Die bonding apparatus

Abstract

A die bonding apparatus includes a frame provided with a certain area; a first loading part located at one side of the frame and storing a magazine carrying a plurality of first substrates; a horizontal driving part adjacent to the first loading part and arranged along a first direction; a first transfer module gripping the magazine from the first loading part to transfer the magazine along the first direction and to drop the first substrates from the magazine to an indexing part; a second loading part arranged adjacent to the horizontal driving part and storing second substrates different from the first substrates; a second transfer module gripping the second substrates from the second loading part to transfer the second substrates to the indexing part; a substrate transfer module transferring the first substrates or the second substrates located at the indexing part along a second direction perpendicular to the first direction; a die bonding module bonding dies singulated from a wafer to the first substrates or the second substrates; and an unloading part discharging the first substrates or the second substrates to which the dies are bonded.

Description

Technical Field

[0001] This invention relates to a die bonding device capable of performing different types of bonding. Background Technology

[0002] Typically, semiconductor devices can be formed on a silicon wafer, which serves as a semiconductor substrate, by repeatedly performing a series of manufacturing processes. Semiconductor devices formed as described above can be manufactured into semiconductor packages through slicing, bonding, and packaging processes.

[0003] Bonding is the process of mounting a single, individualized die from a completed wafer onto a substrate (e.g., a Printed Circuit Board). As the types of semiconductor chips become increasingly diverse, so too do bonding methods (bonding modes). Bonding methods can be determined based on the specifications of the semiconductor chip (e.g., substrate, thickness, leads).

[0004] Typically, bonding equipment exists separately for specific bonding methods. That is, from the semiconductor chip manufacturer's perspective, separate bonding equipment is required for each bonding method, which increases the manufacturing cost of the semiconductor chip. Conversely, if a single device can perform multiple bonding methods, the semiconductor chip manufacturer can save on manufacturing costs. Summary of the Invention

[0005] Therefore, embodiments of the present invention provide a die bonding device capable of performing different bonding methods.

[0006] The problems solved by the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand from the following description other problems not mentioned.

[0007] The die bonding apparatus according to the present invention includes: a frame provided with a certain area; a first loading section located on one side of the frame and holding a cassette carrying a plurality of first substrates; a horizontal driving section adjacent to the first loading section and arranged along a first direction; a first transfer module detachably connected to the horizontal driving section and holding the cassette from the first loading section to transfer the cassette along the first direction and placing the first substrates from the cassette into an indexing section; a second loading section adjacent to the horizontal driving section and holding a second substrate of a different type from the first substrates; a second transfer module detachably connected to the horizontal driving section and holding the second substrate from the second loading section to transfer the second substrate to the indexing section; a substrate transfer module that transfers the first substrate or the second substrate located in the indexing section along a second direction perpendicular to the first direction; a die bonding module that bonds a die uniformed from a wafer to the first substrate or the second substrate; and an unloading section that discharges the first substrate or the second substrate with the bonded die.

[0008] According to the present invention, the first loading unit includes: a cassette loading unit for storing a cassette carrying the first substrate and moving the cassette toward the first conveying module via a conveyor belt; and a cassette unloading unit for receiving and storing the cassette from the first conveying module from which the first substrate has been completely removed.

[0009] According to the present invention, the first conveying module includes: a first horizontal drive member, coupled to the horizontal drive portion and configured to move along the first direction; a first clamp, coupled to the first horizontal drive member and including a pair of hands for gripping the cassette; a first vertical drive member for raising or lowering the first clamp; and a push rod for pushing the first substrate carried in the cassette toward the index portion.

[0010] According to the present invention, the second substrate is stacked and stored in the second loading portion along the vertical direction, and a sheet for preventing damage caused by contact is disposed between the second substrates.

[0011] According to the present invention, the second transmission module includes: a second horizontal drive member, coupled to the horizontal drive portion and configured to move along the first direction; a second clamp, coupled to the second horizontal drive member to hold the second substrate; and a second vertical drive member to raise or lower the second clamp.

[0012] According to the present invention, the substrate transfer module includes: a guide member disposed along the second direction and guiding the movement of the first substrate or the second substrate; and a substrate clamp holding the side of the first substrate or the second substrate and configured to move along the guide member.

[0013] According to the present invention, the die bonding module includes: a die transport unit for picking up and transporting the die; a die stage configured to move along the second direction and configured to place the die from the die transport unit; and a bonding unit configured to pick up the die from the die stage and bond the die to the first substrate or the second substrate.

[0014] According to the present invention, when the bonding mode of the die bonding device is a first bonding mode performed by a die bonding film attached to the back side of the wafer, the first transfer module is configured to be mounted on the horizontal drive unit and the second transfer module is separated from the horizontal drive unit.

[0015] According to the present invention, when the bonding mode of the die bonding device is a second bonding mode performed by a paste adhesive, the second transfer module is configured to be mounted on the horizontal drive unit while the first transfer module is separated from the horizontal drive unit.

[0016] According to the present invention, when the bonding mode of the die bonding device is a second bonding mode performed by a paste adhesive, an adhesive coating unit that coats the paste adhesive on the top of the second substrate is installed in the substrate conveying module along the path of conveying the second substrate.

[0017] According to the present invention, when the bonding mode of the bare die bonding device is a second bonding mode performed by a paste adhesive, a sheet recycling container for recycling the sheet disposed between the second substrates is installed in the movement path of the second conveying module.

