A pin-fin heat sink and method for assembling the same
By designing an assembleable pin-fin radiator, utilizing a base plate and radiator modules, and combining pin-fin groups of different densities, the problem of the single structure of the existing radiator is solved, and flexible heat dissipation effects and cost savings are achieved.
Patent Information
- Application Number
- CN202310297361.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-24
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2043-03-24
AI Technical Summary
Existing pin-fin heat sinks have a single structure and cannot flexibly meet the heat dissipation requirements of different components, especially in the case of high power consumption or uneven heat flux density, resulting in poor heat dissipation effect.
An assembleable pin-fin heat sink is designed, which consists of a base plate and a heat sink module. The heat sink module includes a heat sink base plate and a heat sink pin-fin group. The heat sink module is arranged in a staggered or aligned manner and combined with pin-fin groups of different densities (a first-density pin-fin group and a second-density pin-fin group) to meet different heat dissipation requirements.
The radiator structure can be adjusted according to actual needs, the heat dissipation efficiency can be improved, the radiator reuse rate can be increased, the cost can be saved, local hot spots can be avoided, and the heat dissipation needs of different components can be adapted.