Electronic water pump controller heat dissipation system based on thermoelectric refrigeration and control method

Abstract

The application provides an electronic water pump controller heat dissipation system and control method based on thermoelectric refrigeration, relates to the technical field of electronic water pump controller heat dissipation, and aims to solve the problems of low heat dissipation efficiency, reverse heating under high temperature and poor temperature control precision. The system contacts the cold end of the thermoelectric refrigerator with the back of the main control panel and contacts the hot end with the motor side wall, thereby constructing a new heat dissipation path from the main control panel, the thermoelectric refrigerator, the motor side wall, the motor shaft to the impeller cooling liquid, greatly shortening the heat transfer path, reducing the thermal resistance and significantly improving the heat dissipation efficiency. At the same time, the active refrigeration capacity of the thermoelectric refrigerator can still maintain the low temperature of the cold end in the high-temperature environment, thereby avoiding reverse heating. Combined with the real-time feedback regulation of the temperature sensor and the main control circuit, the system can dynamically adjust the refrigeration capacity according to the working condition, realize the accurate active control of the controller temperature, and ensure the stable and reliable operation of the electronic water pump.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic water pump controllers, and particularly to a heat dissipation system and control method for electronic water pump controllers based on thermoelectric cooling. Background Technology

[0002] With the rapid development and popularization of new energy vehicles, their safety has become a major concern. As a core component of automotive thermal management systems, the performance, reliability, and lifespan of electronic water pumps are increasingly important. During operation, power devices (such as IGBTs and MOSFETs) in electronic water pumps generate a large amount of heat. Once the temperature exceeds a threshold, it can lead to performance degradation, shortened lifespan, and even system failure. Therefore, research on the heat dissipation of electronic water pump controllers is receiving increasing attention.

[0003] Currently, the mainstream heat dissipation technologies for electronic water pump controllers mainly include three forms: passive heat dissipation, active air cooling, and liquid cooling.

[0004] Passive cooling: Passive cooling does not rely on any external power or moving parts (such as fans). It dissipates the heat generated by the controller to the surrounding environment naturally through three physical methods: heat conduction, heat convection, and heat radiation. It is usually used in conjunction with heat sinks. However, this method is only suitable for low-power and low-temperature scenarios. Under high-temperature and high-load conditions, its heat dissipation capacity is significantly insufficient and cannot effectively ensure the normal operation of the controller.

[0005] Active air cooling: This method uses air as the cooling medium, forcing airflow through a finned metal heatsink inside the controller via a fan. This removes heat generated by the controller's power devices and dissipates it into the surrounding environment. Its biggest advantages are its simple structure and low cost. It also boasts high reliability, easy maintenance, small footprint, and environmental friendliness. However, air's low thermal conductivity results in significant thermal resistance, making it difficult to achieve sufficient cooling efficiency in high-temperature environments or high-power operation. For example, in some extreme high-temperature environments, the temperature difference between the air and the controller decreases, drastically reducing the cooling effect and potentially causing the controller to overheat, affecting its normal operation.

[0006] Liquid cooling: A liquid cooling system mainly consists of a cooling plate that is in direct contact with the controller's power devices, a water pump, a radiator similar to a car radiator but equipped with a fan, a water tank, and piping. After absorbing heat within the cooling plate, the liquid is pumped to the radiator, where the fan dissipates the heat into the air. The cooled liquid then flows back to the cooling plate, and the cycle repeats. Liquid cooling offers advantages such as high heat dissipation efficiency, minimal susceptibility to environmental influences, and good temperature uniformity. However, this system is relatively complex, costly, and carries the risk of liquid leakage, which could potentially damage electronic equipment.

[0007] In summary, existing technologies generally suffer from the following problems:

[0008] 1) Insufficient heat dissipation efficiency: Traditional air-cooling / water-cooling technologies have high thermal resistance in the heat transfer path, resulting in a local surface power density exceeding 10W / cm² on the controller. 2 In some cases, it is difficult to control the junction temperature of the controller's heat-generating components within a safe range, leading to derating of the controller. In addition, conventional air cooling methods can only dissipate heat from the controller as a whole, and cannot precisely dissipate heat from the main heat-generating components of the controller, resulting in low heat dissipation efficiency.

[0009] 2) Heat dissipation failure or even reverse heating of the controller under high temperature conditions: Electronic water pump controllers generate a large amount of heat during operation. For traditional natural cooling electronic water pumps, the heat transfer direction is controller heating element → air → housing → environment. Due to the high thermal resistance of air, heat is difficult to dissipate. The controller temperature cannot be reduced below the ambient temperature. When the ambient temperature rises, the heat exchange temperature difference decreases, and the controller's heat dissipation becomes even worse, causing the controller to operate at high temperatures, which can shorten its lifespan or even lead to failure. In extreme high-temperature environments, reverse heating may even occur, with heat being transferred from the environment to the controller.

[0010] 3) Low temperature control accuracy: Traditional passive heat dissipation methods rely on ambient temperature and air convection intensity, making it difficult to achieve active control and precise regulation of the controller temperature. This makes it unable to adapt to rapid changes in the heat generated by the controller when the operating conditions of the electronic water pump change rapidly, resulting in the electronic water pump operating at reduced capacity.

