Display module and display device

Abstract

This invention provides a display module and display device, relating to the field of electronic display technology. The display module includes a display panel, a circuit board assembly, and a heat dissipation layer. The heat dissipation layer includes a first surface and a second surface disposed opposite to each other. The first surface is bonded to the back of the display panel. The heat dissipation layer has multiple bendable heat dissipation portions. Before the heat dissipation portions are bent, the heat dissipation layer is flat; after the heat dissipation portions are bent, the heat dissipation portions are fin-like and curved away from the display panel. The circuit board assembly is disposed on the second surface. The circuit board assembly is electrically connected to the display panel. The technical solution provided by this invention can ensure heat dissipation while maintaining the flatness and thinness of the entire display module and display device, and can effectively reduce transportation costs.

Description

Technical Field

[0001] This invention relates to the field of electronic display technology, and particularly to a display module and display device. Background Technology

[0002] Passive heat dissipation methods in related technologies typically involve attaching heat-dissipating materials to the surface of the heat source. Further, the heat-dissipating material is structurally designed to create heat sink fins to increase the heat dissipation area. However, these heat sink fins are usually integrally molded. Such integrally molded fins not only have low flatness, making them unsuitable for electronic display products with high surface flatness requirements, but they are also quite thick, often reaching centimeter levels in thickness, which does not align with current design principles for thin and light electronic display products. Furthermore, the thick, uneven heat sink fins also pose significant challenges to module bonding processes and transportation costs. Summary of the Invention

[0003] To address the problems in the prior art, this invention proposes a display module and display device that can ensure heat dissipation while maintaining the flatness and thinness of the entire display module and display device, and can effectively reduce transportation costs.

[0004] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0005] In a first aspect, embodiments of the present invention provide a display module, comprising: a display panel, a circuit board assembly, and a heat dissipation layer; the heat dissipation layer includes a first surface and a second surface disposed opposite to each other; the first surface is bonded to the back surface of the display panel; the heat dissipation layer has a plurality of bendable heat dissipation portions, and before the heat dissipation portions are bent, the heat dissipation layer is flat, and after the heat dissipation portions are bent, the heat dissipation portions are fin-shaped and raised away from the display panel; the circuit board assembly is disposed on the second surface; the circuit board assembly is electrically connected to the display panel.

[0006] In one possible implementation, it further includes: a support layer; the support layer includes a third surface and a fourth surface disposed opposite to each other, and the third surface and the fourth surface are both planar; the third surface is bonded to the back of the display panel; the fourth surface is bonded to the first surface.

[0007] In one possible implementation, both the heat dissipation layer and the support layer are metal layers.

[0008] In one possible implementation, the heat dissipation layer is an aluminum layer or a copper layer; the support layer is an aluminum layer or a copper layer.

[0009] In one possible implementation, both the surface of the heat dissipation layer and the surface of the support layer are anodized.

[0010] In one possible implementation, the display panel includes: a transparent protective layer, a polarizing layer, and a light-emitting layer disposed sequentially in a first direction; in the first direction, the transparent protective layer, the polarizing layer, the light-emitting layer, and the third surface are sequentially bonded together; the circuit board assembly is electrically connected to the light-emitting layer; wherein, the first direction is the direction along the display panel pointing towards the heat dissipation layer.

[0011] In one possible implementation, the transparent protective layer is made of glass; the transparent protective layer and the polarizing layer, as well as the polarizing layer and the luminescent layer, are bonded together using transparent optical adhesive; the luminescent layer and the third surface, as well as the fourth surface and the first surface, are bonded together using pressure-sensitive adhesive.

[0012] In one possible implementation, the light-emitting layer is bonded to the third surface, and the fourth surface is bonded to the first surface using a pressure-sensitive adhesive containing ceramic particles.

[0013] In one possible implementation, the circuit board assembly is electrically connected to the light-emitting layer via a flip-chip film.