[0018] The die bonding apparatus according to the present invention includes: a frame provided with a certain area; a first loading section located on one side of the frame and holding a cassette carrying a plurality of first substrates; a horizontal driving section adjacent to the first loading section and arranged along a first direction; a first transfer module detachably connected to the horizontal driving section and holding the cassette from the first loading section to transfer the cassette along the first direction and placing the first substrates from the cassette into an indexing section; a second loading section adjacent to the horizontal driving section and holding a second substrate of a different type from the first substrates; a second transfer module detachably connected to the horizontal driving section and holding the second substrate from the second loading section to transfer the second substrate to the indexing section; a substrate transfer module that transfers the first substrate or the second substrate located in the indexing section along a second direction perpendicular to the first direction; a die bonding module that bonds a wafer-individualized die to the first substrate or the second substrate; an unloading section that discharges the first substrate or the second substrate with the bonded die; and a controller that controls the loading of one of the first substrate and the second substrate into the indexing section according to the die bonding method.

[0019] According to the present invention, when the bonding mode of the die bonding device is a first bonding mode performed by a die bonding film attached to the back side of the wafer, the controller controls the first transfer module to transfer the first substrate to the indexing section.

[0020] According to the present invention, when the bonding mode of the die bonding device is a second bonding mode performed by a paste adhesive, the controller controls the second transfer module to transfer the second substrate to the indexing section.

[0021] According to the present invention, an adhesive coating unit for coating the paste-like adhesive on the second substrate is detachably disposed in the transport path of the second substrate in the substrate transport module.

[0022] According to the present invention, a sheet is provided between the second substrates stored in the second loading section in a stacked state, and a sheet recycling container for storing the sheet for disposal is installed in the movement path of the second conveying module.

[0023] According to the present invention, the second conveying module is configured to hold the sheet and place it into a sheet recycling container.

[0024] The die bonding apparatus according to the present invention includes: a frame provided with a certain area; a first loading section located on one side of the frame and holding a cassette carrying a plurality of first substrates; a horizontal driving section adjacent to the first loading section and arranged along a first direction; a first transfer module detachably connected to the horizontal driving section and holding the cassette from the first loading section to transfer the cassette along the first direction and placing the first substrates from the cassette into an indexing section; a second loading section adjacent to the horizontal driving section and holding a second substrate of a different type from the first substrates; a second transfer module detachably connected to the horizontal driving section and holding the second substrate from the second loading section to transfer the second substrate to the indexing section; a substrate transfer module that transfers the first substrate or the second substrate located in the indexing section along a second direction perpendicular to the first direction; a die bonding module that bonds a wafer-individualized die to the first substrate or the second substrate; an unloading section that discharges the first substrate or the second substrate with the bonded die; and a controller that controls the loading of one of the first substrate and the second substrate into the indexing section according to the bonding type of the die. The die bonding module includes: a die transport unit for picking up and transporting the die; a die stage configured to move along the second direction and to hold the die; and a bonding unit configured to pick up the die from the die stage and bond the die to the first substrate or the second substrate.

[0025] According to the present invention, when the die bonding device is in a first bonding mode performed by a die bonding film attached to the back side of the wafer, the die stage moves to a first die stage position adjacent to the wafer, the die transfer unit transfers the die to the die stage, and the bonding unit picks up the die from the die stage and bonds the die to the first substrate.

[0026] According to the present invention, when the bonding mode of the die bonding device is a second bonding mode performed by a paste adhesive, the die stage moves to a second die stage position separated from the wafer, and the bonding unit picks up the die from the die stage and bonds the die to the second substrate.

[0027] According to the present invention, the horizontal drive unit selectively mounts or drives the first loading unit or the second loading unit according to the bonding type, thereby enabling bonding in different ways to be performed in a single die bonding device.

[0028] The effects of the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand other effects not mentioned from the following description. Attached Figure Description

[0029] Figure 1 This illustrates the die bonding process using die attach film.

[0030] Figure 2 The process of bonding bare sheets using a paste-like adhesive is shown.

[0031] Figure 3 A schematic layout of a die bonding device according to the present invention, which is capable of applying different types of bonding methods to each other, is shown.

[0032] Figure 4 This is a perspective view of the die bonding device according to the present invention.

[0033] Figure 5 The first loading section and the first transport section of the die bonding device are shown as viewed from the side.

[0034] Figure 6 The first and second transport sections of the die bonding device are shown as viewed from above.

[0035] Figure 7 This is a perspective view of the second conveying unit in the die bonding device according to the present invention.

[0036] Figures 8 to 12 This illustrates the operation of the die bonding device when the first bonding mode is applied.

[0037] Figures 13 to 18 This illustrates the operation of the die bonding device when the second bonding mode is applied.

[0038] (Explanation of reference numerals in the attached image)

[0039] 1: Die bonding device

[0040] 10: Framework

[0041] 20: First Loading Section

[0042] 30: Horizontal drive unit Detailed Implementation

[0043] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this invention pertains can readily implement it. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0044] To clearly illustrate the invention, irrelevant parts have been omitted, and the same or similar components are marked with the same reference numerals throughout the specification.

[0045] Furthermore, in multiple embodiments, the same reference numerals are used to describe only representative embodiments of the constituent elements having the same structure, while in other embodiments only structures different from the representative embodiments are described.