[0011] Therefore, as electronic devices develop towards miniaturization and high power density, the limitations of traditional heat dissipation technologies in terms of heat dissipation efficiency, system integration, and energy consumption control are becoming increasingly apparent. This is particularly true in electronic water pump applications. On the one hand, traditional heat dissipation methods have high thermal resistance, making it difficult to meet the ever-increasing heat dissipation demands. In high-temperature environments, this can even lead to the environment heating the controller in reverse. On the other hand, electronic water pump operating conditions change rapidly, and traditional heat dissipation methods lack the ability to precisely and actively control temperature, failing to respond promptly to sudden changes in heat load. This results in large temperature fluctuations in the controller, affecting its stability and reliability. For example, during the operation of new energy vehicles, the operating conditions of the electronic water pump change frequently with the vehicle's operating status. Traditional heat dissipation methods cannot guarantee that the controller remains within its optimal operating temperature range, thus affecting the discharge of the power battery and the vehicle's operation. Summary of the Invention

[0012] To address the technical problems of low heat dissipation efficiency, heat dissipation failure or even reverse heating in high-temperature environments, and poor temperature control accuracy in existing electronic water pump controllers, this invention provides a heat dissipation system and control method for electronic water pump controllers based on thermoelectric cooling. The aim is to achieve efficient, accurate, and proactive temperature control and heat dissipation by reconstructing the heat dissipation path and utilizing thermoelectric cooling technology, thereby improving heat dissipation efficiency, enhancing adaptability to high-temperature environments, and providing more reliable heat dissipation assurance for the stable operation of electronic water pumps.

[0013] To achieve the above objectives, the present invention provides the following technical solution:

[0014] The present invention provides a heat dissipation system for an electronic water pump controller based on thermoelectric cooling in a first aspect. The electronic water pump controller is integrated with an electronic water pump, which includes an electronic water pump housing, a motor and motor shaft disposed inside the housing, and an impeller connected to the motor shaft. The impeller is located inside an impeller chamber containing impeller coolant. The electronic water pump controller includes a main control board with a heating element. The heat dissipation system includes: a thermoelectric cooler, including a cold end and a hot end, the cold end contacting the back of the main control board of the electronic water pump controller, and the hot end contacting the side wall of the motor of the electronic water pump; a temperature sensor mounted on the main control board of the electronic water pump controller for real-time acquisition of the temperature of the main control board; and a main control circuit electrically connected to the temperature sensor and the thermoelectric cooler for adjusting the operating current of the thermoelectric cooler based on the temperature signal acquired by the temperature sensor and a preset temperature control strategy to control the cooling capacity of the thermoelectric cooler. The heat dissipation system constructs a heat dissipation path from the main control board with the heating element in the electronic water pump controller through the thermoelectric cooler, the side wall of the motor, the motor shaft, to the impeller coolant.

[0015] In a first aspect, the present invention provides a preferred embodiment in which the cold end of the thermoelectric cooler is provided with a thermally conductive layer, and the hot end of the thermoelectric cooler is provided with another thermally conductive layer. The cold end is attached to the back of the main control board of the electronic water pump controller through one thermally conductive layer, and the hot end is attached to the motor side wall of the electronic water pump through the other thermally conductive layer. This preferred embodiment effectively fills the microscopic gaps at the contact interface by providing thermally conductive layers between the cold end and the main control board of the thermoelectric cooler, and between the hot end and the motor side wall, thereby reducing contact thermal resistance and improving heat conduction efficiency.

[0016] In a first aspect, the present invention provides a preferred embodiment in which the thermally conductive layer is formed by applying thermally conductive adhesive between the cold end of the thermoelectric cooler and the main control board and / or between the hot end and the side wall of the motor, resulting in a uniform thickness. This preferred embodiment effectively fills the microscopic gaps at the contact interface by providing a uniformly thick thermally conductive adhesive layer between the cold end of the thermoelectric cooler and the main control board, and between the hot end and the side wall of the motor, significantly reducing contact thermal resistance and improving heat transfer efficiency. Simultaneously, the thermally conductive adhesive possesses good adhesion and aging resistance, enabling it to maintain a stable thermal connection over a long period, ensuring the reliability and service life of the heat dissipation path.

[0017] The present invention provides a preferred embodiment in a first aspect, wherein the main control circuit includes: a signal processing unit for amplifying and filtering the acquired temperature signal; a control algorithm unit for calculating the required input current value of the thermoelectric cooler based on the processed temperature signal and a preset temperature control strategy using a control algorithm; and a drive unit for providing a corresponding drive current to the thermoelectric cooler based on the input current value calculated by the control algorithm unit. In this preferred embodiment, the main control circuit integrates the signal processing unit, the control algorithm unit, and the drive unit, realizing the amplification and filtering of the temperature signal, real-time calculation of the control algorithm, and precise output of the drive current. This structure has a clear division of labor and rapid response, effectively improving the accuracy and dynamic response capability of temperature control, ensuring that the thermoelectric cooler can quickly and stably adjust its cooling power under different operating conditions.

