Temperature control system and temperature control method for air conditioner controller

Abstract

The application provides a temperature control system and method for an air conditioner controller. The temperature control system comprises: a first heat conduction unit, one side of the first heat conduction unit being used for mounting and fixing a plurality of devices to be cooled, the plurality of devices to be cooled comprising a compressor IPM module; a second heat conduction unit, the second heat conduction unit being located on the other side of the first heat conduction unit, and the second heat conduction unit and the first heat conduction unit forming a heat exchange gap; a semiconductor temperature control unit, the semiconductor temperature control unit being embedded in the heat exchange gap and being used for heat exchange transmission in the heat exchange gap; and a driving control unit, the driving control unit being used for controlling the semiconductor temperature control unit to adjust the direction and power of the heat exchange transmission. The technical problems of existing technologies, such as condensation of a heat dissipation device, heat dissipation capacity being limited by a harsh installation environment, loosening of fastening screws of the devices to be cooled due to mechanical vibration, and failure of an air conditioner outdoor unit controller, are solved.

Description

Technical Field

[0001] This invention relates to the field of air conditioning technology, and in particular to a temperature control system and method for air conditioning controllers. Background Technology

[0002] Inverter air conditioners are now widely used. The outdoor unit controller is one of the core components of an inverter air conditioner. Analysis of market after-sales data reveals that outdoor unit controllers account for a significant proportion of failures, with most being caused by the failure of high-power semiconductor devices such as rectifier bridges, IGBTs, and IPMs. The main reasons for this are harsh installation and operating environments for outdoor air conditioners and insufficient design heat dissipation margins, which prevent high-power semiconductor devices from dissipating heat in a timely manner during prolonged operation. This leads to excessive temperature rise in the device body, a decrease in parameter performance indicators, and ultimately, device failure.

[0003] To address the heat dissipation issue of outdoor unit controllers in inverter air conditioners, the industry commonly employs radiator-based air cooling, relying on the forced convection generated by an outdoor fan motor to remove heat from the radiator. However, heat dissipation deteriorates under conditions such as condenser blockage or direct sunlight. In higher-power inverter air conditioners, refrigerant-based radiator cooling solutions are also used. This solution offers significant cooling performance, but its manufacturing process is complex, requiring careful handling of refrigerant piping and radiator vibration. Furthermore, radiators are prone to condensation problems. Severe condensation can cause short circuits and failures in power devices when powered on. Analysis of failed after-sales products has also revealed that loose radiator mounting screws on the power devices resulted in poor contact between the devices and the radiator, leading to prolonged and ineffective heat dissipation and eventual failure. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a temperature control system and method for air conditioner controllers, which solves the technical problems of condensation on heat dissipation devices, heat dissipation capacity being limited by harsh installation environments, and loosening of heat dissipation device fastening screws caused by mechanical vibration, leading to the failure of the air conditioner outdoor unit controller.

[0005] According to the temperature control system for an air conditioner controller of the present invention, the temperature control system comprises:

[0006] The first heat-conducting unit has one side for mounting and fixing several heat-dissipating devices of the air conditioner controller, including the compressor IPM module.

[0007] The second heat-conducting unit is located on the other side of the first heat-conducting unit, and the second heat-conducting unit and the first heat-conducting unit form a heat exchange gap;

[0008] A semiconductor temperature control unit is embedded in the heat exchange gap and is used for heat transfer within the heat exchange gap.

[0009] The drive control unit is used to control the semiconductor temperature control unit to adjust the direction and power of heat transfer.

[0010] Furthermore, it also includes several heat-conducting fins, which are spaced apart on the side of the second heat-conducting unit.

[0011] Furthermore, the first heat-conducting unit and the second heat-conducting unit are fixed together by screws to prevent heat transfer between the first heat-conducting unit and the second heat-conducting unit.

[0012] Furthermore, a groove is provided on the inner wall of the heat exchange gap, and the semiconductor temperature control unit is embedded in the groove.

[0013] Furthermore, it also includes a temperature acquisition unit, which is used to acquire the temperature of the first heat-conducting unit.

