Driving panel and display device

Abstract

Embodiments of the present application disclose a driving panel and a display device using the same. The driving panel comprises, for example, a substrate, a column scanning line, a row scanning line, a signal connecting line, a driving circuit, a first electrode pad and a second electrode pad. The substrate comprises a display area and a non-display area. The column scanning line is arranged in the display area on the substrate. The row scanning line is arranged in the display area on the substrate and is staggered with the column scanning line. The signal connecting line is arranged in the display area on the substrate and is electrically connected with the row scanning line. The driving circuit is arranged in the non-display area on the substrate and is electrically connected with the column scanning line and the signal connecting line respectively. The first electrode pad is arranged in the display area on the substrate and is electrically connected with the column scanning line. The second electrode pad is arranged in the display area on the substrate and is electrically connected with the row scanning line and the signal connecting line. The driving panel of the embodiments of the present application realizes a narrow frame or even a frameless panel, and expands the market application of the driving panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a driving panel and a display device. Background Technology

[0002] With the development of Micro-LED displays, borderless display driving has become a design highlight and even a trend in the future market. Currently, passive driver panels utilize the left and right bezels of the non-display area of ​​the driver panel for routing traces to the bottom bezel and then to the driver circuit, resulting in a relatively wide bezel. Considering the relatively large current of the common driver signal, the trace width of the signal connection lines must also be considered, further increasing the bezel size due to the left and right routing. Therefore, achieving borderless display driving is a technical problem that needs to be solved. Summary of the Invention

[0003] Therefore, in order to overcome at least some of the defects and deficiencies of the prior art, the present invention provides a driving panel and a display device, which solves the problem of wide bezels in the driving panel in the prior art, realizes narrow bezels or even bezel-less panels, and expands the market application of driving panels.

[0004] Specifically, an embodiment of the present invention provides a driving panel, for example including: a substrate, including a display area and a non-display area; column scan lines disposed in the display area on the substrate; row scan lines disposed interleaved with the column scan lines in the display area; signal connection lines disposed in the display area on the substrate, the signal connection lines being electrically connected to the row scan lines; a driving circuit disposed in the non-display area on the substrate and electrically connected to the column scan lines and the signal connection lines respectively; a first electrode pad disposed in the display area on the substrate and electrically connected to the column scan lines; and a second electrode pad disposed in the display area on the substrate and electrically connected to the row scan lines and the signal connection lines.

[0005] In one specific embodiment of the present invention, the driving panel further includes a first insulating layer, which covers the row scan line and is located between the row scan line and the signal connection line. A first via is provided on the first insulating layer, and the row scan line is electrically connected to the signal connection line through the first via.

[0006] In one specific embodiment of the present invention, the driving panel further includes a second insulating layer, which covers the signal connection line and the first insulating layer and is located between the second electrode pad and the signal connection line. The second insulating layer is also located between the first insulating layer and the column scan line. A second via is provided on the second insulating layer, and the second electrode pad is electrically connected to the signal connection line through the second via.

[0007] In one specific embodiment of the present invention, the driving panel further includes a planarization layer covering the second insulating layer and the column scan lines, wherein the first electrode pads penetrate the planarization layer and are electrically connected to the column scan lines.

[0008] In one specific embodiment of the present invention, the first electrode pad has a first bonding surface, the second electrode pad has a second bonding surface, the first bonding surface and the second bonding surface are respectively located on the side of the planarization layer away from the substrate, and the minimum distance from the first bonding surface to the substrate is equal to the minimum distance from the second bonding surface to the substrate.

[0009] In one specific embodiment of the present invention, the column scan lines are arranged parallel to the signal connection lines, and the column scan lines are arranged perpendicular to the signal connection lines and the row scan lines.

[0010] On the other hand, an embodiment of the present invention provides a display device, for example including: a driving panel as described above; and a light-emitting device disposed on the driving panel, wherein the light-emitting device includes a first electrode and a second electrode, the first electrode being electrically connected to a first electrode pad of the driving panel, and the second electrode being electrically connected to a second electrode pad of the driving panel.

[0011] In a specific embodiment of the present invention, the row scan lines and the column scan lines are interleaved to form pixel units; a plurality of light-emitting devices are disposed in the pixel units, and the plurality of light-emitting devices form a plurality of sub-pixels; the area of ​​the projection of the first via on the substrate is the area of ​​the projection of at least one sub-pixel on the substrate.

[0012] In one specific embodiment of the present invention, the light-emitting device is a micron-sized light-emitting diode or a sub-millimeter-sized light-emitting diode.