[0018] In a first aspect, this invention provides a preferred embodiment in which the thermoelectric cooler is aligned with the concentrated area of ​​heating elements on the main control board; the temperature sensors include multiple sensors, each arranged at a key heating element, for real-time acquisition of the absolute temperature value, temperature distribution, and temperature change rate of the electronic water pump controller. This preferred embodiment aligns the thermoelectric cooler with the concentrated area of ​​heating elements on the main control board and arranges multiple temperature sensors at each key heating element, enabling real-time acquisition of the controller's absolute temperature value, temperature distribution, and temperature change rate. This layout achieves targeted monitoring and precise cooling of the heat source, avoids ineffective heat dissipation, improves cooling efficiency, and provides multi-dimensional data support for hierarchical control strategies.

[0019] In a first aspect, the present invention provides a preferred embodiment in which the preset temperature control strategy adopts a hierarchical control strategy, and the cooling power of the thermoelectric cooler is divided into multiple discrete power levels for control based on the temperature signal and in combination with multiple preset temperature thresholds; wherein, the multiple preset temperature thresholds are determined based on a minimum temperature threshold, an intermediate temperature threshold, a high temperature threshold, and a maximum allowable temperature.

[0020] The present invention provides a preferred embodiment in a first aspect, wherein the graded control strategy includes: dividing the cooling power of the thermoelectric cooler into five levels: 0%, 25%, 50%, 75%, and 100%; and dynamically switching the power level according to a temperature threshold, the specific logic of which is as follows:

[0021] When the temperature exceeds T p At that time, it outputs 100% power;

[0022] When the temperature drops to 1 / 2 (T) h +T p When below 5%, output 75% power;

[0023] When the temperature drops to 1 / 2 (T) m +T h When the output power is below 50%, output 50% power.

[0024] When the temperature drops to 1 / 2 (T) l +T m When the output power is below 25%, output 25% of the power.

[0025] When the temperature is below T l At that time, the output power is 0%.

[0026] When the temperature rises, switch to a higher power level according to the corresponding threshold.

[0027] Among them, T l T m T h T p These are: minimum temperature threshold, intermediate temperature threshold, high temperature threshold, and maximum allowable temperature.

[0028] By setting a minimum temperature threshold (T) l ), intermediate temperature threshold (T) m） High temperature threshold (T) h ) and the maximum allowable temperature (T) p The cooling power of the thermoelectric cooler is divided into five levels: 0%, 25%, 50%, 75%, and 100%, and dynamically switched according to the real-time temperature. This strategy achieves on-demand cooling, ensuring heat dissipation while avoiding unnecessary energy consumption; at the same time, the use of hysteresis switching logic (increasing the level according to the threshold when the temperature rises) effectively prevents frequent power jumps and improves system stability.

[0029] In its first aspect, this invention provides a preferred embodiment where the control algorithm employs a PID control algorithm. Based on the power of the electronic water pump, the temperature distribution of the electronic water pump controller, and the rate of temperature change, the operating current zones of the thermoelectric cooler are dynamically adjusted to achieve precise temperature control. This preferred embodiment uses a PID control algorithm, combined with the power of the electronic water pump, the temperature distribution of the controller, and the rate of temperature change, to dynamically adjust the operating current zones of the thermoelectric cooler. This solution enables precise adjustment based on real-time operating condition changes, further improving temperature control accuracy and response speed, and adapting to the actual operational needs of rapid changes in the electronic water pump load.

[0030] In a first aspect, the present invention provides a preferred embodiment in which a sealing structure is provided between the motor shaft and the impeller coolant; and the wiring structure of the main control circuit adopts an anti-electromagnetic interference design. In this preferred embodiment, the sealing structure between the motor shaft and the impeller coolant ensures the sealing performance of the heat dissipation path and the reliability of heat conduction, preventing coolant leakage from causing heat dissipation failure. The main control circuit adopts an anti-electromagnetic interference wiring design, effectively suppressing signal transmission interference, ensuring the accuracy of temperature acquisition and control commands, and improving the system's operational stability in complex electromagnetic environments.

[0031] In a second aspect, this invention provides a heat dissipation method for an electronic water pump controller based on thermoelectric cooling. The system includes the following steps: real-time acquisition of the temperature of the main control board of the electronic water pump controller via a temperature sensor; inputting the temperature signal into the main control circuit; the main control circuit calculating the operating current and outputting a corresponding control signal based on the temperature signal and a preset temperature control strategy; and adjusting the operating current applied to the thermoelectric cooler according to the control signal to change its cooling power. This achieves automation and intelligence in the heat dissipation process, dynamically adjusting the cooling power according to the actual temperature, ensuring that the controller always operates within a safe temperature range, optimizing energy consumption, and improving the overall energy efficiency and reliability of the system.