[0014] Furthermore, it also includes a humidity acquisition unit, which is used to acquire ambient humidity.

[0015] Furthermore, the drive control unit includes:

[0016] First switch, second switch, third switch, fourth switch, power supply, sampling resistor, and processor;

[0017] The first pins of the first switch and the third switch are both connected to the positive terminal of the power supply, and the second pins of the first switch and the first pins of the second switch are both connected to the first pin of the semiconductor temperature control unit; the second pins of the third switch and the first pins of the fourth switch are both connected to the second pin of the semiconductor temperature control unit.

[0018] The second pins of the second and fourth switches are both connected to the first pin of the sampling resistor, and the second pin of the sampling resistor is connected to the negative terminal of the power supply.

[0019] The processor controls the on / off states of the first and fourth switches, as well as the third and second switches, to adjust the direction of heat transfer in the semiconductor temperature control unit.

[0020] The processor also controls the first and fourth switches, or the second and third switches, to be in PWM mode to adjust the power of heat transfer in the semiconductor temperature control unit;

[0021] The processor is also used to acquire the current value flowing through the sampling resistor;

[0022] The processor is also used to determine whether condensation occurs in the first heat-conducting unit based on ambient humidity and outdoor ambient temperature.

[0023] Another aspect of the present invention provides a temperature control method for an air conditioner controller, applied to a temperature control system for an air conditioner controller, the temperature control method comprising:

[0024] S101: Air conditioner is turned on, outdoor unit is powered on;

[0025] S102: The drive control unit obtains the dew point temperature and the determination value of condensation phenomenon in the first heat conduction unit based on the current outdoor ambient temperature and humidity.

[0026] S103: The drive control unit determines whether the outdoor ambient temperature and the temperature of the first heat conduction unit meet the first preset condition or the second preset condition.

[0027] The first preset condition includes T2≤T3 and T1-T2≥T4; the second preset condition includes T2≤T; T1 is the outdoor ambient temperature; T2 is the temperature of the first heat conduction unit; T3 and T4 are the judgment values ​​for the occurrence of condensation in the first heat conduction unit, and T is the dew point temperature of the outdoor environment.

[0028] If yes, execute S104; otherwise, execute S105 directly.

[0029] S104: The drive control unit controls the semiconductor temperature control unit to operate at its maximum design power on the side closest to the first heat-conducting unit as the hot end, in order to heat the first heat-conducting unit and evaporate the condensate.

[0030] When T2≥T5 and the set time t1 is maintained, where T5 is the temperature of the first heat conduction unit when the condensate evaporates rapidly; the drive control unit controls the semiconductor temperature control unit to stop working.

[0031] When the compressor is started, after the outdoor unit works and maintains the set time t2, the drive control unit controls the semiconductor temperature control unit to make the side of the first heat conduction unit closer to the first heat conduction unit the cold end to cool and dissipate heat from the first heat conduction unit.

[0032] S105: Directly start the compressor and the outdoor unit will work; the drive control unit controls the semiconductor temperature control unit to make the side near the first heat conduction unit the cold end to cool and dissipate heat from the first heat conduction unit.

[0033] Furthermore, it also includes:

[0034] S201: During the process of cooling and dissipating heat from the first heat-conducting unit by the semiconductor temperature control unit, the drive control unit obtains the temperature difference between the temperature of the first heat-conducting unit and its set target temperature in real time.

[0035] S202: When the temperature of the first heat-conducting unit meets the condition T2-T6>T7, where T2 is the temperature of the first heat-conducting unit; T6 is the target temperature of the first heat-conducting unit; and T7 is the set temperature difference; the drive control unit controls the current flowing through the semiconductor temperature control unit to be at its maximum value, so that the semiconductor temperature control unit operates at its maximum design power to cool the first heat-conducting unit;

[0036] S203: When 0 < T2 - T6 ≤ T7, the drive control unit adjusts the current flowing through the semiconductor temperature control unit in real time so that the temperature of the first heat conduction unit is close to the target temperature when the temperature difference changes.

[0037] S204: When T2-T6≤0, the drive control unit controls the semiconductor temperature control unit to shut down and stop working.