[0014] In one possible implementation, the flip-chip film includes: a display driver chip, a flexible circuit board, and a support member; one end of the flexible circuit board is connected to the circuit board assembly, and the other end of the flexible circuit board is connected to the light-emitting layer; the display driver chip is disposed on the surface of the flexible circuit board near the second surface; a support member is fixed to the side of the display driver chip near the circuit board assembly and the side away from the circuit board assembly, respectively; the thickness of the support member is greater than the thickness of the display driver chip; the support member is supported between the flexible circuit board and the second surface.

[0015] In one possible implementation, the heat dissipation portion is disposed in a first predetermined area of ​​the second surface, the side of the circuit board assembly away from the wiring is attached to a second predetermined area of ​​the second surface, and there is no overlap between the first predetermined area and the second predetermined area; the second predetermined area is provided with a plurality of grooves, and the grooves are located between the second predetermined area and the circuit board assembly.

[0016] In one possible implementation, the heat dissipation portion is disposed in a first predetermined area of ​​the second surface, the circuit board assembly is disposed in a second predetermined area of ​​the second surface, and there is no overlap between the first predetermined area and the second predetermined area; the second predetermined area is provided with a plurality of bosses; the side of the circuit board assembly away from the wiring is fixedly connected to the bosses.

[0017] In one possible implementation, a release film is attached to the second side of the heat dissipation section before it is bent.

[0018] In one possible implementation, the heat dissipation section is obtained by punching or laser cutting the heat dissipation layer; the heat dissipation section is arranged in a rectangular array.

[0019] In one possible implementation, the heat dissipation portion is obtained by completely punching or laser cutting the heat dissipation layer in terms of thickness, or by partially punching or laser cutting the heat dissipation layer in terms of thickness.

[0020] In a second aspect, embodiments of the present invention provide a display device, comprising: a base, and a display module as described in any one of the embodiments of the first aspect; the display module is fixedly connected to the base.

[0021] In one possible implementation, the display module is bonded to the base, or the display module is riveted to the base.

[0022] This invention provides a display module and display device that dissipates heat by directly attaching a heat dissipation layer to the back of the display panel. This ensures the thinness of the heat dissipation layer and the flatness between the heat dissipation layer and the display panel, thereby guaranteeing the thinness and flatness of the entire display panel and display device. Furthermore, the heat dissipation layer has multiple bendable heat dissipation sections, which, when bent, become fin-like, increasing the heat dissipation area and enhancing the heat dissipation effect. Simultaneously, because the heat dissipation sections are bendable, and the heat dissipation layer is flat before bending, the heat dissipation fins can be formed again during the use of the display product. This effectively reduces the thickness of the transport tray and lowers transportation costs. Therefore, the technical solution provided by this invention can ensure heat dissipation while maintaining the flatness and thinness of the entire display module and display device, and effectively reduces transportation costs. Attached Figure Description

[0023] The scope of this invention can be better understood by reading the following detailed description of exemplary embodiments in conjunction with the accompanying drawings. The accompanying drawings are:

[0024] Figure 1 A schematic diagram of the structure of the display module provided in the embodiment of the present invention. Figure 1 ;

[0025] Figure 2 A schematic diagram of the structure of the display module provided in the embodiment of the present invention. Figure 2 ;

[0026] Figure 3 This is a schematic diagram of the second side of the heat dissipation layer of the display module provided in an embodiment of the present invention;

[0027] Figures 4A-4D This is a schematic diagram of the shape of the heat dissipation part in an embodiment of the present invention;

[0028] Figure 5 for Figure 2 Schematic diagram of section AA in the diagram;

[0029] Figure 6 for Figure 2 Schematic diagram of the BB section in the diagram;

[0030] Figure 7A This is a schematic diagram showing the state where the release film is attached to the second side in an embodiment of the present invention;

[0031] Figure 7B This is a schematic diagram showing the state of the second side after the release film has been peeled off in an embodiment of the present invention;

[0032] Figure 7C This is a schematic diagram showing the state of the heat dissipation part after being assistedly bent in an embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram of the display module after the heat dissipation part has been assistedly bent in an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures

