A high-frequency high-voltage planar transformer and a winding loss evaluation method thereof

Abstract

This disclosure relates to the field of planar transformer technology, and more particularly to a high-voltage, high-frequency planar transformer and a method for evaluating its winding losses. The method for evaluating the winding losses of this high-voltage, high-frequency planar transformer includes: determining the winding magnetic field boundary conditions based on the winding current distribution characteristics; determining the copper layer current distribution based on the winding magnetic field boundary conditions; and determining the winding losses of the high-frequency, high-voltage planar transformer based on the copper layer current distribution. Using this disclosure can improve the voltage range in which planar transformers can be applied and improve the accuracy of winding loss calculations.

Description

Technical Field

[0001] This disclosure relates to the field of planar transformer technology, and in particular to a high-voltage, high-frequency planar transformer and a method for evaluating its winding losses. Background Technology

[0002] Isolated DC-DC-DC converters are key equipment in future DC distribution networks, connecting different DC power sources and loads and providing power regulation, electrical isolation, and voltage level conversion. Isolation is primarily achieved through a high-frequency transformer within the converter. Compared to traditional low-frequency transformers, high-frequency transformers achieve the same isolation function while operating at a higher frequency, resulting in a smaller size and higher power density. Insulation in high-frequency transformers used in medium-voltage DC systems is mainly achieved through solid or liquid insulating materials between the primary and secondary windings. Solid insulating materials offer better insulation strength than liquid materials, but this also complicates the manufacturing process, requiring specialized techniques such as vacuum embedding.

[0003] Planar transformers commonly use printed circuit boards (PCBs) for their windings, which are achieved by stacking and pressing core boards and prepregs together. Currently, FR4 material, the insulating dielectric for PCBs, boasts an electrical strength of up to 35 kV, demonstrating high potential for insulation applications and making it an ideal choice for insulating materials. Furthermore, PCBs offer strong process consistency, relatively simple manufacturing, low cost, and good repeatability, providing significant advantages over traditional solid or liquid insulating materials. Therefore, through optimized design, planar transformers can be used in enclosures with electrical insulation less than 20 kV and rated power less than 20 kW. Since PCBs have limited current carrying capacity, increasing the operating voltage has become an effective and feasible way to achieve higher power outputs.

[0004] However, current research on planar transformers mainly focuses on low voltage levels (<500V) and small power levels (<10kW), primarily for applications such as on-board charging, data center power supplies, and fuel cells. The power output of these transformers is typically below 1kW. Planar transformers are also used to generate high voltages. However, research on planar transformers for high-insulation-voltage DC-DC converters is scarce. Therefore, in the field of transformers, it is essential to study the structure of high-voltage planar transformers to expand their applications to even higher voltage levels.

[0005] Furthermore, traditional winding loss assessment methods are not very accurate in high-voltage transformers. When windings are of unequal width, the magnetic field strength on the winding surface is affected by the proximity effect and skin effect, resulting in a non-uniform magnetic field distribution. Traditional loss assessment methods, however, primarily address the case of windings of equal width, assuming a uniform magnetic field distribution, leading to significant calculation errors. Therefore, improving the accuracy of winding loss calculations for high-voltage, high-frequency planar transformers has become a key research focus. Summary of the Invention

[0006] This disclosure provides a high-voltage, high-frequency planar transformer and a method for evaluating its winding losses. The main purpose is to improve the voltage range in which planar transformers are applied and to improve the accuracy of winding loss calculation.

[0007] According to one aspect of this disclosure, a method for evaluating the winding losses of a high-voltage, high-frequency planar transformer is provided, comprising:

[0008] Determine the winding magnetic field boundary conditions based on the winding current distribution characteristics;

[0009] The copper layer current distribution is determined based on the winding magnetic field boundary conditions.

[0010] Based on the copper layer current distribution, the winding losses of the high-frequency high-voltage planar transformer are determined.

[0011] Optionally, the winding current distribution characteristics include high-voltage winding current distribution characteristics and low-voltage winding current distribution characteristics; the winding magnetic field boundary conditions include overall winding magnetic field boundary conditions and winding induced magnetic field boundary conditions; and determining the winding magnetic field boundary conditions based on the winding current distribution characteristics includes:

[0012] Based on the current distribution characteristics of the high-voltage winding, the magnetic field distribution of the layer between the high-voltage winding and the low-voltage winding in the high-frequency high-voltage planar transformer is determined.

[0013] Based on the magnetic field distribution, determine the overall magnetic field boundary conditions of the winding;

[0014] Based on the current distribution characteristics of the low-voltage winding, determine the boundary conditions of the winding excitation magnetic field;

[0015] The boundary conditions of the induced magnetic field of the winding are determined based on the overall magnetic field boundary conditions of the winding and the excitation magnetic field boundary conditions of the winding.

[0016] Optionally, determining the copper layer current distribution based on the winding magnetic field boundary conditions includes:

[0017] The magnetic field boundary conditions of the copper layer are determined based on the winding magnetic field boundary conditions.

[0018] The current distribution of the copper layer is determined based on the magnetic field boundary conditions of the copper layer.

[0019] Optionally, determining the copper layer magnetic field boundary conditions based on the winding magnetic field boundary conditions includes:

[0020] Determine the low-voltage winding parameters corresponding to the low-voltage winding in the high-frequency high-voltage planar transformer;

[0021] Based on the low-voltage winding parameters and the winding magnetic field boundary conditions, the basic equations of electromagnetic fields in the copper layer and air are solved to determine the induced magnetic field distribution on the surface of each copper layer, thus obtaining the set of induced magnetic field distributions.

[0022] The magnetic field boundary conditions of the copper layer are determined based on the set of induced magnetic field distributions.

[0023] Optionally, determining the copper layer current distribution based on the copper layer magnetic field boundary conditions includes:

[0024] Based on the magnetic field boundary conditions of the copper layer, the fundamental equations of the electromagnetic field in the copper layer are solved to obtain the current distribution of the copper layer.

[0025] Optionally, determining the winding losses of the high-frequency high-voltage planar transformer based on the copper layer current distribution includes:

[0026] Based on the copper layer current distribution, determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer;

[0027] The overall current corresponding to the high-frequency high-voltage planar transformer is determined based on the induced current and the excitation current.

[0028] The winding losses of the high-frequency high-voltage planar transformer are determined based on the overall current.

[0029] According to another aspect of this disclosure, a high-frequency, high-voltage planar transformer is provided, characterized in that it comprises: a high-voltage winding layer, a first low-voltage winding layer, a second low-voltage winding layer, a first isolation winding layer, a second isolation winding layer, and a magnetic core; wherein,

[0030] The first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer are connected in sequence;

[0031] The magnetic core passes through the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer.

[0032] Optionally, it also includes: a low-voltage connection terminal and a high-voltage connection terminal; wherein,

[0033] The low-voltage connection terminals are distributed and connected to the first low-voltage winding layer and the second low-voltage winding layer;

[0034] The high-voltage connection terminal is connected to the high-voltage winding layer.

[0035] Optionally, the high-voltage winding layer, the first low-voltage winding layer, the second low-voltage winding layer, the first isolation winding layer, and the second isolation winding layer are printed circuit boards.

