Layered immersion cooling system and removal method

Abstract

A tiered immersion cooling system and removal method are disclosed, where the tiered immersion cooling system includes a cabinet, a cabinet frame, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidably assembled to the cabinet. The cabinet frame is slidable between a first interior position and a first exterior position. The cabinet frame is slidable in a horizontal direction along a depth of the cabinet. The upper immersion tank is slidably assembled to the cabinet. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank is slidable in a vertical direction relative to the cabinet frame along a height of the cabinet. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is assembled to slide independently of the cabinet frame in the horizontal direction. The lower immersion tank is slidable between a second interior position and a second exterior position.

Description

Technical Field

[0001] The present invention relates to a cooling system for a computer system, and more particularly to a stratified immersion cooling system. Background Technology

[0002] Electronic components (such as servers) comprise numerous electronic parts powered by a common power source. Servers generate significant heat due to the operation of their internal electronics (such as controllers, processors, and memory). Inefficient heat removal leading to overheating can shut down or prevent the operation of these devices. Therefore, current servers are designed to rely on airflow through their interior to remove heat generated by the electronic components. Servers typically include various heat sinks attached to electronic components, such as processing units. The heat sinks absorb heat from the electronic components and thus transfer heat away from them. The heat from the heat sinks must be exhausted from the server. The airflow used to exhaust this heat is typically generated by a fan system.

[0003] As high-performance systems improve, the amount of heat that needs to be removed increases with each new generation of electronic components. With the emergence of more powerful components, the traditional combination of air cooling and fan systems is insufficient to adequately remove the heat generated by these newer components. This increased demand for cooling has spurred the development of liquid cooling. Due to its superior thermal performance, liquid cooling is currently the recognized solution for rapid heat removal. At room temperature, the thermal conductivity of air is only 0.024 W / mK, while that of a coolant (such as water) is 0.58 W / mK, 24 times greater than that of air. Therefore, liquid cooling is more efficient at transferring heat from heat sources to radiators and allows for noiseless heat removal from critical components.

[0004] In an immersion liquid cooling system, heat-generating components (such as servers, switches, and storage devices) in a support structure are immersed in a tank containing coolant. The chassis of this system is not sealed, and the coolant liquid circulates between and through the components to remove generated heat. One type of immersion tank is a rectangular one. This type of tank has the disadvantage of requiring the heat-generating components to be removed directly from the immersion tank during repair or assembly. This makes repair or assembly operations laborious. Furthermore, since heat-generating components are typically placed side-by-side in the immersion tank, this system suffers from low power density.

[0005] Therefore, there is a need for an immersion cooling system that can overcome one or more of these drawbacks. The present invention aims to provide such an immersion cooling system. Summary of the Invention

[0006] The terms used in the description of embodiments, and similar terms (e.g., implementation, configuration, feature, example, and option), are intended to refer broadly to all aspects of the invention and the appended claims. Several statements containing these terms should be understood as not limiting the subject matter described herein or limiting the meaning or scope of the appended claims. The embodiments of the invention covered herein are defined by the appended claims, not by the scope of the invention itself. This summary is a high-level overview of various features of the invention and introduces some concepts further described in the following description paragraphs. This summary is not intended to identify key or essential features of the subject matter of the claims, nor is it intended to be used independently to determine the scope of the subject matter of the claims. The subject matter should be understood through reference to appropriate portions of the complete specification of the invention, any or all of the accompanying drawings, and each claim.

[0007] According to certain features of the present invention, a layered immersion cooling system is disclosed, comprising a chassis, a cabinet frame, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidably mounted to the chassis. The upper immersion tank is used to store and cool a first electronic device, and the lower immersion tank is used to store and cool a second electronic device. The cabinet frame is slidable between (i) a first internal position and (ii) a first external position, wherein the cabinet frame is substantially inside the chassis in the first internal position and substantially outside the chassis in the first external position. The cabinet frame slides horizontally along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable horizontally with respect to the cabinet frame. The upper immersion tank slides vertically relative to the cabinet frame along a height of the chassis. The lower immersion tank is vertically positioned below the upper immersion tank. The lower immersion tank is mounted to slide horizontally independently of the cabinet frame. The lower immersion tank is slidable between (i) a second internal position and (ii) a second external position, wherein the lower immersion tank is substantially inside the chassis in the second internal position and substantially outside the chassis in the second external position.

