A transparent LED display

Abstract

In order to overcome the problem that it is difficult to realize printing lamp bead welding area on a transparent substrate and the lamp bead welding area is easy to fall off in the prior art, the present application provides a transparent LED display screen, comprising a transparent substrate and LED lamp beads; the transparent substrate is provided with a circuit pattern; the LED lamp beads are pasted on the transparent substrate; the LED lamp bead comprises a shell, a driving chip and a light emitting wafer; the shell is formed with a chip mounting surface; the transparent LED display screen disclosed by the present application adopts a pasting mode to fix the LED lamp bead on the transparent substrate, then adopts a power jumper to directly or indirectly electrically connect each LED lamp bead to a power supply circuit, adopts a signal jumper to realize the series connection of the LED lamp beads, and through the above mode, the existing mode of welding the LED lamp bead welding area on the lamp bead welding area is replaced. It is easy to implement, and the LED lamp bead is fixed firmly and is not easy to fall off.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED display, in particular to the field of transparent LED display. BACKGROUND

[0002] Transparent LED display screen is gradually widely used in the market, and various product forms are developed. A transparent LED display screen technology of arraying LED lamp beads on a transparent substrate begins to appear. The existing technology proposes a transparent LED display screen as shown in Figure 1 、 Figure 2 The transparent LED display screen includes a transparent substrate 1', a printed circuit layer 3' is arranged on the transparent substrate 1', and LED lamp beads 2' encapsulating driving chips are arrayed on the transparent substrate 1'; then a glue filling layer 5' is formed by filling glue on the surface of the transparent substrate 1' on which the LED lamp beads 2' are arranged; and then a protective cover plate 4' is arranged on the surface of the glue filling layer 5'.

[0003] As shown in Figure 2 Specifically, the printed circuit layer 3' includes a lamp bead welding area 31', a power supply pad 32' and a signal pad 33', and two signal pin pads and two electrode pin pads are arranged in each lamp bead welding area 31'. The signal pin pads are connected in series through a printed signal line, and the two electrode pin pads with opposite polarities are connected to the power supply pad 32' through a metal mesh 30' printed on the transparent substrate 1' to supply power. The pin of the LED lamp bead 2' is welded on the signal pin pad and the electrode pin pad.

[0004] This kind of mode has certain advantages, that is, the metal mesh 30' for power supply as a power supply circuit can be directly formed on the transparent substrate 1' through a printing process. The lamp bead welding area needs to be printed thereon, and then the LED lamp bead 2' is welded on the lamp bead welding area 31' to be electrically connected. However, it is difficult to form the lamp bead welding area 31' on the transparent substrate 1' in the process, and the lamp bead welding area 31' is easy to fall off. If the transparent substrate 1' is a PET (polyethylene terephthalate) substrate, the existing technology needs to find a way to electrically connect the pin of the lamp bead 2' with the pad on the lamp bead welding area 31'. Usually, high-temperature solder or silver paste is used for connection, which needs to be processed under high-temperature conditions, and high temperature will deform or even melt the PET. SUMMARY

[0005] In order to overcome the problems that it is difficult to realize the printing of the lamp bead welding area on the transparent substrate and the lamp bead welding area is easy to fall off in the prior art, the present application provides a transparent LED display screen.

[0006] The application discloses a transparent LED display screen, which comprises a transparent substrate and LED lamp beads.

[0007] The shell is provided with a chip mounting surface, the driving chip is mounted on the chip mounting surface, and the light-emitting wafer is mounted on the driving chip or the chip mounting surface and controlled by the driving chip.

[0008] The chip mounting surface comprises an isolation channel and binding pads isolated from each other through the isolation channel, the binding pads comprise electrode pads and input and output pads, the electrode pads comprise first electrode pads and second electrode pads with opposite polarities, and the input and output pads comprise signal input pads and signal output pads.