[0046] In the specification as a whole, when a part is described as being "connected (or combined)" with other parts, it not only refers to "direct connection (or combination)" but also includes cases where other components are placed in between for "indirect connection (or combination)". Furthermore, when a part is described as "including" a constituent element, unless otherwise stated otherwise, it means that other constituent elements may be included, rather than excluding them.

[0047] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary knowledge in the art to which this invention pertains. Terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the relevant technical context, and shall not be ideally or excessively interpreted as having a formal meaning unless explicitly defined in this application.

[0048] Die bonding equipment is used to bond individual dies from completed wafer processing to substrates (e.g., PCBs, lead frames). The equipment receives wafers individualized by dicing and cassettes (or stack containers) containing the substrates. After picking up the dies from the wafers and bonding them to the substrates, the bonded substrates are discharged externally.

[0049] On the other hand, die bonding methods can vary depending on the type of semiconductor chip. For example, die bonding methods for semiconductor memory (e.g., DRAM) and logic semiconductors (e.g., processors) can be different from each other.

[0050] For example, such as Figure 1 As shown, a die attach film (DAF) can be attached below the wafer, which is individualized in die D units (a), and the die D can be attached to the substrate S1 (b) through the die attach film (DAF).

[0051] In addition, such as Figure 2 As shown, a substrate S2 is placed into a die bonding device 1 (a), a paste-like adhesive (e.g., epoxy resin) E is coated on the substrate S2 (b), and the die D is attached to the substrate S2 by the paste-like adhesive E (c).

[0052] In this article, such as Figure 1The bonding method using bare film adhesive film (DAF) is called the first bonding mode, such as... Figure 2 The bonding method using the paste-like adhesive substance E is called the second bonding mode. In this document, two bonding methods (the first bonding mode and the second bonding mode) are illustrated as examples, but the scope of the invention is not limited to any particular bonding method. The scope of the invention includes die bonding equipment capable of universally performing various bonding methods.

[0053] When there are separate devices for bonding using a die bonding film (DAF) and devices for bonding using a paste-like adhesive substance (E), there is a burden for semiconductor chip manufacturers to have both types of devices.

[0054] According to the present invention, bonding using a bare die adhesive film (DAF) (first bonding mode) and bonding using a paste adhesive substance E (second bonding mode) can be performed with a single device, thereby enabling more efficient operation of the semiconductor manufacturing system.

[0055] The die bonding device according to the present invention will now be described in more detail.

[0056] Figure 3 A schematic layout of a die bonding device according to the present invention, which is capable of applying different types of bonding methods to each other, is shown.

[0057] The die bonding device 1 according to the present invention includes a frame 10 provided with a certain area, a first loading section 20 located on one side of the frame 10 and storing a cassette M1 carrying a plurality of first substrates S1, a horizontal drive section 30 adjacent to the first loading section 20 and arranged along a first direction (Y direction), a first transfer module 25 detachably connected to the horizontal drive section 30, which holds the cassette M1 from the first loading section 20 and transfers the first substrates S1 from the cassette M1 along the first direction (Y direction) and places the first substrates S1 from the cassette M1 into an indexing section LZ, and a cassette adjacent to the horizontal drive section 30 and storing a different substrate than the first substrate S1. The device comprises a second loading section 40 for the second substrate S2, a second transport module 50 that is detachably coupled to the horizontal drive section 30 and transports the second substrate S2 from the second loading section 40 to the index section LZ, a substrate transport module 60 that transports the first substrate S1 or the second substrate S2 located at the index section LZ along a second direction (X direction) perpendicular to the first direction (Y direction), a die bonding module 70 that bonds the die D, which is individualized from the wafer W, to the first substrate S1 or the second substrate S2, and an unloading section 80 that discharges the first substrate S1 or the second substrate S2 with the die D bonded thereto. Additionally, although not shown, a controller for controlling the operation of the die bonding device 1 may be included.

[0058] When manufacturing semiconductor packages of different types, a bonding method (second bonding mode) can be used, in which a paste-like adhesive (e.g., epoxy resin) is coated on a first substrate S1 (e.g., PCB) and the bare die D is attached to the first substrate S1. Another bonding method (first bonding mode) is used, in which the bare die D with the attached die adhesive film DAF is directly attached to a second substrate S2 (e.g., lead frame) that has a different shape from the first substrate S1.

[0059] The die bonding device 1 according to the present invention can support both the first bonding mode and the second bonding mode, and can also be configured as a dedicated device for the first bonding mode or the second bonding mode by simple assembly and disassembly as needed.

[0060] For example, when operating in the second bonding mode, the first transfer module 25 operates to retrieve the first substrate S1 from the cassette M1 stored in the first loading section 20 and transfer it to the loading position. Simultaneously, as the first substrate S1 moves via the substrate transfer module 60, a paste-like adhesive substance E is applied to the first substrate S1 by the coating unit 65. After applying the paste-like adhesive substance E, the bare die D is bonded to the first substrate S1.

[0061] When operating in the first bonding mode, the second transfer module 50 operates to transfer the second substrate S2, on which the second loading part 40 is stacked, to the loading position. While the second substrate S2 moves through the substrate transfer module 60, the die bonding module 70 bonds the die D to the second substrate S2.

[0062] The die bonding device 1 can operate in one of the first bonding mode and the second bonding mode, and the bonding modes can be switched between each other.

