X-ray detection device

Abstract

The X-ray detection apparatus of the present invention includes a capillary, an X-ray detection element, and a detection circuit. The capillary has multiple X-ray passage regions. The X-ray detection element has a conversion section and multiple pixel electrode sections. The conversion section is opposite to the capillary and absorbs X-rays to generate charge carriers. The detection circuit detects the charge carriers collected from the conversion section via the multiple pixel electrode sections. The inner diameter of each X-ray passage region, viewed from the direction of X-ray incidence, is smaller than the width of the arrangement direction of each pixel electrode section, viewed from the same direction. When multiple charge carriers generated by the incident X-rays are dispersedly collected by two or more pixel electrode sections, the detection circuit determines the pixel electrode section corresponding to the position of the X-ray incidence, corrects and evaluates the amount of charge carriers in that pixel electrode section, or ignores the incident X-rays.

Description

Technical Field

[0001] This disclosure relates to an X-ray detection device. Background Technology

[0002] Patent Document 1 discloses a technology related to an X-ray imaging device. This X-ray imaging device includes: a beam irradiation mechanism, a camera mechanism, an angle divergence limiting mechanism, and an X-ray image display mechanism. The beam irradiation mechanism irradiates the surface of a material with any beam of X-rays, particle rays, or ion beams. The camera mechanism is sensitive to the wavelength of the X-ray region. The angle divergence limiting mechanism controls the angle divergence of the X-rays incident on the camera mechanism. The X-ray image display mechanism displays the X-ray image captured by the camera mechanism. This X-ray imaging device captures fluorescent X-rays and scattered X-rays generated by the beam irradiating the material in the camera mechanism, and displays the captured images as moving images in the X-ray image display mechanism.

[0003] Patent document 2 discloses a technique for a two-dimensional photon counting element. Even when multiple charge carriers generated by the incident photon are partially collected by multiple pixel electrodes, this two-dimensional photon counting element can specifically determine the location of the incident photon.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2003-329622

[0007] Patent Document 2: International Publication No. 2015 / 87663

[0008] Non-patent literature

[0009] Non-patent document 1: R.Ballabriga et al., "The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging", IOP Science, February 8, 2013

[0010] Non-patent document 2: Grzegorz W.Deptuch et al., "An algorithm of an X-ray Hitallocation to a single pixel in a cluster and Its test-circuitimplementation", IEEE Transactions on Circuits and Systems, Volume 65, Issue 1, pp.185-197, Jan 2018

[0011] Non-patent document 3: Matthew C. Veale, Matthew David Wilson, Steven James Bell, and Dimitris Kitou, "An ASIC for the Study of Charge Sharing Effects in SmallPixel CdZnTe X-Ray Detectors", IEEE Transactions on Nuclear Science, November 2011 Summary of the Invention

[0012] The problem that the invention aims to solve

[0013] An X-ray detection element exists, comprising: a conversion section that absorbs X-rays incident from the surface side to generate charge carriers, and a plurality of pixel electrodes arranged on the back side of the conversion section. To improve the image quality obtained from such an X-ray detection element, a capillary, such as a capillary plate, is disposed opposite to the surface of the X-ray detection element. The capillary, as described here, is a component having a plurality of X-ray passage regions, such as a plurality of holes, that extend through the X-ray shielding region. By making the central axes of the plurality of X-ray passage regions parallel to each other, only the parallel components of the X-rays can pass through, thereby improving image quality.

[0014] In this context, it is generally believed that the smaller the inner diameter of the multiple X-ray passing regions of the capillary is compared to the pixel electrodes of the X-ray detection element, the lower the spatial resolution, and therefore, the clearer the image. However, the inventors' research has shown that this is not necessarily the case. A gap must be provided between adjacent pixel electrodes to electrically insulate them from each other. The smaller the inner diameter of the X-ray passing regions of the capillary, the higher the frequency of X-ray passing regions positioned within this gap. Multiple charge carriers generated by the X-rays passing through these X-ray passing regions are dispersed and collected by the two pixel electrodes located on either side of the gap. This phenomenon is called charge sharing. As a result, the incident position of the X-rays becomes blurred, the energy resolution decreases, and this becomes one cause of image blurring.

[0015] The purpose of this disclosure is to suppress image blurring caused by charge sharing in an X-ray detection apparatus equipped with an X-ray detection element and a capillary.

[0016] Technical means for solving problems

[0017] One aspect of this disclosure is an X-ray detection apparatus comprising: at least one capillary, at least one X-ray detection element, and at least one detection circuit. The capillary has: a first surface, a second surface opposite to the first surface, a plurality of X-ray passing regions, and an X-ray shielding region. The plurality of X-ray passing regions extend from the first surface to the second surface, and the X-ray shielding region is disposed between the plurality of X-ray passing regions. The X-ray detection element has a conversion section and a plurality of pixel electrode sections. The conversion section has: a third surface opposite to the second surface of the capillary, and a fourth surface opposite to the third surface. The conversion section absorbs X-rays to generate charge carriers. The plurality of pixel electrode sections are arranged in a two-dimensional configuration on the fourth surface of the conversion section. The detection circuit detects the charge carriers collected from the conversion section via the plurality of pixel electrode sections. The inner diameter of each X-ray passing region, viewed from the X-ray incident direction, is smaller than the width of the arrangement direction of each pixel electrode section, viewed from the same direction. When multiple charge carriers generated by the incident X-rays are dispersed and collected by two or more pixel electrodes, the detection circuit determines the pixel electrode corresponding to the position of the incident X-rays, corrects and evaluates the amount of charge carriers in the pixel electrode, or ignores the incident X-rays.