[0032] Compared with the prior art, the present invention has the following advantages:

[0033] This invention effectively solves the technical problems of low heat dissipation efficiency, heat dissipation failure or even reverse heating in high-temperature environments, and poor temperature control accuracy in existing electronic water pump controllers by reconstructing the heat dissipation path and introducing thermoelectric cooling technology. Specifically, the system connects the cold end of the thermoelectric cooler to the back of the main control board and the hot end to the side wall of the motor, constructing a new heat dissipation path of "main control board heating element - thermoelectric cooler - motor side wall - motor shaft - impeller coolant". This path abandons the traditional air-to-outside heat dissipation method, significantly shortens the heat transfer path, reduces thermal resistance, and enables heat to be quickly conducted to the coolant, significantly improving heat dissipation efficiency. At the same time, the thermoelectric cooler has active cooling capability, which can maintain the cold end temperature below the ambient temperature even in high-temperature environments, preventing ambient heat from heating the controller in reverse. In addition, combined with the real-time feedback adjustment of the temperature sensor and the main control circuit, the system can dynamically adjust the cooling capacity according to changes in operating conditions, achieving precise and active control of the controller temperature and ensuring the stable and reliable operation of the electronic water pump under different operating conditions. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0035] Figure 1 This is an architectural diagram of a heat dissipation system provided in a specific embodiment of the present invention;

[0036] Figure 2 A schematic diagram of the installation position of the TEC in a heat dissipation system provided in a specific embodiment of the present invention;

[0037] Figure 3 An exploded view of the electronic water pump used in a heat dissipation system provided in a specific embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of the TEC structure and thermally conductive adhesive (layer) in a heat dissipation system provided by a specific embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of a traditional heat dissipation path;

[0040] Figure 6 This is a schematic diagram of a heat dissipation path based on TEC in a specific embodiment of the present invention;

[0041] Figure 7 Temperature distribution diagram for a non-TEC electronic water pump controller;

[0042] Figure 8 Temperature distribution diagram of an electronic water pump controller equipped with a TEC electronic water pump (operating current 1A) according to a specific embodiment of the present invention;

[0043] Figure 9 Temperature distribution diagram of an electronic water pump controller equipped with a TEC electronic water pump (operating current 1.5A) according to a specific embodiment of the present invention;

[0044] Figure 10 Temperature distribution diagram of an electronic water pump controller equipped with a TEC electronic water pump (operating current 2A) according to a specific embodiment of the present invention.

[0045] The attached figures are labeled as follows: electronic water pump controller 100, controller end cover 110, main control board (PCB board) 120, heating element 121, motor 200, motor shaft 201, bearing 202, electronic water pump housing 203, impeller 300, thermoelectric cooler (TEC) 400, cold end thermal conductive adhesive 401, cold end 402, NP junction 403, hot end 404, hot end thermal conductive adhesive 405, temperature sensor 500, main control circuit 600, signal processing unit 601, control algorithm unit 602, and drive unit 603. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Please refer to Figure 1 In one optional embodiment, a thermoelectric cooling-based electronic water pump controller heat dissipation system is provided, wherein the electronic water pump controller 100 is integrated with the electronic water pump, the electronic water pump includes an electronic water pump housing 203, a motor 200 and a motor shaft 201 disposed inside the electronic water pump housing 203, a bearing 202, and an impeller 300 connected to the motor shaft 201, the impeller 300 being located inside an impeller chamber containing impeller coolant; the electronic water pump controller 100 includes a main control board (PCB board) 120 having a heating element 121.

[0048] Please refer to Figure 2 and Figure 3 In this embodiment, the heat dissipation system is integrated inside the electric water pump assembly.

[0049] The core of the electronic water pump controller 100 is a PCB board that integrates circuit components (heating elements). The front side has 6 MOSFETs (main heat sources) and driver chips arranged in a concentrated manner, while the back side has wiring layers and some passive components.

[0050] The heat dissipation system in this embodiment mainly consists of a thermoelectric cooler (TEC) 400, a temperature sensor 500, and a main control circuit 600.

[0051] The thermoelectric cooler (TEC) 400 includes a cold end 402 and a hot end 404. The cold end 402 contacts the back of the main control board (PCB board) 120 of the electronic water pump controller 100, and the hot end 404 contacts the side wall of the motor 200 of the electronic water pump. In this embodiment, the installation position of the thermoelectric cooler (TEC) 400 is as follows: Figure 2 and 3 As shown. The selection of the TEC depends on the size of the controller PCB board, the operating temperature range, and the maximum heat dissipation power requirement. Its dimensions are L×W×T, representing length*width*thickness, respectively. The maximum cooling capacity = maximum heat dissipation power * N, where N is the selection factor, which is greater than 1. In this embodiment, the thermoelectric cooler (TEC) 400 uses a TEC-12706 type thermoelectric cooler with dimensions of 40mm×40mm×3.5mm. Its maximum temperature difference ΔTmax can reach 68℃, and its maximum cooling capacity Qmax is 60W (at a hot surface temperature of 27℃). Based on the estimated peak heat dissipation power of the controller being 45W, the selection factor N = 60 / 45 ≈ 1.33 > 1, which meets the requirements.

