Ultra-precision grinding device and method for hemispherical resonator
By using a specific grinding wheel combination and diamond abrasives on the grinding machine, the problems of difficulty and low precision in machining quartz hemispherical resonators were solved, achieving ultra-precision machining effects with high efficiency and low damage.
Patent Information
- Application Number
- CN202211457870.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-21
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2042-11-21
AI Technical Summary
Quartz hemispherical resonators are prone to edge chipping, cracking, and fragmentation during mechanical processing. They are difficult to process, have a high scrap rate, and are difficult to meet high precision requirements.
A three-axis vertical or horizontal grinding machine is used, combined with an external convex grinding wheel, an internal concave cylindrical grinding wheel, an external concave grinding wheel and a cut-off grinding wheel, and diamond abrasives of different grit sizes are used for grinding, including rough grinding, semi-finishing grinding and fine grinding of various parts, with appropriate speed and feed rate.
The efficient ultra-precision machining of the quartz hemispherical resonator is achieved, with low surface roughness of the inner and outer spherical surfaces, smooth and defect-free surfaces, and high coaxiality and surface accuracy of the inner and outer cylinders, which significantly improves the machining efficiency and quality.