[0009] The circuit pattern comprises power supply pads, signal pads and power supply lines, the power supply lines comprise first power supply lines and second power supply lines with opposite polarities, and the power supply pads are connected to the first power supply lines and the second power supply lines.

[0010] The first electrode pads are directly or indirectly bound to the first power supply lines through power supply jumpers, and the second electrode pads are directly or indirectly bound to the second power supply lines through power supply jumpers.

[0011] Each LED lamp bead is bound and connected to form a lamp bead string through signal jumpers, wherein the signal input pads of each LED lamp bead in the lamp bead string are connected to signal pads or signal output pads of a previous LED lamp bead through signal jumpers, and the signal output pads of each LED lamp bead are bound and connected to signal input pads of a subsequent LED lamp bead through signal jumpers.

[0012] The transparent LED display screen disclosed by the application only needs to form a power supply circuit on the transparent substrate, and does not need to print and form a lamp bead welding area as in the prior art, the LED lamp beads are fixed on the transparent substrate in a pasting mode, then the LED lamp beads are directly or indirectly electrically connected to the power supply lines through power supply jumpers, the LED lamp beads are serially connected through signal jumpers, and the above mode is used to replace the mode that the LED lamp beads are welded on the lamp bead welding area in the prior art. The LED lamp bead fixing mode is easy to implement, the LED lamp beads are fixed firmly and not easy to fall off, the power supply of the lamp beads is realized through the power supply jumpers, the signal transmission is realized through the signal jumpers, and the process is also easy to implement. Meanwhile, the mode also greatly improves the transparency of the transparent LED display screen.

[0013] Further, the binding pad is led out with a binding pin; the binding pin includes an electrode pin and an input and output pin; the electrode pin includes a first electrode pin and a second electrode pin with opposite polarity; the input and output pin includes a signal input pin and a signal output pin;

[0014] The first electrode pin is directly or indirectly bound to the first power supply line through a power supply jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power supply jumper;

[0015] The signal input pin of each LED lamp bead in the lamp bead string is bound and connected to a signal pad or a signal output pin of a previous LED lamp bead through a signal jumper; and the signal output pin of each LED lamp bead is bound and connected to a signal input pin of a subsequent LED lamp bead through a signal jumper.

[0016] Further, the first electrode pad or the first electrode pin on each LED lamp bead is bound and connected to the first power supply line or the first electrode pad or the first electrode pin on an adjacent LED lamp bead through a power supply jumper; and the second electrode pad or the second electrode pin on each LED lamp bead is bound and connected to the second power supply line or the second electrode pad or the second electrode pin on an adjacent LED lamp bead through a power supply jumper; so that each LED lamp bead can directly take power from the power supply line or from an adjacent LED lamp bead.

[0017] Further, the LED lamp bead is a CHIP type LED lamp bead, and a copper foil on a front surface of a circuit board of the CHIP type LED lamp bead is etched to form the chip mounting surface.

[0018] Further, a driving chip is arranged on the chip mounting surface of the CHIP type LED lamp bead, and the light emitting wafer is mounted on the driving chip; the driving chip is encapsulated in a transparent encapsulating layer, and the chip mounting surface exposes the binding pad.

[0019] Further, the LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a housing adopting a plastic support; a chip mounting surface is formed on a surface of the plastic support through a metal strip, the binding pin extends from the chip mounting surface and is bent towards a bottom of the plastic support.

[0020] Further, the LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a housing adopting a plastic support; a chip mounting surface is formed on a surface of the plastic support through a metal strip, the binding pin extends from the chip mounting surface and is bent towards a top of the plastic support.

[0021] Further, the light emitting wafer is mounted on the driving chip by CSP or COC mode.

[0022] Further, the power supply circuit includes a plurality of first power supply circuits and second power supply circuits arranged in rows or columns; a plurality of rows or columns of LED lamp beads are arranged between the first power supply circuits and the second power supply circuits; the LED lamp beads share the first power supply circuits and the second power supply circuits.