[0013] In one specific embodiment of the present invention, the display device further includes an encapsulation layer covering the light-emitting device and the driving panel.

[0014] As can be seen from the above, by setting signal connection lines connecting the horizontal scan lines within the display area of ​​the driving panel, the embodiments of the present invention can achieve a narrow bezel or even a bezel-less design for the driving panel based on a passive driving method, meeting the market demand for narrow bezels. Furthermore, the signal connection lines are connected to the horizontal scan lines through vias with an area equal to or greater than at least one pixel, improving the current-carrying capacity of the signal connection lines and enhancing product reliability. Protected by an organic film layer on the driving panel, the signal connection lines can be electrically connected to the light-emitting device through the top metal pads (i.e., the first electrode pad and the second electrode pad) on the driving panel. Moreover, by setting a planarization layer, the bonding between the top metal pads (i.e., the first electrode pad and the second electrode pad) and the light-emitting device is facilitated, improving product quality and reliability. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a cross-sectional schematic diagram of a display device provided in an embodiment of the present invention.

[0017] Figure 2 This is a plan view of a display device provided in an embodiment of the present invention.

[0018] Figure 3 for Figure 2 The diagram shows the structure of the drive panel.

[0019] Figure 4 for Figure 2 A magnified view of a portion of region A in the middle.

[0020] Figure 5 for Figure 3 The diagram shows a cross-sectional view of the drive panel.

[0021] Figure 6 for Figure 5 This diagram illustrates the positional relationship between the electrode pads and the display panel.

[0022] Figure 7 This is a schematic diagram of the structure of the first via and pixel unit. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments described in the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, top, and bottom) in the embodiments of this invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figures). If the specific posture changes, the directional indicator will also change accordingly. Furthermore, the term "vertical" in the embodiments and claims refers to an angle of 90° between two components or a deviation of -5° to +5°, and the term "parallel" refers to an angle of 0° between two components or a deviation of -5° to +5°.

[0025] In the embodiments of this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0026] See Figure 1 and Figure 2 This invention provides a display device 50. The display device 50 provided in this embodiment can be, for example, a micro-LED display device, a sub-millimeter LED display device, or other miniature LED display devices. The display device 50 includes, for example, a driving panel 10 and a light-emitting device 30. The light-emitting device 30 is disposed on and electrically connected to the driving panel 10. The light-emitting device 30 is, for example, a micro-LED. A micro-LED typically refers to a semiconductor light-emitting diode chip whose length, width, and thickness are all less than 100 micrometers (μm), including, for example, micro-LEDs or sub-millimeter LEDs (Mini LEDs), or even other similar light-emitting devices.

[0027] Furthermore, the display device 50 also includes, for example, an encapsulation layer 40. The encapsulation layer 40 covers, for example, the light-emitting device 30 and the driving panel 10. The encapsulation layer 40 can fix the positions of the light-emitting devices, such as Micro LEDs and / or the light-emitting device circuitry, such as Micro ICs, and provides protection. The material of the encapsulation layer 40 may include, for example, epoxy resin and silicone resin, or other materials.

[0028] Furthermore, the display device 50 is, for example, a passive matrix (PM) display device; therefore, the driving panel 10 is, for example, a passive driving panel. The driving panel 10 is used to control the lighting and shutting off of the light-emitting devices 30 so that the display device 50 can display corresponding images.

[0029] Specifically, the driving panel 10 includes, for example, a substrate 110 and row scan lines 120, column scan lines 130, signal connection lines 140, driving circuit 150, first electrode pad 190 and second electrode pad 200 disposed on the substrate 110.

[0030] like Figure 3 As shown, the substrate 110 is, for example, a glass substrate. The substrate 110 includes a display area 111 and a non-display area 112. Row scan lines 120, column scan lines 130, and signal connection lines 140 are respectively disposed within the display area 111. Specifically, as shown... Figure 3 As shown, column scan lines 130 are arranged vertically (or in the column direction) within the display area 111. Row scan lines 120 are arranged horizontally (or in the row direction) within the display area 111. That is, row scan lines 120 and column scan lines 130 are arranged alternately within the display area 111. Preferably, row scan lines 120 and column scan lines 130 are arranged perpendicularly to each other within the display area 111. Signal connection lines 140 are arranged within the display area 111, and the signal connection lines 140 are electrically connected to the row scan lines 120. Preferably, the signal connection lines 140 may be arranged parallel to the column scan lines 130, for example. Preferably, the signal connection lines 140 and column scan lines 130 are arranged perpendicularly to each other within the display area 111. The projection of the signal connection lines 140 onto the substrate 110 may be parallel, overlap, or even coincide with the projection of the column scan lines 130 onto the substrate 110, and the present invention is not limited thereto. For example, the projection of the signal connection line 140 onto the substrate 110 can be parallel to and alternately distributed with the projection of the column scan line 130 onto the substrate 110, that is, in Figure 3In the horizontal direction, a column scan line 130 is disposed between two adjacent signal connection lines 140, and a signal connection line 140 is disposed between two adjacent column scan lines 130. Alternatively, three column scan lines 130 may be disposed between two adjacent signal connection lines 140, alternating sequentially. Furthermore, the projection of the signal connection line 140 on the substrate 110 may, for example, coincide with the projection of the column scan line 130 on the substrate 110; that is, since the signal connection line 140 and the column scan line 130 are located on different layers of the driving panel 10, their projections on the substrate 110 coincide. The signal connection line 140 is electrically connected to the driving circuit 150, and the row scan line 120 is electrically connected to the driving circuit 150 through the signal connection line 140.

