Display panel, display device, composite adhesive tape and manufacturing method thereof
By introducing a more elastic buffer layer into the foam layer of the OLED display panel to absorb deformation, the problem of film printing caused by uneven deformation of the foam layer is solved, improving the display effect and production yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-05-24
- Publication Date
- 2026-06-16
AI Technical Summary
When applying composite tape to existing OLED display panels, uneven deformation of the foam layer leads to inconsistent adhesive layer thickness, resulting in film imprints that affect display performance.
The foam layer is composed of a buffer layer and a sub-foam layer. The elasticity of the buffer layer is greater than the maximum deformation of the sub-foam layer. It is coated on the surface of the sub-foam layer to absorb deformation and ensure that the deformation of each area is consistent.
By balancing the deformation of the foam layer, the thickness of the adhesive layer is ensured to be consistent, thus solving the problem of poor film printing and improving the display effect and production yield.
Smart Images
Figure CN116622301B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of display technology, and in particular to a display panel, display device, composite tape, and method of manufacturing the same. Background Technology
[0002] With the development of display technology, the application of display panels is becoming more and more common. Among them, OLED display panels are display panels made of organic light-emitting diodes. Because they have self-emissive organic light-emitting diodes, they have excellent characteristics such as no need for backlight, high contrast, thinness, wide viewing angle, fast response speed, applicability to flexible devices, wide operating temperature range, and relatively simple construction process. They have gradually become the mainstream development trend in the display field.
[0003] Currently, organic light-emitting diode (OLED) displays typically have a composite adhesive tape (SCF) adhered to the back. This tape is compressed during application, causing deformation of the internal foam layer. Unevenness on the display panel surface leads to variations in the deformation of the foam layer in different areas, resulting in varying adhesive layer strength and uneven adhesive layer thickness. This unevenness can create film marks on the display panel, negatively impacting the display performance. Summary of the Invention
[0004] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.
[0005] This disclosure provides a display panel, a display device, a composite tape, and a method for manufacturing the same.
[0006] The first aspect of this disclosure provides a composite tape, the composite tape including a foam layer, the foam layer including a buffer layer and a sub-foam layer, the buffer layer being coated on the surface of a first side and / or a second side of the sub-foam layer, the first side and the second side being opposite sides;
[0007] The elasticity of the buffer layer is greater than the maximum deformation of the surface of the sub-foam layer.
[0008] In some exemplary embodiments, the sub-foam layer contains hollow particles, wherein the maximum deformation of the surface of the sub-foam layer includes the deformation generated on the surface corresponding to the region of maximum density of the hollow particles in the sub-foam layer.
[0009] In some exemplary embodiments, the buffer layer does not contain the hollow particles.
[0010] In some exemplary embodiments, the buffer layer contains hollow particles, and the concentration of the hollow particles in the buffer layer is less than the concentration of the hollow particles in the sub-foam layer.
[0011] In some exemplary embodiments, the thickness of the buffer layer is greater than or equal to the diameter of a single hollow particle.
[0012] In some exemplary embodiments, the buffer layer is made of one or more materials selected from foam pulp, polyvinyl alcohol adhesive, and vinyl adhesive.
[0013] In some exemplary embodiments, the composite tape further includes an adhesive layer and a heat dissipation layer, the adhesive layer and the heat dissipation layer being located on two surfaces of the foam layer, respectively.
[0014] In some exemplary embodiments, the heat dissipation layer includes a copper layer.
[0015] A second aspect of this disclosure provides a method for manufacturing a composite adhesive tape, the method comprising:
[0016] Forming a sub-foam layer;
[0017] A buffer layer is coated on the surface of the first and / or second sides of the sub-foam layer, wherein the first side and the second side are opposite sides; the sub-foam layer and the buffer layer constitute a foam layer;
[0018] The elasticity of the buffer layer is greater than the maximum deformation of the surface of the sub-foam layer.
[0019] In some exemplary embodiments, forming the sub-foam layer includes:
[0020] Hollow particles of a first preset concentration are doped into the sub-foam layer;
[0021] The maximum deformation of the surface of the sub-foam layer includes the deformation generated on the surface corresponding to the region of maximum density of hollow particles in the sub-foam layer.
[0022] In some exemplary embodiments, coating a cushioning layer on the surface of the first and / or second sides of the sub-foam layer includes:
[0023] A buffer layer free of the hollow particles is coated on the surface of the first and / or second sides of the sub-foam layer.
[0024] In some exemplary embodiments, the manufacturing method further includes:
[0025] Hollow particles of a second preset concentration are doped into the buffer layer, wherein the second preset concentration is less than the first preset concentration.
[0026] In some exemplary embodiments, the manufacturing method further includes:
[0027] A heat dissipation layer and an adhesive layer are formed on the two surfaces of the foam layer, respectively.
[0028] A third aspect of this disclosure provides a display panel, comprising:
[0029] Panel; and
[0030] The composite tape as described in the first aspect or the composite tape made using the manufacturing method described in the second aspect is disposed on the surface of the panel.
[0031] A fourth aspect of this disclosure provides a display device, comprising:
[0032] Electronic devices; and
[0033] A display panel as described in the third aspect that is connected to the electronic device via signals.