[0008] In some features, the upper immersion tank houses multiple servers and includes a liquid coolant for cooling the servers. In some features, the tiered immersion cooling system also includes a third electronic device. The third electronic device is located within the chassis and coupled to one of the servers. In some features, the third electronic device is a switching system. In some features, the third electronic device is coupled to the server via a single cable and remains coupled to the server regardless of its location within the upper immersion tank. In some features, the multiple servers housed in the upper immersion tank are arranged vertically.

[0009] In some features, a submerged tank houses multiple servers, and the submerged tank includes a liquid coolant for cooling the multiple servers. In some features, the tiered immersion cooling system also includes a third electronic device located within the chassis. The third electronic device is coupled to one of the multiple servers via a wire, and remains coupled to the server regardless of its location within the submerged tank. In some features, the multiple servers housed in the submerged tank are arranged vertically.

[0010] In some features, the chassis also includes a pulley system coupled to the upper immersion tank. The pulley system is configured to lower and raise the upper immersion tank in the vertical direction. In some features, the pulley system includes a wheel that lowers the upper immersion tank when the wheel (i) rotates clockwise and raises the upper immersion tank when the wheel rotates counterclockwise.

[0011] In some features, the lower immersion tank slides horizontally regardless of the position of the cabinet frame.

[0012] According to certain features of the invention, a removal method is disclosed below for removing an electronic device from a layered immersion cooling system. A cabinet frame, an upper immersion tank, and a lower immersion tank are slidably mounted within a chassis of the immersion cooling system. The upper immersion tank stores and cools an electronic device. The cabinet frame is pulled horizontally along a depth of the chassis. Thus, the cabinet frame and the upper immersion tank slide between a first position substantially inside the chassis and a second position substantially outside the chassis. The upper immersion tank is lowered vertically relative to the cabinet frame along a height of the chassis. The electronic device is removed from the upper immersion tank.

[0013] In some features, multiple servers are housed in the upper immersion tank. The multiple servers are cooled within the upper immersion tank using a liquid coolant. In some features, at least one of the servers is coupled to another electronic device in the chassis via a cable. Regardless of the position of the upper immersion tank, the at least one server remains coupled to the other electronic device. In some features, the rack frame is slidable by a pulley system coupled to the upper immersion tank. One wheel of the pulley system rotates clockwise to lower the upper immersion tank. In some features, the upper immersion tank returns to a first position.

[0014] In some features, a lower immersion tank is mounted below the upper immersion tank. The lower immersion tank slides between a third position and a fourth position, the third position being substantially inside the chassis and the fourth position being substantially outside the chassis. Another electronic device is removed from the lower immersion tank. In some features, after the upper immersion tank returns to the first position, another electronic device is removed from the lower immersion tank.

[0015] The foregoing description is not intended to present every embodiment or feature of the invention. Rather, it provides only examples of some novel features and characteristics set forth herein. The above features and advantages, as well as other features and advantages, will become apparent from the following detailed description of representative embodiments and modes for carrying out the invention, taken in conjunction with the accompanying drawings and appended claims. Additional features of the invention will be apparent to those skilled in the art from the following brief description of various embodiments with reference to the accompanying drawings and the provided symbols. Attached Figure Description

[0016] The invention and its advantages, along with the accompanying drawings, will be better understood from the following description of exemplary embodiments in conjunction with the accompanying drawings. These drawings depict exemplary embodiments only and should therefore not be construed as limiting the various embodiments or claims.

[0017] Figure 1 A perspective view of a layered immersion cooling system for certain features of the present invention;

[0018] Figure 2 For certain features of the present invention, Figure 1 A three-dimensional view of the tiered immersion cooling system, showing a suspended upper immersion tank;

[0019] Figure 3 For certain features of the present invention, Figure 1 A three-dimensional view of the tiered immersion cooling system, showing a lowered upper immersion tank;

[0020] Figure 4 For certain features of the present invention, Figure 1 A partial perspective view of the tiered immersion cooling system, showing the lowered upper immersion tank; and

[0021] Figure 5 For certain features of the present invention, Figure 1 A three-dimensional view of the tiered immersion cooling system, showing the lower immersion tank.

