An IC substrate inspection apparatus

Abstract

The application discloses an IC substrate detection device, which comprises a detection table and a detection mechanism fixed on the upper end of the detection table through a support, at least one detection station is arranged on the detection table, a to-be-detected IC substrate is arranged in the detection station, detection probes on the detection mechanism correspond to detection contacts of the to-be-detected IC substrate, when the to-be-detected IC substrate is placed in the detection station and clamped, the detection probes move towards the detection contacts and contact the detection contacts to perform detection, and a detection probe fine adjustment mechanism is further arranged between the detection mechanism and the detection table. The application utilizes the mode of extruding and clamping the IC substrate to realize the ejection and retraction of the probes, the detection of the detection probes can be fine adjusted in distance each time, the clamping and ejection structure is utilized, and the integrated multi-point contact detection mode can be realized.

Description

Technical Field

[0001] This invention relates to the field of IC substrates, and more specifically to an IC substrate testing device. Background Technology

[0002] An IC substrate is a miniature electronic device or component. Using specific processes, transistors, diodes, resistors, capacitors, inductors, and interconnections required for a circuit are fabricated on one or more small pieces of semiconductor wafer or dielectric substrate, and then packaged in a housing to form a miniature structure with the desired circuit function. All components are structurally integrated, representing a significant step forward in miniaturization, low power consumption, and high reliability of electronic components. During the production process, IC substrates require testing, necessitating the use of IC substrate testing devices. Current testing devices utilize a lifting structure to press a testing head onto the IC substrate placed on a testing platform for inspection.

[0003] Currently, there are many IC testing devices on the market. These devices use a downward-pressing test probe to contact the test contacts on the substrate. If the indicator light illuminates, it means the corresponding IC substrate is working properly; if the light does not illuminate, it means the IC substrate is defective. However, during the vertical pressing of the test probe, although it is designed to make vertical contact with the test contacts, a slight offset often occurs. For example, the position of the test contacts may shift. This slight offset can cause poor contact between the test probe and the test contacts, resulting in the indicator light not illuminating. In such cases, the IC substrate may be mistakenly judged as defective. In addition, test probes exposed to the elements for extended periods are prone to bending due to various external factors. Furthermore, a driving mechanism for pressing down the test probe and a clamping mechanism for clamping the IC substrate are required, making the structure very complex. Summary of the Invention

[0004] The technical problem to be solved by this invention is an IC substrate testing device. By squeezing and clamping the IC substrate, the probe is ejected and retracted. It can simultaneously clamp the IC substrate and eject the testing probe, simplifying the overall structure while hiding the probe and having the function of correcting the micro-deformation of the probe. In addition, this invention can make fine adjustments to the distance of each testing probe test, also using the above-mentioned clamping and ejection structure, to achieve an integrated multi-point contact testing method, effectively avoiding inaccurate testing results due to insufficient contact.

[0005] The present invention is achieved through the following technical solution: an IC substrate testing device, including a testing stage and a testing mechanism fixed on the upper end of the testing stage by a bracket. The testing stage is provided with at least one testing station. The IC substrate to be tested is placed in the testing station. The testing probe on the testing mechanism corresponds to the testing contact of the IC substrate to be tested. When the IC substrate to be tested is placed in the testing station and clamped, the testing probe moves toward the testing contact and makes contact with the testing contact to perform testing. A testing probe fine-tuning mechanism is also provided between the testing mechanism and the testing stage.

[0006] As a preferred technical solution, an ejector cylinder is fixedly installed at one end of the outer side of the testing station. The output end of the ejector cylinder is connected to a fixed box. An elastic air reservoir is embedded in the fixed box at the end opposite to the ejector cylinder. A first connecting pipe and a second connecting pipe are connected and communicated between the top of the fixed box and the elastic air reservoir. The first connecting pipe has two branches that are respectively connected and communicated with the ejector mechanism at the top of the testing mechanism. The second connecting pipe is connected and communicated with an ejector air reservoir. The other end of the elastic air reservoir contacts and supports the side of the IC substrate to be tested. The other end of the IC substrate to be tested contacts and supports the testing station.

