A device for front processing and flow plating
By designing a pretreatment and plating integrated device, the liquid outlet component and the anode plating component are set up side by side, enabling multiple pretreatment processes to be completed in one station and a single plating process to be completed. This solves the problems of large footprint and low production efficiency of electroplating equipment and improves the efficiency of electroplating.
CN116536723BActive Publication Date: 2026-06-16SHAANXI XINYU SURFACE ENG
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHAANXI XINYU SURFACE ENG
- Filing Date
- 2023-04-20
- Publication Date
- 2026-06-16
Smart Images

Figure CN116536723B_ABST
Abstract
The application relates to the technical field of electroplating equipment, and particularly discloses a front treatment and flow plating integrated device, which comprises a workpiece supporting device, a front treatment device and a flow plating device; the workpiece supporting device is provided in plurality and is arranged correspondingly with the front treatment device and the flow plating device; the front treatment device comprises a supply system for supplying multiple treatment liquids and an integrated liquid outlet assembly in communication with the supply system; the flow plating device comprises a cathode assembly and an anode flow plating assembly; the anode flow plating assembly is arranged side by side with the integrated liquid outlet assembly, and the integrated liquid outlet assembly performs front treatment on a workpiece placed on the workpiece supporting device; and the anode flow plating assembly performs flow plating treatment on the workpiece placed on the workpiece supporting device. Through the arrangement of the anode flow plating assembly and the integrated liquid outlet assembly, the production line floor area can be reduced, and the production efficiency can be effectively improved.
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