[0034] This disclosure provides a display panel, display device, composite tape, and a method for manufacturing the same. By improving the overall structure of the foam layer, the foam layer is formed using a buffer layer and sub-foam layers. A buffer layer with an elasticity greater than the maximum deformation of the surface of the sub-foam layer is used. The buffer layer is coated on the surface of the first and / or second surfaces of the sub-foam layer to absorb the deformation of the sub-foam layer, ensuring that the deformation of each area on one or both surfaces of the foam layer is consistent. This ensures that the adhesive layer thickness is consistent in each area of the foam layer, solving the problem of poor film printing and improving the display effect. Attached Figure Description
[0035] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of these embodiments. In these drawings, similar reference numerals are used to denote similar elements. The drawings described below are some embodiments of the present disclosure, but not all embodiments. Other drawings will be readily available to those skilled in the art based on these drawings without inventive effort.
[0036] Figure 1 This is a schematic diagram of the structure of a composite tape shown in a comparative embodiment.
[0037] Figure 2 This is a structural schematic diagram of a composite tape shown in another comparative embodiment.
[0038] Figure 3 This is a schematic diagram of the structure of a composite tape according to an exemplary embodiment of the present disclosure.
[0039] Figure 4This is a schematic diagram of the structure of a composite tape according to an exemplary embodiment of the present disclosure.
[0040] Figure 5 This is a schematic diagram of the structure of a composite tape according to an exemplary embodiment of the present disclosure.
[0041] Figure 6 This is a schematic diagram of the structure of a composite tape according to another exemplary embodiment of the present disclosure.
[0042] Figure 7 This is a schematic diagram of the structure of a composite tape according to another exemplary embodiment of the present disclosure.
[0043] Figure 8 This is a schematic diagram of the structure of a composite tape according to another exemplary embodiment of the present disclosure.
[0044] Figure 9 This is a schematic diagram of the structure of a composite tape according to an exemplary embodiment of the present disclosure.
[0045] Figure 10 This is a flowchart illustrating a method for manufacturing a composite tape according to an exemplary embodiment of the present disclosure.
[0046] Figure 11 This is a flowchart illustrating a method for manufacturing a composite tape according to another exemplary embodiment of this disclosure. Detailed Implementation
[0047] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other. The present disclosure will be further described below with reference to the embodiments shown in the accompanying drawings.
[0048] Figure 1 The exemplary embodiment shows a structural schematic diagram of a composite tape, which can be considered as a cross-sectional view perpendicular to the surface of the composite tape. The foam layer in this composite tape is an integral structure. Figure 1 As shown, when the composite tape is applied to the display panel (not shown in the figure) and is compressed, the entire foam layer 10 is also compressed, and the foam layer as a whole deforms. The different deformation of the foam in different parts will cause different stress on the adhesive layer, such as... Figure 1The area A shown in the dashed box has a thinning adhesive layer, resulting in uneven adhesive layer thickness, poor film printing, and consequently affecting the display effect of the display device.
[0049] Figure 2 The following is an exemplary structural diagram of a composite tape in another comparative embodiment. This composite tape can have a waterproof function. For example, the foam layer 10 of the composite tape contains hollow particles 20. During the process of attaching the composite tape to the display panel, the foam layer 10 deforms under stress. Because the hollow particles 20 are not easily deformed, the foam layer 10 with a larger area of dense hollow particles 20 has a harder hardness and cannot deform. Therefore, the deformation of the adhesive layer at the corresponding position will also increase. Figure 2 The area B shown in the dashed box shows a thinning of the adhesive layer, resulting in uneven thickness of the adhesive layer in different locations, which in turn causes film printing.
[0050] To address the aforementioned technical problems, this disclosure provides a composite tape that improves the overall structure of the foam layer by using a buffer layer and a sub-foam layer to form the foam layer. The buffer layer is made of a material with an elasticity greater than the maximum deformation of the surface of the sub-foam layer. The buffer layer is coated on the surface of the first and / or second surfaces of the sub-foam layer to absorb the deformation of the sub-foam layer, ensuring consistent deformation across all areas of one or both surfaces of the foam layer. This ensures consistent adhesive layer thickness across all areas of the foam layer, thereby solving the problem of poor film printing and improving the display effect.
[0051] In exemplary embodiments of this disclosure, a composite tape is provided, such as... Figure 3 As shown, Figure 3 A schematic diagram of the structure of a composite tape according to an exemplary embodiment of the present disclosure is shown. It will be understood that in this embodiment... Figures 3 to 9 These are partial schematic diagrams of composite tape.
[0052] like Figures 3-5 As shown, the composite tape includes a heat dissipation layer 300, a foam layer 100, and an adhesive layer 400 stacked sequentially from top to bottom. The foam layer 100 includes a stacked buffer layer 120 and a sub-foam layer 110. The buffer layer 120 is coated on the first and / or second sides of the sub-foam layer 110, with the first and second sides being opposite sides. The elasticity of the buffer layer 120 is greater than the maximum deformation of the surface of the sub-foam layer 110.
