Method and apparatus for processing a metal foil

Abstract

The application relates to the technical field of metal foil processing, and particularly discloses a metal foil processing method and a processing device. The method is used for processing foil strips and comprises the following steps: rotating a feeding roller in a first direction, conveying a foil strip wound on the feeding roller into a deposition liquid in a deposition cavity to perform a deposition operation. After the deposition operation is completed, a monitoring module is used to measure the resistance value of the foil strip after the deposition operation, if the resistance value is not within a qualified threshold range, a re-deposition operation is performed on the foil strip, and then a winding roller is rotated in the first direction to recover the foil strip to the winding roller; otherwise, the winding roller is directly rotated in the first direction to recover the foil strip to the winding roller. With the above steps, the resistance value of the foil strip after the deposition operation can be monitored, and the foil strip with a resistance value not meeting the requirements can be adjusted again through the re-deposition operation on the unqualified foil strip, so that the deposition effect on the foil strip is guaranteed, and the processing yield of the metal foil is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of metal foil processing technology, and in particular to a metal foil processing method and processing apparatus. Background Technology

[0002] Embedded resistor foil is a common PCB component used in PCB manufacturing. Through the embedding process, embedded resistor foil can be placed into the inner layers of the PCB. These embedded resistor foils are small in size and their resistance values ​​can be set according to customer requirements. The resulting PCB is identical to a normal PCB, but the inner layers can accommodate a large number of resistors. This design saves considerable space for component placement on the top and bottom layers of the PCB, and therefore it is widely used in various types of PCBs.

[0003] However, the yield rate of embedded resistive metal foil is difficult to guarantee. Currently, a common method involves using a production line system with multiple rollers to transport the foil strip along a predetermined track. As it passes through the deposition chamber, the resistance of the foil strip is altered by immersion and adhesion in the deposition solution. During this process, the resistance value of the deposited foil strip is unpredictable. If the resistance value does not meet the requirements, the embedded resistive metal foil cannot function properly on the PCB board, rendering the entire PCB board unusable and significantly impacting PCB production volume and yield. Therefore, solving the yield rate problem of metal foil is crucial for the future development of this field. Summary of the Invention

[0004] The purpose of this invention is to provide a metal foil processing method and processing apparatus to solve the problem of low metal foil yield.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A method for processing metal foil strips includes the following steps:

[0007] S10. Rotate the feeding roller around the first direction to convey the foil strip wound on the feeding roller to the deposition liquid in the deposition chamber for deposition operation;

[0008] S20. After the deposition operation is completed, the resistance value of the foil strip after the deposition operation is measured using the monitoring module. If the resistance value is not within the qualified threshold range, proceed to step S30; otherwise, proceed to step S40.

[0009] S30. Perform a redeposition operation on the foil strip, and then proceed to step S40;

[0010] S40. Rotate the take-up roller to recycle the foil strip onto the take-up roller.

[0011] As a preferred technical solution for the metal foil processing method, the monitoring module includes a scanning unit and a computing unit, and step S20 includes the following detailed steps:

[0012] S21. Detect the volume of the resistive layer formed by the deposition operation using the scanning unit;

[0013] S22. The arithmetic unit calculates the resistance value of the resistive layer based on the volume of the resistive layer.

[0014] S23. Compare the resistance value with the qualified threshold. If the resistance value is not within the qualified threshold range, proceed to step S30; otherwise, proceed to step S40.

[0015] As a preferred technical solution for the metal foil processing method, step S30 includes the following detailed steps:

[0016] S31. Rotate the feeding roller around the second direction to move the foil strip whose resistance value is not within the qualified threshold range back to the front of the deposition chamber;

[0017] S32. Rotate the feeding roller again around the first direction so that the foil strip is fed into the deposition chamber again for deposition operation;

[0018] S33. After the deposition operation is completed, the resistance value of the foil strip after the deposition operation is measured using the monitoring module. If the resistance value is not within the qualified threshold range, return to step S31; otherwise, proceed to step S40.

[0019] As a preferred technical solution for the metal foil processing method, step S30 includes the following detailed steps:

[0020] S34. Place the foil strip whose resistance value is not within the qualified threshold range into the deposition liquid in the replenishment cavity, and then proceed to step S40.