[0038] Furthermore, the target temperature includes:

[0039] Using the following formula:

[0040] T6 = K * T1 + B;

[0041] Obtain the target temperature, where T6 is the target temperature; T1 is the outdoor ambient temperature; and K and B are both coefficients.

[0042] Furthermore, it also includes:

[0043] S301: The drive control unit obtains the temperature of the compressor IPM module and the temperature of the first heat conduction unit in real time;

[0044] S302: Determine whether the temperature of the compressor IPM module and the temperature of the first heat conduction unit meet the condition T8-T2≥T9, where T8 is the temperature of the compressor IPM module, T2 is the temperature of the first heat conduction unit, and T9 is the preset temperature difference due to the loosening of the fastening screws of the temperature control system.

[0045] S303: If so, it indicates that the temperature control system fastening screws are loose, triggers an alarm, and reduces the compressor's operating frequency or stops the machine directly.

[0046] Furthermore, it also includes:

[0047] S401: The drive control unit acquires the current value flowing through the sampling resistor in real time;

[0048] S402: Determine whether the current value meets the condition IR≥Imax and continue for a duration of t3; where IR is the current value flowing through the sampling resistor, and Imax is the set maximum operating current of the semiconductor temperature control unit.

[0049] S403: If so, determine that the semiconductor temperature control unit is overcurrent, drive the control unit to control the semiconductor temperature control unit to shut down; and restore power supply after time t4.

[0050] S404: When the semiconductor temperature control unit experiences an overcurrent after a set number of consecutive cycles, the semiconductor temperature control unit is judged to be faulty, an alarm is triggered, and the unit is shut down directly.

[0051] Compared with the prior art, the present invention has the following beneficial effects:

[0052] This invention arranges a first heat-conducting unit and a second heat-conducting unit on opposite sides of a semiconductor temperature control unit, respectively, and adjusts the heat exchange direction of the first and second heat-conducting units by controlling the current direction of the semiconductor temperature control unit. It can detect and remove condensation on the first heat-conducting unit before the compressor starts, and after the compressor starts running, the first heat-conducting unit can cool several heat-dissipating devices while preventing condensation on it. The heat exchange efficiency of the first and second heat-conducting units is adjusted by controlling the current of the semiconductor temperature control unit, preventing the semiconductor temperature control unit from operating at high load for extended periods. The semiconductor temperature control unit experiences minimal vibration during operation, and its embedding within the thermally conductive gap formed by the first and second heat-conducting units further reduces vibration. This also makes it less likely for the heat dissipation devices fixed to the side of the first heat-conducting unit to fall off. This invention utilizes the compressor's own IPM temperature output function, combined with temperature detection by the first heat-conducting unit, to determine if the radiator fastening screws are loose, thus protecting power devices in advance. Simultaneously, by detecting the current of the semiconductor temperature control unit, overcurrent protection is implemented, achieving protection and fault diagnosis for the semiconductor temperature control unit.

[0053] This invention solves the technical problems existing in the prior art, such as condensation on the heat dissipation device, heat dissipation capacity being limited by harsh installation environment, and mechanical vibration causing the fastening screws of the heat dissipation device to loosen, leading to the failure of the air conditioner outdoor unit controller. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0055] Figure 2 This is a circuit diagram of a drive control unit according to another embodiment of the present invention.

[0056] Figure 3 This is a flowchart illustrating the steps of a temperature control method for an air conditioner outdoor unit when it is turned on, according to another embodiment of the present invention.

[0057] Figure 4 This is a flowchart illustrating the steps of controller temperature control during operation in another embodiment of the present invention.

[0058] Figure 5 This is a flowchart illustrating the steps for determining if a radiator is loose, according to another embodiment of the present invention.

[0059] Figure 6This is a flowchart illustrating the steps of overcurrent protection in a semiconductor temperature control unit according to another embodiment of the present invention.