[0036] Optionally, the magnetic core passes through the middle of the printed circuit board.

[0037] Optionally, the high-voltage winding layer, the first low-voltage winding layer, and the second low-voltage winding layer are multilayer printed circuit boards, and the first isolation winding layer and the second isolation winding layer are two thickened printed circuit boards; wherein,

[0038] The thickness of each printed circuit board in the multilayer printed circuit board is less than the thickness of each printed circuit board in the two thickened printed circuit boards.

[0039] The copper layer width in the multilayer printed circuit board corresponding to the first low-voltage winding layer and the second low-voltage winding layer is greater than the copper layer width in the multilayer printed circuit board corresponding to the high-voltage winding layer.

[0040] Optionally, each layer of the multilayer printed circuit board and the two-layer thickened printed circuit board is connected by solder in at least one of the following ways: through-hole pad to through-hole pad, through-hole pad to single-layer pad, and single-layer pad to single-layer pad.

[0041] Each layer of windings in each printed circuit board is connected by vias.

[0042] Optionally, in the multilayer printed circuit board corresponding to the high voltage winding layer, multiple turns of winding are wound in the same layer of printed circuit board.

[0043] Optionally, the two-layer thickened printed circuit board includes a first thickened printed circuit board and a second thickened printed circuit board; wherein,

[0044] The first thickened printed circuit board is connected to the low-voltage winding layer, and the second thickened printed circuit board is connected to the high-voltage winding layer. The copper layer width in the first thickened printed circuit board is greater than the copper layer width in the second thickened printed circuit board.

[0045] Optionally, the two-layer thickened printed circuit board includes a current-guiding region and an insulating edge region, wherein the current-guiding region is connected to the insulating edge region; wherein,

[0046] The width of the flow guiding area in the first thickened printed circuit board is the same as the width of the flow guiding area in the second thickened printed circuit board;

[0047] The insulating edge region extends out of the flow guiding region;

[0048] The insulating edge region is strip-shaped, and an equalizing ring is provided at the end of the insulating edge region.

[0049] Optionally, the magnetic core is a high-frequency magnetic core.

[0050] According to another aspect of this disclosure, a high-frequency high-voltage planar transformer winding loss assessment device is provided, characterized in that it comprises:

[0051] The condition determination unit is used to determine the winding magnetic field boundary conditions based on the winding current distribution characteristics.

[0052] The distribution determination unit is used to determine the copper layer current distribution based on the winding magnetic field boundary conditions;

[0053] The loss determination unit is used to determine the winding loss of the high-frequency high-voltage planar transformer based on the copper layer current distribution.

[0054] Optionally, the winding current distribution characteristics include high-voltage winding current distribution characteristics and low-voltage winding current distribution characteristics; the winding magnetic field boundary conditions include overall winding magnetic field boundary conditions and winding induced magnetic field boundary conditions; the condition determination unit, when determining the winding magnetic field boundary conditions based on the winding current distribution characteristics, is specifically used for:

[0055] Based on the current distribution characteristics of the high-voltage winding, the magnetic field distribution of the layer between the high-voltage winding and the low-voltage winding in the high-frequency high-voltage planar transformer is determined.

[0056] Based on the magnetic field distribution, determine the overall magnetic field boundary conditions of the winding;

[0057] Based on the current distribution characteristics of the low-voltage winding, determine the boundary conditions of the winding excitation magnetic field;

[0058] The boundary conditions of the induced magnetic field of the winding are determined based on the overall magnetic field boundary conditions of the winding and the excitation magnetic field boundary conditions of the winding.

[0059] Optionally, the distribution determination unit, when determining the copper layer current distribution based on the winding magnetic field boundary conditions, is specifically used for:

[0060] The magnetic field boundary conditions of the copper layer are determined based on the winding magnetic field boundary conditions.

[0061] The current distribution of the copper layer is determined based on the magnetic field boundary conditions of the copper layer.

[0062] Optionally, the distribution determining unit, when determining the copper layer magnetic field boundary conditions based on the winding magnetic field boundary conditions, is specifically used for:

[0063] Determine the low-voltage winding parameters corresponding to the low-voltage winding in the high-frequency high-voltage planar transformer;

[0064] Based on the low-voltage winding parameters and the winding magnetic field boundary conditions, the basic equations of electromagnetic fields in the copper layer and air are solved to determine the induced magnetic field distribution on the surface of each copper layer, thus obtaining the set of induced magnetic field distributions.

[0065] The magnetic field boundary conditions of the copper layer are determined based on the set of induced magnetic field distributions.

[0066] Optionally, the distribution determination unit, when determining the current distribution of the copper layer based on the magnetic field boundary conditions of the copper layer, specifically performs the following:

[0067] Based on the magnetic field boundary conditions of the copper layer, the fundamental equations of the electromagnetic field in the copper layer are solved to obtain the current distribution of the copper layer.

[0068] Optionally, the loss determination unit, when determining the winding loss of the high-frequency high-voltage planar transformer based on the copper layer current distribution, is specifically used for:

[0069] Based on the copper layer current distribution, determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer;

[0070] The overall current corresponding to the high-frequency high-voltage planar transformer is determined based on the induced current and the excitation current.

[0071] The winding losses of the high-frequency high-voltage planar transformer are determined based on the overall current.

[0072] According to another aspect of this disclosure, an electronic device is provided, comprising:

[0073] At least one processor; and

[0074] A memory communicatively connected to the at least one processor; wherein,

[0075] The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method described in any one of the preceding aspects.

[0076] According to another aspect of this disclosure, a non-transitory computer-readable storage medium is provided storing computer instructions, wherein the computer instructions are used to cause the computer to perform the method described in any one of the preceding aspects.

[0077] According to another aspect of this disclosure, a computer program product is provided, comprising a computer program that, when executed by a processor, implements the method described in any one of the preceding aspects.

[0078] In one or more embodiments of this disclosure, the winding magnetic field boundary conditions are determined based on the winding current distribution characteristics; the copper layer current distribution is determined based on the winding magnetic field boundary conditions; and the winding loss of the high-frequency high-voltage planar transformer is determined based on the copper layer current distribution. Therefore, by determining the copper layer current distribution based on the winding magnetic field boundary conditions and calculating the winding loss of the high-frequency high-voltage planar transformer based on the copper layer current distribution, the winding loss can be calculated with higher accuracy when the magnetic field distribution of the high-frequency high-voltage planar transformer is affected by the skin effect and proximity effect, thereby improving the accuracy of winding loss calculation.

[0079] In one or more embodiments of this disclosure, a high-frequency high-voltage planar transformer includes: a high-voltage winding layer, a first low-voltage winding layer, a second low-voltage winding layer, a first isolation winding layer, a second isolation winding layer, and a magnetic core; wherein the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer are connected sequentially; the magnetic core passes through the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer. Therefore, by adopting a winding arrangement structure with partially overlapping high and low voltage windings, the transformer avoids both the excessive winding loss caused by completely eliminating overlap and the excessive winding height caused by complete overlap. It maintains a structure where the low-voltage winding wraps around the high-voltage winding, thus reducing winding losses while also meeting the requirements for insulation structure. This broadens the high-voltage application prospects of planar transformers and fully utilizes their high-voltage application potential. Meanwhile, by using isolation windings to separate the high-voltage windings and the low-voltage windings, high-voltage operation of the planar transformer can be achieved. While ensuring high overall efficiency, insulation between the high-voltage and low-voltage windings can be achieved. This can broaden the high-voltage application prospects of the planar transformer, give full play to its insulation potential, and leverage its advantages of good processing consistency and simple processing.