[0023] Further, the power supply circuit is a conductive grid, an ITO conductive film or a nano-silver film.

[0024] Further, a glue filling layer is arranged on the transparent substrate on which the LED lamp beads are arranged, the glue filling layer encapsulates the LED lamp beads; a protective cover plate is arranged on the upper surface of the glue filling layer.

[0025] Further, a plurality of transparent unit plates are arranged on the transparent substrate; the LED lamp beads are arranged on the transparent unit plates; metal strips are arranged on both sides of the transparent unit plates as power supply circuits; the LED lamp beads on the transparent unit plates are connected to the power supply circuits. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a cross-sectional view of a transparent LED display screen disclosed in the prior art;

[0027] Figure 2 is a top view of a transparent LED display screen disclosed in the prior art;

[0028] Figure 3 is a partial cross-sectional view of a transparent LED display screen using CHIP type LED lamp beads provided in the specific embodiment of the present application;

[0029] Figure 4 is a top view of a transparent LED display screen using CHIP type LED lamp beads provided in the specific embodiment of the present application;

[0030] Figure 5a is a three-dimensional view of a CHIP type LED lamp bead provided in the specific embodiment of the present application;

[0031] Figure 5b is Figure 5a is a three-dimensional view of a CHIP type LED lamp bead provided in the specific embodiment of the present application;

[0032] Figure 6 is a top view of a transparent LED display screen using CHIP type LED lamp beads provided in the specific embodiment of the present application;

[0033] Figure 7 is a top view of another transparent LED display provided in the specific embodiments of the present application, which employs CHIP type LED lamp beads;

[0034] Figure 8 is Figure 7 is a further deformation of the transparent LED display in the specific embodiments of the present application;

[0035] Figure 9 is Figure 8 is a partial cross-sectional view of the transparent LED display in the specific embodiments of the present application;

[0036] Figure 10 is a further extension of a transparent LED display provided in the specific embodiments of the present application;

[0037] Figure 11 is a cross-sectional view of a transparent display employing TOP type LED lamp beads in the specific embodiments of the present application;

[0038] Figure 12a is Figure 10 , Figure 11 is a partial cross-sectional view of the TOP type LED lamp bead in the specific embodiments of the present application;

[0039] Figure 12b is Figure 10 , Figure 11 is a perspective view of the TOP type LED lamp bead in the specific embodiments of the present application;

[0040] Figure 13 is a partial cross-sectional view of a transparent LED display employing another TOP type LED lamp bead provided in the specific embodiments of the present application;

[0041] Figure 14a is Figure 13 is a partial cross-sectional view of the TOP type LED lamp bead in the specific embodiments of the present application;

[0042] Figure 14b is Figure 13 is a perspective view of the TOP type LED lamp bead in the specific embodiments of the present application.

[0043] In the background art, the reference signs are as follows: 1', transparent substrate; 2', LED lamp bead; 3', printed circuit layer; 4', protective cover plate; 5', glue filling layer; 31', lamp bead welding area; 32', power supply pad; 33, signal pad; 30', metal mesh;

[0044] Specific embodiments of the drawings: 1, transparent substrate; 2, LED lamp bead; 3, circuit pattern; 4, protective cover plate; 5, glue layer; 6, transparent unit plate; 20, light-emitting wafer; 21, driving chip; 22, shell; 23, chip mounting surface; 231, binding pad; 232, isolation channel; 31, power supply circuit; 31a, first power supply circuit; 31b, second power supply circuit; 32, signal jumper; 33, signal pad; 311, power supply jumper; 2311, binding pin. Specific embodiments

[0045] In order to make the technical problems solved by the present application, technical solutions and beneficial effects clearer, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and not to limit the present application.