[0031] The first electrode pad 190 is electrically connected to the row scan line 120, and the second electrode pad 200 is electrically connected to the column scan line 130 and the signal connection line 140. The first electrode pad 190 and the second electrode pad 200 are arranged in pairs for connecting the light-emitting device 30. The light-emitting device 30 is bonded to the first electrode pad 190 and the second electrode pad 200. Specifically, as shown... Figure 4As shown, the light-emitting device 30 also includes, for example, a pair of first electrodes 31 and second electrodes 32. For example, the light-emitting device 30 is a Micro-LED, with the first electrode 31 being a cathode (or N-electrode) and the second electrode 32 being an anode (or P-electrode). The first electrode 31 is electrically connected to the first electrode pad 190 of the driving panel 10, and the second electrode 32 is electrically connected to the second electrode pad 200 of the driving panel 10. Furthermore, the light-emitting device 30 also includes, for example, a first semiconductor layer, an active layer (e.g., a multi-quantum-well layer), and a second semiconductor layer stacked sequentially. The first electrode 31 and the second electrode 32 can be, for example, dot-shaped or strip-shaped metal electrodes, and of course, other shapes of metal electrodes are also possible; the present invention is not limited thereto. Further, the light-emitting device 30 can also be formed by stacking and connecting multiple light-emitting elements in a vertical direction to form a stacked light-emitting structure. In the stacked light-emitting structure, the first electrode of one of every two adjacent light-emitting elements is bonded to the second electrode of the other light-emitting element to form an electrical connection. The bonding here can be achieved using a metal bonding process, for example, by bonding the first electrode and the second electrode together under heat and pressure using a pure tin (Sn) layer, a gold-tin (Sn / Au) layer, a titanium-copper (Ti / Cu) layer, an aluminum-nickel-gold (Al / Ni / Au) layer, or a titanium-nickel-tin (Ti / Ni / Sn) layer. Of course, other bonding methods can also be used between the electrodes of each adjacent light-emitting element, as long as there is a light-transmitting area in the middle of the light-emitting unit and the light emission of the light-emitting element is not completely blocked. Specifically, multiple light-emitting elements can be, for example, light-emitting elements of the same color, such as all red light-emitting elements, all blue light-emitting elements, all green light-emitting elements, or other light-emitting elements of the same color, thereby forming a monochromatic series high-voltage light-emitting device. Of course, in other embodiments of the present invention, the light-emitting elements can also be light-emitting elements of different colors, for example, a mixture of red, green, and blue light-emitting elements, thereby producing multi-spectral light emission including red, green, and blue colors, i.e., forming a multi-color series high-voltage light-emitting device. In this embodiment, because each pixel uses a monochromatic series high-voltage light-emitting device, such as a monochromatic series high-voltage Micro-LED chip, compared to the prior art which uses a single PN structure Micro-LED chip as a pixel, it can reduce the driving current while maintaining a certain brightness, thereby reducing the power consumption of the display device. Furthermore, the stacked series structure is pre-formed, thus avoiding the increased difficulty of mass transfer. Moreover, since the light-emitting elements in the stacked series structure are stacked sequentially in the vertical direction, it does not increase the space occupied on the driving substrate 81, i.e., it does not reduce the resolution PPI.

[0032] It is worth mentioning that the row scan line 120, column scan line 130, signal connection line 140, first electrode pad 190, and second electrode pad 200 are respectively arranged on the substrate 110 through patterned etching, deposition, or sputtering processes. The row scan line 120, column scan line 130, signal connection line 140, first electrode pad 190, and second electrode pad 200 are located on different layers of the substrate 110. The row scan line 120, column scan line 130, signal connection line 140, first electrode pad 190, and second electrode pad 200 are, for example, transparent conductive lines, and their material is, for example, copper or other transparent conductive materials. Furthermore, there are multiple row scan lines 120, column scan lines 130, signal connection lines 140, first electrode pad 190, and second electrode pad 200, such as... Figure 1 and Figure 2 As shown.

