Radar system for detecting a surrounding and method for manufacturing a radar system

Abstract

This invention relates to a radar system for detecting the surrounding environment, comprising: - a circuit board carrying at least one high-frequency component having at least one element for direct transmission or reception; and - a molded part having one or more single antennas on its upper side for transmitting and / or receiving radar signals; - wherein the connection between at least one transmitting or receiving element of the high-frequency component and the at least one single antenna on the upper side of the molded part is at least partially achieved through an embedded hollow waveguide. The transmitting / receiving element of the high-frequency component transmits along the direction of the circuit board, and the circuit board is permeable to radar waves in this region. The molded part is electrically connected to the circuit board by soldering and / or conductive adhesive. The waveguide is input from a permeable portion of the circuit board, and the molded part is constructed of a single layer of at least partially metallized plastic components.

Description

Technical Field

[0001] This invention relates to a radar system for detecting the surrounding environment in motor vehicle applications. According to the invention, the radar system has a waveguide antenna and a high-frequency assembly with at least one element for direct transmission and reception, wherein the waveguide antenna and the high-frequency assembly are located on opposite sides of a circuit board, and the waveguide antenna is formed from the circuit board and a molding compound. Background Technology

[0002] More and more motor vehicles are equipped with driver assistance systems, which use sensor systems to detect the surrounding environment and, based on the identified traffic conditions, initiate automatic vehicle responses and / or provide instructions to the driver, especially issuing warnings. Here, comfort functions and safety functions are distinguished.

[0003] In current research and development, FSRA (Full Speed ​​Range Adaptive Cruise Control) plays an important role as a comfort function. When traffic conditions permit, the vehicle will adjust its inherent speed to the driver's preset desired speed; otherwise, it will automatically adjust its inherent speed to adapt to actual traffic conditions.

[0004] Meanwhile, safety features exist in various forms. One group forms functions designed to shorten the braking path or stopping path in emergency situations, up to autonomous emergency braking. Another group is lane change functionality: if a driver intends to make a dangerous lane change, i.e., if a vehicle in the adjacent lane is either in the driver's blind spot (known as BSD – “Blind Spot Detection”) or rapidly approaching from behind (LCA – “Lane Change Assist”), the lane change functionality will warn the driver or intervene with steering.

[0005] But in the foreseeable future, instead of simply assisting the driver, the vehicle will increasingly perform the driver's tasks autonomously, meaning that the driver will be increasingly replaced; this is known as autonomous driving.

[0006] Radar sensors are often used in conjunction with sensors of other technologies, such as camera sensors, in systems of the types described above. Radar sensors also offer the advantages of reliable operation even in adverse weather conditions and the ability to directly measure the radial relative velocity of an object via the Doppler effect, in addition to its distance from the object. Here, frequencies of 24 GHz, 77 GHz, and 79 GHz are typically used as the transmission frequencies.

[0007] As the functional scope of these systems continues to expand, the requirements are also increasing, especially the requirements for the maximum detection range. Meanwhile, the price is dropping dramatically.

[0008] In addition to detecting the surrounding environment of motor vehicles for the types of systems mentioned above, the focus is now shifting to monitoring the interior space of motor vehicles, such as identifying which seats are occupied; frequencies in the 60 GHz range are used here. To compete with other interior space monitoring technologies, the radar sensors used must be particularly inexpensive.

[0009] The core component of every radar sensor is the antenna; it largely determines the sensor's performance and price. Currently, antennas, such as patch antennas, are typically implemented on high-frequency circuit boards using planar technology. The disadvantages of this type of antenna implementation are, on the one hand, the losses of the feed line and the antenna itself (which limit the effective range), and on the other hand, the high cost of such circuit boards (especially because they require special substrates capable of operating at high frequencies, which are expensive and require complex processing).

