Interface soft-hard degree design method for improving assembly interface contact thermal performance

By proactively designing the hardness and softness of the assembly interface and optimizing the contact thermal performance of electronic equipment, the problems of excessive temperature and local thermal stress caused by the contact thermal resistance of the assembly interface were solved, thereby improving the contact thermal performance and the effectiveness of equipment thermal management.

CN116502299BActive Publication Date: 2026-07-10XI AN JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XI AN JIAOTONG UNIV
Filing Date
2023-04-21
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Insufficient contact thermal performance caused by the contact thermal resistance of the assembly interface in electronic devices can lead to excessively high operating temperatures and localized thermal stress in electronic components, affecting the reliability and lifespan of electronic systems.

Method used

By actively designing the hardness and softness of the assembly interface, using the fractal method to generate a rough surface, adjusting the coordinates of the mesh nodes, and conducting a force-heat-force-heat four-cycle double-iteration coupled analysis, the material properties of the assembly interface are optimized and the contact thermal performance is improved.

Benefits of technology

It effectively reduces contact thermal resistance and temperature distribution unevenness, ensures the overall thermal performance of electronic equipment, solves the problem of insufficient contact caused by surface roughness, and avoids increasing the size of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of interface soft and hard degree design method of improving assembly interface contact thermal performance, main assembly interface, from assembly interface and matrix area are divided along the thickness direction of assembly body;Main assembly interface is defined as main design domain, and from assembly interface is defined as from design domain;The main design domain and from design domain are divided into several design sub-regions;Rough surface of assembly body main and from assembly interface under given real roughness is generated, rough surface is reconstructed, mesh is divided to assembly body, and the material properties of grid unit in each design sub-region are identical;The initial material elastic modulus or yield strength of each design sub-region is identical with matrix material, and numerical analysis of contact thermal performance is carried out, to obtain the temperature and heat flux distribution results of unit in main and from assembly interface under initial material properties;Iterative calculation can be carried out.The application can effectively reduce contact thermal resistance and assembly interface temperature distribution non-uniformity, and fully guarantee the overall thermal performance of electronic equipment.
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