[0052] In a preferred embodiment, the cold end of the thermoelectric cooler is provided with a heat-conducting layer, and the hot end of the thermoelectric cooler is provided with another heat-conducting layer. The cold end is attached to the back of the main control board of the electronic water pump controller through one heat-conducting layer, and the hot end is attached to the motor sidewall of the electronic water pump through the other heat-conducting layer. More specifically, the heat-conducting layers are formed by applying thermally conductive adhesive between the cold end of the thermoelectric cooler and the main control board and / or between the hot end and the motor sidewall, and the thickness is uniform. Figure 4 As shown, the thermoelectric cooler (TEC) 400 has a layered structure of: cold-end thermally conductive adhesive 401, cold end 402, NP junction 403, hot end 404, and hot-end thermally conductive adhesive 405. During installation, it is necessary to ensure that the cold end of the TEC is in full contact with the back of the controller PCB board, and that the hot end is tightly adhered to the side wall of the motor. This is achieved by applying thermally conductive adhesive to both the cold and hot ends of the TEC. The thermally conductive adhesive acts as a heat conduction bridge during heat dissipation. It firmly connects the cold end of the thermoelectric cooling module to the PCB board of the electronic water pump controller, and simultaneously tightly connects the hot end of the thermoelectric cooling module to the side wall of the motor. This reduces the contact thermal resistance between solids, ensuring that heat can be efficiently transferred from the controller to the motor shaft, and then through the motor shaft to the coolant in the impeller. The thermally conductive adhesive must possess high thermal conductivity, good adhesion, and aging resistance to ensure long-term stable heat conduction. In this embodiment, thermally conductive adhesive is evenly applied between the cold end of the TEC and the back of the PCB board, and between the hot end of the TEC and the side wall of the aluminum alloy housing of the motor.

[0053] A temperature sensor 500 is mounted on the main control board (PCB board) 120 of the electronic water pump controller 100 to collect the temperature of the main control board (PCB board) 120 in real time. In this embodiment, the temperature sensor is mounted on the PCB board of the electronic water pump controller, and its function is to collect the temperature of the PCB board in real time and convert the temperature signal into an electrical signal output, i.e., a temperature signal (temperature acquisition signal). This temperature sensor needs to have the characteristics of high precision and high sensitivity, and be able to quickly and accurately sense minute changes in the temperature of the PCB board, providing reliable data support for subsequent temperature regulation.

[0054] In a preferred embodiment, the thermoelectric cooler (TEC) 400 is aligned with the concentrated area of ​​the heating elements 121 on the main control board (PCB) 120. Multiple temperature sensors 500 are arranged at each key heating element 121 to acquire the absolute temperature value, temperature distribution, and temperature change rate of the electronic water pump controller 100 in real time. Aligning the thermoelectric cooler with the concentrated area of ​​heating elements on the main control board and arranging multiple temperature sensors at each key heating element enables real-time acquisition of the controller's absolute temperature value, temperature distribution, and temperature change rate. This layout achieves targeted monitoring and precise cooling of the heat source, avoids ineffective heat dissipation, improves cooling efficiency, and provides multi-dimensional data support for hierarchical control strategies. In this embodiment, three DS18B20 digital temperature sensors are used, respectively mounted on the front of the PCB board below the MOSFET chip and at the geometric center of the PCB board. They communicate with the main control circuit via a 1-Wire bus, with a temperature measurement accuracy of ±0.5℃.

[0055] The main control circuit 600 is electrically connected to the temperature sensor 500 and the thermoelectric cooler (TEC) 400. It adjusts the operating current of the thermoelectric cooler (TEC) 400 based on the temperature signal collected by the temperature sensor 500 and a preset temperature control strategy to control the cooling capacity of the thermoelectric cooler (TEC) 400. Specifically, the input terminal of the main control circuit is connected to the temperature sensor to receive the temperature acquisition signal. The output terminal of the main control circuit is connected to the thermoelectric cooling module (TEC). It analyzes and processes the received temperature signal and, according to the preset temperature control strategy, outputs a corresponding control signal to adjust the operating current of the TEC, thereby controlling the cooling capacity of the TEC and achieving the purpose of regulating the controller temperature. In an optional implementation, please refer to... Figure 1The main control circuit 600 mainly consists of the following units: a signal processing unit 601, used to amplify and filter the acquired temperature signal; a control algorithm unit 602, used to calculate the required input current value of the thermoelectric cooler based on the processed temperature signal and the preset temperature control strategy; and a drive unit 603, used to provide the corresponding drive current to the thermoelectric cooler based on the input current value calculated by the control algorithm unit. Specifically, the signal processing unit is responsible for amplifying and filtering the acquired temperature signal to improve signal quality. The control algorithm unit calculates the required TEC input current value based on the processed temperature signal using a specific control algorithm (such as a PID control algorithm); and the drive circuit provides the corresponding drive current to the TEC based on the current value calculated by the control algorithm unit. In this embodiment, the main control circuit is integrated on the PCB board of the electronic water pump controller and includes a 32-bit MCU (microcontroller unit). The MCU's ADC (analog-to-digital converter) module is responsible for acquiring the temperature sensor signal, and its internal program implements hierarchical control logic and a PID algorithm. The MCU's PWM (Pulse Width Modulation) output port is connected to an H-bridge driver circuit to precisely regulate the DC current supplied to the TEC (0-3A adjustable).

[0056] During system installation, attention must be paid to the installation precision and positional accuracy of each component. For example, the TEC (Digital Temperature Controller) must be precisely aligned with the concentrated area of ​​the controller's heat-generating elements to achieve targeted temperature control; the temperature sensor's installation position must accurately reflect the controller's actual temperature to avoid inaccurate temperature acquisition due to improper installation. Simultaneously, the connection between the motor shaft and the impeller coolant must ensure good sealing and thermal conductivity to prevent leaks or poor heat transfer. Furthermore, the wiring design of the main control circuit must be reasonable to avoid electromagnetic interference affecting signal transmission and control accuracy.