[0018] The effects of the invention

[0019] According to this disclosure, it is possible to suppress image blurring caused by charge sharing in an X-ray detection apparatus equipped with an X-ray detection element and a capillary. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view showing the structure of an X-ray detection device according to one embodiment.

[0021] Figure 2 This is a cut-out perspective view showing the appearance of the capillary plate.

[0022] Figure 3 This is a diagram used to illustrate an example of the effect of capillary plates.

[0023] Figure 4 This is a schematic diagram showing the structure of an X-ray detection element and a semiconductor integrated element.

[0024] Figure 5 This is a top view showing the configuration of multiple pixel electrodes on the back side of the conversion unit.

[0025] Figure 6 This diagram illustrates a case where a pixel electrode section contains multiple electrodes.

[0026] Figure 7 This is a diagram illustrating the function and effect of a guard ring.

[0027] Figure 8 (a), (b), and (c) are diagrams illustrating how the X-ray incident is ignored when there are two or more pixel electrode sections that have collected more than a threshold amount of charge carriers at the same time.

[0028] Figure 9 This is a three-dimensional view showing the X-ray detection element and the semiconductor integrated element.

[0029] Figure 10 It is a cross-sectional view schematically showing the configuration of the capillary plate, X-ray detection element and semiconductor integrated element.

[0030] Figure 11 This is a schematic diagram showing the structure of the first variant example.

[0031] Figure 12 (a) is a diagram schematically showing the structure of the second variation. Figure 12 (b) is a schematic diagram showing the structure of the third variation.

[0032] Figure 13 This is a schematic diagram showing the structure of the fifth variation.

[0033] Figure 14 This is a schematic diagram showing the structure of the fourth variation.

[0034] Figure 15 This is a schematic diagram showing the structure of the sixth variation. Figure 15 (a) is a diagram showing an example of a capillary plate with multiple X-ray detection elements. Figure 15(b) is a diagram showing an example of an X-ray detection element for multiple capillary plates opposite each other.

[0035] Figure 16 This is a schematic diagram showing the structure of the seventh variation.

[0036] Figure 17 This is a schematic diagram showing the structure of the seventh variation.

[0037] Figure 18 This is a schematic diagram showing the structure of the seventh variation.

[0038] Figure 19 This is a side view showing the capillary lens with respect to the 8th modified example.

[0039] Figure 20 This is a diagram illustrating an example of the internal structure of the pixel circuit in the 9th variation.

[0040] Figure 21 (a) is a diagram showing the case where multiple electrodes are connected to the input terminal of a signal generation unit. Figure 21 (b) is a diagram showing the respective situations where multiple electrodes are connected to multiple signal generation units.

[0041] Figure 22 This diagram shows the self-electrode section and the eight surrounding electrode sections that surround the self-electrode section.

[0042] Figure 23 (a) to (j) are diagrams showing 10 discrimination modes as examples of multiple discrimination modes set in the carrier input mode discrimination unit. Detailed Implementation

[0043] One aspect of this disclosure is an X-ray detection apparatus comprising: at least one capillary, at least one X-ray detection element, and at least one detection circuit. The capillary has: a first surface, a second surface opposite to the first surface, a plurality of X-ray passing regions, and an X-ray shielding region. The plurality of X-ray passing regions extend from the first surface to the second surface. The X-ray shielding region is disposed between the plurality of X-ray passing regions. The X-ray detection element has a conversion section and a plurality of pixel electrode sections. The conversion section has: a third surface opposite to the second surface of the capillary, and a fourth surface facing in the opposite direction to the third surface. The conversion section absorbs X-rays to generate charge carriers. The plurality of pixel electrode sections are arranged in a two-dimensional configuration on the fourth surface of the conversion section. The detection circuit detects the charge carriers collected from the conversion section via the plurality of pixel electrode sections. The inner diameter of each X-ray passing region, viewed from the X-ray incident direction, is smaller than the width of the arrangement direction of each pixel electrode section, viewed from the same direction. When multiple charge carriers generated by the incident X-rays are dispersed and collected by two or more pixel electrodes, the detection circuit determines the pixel electrode corresponding to the position of the incident X-rays, corrects and evaluates the amount of charge carriers in the pixel electrode, or ignores the incident X-rays.

[0044] In this X-ray detection apparatus, when charge sharing occurs—that is, when multiple charge carriers generated by the incident X-ray are dispersed and collected by multiple pixel electrodes—the detection circuit determines the pixel electrode corresponding to the position of the incident X-ray, corrects and evaluates the amount of charge carriers in that pixel electrode, or ignores the incident X-ray. This reduces the impact of charge carrier dispersion on the image. Therefore, energy resolution is improved, and image blurring caused by charge sharing is suppressed.

[0045] In one aspect of the X-ray detection apparatus of this disclosure, the multiple X-ray passing regions of the capillary may be arranged on a triangular grid on the first and second surfaces. The multiple pixel electrodes of the X-ray detection element may also be arranged on the fourth surface along the row and column directions. Thus, when the arrangement of the multiple X-ray passing regions differs from the arrangement of the multiple pixel electrodes, the frequency of X-ray passing regions being arranged in the gaps between the pixel electrodes is higher. In such cases, the above-described X-ray detection apparatus is particularly useful.

