Array heat spreader for large scale radar array

Abstract

An array type heat-dissipating device for large-scale radar array is arranged below the radar heat-generating module, has an array type heat transfer structure inside, can be processed into the radar array installation structure, and is provided with heat-dissipating fins at one end; a plurality of array type heat transfer channels are arranged on the side of the array close to the heat-generating module, the direction of the heat transfer channels is parallel to the direction from the heat-generating module to the heat-dissipating fins, the endpoint on the side of the heat-generating module is the heat transfer initial end, and the endpoint on the side of the heat-dissipating fins is the heat transfer terminal end; the heat transfer channels are designed to be of unequal length, so that there are not less than one heat transfer initial end below each heat-generating module. The system is simple, compact in structure, and can realize heat transfer and dissipation without consuming energy, has strong system heat transfer capacity, and is suitable for large-scale radar array heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of spacecraft thermal control technology, and in particular to an array-type vapor chamber heat sink suitable for large-scale radar arrays. Background Technology

[0002] Tile array antennas represent an important development direction in the integration of active phased array antennas, offering advantages such as small size, light weight, and high integration density, making large-scale array integration easy. However, limited by chip materials and manufacturing processes, their efficiency is only around 20%, or even lower, with the remaining 80% of energy manifesting as heat. The small size and high integration density of tile-type TR components place stringent demands on heat dissipation.

[0003] To address the heat dissipation problem of phased array radar arrays, patent CN201720588653.5 discloses a heat dissipation device for active phased array radars. Two or more thermoelectric coolers are disposed on the inner wall of the radar array, with the cold ends of the thermoelectric coolers facing inwards. The hot ends of the two or more thermoelectric coolers are connected in series via heat pipes, with the ends of the heat pipes extending into a heat dissipation box. The heat dissipation box is disposed outside the radar array, and heat dissipation fins are provided on the portions of the heat pipes extending into the heat dissipation box. An intake fan and an exhaust fan are provided on the heat dissipation box, and the intake and exhaust fans are arranged opposite to each other. The surfaces of the intake and exhaust fans facing inwards from the heat dissipation box both face the fin ends of the heat dissipation fins.

[0004] In this patent, a semiconductor cooling chip is used to conduct heat from the heat source, heat pipes are used to connect the hot ends of the cooling chip in series to transfer the heat to the heat sink, and a fan with cooling fins is used to dissipate the heat. However, due to the limited heat transfer capacity of the heat pipes and the distribution of the heat source, this technical solution is not suitable for heat dissipation of large-scale radar arrays.

[0005] To improve heat dissipation, patent CN201110460197.3 discloses a heat dissipation device for an airborne phased array radar antenna, which relates to airborne phased array radar technology. The device includes heat pipes and liquid cooling plates. Heat pipes are embedded on the outer side of the bottom of the T / R box near the power device. Multiple T / R boxes are stacked one on top of the other. On each side of the multiple T / R boxes, a liquid cooling plate is set as a mounting plate to support the antenna and fix the T / R box. The two liquid cooling plates are connected to a refrigerant tank. The high heat transfer and liquid flow of the liquid cooling plates are used to transfer the heat generated inside the phased array radar antenna. The liquid cooling pipes are used to conduct the heat to a space that is easy to dissipate heat, and the heat sink is used for centralized heat dissipation.

[0006] Patent CN201520716543.3 discloses a field of active phased array radar equipment, specifically relating to a cooling plate for an active phased array antenna. It includes a cooling plate body and one or more slots disposed on the surface of the cooling plate body for inserting heat transfer devices. The cooling plate body also has one or more through holes serving as channels for KK connectors. Simultaneously, a flow channel is disposed inside the cooling plate body, the flow channel including a flow channel body located inside the cooling plate body and surrounding all the slots, for cooling the heat transfer devices inserted into the slots. This utility model provides a cooling plate for active phased array antennas that dissipates heat from the T / R module by setting a flow channel surrounding the heat transfer devices inserted therein. Due to the presence of the flow channel, this utility model can use various methods such as liquid phase, gas phase, or filling with phase change materials to increase the heat dissipation efficiency of the cooling plate, thereby improving the service life of the active phased array antenna.