[0080] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0081] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0082] Figure 1 A flowchart illustrating the first high-frequency high-voltage planar transformer winding loss assessment method provided in this disclosure embodiment is shown.

[0083] Figure 2A schematic flowchart of a second high-frequency high-voltage planar transformer winding loss assessment method provided in this disclosure embodiment is shown.

[0084] Figure 3 This diagram illustrates the calculation principle of winding current distribution and winding loss of a high-frequency high-voltage planar transformer provided in an embodiment of this disclosure.

[0085] Figure 4 This diagram illustrates a comparison between the calculated and simulated results of the longitudinal current distribution of the high-frequency high-voltage planar transformer provided in this embodiment of the present disclosure.

[0086] Figure 5 This diagram illustrates a comparison between the calculation results and simulation results of the lateral current distribution of the high-frequency high-voltage planar transformer provided in this embodiment of the present disclosure.

[0087] Figure 6 This diagram illustrates the structure of a high-frequency, high-voltage planar transformer according to an embodiment of the present disclosure.

[0088] Figure 7 This diagram illustrates the primary current distribution of an example high-voltage planar transformer according to an embodiment of the present disclosure.

[0089] Figure 8 This diagram illustrates the winding structure and electric and magnetic field distribution of a high-voltage planar transformer provided in an embodiment of this disclosure.

[0090] Figure 9 A schematic diagram showing the electric field simulation results of the high-voltage planar transformer provided in the embodiments of this disclosure is shown;

[0091] Figure 10 This diagram illustrates the structure of a high-frequency high-voltage planar transformer winding loss assessment device provided in an embodiment of this disclosure.

[0092] Figure 11 This is a block diagram of an electronic device used to implement the high-frequency high-voltage planar transformer winding loss assessment method according to embodiments of the present disclosure. Detailed Implementation

[0093] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0094] The present disclosure will now be described in detail with reference to specific embodiments.

[0095] In the first embodiment, such as Figure 1 As shown, Figure 1 This diagram illustrates a flowchart of a first method for evaluating the winding losses of a high-frequency, high-voltage planar transformer according to an embodiment of this disclosure. This method can be implemented using a computer program and can run on an apparatus for evaluating the winding losses of a high-frequency, high-voltage planar transformer. The computer program can be integrated into an application or run as a standalone utility application.

[0096] The electronic device includes, but is not limited to: wearable devices, handheld devices, personal computers, tablets, in-vehicle devices, smartphones, computing devices, or other processing devices connected to a wireless modem. In different networks, the electronic device may have different names, such as: user equipment, access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent or user device, cellular phone, cordless phone, personal digital assistant (PDA), electronic device in 5G networks, or future evolved networks, etc. An operating system can be installed on the electronic device. This operating system refers to the program that can run on the electronic device; it is a program that manages and controls the hardware and applications of the electronic device and is an indispensable system application in the electronic device. This operating system includes, but is not limited to, Android, iOS, Windows Phone (WP), and Ubuntu Mobile.

[0097] Specifically, the method for evaluating the winding losses of this high-frequency, high-voltage planar transformer includes:

[0098] S101, Determine the winding magnetic field boundary conditions based on the winding current distribution characteristics;

[0099] According to some embodiments, the winding current distribution characteristic refers to the current distribution characteristic of the windings in a high-frequency, high-voltage planar transformer. This winding current distribution characteristic does not specifically refer to a single fixed characteristic. It can include both high-voltage winding current distribution characteristics and low-voltage winding current distribution characteristics.

[0100] In some embodiments, a high-frequency high-voltage planar transformer refers to a transformer that uses a printed circuit board as the winding and a planar magnetic core as the magnetic core.

[0101] According to some embodiments, the winding magnetic field boundary condition refers to the equation that determines the relationship between the electromagnetic field changes on both sides of the winding interface. This winding magnetic field boundary condition does not specifically refer to a single fixed condition. It can include the overall winding magnetic field boundary condition, the winding excitation magnetic field boundary condition, and the winding induced magnetic field boundary condition.

[0102] It is easy to understand that when electronic equipment performs high-frequency high-voltage planar transformer winding loss assessment, the electronic equipment can determine the winding magnetic field boundary conditions based on the winding current distribution characteristics.

[0103] S102, Determine the copper layer current distribution based on the winding magnetic field boundary conditions;

[0104] According to some embodiments, the copper layer current distribution refers to the current distribution in the copper layer of the printed circuit board corresponding to the winding. This copper layer current distribution is not specifically defined by a fixed distribution. For example, the copper layer current distribution can change when the winding changes.

[0105] It is easy to understand that when an electronic device obtains the winding magnetic field boundary conditions, it can determine the copper layer current distribution based on these boundary conditions.

[0106] S103, determine the winding loss of the high-frequency high-voltage planar transformer based on the copper layer current distribution.

[0107] According to some embodiments, winding loss refers to the loss caused by heat generated due to winding resistance when current flows through the transformer windings. The winding loss of this high-frequency high-voltage planar transformer can be the overall winding loss of the high-frequency high-voltage planar transformer, or it can be the partial winding loss corresponding to a portion of the windings in the high-frequency high-voltage planar transformer.

[0108] It is easy to understand that when an electronic device determines the copper layer current distribution, it can determine the winding loss of a high-frequency high-voltage planar transformer based on that copper layer current distribution.

[0109] In summary, the method provided in this disclosure determines the winding magnetic field boundary conditions based on the winding current distribution characteristics; determines the copper layer current distribution based on the winding magnetic field boundary conditions; and determines the winding losses of the high-frequency high-voltage planar transformer based on the copper layer current distribution. Therefore, by determining the copper layer current distribution based on the winding magnetic field boundary conditions and calculating the winding losses of the high-frequency high-voltage planar transformer based on the copper layer current distribution, the winding losses can be calculated with higher accuracy when the magnetic field distribution of the high-frequency high-voltage planar transformer is affected by the skin effect and proximity effect, thus improving the accuracy of winding loss calculation.

[0110] Please see Figure 2 , Figure 2 This diagram illustrates a flowchart of a second method for evaluating the winding losses of a high-frequency, high-voltage planar transformer according to an embodiment of this disclosure. Specifically, the method for evaluating the winding losses of a high-frequency, high-voltage planar transformer includes:

[0111] S201, Based on the current distribution characteristics of the high-voltage winding, determine the magnetic field distribution of the layer between the high-voltage winding and the low-voltage winding in the high-frequency high-voltage planar transformer;

[0112] It should be noted that in high-frequency high-voltage planar transformers, the high-voltage and low-voltage windings have unequal widths, and due to insulation requirements, the gaps between the copper layers of the high-voltage winding are relatively large. Therefore, the current distribution in the low-voltage winding is affected by the current in the high-voltage winding. Under the proximity effect, the current in the low-voltage winding is attracted by the reverse current in the high-voltage winding, concentrating in areas adjacent to the high-voltage winding current. This results in a high current density in the region of the low-voltage winding adjacent to the copper layer of the high-voltage winding, and a low current density in the region not adjacent to the copper layer of the high-voltage winding. This leads to additional high-frequency winding losses. However, the high-voltage winding is not affected by this effect.