[0057] Corresponding to the above heat dissipation system, a heat dissipation control method for an electronic water pump controller based on thermoelectric cooling is presented, which is mainly implemented through the following steps:

[0058] S1: The temperature of the main control board of the electronic water pump controller is collected in real time through a temperature sensor;

[0059] S2: Input the temperature signal into the main control circuit;

[0060] S3: The main control circuit calculates the operating current and outputs the corresponding control signal based on the temperature signal and the preset temperature control strategy;

[0061] S4: Adjust the operating current applied to the thermoelectric cooler according to the control signal to change its cooling power.

[0062] Please refer to Figure 5 and Figure 6 Based on the heat dissipation system described in the above embodiments, this invention constructs a heat dissipation path from the main control board with heat-generating elements in the electronic water pump controller, through the thermoelectric cooler, the motor sidewall, the motor shaft, to the impeller coolant. Specifically, compared to the original traditional heat dissipation path, this embodiment establishes a completely new and highly efficient heat dissipation path:

[0063] 1. Heat capture: The heat generated by heat-generating components such as MOSFETs on the front of the PCB is conducted to the back of the PCB through the copper layer and vias inside the PCB.

[0064] 2. Active heat transfer: Heat on the back of the PCB is actively absorbed by the tightly fitted TEC cold end. Due to the Peltier effect, when current flows through the TEC, its cold end temperature decreases, creating a temperature difference with the back of the PCB, thereby powerfully extracting heat.

[0065] 3. Heat dissipation: The heat transferred to its hot end by the TEC is quickly conducted to the aluminum alloy housing sidewall of the electric water pump motor through the thermally conductive adhesive.

[0066] 4. Final dissipation: The motor housing is tightly connected to the internal motor shaft and rotor via metal. Heat is conducted from the housing to the motor shaft, and then transferred to the impeller component that rotates coaxially with the shaft. The impeller is immersed in circulating coolant (ethylene glycol aqueous solution), and the heat is ultimately carried away efficiently by the flowing coolant, completing the entire heat dissipation cycle.

[0067] This approach completely eliminates the high thermal resistance path of the traditional "heat source → air → controller housing → environment".

[0068] In summary, this invention abandons the conventional inside-out heat dissipation approach. Instead, it establishes a TEC (Thermal Design Unit) between the PCB board and the motor side, creating a new heat dissipation path: controller heat-generating components → TEC → motor shaft → impeller coolant. The cold end of the TEC module is bonded to the back of the PCB board with thermally conductive adhesive, quickly absorbing heat from the chip and MOSFET. The hot end of the TEC contacts the motor side wall with thermally conductive adhesive, allowing heat to be transferred through the wall to the impeller via the motor shaft, and finally carried away by the coolant. On one hand, the thermal resistance can be reduced by an order of magnitude, significantly improving cooling efficiency. On the other hand, precise temperature control of the controller can be achieved by adjusting the input current of the TEC, transforming passive heat dissipation affected by the environment into active temperature control, thus improving the adaptability of the electronic water pump to extreme environments.

[0069] In a preferred embodiment, a hierarchical control strategy is adopted for the preset temperature control strategy. Based on the temperature signal and multiple preset temperature thresholds, the cooling power of the thermoelectric cooler is divided into multiple discrete power levels for control. The preset temperature thresholds are determined based on a minimum temperature threshold, an intermediate temperature threshold, a high temperature threshold, and a maximum allowable temperature. Furthermore, a PID control algorithm is used to dynamically adjust the operating current zones of the thermoelectric cooler based on the power of the electric water pump, the temperature distribution of the electric water pump controller, and the rate of temperature change, thereby achieving refined temperature control.

[0070] More specifically, the hierarchical control strategy includes three aspects: controller temperature detection, TEC cooling power hierarchical control logic, and PID control parameter adjustment. The specific process is as follows:

[0071] 1. Controller temperature monitoring: Arrange 3-5 digital temperature sensors at the key heat-generating components of the controller to monitor the absolute value of the controller temperature in real time. Based on this, obtain the controller temperature distribution and the rate of change of controller temperature over time.

[0072] 2. TEC cooling power graded control logic: Based on the controller temperature, the cooling power of the thermoelectric cooling chip is divided into five levels: full (100%), high (75%), medium (50%), low (25%) and 0.

[0073] The following temperature thresholds are preset in the main control MCU (based on device specifications and experimental settings):

[0074] Tl (Minimum Temperature Threshold): 55℃

[0075] Tm (intermediate temperature threshold): 65℃

[0076] Th (High Temperature Threshold): 75℃

[0077] Tp (maximum permissible temperature): 85℃

[0078] After the system is powered on, the following control loop is executed:

[0079] 1. Temperature Acquisition and Processing: The MCU reads the values ​​of the three temperature sensors every 100ms, takes the maximum value of the three as the current representative temperature of the controller, and calculates its rate of change in the most recent second.