[0046] In the description of the present application, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0047] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] Examples

[0049] This example will specifically explain the transparent LED display screen disclosed in the present application as follows, as shown in FIG. 1, which comprises a transparent substrate 1 and an LED lamp bead 2; the transparent substrate 1 is provided with a circuit pattern 3; the LED lamp bead 2 is pasted on the transparent substrate 1; the so-called pasting means fixed with glue, and the glue can be various glues known to those skilled in the art, such as instant glue, epoxy resin bonding, anaerobic glue, UV glue hot melt glue, pressure sensitive adhesive and the like. Figure 1

[0050] ​Generally, a transparent substrate 1 provided with the LED lamp beads 2 is further provided with a glue filling layer 5, which encapsulates the LED lamp beads 2; the upper surface of the glue filling layer 5 is provided with a protective cover plate 4. This is well known to those skilled in the art.

[0051] As shown in Figure 5a , Figure 5b , Figure 12a , Figure 12b , Figure 14a , Figure 14b The LED lamp beads 2 include a shell 22, a driving chip 21 and a light emitting wafer 20; the types thereof generally include CHIP type and TOP type structures. Among them, Figure 5a , Figure 5b The LED lamp bead 2 shown in the figure is a CHIP type LED lamp bead, Figure 12a , Figure 12b , Figure 14a , Figure 14b are two different forms of TOP type LED lamp beads.

[0052] Taking the CHIP type LED lamp bead as an example, as shown in Figure 5a , the shell 22 is formed with a chip mounting surface 23, the driving chip 21 is mounted on the chip mounting surface 23, and the light emitting wafer 20 is mounted on the driving chip 21 (or the light emitting wafer 20 can also be mounted on the chip mounting surface 23), controlled by the driving chip 21;

[0053] Among them, the chip mounting surface 23 includes an isolation channel 232 and a binding pad 231 isolated from each other through the isolation channel 232, the binding pad 231 includes an electrode pad (not labeled in the figure) and an input and output pad (not labeled in the figure); the electrode pad includes a first electrode pad (not labeled in the figure) and a second electrode pad (not labeled in the figure) with opposite polarities; the input and output pad includes a signal input pad (not labeled in the figure) and a signal output pad (not labeled in the figure);

[0054] As shown in Figures 3-4 , the circuit pattern 3 includes a power supply pad (not shown in the figure), a signal pad 33 and a power supply circuit 31; the power supply circuit 31 includes a plurality of first power supply circuits 31a and second power supply circuits 31b with opposite polarities; the power supply pad is connected to the first power supply circuit 31a and the second power supply circuit 31b;

[0055] The first electrode pad is directly or indirectly bound to the first power supply circuit 31a through a power supply jumper 311, and the second electrode pad is directly or indirectly bound to the second power supply circuit 31b through a power supply jumper 311;

[0056] Each of the LED lamp beads 2 is connected by signal jumpers 32 to form a lamp bead string, wherein the signal input pads of each of the LED lamp beads 2 in the lamp bead string are connected to the signal pads 33 or the signal output pads of the previous LED lamp bead 2 through the signal jumpers 32; the signal output pads of each of the LED lamp beads 2 are connected to the signal input pads of the next LED lamp bead 2 through the signal jumpers 32. If there is no other LED lamp bead 2 after the current LED lamp bead 2, the signal output pad is empty or returns to the signal pad.

[0057] Generally, a pin is led out on a conventional LED lamp bead, which is used for electrical connection with the pads arranged on the substrate, such as the lamp bead welding area. However, in the present application, since the welding action is not required, the power jumpers 311 and the signal jumpers 32 are directly used on the LED lamp beads 2 to realize electrical connection and signal transmission, and therefore the pin is not necessary. However, the pin can also be added in the present application, which is not used for welding connection with the pads, and is named as a binding pin 2311 for distinction.