[0021] A metal foil processing apparatus, applicable to the aforementioned metal foil processing method, includes a feeding roller, a deposition chamber, a take-up roller, and a monitoring module. The foil strip is wound around the feeding roller. When the feeding roller rotates around a first direction, it drives the foil strip wound on the feeding roller to output. When the feeding roller rotates around a second direction, it drives the foil strip that has detached from the feeding roller to move back onto the feeding roller. A deposition roller is also provided inside the deposition chamber for immersing the foil strip in a deposition solution. The take-up roller is used to recover the foil strip that has passed through the deposition chamber. The monitoring module is located between the deposition chamber and the take-up roller and is used to measure the resistance value of the foil strip that has passed through the deposition chamber.

[0022] As a preferred technical solution for a metal foil processing device, the feeding roller is disposed in the feeding cavity, the winding roller is disposed in the winding cavity, the feeding cavity, the deposition cavity and the winding cavity are connected in sequence, and the monitoring module is disposed between the deposition cavity and the winding cavity.

[0023] As a preferred technical solution for the metal foil processing apparatus, the feeding chamber is provided with a first guide shaft for raising the foil strip output from the feeding chamber to the conveying height; the deposition chamber is provided with a second guide shaft for raising the foil strip input from the deposition chamber to the conveying height and a third guide shaft for raising the foil strip output from the deposition chamber to the conveying height; the winding chamber is provided with a fourth guide shaft for raising the foil strip input from the winding chamber to the conveying height; the conveying height is higher than the liquid surface of the deposition liquid.

[0024] A metal foil processing apparatus, applicable to the aforementioned metal foil processing method, includes a feeding roller, a deposition chamber, a take-up roller, a monitoring module, and a replenishing chamber. The feeding roller drives the foil strip wound on it for output. The deposition chamber also includes a deposition roller for immersing the foil strip in a deposition solution. The take-up roller is used to recover the foil strip that has passed through the deposition chamber. The monitoring module is located between the deposition chamber and the take-up roller and is used to measure the resistance value of the foil strip that has passed through the deposition chamber. The replenishing chamber contains the deposition solution and also includes a liftable pressing unit that can press the foil strip down into the deposition solution within the replenishing chamber.

[0025] As a preferred technical solution for a metal foil processing device, both ends of the deposition roller are coaxially provided with roller shafts, the roller shafts are slidably mounted on lifting guide rails, and the lifting guide rails extend in the vertical direction.

[0026] As a preferred technical solution for a metal foil processing device, the feeding roller is disposed in the feeding cavity, the winding roller is disposed in the winding cavity, the feeding cavity, the deposition cavity, the replenishment cavity and the winding cavity are connected in sequence, and the monitoring module is disposed between the deposition cavity and the replenishment cavity.

[0027] The beneficial effects of this invention are:

[0028] This metal foil processing method utilizes a feeding roller and a take-up roller to smoothly transport the foil strip and ensure accurate placement during deposition. By comparing the resistance value of the foil strip measured by the monitoring module with a qualified threshold, foil strips meeting the resistance requirements can be successfully wound up, while those not meeting the requirements are adjusted through a re-deposition process. This simple and effective process, by detecting and handling the foil strip's resistance value according to different cases, ensures the deposition effect of the foil strip in the deposition solution, greatly improving the yield of processed metal foils and guaranteeing that the resistance value of the foil strip meets the assembly requirements of various electronic devices. Attached Figure Description

[0029] Figure 1 This is a flowchart of the metal foil processing method provided in Embodiment 1 of the present invention;

[0030] Figure 2 This is a schematic diagram of the metal foil processing apparatus provided in Embodiment 1 of the present invention;

[0031] Figure 3 This is a flowchart of the metal foil processing method provided in Embodiment 2 of the present invention;

[0032] Figure 4 This is a schematic diagram of the metal foil processing device provided in Embodiment 2 of the present invention.