[0080] 2. Control Decisions (Hierarchical Logic):

[0081] ①If >= If the temperature exceeds 85℃, the TEC drive current will be immediately set to the full rated 3A (corresponding to 100% cooling power) for maximum cooling; that is, if the controller temperature exceeds the allowable temperature T... pThe TEC cooling power will be set to full power (100%) output and maintained;

[0082] ②If < and >=( + If 1 / 2 = 80℃, then set TEC to high power mode with a drive current of 2.25A (75%); that is, wait until the temperature drops to 1 / 2 (T) h +T p Below this, the TEC output power is set to high (75%) power output and maintained;

[0083] ③If <80℃ and >=( + If 1 / 2 = 70℃, then set the TEC to medium power mode with a drive current of 1.5A (50%); that is, the controller temperature will continue to drop to 1 / 2 (T) m +T h If the temperature rises below 1 / 2 (T), the TEC's cooling power is set to (50%) medium power output and maintained. h +T p The TEC output power is set to high (75%) and maintained.

[0084] ④If <70℃ and >=( + If 1 / 2 = 55℃, then the TEC is set to low power mode with a drive current of 0.75A (25%); that is, the controller temperature continues to drop to 1 / 2 (T) l +T m If the temperature drops below 1 / 2 (T), the TEC's cooling power is set to (25%) low power output and maintained. m +T h If the TEC output power is set to medium (50%) and maintained, then the TEC output power will be set to medium (50%) and maintained.

[0085] ⑤If < If the temperature drops to 55℃, the TEC drive current will be turned off (0%), and the system will enter standby power-saving mode; that is, the controller temperature will drop to T. l If the controller temperature rises back to 1 / 2 (T), the TEC will stop cooling. l +T m If the power is 100% or higher, the cooling power of the TEC is set to (25%) low power output and maintained.

[0086] 3. PID Control Parameter Adjustment: Based on the electric water pump power, controller temperature, and temperature change rate over time, the TEC operating current zone is switched. Specifically, within each power level, the MCU will also run a lightweight PID algorithm to fine-tune the drive current within ±10% based on the deviation from the setpoint (e.g., the target temperature of 67.5℃ for the medium power level) to smooth the temperature curve and avoid oscillations near the switching point.

[0087] 4. Protection and Feedback: Simultaneously monitors the voltage and current across the TEC terminals to prevent overload. All temperature data and control status can be uploaded to the vehicle's central controller via the CAN bus.

[0088] To verify the effectiveness of the heat dissipation system of this invention, a model of 12 components, including the pump housing, PCB board, TEC (cooling device), and impeller, was created using SolidWorks. Thermal simulation was performed using ANSYS Icepak software. The results show that the peak temperature of the controller is 148℃ without the TEC, and the temperature drops to 70℃ after adding the TEC (operating current 1A), a reduction of 78℃, thus verifying the effectiveness of the heat dissipation system of this invention.

[0089] Furthermore, the relationship between the operating current of the TEC and its heat dissipation performance was investigated, such as... Figures 7-10 As shown in Table 1, it was found that as the TEC operating current increases, the maximum temperature of the controller continues to decrease, but the rate of decrease is significantly reduced. Therefore, it is necessary to set the TEC operating current reasonably to ensure optimal heat dissipation efficiency. This also proves the necessity and rationality of establishing a TEC cooling power graded control method based on controller temperature.

[0090] Table 1: Simulation Data Table

[0091]

[0092] Based on the above specific embodiments, the present invention can achieve the following beneficial technical effects:

[0093] 1. Reconstructing the heat dissipation path. The traditional heat dissipation path is controller heating element → air → housing → environment, which has high thermal resistance and poor heat dissipation effect in high-temperature environments. This invention constructs a completely new heat transfer path by installing a TEC on the back of the controller PCB board, allowing the cold end to make close contact with the back of the PCB board, and the hot end to connect with the side wall of the motor, which in turn contacts the motor shaft: controller heating element → motor shaft → impeller coolant. This reconstructed heat transfer path greatly reduces thermal resistance and significantly improves heat dissipation efficiency. For example, under the same heat output and environmental conditions, compared with the traditional heat dissipation path, the new path can improve heat transfer efficiency by more than 20 times, enabling faster conduction of the heat generated by the controller and ensuring stable operation of the controller even in high-temperature environments.

[0094] 2. Optimize TEC placement for targeted temperature control. By precisely analyzing the heating characteristics and thermal conductivity of each heat-generating element within the controller, the TEC is placed in the most critical locations affecting the overall controller temperature. This allows the TEC to precisely cool the controller's heat-generating elements, avoiding ineffective cooling of non-critical areas and improving cooling efficiency. After optimizing the TEC placement, the controller junction temperature can be controlled below 70℃, meeting the requirements for high power density (≥15W / cm²). 2 This meets operational requirements, effectively preventing device failure due to overheating and extending the lifespan of the controller.

[0095] 3. Utilizing the semiconductor cooling characteristics of the TEC (Thermal Design Temperature) device for precise active cooling. Considering the rapidly changing operating conditions of the electronic water pump, this invention uses a temperature sensor to collect the temperature of the controller's PCB board in real time and feeds the temperature signal back to the main control circuit. The main control circuit adjusts the input current of the TEC in real time based on the temperature output signal, thereby achieving precise active cooling of the controller's key components, eliminating reliance on ambient temperature. Simultaneously, this method provides rapid response to sudden heat loads. When the electronic water pump's operating conditions change abruptly, such as a sudden increase in load causing a sharp increase in controller heat, the TEC, using current-controlled heat dissipation, can respond within seconds, increasing cooling capacity and quickly stabilizing the controller temperature within a reasonable range. Compared to traditional heat dissipation methods, this invention's precise active cooling method reduces the controller's temperature fluctuation range, significantly improving the controller's stability and reliability under different operating conditions.