[0113] According to some embodiments, the high-voltage winding current distribution characteristic refers to the characteristic that the high-voltage winding current is not significantly unevenly distributed due to proximity effects. In this case, the current is only affected by a ring-shaped distribution.

[0114] In some embodiments, when determining the magnetic field distribution of the layer between the high-voltage and low-voltage windings in a high-frequency high-voltage planar transformer based on the high-voltage winding current distribution characteristics, firstly, the current distribution corresponding to the high-voltage winding can be determined based on the high-voltage winding current distribution characteristics. Then, the magnetic field distribution of the layer between the high-voltage and low-voltage windings in the high-frequency high-voltage planar transformer can be determined based on the current distribution corresponding to the high-voltage winding. Specifically, the following formula can be referenced:

[0115]

[0116]

[0117]

[0118] in, x for Axis coordinates; Let x be the magnitude of the current density at point x; I This represents the total excitation current of the high-voltage winding. h The thickness of the winding; The inner radius of the secondary winding; The outer radius of the secondary winding; This refers to the winding power loss. The conductivity of a conductor; c This refers to the winding width; The magnetic field strength at the top of the Nth turn of the winding; N Number the number of turns.

[0119] It is easy to understand that when electronic equipment performs winding loss assessment of high-frequency high-voltage planar transformers, the electronic equipment can determine the magnetic field distribution of the layer between the high-voltage winding and the low-voltage winding in the high-frequency high-voltage planar transformer based on the current distribution characteristics of the high-voltage winding.

[0120] S202, Determine the overall magnetic field boundary conditions of the winding based on the magnetic field distribution;

[0121] It is easy to understand that when electronic equipment determines the magnetic field distribution between the high-voltage winding and the low-voltage winding in a high-frequency high-voltage planar transformer, electronic equipment can determine the overall magnetic field boundary conditions of the winding based on the magnetic field distribution.

[0122] S203, Determine the boundary conditions of the winding excitation magnetic field based on the current distribution characteristics of the low-voltage winding;

[0123] According to some embodiments, the low-voltage winding current distribution characteristic refers to the fact that the current distribution of the low-voltage winding is affected by the current of the high-voltage winding. Under the effect of proximity effect, the current of the low-voltage winding is attracted by the reverse high-voltage winding current and concentrates in the place adjacent to the high-voltage winding current.

[0124] In some embodiments, the overall magnetic field boundary conditions of the winding can be divided into winding excitation magnetic field boundary conditions and winding induced magnetic field boundary conditions according to the nature of the magnetic field. The winding excitation magnetic field boundary conditions mainly describe the external current excitation effect on the transformer, and this part does not need to consider the proximity effect. The winding induced magnetic field boundary conditions mainly describe the influence of the proximity effect on the low-voltage winding current distribution. Therefore, when determining the winding excitation magnetic field boundary conditions, the proximity effect does not need to be considered, and the calculation can still be performed based on a uniform distribution.

[0125] Specifically, when determining the boundary conditions of the winding excitation magnetic field, it can be assumed that the low-voltage winding current distribution is also unaffected by the proximity effect, and the magnetic field distribution under simulation can be used as the excitation part distribution. The following formula can be used as a reference:

[0126]

[0127]

[0128]

[0129] in, The magnitude of the primary-side excitation current density; The inner radius of the primary winding; The outer radius of the primary winding; The magnetic field strength at the top of the Nth turn of the winding generated by the excitation current; The magnetic field strength at the top of the i-th turn of the winding; The magnetic field strength at the top of the i-th turn of the winding generated by the excitation current; Let be the magnetic field strength at the top of the i-th turn of the winding generated by the induced current.

[0130] It is easy to understand that when electronic equipment performs high-frequency high-voltage planar transformer winding loss assessment, the electronic equipment can determine the winding excitation magnetic field boundary conditions based on the low-voltage winding current distribution characteristics.

[0131] S204. Determine the winding induced magnetic field boundary conditions based on the overall winding magnetic field boundary conditions and the winding excitation magnetic field boundary conditions.

[0132] It is easy to understand that when the electronic device obtains the overall magnetic field boundary conditions and the winding excitation magnetic field boundary conditions, the electronic device can subtract the winding excitation magnetic field boundary conditions from the overall magnetic field boundary conditions to obtain the winding induced magnetic field boundary conditions.

[0133] S205, Determine the magnetic field boundary conditions of the copper layer based on the winding magnetic field boundary conditions;

[0134] According to some embodiments, when an electronic device determines the magnetic field boundary conditions of a copper layer based on the winding magnetic field boundary conditions, the electronic device can first determine the low-voltage winding parameters corresponding to the low-voltage winding in the high-frequency high-voltage planar transformer. Next, the electronic device can solve the fundamental equations of electromagnetic fields in the copper layer and air based on the low-voltage winding parameters and the winding magnetic field boundary conditions, determining the induced magnetic field distribution corresponding to the surface of each copper layer, thus obtaining a set of induced magnetic field distributions. Finally, the electronic device can determine the magnetic field boundary conditions of the copper layer based on the set of induced magnetic field distributions.

[0135] In some embodiments, when an electronic device solves the fundamental equations of the electromagnetic field in the copper layer and air based on the low-voltage winding parameters and the winding magnetic field boundary conditions to determine the induced magnetic field distribution corresponding to the surface of each copper layer, the induced magnetic field distribution corresponding to the upper and lower surfaces of each copper layer can be obtained. The specific solution formula is as follows:

[0136]

[0137] in, k These are the coefficients in the matrix.

[0138] It is easy to understand that when an electronic device obtains the winding magnetic field boundary conditions, it can determine the copper layer magnetic field boundary conditions based on the winding magnetic field boundary conditions.

[0139] S206, Determine the current distribution in the copper layer based on the boundary conditions of the copper layer magnetic field;

[0140] According to some embodiments, when an electronic device determines the current distribution in a copper layer based on the boundary conditions of the copper layer's magnetic field, the electronic device can solve the fundamental equations of the electromagnetic field in the copper layer based on the boundary conditions of the copper layer's magnetic field to obtain the current distribution in the copper layer.

[0141] In some embodiments, when determining the copper layer current distribution, the electronic device may refer to the following formula:

[0142]

[0143] in, Let represent the magnitude of the induced current density of the i-th turn of the winding; For deeper skin penetration; z This represents the size of the z-axis coordinate.

[0144] It is easy to understand that when an electronic device determines the boundary conditions of the magnetic field of the copper layer, it can determine the current distribution of the copper layer based on the boundary conditions of the magnetic field of the copper layer.

[0145] S207, Based on the copper layer current distribution, determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer;

[0146] It is easy to understand that when electronic devices determine the copper layer current distribution, they can determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer.

[0147] S208, determine the overall current corresponding to the high-frequency high-voltage planar transformer based on the induced current and the excitation current;

[0148] It is easy to understand that when electronic devices determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer, electronic devices can determine the overall current corresponding to the high-frequency high-voltage planar transformer.