[0053] In this embodiment, the composite tape can be attached to a display panel (not shown) via an adhesive layer 400, such as a double-sided adhesive tape like OCA adhesive. The composite tape includes a heat dissipation layer 300, enabling it to dissipate heat. The heat dissipation layer 300 can be a single-layer or multi-layer structure, and may include a copper layer. Optionally, the heat dissipation layer is formed of a single copper layer, such as copper foil, which has both thermal conductivity and heat dissipation capabilities and can also provide support. In other exemplary embodiments, the heat dissipation layer 300 can also be made of other materials with thermal conductivity and heat dissipation functions, such as graphite.
[0054] The maximum deformation of the sub-foam layer surface can be the maximum deformation caused by the devices or protrusions on the display panel surface corresponding to the sub-foam layer surface, or the maximum deformation caused by insufficient elasticity of the sub-foam layer structure itself.
[0055] like Figure 3 As shown, the foam layer 100 mainly serves to absorb light and provide cushioning. To balance the deformation of the foam layer 100 and ensure consistency between the foam layer 100 and the adhesive layer 400, the foam layer 100 is composed of a buffer layer 120 and a sub-foam layer 110. The buffer layer 120 is elastic, which can distribute stress points in the sub-foam layer to the contact surface of the buffer layer, thereby balancing the stress points and providing a cushioning effect. The buffer layer 120 can be formed from one or more of the following materials: foam pulp, polyvinyl alcohol adhesive, and vinyl adhesive. The buffer layer 120 can be located on the first surface of the sub-foam layer 110, that is, on the side of the foam layer 100 away from the adhesive layer 400. Optionally, the elasticity of the buffer layer 120 is greater than the maximum deformation of the first surface of the sub-foam layer 110. When the composite tape (SCF) of this embodiment is used to attach to the site equipment, such as when attaching to the surface of a display panel, the entire composite tape is compressed, and the sub-foam layer 110 inside is also compressed. When the sub-foam layer 110 deforms, the surface of the buffer layer 120 that contacts the first surface of the sub-foam layer 110 is deformed by the force generated by the deformation of each area of the first surface of the sub-foam layer 110, thereby absorbing the deformation of the first surface of the sub-foam layer 110, so that the surface deformation of each area on the second surface of the sub-foam layer 110 is consistent, ensuring that the thickness of the adhesive layer 400 is consistent, thereby solving the problem of poor film printing. Moreover, the buffer layer 120 can absorb the maximum deformation generated by the first surface of the sub-foam layer 110. For example, the maximum deformation is, for example, the maximum height difference generated when the surface of the sub-foam layer 110 deforms.
[0056] For example, refer to Figure 4As shown, the buffer layer 120 can also be located on the second side of the sub-foam layer 110, that is, the buffer layer 120 is located on the side of the foam layer 100 close to the adhesive layer 400. Optionally, the elasticity of the buffer layer 120 is greater than the maximum deformation of the second side of the sub-foam layer 110. When the composite tape (SCF) of this embodiment is used to attach the display panel, the entire composite tape is compressed, and the sub-foam layer 110 inside is also compressed. When the second surface of the sub-foam layer 110 deforms, the surface of the buffer layer 120 that contacts the second surface of the sub-foam layer 110 is deformed by the force generated by the deformation of each area of the second surface of the sub-foam layer 110, thereby absorbing the amount of deformation of the second surface of the sub-foam layer 110. The buffer layer 120 can absorb the maximum deformation of the second surface of the sub-foam layer 110, so that the surface deformation of each area of the buffer layer 120 away from the second surface of the sub-foam layer 110 is consistent, ensuring that the thickness of the adhesive layer 400 is consistent, thereby solving the problem of poor film printing of the display panel and improving the display effect of the display panel.
[0057] For example, refer to Figure 5 As shown, in order to more effectively absorb the deformation of the surface of the sub-foam layer 110, the buffer layer 120 can also be attached to the upper and lower surfaces of the sub-foam layer 110, that is, the buffer layer 120 is located on the first and second surfaces of the sub-foam layer 110. (See reference) Figure 5 As shown, the foam layer 100 includes a sub-foam layer 110 and a buffer layer 120 located on the upper and lower surfaces of the sub-foam layer 110. Optionally, the elasticity of the buffer layer 120 is greater than the maximum deformation of the first and second surfaces of the sub-foam layer 110. When the composite tape (SCF) of this embodiment is used to attach the display panel, the entire composite tape will be compressed, and the sub-foam layer 110 inside will also be compressed. When both sides of the sub-foam layer 110 are deformed, the surface of the buffer layer 120 that contacts the sub-foam layer 110 will be deformed by the force generated by the deformation of each area of the upper and lower sides of the sub-foam layer 110, thereby absorbing the deformation of the surface of the sub-foam layer 110. The buffer layer 120 can absorb the maximum deformation of any side of the sub-foam layer 110, so that the surface deformation of each area of the sub-foam layer 110 is consistent, ensuring that the thickness of the adhesive layer 400 is consistent, thereby solving the problem of poor film printing of the display panel, improving the display effect of the display panel, and improving the production yield.