[0007] As a preferred technical solution, multiple support rods are arranged side by side on the testing station of the testing platform. Each support rod is equipped with a support block made of rubber material. The IC substrate to be tested is placed flat on the support block. A support pad is provided at the end of the testing platform away from the ejector cylinder. One end of the support pad contacts and supports one side of the IC substrate to be tested. The support pad is made of hard rubber material.

[0008] As a preferred technical solution, the bottom of the fixing box is provided with a guide slider, and the detection platform is provided with a support panel at the position corresponding to the fixing box. The support panel is provided with a guide groove at the position corresponding to the guide slider, and the guide slider is snapped into the guide groove.

[0009] As a preferred technical solution, the testing mechanism includes a testing box, inside which is a testing inner box. One or more testing probes are arranged in the testing inner box and partially extend to the lower end face of the testing inner box. The top of one or more testing probes is fixedly mounted on a floating plate. The floating plate is floatingly arranged in the testing inner box. The top of the testing box is provided with two ejection mechanisms, and the output ends of the ejection mechanisms are all connected and fixed to the top of the floating plate.

[0010] As a preferred technical solution, the ejection mechanism includes an ejection box, a sealing piston is provided inside the ejection box, the top of the sealing piston forms an air inlet chamber, one side of the air inlet chamber is connected to the first connecting pipe, a connecting rod is fixedly installed at the bottom of the sealing piston, the other end of the connecting rod is fixedly connected to the upper surface of the floating plate, the connecting rod moves through a limiting baffle, the outer side of the limiting baffle is fixedly connected to the inner wall of the ejection box, a spring is fitted on the outside of the connecting rod located between the limiting baffle and the sealing piston, the spring lifts the sealing piston and makes the floating plate located at the top of the detection inner box.

[0011] As a preferred technical solution, a probe hole is opened at the bottom of the inner box corresponding to the position of the detection probe, and a silicone ring is provided on the inner wall of the probe hole, through which the detection probe passes.

[0012] As a preferred technical solution, the detection probe fine-tuning mechanism includes an ejector airbag arranged on one side of the detection inner box, a first solenoid valve installed on the first connecting pipe, and a second solenoid valve installed on the second connecting pipe. Gas is squeezed into the ejector airbag by squeezing the elastic storage airbag, and the ejector airbag is used to push the detection inner box to realize the horizontal distance adjustment of the detection inner box. The first solenoid valve, the second solenoid valve, and the ejector cylinder are all controlled by the control host set on the top of the detection box.

[0013] As a preferred technical solution, a gap relief cavity is formed between the detection inner box and the detection box at the farthest end of the ejection airbag, and a support spring is provided in the gap relief cavity.

[0014] As a preferred technical solution, a detection indicator light is provided on the top of the control host.

[0015] The beneficial effects of the present invention are as follows: First, the present invention provides an elastic air storage bag on one side of the IC substrate to be tested. The structure of the elastic air storage bag is used to clamp the IC substrate to be tested during testing. While clamping, the squeezed-out gas can be used to push out the test probe. This eliminates the need for the pressure driving mechanism of the test probe, simplifies the overall structure, and the clamping with the IC substrate to be tested can be more flexible. The elastic air storage bag protects the side of the IC substrate to be tested.

[0016] Second, when not in use, each detection probe can be retracted into the detection inner box, so that the detection probe is not exposed when not in use, preventing the detection probe from being deformed by impact. At the same time, with each retraction and ejection of the detection probe, there is a corrective function for the detection probe.

[0017] Third, the present invention has a detection probe fine-tuning mechanism, which can use the air source inside the elastic air bladder to adjust the detection probe in the detection position, effectively avoiding misjudgment caused by poor contact between the probe and the detection contact point, and increasing the detection accuracy. At the same time, the detection probe fine-tuning mechanism uses the structure of the elastic air bladder, making the overall structure design simpler and more reasonable. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 For the present invention Figure 1 A magnified view of a section at point A in the middle;

[0021] Figure 3 This is a schematic diagram of the structure during testing of the present invention;

[0022] Figure 4 This is a simplified illustration of the testing process for the present invention. Figure 1 ;

[0023] Figure 5 This is a simplified illustration of the testing process for the present invention. Figure 2 ;

[0024] Figure 6 This is a simplified illustration of the testing process for the present invention. Figure 3 ;