[0033] As mentioned earlier, by setting signal connection lines in the display area on the substrate and electrically connecting them to the horizontal scan lines, and the horizontal scan lines being electrically connected to the driving circuit through the signal connection lines, the width of the bezel on the driving panel can be reduced, thereby enabling small bezel or even bezel-less panels to meet the needs of more users in the market.

[0034] Furthermore, such as Figure 5 As shown, the driving panel 10 may further include a first insulating layer 160. Row scan lines 120 are disposed on one side of the substrate 110. The first insulating layer 160 covers the row scan lines 120 and the substrate 110. Signal connection lines 140 are formed on the first insulating layer 160. A first via 161 is provided on the first insulating layer 160 adjacent to the row scan lines 120; the first via 161 is, for example, a through-hole. The signal connection lines 140 are electrically connected to the row scan lines 120 through the first via 161. Furthermore, the material of the first insulating layer 160 may be, for example, silicon oxide, silicon nitride, zirconium oxide, silicon oxynitride, or silicon nitride.

[0035] Furthermore, the drive panel 10 also includes, for example, a second insulating layer 170. The second insulating layer 170 covers the signal connection line 140 and the first insulating layer 160. The second insulating layer 170 is located between the second electrode pad 190 and the signal connection line 140; a second via 171 is provided on the second insulating layer 170, through which the second electrode pad 190 is electrically connected to the signal connection line 140. Column scan lines 130 are disposed on the second insulating layer 170. The first electrode pad 200 is electrically connected to the column scan lines 130. Additionally, the material of the second insulating layer 170 may be, for example, silicon oxide, silicon nitride, zirconium oxide, silicon oxynitride, or silicon nitride.

[0036] Furthermore, the driving panel 10 also includes a planarization layer 180. The planarization layer 180 covers the second insulating layer 170 and the column scan lines 130. The first electrode pad 200 penetrates the planarization layer and is electrically connected to the column scan lines 130; the first electrode pad 190 penetrates the planarization layer 180 and the second insulating layer 170 and is electrically connected to the signal connection line 140. The planarization layer 180 can be any suitable organic material, specifically, it can be suitable materials such as acrylic resin, epoxy resin, silicone resin, and polyvinyl alcohol. More specifically, it can be formed by suitable processes such as spraying, scraping, spin coating, and dispensing. The planarization layer 180 is used to planarize the second insulating layer 170 and the column scan lines 130, making the first electrode pad 200 and the second electrode pad 190 equal in height, to facilitate the bonding of the light-emitting device 30. More specifically, such as... Figure 6 As shown, the first electrode pad 200 has a first bonding surface 201, and the second electrode pad 190 has a second bonding surface 191. The first bonding surface 201 and the second bonding surface 191 are respectively located on the side of the planarization layer 180 away from the substrate 100. The minimum distance D1 from the first bonding surface 201 to the substrate 100 is equal to the minimum distance D2 from the second bonding surface 191 to the substrate 100.

[0037] In addition, such as Figure 3 As shown, the substrate 100 may further include a non-display area 112 adjacent to the display area 111; the driving panel 10 also includes a driving circuit 150. The driving circuit 150 is disposed in the non-display area 112 of the substrate 100. The column scan line 130 and the signal connection line 140 are respectively connected to the driving circuit 150. Specifically, the driving panel 10 also includes a fan-out line 210. The fan-out line is disposed in the non-display area 112. The column scan line 130 and the signal connection line 140 are respectively connected to the driving circuit 150 through the fan-out line 210, and the row scan line 120 is connected to the driving circuit 150 through the signal connection line 140 and the fan-out line 210. The fan-out line 210 reduces the area occupied by the driving circuit 150 on the driving panel 10.

[0038] The driving circuit 150 is used to control the display of the light-emitting device 30 via the row scan line 120 and the column scan line 130. The driving circuit 150 may employ a driving circuit from the prior art. Typically, the driving circuit 150 may also include a row driving circuit and a column driving circuit respectively connected to the row scan line 120 and the column scan line 130; their specific structures will not be described in detail here.