[0058] Another embodiment of this disclosure also provides a composite tape, which is substantially the same as the foregoing embodiments, see reference. Figures 6 to 8As shown, the main differences include: the composite tape includes a foam layer 100, which includes a sub-foam layer 110 and a buffer layer 120. An adhesive layer 400 and a heat dissipation layer 300 are located on two surfaces of the foam layer 100. The sub-foam layer 110 contains hollow particles 200, while the buffer layer 120 does not. The maximum deformation of the surface of the sub-foam layer 110 can be the deformation generated on the surface corresponding to the region of maximum density of hollow particles 200 in the sub-foam layer 110. In this embodiment, to make the elasticity of the buffer layer 120 greater than that of the sub-foam layer 110, and to better absorb the deformation of the surface of the sub-foam layer 110, a buffer layer 120 without hollow particles 200 is formed. The following description, in conjunction with the accompanying drawings, will illustrate another embodiment of the composite tape provided in this disclosure. It should be noted that the same or corresponding parts as those in the foregoing embodiments can be referred to the corresponding descriptions in the foregoing embodiments, and will not be repeated hereafter.
[0059] refer to Figure 6 As shown, exemplarily, the first side of the sub-foam layer 110 is considered as the side of the foam layer 100 closest to the heat dissipation layer 300, and the buffer layer 120 is located on the first side of the sub-foam layer 110, that is, between the sub-foam layer 110 and the heat dissipation layer 300. To give the composite tape waterproof properties, the sub-foam layer 110 contains a predetermined concentration of hollow particles 200. For example... Figure 6 As shown, hollow particles 200 are irregularly distributed in the sub-foam layer 110, with a higher density of hollow particles 200 in some areas and a lower density in others. When the display panel is attached using the composite tape (SCF) of this embodiment, the entire composite tape is compressed, and the sub-foam layer 110 inside is also compressed. Due to the uneven distribution of hollow particles 200 in the internal structure of the sub-foam layer 110 and the fact that hollow particles 200 are not easily deformable, the sub-foam layer 110 in areas with higher density hollow particles 200 is harder and cannot deform, resulting in differences in the surface deformation of the sub-foam layer 110 in different parts. Therefore, a buffer layer 1 with an elasticity greater than that of the sub-foam layer 110 is used. 20. Optionally, the elasticity of the buffer layer 120 should be at least greater than the deformation of the surface corresponding to the densest area of hollow particles 200 in the sub-foam layer 110, so as to absorb the difference in deformation of the surface of the sub-foam layer 110. The buffer layer 120 can absorb the maximum deformation of the surface of the sub-foam layer 110, so that the surface deformation of each area of the sub-foam layer 110 is consistent, thereby ensuring that the thickness of the adhesive layer 400 is consistent, thus solving the problem of poor film printing in the display panel, improving the display effect of the display panel, and increasing the production yield.
[0060] For example, refer to Figure 6As shown, optionally, the region with the highest density of hollow particles 200 is the region in the sub-foam layer 110 composed of multiple hollow particles 200 with the highest density, and the deformation of the surface of the sub-foam layer 110 is the height difference of the deformation of the surface of the sub-foam layer 110.
[0061] In this embodiment, reference Figure 6 As shown, to better absorb the deformation of the sub-foam layer 110 surface and save manufacturing steps, the buffer layer 120 can be a foam paste without hollow particles 200. For example, during the production of foam layer 100, a foam paste without hollow particles 200 can be coated on the surface of the finished sub-foam layer 110 containing hollow particles 200, and then foamed in one step to obtain a layered foam layer 100. The finished structure of foam layer 100 is: the upper layer is the buffer layer 120 without hollow particles 200, and the lower layer is the sub-foam layer 110 containing hollow particles 200. When using the composite tape of this embodiment for attachment, the dense hollow particles 200 in the lower layer cause the sub-foam layer 110 to be relatively hard. This can be absorbed by the elastic properties of the upper buffer layer 120, thereby ensuring that the thickness of the adhesive layer 400 in each area is consistent, and preventing poor film printing on the display panel.
[0062] Among them, reference Figure 6 As shown, the concentration of hollow particles 200 in the sub-foam layer 110 can be doped according to actual needs. The thickness of the buffer layer 120 can be adjusted according to actual needs. For example, in order to completely absorb the deformation of the sub-foam layer 110, the thickness of the buffer layer 120 is greater than or equal to the diameter of a single hollow particle 200.
[0063] In other exemplary embodiments, reference is made to Figures 7 to 8 As shown, the buffer layer 120 without hollow particles 200 can also be located on the second side of the sub-foam layer 110 containing hollow particles 200, or on both sides of the sub-foam layer 110 containing hollow particles 200. The specific implementation scheme of the composite tape in this embodiment can be referred to the relevant description in the composite tape embodiment described in the foregoing embodiment, and has the beneficial effects of the corresponding embodiment, which will not be repeated here.