[0033] In the picture:

[0034] 110. Feeding roller; 120. Deposition roller; 121. Roller shaft; 130. Rewinding roller; 140. Pressure roller; 210. Feeding chamber; 220. Deposition chamber; 221. Lifting guide rail; 230. Rewinding chamber; 240. Supplementing chamber; 241. Drive unit; 242. Connecting frame; 300. Monitoring module; 400. Foil strip; 500. Deposition liquid; 610. First guide shaft; 620. Second guide shaft; 630. Third guide shaft; 640. Fourth guide shaft; 710. First direction; 720. Second direction. Detailed Implementation

[0035] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] like Figure 1 and Figure 2 As shown, this embodiment provides a metal foil processing method for processing foil strip 400, including the following steps:

[0041] Step 1: Rotate the feeding roller 110 around the first direction 710 to transport the foil strip 400 wound on the feeding roller 110 to the deposition liquid 500 in the deposition chamber 220 for deposition operation.

[0042] Step 2: After the deposition operation is completed, use the monitoring module 300 to measure the resistance value of the foil strip 400 after the deposition operation. If the resistance value is not within the qualified threshold range, proceed to Step 3; otherwise, proceed to Step 4.

[0043] Step 3: Perform a redeposition operation on foil strip 400, and then proceed to Step 4.

[0044] Step 4: Rotate the take-up roller 130 to retract the foil strip 400 onto the take-up roller 130.

[0045] This metal foil processing method utilizes a feeding roller 110 and a take-up roller 130 to smoothly transport the foil strip 400 and ensure accurate positioning of the foil strip 400 during deposition. By comparing the resistance value of the foil strip 400 measured by the monitoring module 300 with a qualified threshold, foil strips 400 that meet the metal foil resistance requirements can be smoothly wound up, while foil strips 400 that do not meet the requirements can be re-deposited to adjust their resistance value. This process is simple and effective. By detecting and handling the resistance value of the foil strip 400 according to different cases, the deposition effect of the foil strip 400 in the deposition solution 500 is guaranteed, greatly improving the yield of metal foil processing and ensuring that the resistance value of the foil strip 400 meets the assembly requirements of various electronic devices.

[0046] In this embodiment, the monitoring module 300 includes a scanning unit and a calculation unit. Step two includes the following detailed steps: using the scanning unit to detect the volume of the resistive layer formed by the deposition operation; having the calculation unit calculate the resistance value of the resistive layer based on the volume value; comparing the resistance value with a qualified threshold; if the resistance value is not within the qualified threshold range, proceed to step three; otherwise, proceed to step four. By setting up a scanning unit and a calculation unit, the measurement and resistance value calculation of the resistive layer deposited on the surface of the foil strip 400 can be completed. The above structure is simple and reliable, ensuring that the measurement of the resistance value of the foil strip 400 can be completed efficiently and accurately, which can greatly improve the yield and processing efficiency of the foil strip 400 obtained by this metal foil processing method.

[0047] Preferably, the scanning unit and the arithmetic unit are communicatively connected to the control module. The control module can adjust the processing operation of the foil strip 400 by controlling the actions of each component. In this embodiment, the control module, scanning unit, and arithmetic unit are all conventional devices in the art, and their working methods and connection methods are existing technologies in the art and are well known to those skilled in the art, so they will not be described in detail here.

[0048] Further, step three includes the following detailed steps: rotating the feeding roller 110 around the second direction 720, so that the foil strip 400 whose resistance value is not within the qualified threshold range is moved back to be conveyed to the deposition chamber 220; rotating the feeding roller 110 around the first direction 710 again, so that the foil strip 400 is conveyed into the deposition chamber 220 again for deposition operation; after the deposition operation is completed, the monitoring module 300 measures the resistance value of the foil strip 400 after the deposition operation. If the resistance value is not within the qualified threshold range, return to the step of rotating the feeding roller 110 around the second direction 720, otherwise proceed to step four.

[0049] The aforementioned redeposition operation involves retrieving the foil strip 400 whose resistance value is outside the acceptable threshold range and re-entering it into the deposition chamber 220 to redeposit a resistive layer on the surface of the foil strip 400. In this embodiment, by changing the direction of the feed roller 110, the conveying direction of the foil strip 400 can be altered, and the positioning of the foil strip 400 can be maintained while changing direction. This ensures that the foil strip 400 can successfully complete the redeposition operation, thereby guaranteeing the production efficiency and yield of the metal foil.

[0050] Specifically, when the feeding roller 110 rotates around the first direction 710, the feeding roller 110 rotates clockwise; when the feeding roller 110 rotates around the second direction 720, the feeding roller 110 rotates counterclockwise.

