cooled plate structure also includes a second medium circulation pump (4) connected to the inlet end of the second cooling medium inlet pipe (26) and the outlet end of the second cooling medium outlet pipe (27). The second medium circulation pump (4), the second cooling medium inlet pipe (26), the two second medium channels, and the second cooling medium outlet pipe (27) form a circulation system in which the second medium is Freon. Electromagnetic flow valves are respectively provided at the communication positions between the second cooling medium inlet pipe (26) and the second cavity of the two fins (21); the electromagnetic flow valves are used to regulate the flow rate of the second medium in the two second medium channels; The inlet end of the first cooling medium inlet pipe (24) and the outlet end of the first cooling medium outlet pipe (25) are connected to the external cooling circulation system; The first cooling medium inlet pipe (24), the first cavity, the first cooling medium outlet pipe (25), and the first medium in the cooling circulation system are all made of pure water. The cold plate housing includes a lower heat-conducting plate (28), two end plates (22), and an upper cover plate (23) that can be attached to the upper side of the CPU (1); fins (21) are supported between the lower heat-conducting plate (28) and the upper cover plate (23), and the two end plates (22) are fastened to the two ends of several fins (21); the upper cover plate (23) has several liquid replenishment ports (29) arranged in an array that communicate with the upper side of the second cavity inside the fins (21).

2. The server water-cooled plate structure according to claim 1, characterized in that, The outlet end of the first cooling medium inlet pipe (24) is provided with a water distributor that communicates with several first cavities, and the inlet end of the first cooling medium outlet pipe (25) is provided with a water collector that communicates with several first cavities.

3. The server water-cooled plate structure according to claim 1, characterized in that, The connecting pipe is installed on the end plate (22) by snap-fit ​​positioning.

4. A server cooling system, characterized in that, The system includes a motherboard (3), several CPUs (1) mounted on the motherboard (3), and a number of server water-cooled plate structures as described in any one of claims 1-3; the cold plate shell is attached to the upper side of the CPU (1), and the second cooling medium inlet pipe (26) and the second cooling medium outlet pipe (27) on the multiple cold plate shells are connected in series or in parallel, and the first cooling medium inlet pipe (24) and the first cooling medium outlet pipe (25) on the multiple cold plate shells are connected in series or in parallel.

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