[0035] 1-Display panel, 2-Circuit board assembly, 3-Heat dissipation layer, 31-First side, 32-Second side, 321-Heat dissipation unit, 4-Support layer, 41-Third side, 42-Fourth side, 11-Transparent protective layer, 12-Polarizing layer, 13-Light emitting layer

[0036] 5-Chip-on-chip, 51-Display driver chip, 52-Flexible circuit board, 53-Support component, 322-Groove

[0037] 323 - First predetermined area, 324 - Second predetermined area, 325 - Adhesive area, 14 - Transparent optical adhesive

[0038] 6-Release film Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the present invention clearer, the implementation method of the present invention will be described in detail below with reference to the accompanying drawings and embodiments, so that the process of how the present invention uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0040] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0041] Example 1

[0042] Compared to mobile phone displays, automotive environments demand significantly higher brightness, typically exceeding 800 nits, and sometimes even 1250 nits. This high brightness inevitably leads to increased heat generation. This heat accumulation keeps the light-emitting devices in a high-temperature environment for extended periods, shortening the display's lifespan. Improving the display driver circuitry and reducing power consumption are effective ways to minimize heat generation at its source. However, due to the high brightness requirements of the display, heat from the light-emitting devices, electronic components, and circuitry is still unavoidable. Therefore, it is necessary to implement external cooling measures to lower the display module's temperature.

[0043] Passive heat dissipation methods in related technologies typically involve attaching heat-dissipating materials to the surface of the heat source. Further, the heat-dissipating material is structurally designed to create heat sink fins to increase the heat dissipation area. However, these heat sink fins are usually integrally molded. Such integrally molded fins not only have low flatness, making them unsuitable for electronic display products with high surface flatness requirements, but they are also quite thick, often reaching centimeter levels in thickness, which does not align with current design principles for thin and light electronic display products. Furthermore, the thick, uneven heat sink fins also pose significant challenges to module bonding processes and transportation costs.

[0044] To address the aforementioned technical problems, embodiments of the present invention provide a display module, such as... Figure 1 As shown, the system includes a display panel 1, a circuit board assembly 2, and a heat dissipation layer 3. The heat dissipation layer 3 includes a first surface 31 and a second surface 32 disposed opposite to each other. The first surface 31 is attached to the back of the display panel 2. The heat dissipation layer 3 has multiple bendable heat dissipation portions 321. Before the heat dissipation portions 321 are bent, the heat dissipation layer 3 is flat; after the heat dissipation portions 321 are bent, they become fin-like structures that curve away from the display panel 1, forming heat dissipation fins. The unbent portions of the heat dissipation layer 3 form the heat dissipation layer substrate. The circuit board assembly 2 is disposed on the second surface 32 and is electrically connected to the display panel 1.

[0045] The aforementioned heat dissipation fins are composed of multiple fin-shaped heat dissipation parts 321. One end of each "fin" is connected to the heat dissipation layer substrate, and the other end is a free end. The fins are arranged at a certain angle to the heat dissipation layer substrate to ensure that the heat emitted by the display panel 1 can be conducted from one end of each "fin" to the other end, thereby achieving a better heat conduction effect.

[0046] In this embodiment, the circuit board assembly 2 can be a rigid circuit board or a flexible circuit board. Preferably, it is a rigid printed circuit board.

[0047] In this embodiment, electrical signals are conducted between the circuit board assembly 2 and the display panel 1. The circuit board assembly 2 is used to control the display panel 1, and it can also detect and receive various electrical signals from the display panel 1. External input signals can also be transmitted to the display panel 1 through the circuit board assembly 2.