[0010] A basic structure of a general-purpose radar sensor is known from DE 102018203106 A1. It overcomes the disadvantages of planar technology by using a plastic waveguide antenna and a high-frequency assembly with at least one element for direct transmission or reception. The waveguide antenna and the high-frequency assembly are located on opposite sides of a circuit board, and coupling between the high-frequency assembly and the waveguide antenna is achieved through the circuit board, for example, via simple holes in the circuit board. DE 102018203106 A1 does not describe how the waveguide antenna and the printed circuit board (PCB) can be easily and stably interconnected. Furthermore, the antenna exemplarily shown there has a built-in waveguide channel, meaning the antenna must consist of at least two layers. Summary of the Invention

[0011] The objective of this invention is to propose a simple, stable, and inexpensive structure based on existing technology (e.g., a general approach derived from DE 102018203106 A1).

[0012] This task is, in principle, solved using the radar system described below.

[0013] The advantage of this invention is that it can stably and easily realize radar systems with better performance, lower price, and smaller size.

[0014] The radar system for detecting the surrounding environment according to the present invention has the following features:

[0015] - A circuit board carrying at least one high-frequency assembly with at least one element for direct transmission or reception, and

[0016] - Molded component, the molded component having one or more single antennas on its upper side for transmitting and / or receiving radar signals,

[0017] - Wherein, the connection between at least one transmitting or receiving element of the high-frequency component and at least one single antenna on the upper side of the molded part is at least partially achieved through a built-in waveguide.

[0018] Furthermore, the present invention is characterized in that,

[0019] - At least one transmitting or receiving element of the high-frequency component is designed such that it transmits or receives from the direction of the circuit board.

[0020] - In the area of ​​at least one transmitting or receiving element, radar waves can penetrate the circuit board.

[0021] - The molded component is arranged on the side of the circuit board opposite to at least one high-frequency component, and is at least partially and electrically connected to the circuit board, particularly by soldering and / or conductive bonding.

[0022] - At least one hollow waveguide is formed through a recess on the side of the molded part facing the circuit board and the metallized surface of the circuit board.

[0023] - At least one waveguide is input through a penetrable point (or penetrable portion) on the circuit board, and

[0024] - Due to this structure, the molded part is made of or can be made of a single layer of at least partially metallized plastic.

[0025] Suitablely, the molded parts and circuit boards may be pressed together during the welding and / or bonding processes.

[0026] Here, pressing is preferably achieved by temporarily placed spring elements, such as clips and / or spring pins.

[0027] Alternatively, pressing can also be achieved using spring elements integrated into the molded part, which are preferably connected to the circuit board by pressing or clamping.

[0028] In addition, the molded part may have a rated bend point, through which the molded part is arranged or pressed onto the circuit board.

[0029] Solder beads used for soldering and which are part of the waveguide boundary are preferably arranged on the side of the molded part facing the circuit board.

[0030] Suitable positioning of the molded part parallel to the circuit board can be achieved through structures, such as tenons and pins in openings or holes protruding from the molded part into the circuit board.

[0031] According to a preferred design of the present invention, at least one portion (or point) of the circuit board that is permeable to radar waves is formed through a hole in the circuit board having metallized sidewalls.

[0032] One method to achieve at least one radar-penetrable portion of a circuit board is that there is no metallization on and / or between carrier material layers of the circuit board, and the portion is surrounded or enclosed by vias.

[0033] The solder beads are preferably arranged around at least one transmitting or receiving element on the underside of at least one high-frequency component, thereby reducing or preventing lateral escape of the beam in the space between the high-frequency component and the circuit board, and in particular, avoiding coupling between multiple transitions.

[0034] Suitably, the radar system may include components with good thermal conductivity, particularly covers made of metal, wherein the components are arranged on the same side of the circuit board as at least one high-frequency component. Furthermore, thermal contact can be established between the high-frequency component and the components, particularly by means of thermal paste.

[0035] According to an advantageous design of the invention, at least one component may be arranged on the side of the circuit board facing the molded part, wherein the component is covered by a cavity in the molded part, the surface of which is preferably metallized.

[0036] Furthermore, the present invention also includes a method for manufacturing a radar system according to the invention, wherein molded parts and circuit boards are pressed together during a welding process and / or an adhesive process.