[0149] S209, determine the winding losses of the high-frequency high-voltage planar transformer based on the overall current.

[0150] According to some embodiments, Figure 3 This diagram illustrates the calculation principle of winding current distribution and winding loss of a high-frequency, high-voltage planar transformer according to an embodiment of this disclosure. Figure 3 As shown, the different widths of the high-voltage and low-voltage windings result in severe current unevenness in the wider windings. The current distribution is calculated using the superposition method, dividing it into induced current and excitation current based on function. The overall induced current is zero, representing the current induced by the unequal conductor width. The sum of the overall excitation currents is equal to the external excitation, but is not affected by the unequal-width induced current. Detailed analysis has been fully explained above and will not be repeated here.

[0151] In some embodiments, Figure 4 This diagram illustrates a comparison between the calculated and simulated results of the longitudinal distribution of induced current in a high-frequency, high-voltage planar transformer according to an embodiment of this disclosure. Figure 4 As shown, a current is induced in the low-voltage winding near the high-voltage winding. The closer to the high-voltage winding, the greater the induced current, which decreases with distance. The calculated results are consistent with the simulation results.

[0152] In some embodiments, Figure 5 This diagram illustrates a comparison between the calculated and simulated results of the lateral current distribution of the high-frequency high-voltage planar transformer provided in this embodiment of the present disclosure. Figure 5 As shown, a current is induced in the low-voltage winding near the high-voltage winding. The induced current is larger in the lateral direction closer to the high-voltage winding. Due to the limitation of the overall current by the excitation current, the induced current is negative in the part farther from the high-voltage winding. The calculated results are consistent with the simulation results.

[0153] According to some embodiments, in a perfectly ideal situation, the proximity effect has no impact. In this case, the loss can be calculated directly using the current distribution results of the excitation part, and the influence of the induction part is zero.

[0154] It is easy to understand that when an electronic device obtains the overall current corresponding to the high-frequency high-voltage planar transformer, the electronic device can determine the winding loss of the high-frequency high-voltage planar transformer based on the overall current corresponding to the high-frequency high-voltage planar transformer.

[0155] In summary, the method provided in this disclosure determines the magnetic field distribution of the layers between the high-voltage and low-voltage windings in a high-frequency high-voltage planar transformer based on the high-voltage winding current distribution characteristics. Based on the magnetic field distribution, it determines the overall magnetic field boundary conditions of the windings. Based on the low-voltage winding current distribution characteristics, it determines the winding excitation magnetic field boundary conditions. Based on the overall and excitation magnetic field boundary conditions, it determines the winding induced magnetic field boundary conditions. Based on the winding magnetic field boundary conditions, it determines the copper layer magnetic field boundary conditions. Based on the copper layer magnetic field boundary conditions, it determines the copper layer current distribution. Based on the copper layer current distribution, it determines the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer. Based on the induced current and excitation current, it determines the overall current corresponding to the high-frequency high-voltage planar transformer. Based on the overall current, it determines the winding losses of the high-frequency high-voltage planar transformer. Therefore, the method proposed in this disclosure, compared to classical methods, can calculate winding losses when the current distribution is no longer uniform due to the proximity effect. It can effectively calculate the winding losses of high-frequency, high-voltage planar transformers when the magnetic field distribution is affected by the skin effect and proximity effect, and can calculate winding losses with high accuracy, thus improving the accuracy of winding loss calculation and facilitating the parameter design of high-voltage planar transformers. Furthermore, by solving for the magnitude of the magnetic field boundary conditions of each copper layer based on the magnetic field boundary conditions, the influence of the proximity effect on the current distribution under a given set of frequencies and spacing can be measured. This allows for more accurate calculation of winding losses even when the magnetic field is not uniformly distributed on the winding surface, further improving the accuracy of winding loss calculation.

[0156] The collection, storage, use, processing, transmission, provision, and disclosure of user personal information involved in the technical solution disclosed herein comply with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0157] According to embodiments of this disclosure, this disclosure also provides a high-frequency high-voltage planar transformer.

[0158] Please see Figure 6 This illustrates a structural schematic diagram of a high-frequency, high-voltage planar transformer provided in an embodiment of this disclosure. Figure 6 As shown, the high-frequency, high-voltage planar transformer includes: a high-voltage winding layer, a first low-voltage winding layer, a second low-voltage winding layer, a first isolation winding layer, a second isolation winding layer, and a magnetic core; wherein,

[0159] The first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer are connected in sequence.

[0160] The magnetic core passes through the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer.

[0161] According to some embodiments, a high-voltage winding refers to a multi-turn winding used to conduct high-voltage current and generate magnetomotive force.

[0162] According to some embodiments, a low-voltage winding refers to a multi-turn winding used to conduct low-voltage current and generate magnetomotive force.

[0163] In some embodiments, the number of turns in the high-voltage winding and the number of turns in the low-voltage winding can be determined according to the actual operating conditions.

[0164] According to some embodiments, the isolation winding layer is used to isolate the low-voltage winding from the high-voltage winding and to confine the high electric field within itself, achieving insulation by utilizing its own insulating medium.

[0165] In some embodiments, the magnetizing inductance of the high-frequency high-voltage planar transformer can be determined based on the air gap between the upper and lower magnetic cores.

[0166] It should be noted that, Figure 7 This diagram illustrates the primary current distribution of an example high-voltage planar transformer according to an embodiment of this disclosure. Figure 7 As shown, to achieve higher efficiency, planar transformers often employ a method where the primary and secondary windings are completely overlapped to reduce the magnetic field strength near the windings, decrease the equivalent number of winding layers, and reduce losses. For high-voltage planar transformers, using the same method would result in too many isolation windings and an excessively high overall winding height. Conversely, completely eliminating overlap would lead to a large equivalent number of layers and high winding losses.

[0167] Therefore, the high-frequency high-voltage planar transformer provided in this disclosure, by adopting a winding arrangement structure with partially overlapping high- and low-voltage windings, avoids both the excessive winding losses caused by completely eliminating overlap and the excessive winding height caused by complete overlap. It maintains a structure where the low-voltage winding surrounds the high-voltage winding, reducing winding losses while also meeting insulation requirements. This broadens the high-voltage application prospects of planar transformers and fully utilizes their high-voltage application potential. Simultaneously, by using an isolation winding to separate the high-voltage and low-voltage windings, the high-voltage operation of the planar transformer can be achieved. This ensures high overall efficiency while achieving insulation between the high and low-voltage windings, thereby broadening the high-voltage application prospects of planar transformers, maximizing their insulation potential, and offering advantages such as good processing consistency and simplicity.

[0168] In this embodiment of the disclosure, the high-frequency high-voltage planar transformer further includes: a low-voltage connection terminal and a high-voltage connection terminal; wherein,

[0169] The low-voltage connection terminals are distributed and connected to the first low-voltage winding layer and the second low-voltage winding layer;

[0170] The high-voltage connection terminal is connected to the high-voltage winding layer.

[0171] According to some embodiments, the low-voltage connection terminal is used to connect the high-frequency high-voltage planar transformer to an external low-voltage circuit. Specifically, the low-voltage connection terminal is used to connect the low-voltage winding layer to the external low-voltage circuit.