[0063] According to an embodiment of the present invention, the first loading unit 20 may include a box loading unit 210 for storing a box M1 carrying a first substrate S1 and moving the box M1 toward the first conveying module 250 via a conveyor belt 212, and a box unloading unit 220 for collecting and storing the box M1 from the first conveying module 250 after all the first substrates S1 have been removed.

[0064] like Figure 4 as well as Figure 5 As shown, the first loading section 20 can be located on the side of the frame 10 and can be configured to be open for loading and unloading the material box M1. The material box loading section 210 for storing the material box M1 containing the first substrate S1 is disposed below, and the material box unloading section 220 for storing the material box M1 that has discharged the second substrate S1 is disposed above the material box loading section 210.

[0065] The horizontal drive unit 30 can be disposed adjacent to the first loading unit 20 inside the frame 10, providing a movement path for the first conveying module 25 and the second conveying module 50. The horizontal drive unit 30 includes a first guide member 310 providing a path for the movement of the first conveying module 25 and a second guide member 320 providing a path for the movement of the second conveying module 50. The first guide member 310 and the second guide member 320 may be arranged adjacent to each other, with the first guide member 310 located on the outer side of the frame 10 and the second guide member 320 located on the inner side of the frame 10. The first guide member 310 may consist of a pair of guide members 310a and 310b arranged along the vertical direction (Z direction). The first guide member 310 may be fixedly disposed on the wall of the frame 10 along a first direction (Y direction).

[0066] The first transfer module 25 can be detachably coupled to the first guide member 310 and move along the first guide member 310 of the horizontal drive section 30. The first transfer module 25 can be mounted on the first guide member 310 and operate when bonding is performed on the first substrate S1, and can be deactivated or removed from the first guide member 310 when bonding is performed on the second substrate S2.

[0067] The first transfer module 25 includes a first horizontal drive member 251 configured to move along a first direction (Y direction) by being combined with the horizontal drive unit 30, a first clamp 252 combined with the first horizontal drive member 251 and including a pair of hands 252a, 252b for holding the material box M1, a first vertical drive member 253 for raising or lowering the first clamp 252, and a push rod 254 for pushing the first substrate S1 carried in the material box M1 toward the loading position.

[0068] The first horizontal drive component 251 may be mounted on the first guide component 310 and may move along the first guide component 310 in a first direction (Y direction). The first horizontal drive component 251 may include a linear motor that is coupled to the first guide component 310 and is movable therein.

[0069] The first clamp 252 is coupled to the first horizontal drive member 251 and moves along a first direction (Y direction), and is configured to grip the material box M1. The first clamp 252 may include a lower handle 252a supporting the lower part of the material box M1, an upper handle 252b contacting the upper part of the material box M1, and a lifting shaft 252c for raising or lowering the upper handle 252b relative to the lower handle 252a. The upper handle 252b can rise or fall relative to the lower handle 252a along the lifting shaft 252c, and the raising or lowering of the upper handle 252b can be achieved by hydraulic or pneumatic cylinders. On the other hand, buffering members that can reduce the impact and friction generated when in contact with the material box M1 can be installed in the lower handle 252a and the upper handle 252b.

[0070] The second loading section 40 stores the second substrate S2 stacked along the vertical direction (Z direction). The second loading section 40 can be configured as a box with a shape capable of storing the second substrate S2. The second substrates S2 can be stored in the second loading section 40 in a stacked state, and sheets for preventing damage caused by contact are arranged between the second substrates S2.

[0071] The second transmission module 50 includes a second horizontal drive member 510 coupled to the horizontal drive unit 30 and configured to move along a first direction (Y direction), a second clamp 520 coupled to the second horizontal drive member 510 and holding the second substrate S2, and a second vertical drive member 530 for raising or lowering the second clamp 520. A portion of the second horizontal drive member 510 is coupled to the second guide member 320 and configured to move in the first direction (Y direction), and a portion of the second horizontal drive member 510 is coupled to the second vertical drive member 530. The second vertical drive member 530 is coupled to the second horizontal drive member 510 and configured to move together with the second horizontal drive member 510 along the first direction (Y direction) and in the vertical direction (Z direction). The second clamp 520 is coupled to the second vertical drive member 530 and configured to move in both the Y and Z directions and hold the second substrate S2.

[0072] The second clamp 520 can hold the second substrate S2 by vacuum adsorption. The second clamp 520 includes a pitch adjustment plate 525 fixedly coupled to the second vertical drive component 530, a pair of clamping plates 523A and 523B mounted to the pitch adjustment plate 525 via fastening components 522A and 522B, and adsorption components 524A and 524B coupled to the clamping plates 523A and 523B to adsorb the second substrate S2. (Refer to...) Figure 6 as well as Figure 7 A pair of slots 521A and 521B are formed in the spacing adjustment plate 525, and bolt-shaped fastening members 522A and 522B are inserted into each slot 521A and 521B. Additionally, slots 526A and 526B are also formed in the clamping plates 523A and 523B, and the fastening members 522A and 522B are configured to pass through the slots 521A and 521B of the spacing adjustment plate 525 and the slots 526A and 526B of the clamping plates 523A and 523B. Therefore, the position and spacing of the clamping plates 523A and 523B can be adjusted by adjusting the position of the fastening members 522A and 522B, and the position and spacing of the clamping plates 523A and 523B can be adjusted to conform to the shape and size of the second substrate S2. The adsorption components 524A and 524B, which are connected to the slots 526A and 526B of the clamping plates 523A and 523B, can pick up or place the second substrate S2 by applying or releasing vacuum pressure to the second substrate S2.