[0037] Here, the pressing of the molded part and the circuit board is preferably achieved by temporarily placed spring elements, such as clips and / or spring pins, or by spring elements integrated into the molded part and preferably connected to the circuit board by pressing or clamping.

[0038] Because of the provided bend points, such as slots, notches and / or webs, the molded parts can be pressed onto the circuit board in a particularly simple manner. Attached Figure Description

[0039] Figure 1 The high-frequency circuit board of a radar system according to the prior art is shown.

[0040] Figure 2 The top (left) and bottom (right) sides of a square, plastic-based hollow conductor antenna are shown.

[0041] Figure 3 A cross-sectional view is shown through a radar sensor with direct transmission from the top of the high-frequency chip to the hollow conductor antenna.

[0042] Figure 4 A cross-sectional view of a radar sensor with direct transmission through an opening in the circuit board from the underside of the high-frequency chip to a hollow conductor antenna located on the opposite side of the circuit board is shown.

[0043] Figure 5 A cross-sectional view is shown of a radar sensor according to the invention, which directly transmits through an opening in a circuit board from the underside of a high-frequency chip to an opposite side of the circuit board and is formed by a hollow conductor antenna consisting of a single-layer molded part and at least partially metallized circuit board surface itself, wherein the molded part and the circuit board are at least partially electrically connected by soldering or bonding.

[0044] Figure 6 The molded part is shown from the side facing the circuit board.

[0045] Figure 7 This illustrates the temporary connection between the molded part and the circuit board via spring pins during the soldering or bonding process.

[0046] Figure 8 This illustrates a spring element integrated into the molded part for pressing the molded part and the circuit board together.

[0047] Figure 9 A molded part with a rated bend point is shown to facilitate the pressing of the molded part and the circuit board. Detailed Implementation

[0048] Today, the antennas of radar systems used to detect the surrounding environment are typically implemented as planar antennas on high-frequency circuit boards. Figure 1 A high-frequency circuit board is shown, featuring high-frequency components, a so-called MMIC (monolithic microwave integrated circuit), three transmit antennas (TX), and four receive antennas (RX), each consisting of multiple individual transmitters. The antennas are implemented as planar patch antennas.

[0049] The antenna and its feed line from the high-frequency chip require a special substrate on top of the high-frequency circuit board, with material data suitable for high frequencies (e.g., defined thickness, defined dielectric constant, extremely low loss angle, etc.). In particular, the material cost of this special substrate and its fabrication (also due to the required high structural precision) result in a higher cost compared to a purely low-frequency circuit board of the same size and number of layers. Besides cost, signal loss in the antenna and its feed line is also disadvantageous. For both the transmitting and receiving antennas, including the feed line, the total power loss is typically around 6 dB. This reduced sensor sensitivity results in a 30% reduction in the maximum sensor operating range.

[0050] Due to the aforementioned drawbacks of circuit board-based antennas, so-called waveguide antennas are increasingly being considered. Here, the antenna and its feed line are implemented using a hollow conductor, which in its simplest case represents a rectangular cavity with metal or metallized walls; hence, the name "hollow conductor antenna" is often used. This type of antenna can be implemented as a square plastic component and, for example, in… Figure 2 As shown in the image. Figure 2 As shown, there is an opening for transmission on the upper side and an opening for feeding on the lower side; the cavity structure extends within the plastic component, wherein all surfaces are metallized both internally and externally (for practical functionality, surface metallization is only necessary in the areas of the waveguide and a single antenna, but for ease of manufacturing, the entire surface is typically metallized); Figure 2 The image does not show a recessed area below the antenna for structural elements (especially high-frequency chips) located on a circuit board below, and for high-frequency lines leading to the structure transmitting into the hollow conductor antenna. Such antennas typically consist of at least two metallization layers to enable the built-in hollow conductor; cross-connections for high-frequency connections can also be achieved using three or more layers. Because the arrangement of multiple individual antennas is now independent of the chip, as... Figure 2 As shown, three transmitting antennas can, for example, be arranged below four receiving antennas (according to...). Figure 1 In circuit board-based antennas, they are arranged side by side. Because the chips are no longer located on the antenna plane, smaller sensors can be implemented.