[0058] As a preferred mode, the binding pad 231 has a binding pin 2311 led out therefrom; the binding pin 2311 includes electrode pins and input and output pins; the electrode pins include first and second electrode pins with opposite polarities; the input and output pins include signal input and output pins;

[0059] The first electrode pin is directly or indirectly bound to the first power supply line 31a through the power jumper 311, and the second electrode pin is directly or indirectly bound to the second power supply line 31b through the power jumper 311.

[0060] The signal input pins of each of the LED lamp beads 2 in the lamp bead string are connected to the signal pads 33 or the signal output pins of the previous LED lamp bead 2 through the signal jumpers 32; the signal output pins of each of the LED lamp beads 2 are connected to the signal input pins of the next LED lamp bead 2 through the signal jumpers 32.

[0061] The direct or indirect connection of the binding pad 231 or the binding pin 2311 with the power supply line 31 will be explained in detail as follows, such as Figure 3 , Figure 4As shown, the first electrode pad or first electrode pin on each of the LED lamp beads 2 is connected to the first power supply line 31a through the power supply jumper 311, or the first electrode pad or first electrode pin on the adjacent LED lamp bead 2; the second electrode pad or second electrode pin on each of the LED lamp beads 2 is connected to the second power supply line 31b through the power supply jumper 311, or the second electrode pad or second electrode pin on the adjacent LED lamp bead 2; so that each LED lamp bead 2 can directly take power from the power supply line 31, or from the adjacent LED lamp bead 2.

[0062] The power supply jumper 311 and the signal jumper 32 and the adapter jumper 313 in the example are the binding wires or bonding wires understood by those skilled in the art, which are only distinguished from each other and named here. The power supply jumper 311 and the signal jumper 32 described above are preferably 15-70 μm in diameter, made of gold wire, copper wire or alloy wire. Since the diameter is very small, it is almost invisible to the naked eye, so while ensuring that the working current of the connected several LED lamp beads 2 is met, the obstruction to the line of sight is reduced, and the transparency of the product is improved.

[0063] The power supply jumper 311 and the signal jumper 32 cross each other in the schematic diagram, but in the actual production process, they are bonded at different heights, and then fixed by glue filling, so they will not short circuit.

[0064] The shell 22 in the CHIP type LED lamp bead is a circuit board, and the copper foil on the front of the circuit board is etched to form the chip mounting surface 23, that is, after the circuit board is etched, the etched part forms an isolation channel 232, and the unetched part forms a bonding pad 231. The difference between the CHIP type LED lamp bead in the example and the traditional CHIP type LED lamp bead is that it does not need to form a pin on the back, and a pin 23 is formed on the back. The circuit board generally uses an insulating material such as glass epoxy resin or polyimide as a substrate, and the CHIP type packaging structure is known to the public. In the example, it is emphasized that it is not necessary to have a pin, and will not be described in detail. As a preferred way, as shown in Figure 5b As shown, the light-emitting wafer 20 is mounted on the driving chip 21; the driving chip 21 is packaged in a transparent encapsulating layer, and the chip mounting surface 23 exposes the bonding pad 231. This way can first encapsulate and protect the light-emitting wafer 20 and the driving chip 21 through the transparent encapsulating layer.

[0065] In this example, the light emitting chip 20 is preferably mounted on the driving chip 21 by a CSP (Chip Scale Package) method. It can also be mounted on the driving chip 21 by a COC (Chip On Chip) method. The light emitting chip 20 generally includes red, green, and blue light emitting chips 20.

[0066] As a preferred method, the power supply line 31 includes a plurality of first power supply lines 31a and second power supply lines 31b arranged in rows or columns. The first power supply line 31a and the second power supply line 31b are provided with a plurality of rows or columns of LED lamp beads 2. The LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b. Figure 6 As shown, the first power supply line 31a, the second power supply line 31b, and the first power supply line 31a are arranged in intervals. The first power supply line 31a and the second power supply line 31b on the left side are provided with 4 rows and 4 columns of LED lamp beads 2. The 4 rows and 4 columns of LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b. The first power supply line 31a and the second power supply line 31b on the right side are also provided with 4 rows and 4 columns of LED lamp beads 2. The 4 rows and 4 columns of LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b.