[0073] The second transfer module 50 can pick up the second substrate S2 from the second loading unit 40 and transfer it to the indexing unit LZ. After that, it can pick up the sheet P disposed between the second substrates S2 and place it into the sheet recycling container 55. The sheet recycling container 55 is located in the movement path of the second clamp 520 and temporarily stores the sheet P disposed between the second substrates S2 for disposal.

[0074] The first substrate S1 or the second substrate S2, which is transferred to the index section LZ via the first transfer module 25 or the second transfer module 50, can be moved in the second direction (X direction) by the substrate transfer module 60, and the die bonding module 70 can bond the die D to the second substrate S2. The substrate transfer module 60 may include a guide member 62 configured along the second direction X and guiding the first substrate S1 or the second substrate S2 to move, and a substrate clamp 64 configured to hold the side of the first substrate S1 or the second substrate S2 and move along the guide member 62.

[0075] On the other hand, an adhesive material coating unit 65 can be configured in the substrate transport module 60 for coating a portion of the path through which the first substrate S1 or the second substrate S2 moves. The adhesive material coating unit 65 can also be deactivated or removed as needed. Specifically, when the die bonding device 1 is in a first bonding mode performed by a die bonding film (DAF) attached to the back side of the wafer W, the adhesive material coating unit 65 can be deactivated or removed; when the die bonding device 1 is in a second bonding mode performed by the paste adhesive material E, the adhesive material coating unit 65 coats the paste adhesive material E onto the second substrate S2.

[0076] For the first substrate S1 or the second substrate S2 transported via the substrate transport module 60, die bonding can be performed by the die bonding module 70. The die bonding module 70 includes a die transport unit 72 for picking up and transporting a die D, a die stage 74 configured to move along a second direction (X direction) and to place a die D from the die transport unit 72, and a bonding unit 76 configured to pick up the die D from the wafer W or the die stage 74 and bond it to the first substrate S1 or the second substrate S2. On the other hand, a video inspection unit 78 can be configured to inspect the state of the die D from below.

[0077] According to the present invention, when the die bonding device 1 is in the first bonding mode performed by a die bonding film (DAF) attached to the back side of the wafer W, the die stage 74 moves to a first die stage position P1 adjacent to the wafer W, the die transfer unit 72 transfers the die D to the die stage 74, and the bonding unit 76 picks up the die D from the die stage 74 and bonds it to the first substrate S1. When the die bonding film (DAF) is used to bond the die D, the time to bond the die D to the first substrate S1 is relatively longer than the time to pick up the die D from the wafer W. Therefore, after the die transfer unit 72 temporarily carries the die D to the die stage 74, the bonding unit 76 picks up the die D from the die stage 74 and bonds it to the first substrate S1, making the moving distance of the bonding unit 76 shorter, thus effective for the processing volume per unit time.

[0078] When the die bonding device 1 is in the second bonding mode performed by the paste adhesive E, the die stage 74 is configured to move to a second die stage position P2 separated from the wafer W, and the bonding unit 76 picks up the die from the die stage 74 and bonds it to the second substrate S2. The second bonding mode using the paste adhesive E is used when bonding very small dies D, which are difficult to place on the die stage 74; therefore, bonding without using the die stage 74 is preferred. Thus, the bonding unit 76 directly picks up the die D from the wafer W and bonds it to the second substrate S2. Here, the die transport unit 72 can be removed, and the die stage 74 retracts in the second direction (X direction).

[0079] The first substrate S1 or the second substrate S2, which is bonded by the die bonding module 70, is transferred to the unloading unit 80. Alternatively, the first substrate S1 or the second substrate S2, after being bonded, can be stored in the material box M2, and after being stored in the unloading unit 80, it can be discharged to the outside through another conveying device 85.

[0080] The bare film bonding device 1 can be configured with slight modifications to be a dedicated device for a first bonding mode using the bare film adhesive film DAF, or to be a dedicated device for a second bonding mode using the paste adhesive substance E.

[0081] For example, when the die bonding device 1 is in the first bonding mode performed by the die bonding film (DAF) attached to the back side of the wafer, it can be configured such that the loading unit 20 is mounted on the frame 10, the first transfer module 25 is mounted on the horizontal drive unit 30, and the second transfer module 50 is separated from the horizontal drive unit 30. Furthermore, when the die bonding device 1 is in the first bonding mode performed by the die bonding film (DAF) attached to the back side of the wafer, the sheet recovery container 55 and the adhesive coating unit 65 can be removed from the die bonding device 1.

[0082] When the die bonding device 1 is in the first bonding mode performed by the die bonding film (DAF) attached to the back side of the wafer, such as Figure 8 As shown, the first conveying module 25 is mounted on the horizontal drive unit 30. Then, the first conveying module 25 moves to the material box loading unit 210 carrying the material box M1 and holds the material box M1. Figure 9 The first conveying module 25 conveys the substrate to the substrate delivery port while holding the material box M1. Figure 10 The first substrate S1, carried in the material box M1, is pushed into the index section LZ using push rod 254. Figure 11 Then, the substrate clamp 64 is moved along the guide member 62 in a holding state to transfer the first substrate S1 to the die bonding module 70, and the die bonding module 70 bonds the die D to the first substrate S1. Figure 12 Here, the die transfer unit 72 may pick up the die D in one go and place it on the die stage 74, while the bonding unit 76 may pick up the die D located on the die stage 74 and bond it to the first substrate S1. Here, the die stage 74 may be located at the first die stage position P1 adjacent to the wafer W. Afterwards, the first substrate S1, having completed bonding, is discharged in the cassette M2 of the unloading unit 80.