[0060] In the figure, 1 is the first heat-conducting unit; 2 is the second heat-conducting unit; 3 is the semiconductor temperature control unit; 4 is the temperature acquisition unit; 5 is the device to be cooled; 6 is the heat-conducting fin; S1 is the first switch; S2 is the second switch; S3 is the third switch; S4 is the fourth switch; RS is the sampling resistor. Detailed Implementation

[0061] The technical solutions of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0062] like Figure 1 As shown, according to the present invention, a temperature control system and method for an air conditioner controller; in a first aspect, the temperature control system includes:

[0063] The first heat-conducting unit 1, one side of which is used to install and fix a plurality of heat-dissipating devices 5 of the air conditioner controller, the plurality of heat-dissipating devices 5 including the compressor IPM module;

[0064] The second heat-conducting unit 2 is located on the other side of the first heat-conducting unit 1, and the second heat-conducting unit 2 and the first heat-conducting unit 1 form a heat exchange gap;

[0065] A semiconductor temperature control unit 3 is embedded in the heat exchange gap and is used for heat transfer within the heat exchange gap.

[0066] The drive control unit is used to control the semiconductor temperature control unit 3 to adjust the direction and power of heat transfer.

[0067] The specific implementation process of this embodiment includes:

[0068] In this embodiment, a plurality of heat-conducting fins 6 are also included. The plurality of heat-conducting fins 6 are distributed at intervals on the side of the second heat-conducting unit 2. The plurality of heat-conducting fins 6 can accelerate the heat conduction speed of the second heat-conducting unit 2.

[0069] The semiconductor temperature control unit 3 is embedded in the heat exchange gap formed by the first heat-conducting unit 1 and the second heat-conducting unit 2. The first heat-conducting unit 1 and the second heat-conducting unit 2 are fixed with screws, ensuring the semiconductor temperature control unit 3 is securely fixed in the heat exchange gap to prevent heat transfer between them. Furthermore, the two sides of the semiconductor temperature control unit 3 are respectively in close contact with the two opposite inner walls of the heat exchange gap. In this embodiment, a groove is provided on the inner wall of the heat exchange gap, and the semiconductor temperature control unit 3 is embedded in the groove. In this embodiment, the groove is located on the second heat-conducting unit 2.

[0070] When the semiconductor temperature control unit 3 is running, one side is the cold end and the other side is the hot end. The drive control unit changes the orientation of the cold end and the hot end by adjusting the current direction of the semiconductor temperature control unit 3. The drive control unit also changes the operating power of the semiconductor temperature control unit 3 by controlling the magnitude of the current of the semiconductor temperature control unit 3. In this embodiment, the operating power is the heat exchange power. The higher the operating power, the greater the heat exchange power and the more obvious the effect.

[0071] In this embodiment, a temperature acquisition unit 4 is also included; the temperature acquisition unit 4 includes multiple temperature sensors, wherein at least one temperature sensor is disposed on the first heat conduction unit 1 for acquiring the temperature of the first heat conduction unit 1; at least one sensor is disposed on the outdoor unit of the air conditioner for acquiring the ambient temperature; existing air conditioner products have fixed temperature sensors on the outdoor unit, which can be connected to the temperature acquisition unit 4.

[0072] In some embodiments, a humidity acquisition unit is further included, the humidity acquisition unit including at least one humidity sensor, and the temperature and humidity sensor is installed on the outdoor unit.

[0073] The temperature acquisition unit 4 is used to acquire the outdoor ambient temperature and the temperature of the first heat conduction unit.

[0074] It should be noted that in this embodiment, the plurality of heat dissipation devices 5 are fixed to the first heat conduction unit 1 by screws; the first heat conduction unit 1, the second heat conduction unit 2 and the plurality of heat conduction fins 6 are all made of materials that are easy to conduct heat, wherein the plurality of heat conduction fins 6 are integrally formed with the second heat conduction unit 2.