[0067] In this way, a plurality of columns or rows of LED lamp beads 2 share the same polarity power supply line 31, and the arrangement is repeated to form a large-area transparent LED display screen. Sharing the power supply line 31 by a plurality of LED lamp beads 2 can reduce the number of power supply lines 31, reduce the obstruction of the line of sight, and improve the transparency of the display screen.

[0068] The present application is not limited to the implementation of the power supply line 31, which is not the core innovation of the present application. The number of first power supply lines 31a and second power supply lines 31b can be one or more, and the number of first power supply lines 31a and second power supply lines 31b can be the same or different. The specific number is determined by the power supply capacity of the power supply line 31 and the current demand of the LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b. Generally, the number of LED lamp beads 2 is 3 to 8 columns, which is a relatively ideal number.

[0069] The power supply line 31 can be in the form of a straight line, a curved line, a serpentine line segment, etc. As a preferred mode, each power supply line 31 is generally arranged in a row or column, and the implementation is not limited, as long as it can provide power. For example, it can be a metal layer etched on the transparent substrate 1, or a metal mesh, or a nano-silver coating or ITO coating, or a metal wire as in the previously applied patent, or a metal sheet embedded in the transparent substrate 1, etc.

[0070] As a preferred mode, as shown in Figure 7 , the power supply line 31 is preferably a conductive mesh. The conductive mesh can be a metal mesh or ITO, and the dots in the figure are the binding lines and the binding points (electrical connection points) of the metal mesh or ITO. The metal mesh or ITO has a large sheet resistance and a small conductive capacity, so a large area is needed to meet the current demand. In the figure, the conductive mesh is arranged on both sides of several columns of LED lamp beads 2, and the LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b of the conductive mesh share the first power supply line 31a and the second power supply line 31b. At this time, only the LED lamp beads 2 need to be pasted on the glass substrate.

[0071] As shown in Figure 8 , Figure 9 , in order to enhance the conductive capacity of the conductive mesh, the area of the conductive mesh can also be expanded, and the LED lamp beads 2 can be insulatively pasted on the conductive mesh. For example, the left two columns of LED lamp beads 2 in the figure are arranged on the conductive mesh of the first power supply line 31a, and the right two columns of LED lamp beads 2 in the figure are arranged on the conductive mesh of the second power supply line 31b.

[0072] As for the design of the power supply line 31, there can also be other forms of variations, for example, as shown in Figure 10 , a plurality of transparent unit plates 6 are provided on the transparent substrate 1; the LED lamp beads 2 are arranged on the transparent unit plates 6; metal strips are provided on both sides of each transparent unit plate 6 as power supply lines 31; and the LED lamp beads 2 on each transparent unit plate 6 are connected to the power supply lines 31. The power supply lines 31 on both sides are the first power supply line 31a and the second power supply line 31b. This way makes the transparent substrate 1 surface without power supply lines 31, but embedded between the two transparent unit plates 6. The transparent unit plates 6 are independent glass plates, and each transparent unit plate 6 is fixed on the lower whole transparent substrate 1. The advantage of this way is that the metal strip has a very small cross-sectional area in the screen viewing direction, which can ensure sufficient current supply to a plurality of LED lamp beads 2 between the two power supply lines 31 with opposite polarities, greatly reducing the blockage of the conductive material to the line of sight, and improving the transparency of the screen.