[0083] When the die bonding device 1 operates in the second bonding mode, performed using a paste-like adhesive material E, the second transport module 50 can be positioned on the horizontal drive unit 30 while the first transport module 25 is separated from the horizontal drive unit. Alternatively, when the die bonding device 1 operates in the first bonding mode, performed using a die adhesive film (DAF) attached to the back side of the wafer, the sheet recovery container 55 and the adhesive material coating unit 65 can be installed in the substrate transport module 60 along the path for transporting the second substrate S2. Furthermore, when the die bonding device 1 operates in the first bonding mode, performed using a die adhesive film (DAF) attached to the back side of the wafer, the sheet recovery container 55 for recovering the sheets disposed between the second substrates S2 can be installed in the movement path of the second transport module 50.

[0084] When the bonding mode of the bare die bonding device 1 is the second bonding mode performed by the paste adhesive substance E, such as Figure 13 As shown, the loading section 20 and the first transfer module 25 can be removed. In order to bond the die D to the second substrate S2, the second transfer module 50 moves to the second loading section 40 to hold the second substrate S2. Figure 14 ), and move to the index section LZ while holding the second substrate S2 ( Figure 15 Then, the substrate clamp 64 holds the second substrate S2 ( Figure 16The substrate clamp 64 moves along the second direction (X direction) while holding the second substrate S2, transferring the second substrate S2 to the die bonding module 70. Meanwhile, the adhesive coating unit 65, installed in the transport path of the substrate S2, applies a paste-like adhesive E to the bonding position of the second substrate S2. Additionally, the second transport module 50 picks up the sheet P disposed between the second substrates S2 and places it in the sheet recycling container 55. After the second substrate S2 has been coated with the paste-like adhesive E, it is transferred to the die bonding module 70, which picks up the die D and bonds it to the second substrate S2. Alternatively, the die D may be immediately bonded to the second substrate S2 by the bonding unit 76, the die transport unit 72 may be removed, and the die stage 74 may move along the second direction (X direction) to the second die stage position P2.

[0085] As described above, by using the horizontal drive unit 30 together and selectively installing the first transfer module 25 and the second transfer module 50, the die bonding device 1 can be configured as a dedicated device for a first bonding mode using the die bonding film DAF, or as a dedicated device for a second bonding mode using the paste adhesive substance E.

[0086] Furthermore, the die bonding device 1 can be used as a shared device supporting both a first bonding mode using a die bonding film (DAF) and a second bonding mode using a paste-like adhesive substance (E). That is, with both the first transport module 25 and the second transport module 50 mounted on the horizontal drive unit 30, the controller can control each module according to the set bonding mode. Specifically, according to the present invention, the controller can control the loading of one of the first substrate S1 and the second substrate S2 into the index unit LZ based on the bonding method of the die D.

[0087] The die bonding device 1 according to the present invention includes a frame 10 provided with a certain area, a first loading section 20 located on one side of the frame 10 and storing a cassette M1 carrying a plurality of first substrates S1, a horizontal drive section 30 adjacent to the first loading section 20 and arranged along a first direction (Y direction), a first transfer module 25 detachably connected to the horizontal drive section 30, which holds the cassette M1 from the first loading section 20 and transfers the first substrates S1 from the cassette M1 along the first direction (Y direction) to an indexing section LZ, a second loading section 40 adjacent to the horizontal drive section 30 and storing a second substrate S2 of a different type than the first substrates S1, and a second loading section 40 connected to the horizontal drive section 30 and storing a second substrate S2 of a different type than the first substrates S1. The second transfer module 50, which can be detachably combined with the second loading unit 40 to transfer the second substrate S2 to the index unit LZ, the substrate transfer module 60 that transfers the first substrate S1 or the second substrate S2 located in the index unit LZ along the second direction (X direction) perpendicular to the first direction (Y direction), the die bonding module 70 that bonds the die D, which is individualized from the wafer W, to the first substrate S1 or the second substrate S2, the unloading unit 80 that discharges the first substrate S1 or the second substrate S2 with the die D bonded thereto, and the controller that controls the first substrate S1 or the second substrate S2 to be loaded into the index unit LZ according to the bonding method of the die D.

[0088] According to the present invention, when the die bonding device 1 is in the first bonding mode performed by the die bonding film DAF attached to the back side of the wafer W, the controller can control the first transfer module 25 to transfer the first substrate S1 to the index section LZ.

[0089] When the bonding mode of the die bonding device 1 is the second bonding mode performed by the paste adhesive substance E, the controller can control the second transfer module 50 to transfer the second substrate S2 to the indexing section LZ.

[0090] When the bonding mode of the die bonding device 1 is the second bonding mode performed by the paste adhesive substance E, the adhesive substance coating unit 65 for coating the paste adhesive substance E on the second substrate S2 can be detachably disposed in the transport path of the second substrate S2 in the substrate transport module 60.