[0075] In this embodiment, by respectively arranging the first heat-conducting unit 1 and the second heat-conducting unit 2 on both sides of the semiconductor temperature control unit 3, the heat exchange direction of the first heat-conducting unit 1 and the second heat-conducting unit 2 is adjusted by controlling the current direction of the semiconductor temperature control unit 3. This allows the first heat-conducting unit 1 to cool several heat-dissipating devices while preventing condensation on it. By controlling the current of the semiconductor temperature control unit 3, the heat exchange efficiency of the first heat-conducting unit 1 and the second heat-conducting unit 2 is adjusted, preventing the semiconductor temperature control unit 3 from operating under high load for extended periods. The semiconductor temperature control unit 3 experiences minimal vibration during operation, and its embedding within the thermally conductive gap formed by the first heat-conducting unit 1 and the second heat-conducting unit 2 further reduces vibration. This also makes it less likely for the heat dissipation devices fixed to the side of the first heat-conducting unit 1 to fall off. Furthermore, the compressor IPM's own temperature output function is utilized, combined with the temperature detection of the first heat-conducting unit 1, to determine whether the heat sink fastening screws have loosened, thus protecting the power devices in advance. Simultaneously, by detecting the current of the semiconductor temperature control unit 3, overcurrent protection is implemented, achieving protection and fault diagnosis for the semiconductor temperature control unit 3. This invention solves the technical problems existing in the prior art, such as condensation on the heat dissipation device, heat dissipation capacity being limited by harsh installation environment, and mechanical vibration causing the fastening screws of the heat dissipation device to loosen, leading to the failure of the air conditioner outdoor unit controller.

[0076] like Figure 2 As shown, the drive control unit includes:

[0077] First switch S1, second switch S2, third switch S3, fourth switch S4, power supply, sampling resistor RS, and processor;

[0078] The first pins of the first switch S1 and the third switch S3 are both connected to the positive terminal of the power supply. The second pins of the first switch S1 and the first pins of the second switch S2 are both connected to the first pin of the semiconductor temperature control unit 3. The second pins of the third switch S3 and the first pins of the fourth switch S4 are both connected to the second pins of the semiconductor temperature control unit 3.

[0079] The second pins of the second switch S2 and the fourth switch S4 are both connected to the first pin of the sampling resistor RS, and the second pin of the sampling resistor RS is connected to the negative terminal of the power supply.

[0080] The processor controls the on / off states of the first switch S1 and the fourth switch S4, as well as the third switch S3 and the second switch S2, to adjust the direction of heat transfer in the semiconductor temperature control unit 3.

[0081] The processor also controls the first switch S1 and the fourth switch S4, or the second switch S2 and the third switch S3, to be in PWM state to adjust the heat transfer power of the semiconductor temperature control unit 3; the processor calculates and obtains the current dew point temperature based on the outdoor ambient temperature and humidity, and drives the control unit to control the temperature of the first heat conduction unit 1 to be no lower than the current dew point temperature, so as to prevent the first heat conduction unit temperature from being too low and causing condensation, which would result in a short circuit.

[0082] The processor is also used to acquire the current value flowing through the sampling resistor RS.

[0083] The specific implementation process of this embodiment includes:

[0084] In this embodiment, the processor controls the state of the first switch S1, the second switch S2, the third switch S3, and the fourth switch S4. When the first switch S1 and the fourth switch S4 are in the through state, and the second switch S2 and the third switch S3 are in the open state, the current flows from the left side to the right side of the semiconductor temperature control unit 3. In this embodiment, when the current flows from the left side to the right side of the semiconductor temperature control unit 3, the side of the semiconductor temperature control unit 3 closer to the first heat conduction unit 1 is the cold end, and the side of the semiconductor temperature control unit 3 closer to the second heat conduction unit 2 is the hot end. The semiconductor temperature control unit 3 dissipates heat from the first heat conduction unit 1 and cools it down, quickly conducting the heat to the second heat conduction unit 2 for dissipation.

[0085] When the first switch S1 and the fourth switch S4 are in the open state, and the second switch S2 and the third switch S3 are in the through state, the current flows from the right side to the left side of the semiconductor temperature control unit 3. The side of the semiconductor temperature control unit 3 closest to the first heat conduction unit 1 is the hot end, and the side of the semiconductor temperature control unit 3 closest to the second heat conduction unit 2 is the cold end. The semiconductor temperature control unit 3 heats up the first heat conduction unit 1 to remove or prevent condensation from forming on the first heat conduction unit 1.

[0086] In this embodiment, the current flowing through the semiconductor temperature control unit 3 is obtained by sampling resistor RS.