[0007] Both solutions use liquid cooling plates for heat dissipation, requiring mechanical pumps and coolant to operate, consuming energy resources and increasing system complexity. Summary of the Invention

[0008] This disclosure provides an array-type vapor chamber heat dissipation device suitable for large-scale radar array heat dissipation. The system is simple, compact, and has strong heat transfer capability, achieving heat transfer and heat dissipation without consuming energy.

[0009] The present disclosure provides an array-type heat dissipation plate device suitable for large-scale radar array heat dissipation. The heat dissipation plate is placed below the radar heat-generating module and operates. The plate has an array-type heat transfer structure and heat dissipation fins at one end.

[0010] The heat exchange plate is shaped like a radar array mounting structure. On the side of the array that is close to the heat-generating module, there are several array-type heat transfer channels. The direction of the heat transfer channels is parallel to the direction from the heat-generating module to the heat dissipation fins. The end point on the side of the heat-generating module is the initial end of heat transfer, and the end point on the side of the heat dissipation fins is the final end of heat transfer. The heat transfer channels adopt an unequal length design to ensure that there is no less than one initial end of heat transfer under each heat-generating module.

[0011] Furthermore, the heat dissipation fins are arranged on the other side of the array surface; this side is also provided with several heat transfer channels orthogonal to the direction from the heat-generating module to the heat dissipation fins.

[0012] Furthermore, each of the heat transfer channels is a separate heat transfer structure with a channel width of 10–20 mm and a height of 3–10 mm.

[0013] Furthermore, each heat transfer channel is a sealed cavity formed by matching the upper and lower plates, containing capillary structures and a phase change heat dissipation medium.

[0014] Furthermore, the capillary structure consists of channels and porous capillary cores covering the surface of the channels. The porous capillary cores are made of sintered wire mesh material, sintered fiber felt, or powder sintered porous material, with a thickness of 0.5 to 1.0 mm, a capillary core pore size of 10 to 200 micrometers, and a porosity of 30% to 70%.

[0015] Furthermore, the inner surface of the lower plate has a channel structure, and the inner surface of the upper plate has a cylindrical boss array structure. The capillary core is fixed by the cylindrical bosses of the upper plate and fits against the lower plate, completely covering the channel on the inner side of the lower plate.

[0016] Furthermore, the channel width is 0.3–0.5 mm and the channel depth is 0.5–1.0 mm.

[0017] Furthermore, the cylindrical boss array of the upper plate is a stepped column, and the height of the cylindrical steps is the capillary core thickness and the cavity height, respectively; the capillary core has a circular hole that matches the parameters of the cylindrical boss array, and the diameter of the circular hole matches the diameter of the end of the cylinder with a gap between 0.1mm and 0.5mm; the diameter of the circular hole is smaller than the diameter of the root of the cylinder.

[0018] Furthermore, the filling amount of the heat dissipation working fluid is 1 / 3 to 1 / 4 of the total cavity volume. After the working fluid completely wets the pores of the capillary structure, some of it should still accumulate in the initial heat transfer cavity, and the liquid level should not be less than the size of two heating modules.

[0019] Furthermore, the mounting surfaces of the upper plate and the lower plate are joined by friction stir welding.

[0020] Compared with the prior art, the beneficial effects of this disclosure are:

[0021] (1) The front panel heat transfer channel is designed with unequal lengths to ensure that there is at least one heat transfer initial end under each heat-generating module. When the module in the middle of the array is turned on alone, it can also transfer heat normally.

[0022] (2) The heat transfer channels on the rear panel are arranged orthogonally to the front panel, which can improve the temperature uniformity within the radiator surface, improve the utilization efficiency of the heat dissipation fins, and reduce the radiator temperature level.

[0023] (3) The axial channel structure on the inner side of the lower plate can significantly reduce the flow resistance of the working fluid and improve the heat transfer capacity, making it suitable for large-scale array-type heat source heat dissipation.

[0024] (4) The internal capillary core structure has a large capillary force, which can adsorb the working fluid. The heat sink can work at different tilt angles from 0 to 90°, which broadens the working mode and environmental adaptability of the equipment.

[0025] (5) The working fluid is adsorbed in the porous capillary core, which can prevent the working fluid from forming a deep liquid pool under the action of gravity, and reduce the superheat required for the heat transfer channel to start up and operate; the filling amount can ensure that the radiator can operate normally even if the first heating module at the initial end of the heat transfer does not work, the heating of the other modules can also make the radiator operate normally.