[0091] A sheet P is placed between the second substrates S2 stored in a stacked state in the second loading section 40. A sheet recycling container 55 for storing waste sheet P is installed in the movement path of the second conveying module 50. The second conveying module 50 can be configured to hold the sheet P between the second substrates S2 and place it into the sheet recycling container 55.

[0092] As explained above, the structure and operation of the die bonding module 70 can be changed according to the bonding method of the die D.

[0093] The die bonding device 1 according to the present invention includes a frame 10 provided with a certain area, a first loading section 20 located on one side of the frame 10 and storing a cassette M1 carrying a plurality of first substrates S1, a horizontal drive section 30 adjacent to the first loading section 20 and arranged along a first direction (Y direction), a first transfer module 25 detachably connected to the horizontal drive section 30, which holds the cassette M1 from the first loading section 20 and transfers the first substrates S1 from the cassette M1 along the first direction (Y direction) to an indexing section LZ, and a second substrate S1 of a different type from the first substrates S1 arranged adjacent to the horizontal drive section 30 and storing it. The system comprises: a second loading unit 40; a second transport module 50 detachably coupled to the horizontal drive unit 30 and transporting the second substrate S2 from the second loading unit 40 to the index unit LZ; a substrate transport module 60 transporting the first substrate S1 or the second substrate S2 located in the index unit LZ along a second direction (X direction) perpendicular to the first direction (Y direction); a die bonding module 70 bonding the individualized die D from the wafer W to the first substrate S1 or the second substrate S2; and a controller controlling the loading of one of the first substrate S1 and the second substrate S2 into the index unit LZ according to the bonding type of the die D. The die bonding module 70 includes a die transport unit 72 for picking up and transporting the die D; a die stage 74 configured to move along the second direction (X direction) and on which the die D is placed; and a bonding unit 76 configured to pick up the die D from the die stage 74 and bond it to the first substrate S1 or the second substrate S2.

[0094] According to the present invention, when the die bonding device 1 is in the first bonding mode performed by a die bonding film (DAF) attached to the back side of the wafer W, the die stage 74 moves to a first die stage position P1 adjacent to the wafer W, the die transfer unit 72 transfers the die D to the die stage 74, and the bonding unit 76 picks up the die D from the die stage 74 and bonds it to the first substrate S1. When the die bonding film (DAF) is used to bond the die D, the time to bond the die D to the first substrate S1 is relatively longer than the time to pick up the die D from the wafer W. Therefore, after the die transfer unit 72 temporarily carries the die D to the die stage 74, the bonding unit 76 picks up the die D from the die stage 74 and bonds it to the first substrate S1, making the moving distance of the bonding unit 76 shorter, thus effective for the processing volume per unit time.

[0095] When the die bonding device 1 is in the second bonding mode performed by the paste adhesive E, the die stage 74 is configured to move to a second die stage position P2 separated from the wafer W, and the bonding unit 76 picks up the die from the die stage 74 and bonds it to the second substrate S2. The second bonding mode using the paste adhesive E is used when bonding very small dies D, which are difficult to place on the die stage 74; therefore, bonding without using the die stage 74 is preferred. Thus, the bonding unit 76 directly picks up the die D from the wafer W and bonds it to the second substrate S2. Here, the die transport unit 72 can be removed, and the die stage 74 retracts in the second direction (X direction).

[0096] This embodiment and the accompanying drawings are merely illustrative of a portion of the technical concept included in this invention. It is obvious that variations and specific embodiments that can be readily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of this invention are all included within the scope of the claims of this invention.

[0097] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only to the appended claims, but also to all concepts that are equivalent or modified from the claims.

Claims

1. A die bonding device, comprising: The frame is provided in a certain area; The first loading section is located on one side of the frame and stores a cassette containing a plurality of first substrates. A horizontal drive unit is adjacent to the first loading unit and configured along a first direction; The first conveying module is detachably connected to the horizontal drive unit, and holds the cassette from the first loading unit to convey the cassette along the first direction and places the first substrate from the cassette onto the indexing unit. The second loading section is configured adjacent to the horizontal driving section and stores a second substrate of a different type from the first substrate. The second transfer module is detachably connected to the horizontal drive unit and holds the second substrate from the second loading unit to transfer the second substrate to the index unit; A substrate transfer module transfers the first substrate or the second substrate located in the index section along a second direction perpendicular to the first direction. The die bonding module bonds individual dies from a wafer to either the first substrate or the second substrate. as well as The unloading section discharges the first substrate or the second substrate to which the bare die is attached.

2. The die bonding device according to claim 1, wherein, The first loading unit includes: The material box loading section stores the material box carrying the first substrate and moves the material box toward the first conveying module via a conveyor belt; and The unloading unit collects and stores the boxes from the first conveying module that have completely removed the first substrate.

3. The die bonding device according to claim 1, wherein, The first transmission module includes: The first horizontal drive component is combined with the horizontal drive unit and configured to move along the first direction; The first clamp is coupled to the first horizontal drive component and includes a pair of units for gripping the hopper; A first vertical drive component causes the first clamp to rise or fall; and The push rod pushes the first substrate, which is carried in the material box, toward the index section.

4. The die bonding device according to claim 1, wherein, The second substrate is stacked and stored in the second loading section along the vertical direction. A sheet is disposed between the second substrates to prevent damage caused by contact.

5. The die bonding device according to claim 1, wherein, The second transmission module includes: The second horizontal drive component is combined with the horizontal drive unit and configured to move along the first direction; The second clamp, combined with the second horizontal drive component, holds the second substrate; and The second vertical drive component causes the second clamp to rise or fall.