[0051] Besides die casting, 3D printing is also being considered as a method for manufacturing plastic antennas. Compared to all-metal implementations, waveguide antennas made of surface-metallized plastic offer significant manufacturing and cost advantages. The challenges in plastic-based waveguide antennas lie in the required structural precision and accurate bonding of multiple plastic layers, but new manufacturing methods simultaneously make this possible.

[0052] However, even when using plastic antennas, high-frequency signals still exist on the circuit board, especially in the structure from the chip output to the hollow conductor antenna. Therefore, relatively expensive and complex circuit boards are used here as well. For this reason, such as... Figure 3 As shown, an attempt is made to transmit directly from the top of the high-frequency chip into the waveguide antenna. However, this method has some drawbacks:

[0053] - The transition from chip 3.6 to waveguide antenna 3.2 is tolerance-critical; the long tolerance chain includes, in particular, the following: chip soldering, chip thickness, and antenna tolerances;

[0054] - (Not only during production, but also throughout its lifespan) direct contact between the antenna and the chip may damage the chip;

[0055] - In addition to the silicon core 3.9 which contains high-frequency, low-frequency and digital circuits, the chip 3.6 requires not only the so-called redistribution layer 3.10 below, but also another redistribution layer 3.8 above for the emitter element 3.7;

[0056] - The chip's heat dissipation is poor because the plastic antenna 3.2 and the front plastic housing 3.1 are thermally insulated, so the chip's heat can only be dissipated through the circuit board 3.3. Therefore, the chip's thermal coupling with the metal sensor's rear side 3.5 via thermal paste 3.4 cannot be achieved directly, but can only be achieved through the circuit board.

[0057] To circumvent these drawbacks, a proposal has been put forward in DE 102018203106 A1. Figure 4 The general structure is as follows. The transmitting element 4.7 is now arranged below the chip 4.6, which is located on the side of the circuit board 4.3 opposite to the plastic antenna 4.2. The plastic antenna 4.2 originates from the chip 4.6 and is input through the circuit board 4.3, which is permeable to radar waves at these locations; therefore, the high-frequency transition from the chip 4.6 to the plastic antenna 4.2 is achieved through the circuit board 4.3.

[0058] like Figure 4 As shown, the permeability of the circuit board 4.3 can be simply achieved through the holes in the circuit board 4.3, wherein the sidewalls of the circuit board 4.3 are metallized at the location, thereby realizing a hollow conductor.

[0059] Another method for penetrable transitions in circuit boards, as proposed in DE 102018203106 A1, is to remove the metallization on or between the carrier material layers of the circuit board and to utilize vias around these areas.

[0060] To prevent the beam from escaping into the space between high-frequency components and the circuit board at the transition points, which would lead to power loss and coupling between transitions, solder balls can be placed around the transitions, and thus between them. For example, in Figure 4 This is illustrated in the diagram, where a chip 4.6 with solder balls 4.11 is shown, which is implemented as a so-called ball grid array. In a proper design and arrangement of these solder balls 4.11, the solder balls can represent a band-stop filter for the high frequencies used, and thus act as an EBG (electromagnetic bandgap) structure.

[0061] according to Figure 4 Another advantage of this arrangement is that it allows for good thermal contact with the chip 4.6, which has high power consumption and is therefore self-heating. For this purpose, as shown, the chip 4.6 is thermally coupled to a cover 4.5 on the rear side of the sensor via thermal paste 4.4, which may be at least partially made of aluminum and have heat sinks.

[0062] Such an external Figure 4As shown, component 4.12 can be mounted on the side of circuit board 4.3 facing the plastic antenna 4.2, and the component is covered by a cavity in the plastic antenna 4.2. Because the surface of the plastic antenna 4.2 will always be metallized, electrical shielding of the component can be achieved without increasing cost.