[0026] (6) The cylindrical array arranged on the upper plate is closely attached to the capillary core, which can improve the heat conduction path, increase the evaporation surface area of ​​the capillary core, and reduce the heat transfer temperature difference.

[0027] (7) The capillary core is tightly attached to the inner surface of the lower plate through the upper plate cylindrical array to form a capillary seal, which prevents the channel from being broken by steam during operation and improves the operating stability of the radiator.

[0028] (8) The system is simple and compact, and can achieve heat transfer and heat dissipation without consuming energy. Attached Figure Description

[0029] The above and other objects, features and advantages of this disclosure will become more apparent from the more detailed description of exemplary embodiments of this disclosure taken in conjunction with the accompanying drawings, in which the same reference numerals generally represent the same components.

[0030] Figure 1 1 is the front panel of the radar array mounting structure, 2 is the rear panel of the radar array mounting structure, 3 is the array-type heat transfer channel, 4 is the heat dissipation fins, and 5 is the orthogonal heat transfer channel.

[0031] Figure 2 This is a schematic diagram of the internal structure of a heat transfer channel unit. In the diagram, 1 is a porous capillary core, 2 is an upper plate with a cylindrical array, 3 is a schematic diagram of the assembly of the wire mesh and the upper plate, 4 is a lower plate with a channel structure, and 5 is a schematic diagram of the interface of a single heat transfer channel.

[0032] Figure 3 A schematic diagram of the fabricated components of an array-type heat exchanger, where 1, 2, 3, and 4 are, in order, the integral plate, the heat transfer channel, the capillary core, and the fins. Detailed Implementation

[0033] Preferred embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0034] This disclosure provides an array-type heat dissipation device suitable for large-scale radar arrays. It has an internal array-type heat transfer structure and its shape can be processed into a radar array mounting structure. One end is equipped with heat dissipation fins. The system is simple and compact, and can achieve heat transfer and heat dissipation without consuming energy. The system has strong heat transfer capacity and is suitable for large-scale radar array heat dissipation.

[0035] Exemplary embodiments are attached. Figure 1 As shown, its shape is a radar array mounting structure. Several array-type heat transfer channels are arranged on one side of the array (defined as the front panel). The direction of the heat transfer channels is parallel to the direction from the heat-generating module to the heat dissipation fins. The end point on the side of the heat-generating module is the initial end of heat transfer, and the end point on the side of the fins is the final end of heat transfer.

[0036] Multiple heat transfer channels located under the same heat transfer path on the front panel are set to different lengths to ensure that there is no less than one heat transfer initiation end under each heating module, and one or more heating modules may pass through a heat transfer channel.

[0037] On the other side of the array (defined as the rear panel), heat dissipation fins and heat transfer channels orthogonal to several front panel heat transfer channels are arranged.

[0038] Except for their length, the array-type heat transfer channels have the same internal heat transfer structure, as shown in the attached figure. Figure 2 As shown in the diagram. Each heat transfer channel is an independent heat transfer structure, with a channel width preferably of 10–20 mm and a channel height preferably of 3–10 mm. A single heat transfer channel consists of an upper plate and a lower plate forming a sealed cavity. A filling hole is provided on one side of the cavity for filling with the working fluid, and the cavity is sealed after filling. The cavity contains a porous capillary core and a phase change working fluid. The porous capillary core is preferably made of sintered wire mesh material, with a thickness preferably of 0.5–1.0 mm, a pore size of 10–200 micrometers, and a porosity of 30%–70%. The phase change working fluid can be ammonia, acetone, water, ethanol, or Freon, etc.

[0039] The inner surface of the lower plate has a channel structure, and the inner surface of the upper plate has a cylindrical boss array structure; the channel width is preferably 0.3 to 0.5 mm; the channel depth is preferably 0.5 to 1.0 mm; the capillary core is fixed by the cylindrical bosses of the upper plate, and the capillary core fits against the lower plate of the cavity, completely covering the channel on the inner side of the lower plate;

[0040] The upper plate cylindrical boss array is a stepped column, and the height of the cylindrical steps is the capillary core thickness and the cavity height, respectively. The capillary core has a circular hole that matches the parameters of the cylindrical boss array. The hole diameter is clearance-fitted with the diameter of the cylinder end, with a clearance between 0.1mm and 0.5mm. The hole diameter on the capillary core is smaller than the diameter of the cylinder root.