[0046] In one aspect of the X-ray detection apparatus disclosed herein, the second and third surfaces may be separated from each other by a gap. Since the X-rays expand more after passing through each X-ray passage region as the capillary moves further away from the X-ray detection element, the frequency of charge sharing increases. In such cases, the aforementioned X-ray detection apparatus is particularly useful. Furthermore, by moving the capillary further away from the X-ray detection element, the degree of freedom in the arrangement of the capillary and the X-ray detection element can be increased.

[0047] In one aspect of the X-ray detection apparatus of this disclosure, the second and third surfaces may also be bonded together via an adhesive. In this case, since the X-rays reach the conversion section of the X-ray detection element before the X-rays spread through each X-ray passage region, charge sharing can be reduced compared to the case where the second and third surfaces are separated from each other by a gap.

[0048] In one aspect of the X-ray detection apparatus of this disclosure, the central axes of multiple X-ray passing regions may be parallel to each other. In this case, the X-rays passing through the capillary can be parallelized, improving the clarity of the X-ray image.

[0049] The X-ray inspection apparatus of one aspect of this disclosure may further include: a container that hermetically houses the capillary, the X-ray detection element, and the detection circuit. The container may also have a window member that allows X-rays directed toward the capillary to pass through. In this case, dust can be prevented from adhering to the capillary, the X-ray detection element, and the detection circuit. In particular, when the X-ray passage area of ​​the capillary is a micro-aperture, if dust enters the aperture, it is difficult to remove, leading to image quality degradation. By including the aforementioned container in the X-ray inspection apparatus, dust can be prevented from entering the aperture, thereby maintaining image quality.

[0050] Alternatively, the X-ray detection apparatus of one aspect of the present invention may further include a support portion fixed to and supporting the side of the capillary. In this case, compared to the case where a second side of the capillary is supported, the capillary can be brought close to the X-ray detection element by an amount equal to the thickness of the member supporting the capillary. Therefore, the degree of X-ray spread through each X-ray passage region can be reduced, and charge sharing can be decreased.

[0051] Alternatively, one aspect of the X-ray detection apparatus of this disclosure may further include: a base member on which an X-ray detection element is mounted; and a support body erected on the base member to support the capillary. In this case, the second surface of the capillary can be easily made nearly parallel to the third surface of the X-ray. In other words, the central axis of the X-ray passage area can be easily made nearly perpendicular to the third surface of the X-ray detection element.

[0052] In one aspect of the X-ray detection apparatus of this disclosure, the detection circuit may be built into a semiconductor integrated device. The fourth surface of the X-ray detection element may also face the semiconductor integrated device. Each pixel electrode may also be connected to the semiconductor integrated device via a metal protrusion. Typically, the protrusions used for conductive connection mainly include metals with relatively high atomic numbers, such as lead (Pb) or gold (Au), and have the function of shielding X-rays. Therefore, by connecting each pixel electrode to the semiconductor integrated device via a metal protrusion, at least a portion of the detection circuit within the semiconductor integrated device can be protected from the influence of X-rays.

[0053] In one aspect of the X-ray detection apparatus of this disclosure, multiple X-ray detection elements may be arranged opposite a capillary. In this case, since multiple X-ray detection elements are arranged in a specific configuration, small X-ray detection elements can be used and a large area of ​​the light-receiving region can be achieved.

[0054] In one aspect of the X-ray detection apparatus disclosed herein, multiple capillaries may be arranged relative to one X-ray detection element. In this case, since multiple capillaries are arranged in a specific configuration, even if the manufacturing yield of large-area capillaries is low, the X-ray detection apparatus can be manufactured with a good yield using multiple small-area capillaries.

[0055] One aspect of the X-ray detection apparatus disclosed herein may also include: a first element column comprising two or more X-ray detection elements arranged along a predetermined direction; and a second element column comprising two or more X-ray detection elements arranged along the first element column. The X-ray detection elements of the first element column and the X-ray detection elements of the second element column may also be arranged alternately. In this case, when the X-ray detection apparatus is used as a line sensor, the non-sensing area (dead zone) between the X-ray detection elements can be reduced or eliminated.

[0056] In the following description, embodiments of the X-ray detection apparatus of this disclosure will be described in detail with reference to the accompanying drawings. Furthermore, the invention is not limited to these examples, but is intended to include all modifications within the meaning and scope indicated by and equivalent to the scope of the claims. In the following description, the same reference numerals are used to refer to the same elements, and repeated descriptions are omitted.

[0057] Figure 1 This is a cross-sectional view showing the structure of the X-ray detection apparatus 1 according to this embodiment. Figure 1As shown, the X-ray detection apparatus 1 of this embodiment includes a capillary plate 2, an X-ray detection element 3, a semiconductor integrated element 4, a base component 6, a heat sink 7, a Peltier element 8, multiple circuit boards 9, and a container 10.

[0058] The capillary plate 2 is an example of a capillary in this embodiment. The capillary plate 2 parallels the X-rays incident on the X-ray detection device 1 toward the X-ray detection element 3. The capillary plate 2 is plate-shaped, having a surface 21 as a first surface and a back surface 22 as a second surface opposite to the surface 21. In one example, the surface 21 and the back surface 22 are parallel to each other.