[0064] Another embodiment of this disclosure provides a composite tape that is substantially the same as the foregoing embodiments, see reference. Figure 9As shown, the main differences include: the buffer layer 120 of the foam layer 100 in this composite tape contains hollow particles 200, and the concentration of hollow particles 200 in the buffer layer 120 is less than the concentration of hollow particles 200 in the sub-foam layer 110. The composite tape provided by the embodiments of this disclosure will be described below with reference to the accompanying drawings. It should be noted that the same or corresponding parts as those in the foregoing embodiments can be referred to the corresponding descriptions in the foregoing embodiments, and will not be repeated hereafter.
[0065] refer to Figure 9 As shown, exemplarily, the foam layer 100 includes a buffer layer 120 and a sub-foam layer 110. The buffer layer 120 is located on the first surface of the sub-foam layer 110, that is, between the sub-foam layer 110 and the heat dissipation layer 300. To enhance the waterproof function of the composite tape, the sub-foam layer 110 contains hollow particles 200 of a first preset concentration, and the buffer layer 120 contains hollow particles 200 of a second preset concentration, wherein the second preset concentration is less than the first preset concentration. Figure 9 As shown, the hollow particles 200 in the sub-foam layer 110 and the buffer layer 120 are distributed in an irregular manner. When the composite tape (SCF) of this embodiment is used to attach the display panel, the entire composite tape is compressed, and the sub-foam layer 110 inside is also compressed. Because the concentration of hollow particles 200 in the internal structure of the sub-foam layer 110 is relatively high, and the hollow particles 200 are not easily deformed, the sub-foam layer 110 in the area where the hollow particles 200 are denser is harder and cannot be deformed, resulting in differences in the deformation of the sub-foam in different parts. Therefore, a buffer layer 120 with a lower concentration of hollow particles 200 is used to absorb the deformation differences of the sub-foam layer 110. The buffer layer 120 can absorb the maximum deformation that occurs on the surface of the sub-foam layer 110, so that the surface deformation of each area of the sub-foam layer 110 is consistent, ensuring that the thickness of the adhesive layer 400 is consistent. This enhances the waterproof performance of the composite tape, solves the problem of poor film printing on the display panel, improves the display effect of the display panel, and increases the production yield.
[0066] refer to Figure 9 As shown, the foam layer 100 includes an upper layer and a lower layer. Optionally, the upper layer is a buffer layer 120 containing hollow particles 200 at a second preset concentration, and the lower layer is a sub-foam layer containing hollow particles 200 at a first preset concentration. The second preset concentration is less than the first preset concentration, so that the concentration of hollow particles 200 in the foam layer 100 gradually increases from top to bottom. The elasticity of the upper buffer layer 120 is greater than that of the lower sub-foam layer 110. This causes the surface of the buffer layer 120 in contact with the sub-foam layer 110 to deform under the force generated by the deformation of various areas of the sub-foam layer 110, thereby absorbing the deformation of the surface of the sub-foam layer 110 and ensuring that the thickness of the adhesive layer 400 remains consistent.
[0067] In other exemplary embodiments, the foam layer comprises an upper layer and a lower layer. The upper layer is a sub-foam layer containing a first preset concentration of hollow particles, and the lower layer is a buffer layer containing a second preset concentration of hollow particles, wherein the second preset concentration is less than the first preset concentration. Because the concentration of hollow particles in the foam layer gradually decreases from top to bottom, the elasticity of the lower buffer layer is greater than that of the upper sub-foam layer. This causes the surface of the buffer layer in contact with the sub-foam layer to deform under the force generated by the deformation of various areas of the sub-foam layer's surface, thus absorbing the deformation of the sub-foam surface and ensuring that the thickness of the adhesive layer remains consistent.
[0068] In other exemplary embodiments, the foam layer includes an upper layer, a middle layer, and a lower layer. The upper and lower layers are buffer layers containing hollow particles at a second preset concentration, and the middle layer is a sub-foam layer containing hollow particles at a first preset concentration, wherein the second preset concentration is less than the first preset concentration. Because the concentration of hollow particles in the upper and lower layers of the foam layer is relatively low, the elasticity of the buffer layers in the upper and lower layers is greater than the elasticity of the sub-foam layer in the middle layer. This causes the surface of the buffer layer in contact with the sub-foam layer to deform under the force generated by the deformation of various areas of the sub-foam layer's surface, thereby absorbing the deformation of the upper and lower surfaces of the sub-foam and ensuring that the thickness of the adhesive layer remains consistent.
[0069] This disclosure provides a method for manufacturing a composite tape in exemplary embodiments, such as... Figure 10 As shown, Figure 10 A flowchart illustrating a method for manufacturing a composite tape according to an exemplary embodiment of the present disclosure is shown. The following is in conjunction with... Figures 3-9 The manufacturing method of composite tape is introduced.
[0070] like Figure 10 As shown, an exemplary embodiment of this disclosure provides a method for manufacturing a composite tape, including the following steps:
[0071] Step S110: Forming a sub-foam layer;
[0072] Step S120: Apply a buffer layer to the surface of the first and / or second side of the sub-foam layer, with the first and second sides being opposite sides; the sub-foam layer and the buffer layer constitute a foam layer; wherein, the elasticity of the buffer layer is greater than the maximum deformation of the surface of the sub-foam layer;
[0073] Step S130: A heat dissipation layer and an adhesive layer are formed on the two surfaces of the foam layer, respectively.