[0048] In this embodiment, the heat dissipation layer 3 is used to dissipate heat from the display panel 1. It is made of a material with heat dissipation function and is directly attached to the back of the display panel 1. This ensures both the thinness of the heat dissipation layer 3 and the flatness between the heat dissipation layer 3 and the display panel 1, thereby guaranteeing the thinness and flatness of the entire display module. The heat dissipation layer 3 has multiple bendable heat dissipation sections 321. After being bent, the heat dissipation sections become fin-like, increasing the heat dissipation area and enhancing the heat dissipation effect. Furthermore, because the heat dissipation sections 321 can be bent, and the heat dissipation layer is flat before bending, the heat dissipation fins can be re-formed during the use of the display product. This effectively reduces the thickness of the transfer tray and lowers transportation costs.

[0049] In this embodiment, the heat dissipation part 321 is obtained by punching or laser cutting the heat dissipation layer 3, and the heat dissipation part 321 is arranged in a rectangular array, such as... Figure 3 , Figures 4A-4D As shown.

[0050] In the process of punching or laser cutting the heat dissipation layer 3 to obtain the heat dissipation part 321, the heat dissipation layer 3 can be completely punched or laser cut in thickness so that the first surface 31 and the second surface 32 are connected through the heat dissipation part 321; or, the heat dissipation layer 3 can be partially punched or laser cut in thickness so that the heat dissipation part 321 is only arranged on the second surface 32, and the first surface 31 remains a complete plane. In practical applications, the above two arrangement methods can be selected according to the requirements, and this embodiment does not impose specific limitations on them.

[0051] Specifically, such as Figure 3 As shown, the heat sink 321 is located in the central area of ​​the second surface 32, mainly to avoid the fixing area of ​​the circuit board assembly 2 of the display module and the reserved area for fixing with the assembly. Before assembly, the heat sink 321 and the second surface 32 are on the same plane. A release film 6 is attached to its surface to reduce mutual interference with the outside world. The heat sink 321 is obtained by punching or laser cutting. The cutting line is non-closed loop, with at least one side connected to the substrate to ensure that the heat sink 321 can be connected to the substrate after being bent, thus achieving the function of heat conduction. The cutting line can be of various shapes, such as a non-closed loop square, trapezoid, arc, etc. Figures 4A-4D As shown. The cutting lines can be arranged in a very regular pattern, such as... Figure 3 , Figures 4A-4DAs shown. The arrangement can also be adjusted according to the heat generation of the display module, with various combinations of cutting line shapes. Ensuring that the starting and ending points of the cutting lines for most heat dissipation units 321 are roughly in the same row or column facilitates the later bending of the heat dissipation units 321.

[0052] In practical applications, when the display panel 1 is a flexible panel, in order to effectively support the display panel 1, such as... Figure 2 As shown, the display module described in this embodiment further includes a support layer 4, which includes a third surface 41 and a fourth surface 42 disposed opposite to each other, and both the third surface 41 and the fourth surface 42 are planar. The third surface 41 is bonded to the back of the display panel 1, and the fourth surface 42 is bonded to the first surface 31.

[0053] In order to dissipate heat more effectively from the display panel 1, in this embodiment, both the heat dissipation layer 3 and the support layer 4 are made of metal.

[0054] Furthermore, to optimize the external heat dissipation capability of the display module, the metal materials of the aforementioned heat dissipation layer 3 and support layer 4 can preferably be aluminum or its alloys with low density and good thermal conductivity, or materials with a certain degree of toughness such as copper foil and stainless steel. In this embodiment, the heat dissipation layer 3 is preferably set as an aluminum layer or a copper layer, and the support layer 4 is also set as an aluminum layer or a copper layer. Since both aluminum and copper have good thermal conductivity, the support layer 4 can also have good heat dissipation function, thereby more effectively dissipating heat from the display panel 1. In this embodiment, the support layer 4 also has a light-shielding function, which enables the display module to have a better display effect.

[0055] Since conventional materials such as aluminum and copper have low thermal emissivity, which limits their thermal radiation capacity to a certain extent, this embodiment uses anodizing to treat the surfaces of both the heat dissipation layer 3 and the support layer 4, forming an oxide film on their surfaces to enhance their thermal radiation capacity. Of course, in addition to the above-mentioned anodizing process, an oxide film can also be deposited on the surfaces of the heat dissipation layer 3 and the support layer 4 through electrophoresis, printing, or other methods; this embodiment does not impose specific limitations on this.