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Detection box; 2. Inner detection box; 3. Detection probe; 6. Second connecting tube; 7. Second solenoid valve; 8. Ejection box; 9. Sealing piston; 11. Floating plate; 12. First connecting tube; 13. Ejection cylinder; 14. Fixing box; 15. Elastic air reservoir; 16. Detection stage; 17. Support panel; 18. IC substrate to be tested; 19. Support block; 21. Support rod; 22. First solenoid valve; 23. Support cushion; 24. Detection contact; 25. Air inlet chamber; 26. Spring; 27. Connecting rod; 28. Limiting baffle; 30. Gap relief chamber; 31. Control host; 32. Detection indicator light; 33. Ejection air reservoir. Detailed Implementation

[0027] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0028] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0029] like Figure 1 As shown, an IC substrate testing device of the present invention includes a testing stage 16 and a testing mechanism fixed on the upper end of the testing stage 16 by a bracket. The testing stage 16 is provided with at least one testing station. The IC substrate 18 to be tested is placed in the testing station. The testing probe 3 on the testing mechanism corresponds to the testing contact 24 of the IC substrate 18 to be tested. When the IC substrate 18 to be tested is placed in the testing station and clamped, the testing probe 3 moves toward the testing contact 24 and makes contact with the testing contact 24 to perform testing. A fine-tuning mechanism for the testing probe 3 is also provided between the testing mechanism and the testing stage 16.

[0030] The testing platform 16 has an ejector cylinder 13 fixedly installed at one end of its exterior. The output end of the ejector cylinder 13 is connected to a fixed box 14. An elastic air reservoir 15 is embedded in the fixed box 14 at the end opposite to the ejector cylinder 13. The top of the fixed box 14 is connected to the elastic air reservoir 15 by a first connecting pipe 12 and a second connecting pipe 6. The first connecting pipe 12 has two branches that are connected to the ejector mechanism at the top of the testing mechanism. The second connecting pipe 6 is connected to the ejector air reservoir. The other end of the elastic air reservoir 15 contacts and supports the side of the IC substrate 18 to be tested. The other end of the IC substrate 18 contacts and supports the testing platform 16. When testing is required, the ejector cylinder 13 is ejected, and the elastic air reservoir 15 on one side of the fixed box 14 moves toward the IC substrate 18 to be tested and clamps it, thereby squeezing the gas in the elastic air reservoir 15 and clamping both sides of the IC substrate 18 to be tested.

[0031] The testing station of the testing table 16 has multiple support rods 21 arranged side by side. Each support rod 21 is equipped with a support block made of rubber material. The IC substrate 18 to be tested is placed flat on the support block. A support pad 23 is provided on the testing table 16 at the end away from the ejector cylinder 13. One end of the support pad 23 contacts and supports one side of the IC substrate 18 to be tested. The support pad 23 is made of hard rubber material. During testing, the IC substrate 18 to be tested is placed on the multiple support rods 21 by the operator. The support pad 23 supports one side of the IC substrate 18 to be tested. The ejector cylinder 13 and the elastic air bladder 15 are used to clamp the other side of the IC substrate 18 to be tested, thus completing the positioning and clamping of both sides.

[0032] In order to achieve smooth operation of the fixed box 14 during ejection and retraction, a guide slider is provided at the bottom of the fixed box 14. A support panel 17 is provided on the detection table 16 at the position corresponding to the fixed box 14. A guide groove is provided on the support panel 17 at the position corresponding to the guide slider. The guide slider is snapped into the guide groove.

[0033] like Figure 1 and Figure 2 As shown, the detection mechanism includes a detection box 1, inside which is a detection inner box 2. One or more detection probes 3 are arranged in the detection inner box 2 and partially extend to the lower end face of the detection inner box 2. The top of the one or more detection probes 3 is fixedly mounted on a floating plate 11. The floating plate 11 is floatingly arranged in the detection inner box 2. The top of the detection box 1 is provided with two ejection mechanisms. The output ends of the ejection mechanisms are all connected and fixed to the top of the floating plate 11. Since the detection probes 3 are telescopically mounted in the detection inner box 2, the left and right movement of the detection inner box 2 can adjust the contact position of the detection probes 3 relative to the detection contact 24. The telescopic detection probes 3 can perform a correction action each time they are extended or retracted, preventing the probes from being slightly deformed due to excessive pressure during detection.