[0022] This invention is readily adaptable to various modifications and alternatives. Representative embodiments have been shown by way of example in the accompanying drawings and will be described in detail herein. However, it should be understood that this invention is not intended to be limited to the specific forms disclosed. Rather, this invention is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined in the claims.

[0023] Symbol Explanation

[0024] 100: Layered immersion cooling system

[0025] 110: Chassis

[0026] 120: Server rack frame

[0027] 130: Upper immersion tank

[0028] 150: Submersion tank

[0029] 222a: First frame roller

[0030] 222b: Second frame roller

[0031] 224: Sliding support system

[0032] 226a: First strip

[0033] 226b: Second strip

[0034] Z: Horizontal direction

[0035] 332: Electronic Components

[0036] 350: Control Wheel

[0037] 352: Pulley

[0038] 354: Rope

[0039] 356: Locking System

[0040] Y: Vertical direction

[0041] 420: Electronic devices

[0042] 460: Cable Management Arm

[0043] 462: Wire Management Arm Rail

[0044] 464: Wire

[0045] 552a: Roller Detailed Implementation

[0046] Various embodiments are described with reference to the accompanying drawings, throughout which similar reference numerals are used to designate similar or equivalent elements. The drawings are not drawn to scale and are provided solely to illustrate the features and characteristics of the invention. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, those skilled in the art will readily appreciate that various embodiments may be practiced without one or more specific details or in other ways. In some cases, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments are not limited to the order in which actions or events are shown, as some actions may occur in different orders and / or simultaneously with other actions or events. Furthermore, not all actions or events shown are necessary for implementing certain features and characteristics of the invention.

[0047] For the purposes of this embodiment, unless explicitly stated otherwise, the singular includes many and vice versa. The term "including" means "including but not limited to". Furthermore, approximate words such as "about (about), almost, substantially, approximatelyly" and similar words may be meant herein as, for example, "at," "near, nearly at," "within 3-5% of," "within acceptable manufacturing tolerances," or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5%" in the vertical or horizontal direction, respectively. Furthermore, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions depicted in the reference illustrations; to be understood from the context of the referenced object or element, such as from its usual location; or other such descriptions.

[0048] As mentioned above, due to improvements in high-performance systems, the amount of heat that needs to be removed within a computing center (e.g., a data center) increases with each new generation of electronic components (e.g., servers). With the advent of more powerful components, the combination of traditional air cooling and fan systems is insufficient to adequately remove the heat generated by these newer generations of components. Liquid cooling is currently recognized as the solution for rapid heat removal due to its superior thermal performance.

[0049] In an immersion liquid cooling system, heat-generating components (such as servers, switches, and storage devices) in a support structure are immersed in a tank containing coolant. Immersion cooling is a liquid cooling technology that directly immerses heat-generating components in a non-conductive liquid. The heat (or energy) generated by the components is directly transferred to the non-conductive liquid, and no other active cooling components (e.g., fans) are required. One type of immersion tank is a rectangular immersion tank. This type of tank has the disadvantage of requiring heat-generating components to be removed directly from the immersion tank upwards or installed downwards during repair or assembly. This makes repair or assembly operations laborious. In addition, heat-generating components are usually placed side by side in a conventional immersion tank for easy access, so this type of system has the problem of low power density.

[0050] The present invention aims to provide a tiered immersion cooling system that provides high power density while allowing for effective heat dissipation through liquid cooling. Specifically, this tiered immersion cooling system includes at least two immersion tanks arranged perpendicularly to each other, in which multiple electronic components (e.g., servers or other electronic devices) can be arranged vertically.