[0051] Continue to refer to Figure 2 This embodiment also provides a metal foil processing apparatus that can be applied to the above-mentioned metal foil processing method. The metal foil processing apparatus includes a feeding roller 110, a deposition chamber 220, a take-up roller 130, and a monitoring module 300. The foil strip 400 is wound around the feeding roller 110. When the feeding roller 110 rotates around the first direction 710, the feeding roller 110 drives the foil strip 400 wound around the feeding roller 110 to be output. When the feeding roller 110 rotates around the second direction 720... At this time, the feeding roller 110 drives the foil strip 400, which has detached from the feeding roller 110, to move back onto the feeding roller 110; a deposition roller 120 is also provided in the deposition chamber 220, which is used to immerse the foil strip 400 in the deposition solution 500; a take-up roller 130 is used to recover the foil strip 400 that has passed through the deposition chamber 220; a monitoring module 300 is located between the deposition chamber 220 and the take-up roller 130, and is used to measure the resistance value of the foil strip 400 that has passed through the deposition chamber 220. Specifically, the control module can control the direction of rotation of the feeding roller 110.

[0052] This metal foil processing apparatus utilizes an optimized design where the feeding roller 110 can rotate around a first direction 710 and a second direction 720, making the movement direction of the foil strip 400 adjustable. This improvement eliminates the need for machine stopping and disassembly during direction changes; only the control module needs to adjust the direction of the feeding roller 110. The placement of the deposition roller 120 ensures the foil strip 400 is immersed in the deposition solution 500 while effectively preventing scratches and damage to its outer surface. This design is simple and reliable, efficiently and smoothly implementing the metal foil processing method provided in this embodiment. With the assistance of the control module, the automation level of the metal foil processing apparatus is further improved, ensuring the accuracy of the metal foil processing method and thus increasing the yield of the foil strip 400.

[0053] In this embodiment, the feeding roller 110 is disposed in the feeding cavity 210, and the winding roller 130 is disposed in the winding cavity 230. The feeding cavity 210, the deposition cavity 220, and the winding cavity 230 are sequentially connected, and the monitoring module 300 is disposed between the deposition cavity 220 and the winding cavity 230. The above structural improvement connects the various interconnected cavities sequentially, making the structure of this metal foil processing device simple and space-saving, thereby effectively reducing the production cost of this metal foil processing device. At the same time, it also simplifies the setting method of the foil strip 400 in this metal foil processing device and reduces the risk of positional displacement of the foil strip 400 during processing.

[0054] Furthermore, the feeding chamber 210 is provided with a first guide shaft 610 for raising the foil strip 400 output from the feeding chamber 210 to the conveying height; the deposition chamber 220 is provided with a second guide shaft 620 for raising the foil strip 400 input from the deposition chamber 220 to the conveying height and a third guide shaft 630 for raising the foil strip 400 output from the deposition chamber 220 to the conveying height; the winding chamber 230 is provided with a fourth guide shaft 640 for raising the foil strip 400 input from the winding chamber 230 to the conveying height; the conveying height is higher than the liquid surface of the deposition liquid 500. The above design ensures that the foil strip 400 not in the deposition process is not soaked in the deposition solution 500, thereby avoiding the situation where the foil strip 400 is soaked in the deposition solution 500 in advance and the foil strip 400 that has completed the deposition process cannot be removed from the deposition solution 500 in time. The above settings ensure the quality of the foil strip 400 deposition process, improve the quality of the resistive layer formation, and increase the probability that the foil strip 400 is qualified by the monitoring module 300 after the deposition process, thereby reducing the frequency of the foil strip 400 being returned due to unqualified detection, and thus improving the processing efficiency of the foil strip 400.

[0055] Specifically, the first guide shaft 610, the second guide shaft 620, the third guide shaft 630 and the fourth guide shaft 640 are rotatably connected to the cavity in which they are disposed. The above arrangement effectively avoids scratches and damage to the outer surface of the foil strip 400, ensuring that the foil strip 400 can always be deposited intact, thereby further guaranteeing the yield of the metal foil.

[0056] Example 2

[0057] like Figure 3 and Figure 4 As shown, the metal foil processing method of this embodiment is basically the same as that of the first embodiment. The difference is that step three includes the following detailed steps: placing the foil strip 400 whose resistance value is not within the qualified threshold range into the deposition liquid 500 in the filling cavity 240, and then proceeding to step four.