[0056] In this embodiment, as Figure 5 and Figure 6 As shown, the display panel 1 includes: a transparent protective layer 11, a polarizing layer 12, and a light-emitting layer 13 sequentially disposed in a first direction, and in this first direction, the transparent protective layer 11, the polarizing layer 12, the light-emitting layer 13, and the third surface 41 are sequentially bonded together; wherein, the circuit board assembly 2 is electrically connected to the light-emitting layer 13. In this embodiment, the aforementioned first direction is the direction along the display panel 1 pointing towards the heat dissipation layer 3. Figure 5 and Figure 6 Specifically, this is manifested in a top-to-bottom direction.

[0057] In this embodiment, the transparent protective layer 11 is made of glass; the transparent protective layer 11 and the polarizing layer 12, and the polarizing layer 12 and the light-emitting layer 13 are bonded together using transparent optical adhesive 14 to allow light to pass through normally; the light-emitting layer 13 and the third surface 41, and the fourth surface 42 and the first surface 31 are bonded together using pressure-sensitive adhesive. The pressure-sensitive adhesive is typically black, as black pressure-sensitive adhesive has good light-shielding properties to ensure the display effect of the entire display module.

[0058] To improve the thermal conductivity of the material interface, in this embodiment, the light-emitting layer 13 is bonded to the third surface 41, and the fourth surface 42 is bonded to the first surface 31, using a pressure-sensitive adhesive containing ceramic particles. The thickness of the pressure-sensitive adhesive is set to 30–100 μm.

[0059] Specifically, the transparent protective layer 11 is a glass cover plate used to protect the polarizing layer 12 and the light-emitting layer 13 located beneath it. The light-emitting layer 13 includes all the light-emitting circuits and light-emitting materials required by the display panel 1 when displaying; the polarizing layer 12 may specifically include a polarizer and a quarter-wave plate, used to improve the contrast of the display panel 1.

[0060] In this embodiment, as Figure 5 and Figure 6 As shown, the circuit board assembly 2 is electrically connected to the light-emitting layer 13 via a chip-on-flex (COF) film 5.

[0061] See you again Figure 5 and Figure 6 The flip-chip film 5 includes a display driver chip 51, a flexible circuit board 52, and a support member 53. One end of the flexible circuit board 52 is connected to the circuit board assembly 2, and the other end is connected to the light-emitting layer 13. The display driver chip 51 is disposed on the surface of the flexible circuit board 52 near the second surface 32, and is used to drive the display panel 1. A support member 53 is fixed to both the side of the display driver chip 51 near the circuit board assembly 2 and the side away from the circuit board assembly 2, and the thickness of the support member 53 is greater than the thickness of the display driver chip 51. The support member 53 is supported between the flexible circuit board 52 and the second surface 32.

[0062] The support member 53 is used to protect the display driver chip 51 and prevent it from being damaged by colliding with the bottom surface of the heat dissipation layer 3.

[0063] In this embodiment, the display panel 1 is an OLED (Organic Light-Emitting Diode) display screen.

[0064] like Figure 5 , Figure 6 and Figure 8 As shown, in this embodiment, the heat dissipation part 321 is disposed in the first predetermined area 323 of the second surface 32, and the side of the circuit board assembly 2 away from the wiring is attached to the second predetermined area 324 of the second surface 32, and there is no overlap between the first predetermined area 323 and the second predetermined area 324. The second predetermined area 324 is provided with a plurality of grooves 322, and the grooves 322 are located between the second predetermined area 324 and the circuit board assembly 2. Alternatively, the second predetermined area 324 is provided with a plurality of bosses, and the side of the circuit board assembly 2 away from the wiring is fixedly connected to the bosses (not shown in the figure).