[0051] Reference Figure 1 The diagram illustrates a perspective view of a layered immersion cooling system 100. The layered immersion cooling system 100 includes a chassis 110, a cabinet frame 120, an upper immersion tank 130, and a lower immersion tank 150. The upper immersion tank 130 and the lower immersion tank 150 may each include a liquid coolant for cooling electronic components stored within the immersion tank. When the upper immersion tank 130 and the lower immersion tank 150 are housed within the chassis 110, the lower immersion tank 150 is vertically positioned below the upper immersion tank 130 and together occupy most of the space within the chassis 110. For example, in some embodiments, the chassis 110 may be a server chassis, and the upper immersion tank 130 and the lower immersion tank 150 may each house and cool multiple servers.

[0052] Reference Figure 2 A perspective view of the layered immersion cooling system 100 is shown, and the upper immersion tank 130 suspended on the ground is also shown. Figure 2 The stratified immersion cooling system 100 is the same as or similar to Figure 1 The layered immersion cooling system 100, wherein the same symbols represent equivalent elements. In some embodiments, the rack frame 120 includes a plurality of frame rollers to assist the rack frame 120 in sliding in a horizontal direction Z along a depth of the chassis 110. In this example, the rack frame 120 includes a first frame roller 222a and a second frame roller 222b. Thus, the rack frame 120 is slidably mounted to the chassis 110 and is available in (i) a first internal position ( Figure 1 (ii) a first external location ( Figure 2 The rack frame 120 slides between the two, with the rack frame 120 substantially inside the chassis 110 in the first internal position and substantially outside the chassis 110 in the first external position.

[0053] Still refer to Figure 2 The upper immersion tank 130 is coupled to the cabinet frame 120 via a sliding support system 224, ensuring that the upper immersion tank 130 does not shift horizontally relative to the cabinet frame 120 in the Z direction. Thus, when the cabinet frame 120 is pulled out of the chassis 110, the upper immersion tank 130 can slide horizontally relative to the cabinet frame 120 in the Z direction, during which the upper immersion tank 130 remains suspended.

[0054] In some embodiments, the rack frame 120 also includes multiple slats (e.g., first slat 226a and second slat 226b) to provide structural support for the rack frame 120 itself and / or the sliding support system 224. Additionally, or in some embodiments, slats 226a and 226b provide additional separation to prevent any electronic devices positioned on the rack frame 120 from falling into the upper immersion tank 130. However, when the upper immersion tank 130 is suspended in this position (e.g., the space between the upper immersion tank 130 and slats 226a and 226b is minimal), any electronic devices stored within the upper immersion tank 130 are difficult to remove due to the slats 226a and 226b being at the top of the rack frame 120. Therefore, to allow easy access to electronic devices stored within the upper immersion tank 130, the upper immersion tank 130 may be further lowered.

[0055] Reference Figure 3 A perspective view of the layered immersion cooling system 100 is shown, and the upper immersion tank 130 is shown from... Figure 2 The suspension position is lowered. Figure 3 The stratified immersion cooling system 100 is the same as or similar to Figures 1 to 2 The layered immersion cooling system 100 in the image refers to the same symbols representing equivalent elements. In some embodiments, the sliding support system 224 includes a pulley system comprising a control wheel 350, a plurality of pulleys 352, and corresponding plurality of ropes 354. In this example, the sliding support system 224 includes four pulleys 352 (the fourth of which is not shown) and four corresponding ropes 354.

[0056] A sliding support system 224 (e.g., a pulley system) causes the upper immersion tank 130 to lower and / or raise relative to the cabinet frame 120 in the vertical direction Y. A control wheel 350 actuates and / or controls a plurality of pulleys 352 and their corresponding plurality of ropes 354 such that when the control wheel 350 rotates clockwise, the upper immersion tank 130 is lowered, and (ii) when it rotates counterclockwise, the upper immersion tank 130 is raised. In other embodiments, the control wheel 350 actuates and / or controls a plurality of pulleys 352 and their corresponding plurality of ropes 354 such that when the control wheel 350 rotates clockwise, the upper immersion tank 130 is raised, and (ii) when it rotates counterclockwise, the upper immersion tank 130 is lowered. In some embodiments, a locking system 356 is coupled to the control wheel 350 to lock the control wheel 350, preventing its rotation, thereby securing the upper immersion tank 130 at any given position in the vertical direction Y.