[0074] refer to Figures 3 to 5As shown, a sub-foam layer 110 is first formed. This sub-foam layer 110 is, for example, a material foamed from plastic particles. This sub-foam layer 110 has characteristics such as high elasticity, light weight, rapid pressure-sensitive fixing, ease of use, flexible bending, ultra-thin volume, and reliable performance. For example, it is PU (Polyurethane) foam. Then, a buffer layer 120 is coated on one or both sides of the sub-foam layer 110. The elasticity of the buffer layer 120 is greater than the maximum deformation of the surface of the sub-foam layer 110. The sub-foam layer 110 and the buffer layer 120 constitute a foam layer 100. Because the foam layer 100 is soft, it can provide excellent cushioning for stressed surfaces. Finally, a heat dissipation layer 300 and an adhesive layer 400 are formed on the upper and lower surfaces of the foam layer 100, respectively, as needed.
[0075] Composite tape can be applied to the surface of an OLED display panel via an adhesive layer to help dissipate heat. (Reference) Figures 3-5 As shown, when the composite tape is compressed, the different deformation of the foam in different parts will cause the adhesive layer 400 to bear different forces. The buffer layer 120 coated on the first and / or second surfaces of the sub-foam layer 110 in the composite tape is used to absorb the deformation of the sub-foam layer 110, so as to ensure that the deformation of each area of one or both surfaces of the foam layer 100 is consistent, thereby ensuring that the adhesive thickness of each area of the foam layer 100 is consistent, so as to solve the problem of poor film printing and improve the display effect of the display panel.
[0076] Another embodiment of this disclosure provides a method for manufacturing a composite tape. This method is largely the same as the aforementioned embodiment, with the main differences being: a different method for forming the foam layer and a different structure of the foam layer. The method for manufacturing the composite tape according to another embodiment of this disclosure will be described below with reference to the accompanying drawings. It should be noted that the same or corresponding parts as those in the aforementioned embodiments can be referred to the corresponding descriptions in the aforementioned embodiments, and will not be repeated hereafter.
[0077] like Figure 11 As shown, an exemplary embodiment of this disclosure provides a method for manufacturing a composite tape, including the following steps:
[0078] Step S210: Form a sub-foam layer and dope the sub-foam layer with hollow particles of a first preset concentration;
[0079] Step S220: Coat the surface of the first and / or second sides of the sub-foam layer with a buffer layer that does not contain hollow particles, with the first and second sides being opposite sides; the sub-foam layer and the buffer layer constitute the foam layer; wherein, the elasticity of the buffer layer is greater than the deformation generated on the surface corresponding to the region of maximum density of hollow particles in the sub-foam layer;
[0080] Step S230: A heat dissipation layer and an adhesive layer are formed on the two surfaces of the foam layer, respectively.
[0081] In this embodiment, optionally, the maximum deformation of the surface of the sub-foam layer can be the deformation generated on the surface corresponding to the region of maximum density of hollow particles in the sub-foam layer. (Reference) Figure 6 As shown, to give the composite tape waterproof properties, hollow particles 200 of a first preset concentration are doped into the sub-foam layer 110. The hollow particles 200 are irregularly distributed in the sub-foam layer 110, with a higher density of hollow particles 200 in some areas and a lower density in others. To better absorb the deformation of the surface of the sub-foam layer 110 and to save manufacturing steps, the buffer layer 120 is made of foam paste without hollow particles 200. For example, during the production of the foam layer 100, foam paste without hollow particles 200 can be directly coated onto the surface of the finished sub-foam layer 110 containing hollow particles 200, and then foamed in one step to obtain the laminated foam layer 100. The thickness of the buffer layer 120 is greater than or equal to the diameter of a single hollow particle 200. Optionally, the finished structure of the foam layer 100 is as follows: the upper layer is a buffer layer 120 without hollow particles 200, and the lower layer is a sub-foam layer 110 containing hollow particles 200. Finally, a heat dissipation layer 300 and an adhesive layer 400 are formed on the upper and lower surfaces of the foam layer 100 as needed.
[0082] During the application process using the composite tape of this embodiment, refer to Figure 6 As shown, the dense area of the hollow particles 200 in the lower layer causes the sub-foam layer 110 to be relatively hard. The height difference on the surface of the sub-foam layer 110 can be absorbed by the upper buffer layer 120 with good elasticity, thereby ensuring that the thickness of the adhesive layer 400 in each area is consistent, so as to prevent the display panel from having poor film printing.
[0083] Another embodiment of this disclosure provides a method for manufacturing a composite tape. This method is largely the same as the aforementioned embodiments, with the main differences being: a different method for forming the buffer layer and a different structure of the buffer layer. The method for manufacturing the composite tape according to another embodiment of this disclosure will be described below with reference to the accompanying drawings. It should be noted that the same or corresponding parts as those in the aforementioned embodiments can be referred to the corresponding descriptions in the aforementioned embodiments, and will not be repeated hereafter.