[0063] DE 102018203106 A1 does not explain how the plastic antenna is connected to the circuit board. Of particular importance is that in the feed region, there is no or only a very small air gap (less than 50 micrometers in the case of a 77 / 79 GHz radar system) between the antenna 4.2 and the circuit board 4.3, because otherwise this would, for example, lead to strong coupling between different antenna channels, and thus result in poor angle formation and / or reduced sensor sensitivity. Furthermore, the antenna exemplarily shown in DE 102018203106 A1 has a built-in waveguide channel, meaning the antenna must consist of at least two layers, according to… Figure 4 In the antenna, these two layers are labeled 4.21 and 4.22. To address or improve upon these two issues, the following implementation according to the present invention is proposed.

[0064] Figure 5 A waveguide antenna is shown, which is implemented by soldering or conductively bonding a single-layer molded part 5.2, the metal of which or at least partially of its surface is metallized, to a circuit board 5.3. Thus, three sides of the built-in hollow conductor 5.13 are implemented via the molded part, and the fourth side via a circuit board whose surface is metallized there. Roughly speaking, Figure 4 The lower antenna layer 4.22 is now replaced by circuit board 5.3; naturally, the waveguide slots in the molded part 5.2 must now have the full depth of the waveguide. Advantageously, only a single-layer molded part is needed, and according to... Figure 4 The antenna requires two molded parts; this leads to a significant reduction in price and a smaller structural size. The connection process used, namely welding or bonding, is also inexpensive; in the simplest case, the molded parts and electronic components are welded together in the same process, thus eliminating the need for additional process steps.

[0065] Figure 5 The structure of the molded part is shown only in a very simplified and schematic manner, and in particular, the forward-firing elements of the molded part are shown. Figure 6The structure of the molded part 6.2, viewed from the rear, is shown in greater detail. The shaded areas are the recesses of the waveguide 6.3 (oblique shade) and the component cavity 6.4 (grid shade). The white-marked slot 6.5 is the upward-facing notch, which itself is otherwise unstructured. The dotted surface 6.6 represents the additionally smooth rear side of the molded part. At the beginning of the waveguide 6.31, the feeding of the high-frequency component through the circuit board occurs. In the feeding region, the structure in the molded part can also be more complex to achieve better matching. In addition to the slot 6.5 shown, other structures, such as an upward-facing horn transmitter, can be implemented to couple the output from the antenna.

[0066] Conductive connections between the molded component 6.2 and the underlying circuit board should exist around the waveguide structure 6.3. Alternatively, point-to-point connections (typically less than 1 mm apart in 77 / 79 GHz radar systems) are sufficient as an alternative to a fully interconnected surface. A possible implementation is that the molded component, such as a chip, is equipped with solder balls on its underside and is soldered to the circuit board via these solder balls.

[0067] For welding or bonding, it is advantageous that the molded part is as flat as possible on the back side (only in non-recessed areas, of course). If the molded part is made of plastic using a die-casting method, then thermoplastic is the simplest and cheapest solution in manufacturing technology as a base material. However, the dimensional stability and, consequently, flatness achievable with thermoplastics, as well as their thermal expansion properties, are generally not optimal. Furthermore, thermoplastics are not particularly heat-resistant, which may lead to the need for a low-temperature soldering process when soldering the molded part to a circuit board, and therefore the soldering cannot be performed in the same process steps as electronic components (such as chips); that is, two separate soldering processes are required.

[0068] This drawback can be avoided by using thermoset plastics as the base material for the plastic; they provide dimensionally stable and heat-resistant die-cast molded parts, which also have very smooth surfaces, important for waveguides with the lowest possible loss (and for the "smoothness" of the surface, thick metallization layers are not required, but thin metallization layers are sufficient, which saves costs). The disadvantage of molded parts made of thermoset plastics is that their manufacturing is generally more complex.

[0069] In addition to plastic molded parts with metallized surfaces manufactured by die casting, other manufacturing methods and materials can be used; for example, manufacturing using 3D printing and / or using base materials of metal (e.g., aluminum die casting, with subsequent surface finishing if necessary).