[0065] In this embodiment, a groove is cut into the second predetermined area 324 where the circuit board assembly 2 is disposed, or a boss is provided in the second predetermined area 324, and the circuit board assembly 2 is disposed on the boss. The purpose is to reduce the contact area between the heat dissipation layer 3 and the circuit board assembly 2, thereby reducing the heat transfer from the circuit board assembly 2 side to the display panel 1 side. The cross-section of the groove 322 or the boss can be rectangular or trapezoidal. Preferably, each groove 322 or each boss has the same shape. Furthermore, grooves can also be provided at the positions corresponding to the circuit board assembly 2 on the support layer 4 to further reduce the heat transfer from the circuit board assembly 2 side to the display panel 1 side.

[0066] To protect the second surface 32 of the heat dissipation layer 3 and prevent the heat dissipation part 321 from warping, in this embodiment, a release film 6 is attached to the second surface 32 of the heat dissipation part 321 before it is bent, such as... Figure 7A As shown.

[0067] Figure 5 and Figure 6 The diagrams show cross-sectional views of the heat sink 321 before and after bending. The display panel 1 is composed of a transparent protective layer 11, a polarizing layer 12, a light-emitting layer 13, a support layer 4, and a heat sink 3, which are sequentially bonded together. The thickness of the support layer 4 can be set to 0.2–1 mm, mainly influenced by the application configuration; the thickness of the heat sink 3 can be set to 0.1–0.5 mm. The circuit board assembly 2 is attached to the second surface 32 of the heat sink 3. The metal surface of the area where the circuit board assembly 2 is attached can be grooved or raised to reduce the contact area between the heat sink 3 and the circuit board assembly 2, thereby reducing heat transfer from the circuit board assembly 2 side to the display panel 1 side.

[0068] like Figure 5 As shown in the AA section, the second surface 32 of the heat dissipation layer 3 has no cutting lines in this area; its cross-section is a flat plane. For example... Figure 6The BB cross-section shown has a cutting line. After the heat dissipation portion 321 in this area is bent, it is arranged at a certain angle to the substrate of the heat dissipation layer 3. For example, this angle can be set to 45°, 60°, 90°, 120°, etc. Of course, in practical applications, it can be set to other angles according to specific needs. This embodiment does not impose specific limitations on this. To obtain better heat dissipation, in this embodiment, the angle is preferably 90°. Figure 6 As shown, the heat dissipation part 321 is not on the same plane as the substrate. The fins formed by bending the separated part along the cutting line are preferably set to be 90° with the original substrate surface. The hollowed-out area exposes the surface of the support layer 4, without blocking the heat radiation from the surface of the support layer 4. After the heat dissipation part 321 is arranged vertically, it forms heat dissipation fins, increases the area of ​​the two "hollowed-out areas", and improves the heat radiation capability of the display module.

[0069] In actual use, the heat sink 321 will not be deployed at the screen manufacturing stage, primarily to facilitate product module manufacturing and transportation. The heat sink 321 will be deployed during final assembly. Its main states are described below. Figures 7A-7C As shown. Figure 7A With the release film 6 attached, the heat dissipation layer 321 is effectively prevented from warping, ensuring that the support layer 4 and the heat dissipation layer 3 remain in a planar state during the manufacturing process. This facilitates smooth module bonding and optical debugging. During transportation, the heat dissipation layer 3 also remains in a planar state, identical to the transportation state without the heat dissipation layer 3, ensuring that the product is not damaged during transport. Figure 7B When the release film 6 has just been torn off, the residual stress in the heat dissipation part 321 will cause it to naturally warp at a certain angle, but this angle is not enough to make the heat dissipation part 321 vertical. Tearing off the release film 6 in the opposite direction of the warping of the heat dissipation part 321 will help to increase the warping angle of the heat dissipation part 321. Figure 7C To achieve the bent state of the heat dissipation part 321, a jig with a crossbar can be made to move in the opposite direction of the warping direction of the heat dissipation part 321, so that the heat dissipation part 321 stands upright at a large angle on the surface of the heat dissipation layer 3, thereby increasing its heat dissipation area.