[0034] like Figure 2As shown, the ejection mechanism includes an ejection box 8, inside which a sealing piston 9 is disposed. The top of the sealing piston 9 forms an air inlet chamber 25, and one side of the air inlet chamber 25 is connected to the first connecting pipe 12. A connecting rod 27 is fixedly installed at the bottom of the sealing piston 9, and the other end of the connecting rod 27 is fixedly connected to the upper end face of the floating plate 11. The connecting rod 27 moves through a limiting baffle 28, and the outer side of the limiting baffle 28 is fixedly connected to the inner wall of the ejection box 8. The connecting rod 27 located between the limiting baffle 28 and the sealing piston 9 is externally fitted with a sleeve. A spring 26 pushes up the sealing piston 9, causing the floating plate 11 to be at the top of the inner detection box 2. When the elastic air bladder 15 is compressed, gas enters the air inlet chamber 25 of the ejection box 8 through the first connecting pipe 12. At this time, the sealing piston 9 is pushed, the spring 26 is compressed, the connecting rod pushes out the floating plate 11, and then pushes out each detection probe 3. The detection probe 3 moves toward the detection contact 24 and makes contact, finally achieving the purpose of detection. After the detection is completed, the elastic air bladder 15 is reset, the spring 26 is reset, and the detection probe 3 retracts.

[0035] In this case, a probe hole is opened at the bottom of the inner box 2 corresponding to the position of the probe 3. A silicone ring is provided on the inner wall of the probe hole. The probe 3 passes through the silicone ring, which protects the probe 3 and makes the contact tighter.

[0036] The fine-tuning mechanism of the detection probe 3 includes an ejector airbag arranged on one side of the inner detection box 2. A first solenoid valve 22 is installed on the first connecting pipe 12, and a second solenoid valve 7 is installed on the second connecting pipe 6. Gas is squeezed into the ejector airbag by squeezing the elastic storage airbag 15, and the ejector airbag is used to push the inner detection box 2 to adjust the distance of the inner detection box 2 in the horizontal direction. The first solenoid valve 22, the second solenoid valve 7, and the ejector cylinder 13 are all controlled by the control host 31 located on the top of the detection box 1. A gap relief cavity 30 is formed between the inner detection box 2 at the farthest end of the ejector airbag and the detection box 1. A support spring 26 is installed in the gap relief cavity 30. A detection indicator light 32 is installed on the top of the control host 31. When the detection indicator light 32 is lit, it means that the IC substrate 18 product under test is qualified, otherwise it is unqualified.

[0037] During operation, the default setting is that the detection probe 3 is aligned with the center of the detection contact 24 offset by one point. Figure 4 In the state shown, the second solenoid valve 7 is closed, the first solenoid valve 22 is open, the ejector cylinder 13 ejects, and gas enters the intake chamber 25 through the first connecting pipe 12, thereby pushing the sealing piston 9 and the connecting rod 27, and vertically pushing the detection probe 3 to contact the detection contact 24 for detection, thus completing the detection. Figure 3As shown, if the detection indicator light 32 is lit, it means that the IC substrate 18 under test is qualified; otherwise, it is unqualified. If the detection indicator light 32 is not lit, a second test is required. That is, the retracted part of the ejector bag is pushed out, so that part of the gas flows back into the elastic storage bag 15. At this time, the first solenoid valve 22 is closed and the second solenoid valve 7 is opened. At this time, the second connecting pipe 6 is open, controlling the ejector bag to eject a small amount of gas. In order to increase the amount of ejected gas, a flow valve can be connected to the second connecting pipe 6. After the set gas flow rate is pushed out, the ejector bag expands slightly, thereby pushing the detection inner box 2. The detection inner box 2 moves towards the gap relief cavity 30, and the support spring 26 is compressed. At this time, the detection probe 3 will adjust its position relative to the detection contact 24, such as... Figure 5 As shown, at this time, the second solenoid valve 7 is closed, the first solenoid valve 22 reopens, and the ejector cylinder 13 ejects again, causing the detection probe 3 to continue contacting the detection contact 24, completing the detection. If the detection indicator light 32 does not light up, the above steps are repeated. Figure 6 As shown, if the test indicator light 32 lights up, it means the test is qualified and no further test is required.