[0041] The assembly surfaces of the upper and lower plates are preferably joined by friction stir welding.

[0042] Taking a large-scale radar array as an example, the specific implementation process is described below:

[0043] (1) Fabricate one upper plate, 63 lower plates of 8 types, 63 capillary cores of 8 types, and one fin of array-type heat exchanger according to the design drawings. Schematic diagram is attached. Figure 3 As shown.

[0044] (2) Assemble the capillary core on the cylindrical array on the upper plate, and then assemble them in the corresponding positions on the lower plate.

[0045] (3) The assembly surfaces of the upper and lower plates are welded together by friction stir welding to form a closed cavity;

[0046] (4) A working fluid filling hole is machined on the side of the radiator near the fins, and a filling pipe is welded at the filling point using argon arc welding.

[0047] (5) Weld or screw the fins to the designated area on the upper plate of the radiator;

[0048] (6) Fill each heat transfer channel with the designed amount of phase change working fluid and seal the filling pipe;

[0049] (7) Complete the radiator manufacturing.

[0050] The above technical solutions are merely exemplary embodiments of the present invention. For those skilled in the art, based on the application methods and principles disclosed in the present invention, it is easy to make various types of improvements or modifications, and not limited to the methods described in the specific embodiments of the present invention. Therefore, the methods described above are merely preferred and not restrictive.

Claims

1. An array-type heat dissipation device suitable for large-scale radar arrays, characterized in that: The heat exchange plate is positioned below the radar heating module and has an array-type heat transfer structure inside, with heat dissipation fins at one end. The heat exchange plate is shaped like a radar array mounting structure. On the side of the array that is close to the heat-generating module, there are several array-type heat transfer channels. The direction of the heat transfer channels is parallel to the direction from the heat-generating module to the heat dissipation fins. The end point on the side of the heat-generating module is the initial end of heat transfer, and the end point on the side of the heat dissipation fins is the final end of heat transfer. The heat transfer channels adopt an unequal length design to ensure that there is no less than one initial end of heat transfer under each heat-generating module. A single heat transfer channel is a sealed cavity formed by matching the upper and lower plates, and the cavity contains capillary structures and phase change heat dissipation working fluid; The inner surface of the lower plate has a channel structure, and the inner surface of the upper plate has a cylindrical boss array structure. The capillary core is fixed by the cylindrical bosses of the upper plate and fits against the lower plate, completely covering the channel on the inner side of the lower plate.

2. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation fins are arranged on the other side of the array; this side is also provided with several heat transfer channels that are orthogonal to the direction from the heat-generating module to the heat dissipation fins.

3. The heat dissipation device as described in claim 1 or 2, characterized in that, Each heat transfer channel is a separate heat transfer structure with a channel width of 10~20mm and a height of 3~10mm.

4. The heat dissipation device as described in claim 1, characterized in that, The capillary structure consists of channels and porous capillary cores covering the surface of the channels. The porous capillary cores are made of sintered wire mesh, sintered fiber felt, or powder sintered porous material with a thickness of 0.5~1.0 mm, a capillary core pore size of 10~200 micrometers, and a porosity of 30%~70%.

5. The heat dissipation device as described in claim 1, characterized in that, The channel width is 0.3~0.5mm and the channel depth is 0.5~1.0mm.

6. The heat dissipation device as described in claim 1, characterized in that, The cylindrical boss array on the upper plate is a stepped column, and the height of the cylindrical steps is the capillary core thickness and the cavity height, respectively. The capillary core has a circular hole that matches the parameters of the cylindrical boss array. The diameter of the circular hole matches the diameter of the end of the cylinder, with a gap between 0.1mm and 0.5mm. The diameter of the circular hole is smaller than the diameter of the root of the cylinder.

7. The heat dissipation device as described in claim 1, characterized in that, The filling amount of the heat dissipation working fluid is 1 / 3 to 1 / 4 of the total cavity volume. After the working fluid completely wets the pores of the capillary structure, some of it should still accumulate in the cavity at the initial end of the heat transfer. The liquid level line should not be less than the size of two heating modules.

8. The heat dissipation device as described in any one of claims 1-7, characterized in that, The mounting surfaces of the upper and lower plates are joined by friction stir welding.

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