[0059] Figure 2 This is a cutaway perspective view showing the appearance of capillary plate 2. (Example) Figure 2 As shown, the capillary plate 2, viewed from the normal direction of surface 21 and back surface 22, i.e., the X-ray incident direction, has a circular shape. The shape of the capillary plate 2 is not limited to this; it can also be other shapes such as square or rectangular. The capillary plate 2 has multiple X-ray passing regions 23. Each X-ray passing region 23 extends from surface 21 to back surface 22 through the capillary plate 2. In one example, the X-ray passing region 23 is a hole extending from surface 21 to back surface 22. The X-ray passing region 23 is not limited to this; it can also be made of an X-ray permeable material filling the hole. The shape of the X-ray passing region 23, viewed from the normal direction of surface 21 and back surface 22, is, for example, circular. The multiple X-ray passing regions 23 are arranged on a triangular lattice on surface 21 and back surface 22. More specifically, the central axis of each X-ray passing region 23 overlaps with each point of the triangular lattice. The central axes of the multiple X-ray passing regions 23 are parallel to each other, along the normal direction of surface 21 and back surface 22. The capillary plate 2 also has an X-ray shielding region 24. The X-ray shielding region 24 is disposed between multiple X-ray passing regions 23. In other words, the entire portion of the capillary plate 2 outside the X-ray passing regions 23 is the X-ray shielding region 24.

[0060] A capillary plate 2 with such a structure can be manufactured, for example, as follows: First, a plurality of structures are fabricated in which cylindrical second members are arranged around a cylindrical first member to shield X-rays. Next, the structure is bundled and stretched along the axial direction. The structure is then cut into a plate shape along a plane perpendicular to the axis. Finally, the first member is etched away. No X-ray passage region 23 is formed at the periphery of the capillary plate 2; instead, an X-ray blocking region 25 exists. The blocking region 25 can be made of the same material as the X-ray shielding region 24, or it can be made of a different material. The blocking region 25 is circular in shape. The blocking region 25 is provided during the fabrication of the capillary plate 2 to maintain the structure during the stretching process.

[0061] X-rays are incident on the capillary plate 2 from the surface 21 side. The X-rays exit from the back side 22 side through the X-ray passage region 23. X-rays traveling in a direction inclined relative to the central axis of the X-ray passage region 23 are blocked by the X-ray shielding region 24 and do not exit from the back side 22 side. Thus, the capillary plate 2 aligns the direction of travel of the incident X-rays with the normal direction of the back side 22, resulting in parallel X-ray exit.

[0062] Figure 3 This diagram illustrates an example of the effect of the capillary plate 2. When a target object C is irradiated with excitation X-rays XR1 from an X-ray source D1, the target object C is excited to generate fluorescent X-rays XR2, which are then detected. The parallel component contained in the fluorescent X-rays XR2 passes through the X-ray passage region 23 of the capillary plate 2 and reaches the X-ray detection element 3. The optical axis of the X-ray source D1 is tilted relative to the central axis direction of the X-ray passage region 23, i.e., the normal direction of the surface 21, so the excitation X-rays XR1 hardly pass through the X-ray passage region 23. Therefore, the amount of excitation X-rays XR1 reaching the X-ray detection element 3 is reduced, enabling high-precision detection of the fluorescent X-rays XR2.

[0063] In one embodiment, the diameter of the capillary plate 2 is in the range of 1 mm to 1000 mm, and in one embodiment it is 25 mm. When the planar shape of the capillary plate 2 is quadrilateral, the diameter of the capillary plate 2 is replaced by the length of the long side. The inner diameter of the X-ray passing region 23 is in the range of several μm to several hundred μm, and in one embodiment it is 25 μm. The center-to-center spacing of the X-ray passing regions 23 is in the range of several μm to several hundred μm. The thickness of the capillary plate 2 is in the range of several hundred μm to several tens of mm, and in one embodiment it is 5.0 mm. The thickness of the capillary plate 2 is the distance between the surface 21 and the back surface 22, in other words, the length of the X-ray passing region 23. The material of the X-ray shielding region 24 is, for example, lead glass.

[0064] Refer again Figure 1 The X-ray detection element 3 is disposed opposite to the back surface 22 of the capillary plate 2. The X-ray detection element 3 detects X-rays passing through the capillary plate 2, for example... Figure 3 The fluorescent X-ray XR2 is shown. The X-ray detection element 3 is mounted on the semiconductor integrated device 4. In one example, the X-ray detection element 3 is flip-chip mounted relative to the semiconductor integrated device 4. Figure 4 This is a schematic diagram showing the structure of the X-ray detection element 3 and the semiconductor integrated element 4. (See diagram for example.) Figure 4 As shown, the X-ray detection element 3 of this embodiment has a conversion section 31 and a plurality of pixel electrode sections B.

[0065] The conversion section 31 is a bulk or layered component that absorbs X-rays (XR) to generate charge carriers. The conversion section 31 is, for example, made of at least one material selected from CdTe, CdZnTe, GaAs, InP, TlBr, HgI2, PbI2, Si, Ge, and α-Se. The conversion section 31 extends along a plane intersecting the incident direction of the X-rays (XR). The conversion section 31 has a surface 31a and a back surface 31b that face opposite directions. In one example, surface 31a and back surface 31b are parallel. The planar shape of the conversion section 31 is, for example, rectangular or square. The length of the long side of the conversion section 31 when its planar shape is rectangular, or the length of one side of the conversion section 31 when its planar shape is square, is, for example, in the range of 1 mm to 500 mm. A bias electrode 33, serving as a common electrode, is provided on surface 31a, covering the entire surface 31a. Surface 31a faces the back surface 22 of the capillary plate 2. X-rays (XR) that have passed through the capillary plate 2 and the bias electrode 33 are incident on surface 31a. The back surface 22 of the capillary plate 2 and the surface 31a of the X-ray detection element 3 are arranged in a manner that is nearly parallel to each other.