[0172] In some embodiments, the high-voltage connection terminal is used to connect the high-frequency high-voltage planar transformer to an external high-voltage circuit. Specifically, the high-voltage connection terminal is used to connect the high-voltage winding layer to the external high-voltage circuit.

[0173] According to some embodiments, the low-voltage connection terminal and the high-voltage connection terminal can also be used to connect a high-frequency high-voltage planar transformer to a converter.

[0174] In this embodiment of the disclosure, the high-voltage winding layer, the first low-voltage winding layer, the second low-voltage winding layer, the first isolation winding layer, and the second isolation winding layer are printed circuit boards (PCBs). Figure 6 As shown, the high-voltage winding layer is a high-voltage PCB, the first low-voltage winding layer and the second low-voltage winding layer are both low-voltage PCBs, and the first isolation winding layer and the second isolation winding layer are both shielded PCBs.

[0175] According to some embodiments, a printed circuit board includes a copper layer and an insulating dielectric. The copper layer is used to conduct current, and the insulating dielectric is used to provide basic insulation.

[0176] In this embodiment of the disclosure, the magnetic core passes through the middle of the printed circuit board.

[0177] Specifically, the magnetic core is a planar magnetic core. This planar magnetic core sequentially passes through the middle of the printed circuit boards corresponding to the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer. Thus, the planar magnetic core can couple the magnetic fields of all the windings together.

[0178] According to some embodiments, the copper layer of the low-voltage winding and the copper layer of the high-voltage winding conduct high-frequency current and are coupled together through a magnetic core to transfer energy.

[0179] In this embodiment, the high-voltage winding layer, the first low-voltage winding layer, and the second low-voltage winding layer are multilayer printed circuit boards, and the first isolation winding layer and the second isolation winding layer are two thickened printed circuit boards; wherein,

[0180] The thickness of each printed circuit board in a multilayer printed circuit board is less than the thickness of each printed circuit board in a two-layer thickened printed circuit board.

[0181] The copper layer width in the multilayer printed circuit board corresponding to the first low-voltage winding layer and the second low-voltage winding layer is greater than the copper layer width in the multilayer printed circuit board corresponding to the high-voltage winding layer.

[0182] In some embodiments, the copper layer width corresponding to the low-voltage winding layer is greater than the copper layer width corresponding to the high-voltage winding layer, thereby enabling the low-voltage winding layer to conduct a larger current. Simultaneously, the low-voltage winding layer can be appropriately widened based on the overall width of a single layer in the high-voltage winding layer, thereby achieving a width that is essentially the same as the overall width of a single layer in the high-voltage winding layer.

[0183] In some embodiments, the thickness of each printed circuit board in a two-layer thickened printed circuit board can be determined based on the insulation voltage.

[0184] It is easy to understand that all windings of the high-frequency high-voltage planar transformer adopt a non-uniform thickness arrangement, that is, the winding thickness adopts a non-uniform thickness, the high and low voltage windings adopt a normal thickness, and the isolation winding adopts a thicker thickness, thereby realizing the effective utilization of winding height and reducing the winding processing cost.

[0185] In the embodiments disclosed herein, each layer of the multilayer printed circuit board and the two-layer thickened printed circuit board is connected to each other by solder in at least one of the following methods: through-hole pad to through-hole pad, through-hole pad to single-layer pad, and single-layer pad to single-layer pad.

[0186] Each layer of windings in each printed circuit board is connected by vias.

[0187] According to some embodiments, when each layer of windings in each layer of a printed circuit board is connected by vias, they can be connected through through holes, buried vias, etc.

[0188] In this embodiment of the disclosure, multiple turns of the winding in the multilayer printed circuit board corresponding to the high voltage winding layer are wound in the same layer of printed circuit board.

[0189] For example, when the step-up ratio of a high-frequency high-voltage planar transformer is 1:2, the high-voltage winding layer needs to have two turns placed on the same printed circuit board, while the low-voltage winding layer has one turn placed on a separate printed circuit board. In this case, the width of the low-voltage winding layer should be the same as the combined width of the two high-voltage winding turns.

[0190] It is easy to understand that by winding multiple turns in the high-voltage winding layer on the same printed circuit board, the number of high-voltage winding layers can be reduced, and the overall width is basically the same as that of the low-voltage winding.

[0191] In this embodiment of the disclosure, the two-layer thickened printed circuit board includes a first thickened printed circuit board and a second thickened printed circuit board; wherein,

[0192] The first thickened printed circuit board is connected to the low-voltage winding layer, and the second thickened printed circuit board is connected to the high-voltage winding layer. The copper layer width in the first thickened printed circuit board is greater than the copper layer width in the second thickened printed circuit board.

[0193] According to some embodiments, the copper layer width in the first thickened printed circuit board is greater than the copper layer width in the second thickened printed circuit board, allowing for insulation of the high and low voltage windings through a sufficiently thick printed circuit board insulating material. Furthermore, the higher electric field strength exists only within the two thickened printed circuit board layers; the electric field strength in the air will not be excessive. Figure 8 and Figure 9 As shown.

[0194] It is easy to understand that the structure of the two-layer thickened printed circuit board provided in the embodiments of this disclosure has high power density, low electric field strength in air, is easy to process, and has low cost.

[0195] In the embodiments disclosed herein, such as Figure 6 As shown, the two-layer thickened printed circuit board includes a current-guiding region and an insulating edge region, with the current-guiding region connected to the insulating edge region; wherein,

[0196] The width of the flow guiding area in the first thickened printed circuit board is the same as the width of the flow guiding area in the second thickened printed circuit board.

[0197] The insulating edge region extends into the flow-guiding region;

[0198] The insulating edge region is strip-shaped, and an equalizing ring is provided at the end of the insulating edge region.

[0199] It should be noted that when designing a high-frequency, high-voltage planar transformer, both insulation and efficiency factors must be considered. Based on the analysis of current distribution and winding losses, the widths of the high-voltage and low-voltage windings need to be equal to minimize the impact of proximity effects. Furthermore, insulation requirements necessitate that the low-voltage winding be wider than the high-voltage winding to achieve optimal shielding performance. Therefore, to balance insulation performance and high-efficiency conversion, the isolation winding proposed in this embodiment has been optimized, primarily focusing on the portion connected to the low-voltage winding.

[0200] According to some embodiments, the insulating edge region is widened based on the current-conducting region. That is, after the insulating edge region extends out of the current-conducting region, in order to avoid the generation of induced current and reduced efficiency at the same time as widening, the shape of the insulating edge region is set to strip.

[0201] In some embodiments, providing an equalizing ring at the end of the insulating edge region can prevent a large electric field strength from being generated at the tip of the strip when the insulating edge region is strip-shaped.

[0202] It is readily understood that the isolation winding layer provided in this embodiment of the present disclosure balances the requirements of low loss and reliable insulation isolation. Its current-conducting region maintains the same width for both high and low voltage windings, minimizing the impact of proximity effects on the windings. Simultaneously, by optimizing the insulation edge region, it is possible to achieve a wider insulation edge region for the low-voltage winding than the high-voltage winding without introducing current, thereby reducing winding losses.

[0203] In this embodiment of the disclosure, the magnetic core is a high-frequency magnetic core.