[0084] An exemplary embodiment of this disclosure provides a method for manufacturing a composite tape, comprising the following steps:
[0085] Step S310: Form a sub-foam layer and dope the sub-foam layer with hollow particles of a first preset concentration;
[0086] Step S320: Coat a buffer layer on the surface of the first and / or second side of the sub-foam layer, wherein the first and second sides are opposite sides; dop the buffer layer with hollow particles of a second preset concentration, wherein the second preset concentration is less than the first preset concentration; the sub-foam layer and the buffer layer constitute a foam layer; wherein the elasticity of the buffer layer is greater than the deformation generated on the surface corresponding to the region of maximum density of hollow particles in the sub-foam layer.
[0087] Step S330: A heat dissipation layer and an adhesive layer are formed on the two surfaces of the foam layer, respectively.
[0088] refer to Figure 9 As shown, to enhance the waterproof function of the composite tape, the sub-foam layer 110 contains hollow particles 200 at a first preset concentration, and the buffer layer 120 contains hollow particles 200 at a second preset concentration, wherein the second preset concentration is less than the first preset concentration. In this embodiment, the buffer layer 120 with a lower concentration of hollow particles 200 absorbs the deformation differences of the sub-foam layer 110. The buffer layer 120 can absorb the maximum deformation occurring on the surface of the sub-foam layer 110, making the surface deformation of each area of the sub-foam layer 110 consistent, thus ensuring that the thickness of the adhesive layer 400 remains consistent. This enhances the waterproof performance of the composite tape while solving the problem of poor film printing on the display panel, improving the display effect of the display panel, and increasing the production yield.
[0089] refer to Figure 9 As shown, the foam layer 100 includes an upper layer and a lower layer. The upper layer is a buffer layer 120 containing hollow particles 200 of a second preset concentration, and the lower layer is a sub-foam layer 110 containing hollow particles 200 of a first preset concentration. Exemplarily, during the production process of the foam layer 100, the concentration of hollow particles 200 in the upper and lower layers of the foam layer 100 can be changed by other means, so that the concentration of hollow particles 200 in the foam layer 100 gradually increases from top to bottom. The elasticity of the buffer layer 120 in the upper layer is greater than that of the sub-foam layer 110 in the lower layer, so that the surface of the buffer layer 120 in contact with the sub-foam layer 110 is deformed by the force generated by the deformation of each area of the sub-foam layer 110, so as to absorb the deformation of the surface of the sub-foam layer 110 and ensure that the thickness of the adhesive layer remains consistent.
[0090] In other exemplary embodiments, the foam layer comprises an upper layer and a lower layer. The upper layer is a sub-foam layer containing a first preset concentration of hollow particles, and the lower layer is a buffer layer containing a second preset concentration of hollow particles, wherein the second preset concentration is less than the first preset concentration. Because the concentration of hollow particles in the foam layer gradually decreases from top to bottom, the elasticity of the lower buffer layer is greater than that of the upper sub-foam layer. This causes the surface of the buffer layer in contact with the sub-foam layer to deform under the force generated by the deformation of various areas of the sub-foam layer's surface, thereby absorbing the deformation of the sub-foam surface and ensuring that the thickness of the adhesive layer remains consistent.
[0091] In other exemplary embodiments, the concentration of hollow particles in the upper, middle, and lower layers of the foam layer can be changed in other ways during the foam layer production process. For example, the foam layer includes an upper layer, a middle layer, and a lower layer. The upper and lower layers are buffer layers containing a second preset concentration of hollow particles, and the middle layer is a sub-foam layer containing a first preset concentration of hollow particles, wherein the second preset concentration is less than the first preset concentration. The lower concentration of hollow particles in the upper and lower layers of the foam layer results in greater elasticity of the buffer layers than the sub-foam layers in the middle layer. This causes the surfaces of the buffer layers in contact with the sub-foam layers to deform under the force generated by the deformation of various areas of the sub-foam layer's surface, thereby absorbing the deformation of the upper and lower surfaces of the sub-foam layer and ensuring that the thickness of the adhesive layer remains consistent.
[0092] This disclosure provides an exemplary embodiment of a display panel, which includes a panel for display purposes. The panel surface is coated with the composite tape provided in the above embodiments. For example, the composite tape can be attached to the surface of the panel to provide heat dissipation and waterproofing. When using the composite tape of this embodiment, areas where the sub-foam layer is too rigid to deform can be absorbed by a buffer layer with good elasticity, ensuring consistent adhesive layer thickness in all areas. This prevents poor film printing on the display panel and improves its display effect. Exemplarily, the composite tape can also be formed on the panel using the manufacturing method provided in the above embodiments. By improving the overall structure of the foam layer, a buffer layer and a sub-foam layer are used to form the foam layer. A buffer layer with an elasticity greater than the maximum deformation of the surface of the sub-foam layer is used. The buffer layer is coated on the first and / or second surfaces of the sub-foam layer to absorb the deformation of the sub-foam layer, ensuring that the deformation of each area on one or both surfaces of the foam layer is consistent. This ensures that the adhesive layer thickness is consistent in each area of the foam layer, thereby solving the problem of poor film printing and improving the display effect of the panel.