[0066] The multiple pixel electrode portions B are conductive films disposed on the back surface 31b of the conversion unit 31. The pixel electrode portions B are, for example, metal films. A high bias voltage is applied between the multiple pixel electrode portions B and the bias electrode 33 to deplete the conversion unit 31. Figure 5 This is a top view showing the arrangement of multiple pixel electrode sections B on the back surface 31b of the transformation unit 31. The multiple pixel electrode sections B are arranged in a two-dimensional configuration of M rows × N columns when viewed from the X-ray incident direction. M and N are integers greater than 2. The two-dimensional configuration is, for example, a matrix. The planar shape of the pixel electrode sections B is, for example, rectangular or square, having sides along the row and column directions. The width of each pixel electrode section B in the row and column directions is, for example, in the range of 10 μm to 10000 μm. Therefore, the inner diameter of each X-ray passing region 23 of the capillary plate 2, viewed from the X-ray incident direction, is smaller than the width of each pixel electrode section B in the row and column directions when viewed from the same direction. Each of the M × N pixel electrode sections B is formed in a pixel region of M rows and N columns in the transformation unit 31. Each pixel electrode section B collects the charge carriers generated in the corresponding pixel region. Figure 5 In the example, each pixel electrode portion B is composed of a single electrode. For example... Figure 6 As shown, for example, each pixel electrode portion B may also include multiple electrodes b. In the illustrated example, in each pixel electrode portion B, four square electrodes b are arranged in 2 rows and 2 columns. The material of the pixel electrode portion B is, for example, Al, AlCu, Au, other materials, or a combination of two or more of them.

[0067] like Figure 5As shown, a guard ring 34 is provided on the back surface 31b of the conversion unit 31, between the electrode group composed of multiple pixel electrode sections B and the edge, i.e., the side surface 31c, of the conversion unit 31. The guard ring 34 is a conductive film provided on the back surface 31b. The guard ring 34 is, for example, a metal film. The potential of the guard ring 34 is set to be the same as or close to the potential of the pixel electrode section B. Figure 7 This diagram illustrates the effect of the guard ring 34. During the fabrication of the X-ray detection element 3, the conversion section 31 is monolithically cut. Therefore, the side surface 31c of the conversion section 31 becomes a rough surface. When dark current A reaches the pixel electrode section B from this side surface 31c, it becomes noise, leading to image degradation. The guard ring 34, positioned between the side surface 31c and the pixel electrode section B, absorbs dark current A, reducing the amount of dark current A reaching the pixel electrode section B. Figure 5 As shown, the protective ring 34 is provided along the side 31c of the transformation section 31. When the planar shape of the transformation section 31 is square or rectangular, the planar shape of the protective ring 34 is a square or rectangular frame.

[0068] like Figure 4 As shown, the semiconductor integrated element 4 incorporates a detection circuit 5. The detection circuit 5 detects the charge carriers generated in the conversion unit 31 in each pixel region via each pixel electrode section B. Based on the detected charge carriers, the detection circuit 5 counts the number of X-ray photons in each pixel region. The detection circuit 5 is implemented, for example, using an integrated circuit such as an ASIC (Application Specific Integrated Circuit). The detection circuit 5 has multiple pixel circuits (M×N pixel circuits) 5a. Each pixel circuit 5a detects the charge carriers collected in its corresponding pixel electrode section B. Based on the detected charge carriers, each pixel circuit 5a counts the number of X-ray photons. Alternatively, each pixel circuit 5a may generate a signal representing the magnitude of the incident X-rays by integrating the charge carriers collected in its corresponding pixel electrode section B.

[0069] There are cases where multiple charge carriers generated by the incident X-rays are dispersed and collected by two or more pixel electrode sections B. In such cases, the detection circuit 5 determines the pixel electrode section B corresponding to the position where the X-rays were incident. The detection circuit 5 corrects and evaluates the amount of charge carriers in that pixel electrode section B.

[0070] Specifically, the detection circuit 5, when the charge carriers generated by the incident X-rays are collected by two or more pixel electrode sections B, determines the pixel electrode section B that collects the most charge carriers as the pixel electrode section B corresponding to the position of the X-ray incident. Furthermore, the detection circuit 5 evaluates the sum of the charge carriers collected in this pixel electrode section B and the eight pixel electrode sections B surrounding it as the amount of charge carriers collected by the pixel electrode section B corresponding to the position of the X-ray incident. Details of this method are described in Non-Patent Documents 1 and 2.