[0039] Furthermore, in other embodiments of the present invention, such as Figure 3 and Figure 7As shown, there are multiple row scan lines 120 and multiple column scan lines 130, which intersect to form multiple pixel units 300. Each pixel unit 300 includes, for example, multiple pixels arranged sequentially. In this embodiment, the multiple pixels include, for example, red pixels (R), green pixels (G), and blue pixels (G). Of course, in other embodiments, each pixel unit 300 may include, for example, red pixels (R), green pixels (G), blue pixels (G), and white pixels (G) arranged sequentially, and may even include yellow pixels (Y); the present invention is not limited thereto. The area of ​​the projection of the first via 161 onto the substrate 100 is greater than or equal to the area of ​​the projection of one of the sub-pixels onto the substrate 100. Figure 7 As shown, the area of ​​the projection of the first via 161 onto the substrate is greater than the area of ​​the projection of the two sub-pixels R and G onto the display panel.

[0040] In summary, the driving panel of the display device provided in this embodiment of the invention, by setting signal connection lines connecting the row scan lines within the display area of ​​the driving panel, can achieve a borderless design of the driving panel based on a passive driving method, meeting the market demand for narrow bezels. Furthermore, the signal connection lines utilize vias with an area larger than at least one pixel, enhancing their current-carrying capacity and improving product reliability. Protected by an organic film layer on the driving panel, the signal connection lines can connect to light-emitting devices such as Micro-LEDs via the top metal pads (i.e., the first and second electrode pads) on the driving panel. Moreover, the planarization layer facilitates the bonding of the top metal pads (i.e., the first and second electrode pads) to the light-emitting devices such as Micro-LEDs, improving product quality and reliability.

[0041] It is understood that the foregoing embodiments are merely illustrative examples of the present invention. Provided that the technical features do not conflict, the structure is not contradictory, and the purpose of the invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A driving panel, characterized in that, include: The substrate includes both the display area and the non-display area; Column scan lines are disposed within the display area on the substrate. Row scan lines are arranged interlaced with column scan lines within the display area; A signal connection line is disposed in the display area on the substrate, and the signal connection line is electrically connected to the row scan line; A driving circuit is disposed in the non-display area of ​​the substrate and electrically connected to the column scan line and the signal connection line, respectively. A first electrode pad is disposed within the display area on the substrate and is electrically connected to the column scan line; The second electrode pad is disposed within the display area on the substrate and is electrically connected to the row scan line and the signal connection line.

2. The driving panel as described in claim 1, characterized in that, The driving panel further includes a first insulating layer, which covers the row scan line and is located between the row scan line and the signal connection line. A first via is provided on the first insulating layer, and the row scan line is electrically connected to the signal connection line through the first via.

3. The driving panel as described in claim 2, characterized in that, The driving panel further includes a second insulating layer, which covers the signal connection line and the first insulating layer and is located between the second electrode pad and the signal connection line. The second insulating layer is also located between the first insulating layer and the column scan line. A second via is provided on the second insulating layer, and the second electrode pad is electrically connected to the signal connection line through the second via.

4. The driving panel as described in claim 3, characterized in that, The drive panel further includes a planarization layer that covers the second insulating layer and the column scan lines, with the first electrode pads penetrating the planarization layer and electrically connected to the column scan lines.

5. The driving panel as described in claim 4, characterized in that, The first electrode pad has a first bonding surface, and the second electrode pad has a second bonding surface. The first bonding surface and the second bonding surface are respectively located on the side of the planarization layer away from the substrate. The minimum distance from the first bonding surface to the substrate is equal to the minimum distance from the second bonding surface to the substrate.

6. The driving panel as described in claim 1, characterized in that, The column scan lines are arranged parallel to the signal connection lines, and the column scan lines are arranged perpendicular to the signal connection lines and the row scan lines.

7. A display device, characterized in that, include: The drive panel as described in any one of claims 1-6; as well as A light-emitting device is disposed on the driving panel, wherein the light-emitting device includes a first electrode and a second electrode, the first electrode being electrically connected to a first electrode pad of the driving panel, and the second electrode being electrically connected to a second electrode pad of the driving panel.

8. The display device as claimed in claim 7, characterized in that, The row scan lines and column scan lines intersect to form pixel units; a plurality of light-emitting devices are disposed within the pixel units, and the plurality of light-emitting devices form a plurality of sub-pixels; the area of ​​the projection of the first via onto the substrate is the same as the area of ​​the projection of at least one sub-pixel onto the substrate.

9. The display device as claimed in claim 7, characterized in that, The light-emitting device is a micron-sized light-emitting diode or a sub-millimeter-sized light-emitting diode.

10. The display device as claimed in claim 7, characterized in that, The display device further includes an encapsulation layer that covers the light-emitting device and the driving panel.

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