[0058] The above steps allow foil strip 400 with resistance values ​​outside the acceptable threshold range to undergo a second deposition operation. This second deposition operation steadily increases the probability that the resistance value of foil strip 400 will be within acceptable limits. Furthermore, this design eliminates the need for the foil strip 400 to stop or slow down during movement, enabling this metal foil processing method to maintain extremely high processing efficiency while improving the yield rate of foil strip 400 deposition operations.

[0059] Continue to refer to Figure 4 This embodiment also provides a metal foil processing apparatus that can be applied to the above-mentioned metal foil processing method. The metal foil processing apparatus includes a feeding roller 110, a deposition chamber 220, a take-up roller 130, a monitoring module 300, and a replenishing chamber 240. The feeding roller 110 is used to drive the foil strip 400 wound on the feeding roller 110 to output. The deposition chamber 220 is also provided with a deposition roller 120, which is used to immerse the foil strip 400 in the deposition liquid 500. The take-up roller 130 is used to recover the foil strip 400 that has passed through the deposition chamber 220. The monitoring module 300 is located between the deposition chamber 220 and the take-up roller 130 and is used to measure the resistance value of the foil strip 400 that has passed through the deposition chamber 220. The replenishing chamber 240 contains the deposition liquid 500 and is also provided with a lifting and lowering pressing unit, which can press the foil strip 400 down into the deposition liquid 500 in the replenishing chamber 240.

[0060] Because this metal foil processing apparatus has a single conveying direction for the foil strip 400, it effectively reduces the probability of the foil strip 400 slowing down or stopping during conveying, thereby greatly improving the processing efficiency of the foil strip 400. The beneficial effect of the deposition roller 120 in Embodiment 2 is the same as that in Embodiment 1, and will not be elaborated here. The design of the pressing unit allows the foil strip 400 whose resistance value is not within the qualified threshold range to be deposited again without reducing its own conveying speed. By utilizing the cooperation between the monitoring module 300 and the replenishment cavity 240, a certain portion of the foil strip 400 can be selectively re-deposited. The above settings avoid the situation where the resistance value of the foil strip 400 within the qualified threshold range is adversely changed due to re-deposition, and also reduce the loss of the deposition liquid 500 in the replenishment cavity 240, reducing the frequency of replenishment of the deposition liquid 500. The above design is simple and reliable, and can efficiently and smoothly realize the metal foil processing method provided in this embodiment. With the cooperation of the control module, the automation level of this metal foil processing device can also be improved, thereby improving the efficiency and accuracy of the metal foil processing method, and thus improving the processing efficiency and yield of metal foil.

[0061] Specifically, the pressing unit includes a pressing roller 140, a drive unit 241, and a connecting frame 242. The pressing roller 140 is used to press down the foil strip 400, and is rotatably connected to the connecting frame 242. The drive unit 241 is used to drive the connecting frame 242 to move up and down in the vertical direction. Specifically, the control module is communicatively connected to the drive unit 241 and is used to control the raising and lowering of the connecting frame 242.

[0062] In this embodiment, both ends of the deposition roller 120 are coaxially provided with roller shafts 121, which slide on the lifting guide rail 221, which extends vertically. The vertical sliding design of the roller shafts 121 allows the deposition roller 120 to automatically adapt to the downward pressing action of the pressure roller 140 on the foil strip 400, thereby avoiding the foil strip 400 from becoming taut due to deformation under force, which could lead to scraping, friction, or even breakage. The above design is simple and reliable, allowing the metal foil processing device to operate smoothly even when the pressure roller 140 is pressing down, reducing the risk of damage to the foil strip 400, and further ensuring the yield of the foil strip 400 deposition operation.

[0063] Preferably, the feeding roller 110 is disposed within the feeding chamber 210, and the take-up roller 130 is disposed within the take-up chamber 230. The feeding chamber 210, deposition chamber 220, replenishment chamber 240, and take-up chamber 230 are sequentially connected, and the monitoring module 300 is disposed between the deposition chamber 220 and the replenishment chamber 240. By placing the monitoring module 300 between the deposition chamber 220 and the replenishment chamber 240, timely re-deposition of the foil strip 400 whose resistance value is not within the qualified threshold range can be performed without stopping the driving of the foil strip 400. Utilizing the configuration that the replenishment chamber 240 is simultaneously connected to both the deposition chamber 220 and the take-up chamber 230, the foil strip 400 that has completed the re-deposition operation can be directly recycled to the take-up roller 130, thereby greatly improving the efficiency of the re-deposition operation. The above structural improvement sequentially connects the various interconnected chambers, making the structure of this metal foil processing apparatus simple and space-saving, thereby effectively reducing the production cost of this metal foil processing apparatus.