[0071] Alternatively, the detection circuit 5 can ignore the X-ray incident if the charge carriers generated by the incident X-ray are collected by two or more pixel electrode sections B. Specifically, a certain threshold is preset. If two or more pixel electrode sections B simultaneously collect more than the threshold amount of charge carriers, the detection circuit 5 ignores the X-ray incident. Figure 8 This is a diagram illustrating an example of this method. Here, the threshold is used as 2keV for illustration. Figure 8 Part (a) shows a case where a certain pixel electrode section Ba among multiple pixel electrode sections B detects a carrier quantity equivalent to 10 keV, while no carriers are detected in the surrounding pixel electrode sections B. In this case, only one pixel electrode section B collects a carrier quantity exceeding the threshold. Therefore, this pixel electrode section Ba is determined to be the pixel electrode section B corresponding to the position of X-ray incident. Furthermore, the amount of carriers in the pixel electrode section Ba is evaluated as the amount of carriers collected by the pixel electrode section B corresponding to the position of X-ray incident. Figure 8 Part (b) illustrates a case where a pixel electrode Ba detects a carrier quantity equivalent to 9 keV, while a pixel electrode Bb in a surrounding pixel electrode B detects a carrier quantity equivalent to 1 keV. In this case, only one pixel electrode B collects a quantity of carriers exceeding the threshold. Therefore, instead of determining that the carriers generated by the X-ray incident are collected by more than two pixel electrode Bs, pixel electrode Ba is determined to be the pixel electrode B corresponding to the position of X-ray incident. Furthermore, the quantity of carriers in pixel electrode Ba is evaluated as the quantity of carriers collected by pixel electrode B corresponding to the position of X-ray incident. Figure 8Part (c) shows a case where a pixel electrode Ba detects a carrier quantity equivalent to 7 keV, and a pixel electrode Bb in its vicinity detects a carrier quantity equivalent to 3 keV. In this case, there are two pixel electrodes B that have collected a quantity of carriers exceeding the threshold. Therefore, the detection circuit 5 determines that the carriers generated by the incident X-rays are collected by more than two pixel electrodes B, and none of the pixel electrodes B are determined to be the pixel electrode B corresponding to the position of the X-ray incident. Therefore, the incident X-rays are ignored. The details of this method are described in Non-Patent Document 3.

[0072] The function of the aforementioned detection circuit 5 can preferably be implemented by an electronic circuit including, for example, logic circuits, a computer, or a combination thereof. The computer includes a CPU and a memory, the CPU executing a program stored in the memory.

[0073] Figure 9 This is a perspective view showing the X-ray detection element 3 and the semiconductor integrated element 4. Figure 10 These are schematic cross-sectional views illustrating the arrangement of the capillary plate 2, the X-ray detection element 3, and the semiconductor integrated element 4. As shown in these figures, the X-ray detection element 3 is mounted on the semiconductor integrated element 4. The back surface 31b of the X-ray detection element 3 faces the semiconductor integrated element 4. Each pixel electrode portion B is connected to the semiconductor integrated element 4 via a metal protrusion 41. The protrusion 41 primarily contains metals with relatively high atomic numbers, such as lead (Pb) or gold (Au). The material of the protrusion 41 is, for example, lead solder, Au, In, etc. The diameter of the protrusion 41 is, for example, in the range of 10 μm to 10000 μm. The protrusion 41 serves to shield against X-rays. The protrusion 41 protects at least a portion of each pixel circuit 5a within the semiconductor integrated element 4 from the influence of X-rays that have passed through the conversion section 31. The atomic number of the metal constituting the protrusion 41 may also be greater than the atomic number of the material constituting the conversion section 31. Directly below the protrusion 41 in the X-ray incident direction, a section of the pixel circuit 5a that is particularly susceptible to X-rays can also be configured.

[0074] The bias electrode 33 disposed on the surface 31a of the conversion section 31 of the X-ray detection element 3 is connected to any circuit board 9 (see reference 42) via a bonding wire 42. Figure 1 Electrical connection. A bias voltage is applied to the bias electrode 33 via bonding wire 42. On the surface of the semiconductor integrated element 4, i.e., the surface opposite to the X-ray detection element 3, M×N electrodes connected to the protrusion 41 and multiple electrodes for signal output are provided. These electrodes are electrically connected to any circuit board 9 via bonding wire 43. A signal voltage is output from bonding wire 43. The bias voltage applied to the bias electrode 33 via bonding wire 42 is much larger than the signal voltage output from bonding wire 43. Figure 9As shown, in the top view, the extension directions of solder wire 42 and solder wire 43 intersect each other. Solder wires 42 and 43 do not overlap or intersect each other in the top view. This structure reduces the impact of bias voltage on the signal voltage, i.e., noise. Solder wire 42 protrudes on the X-ray detection element 3. To avoid interference between solder wire 42 and the capillary plate 2, as... Figure 10 As shown, the back surface 22 of the capillary plate 2 and the surface of the X-ray detection element 3, i.e., the surface of the bias electrode 33, are separated from each other by a gap. In one example, the distance between the back surface 22 and the surface of the X-ray detection element 3 is in the range of 1 mm to 100 mm.

[0075] Refer again Figure 1 The base member 6 is a plate-like or block-like component that mounts the X-ray detection element 3 and the semiconductor integrated element 4. The base member 6 is made of a material with high thermal conductivity. In one example, the base member 6 is made of metal. In one embodiment, the base member 6 is made of aluminum. The base member 6 has a mounting surface 61 and a back surface 62. The mounting surface 61 is a flat surface opposite to the back surface of the semiconductor integrated element 4. The back surface 62 is a flat surface opposite to the mounting surface 61. The mounting surface 61 is bonded to the back surface of the semiconductor integrated element 4 via a thermally conductive adhesive material. The adhesive material is, for example, silver paste, copper paste, a heat sink, other materials, or a combination of two or more of these. A step difference is provided around the mounting surface 61. At least one circuit board 9 is disposed on a surface 63 that descends one step from the mounting surface 61.

[0076] At least one of the multiple circuit boards 9 is electrically connected to the semiconductor integrated element 4 via bonding wire 43. Other circuit boards 9 are electrically connected to adjacent other circuit boards 9. Circuits for controlling the detection circuit 5, and other circuits forming part of the detection circuit 5, are provided on these circuit boards 9. The circuit boards 9 are, for example, printed circuit boards.