[0070] Figure 8 This is a schematic diagram of the display module after the heat sink 321 has been assistedly bent. In areas where the heat sink layer 3 needs to be bonded or riveted to the assembly, no cutting is performed to reserve assembly areas. The bonding areas may also omit the heat sink layer 3, and the assembly can be directly connected to the support layer 4 as a structural component. In the circuit board assembly bonding area, the heat sink layer 3 can be cut out to reduce the contact area between the circuit board assembly and the display module.

[0071] In summary, to reduce the temperature of the display module, this invention employs a double-layer metal design. A first metal layer is bonded to the back of the display panel, primarily serving as a support, light shield, and heat conductor. A second metal layer, thinner than the first, is bonded to the side furthest from the first metal layer and features localized "windowing." After the display module is bonded, the metal sheets in the "windowing" areas can be bent to form heat dissipation fins arranged at an angle to the display panel, increasing heat dissipation speed. Both metal layers undergo anodizing to enhance their thermal radiation capacity, achieving rapid heat dissipation. The heat dissipation fins manufactured using this solution solve the problems of excessive thickness and complex module manufacturing and transportation associated with conventional heat dissipation fins. The heat dissipation fins designed using this solution are only deployed during assembly, effectively reducing the thickness of the transport pallet and lowering transportation costs and risks.

[0072] This invention provides a display module that dissipates heat by directly attaching a heat dissipation layer to the back of the display panel. This ensures the thinness of the heat dissipation layer and the flatness between the heat dissipation layer and the display panel, thereby guaranteeing the thinness and flatness of the entire display panel and display device. Furthermore, the heat dissipation layer has multiple bendable heat dissipation sections, which, when bent, form fins, increasing the heat dissipation area and enhancing the heat dissipation effect. Simultaneously, because the heat dissipation sections are bendable, and the heat dissipation layer is flat before bending, the heat dissipation fins can be formed again during the use of the display product. This effectively reduces the thickness of the transport tray and lowers transportation costs. Therefore, the technical solution provided by this invention can ensure heat dissipation while maintaining the flatness and thinness of the entire display module and display device, and effectively reduces transportation costs.

[0073] Example 2

[0074] Based on the above embodiment one, this embodiment of the invention also provides a display device, including: a base, and the display module provided in embodiment one; wherein the display module is fixedly connected to the base.

[0075] In this embodiment, the display module is bonded to the base, or the display module is riveted to the base.

[0076] Preferably, the display module is through Figure 8 The bonding area 325 shown is bonded to the base.

[0077] This invention provides a display module and display device that dissipates heat by directly attaching a heat dissipation layer to the back of the display panel. This ensures the thinness of the heat dissipation layer and the flatness between the heat dissipation layer and the display panel, thereby guaranteeing the thinness and flatness of the entire display panel and display device. Furthermore, the heat dissipation layer has multiple bendable heat dissipation sections, which, when bent, become fin-like, increasing the heat dissipation area and enhancing the heat dissipation effect. Simultaneously, because the heat dissipation sections are bendable, and the heat dissipation layer is flat before bending, the heat dissipation fins can be formed again during the use of the display product. This effectively reduces the thickness of the transport tray and lowers transportation costs. Therefore, the technical solution provided by this invention can ensure heat dissipation while maintaining the flatness and thinness of the entire display module and display device, and effectively reduces transportation costs.

[0078] This invention solves the problems of excessively thick conventional heat sink fins and the difficulties in module manufacturing and transportation. The "fins" in this design unfold only during assembly, ensuring good flatness and minimizing the overall thickness of the display module, thus not affecting the module manufacturing process. Furthermore, the thin and light design effectively reduces the thickness of the transport tray, lowering transportation costs and risks.