[0087] like Figure 3 As shown, in another embodiment of the present invention, a temperature control method for an air conditioner controller is applied to the temperature control system for the air conditioner controller, the temperature control method comprising:

[0088] The temperature control method includes:

[0089] S101: Air conditioner is turned on, outdoor unit is powered on;

[0090] S102: The drive control unit obtains the dew point temperature and the determination value of condensation phenomenon in the first heat conduction unit 1 based on the current outdoor ambient temperature and humidity.

[0091] S103: The drive control unit determines whether the outdoor ambient temperature and the temperature of the first heat conduction unit meet the first preset condition or the second preset condition.

[0092] The first preset condition includes T2≤T3 and T1-T2≥T4; the second preset condition includes T2≤T; T1 is the outdoor ambient temperature; T2 is the temperature of the first heat conduction unit; T3 and T4 are the judgment values ​​for the occurrence of condensation in the first heat conduction unit 1, and T is the dew point temperature of the outdoor environment.

[0093] If yes, execute S104; otherwise, execute S105 directly.

[0094] S104: The drive control unit controls the semiconductor temperature control unit 3 to operate at its maximum design power on the side closest to the first heat conduction unit 1 as the hot end, so as to heat the first heat conduction unit 1 and evaporate the condensate.

[0095] When T2≥T5 and the set time t1 is maintained, where T5 is the temperature of the first heat conduction unit when the condensate evaporates rapidly; the drive control unit controls the semiconductor temperature control unit 3 to stop working.

[0096] When the compressor is started, after the outdoor unit works and maintains the set time t2, the drive control unit controls the semiconductor temperature control unit 3 to cool the first heat conduction unit 1 by making the side closer to the first heat conduction unit 1 the cold end.

[0097] S105: Directly start the compressor and the outdoor unit works; drive control unit controls the semiconductor temperature control unit 3 to cool the first heat conduction unit 1 by making the side near the first heat conduction unit 1 the cold end.

[0098] The specific implementation process of this embodiment includes:

[0099] In this embodiment, the ambient dew point temperature is obtained using the following formula:

[0100] T = A * φ + C * T1

[0101] Where T is the dew point temperature; φ is the ambient humidity; T1 is the outdoor ambient temperature; and A and C are coefficients.

[0102] There are two possibilities for determining the presence of condensation on the first heat-conducting unit 1:

[0103] 1) If the temperature of the first heat-conducting unit 1 is lower than the dew point temperature, condensation will occur in the first heat-conducting unit 1.

[0104] 2) If the outdoor ambient temperature is higher than the temperature of the first heat-conducting unit 1 (i.e., T1-T2≥T4) and the temperature of the first heat-conducting unit is lower than a certain value (i.e., T2≤T3), condensation may also occur on the first heat-conducting unit 1. For example, in summer, the ambient temperature is low at night, and the temperature of the first heat-conducting unit 1 is also low. In the morning, the ambient temperature rises faster than the temperature of the first heat-conducting unit 1, which makes condensation more likely to occur.

[0105] It should be noted that the judgment values ​​T3 and T4 were obtained after testing and calibration under simulated environmental conditions in the enthalpy difference chamber.

[0106] like Figure 4 As shown, in this embodiment, during the operation of the temperature control system, the temperature of the first heat-conducting unit 1 is maintained near the target temperature. The process includes:

[0107] S201: During the cooling and heat dissipation process of the semiconductor temperature control unit 3 on the first heat conduction unit 1, the drive control unit obtains the temperature difference between the temperature of the first heat conduction unit and its set target temperature in real time.

[0108] S202: When the temperature of the first heat conduction unit meets the condition T2-T6>T7, where T2 is the temperature of the first heat conduction unit; T6 is the target temperature of the first heat conduction unit 1; and T7 is the set temperature difference; the drive control unit controls the current flowing through the semiconductor temperature control unit 3 to be at its maximum value, so that the semiconductor temperature control unit 3 works at its maximum design power to cool down the first heat conduction unit 1;

[0109] S203: When 0 < T2 - T6 ≤ T7, the drive control unit adjusts the current flowing through the semiconductor temperature control unit 3 in real time so that the temperature of the first heat conduction unit is close to the target temperature when the temperature difference changes.