[0073] AsFigure 11 As an alternative, a TOP type LED lamp bead can be used as shown in FIG. 2B. Figure 12a , 12b As shown in FIG. 2A, the so-called TOP type structure refers to a structure in which a PLCC (Plastic Leaded Chip Carrier) plastic support is used as the housing 22. The process is known to the public and generally includes processes such as metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional inkjet, etc. The core is to form a chip mounting surface 23 on the surface of the plastic support through a metal strip; and the chip mounting surface 23 extends a binding pin 2311. The binding pin 2311 in this example is no longer used for welding, but is used for binding connection. The binding pin 2311 is bent towards the bottom of the plastic support. A binding pin 2311 with a z-shaped structure is formed. The binding pad 231 is actually a metal sheet of the same material as the binding pin 2311. The metal sheet is stamped into shape, and the hollow part is filled with injection molding to become an isolation channel 232. The isolation channel 232 is actually an insulating plastic material that separates the binding pins 2311 and also serves to fix the housing 22. Specifically, the binding pad 231 includes electrode pads and input / output pads.

[0074] The driving chip 21 is known to the public, and generally has a driving circuit integrated inside the driving chip 21, and a passivation layer is provided on the driving chip 21. The passivation layer is a surface insulating layer formed when the driving chip 21 is manufactured. The driving chip 21 is provided with a plurality of pins (or terminals). The pins on the driving chip 21 are electrically connected to the chip mounting surface 23 and the light-emitting wafer 20 through direct welding or through a bonding wire. The pins (PAD) are generally provided on the passivation layer, and the pins are terminals inside the chip.

[0075] As another embodiment, as shown in FIG. 2B, a TOP type LED lamp bead 2 in the figure can also be used to paste on the transparent substrate 1. The TOP type LED lamp bead is shown in FIG. 2B. Figure 13 , Figure 14a , Figure 14b As shown in FIG. 2A, the binding pin 2311 on the chip mounting surface 23 can also be bent towards the top of the plastic support.

[0076] The transparent LED display screen disclosed by the application only needs to form a power supply circuit on the transparent substrate 1, and does not need to print a lamp bead welding area as in the prior art. The LED lamp beads 2 are fixed on the transparent substrate 1 in a pasting manner, then the power supply jumpers 311 are used to directly or indirectly electrically connect the LED lamp beads 2 to the power supply circuit 31, and the signal jumpers 32 are used to realize the series connection of the LED lamp beads 2, so as to replace the manner of welding the lamp bead welding area of the LED lamp bead 2 on the lamp bead welding area. The pasting fixing manner of the LED lamp bead 2 is easy to implement, avoids the difficulty in manufacturing the lamp bead welding area on the transparent substrate, and the LED lamp bead 2 is fixed firmly and not easy to fall off. The power supply jumpers 311 are used to realize the power supply of the LED lamp beads, and the signal jumpers 32 are used to realize the transmission of signals, which are easy to implement in the process. By using the technical means, the LED lamp beads 2 can be firmly bonded at room temperature, and the binding and wire bonding are also performed at room temperature, so that the high-temperature environment is avoided, and a very good technical means is provided for manufacturing the flexible transparent screen with the PET as the substrate. Meanwhile, the transparency of the transparent LED display screen is greatly improved by using the technical means.

[0077] The above only describes the preferred embodiments of the application and is not used to limit the application. Any modification, equivalent replacement and improvement within the spirit and principle of the application should be included in the protection scope of the application.