[0077] The heat sink 7 is provided to cool the semiconductor integrated device 4 by dissipating the heat generated thereon. The heat sink 7 has an upper surface 71 and a plurality of fins 72. The upper surface 71 faces the back surface 62 of the base member 6. The fins 72 project in the opposite direction to the orientation of the upper surface 71 and are arranged along the direction of the upper surface 71. The heat sink 7 is made of a material with high thermal conductivity. In one example, the heat sink 7 is made of metal. The material of the heat sink 7 may be the same as or different from that of the base member 6. The upper surface 71 is joined to the back surface 62 of the base member 6 via a Peltier element 8. The Peltier element 8 is driven by electricity supplied via wiring (not shown). The Peltier element 8 causes heat to move from the base member 6 to the heat sink 7.

[0078] Container 10 houses a capillary plate 2, an X-ray detection element 3, a semiconductor integrated element 4, a base member 6, a heat sink 7, a Peltier element 8, and a circuit board 9. The material of container 10 is, for example, aluminum, iron, stainless steel, other materials, or a combination of two or more of these. Container 10 has at least two spaces 11 and 12 spaced apart from each other. Space 11 is hermetically sealed and houses the capillary plate 2, X-ray detection element 3, semiconductor integrated element 4, base member 6, and circuit board 9. Space 12 communicates with the external space of container 10 via a vent and houses the heat sink 7. Spaces 11 and 12 are separated from each other by a partition 13. The partition 13 has an opening 13a in which the Peltier element 8 is disposed. The periphery of the heat sink 7 contacts the partition 13, thereby maintaining the hermetical seal of space 11.

[0079] A fan 16 is installed on a portion of the wall that divides the space 12, excluding the partition 13. The fan 16 draws in or exhausts air through an opening (not shown) provided in the wall. As a result, the heat released from the radiator 7 is released to the outside of the container 10.

[0080] An opening 110 for X-ray passage is formed on a portion of the wall surface of the partition space 11, excluding the partition 13. The container 10 also includes a window member 14 that hermetically blocks the opening 110. The window member 14 allows X-rays toward the capillary plate 2 to pass through. The material of the window member 14 is, for example, beryllium, aluminum, carbon, other materials, or a combination of two or more of these. The capillary plate 2, with its surface 21 facing the window member 14, is supported by a support portion 15 of the container 10 and fixed to the wall surface of the partition space 11, with its back surface 22 facing the window member 14.

[0081] The effects obtained by the X-ray detection apparatus 1 of this embodiment as described above will be explained. As described above, in order to improve the image quality obtained by the X-ray detection element 3, a capillary plate 2 is disposed opposite to the surface of the X-ray detection element 3. By making the central axes of the multiple X-ray passage regions 23 parallel to each other, only the parallel components of the X-rays can pass through, thereby improving the image quality. In this case, it is generally believed that the smaller the inner diameter of the multiple X-ray passage regions 23 of the capillary plate 2 is than the width of the pixel electrode portions B in the arrangement direction, the clearer the image can be obtained. However, through the research of the inventors, it has been proven that this is not necessarily the case. A gap must be provided between adjacent pixel electrode portions B to electrically insulate the pixel electrode portions B from each other (see reference). Figure 5The smaller the inner diameter of the X-ray passage region 23 of the capillary plate 2, the higher the frequency of X-ray passage region 23 positioned in this gap. Multiple charge carriers generated by the X-rays passing through region 23 are dispersed and collected by the two pixel electrode portions B located on either side of the gap. This phenomenon is called charge sharing. As a result, the incident position of the X-rays becomes blurred, and the energy resolution decreases, becoming one cause of image blurring.

[0082] To address this problem, in the X-ray detection apparatus 1 of this embodiment, in the case of charge sharing—that is, when multiple charge carriers generated by the incident X-ray are dispersed and collected by multiple pixel electrode portions B—the detection circuit 5 determines the pixel electrode portion B corresponding to the position of the incident X-ray, corrects and evaluates the amount of charge carriers in that pixel electrode portion B, or ignores the incident X-ray. This reduces the impact of charge carrier dispersion on the image. Therefore, energy resolution can be improved, and image blurring caused by charge sharing can be suppressed.

[0083] in addition, Figure 3 The energy of the excitation X-ray XR1 shown is higher than that of the fluorescence X-ray XR2. Without the capillary plate 2, due to the high energy, the excitation X-ray XR1 passes through the conversion section 31 and reaches the protrusion 41. This generates fluorescence X-rays on the protrusion 41, which are absorbed by the conversion section 31, generating charge carriers. These charge carriers become noise, thus contributing to reduced image sharpness. In particular, when the energy of the L-rays from the material constituting the protrusion 41 is in the range of several keV to 20 keV, there is a high probability of overlap with the energy of the fluorescence X-ray XR2, which is the object of detection. By arranging the capillary plate 2 as in this embodiment, the amount of excitation X-ray XR1 reaching the protrusion 41 can be significantly reduced, suppressing the reduction in image sharpness.

[0084] As in this embodiment, the plurality of X-ray passing regions 23 of the capillary plate 2 can also be arranged on a triangular grid on the surface 21 and the back surface 22. The plurality of pixel electrode portions B of the X-ray detection element 3 can also be arranged along the row and column directions on the back surface 31b. In this way, when the arrangement of the plurality of X-ray passing regions 23 is different from the arrangement of the plurality of pixel electrode portions B, the frequency of X-ray passing regions 23 being arranged in the gaps between the pixel electrode portions B is higher. In this case, the X-ray detection device 1 of this embodiment is particularly useful.