[0110] S204: When T2-T6≤0, the drive control unit controls the semiconductor temperature control unit 3 to stop working by powering off.

[0111] In this embodiment, the target temperature is obtained using the following formula:

[0112] T6 = K * T1 + B;

[0113] Where T6 is the target temperature; T1 is the outdoor ambient temperature; K and B are both coefficients.

[0114] It should be noted that in this embodiment, the target temperature needs to be higher than the ambient condensation temperature to avoid the first heat conduction unit 1 being lower than the dew point temperature and condensation occurring during the cooling process of the semiconductor temperature control unit 3. When the calculated target temperature is lower than or equal to the dew point temperature, a temperature value higher than the current dew point temperature is selected as the target temperature. In this embodiment, a temperature value 2 degrees Celsius higher than the dew point temperature is selected as the target temperature.

[0115] like Figure 5 As shown, in this embodiment, the drive control unit further determines whether the fastening screws of the compressor IPM module and the first heat-conducting unit 1 are loose, and whether the fastening screws of the first heat-conducting unit 1 and the second heat-conducting unit 2 are loose, including:

[0116] S301: The drive control unit obtains the temperature of the compressor IPM module and the temperature of the first heat conduction unit in real time;

[0117] S302: Determine whether the temperature of the compressor IPM module and the temperature of the first heat conduction unit meet the condition T8-T2≥T9, where T8 is the temperature of the compressor IPM module, T2 is the temperature of the first heat conduction unit, and T9 is the preset temperature difference due to the loosening of the fastening screws of the temperature control system.

[0118] S303: If so, it indicates that the temperature control system fastening screws are loose, triggers an alarm, and reduces the compressor's operating frequency or stops the machine directly.

[0119] The specific implementation process of this embodiment includes:

[0120] There are two main possibilities that lead to T8-T2≥T9

[0121] 1. The fastening screws between the compressor IPM module and the first heat conduction unit 1 are loose, resulting in unreliable contact and poor heat dissipation.

[0122] 2. The fastening screws of the first heat-conducting unit 1 and the second heat-conducting unit 2 are loose, which makes the contact between the semiconductor temperature control unit 3 and the first heat-conducting unit 1 and the second heat-conducting unit 2 unreliable, resulting in poor heat dissipation conditions.

[0123] like Figure 6 As shown, this embodiment also determines whether the semiconductor temperature control unit 3 is faulty during operation. The specific steps include:

[0124] S401: The drive control unit acquires the current value flowing through the sampling resistor RS in real time;

[0125] S402: Determine whether the current value meets the condition IR≥Imax and continue for a duration of t3; where IR is the current value flowing through the sampling resistor RS, and Imax is the set maximum operating current of the semiconductor temperature control unit 3;

[0126] S403: If so, determine that the semiconductor temperature control unit 3 is overcurrent, drive the control unit to control the semiconductor temperature control unit 3 to shut down; and restore power supply after time t4.

[0127] S404: When the semiconductor temperature control unit 3 experiences an overcurrent after a set number of consecutive cycles, the semiconductor temperature control unit 3 is judged to be faulty, an alarm is triggered, and the machine is shut down directly.