[0070] If the molded part used is dimensionally stable, then soldering or bonding can be performed without pressing it onto the circuit board. To avoid lateral, i.e. parallel displacement of the molded part relative to the circuit board (i.e., to ensure sufficiently accurate lateral positioning), it is advantageous to have protruding tenons or pins on the underside of the molded part that extend into corresponding holes in the circuit board.

[0071] In molded parts where dimensions are less stable, it may be necessary to press the antenna onto the circuit board during soldering or bonding to achieve a sufficiently good solder joint around the waveguide structure 6.3. This can be achieved by pressing them together from above and below via a die.

[0072] Alternatively, this can be achieved by placing one or more spring elements before the welding or bonding process to press the molded part and antenna together, and then removing the spring elements after the welding or bonding process; in addition to clips, pins with spring elements can also be used here, which are pressed into the press-fit structure of the molded part from the rear through holes in the circuit board, wherein the spring elements apply force to the circuit board from the rear. Figure 7 An exemplary embodiment is shown, wherein the spring element therein is constituted by a common spring 7.6, which presses the head 7.5 of the pin 7.4 pressed into the molding 7.2 on one side and presses the circuit board 7.3 on the other side, thereby pressing the circuit board and the molding together. Figure 7 Only a fragment of the entire arrangement is shown.

[0073] Instead of temporarily placing separate spring elements for welding or bonding processes, these spring elements can also be implemented as components of the molded part itself. Therefore, Figure 8 An example is shown—a segment of a molded part 8.2 made of metallized plastic is shown above from the rear, and a cross-section through the molded part 8.2 and the circuit board 8.3 in the pressed state is shown below. A structure 8.4, achieved through cavities perforated on three sides, carries a rearwardly protruding tenon 8.5 pressed into a hole in the circuit board 8.3; a spring effect is achieved through the freely cut structure 8.4 on three sides and the use of an elastic plastic (e.g., made of thermoplastic); the notch for the freely cut structure 8.4 is labeled 8.6.

[0074] If the molded part is as elastic as possible, then compression is facilitated, which can be achieved through a rated bending point as specified in DE 102018213540B3. Figure 9 As exemplarily shown, the molded part may therefore have deep grooves 9.7 and / or notches 9.8 to achieve thin, resilient connections or webs between the various regions of the molded part; the grooves may be implemented from the rear side and / or the front side.

[0075] In molded parts made of plastic, it may be advantageous regarding the metallization process that the recesses for the hollow conductors are not simultaneously narrow and deep. In the simplest case, the hollow conductor is rectangular; therefore, it is advantageous that the wide side of the hollow conductor is parallel to the rear side, and the narrow side indicates or defines the recess. However, as long as the coupling points are close to each other (due to the smallest possible chip size), there may not be enough space in the coupling region through the holes in the circuit board from the chip for this orientation of the rectangular hollow conductor. Thus, a space-saving transition structure is needed.

[0076] Small and shallow hollow conductors can also be made in such a way that the cross-section of the hollow conductor is not rectangular, but has, for example, a longitudinally extending convex web in the middle of one of its long sides; in technical terms, this is called a "ridge waveguide".

[0077] So far, single-layer molded parts have been considered because they represent the cheapest variant. For complex antennas, such as those requiring waveguide crossings, at least one additional layer is needed. Preferably, the at least one additional layer is manufactured as a separate molded part with the same manufacturing process as the first molded part, and the connection between the at least one additional molded part and the first molded part is achieved in the same process steps as the connection between the first molded part and the circuit board (especially by soldering or conductive adhesive).

[0078] Finally, please note the following:

[0079] In radar systems, both transmission and reception are required. For simplicity, the above descriptions often do not explicitly implement or distinguish between these two scenarios. For example, the term "(transmit) radiation" in the context of an antenna or chip component naturally implies "reception" in a receiving antenna; and if "feed" is mentioned in the waveguide behind the antenna, it implies "coupled output" in the receiving antenna.