[0038] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An IC substrate testing device, characterized in that: The device includes a testing platform (16) and a testing mechanism fixed on the upper end of the testing platform (16) by a bracket. The testing platform (16) has at least one testing station. The IC substrate (18) to be tested is placed in the testing station. The testing probe (3) on the testing mechanism corresponds to the testing contact (24) of the IC substrate (18) to be tested. When the IC substrate (18) to be tested is placed in the testing station and clamped, the testing probe (3) moves toward the testing contact (24) and makes contact with the testing contact (24) to perform testing. A testing probe (3) fine-tuning mechanism is also provided between the testing mechanism and the testing platform (16). An ejector cylinder (13) is fixedly installed at one end of the outer side of the testing platform (16). The output end of the ejector cylinder (13) is connected to a fixed box (14). An elastic air reservoir (15) is embedded in the fixed box (14) at the end opposite to the ejector cylinder (13). A first connecting pipe (12) and a second connecting pipe (6) are connected and communicated between the top of the fixed box (14) and the elastic air reservoir (15). The first connecting pipe (12) is divided into two branches and connected and communicated with the ejector mechanism at the top of the testing mechanism. The second connecting pipe (6) is connected and communicated with an ejector air reservoir. The other end of the elastic air reservoir (15) contacts and supports the side of the IC substrate (18) to be tested. The other end of the IC substrate (18) to be tested contacts and supports the testing platform (16). Multiple support rods (21) are arranged side by side on the testing station of the testing table (16). Each support rod (21) is provided with a support block made of rubber material. The IC substrate (18) to be tested is placed flat on the support block. A support pad (23) is provided on the testing table (16) at the end away from the ejection cylinder (13). One end of the support pad (23) contacts and supports one side of the IC substrate (18) to be tested. The support pad (23) is made of hard rubber material. The bottom of the fixed box (14) is provided with a guide slider, and the detection table (16) is provided with a support panel (17) corresponding to the fixed box (14). The support panel (17) is provided with a guide groove corresponding to the guide slider, and the guide slider is snapped into the guide groove. The testing mechanism includes a testing box (1), and a testing inner box (2) is provided inside the testing box (1). One or more testing probes (3) are arranged in the testing inner box (2) and partially extend to the lower end face of the testing inner box (2). The top of one or more testing probes (3) is fixedly installed on a floating plate (11). The floating plate (11) is floatingly arranged in the testing inner box (2). The top of the testing box (1) is provided with two ejection mechanisms. The output ends of the ejection mechanisms are all connected and fixed to the top of the floating plate (11). The ejection mechanism includes an ejection box (8), a sealing piston (9) is provided inside the ejection box (8), an air inlet chamber (25) is formed at the top of the sealing piston (9), and one side of the air inlet chamber (25) is connected to the first connecting pipe (12). A connecting rod (27) is fixedly installed at the bottom of the sealing piston (9), and the other end of the connecting rod (27) is fixedly connected to the upper end face of the floating plate (11). The connecting rod (27) moves through a limiting baffle (28), and the outer side of the limiting baffle (28) is fixedly connected to the inner wall of the ejection box (8). A spring (26) is fitted on the outside of the connecting rod (27) between the limiting baffle (28) and the sealing piston (9). The spring (26) lifts the sealing piston (9) and makes the floating plate (11) located at the top of the detection inner box (2). A probe hole is opened at the bottom of the inner box (2) corresponding to the position of the detection probe (3). A silicone ring is provided on the inner wall of the probe hole, and the detection probe (3) passes through the silicone ring. The fine-tuning mechanism of the detection probe (3) includes an ejection airbag arranged on one side of the detection inner box (2), a first solenoid valve (22) installed on the first connecting pipe (12), and a second solenoid valve (7) installed on the second connecting pipe (6). By squeezing the elastic storage airbag (15), gas is squeezed into the ejection airbag, and the ejection airbag is used to push the detection inner box (2) to realize the horizontal distance adjustment of the detection inner box (2). The first solenoid valve (22), the second solenoid valve (7), and the ejection cylinder (13) are all controlled by the control host (31) set on the top of the detection box (1). A gap relief cavity (30) is formed between the detection inner box (2) at the farthest end of the ejection airbag and the detection box (1), and a support spring (26) is provided in the gap relief cavity (30); The top of the control host (31) is equipped with a detection indicator light (32).

Images