[0096] 4. Establishing a tiered control method for TEC cooling power based on controller temperature enables on-demand heat dissipation, avoiding energy waste. Simultaneously, utilizing the temperature difference between the hot and cold ends of the TEC ensures effective heat dissipation for the electric water pump even in high-temperature environments.

[0097] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), or random access memory (RAM), etc.

[0098] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. Furthermore, the above embodiments only illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A heat dissipation system for an electronic water pump controller based on thermoelectric cooling, wherein, An electronic water pump controller is integrated with an electronic water pump. The electronic water pump includes an electronic water pump housing, a motor and motor shaft disposed inside the electronic water pump housing, and an impeller connected to the motor shaft. The impeller is located inside an impeller chamber containing impeller coolant. The electronic water pump controller includes a main control board with a heating element. The heat dissipation system comprises: The thermoelectric cooler includes a cold end and a hot end. The cold end is in contact with the back of the main control board of the electronic water pump controller, and the hot end is in contact with the motor side wall of the electronic water pump. A temperature sensor is installed on the main control board of the electronic water pump controller to collect the temperature of the main control board in real time. The main control circuit is electrically connected to the temperature sensor and the thermoelectric cooler, and is used to adjust the operating current of the thermoelectric cooler according to the temperature signal collected by the temperature sensor and based on a preset temperature control strategy, so as to control the cooling capacity of the thermoelectric cooler. The heat dissipation system constructs a heat dissipation path from the main control board with heat-generating elements in the electronic water pump controller, through the thermoelectric cooler, the motor side wall, the motor shaft, to the impeller coolant.

2. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 1, characterized in that, The cold end of the thermoelectric cooler is provided with a heat-conducting layer, and the hot end of the thermoelectric cooler is provided with another heat-conducting layer. The cold end is attached to the back of the main control board of the electronic water pump controller through one heat-conducting layer, and the hot end is attached to the motor side wall of the electronic water pump through the other heat-conducting layer.

3. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 2, characterized in that, The thermally conductive layer is formed by applying thermally conductive adhesive between the cold end of the thermoelectric cooler and the main control board and / or between the hot end and the side wall of the motor, and has a uniform thickness.

4. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 1, characterized in that, The main control circuit includes: The signal processing unit is used to amplify and filter the acquired temperature signal; The control algorithm unit is used to calculate the required input current value of the thermoelectric cooler based on the processed temperature signal and the preset temperature control strategy using the control algorithm. The drive unit is used to provide the corresponding drive current to the thermoelectric cooler based on the input current value calculated by the control algorithm unit.

5. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 1, characterized in that, The thermoelectric cooler is aligned with the concentrated area of ​​the heating elements on the main control board; the temperature sensor includes multiple sensors, which are respectively arranged at each key heating element to obtain the absolute temperature value, temperature distribution and temperature change rate of the electronic water pump controller in real time.

6. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 1 or 4, characterized in that, The preset temperature control strategy adopts a hierarchical control strategy, which divides the cooling power of the thermoelectric cooler into multiple discrete power levels for control based on the temperature signal and multiple preset temperature thresholds; wherein, the multiple preset temperature thresholds are determined based on the minimum temperature threshold, the intermediate temperature threshold, the high temperature threshold, and the maximum allowable temperature.

7. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 6, characterized in that, The hierarchical control strategy includes: The cooling capacity of thermoelectric coolers is divided into five levels: 0%, 25%, 50%, 75%, and 100%. The power level is dynamically switched based on the temperature threshold. The specific logic is as follows: When the temperature exceeds T p At that time, it outputs 100% power; When the temperature drops to 1 / 2 (T) h +T p When below 5%, output 75% power; When the temperature drops to 1 / 2 (T) m +T h When the output power is below 50%, output 50% power. When the temperature drops to 1 / 2 (T) l +T m When the output power is below 25%, output 25% of the power. When the temperature is below T l At that time, the output power is 0%. When the temperature rises, switch to a higher power level according to the corresponding threshold. Among them, T l T m T h T p These are: minimum temperature threshold, intermediate temperature threshold, high temperature threshold, and maximum allowable temperature.

8. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 1, characterized in that, The control algorithm adopts the PID control algorithm, which dynamically adjusts the working current zone of the thermoelectric cooler according to the power of the electronic water pump, the temperature distribution of the electronic water pump controller and the temperature change rate, so as to achieve fine temperature control.

9. The heat dissipation system for an electronic water pump controller based on thermoelectric cooling according to claim 1, characterized in that, A sealing structure is provided between the motor shaft and the impeller coolant; the wiring structure of the main control circuit adopts an anti-electromagnetic interference design.

10. A heat dissipation control method for an electronic water pump controller based on thermoelectric cooling, characterized in that, The system according to any one of claims 1 to 9 is characterized by comprising the following steps: The temperature of the main control board of the electronic water pump controller is collected in real time by a temperature sensor. The temperature signal is input into the main control circuit; The main control circuit calculates the operating current and outputs the corresponding control signal based on the temperature signal and the preset temperature control strategy. The operating current applied to the thermoelectric cooler is adjusted according to the control signal to change its cooling power.

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