[0093] This disclosure provides an exemplary embodiment of a display device, which includes: electronic components; and a display panel of the above embodiment that is signal-connected to the electronic components. By improving the overall structure of the foam layer, the foam layer is formed using a buffer layer and a sub-foam layer, and a buffer layer with an elasticity greater than the maximum deformation of the surface of the sub-foam layer is used. The buffer layer is coated on the surface of the first and / or second surfaces of the sub-foam layer to absorb the deformation of the sub-foam layer, thereby ensuring that the deformation of each area of one or both surfaces of the foam layer is consistent, thus ensuring that the adhesive layer thickness of each area of the foam layer is consistent, thereby solving the problem of poor film printing and improving the display effect of the display device.
[0094] In the description of this specification, references to the terms "embodiment," "exemplary embodiment," "some implementation," "illustrated implementation," "example," etc., refer to specific features, structures, materials, or characteristics described in connection with an implementation or example that are included in at least one implementation or example of this disclosure.
[0095] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same implementation or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more implementations or examples.
[0096] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.
[0097] It is understood that the terms "first," "second," etc., as used in this disclosure may be used to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish one structure from another.
[0098] In one or more accompanying drawings, the same elements are represented by similar reference numerals. For clarity, many parts in the drawings are not drawn to scale. Furthermore, certain well-known parts may not be shown. For simplicity, a structure obtained after several steps may be depicted in a single drawing. Many specific details of this disclosure, such as the structure, materials, dimensions, processing methods, and techniques of the devices, are described below to provide a clearer understanding of the disclosure. However, as those skilled in the art will understand, this disclosure may be implemented without adhering to these specific details.
[0099] The various embodiments in this disclosure are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.
[0100] The scope of protection of this disclosure is not limited to the embodiments described above. Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its scope and spirit. If such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, then the intent of this disclosure also includes such modifications and variations.
Claims
1. A composite tape, characterized by, The composite tape includes a foam layer, the foam layer includes a buffer layer and a sub-foam layer, the buffer layer is coated on the surface of a first side and / or a second side of the sub-foam layer, the first side and the second side are opposite sides; The elasticity of the buffer layer is greater than the maximum deformation of the surface of the sub-foam layer, so as to absorb the deformation difference of the sub-foam layer and ensure that the deformation of each area of the foam layer surface is consistent. The sub-foam layer contains hollow particles, wherein the maximum deformation of the surface of the sub-foam layer includes the deformation generated on the surface corresponding to the region of maximum density of the hollow particles in the sub-foam layer; The thickness of the buffer layer is greater than or equal to the diameter of a single hollow particle.
2. The composite tape of claim 1, wherein The buffer layer does not contain the hollow particles.
3. The composite tape of claim 1, wherein The buffer layer contains hollow particles, and the concentration of the hollow particles in the buffer layer is lower than the concentration of the hollow particles in the sub-foam layer.
4. The composite tape of claim 1, wherein The buffer layer is made of one or more materials selected from foam pulp, polyvinyl alcohol adhesive, and vinyl adhesive.
5. The composite tape of claim 1, wherein The composite tape further includes an adhesive layer and a heat dissipation layer, which are located on two surfaces of the foam layer, respectively.
6. The composite tape of claim 5, wherein, The heat dissipation layer includes a copper layer.
7. A method of manufacturing a composite tape, characterized by, The manufacturing method includes: Forming a sub-foam layer; A buffer layer is coated on the surface of the first and / or second sides of the sub-foam layer, wherein the first side and the second side are opposite sides; the sub-foam layer and the buffer layer constitute a foam layer; The elasticity of the buffer layer is greater than the maximum deformation of the surface of the sub-foam layer, so as to absorb the deformation difference of the sub-foam layer and ensure that the deformation of each area of the foam layer surface is consistent. The sub-foam layer includes: Hollow particles of a first preset concentration are doped into the sub-foam layer; The maximum deformation of the surface of the sub-foam layer includes the deformation generated on the surface corresponding to the region of maximum density of hollow particles in the sub-foam layer; The thickness of the buffer layer is greater than or equal to the diameter of a single hollow particle.
8. The method of manufacturing a composite tape of claim 7, wherein, Coating a cushioning layer onto the surface of the first and / or second sides of the sub-foam layer includes: A buffer layer free of the hollow particles is coated on the surface of the first and / or second sides of the sub-foam layer.
9. The method of manufacturing a composite tape of claim 7, wherein, The manufacturing method further includes: Hollow particles of a second preset concentration are doped into the buffer layer, wherein the second preset concentration is less than the first preset concentration.
10. The method of manufacturing a composite tape of claim 7, wherein, The manufacturing method further includes: A heat dissipation layer and an adhesive layer are formed on the two surfaces of the foam layer, respectively.
11. A display panel, characterized by, include: panel; as well as The composite tape as described in any one of claims 1 to 6 or the composite tape manufactured using the manufacturing method described in any one of claims 7 to 10 is disposed on the surface of the panel.
12. A display device, characterized by comprising: include: Electronic devices; as well as The display panel as described in claim 11 is connected to the electronic device via signals.