[0064] Preferably, a first guide shaft 610 is rotatably connected inside the feeding chamber 210, a second guide shaft 620 and a third guide shaft 630 are rotatably connected inside the deposition chamber 220, and a fourth guide shaft 640 is rotatably connected inside the winding chamber 230. The positions of the above structures are the same as those of the corresponding components in Embodiment 1, and the conveying height in Embodiment 2 is simultaneously higher than the liquid level of the deposition liquid 500 in the deposition chamber 220 and the liquid level of the deposition liquid 500 in the replenishment chamber 240. The functions of the multiple guide shafts are the same as the beneficial effects described in Embodiment 1, and will not be elaborated further here.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for processing metal foil, used for processing foil strips (400), characterized in that, Includes the following steps: S10. Rotate the feeding roller (110) around the first direction (710) to transport the foil strip (400) wound on the feeding roller (110) to the deposition liquid (500) in the deposition chamber (220) for deposition operation; S20. After the deposition operation is completed, the resistance value of the foil strip (400) after the deposition operation is measured by the monitoring module (300). If the resistance value is not within the qualified threshold range, proceed to step S30; otherwise, proceed to step S40. S30, perform a redeposition operation on the foil strip (400), and then proceed to step S40; S40, rotate the take-up roller (130) to recycle the foil strip (400) onto the take-up roller (130); The monitoring module (300) includes a scanning unit and a processing unit. Step S20 includes the following detailed steps: S21. The volume of the resistive layer formed by the deposition operation is detected using the scanning unit; S22. The arithmetic unit calculates the resistance value of the resistive layer based on the volume of the resistive layer. S23. Compare the resistance value with the qualified threshold. If the resistance value is not within the qualified threshold range, proceed to step S30; otherwise, proceed to step S40. Step S30 includes the following detailed steps: S34. Place the foil strip (400) whose resistance value is not within the qualified threshold range into the deposition liquid (500) in the filling cavity (240), and then proceed to step S40. The replenishment cavity (240) is also provided with a lifting and lowering pressing unit, which can press the foil strip (400) down into the deposition liquid (500) in the replenishment cavity (240); Both ends of the deposition roller (120) are coaxially provided with roller shafts (121), and the roller shafts (121) are slidably mounted on the lifting guide rail (221), which extends in the vertical direction. The design of the roller shafts (121) sliding in the vertical direction enables the deposition roller (120) to automatically adapt to the pressing action of the pressure roller (140) on the foil strip (400) and rise and fall.

2. A metal foil processing apparatus, characterized in that, The metal foil processing apparatus, applicable to the metal foil processing method of claim 1, comprises: The feeding roller (110) is used to drive the foil strip (400) wound on the feeding roller (110) to output; The deposition chamber (220) is further provided with a deposition roller (120), which is used to immerse the foil strip (400) in the deposition liquid (500); The take-up roller (130) is used to recover the foil strip (400) that has passed through the deposition chamber (220). The monitoring module (300) is located between the deposition chamber (220) and the take-up roller (130) and is used to measure the resistance value of the foil strip (400) passing through the deposition chamber (220); The replenishment cavity (240) contains the deposition liquid (500), and the replenishment cavity (240) is also provided with a pressing unit that can be raised and lowered, which can press the foil strip (400) into the deposition liquid (500) in the replenishment cavity (240); The pressing unit includes a pressing roller (140), a driving unit (241), and a connecting frame (242).

3. The metal foil processing apparatus according to claim 2, characterized in that, The feeding roller (110) is disposed in the feeding cavity (210), the winding roller (130) is disposed in the winding cavity (230), the feeding cavity (210), the deposition cavity (220), the replenishment cavity (240) and the winding cavity (230) are connected in sequence, and the monitoring module (300) is disposed between the deposition cavity (220) and the replenishment cavity (240).

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