[0204] According to some embodiments, the high-frequency magnetic core does not specifically refer to a particular fixed magnetic core. For example, the high-frequency magnetic core can be a ferrite core, a nanocrystalline core, etc.

[0205] In summary, the high-frequency high-voltage planar transformer provided in this embodiment includes: a high-voltage winding layer, a first low-voltage winding layer, a second low-voltage winding layer, a first isolation winding layer, a second isolation winding layer, and a magnetic core; wherein the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer are connected sequentially; the magnetic core passes through the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer. By adopting a winding arrangement structure with partially overlapping high and low voltage windings, it avoids both completely eliminating overlap, which would lead to large winding losses, and completely overlapping, which would lead to excessively high winding height. It maintains a structure where the low-voltage winding wraps around the high-voltage winding, thus reducing winding losses while also meeting the requirements for insulation structure. This broadens the high-voltage application prospects of planar transformers and fully utilizes their high-voltage application potential. Meanwhile, by using isolation windings to separate the high-voltage windings and the low-voltage windings, high-voltage operation of the planar transformer can be achieved. While ensuring high overall efficiency, insulation between the high-voltage and low-voltage windings can be achieved. This can broaden the high-voltage application prospects of the planar transformer, give full play to its insulation potential, and leverage its advantages of good processing consistency and simple processing.

[0206] The following are embodiments of the apparatus disclosed herein, which can be used to execute embodiments of the method disclosed herein. For details not disclosed in the apparatus embodiments of this disclosure, please refer to the embodiments of the method disclosed herein.

[0207] According to embodiments of this disclosure, this disclosure also provides a device for evaluating the winding losses of a high-frequency high-voltage planar transformer.

[0208] Please see Figure 10This illustration shows a structural schematic diagram of a high-frequency high-voltage planar transformer winding loss assessment device provided in an embodiment of this disclosure. This high-frequency high-voltage planar transformer winding loss assessment device can be implemented as all or part of a device through software, hardware, or a combination of both. The high-frequency high-voltage planar transformer winding loss assessment device 1000 includes a condition determination unit 1001, a distribution determination unit 1002, and a loss determination unit 1003, wherein:

[0209] The condition determination unit 1001 is used to determine the winding magnetic field boundary conditions based on the winding current distribution characteristics.

[0210] The distribution determination unit 1002 is used to determine the copper layer current distribution based on the winding magnetic field boundary conditions;

[0211] The loss determination unit 1003 is used to determine the winding loss of the high-frequency high-voltage planar transformer based on the copper layer current distribution.

[0212] Optionally, the winding current distribution characteristics include the high-voltage winding current distribution characteristics and the low-voltage winding current distribution characteristics; the winding magnetic field boundary conditions include the overall winding magnetic field boundary conditions and the winding induced magnetic field boundary conditions; the condition determination unit 1001 is used to determine the winding magnetic field boundary conditions based on the winding current distribution characteristics, specifically for:

[0213] Based on the current distribution characteristics of the high-voltage winding, determine the magnetic field distribution of the layer between the high-voltage winding and the low-voltage winding in the high-frequency high-voltage planar transformer;

[0214] Determine the overall magnetic field boundary conditions of the winding based on the magnetic field distribution;

[0215] Determine the boundary conditions of the winding excitation magnetic field based on the current distribution characteristics of the low-voltage winding;

[0216] The boundary conditions of the induced magnetic field of the winding are determined based on the boundary conditions of the overall magnetic field of the winding and the boundary conditions of the excitation magnetic field of the winding.

[0217] Optionally, the distribution determination unit 1002 is used to determine the copper layer current distribution based on the winding magnetic field boundary conditions, specifically for:

[0218] Determine the magnetic field boundary conditions of the copper layer based on the winding magnetic field boundary conditions;

[0219] The current distribution in the copper layer is determined based on the boundary conditions of the magnetic field in the copper layer.

[0220] Optionally, the distribution determination unit 1002 is used to determine the magnetic field boundary conditions of the copper layer based on the winding magnetic field boundary conditions, specifically for:

[0221] Determine the low-voltage winding parameters corresponding to the low-voltage winding in a high-frequency high-voltage planar transformer;

[0222] Based on the low-voltage winding parameters and the winding magnetic field boundary conditions, the basic equations of electromagnetic fields in the copper layer and air are solved to determine the induced magnetic field distribution on the surface of each copper layer, thus obtaining the set of induced magnetic field distributions.

[0223] The boundary conditions of the copper layer magnetic field are determined based on the set of induced magnetic field distributions.

[0224] Optionally, the distribution determination unit 1002 is used to determine the copper layer current distribution based on the copper layer magnetic field boundary conditions, specifically for:

[0225] Based on the boundary conditions of the magnetic field in the copper layer, the fundamental equations of the electromagnetic field in the copper layer are solved to obtain the current distribution in the copper layer.

[0226] Optionally, the loss determination unit 1003 is used to determine the winding losses of a high-frequency high-voltage planar transformer based on the copper layer current distribution, specifically for:

[0227] Based on the copper layer current distribution, determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer;

[0228] The overall current corresponding to the high-frequency high-voltage planar transformer is determined based on the induced current and the excitation current.

[0229] Determine the winding losses of the high-frequency high-voltage planar transformer based on the overall current.

[0230] It should be noted that the high-frequency high-voltage planar transformer winding loss assessment device provided in the above embodiments is only illustrated by the division of the above functional modules when performing the high-frequency high-voltage planar transformer winding loss assessment method. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the high-frequency high-voltage planar transformer winding loss assessment device and the high-frequency high-voltage planar transformer winding loss assessment method embodiments provided in the above embodiments belong to the same concept, and the implementation process is detailed in the method embodiments, which will not be repeated here.

[0231] In summary, the apparatus provided in this disclosure determines the winding magnetic field boundary conditions based on the winding current distribution characteristics by a condition determination unit; determines the copper layer current distribution based on the winding magnetic field boundary conditions by a distribution determination unit; and determines the winding losses of the high-frequency high-voltage planar transformer based on the copper layer current distribution by a loss determination unit. Therefore, by determining the copper layer current distribution based on the winding magnetic field boundary conditions and calculating the winding losses of the high-frequency high-voltage planar transformer based on the copper layer current distribution, the winding losses can be calculated with higher accuracy when the magnetic field distribution of the high-frequency high-voltage planar transformer is affected by the skin effect and proximity effect, thus improving the accuracy of winding loss calculation.

[0232] The collection, storage, use, processing, transmission, provision, and disclosure of user personal information involved in the technical solution disclosed herein comply with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0233] According to embodiments of this disclosure, this disclosure also provides an electronic device, a readable storage medium, and a computer program product.

[0234] Figure 11 A schematic block diagram of an example electronic device 1100 that can be used to implement embodiments of the present disclosure is shown. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0235] like Figure 11 As shown, the electronic device 1100 includes a computing unit 1101, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 1102 or a computer program loaded into a random access memory (RAM) 1103 from a storage unit 1108. The RAM 1103 may also store various programs and data required for the operation of the electronic device 1100. The computing unit 1101, ROM 1102, and RAM 1103 are interconnected via a bus 1104. An input / output (I / O) interface 1105 is also connected to the bus 1104.