[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A temperature control method for an air conditioner controller, applied to a temperature control system for an air conditioner controller, the temperature control system including a first heat conduction unit, one side of the first heat conduction unit being used to install and fix a plurality of heat-dissipating devices of the air conditioner controller, the plurality of heat-dissipating devices including a compressor IPM module; The second heat-conducting unit is located on the other side of the first heat-conducting unit, and the second heat-conducting unit and the first heat-conducting unit form a heat exchange gap; A semiconductor temperature control unit is embedded in the heat exchange gap and is used for heat transfer within the heat exchange gap. The drive control unit controls the semiconductor temperature control unit to adjust the direction and power of heat transfer, characterized in that: the temperature control method includes: S101: Air conditioner is turned on, outdoor unit is powered on; S102: The drive control unit obtains the dew point temperature and the determination value of condensation phenomenon in the first heat conduction unit based on the current outdoor ambient temperature and humidity. S103: The drive control unit determines whether the outdoor ambient temperature and the temperature of the first heat conduction unit meet the first preset condition or the second preset condition. The first preset condition includes T2≤T3 and T1-T2≥T4; the second preset condition includes T2≤T; T1 is the outdoor ambient temperature; T2 is the temperature of the first heat conduction unit; T3 and T4 are the judgment values ​​for the occurrence of condensation in the first heat conduction unit, and T is the dew point temperature of the outdoor environment. If yes, execute S104; otherwise, execute S105 directly. S104: The drive control unit controls the semiconductor temperature control unit to operate at its maximum design power on the side closest to the first heat-conducting unit as the hot end, in order to heat the first heat-conducting unit and evaporate the condensate. When T2≥T5 and the set time t1 is maintained, where T5 is the temperature of the first heat conduction unit when the condensate evaporates rapidly; the drive control unit controls the semiconductor temperature control unit to stop working. When the compressor is started, after the outdoor unit works and maintains the set time t2, the drive control unit controls the semiconductor temperature control unit to make the side of the first heat conduction unit closer to the first heat conduction unit the cold end to cool and dissipate heat from the first heat conduction unit. S105: Directly start the compressor and the outdoor unit will work; the drive control unit controls the semiconductor temperature control unit to make the side near the first heat conduction unit the cold end to cool and dissipate heat from the first heat conduction unit.

2. The temperature control method for an air conditioner controller as described in claim 1, characterized in that: Also includes: S201: During the process of cooling and dissipating heat from the first heat-conducting unit by the semiconductor temperature control unit, the drive control unit obtains the temperature difference between the temperature of the first heat-conducting unit and its set target temperature in real time. S202: When the temperature of the first heat-conducting unit meets the condition T2-T6>T7, where T2 is the temperature of the first heat-conducting unit; T6 is the target temperature of the first heat-conducting unit; and T7 is the set temperature difference; the drive control unit controls the current flowing through the semiconductor temperature control unit to be at its maximum value, so that the semiconductor temperature control unit operates at its maximum design power to cool the first heat-conducting unit; S203: When 0 < T2 - T6 ≤ T7, the drive control unit adjusts the current flowing through the semiconductor temperature control unit in real time so that the temperature of the first heat conduction unit is close to the target temperature when the temperature difference changes. S204: When T2-T6≤0, the drive control unit controls the semiconductor temperature control unit to shut down and stop working.

3. The temperature control method for an air conditioner controller as described in claim 2, characterized in that: The target temperature includes: Using the following formula: T6 = K * T1 + B; Obtain the target temperature, where T6 is the target temperature; T1 is the outdoor ambient temperature; and K and B are both coefficients.

4. The temperature control method for an air conditioner controller as described in claim 1, characterized in that: Also includes: S301: The drive control unit obtains the temperature of the compressor IPM module and the temperature of the first heat conduction unit in real time; S302: Determine whether the temperature of the compressor IPM module and the temperature of the first heat conduction unit meet the condition T8-T2≥T9, where T8 is the temperature of the compressor IPM module, T2 is the temperature of the first heat conduction unit, and T9 is the preset temperature difference due to the loosening of the fastening screws of the temperature control system. S303: If so, it indicates that the temperature control system fastening screws are loose, triggers an alarm, and reduces the compressor's operating frequency or stops the machine directly.

5. The temperature control method for an air conditioner controller as described in claim 1, characterized in that: Also includes: S401: The drive control unit acquires the current value flowing through the sampling resistor in real time; S402: Determine whether the current value meets the condition IR≥Imax, and continue for a duration of t3; Where IR is the current value flowing through the sampling resistor, and Imax is the maximum operating current of the semiconductor temperature control unit. S403: If so, determine that the semiconductor temperature control unit is overcurrent and drive the control unit to control the semiconductor temperature control unit to shut down; Power will be restored after time t4; S404: When the semiconductor temperature control unit experiences an overcurrent after a set number of consecutive cycles, the semiconductor temperature control unit is judged to be faulty, an alarm is triggered, and the unit is shut down directly.

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