[0057] When the upper immersion tank 130 is fixed to the cabinet frame 120 in the horizontal direction Z ( Figure 2The upper immersion tank 130 can slide relative to the rack frame 120 in a vertical direction Y along a height of the chassis 110. Figure 3 ).like Figure 3 The display shows the relative displacement of the upper immersion tank 130 as the upper immersion tank 130 is lowered (comparison). Figure 2 as well as Figure 3 This provides an additional operating space for users to access electronic components, such as electronic component 332 (e.g., a server), stored and cooled in the upper immersion tank 130. Furthermore, because of this additional operating space, electronic components can be stored vertically adjacent to each other within the upper immersion tank 130, thereby increasing the power density of the entire computing system, as more electronic components can be stored in the upper immersion tank 130 when stored vertically.

[0058] Reference Figure 4 A partial perspective view of the tiered immersion cooling system 100 is shown, and it displays... Figure 3 The upper immersion tank 130 is shown to be lowered. Figure 4 The stratified immersion cooling system 100 is the same as or similar to the stratified immersion cooling system 100. Figures 1 to 3 The tiered immersion cooling system 100 is described in the diagram, where the same symbols represent equivalent components. In some embodiments, electronic devices housed in the upper immersion tank 130 are connected to the tiered immersion cooling system via a wire 464 and an electronic device 420. For example, the electronic device 420 may be a switching system. The electronic device 420 provides communication between electronic components 332 (e.g., a server) and chassis 110 (e.g., a server chassis).

[0059] In some embodiments, chassis 110 also includes a cable management arm 460 and a cable management arm rail 462. The cable management arm 460 is hollow and accommodates a portion of the cable 464. The cable management arm 460 allows the upper immersion tank 130 (and therefore server 332) to extend fully from chassis 110 without powering off the system or disconnecting any rear panel cables. The cable management arm 460 extends when the rack frame 120 is pulled out of chassis 110 and retracts when the rack frame 120 is restored to chassis 110. The cable management arm rail 462 causes the cable management arm 460 to slide up or down in the vertical direction Y, thereby individually accommodating the upper immersion tank 130 as it is raised or lowered. Therefore, regardless of the position of the upper immersion tank 130, electronics 420 remains connected to electronics 332.

[0060] Reference Figure 5 A perspective view of the layered immersion cooling system 100 is shown, displaying the lower immersion tank 150 pulled out from the chassis 110. Figure 5The stratified immersion cooling system 100 is the same as or similar to the stratified immersion cooling system 100. Figures 1 to 4 The layered immersion cooling system 100 in the middle, wherein the same symbol represents equal elements. The lower immersion tank 150 may include a plurality of rollers (e.g., roller 552a) to assist the lower immersion tank 150 in sliding in the horizontal direction Z. The lower immersion tank 150 is in (i) a second internal position ( Figure 1 (ii) a second external position ( Figure 5 The lower immersion tank 150 slides between the upper immersion tank 130 and the upper immersion tank 140, with the lower immersion tank 150 substantially inside the chassis 110 in the second internal position and substantially outside the chassis 110 in the second external position. In this example, the lower immersion tank 150 can slide independently of the rack frame 120. In other words, when the lower immersion tank 150 is pulled out of the chassis 110, the rack frame 120 (together with the upper immersion tank 130) can remain inside the chassis 110.

[0061] Similar to the upper immersion tank 130, the lower immersion tank 150 may also include a plurality of vertically arranged electronic components (not shown, e.g., servers). One electronic component (e.g., a server) in the lower immersion tank 150 may also be connected via a single wire (not shown, similar to...) Figure 4 Cable 464 is connected to electronic device 420 (e.g., a switching system). A cable management arm (not shown, similar to...) Figure 4 The cable management arm 460 can also extend or retract to handle the cables for electronic components in the lower immersion tank 150, depending on whether the lower immersion tank 150 is pulled out or stored back in the chassis 110. However, a cable management arm rail is not necessary for the lower immersion tank 150, as it does not move vertically. After the lower immersion tank 150 is pulled out of the chassis 110, the user can directly access the electronic components in the lower immersion tank 150 from above.