6. The die bonding device according to claim 1, wherein, The substrate transfer module includes: A guide component, configured along the second direction and guiding the movement of the first substrate or the second substrate; and A substrate clamp holds the side of the first substrate or the second substrate and is configured to move along the guide member.

7. The die bonding device according to claim 1, wherein, The die bonding module includes: The die transfer unit picks up and transfers the die; A die stage, configured to move along the second direction and configured to place the die from the die transfer unit; and The bonding unit is configured to pick up the die from the die stage and bond the die to the first substrate or the second substrate.

8. The die bonding device according to claim 1, wherein, When the die bonding device is in a first bonding mode performed by a die bonding film attached to the back side of the wafer, the first transfer module is mounted on the horizontal drive unit and the second transfer module is separated from the horizontal drive unit.

9. The die bonding device according to claim 1, wherein, When the bonding mode of the die bonding device is a second bonding mode performed by a paste adhesive, the second transfer module is configured to be mounted on the horizontal drive unit while the first transfer module is separated from the horizontal drive unit.

10. The die bonding apparatus according to claim 9, wherein, When the bonding mode of the die bonding device is the second bonding mode performed by the paste adhesive, the adhesive coating unit that coats the paste adhesive on the top of the second substrate is installed in the substrate conveying module along the path of conveying the second substrate.

11. The die bonding apparatus according to claim 9, wherein, When the bonding mode of the bare die bonding device is the second bonding mode performed by the paste adhesive, a sheet recycling container for recycling the sheet disposed between the second substrates is installed in the movement path of the second conveying module.

12. A die bonding device, comprising: The frame is provided in a certain area; The first loading section is located on one side of the frame and stores a cassette containing a plurality of first substrates. A horizontal drive unit is adjacent to the first loading unit and configured along a first direction; The first conveying module is detachably connected to the horizontal drive unit, and holds the cassette from the first loading unit to convey the cassette along the first direction and places the first substrate from the cassette onto the indexing unit. The second loading section is configured adjacent to the horizontal driving section and stores a second substrate of a different type from the first substrate. The second transfer module is detachably connected to the horizontal drive unit and holds the second substrate from the second loading unit to transfer the second substrate to the index unit; A substrate transfer module transfers the first substrate or the second substrate located in the index section along a second direction perpendicular to the first direction. The die bonding module bonds individual dies from the wafer to the first substrate or the second substrate; The unloading section discharges the first substrate or the second substrate to which the bare die is bonded; as well as The controller controls the loading of one of the first substrate and the second substrate onto the index section according to the bonding method of the bare die.

13. The die bonding apparatus according to claim 12, wherein, When the die bonding device is in the first bonding mode performed by the die bonding film attached to the back side of the wafer, the controller controls the first transfer module to transfer the first substrate to the indexing section.

14. The die bonding apparatus according to claim 13, wherein, When the bonding mode of the die bonding device is the second bonding mode performed by the paste adhesive, the controller controls the second transfer module to transfer the second substrate to the indexing section.

15. The die bonding apparatus according to claim 14, wherein, An adhesive coating unit for applying the paste-like adhesive to the second substrate is detachably disposed in the transport path of the second substrate in the substrate transport module.

16. The die bonding apparatus according to claim 15, wherein, In the second loading section, sheets are interposed between the second substrates stored in a stacked state, and a sheet recycling container for storing the sheets for disposal is installed in the movement path of the second conveying module.

17. The die bonding apparatus according to claim 16, wherein, The second conveying module is configured to hold the sheet and place it into a sheet recycling container.

18. A die bonding device, comprising: The frame is provided in a certain area; The first loading section is located on one side of the frame and stores a cassette containing a plurality of first substrates. A horizontal drive unit is adjacent to the first loading unit and configured along a first direction; The first conveying module is detachably connected to the horizontal drive unit, and holds the cassette from the first loading unit to convey the cassette along the first direction and places the first substrate from the cassette onto the indexing unit. The second loading section is configured adjacent to the horizontal driving section and stores a second substrate of a different type from the first substrate. The second transfer module is detachably connected to the horizontal drive unit and holds the second substrate from the second loading unit to transfer the second substrate to the index unit; A substrate transfer module transfers the first substrate or the second substrate located in the index section along a second direction perpendicular to the first direction. The die bonding module bonds individual dies from a wafer to either the first substrate or the second substrate. as well as The controller, based on the bonding type of the bare die, controls the loading of one of the first substrate and the second substrate into the index section. The die bonding module includes: The die transfer unit picks up and transfers the die; A die stage, configured to move along the second direction and to hold the die; and The bonding unit is configured to pick up the die from the die stage and bond the die to the first substrate or the second substrate.

19. The die bonding apparatus according to claim 18, wherein, When the die bonding device is in the first bonding mode performed by the die bonding film attached to the back side of the wafer, the die stage moves to the first die stage position adjacent to the wafer, the die transfer unit transfers the die to the die stage, and the bonding unit picks up the die from the die stage and bonds the die to the first substrate.

20. The die bonding apparatus according to claim 19, wherein, When the die bonding device is in the second bonding mode performed by a paste adhesive, the die stage moves to a second die stage position separated from the wafer, and the bonding unit picks up the die from the die stage and bonds the die to the second substrate.

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