[0236] Multiple components in electronic device 1100 are connected to I / O interface 1105, including: input unit 1106, such as keyboard, mouse, etc.; output unit 1107, such as various types of displays, speakers, etc.; storage unit 1108, such as disk, optical disk, etc.; and communication unit 1109, such as network card, modem, wireless transceiver, etc. Communication unit 1109 allows electronic device 1100 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0237] The computing unit 1101 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 1101 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1101 performs the various methods and processes described above, such as the high-frequency high-voltage planar transformer winding loss assessment method. For example, in some embodiments, the high-frequency high-voltage planar transformer winding loss assessment method can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as storage unit 1108. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 1100 via ROM 1102 and / or communication unit 1109. When the computer program is loaded into RAM 1103 and executed by the computing unit 1101, one or more steps of the high-frequency high-voltage planar transformer winding loss assessment method described above can be performed. Alternatively, in other embodiments, the computing unit 1101 may be configured by any other suitable means (e.g., by means of firmware) to perform a high-frequency high-voltage planar transformer winding loss assessment method.

[0238] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0239] The program code used to implement the methods of this disclosure may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus, such that when executed by the processor or controller, the program code causes the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0240] In the context of this disclosure, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0241] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0242] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), the Internet, and blockchain networks.

[0243] Computer systems can include clients and servers. Clients and servers are generally geographically separated and typically interact via communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. A server can be a cloud server, also known as a cloud computing server or cloud host, a hosting product within the cloud computing service system that addresses the shortcomings of traditional physical hosts and VPS (Virtual Private Server) services, such as high management difficulty and weak business scalability. Servers can also be servers for distributed systems or servers incorporating blockchain technology.

[0244] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0245] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A method of evaluating winding losses of a high-frequency high-voltage planar transformer, characterized by, The high-frequency high-voltage planar transformer includes a high-voltage winding layer, a first low-voltage winding layer, a second low-voltage winding layer, a first isolation winding layer, a second isolation winding layer, and a magnetic core; wherein the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer are connected sequentially; the magnetic core passes through the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer, wherein the high-voltage winding layer, the first low-voltage winding layer, and the second low-voltage winding layer are multilayer printed circuit boards, the first isolation winding layer and the second isolation winding layer are two thickened printed circuit boards, the copper layer width in the multilayer printed circuit boards corresponding to the first low-voltage winding layer and the second low-voltage winding layer is greater than the copper layer width in the multilayer printed circuit board corresponding to the high-voltage winding layer, and the winding loss evaluation method includes: Based on the winding current distribution characteristics, the winding magnetic field boundary conditions are determined. Specifically, based on the high-voltage winding current distribution characteristics, the magnetic field distribution of the layer corresponding to the high-voltage winding and the low-voltage winding in the high-frequency high-voltage planar transformer is determined. Based on the magnetic field distribution, the overall winding magnetic field boundary conditions are determined. Based on the low-voltage winding current distribution characteristics, the winding excitation magnetic field boundary conditions are determined. Based on the overall winding magnetic field boundary conditions and the winding excitation magnetic field boundary conditions, the winding induced magnetic field boundary conditions are determined. The winding current distribution characteristics include both the high-voltage winding current distribution characteristics and the low-voltage winding current distribution characteristics. The winding magnetic field boundary conditions include both the overall winding magnetic field boundary conditions and the winding induced magnetic field boundary conditions. The copper layer current distribution is determined based on the winding magnetic field boundary conditions. Based on the copper layer current distribution, the winding losses of the high-frequency high-voltage planar transformer are determined.

2. The method according to claim 1, characterized in that, The step of determining the copper layer current distribution based on the winding magnetic field boundary conditions includes: The magnetic field boundary conditions of the copper layer are determined based on the winding magnetic field boundary conditions. The current distribution of the copper layer is determined based on the magnetic field boundary conditions of the copper layer.

3. The method according to claim 2, characterized in that, The step of determining the copper layer magnetic field boundary conditions based on the winding magnetic field boundary conditions includes: Determine the low-voltage winding parameters corresponding to the low-voltage winding in the high-frequency high-voltage planar transformer; Based on the low-voltage winding parameters and the winding magnetic field boundary conditions, the basic equations of electromagnetic fields in the copper layer and air are solved to determine the induced magnetic field distribution on the surface of each copper layer, thus obtaining the set of induced magnetic field distributions. The magnetic field boundary conditions of the copper layer are determined based on the set of induced magnetic field distributions.

4. The method according to claim 2, characterized in that, The step of determining the current distribution of the copper layer based on the magnetic field boundary conditions of the copper layer includes: Based on the magnetic field boundary conditions of the copper layer, the fundamental equations of the electromagnetic field in the copper layer are solved to obtain the current distribution of the copper layer.

5. The method according to claim 1, characterized in that, The step of determining the winding losses of the high-frequency high-voltage planar transformer based on the copper layer current distribution includes: Based on the copper layer current distribution, determine the induced current and excitation current corresponding to the high-frequency high-voltage planar transformer; The overall current corresponding to the high-frequency high-voltage planar transformer is determined based on the induced current and the excitation current. The winding losses of the high-frequency high-voltage planar transformer are determined based on the overall current.

6. A device for evaluating the winding loss of a high-frequency, high-voltage planar transformer, characterized in that, The high-frequency high-voltage planar transformer includes a high-voltage winding layer, a first low-voltage winding layer, a second low-voltage winding layer, a first isolation winding layer, a second isolation winding layer, and a magnetic core; wherein the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer are connected sequentially; the magnetic core passes through the first low-voltage winding layer, the first isolation winding layer, the high-voltage winding layer, the second low-voltage winding layer, and the second isolation winding layer, wherein the high-voltage winding layer, the first low-voltage winding layer, and the second low-voltage winding layer are multilayer printed circuit boards, the first isolation winding layer and the second isolation winding layer are two thickened printed circuit boards, and the copper layer width in the multilayer printed circuit boards corresponding to the first low-voltage winding layer and the second low-voltage winding layer is greater than the copper layer width in the multilayer printed circuit board corresponding to the high-voltage winding layer; the winding loss assessment device includes: The condition determination unit is used to determine the winding magnetic field boundary conditions based on the winding current distribution characteristics. Specifically, it determines the magnetic field distribution of the layer between the high-voltage and low-voltage windings in the high-frequency high-voltage planar transformer based on the high-voltage winding current distribution characteristics; determines the overall winding magnetic field boundary conditions based on the magnetic field distribution; determines the winding excitation magnetic field boundary conditions based on the low-voltage winding current distribution characteristics; and determines the winding induced magnetic field boundary conditions based on the overall winding magnetic field boundary conditions and the winding excitation magnetic field boundary conditions. The winding current distribution characteristics include both the high-voltage and low-voltage winding current distribution characteristics, and the winding magnetic field boundary conditions include both the overall winding magnetic field boundary conditions and the winding induced magnetic field boundary conditions. The distribution determination unit is used to determine the copper layer current distribution based on the winding magnetic field boundary conditions; The loss determination unit is used to determine the winding loss of the high-frequency high-voltage planar transformer based on the copper layer current distribution.

7. An electronic device, comprising: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-5.

8. A non-transitory computer-readable storage medium storing computer instructions, wherein, The computer instructions are used to cause the computer to perform the method according to any one of claims 1-5.

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