Claims

1. A transparent LED display, characterized by The LED lamp bead is pasted on the transparent substrate, and the LED lamp bead comprises a shell, a driving chip and a light-emitting wafer. The chip mounting surface comprises an isolation channel and a binding pad isolated from each other through the isolation channel, and the binding pad comprises an electrode pad and an input and output pad. The circuit pattern comprises a power supply pad, a signal pad and a power supply circuit, the power supply circuit comprises a plurality of rows of first power supply circuits and second power supply circuits arranged alternately, and a plurality of rows of LED lamp beads are arranged between the first power supply circuits and the second power supply circuits. The power supply pad is connected to the first power supply circuit and the second power supply circuit. The LED lamp bead shares the first power supply circuit and the second power supply circuit. In the plurality of rows of LED lamp beads between the first power supply circuit and the second power supply circuit, the first electrode pad of the first LED lamp bead is bound to the first power supply circuit through a power supply jumper, the second electrode pad of the last LED lamp bead is bound to the second power supply circuit through a power supply jumper, the first electrode pad of each of the remaining LED lamp beads is bound to the first electrode pad of the previous LED lamp bead through a power supply jumper, and the second electrode pad of each of the remaining LED lamp beads is bound to the second electrode pad of the next LED lamp bead through a power supply jumper. The power supply jumper is a binding wire or a bonding wire with a relatively small diameter. Each of the LED lamp beads is bound and connected to form a lamp bead string through a signal jumper, wherein the signal input pad of each of the LED lamp beads in the lamp bead string is connected to the signal pad or the signal output pad of the previous LED lamp bead through a signal jumper, and the signal output pad of each of the LED lamp beads is bound and connected to the signal input pad of the next LED lamp bead through a signal jumper. ​ ​ 2. The transparent LED display of claim 1, wherein, The binding pad is provided with a binding pin; the binding pin includes an electrode pin and an input and output pin; the electrode pin includes a first electrode pin and a second electrode pin with opposite polarities; the input and output pin includes a signal input pin and a signal output pin; The first electrode pin is directly or indirectly bound to the first power supply line through a power supply jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power supply jumper; The signal input pin of each LED lamp bead in the lamp bead string is bound and connected to a signal pad or a signal output pin of a previous LED lamp bead through a signal jumper; and the signal output pin of each LED lamp bead is bound and connected to a signal input pin of a subsequent LED lamp bead through a signal jumper.

3. The transparent LED display of claim 1 or 2, wherein, The first electrode pad or the first electrode pin on each LED lamp bead is bound and connected to the first power supply line or a first electrode pad or a first electrode pin on an adjacent LED lamp bead through a power supply jumper; and the second electrode pad or the second electrode pin on each LED lamp bead is bound and connected to the second power supply line or a second electrode pad or a second electrode pin on an adjacent LED lamp bead through a power supply jumper; so that each LED lamp bead can directly draw power from the power supply line or from an adjacent LED lamp bead.

4. The transparent LED display of claim 1, wherein, The LED lamp bead is a CHIP type LED lamp bead, and a copper foil on a front surface of a circuit board of the CHIP type LED lamp bead is etched to form a chip mounting surface.

5. The transparent LED display of claim 4, wherein, A driving chip is arranged on the chip mounting surface of the CHIP type LED lamp bead, and a light emitting wafer is mounted on the driving chip; the driving chip is encapsulated in a transparent encapsulating layer, and the chip mounting surface exposes the binding pad.

6. The transparent LED display of claim 2, wherein, The LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a housing adopting a plastic support; a chip mounting surface is formed on a surface of the plastic support through a metal strip, the binding pin extends from the chip mounting surface and is bent towards a bottom of the plastic support.

7. The transparent LED display of claim 2, wherein, The LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a housing adopting a plastic support; a chip mounting surface is formed on a surface of the plastic support through a metal strip, the binding pin extends from the chip mounting surface and is bent towards a top of the plastic support.

8. The transparent LED display of claim 1, wherein, The light emitting wafer is mounted on the driving chip in a CSP or COC mode.

9. The transparent LED display of claim 1, wherein, A transparent substrate on which the LED lamp bead is arranged is provided with an encapsulating layer, and the encapsulating layer encapsulates each LED lamp bead therein; An upper surface of the encapsulating layer is provided with a protective cover plate.

10. The transparent LED display of claim 9, wherein, The transparent substrate is provided with a plurality of transparent unit plates; the LED lamp bead is attached to the transparent unit plate; metal strips are arranged on both sides of each transparent unit plate as power supply lines; and the LED lamp bead on each transparent unit plate is connected to the power supply lines.

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