[0079] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0080] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0081] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0082] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0083] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed herein; however, the scope of protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A display module, characterized in that, include: The display panel, circuit board assembly, and heat dissipation layer; the heat dissipation layer includes a first side and a second side disposed opposite to each other; the first side is attached to the back of the display panel; the heat dissipation layer has a plurality of bendable heat dissipation portions, which are obtained by punching or laser cutting the heat dissipation layer; the heat dissipation portions are arranged in a rectangular array, and before the heat dissipation portions are bent, the heat dissipation layer is flat, and after the heat dissipation portions are bent, the heat dissipation portions are fin-shaped and raised away from the display panel; the circuit board assembly is disposed on the second side; the circuit board assembly is electrically connected to the display panel.

2. The display module according to claim 1, characterized in that, Also includes: A support layer; the support layer includes a third surface and a fourth surface disposed opposite to each other, and both the third surface and the fourth surface are planar. The third side is bonded to the back of the display panel; the fourth side is bonded to the first side.

3. The display module according to claim 2, characterized in that, Both the heat dissipation layer and the support layer are metal layers.

4. The display module according to claim 3, characterized in that, The heat dissipation layer is an aluminum layer or a copper layer; the support layer is an aluminum layer or a copper layer.

5. The display module according to claim 3, characterized in that, The surfaces of the heat dissipation layer and the support layer are both anodized.

6. The display module according to claim 2, characterized in that, The display panel includes: a transparent protective layer, a polarizing layer, and a light-emitting layer disposed sequentially in a first direction; in the first direction, the transparent protective layer, the polarizing layer, the light-emitting layer, and the third surface are sequentially bonded and connected; the circuit board assembly is electrically connected to the light-emitting layer; wherein, the first direction is the direction along the display panel pointing towards the heat dissipation layer.

7. The display module according to claim 6, characterized in that, The transparent protective layer is made of glass; the transparent protective layer and the polarizing layer, as well as the polarizing layer and the luminescent layer, are bonded together using transparent optical adhesive; the luminescent layer and the third surface, as well as the fourth surface and the first surface, are bonded together using pressure-sensitive adhesive.

8. The display module according to claim 7, characterized in that, The light-emitting layer is bonded to the third surface, and the fourth surface is bonded to the first surface using pressure-sensitive adhesive containing ceramic particles.

9. The display module according to claim 6, characterized in that, The circuit board assembly is electrically connected to the light-emitting layer via a flip-chip film.

10. The display module according to claim 9, characterized in that, The flip-chip film includes: a display driver chip, a flexible circuit board, and a support member; one end of the flexible circuit board is connected to the circuit board assembly, and the other end of the flexible circuit board is connected to the light-emitting layer; the display driver chip is disposed on the surface of the flexible circuit board near the second surface; a support member is fixed to the side of the display driver chip near the circuit board assembly and the side away from the circuit board assembly, respectively; the thickness of the support member is greater than the thickness of the display driver chip; the support member is supported between the flexible circuit board and the second surface.

11. The display module according to claim 1, characterized in that, The heat dissipation part is disposed in the first predetermined area of ​​the second surface, and the side of the circuit board assembly away from the wiring is attached to the second predetermined area of ​​the second surface, and there is no overlapping area between the first predetermined area and the second predetermined area; the second predetermined area is provided with a plurality of grooves, and the grooves are located between the second predetermined area and the circuit board assembly.

12. The display module according to claim 1, characterized in that, The heat dissipation part is disposed in a first predetermined area of ​​the second surface, the circuit board assembly is disposed in a second predetermined area of ​​the second surface, and there is no overlap between the first predetermined area and the second predetermined area; the second predetermined area is provided with a plurality of bosses; the side of the circuit board assembly away from the wiring is fixedly connected to the bosses.

13. The display module according to claim 1, characterized in that, A release film is attached to the second side of the heat dissipation part before it is bent.

14. The display module according to claim 11, characterized in that, The heat dissipation part is obtained by completely punching or laser cutting the heat dissipation layer in terms of thickness, or by partially punching or laser cutting the heat dissipation layer in terms of thickness.

15. A display device, characterized in that, include: The base, and the display module according to any one of claims 1-14; The display module is fixedly connected to the base.

16. The display device according to claim 15, characterized in that, The display module is bonded to the base, or the display module is riveted to the base.

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