Claims

1. A radar system for detecting the surrounding environment, the radar system comprising: - A circuit board carrying at least one high-frequency component, the high-frequency component having at least one element for direct transmission or reception, and - Molded component, the molded component having one or more single antennas on its upper side for transmitting and / or receiving radar signals, - wherein, The connection between at least one transmitting or receiving element of the high-frequency component and at least one single antenna on the upper side of the molded part is at least partially achieved through a built-in waveguide. Its features are, - At least one transmitting or receiving element of the high-frequency component is designed such that it transmits or receives from the direction of the circuit board. - In the area of ​​at least one transmitting or receiving element, radar waves can penetrate the circuit board. - The molded component is disposed on the side of the circuit board opposite to at least one high-frequency component, and is at least partially electrically connected to the circuit board. - At least one hollow waveguide is formed through a recess on the side of the molded part facing the circuit board and the metallized surface of the circuit board. - At least one waveguide enters from a penetrable point on the circuit board, and - Due to this type of structure, the molded part is made of or can be made of a single layer of at least partially metallized plastic.

2. The radar system of claim 1, wherein, The molded part is electrically connected to the circuit board via welding and / or conductive adhesive.

3. The radar system according to claim 2, characterized in that, During the welding and / or bonding process, the molded parts and circuit boards are pressed together.

4. The radar system according to claim 3, characterized in that, The pressing is achieved by a temporarily placed spring element.

5. The radar system according to claim 4, characterized in that, The temporary spring element is a clip and / or a spring pin.

6. The radar system according to claim 3, characterized in that, The pressing is achieved by spring elements integrated into the molded part, which are connected to the circuit board.

7. The radar system according to claim 6, characterized in that, The spring element is connected to the circuit board by pressing or clamping.

8. The radar system according to any one of claims 1 to 7, characterized in that, The molded part has a rated bend point through which it can be arranged or pressed onto the circuit board.

9. The radar system according to claim 8, characterized in that, The rated bending point is in the form of a groove, a notch, and / or a web.

10. The radar system according to any one of claims 1 to 7, characterized in that, Solder beads, used for soldering and part of the waveguide boundary, are located on the side of the molded part facing the circuit board.

11. The radar system according to any one of claims 1 to 7, characterized in that, The positioning of the molded part parallel to the circuit board is achieved by tenons and / or pins in the openings or holes protruding from the molded part into the circuit board.

12. The radar system according to any one of claims 1 to 7, characterized in that, At least one portion of the circuit board that is permeable to radar waves is formed through a hole in the circuit board having metallized sidewalls.

13. The radar system according to any one of claims 1 to 7, characterized in that, One method for achieving at least one radar-wave-penetrable portion of a circuit board is that there is no metallization on and / or between carrier material layers of the circuit board, and the portion is surrounded by vias.

14. The radar system according to any one of claims 1 to 7, characterized in that, Solder beads are arranged around at least one transmitting or receiving element on the underside of at least one high-frequency component, thereby reducing or preventing lateral escape of the beam in the space between the high-frequency component and the circuit board.

15. The radar system according to any one of claims 1 to 7, characterized in that, It includes components with good thermal conductivity, wherein the components are arranged on the same side of the circuit board as at least one high-frequency component.

16. The radar system according to claim 15, characterized in that, The component is a cover made of metal.

17. The radar system according to claim 15, characterized in that, Thermal contact is established between the high-frequency component and the component using thermal grease.

18. The radar system according to any one of claims 1 to 7, characterized in that, At least one component is arranged on the side of the circuit board facing the molded part, wherein the component is covered by a cavity in the molded part.

19. The radar system according to claim 18, characterized in that, The surface of the cavity is metallized.

20. A method for manufacturing a radar system according to any one of claims 1 to 19, wherein, The molded part is electrically connected to the circuit board via welding and / or conductive adhesive, and the molded part and the circuit board are pressed together during the welding and / or adhesive process.

21. The method according to claim 20, characterized in that, The molding and the circuit board are pressed together by a temporarily placed spring element, or by a spring element integrated into the molding and connected to the circuit board.

22. The method according to claim 20 or 21, characterized in that, The molded part is pressed onto the circuit board through a rated bending point in the form of a slot, notch, and / or web.

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