[0062] Although the shown tiered immersion cooling system 100 includes two immersion tanks (e.g., upper immersion tank 130 and lower immersion tank 150), the tiered immersion cooling system of the present invention may include any suitable number of immersion tanks arranged perpendicularly to each other, such as three immersion tanks, four immersion tanks, five immersion tanks, etc. A separate sliding support system (e.g., Figure 2 The sliding support system 224 (including a pulley system) can be used for any immersion tank that is not the lowest in the vertical direction. In other words, in a layered immersion cooling system with N immersion tanks stacked vertically, there can be N-1 pulley systems.

[0063] The foregoing description of the embodiments, including the illustrated embodiments, is presented for illustrative and descriptive purposes only and is not intended to exhaustively describe or limit the precise forms disclosed. Various modifications, adaptations, and uses will be apparent to those skilled in the art.

[0064] Although embodiments of the invention have been shown and described with respect to one or more implementations, equivalents and modifications will arise in those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while specific features of the invention may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous for any given or particular application.

[0065] While various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limiting. Various modifications may be made to the embodiments disclosed herein without departing from the spirit or scope of the invention. Therefore, the breadth and scope of the invention should not be limited by any of the foregoing embodiments. Rather, the scope of the invention should be defined by the appended claims and their equivalents.

Claims

1. A stratified immersion cooling system, comprising: Chassis; A cabinet frame is slidably mounted to the chassis. The cabinet frame is capable of sliding between a first internal position and a first external position. The cabinet frame is substantially inside the chassis in the first internal position and substantially outside the chassis in the first external position. The cabinet frame slides horizontally along the depth of the chassis. An upper immersion tank for storing and cooling a first electronic device is slidably mounted on the chassis. The upper immersion tank is able to slide with the cabinet frame in the horizontal direction and slides vertically relative to the cabinet frame along the height of the chassis. as well as A lower immersion tank for storing and cooling a second electronic device is positioned vertically below the upper immersion tank. The lower immersion tank is mounted to slide independently of the cabinet frame in the horizontal direction. The lower immersion tank is slidable between a second internal position and a second external position. The lower immersion tank is substantially inside the chassis in the second internal position and substantially outside the chassis in the second external position.

2. The layered immersion cooling system of claim 1, wherein the upper immersion tank houses a plurality of servers, and the upper immersion tank includes a liquid coolant for cooling the plurality of servers.

3. The tiered immersion cooling system of claim 2 further includes a third electronic device located within the chassis and coupled to one of the plurality of servers.

4. The layered immersion cooling system of claim 3, wherein the third electronic device is coupled to one of the plurality of servers via wiring and remains coupled to the server regardless of the position of the upper immersion tank.

5. The tiered immersion cooling system of claim 2, wherein the plurality of servers are arranged vertically.

6. The layered immersion cooling system of claim 1, wherein the lower immersion tank houses a plurality of servers, and the lower immersion tank includes a liquid coolant for cooling the plurality of servers.

7. The tiered immersion cooling system of claim 6 further includes a third electronic device located within the chassis and coupled to one of the plurality of servers via wiring, wherein the third electronic device remains coupled to the server regardless of the position of the lower immersion tank.

8. The layered immersion cooling system of claim 1, wherein the chassis further includes a pulley system coupled to the upper immersion tank, the pulley system being configured to lower and raise the upper immersion tank in the vertical direction.

9. The layered immersion cooling system of claim 8, wherein the pulley system further includes a wheel that lowers the upper immersion tank when rotating clockwise and raises the upper immersion tank when rotating counterclockwise.

10. A removal method for removing an electronic device from a stratified immersion cooling system, the method comprising: The cabinet frame, upper immersion tank, and lower immersion tank are slidably assembled within the chassis of the layered immersion cooling system, the upper immersion tank storing and cooling electronic devices. Pull the cabinet frame horizontally along the depth of the chassis, thereby causing the cabinet frame and the upper immersion tank to slide between a first position and a second position, the first position being substantially inside the chassis and the second position being substantially outside the chassis; The upper immersion tank is lowered vertically relative to the cabinet frame along the height of the chassis. as well as Remove the electronic device from the immersion tank.

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