[0085] As in this embodiment, the back surface 22 of the capillary plate 2 and the surface of the X-ray detection element 3 can also be separated from each other by gaps. Since the further the capillary plate 2 is from the X-ray detection element 3, the greater the X-ray spread after passing through each X-ray passage region 23, the higher the frequency of charge sharing. In this case, the X-ray detection apparatus 1 of this embodiment is particularly useful. Furthermore, by moving the capillary plate 2 away from the X-ray detection element 3, the degree of freedom in the arrangement of the capillary plate 2 and the X-ray detection element 3 can be increased.

[0086] As in this embodiment, the central axes of multiple X-rays passing through region 23 can also be parallel to each other. In this case, the X-rays passing through capillary plate 2 can be parallelized, thereby improving the clarity of the X-ray image.

[0087] As in this embodiment, the X-ray detection apparatus 1 may also include a container 10 that hermetically houses the capillary plate 2, the X-ray detection element 3, and the detection circuit 5. The container 10 may also have a window member 14 that allows X-rays directed toward the capillary plate 2 to pass through. In this case, dust can be prevented from adhering to the capillary plate 2, the X-ray detection element 3, and the detection circuit 5. In particular, when the X-ray passage area 23 of the capillary plate 2 is a micropore, dust entering the pore is difficult to remove, leading to image quality degradation. By including the container 10 in the X-ray detection apparatus 1, dust can be prevented from entering the pore, thus maintaining image quality. Furthermore, to prevent dust from entering the pore, the capillary plate 2 may be completely sealed with an X-ray permeable material. The airtightness of the space 11 may also be such that dust does not intrude into the space 11. Depending on the situation, the space 11 may not be airtight. Alternatively, only the capillary plate 2 and its surrounding area within the space 11 may be airtight.

[0088] (First variation)

[0089] Figure 11 This diagram schematically illustrates the structure of a first variation of the above embodiment. In the above embodiment, the back surface 22 of the capillary plate 2 and the surface of the X-ray detection element 3, i.e., the surface of the bias electrode 33, are separated from each other by a gap. Figure 11 As shown, the surfaces of the back surface 22 and the X-ray detection element 3 can also be bonded to each other via adhesive 17. In this case, the capillary plate 2 and the X-ray detection element 3 are close to each other. Therefore, the X-ray reaches the conversion section 31 of the X-ray detection element 3 before the X-ray propagation through each X-ray passage region 23. Therefore, charge sharing can be reduced compared to the case where the surfaces of the back surface 22 and the X-ray detection element 3 are separated from each other by gaps. Figure 11In this configuration, the adhesive 17 is only disposed directly below the non-transmission area 25, and not directly below the X-ray transmission area 23. This prevents the incident X-rays from being absorbed by the adhesive 17. Therefore, even when the energy of the incident X-rays is low, the decrease in sensitivity of the X-ray detection device 1 can be suppressed. Not limited to this method, when the energy of the incident X-rays is high, the adhesive 17 can also be disposed entirely on the back surface 22, including the area directly below the X-ray transmission area 23.

[0090] (Second variation)

[0091] Figure 12 Part (a) is a diagram schematically illustrating the structure of a second variation of the above embodiment. In the above embodiment, the back surface 22 of the capillary plate 2 is supported by the support portion 15 of the container 10 (see reference). Figure 1 ).like Figure 12 As shown in part (a), the support portion 15 of the container 10 can be fixed to the side surface 26 of the capillary plate 2 and support the capillary plate 2. In this case, compared to the case where the support portion 15 supports the back surface 22 of the capillary plate 2, the capillary plate 2 can be brought closer to the X-ray detection element 3 by the amount of thickness of the support portion 15. Therefore, the degree of X-ray spread through each X-ray transmission region 23 can be reduced, and charge sharing can be decreased. The support portion 15 and the side surface 26 of the capillary plate 2 can be fixed to each other, for example, using resin.

[0092] (3rd variation)

[0093] Figure 12 Part (b) is a diagram schematically illustrating the structure of the third variation of the above embodiment. In the above embodiment, the capillary plate 2 is fixed to the wall of the dividing space 11 by the support portion 15 (see reference). Figure 1 ).like Figure 12As shown in (b), the X-ray detection apparatus may also have a support body 18 instead of the support portion 15. The support body 18 is erected on the base member 6. The support body 18 supports the back surface 22 or side surface 26 of the capillary plate 2. The support body 18 may be columnar, or cylindrical, surrounding the X-ray detection element 3. The material of the support body 18 may be, for example, aluminum, iron, stainless steel, other materials, or a combination of two or more of them. The support body 18 may be joined to the base member 6 or may be integrally formed with the base member 6. In one example, the support body 18 is disposed on the surface 63, which descends one step from the mounting surface 61 of the base member 6. According to this modification, the back surface 22 of the capillary plate 2 and the surface of the X-ray detection element 3 can be easily made nearly parallel to each other. In other words, the central axis of the X-ray passage region 23 can be easily made nearly perpendicular to the surface of the X-ray detection element 3. Therefore, a clearer image can be obtained. To facilitate the formation of bonding lines 42 and 43, the capillary plate 2 and the support 18 can be detached from each other, or the support 18 and the base member 6 can be detached from each other.

[0094] (4th variation)

[0095] Figure 14 This diagram schematically illustrates the structure of the fourth variation of the above-described embodiment. In the above embodiment, the capillary plate 2 and the X-ray detection element 3 are positioned one-to-one opposite each other. Figure 14 As shown, multiple X-ray detection elements 3 can also be arranged opposite a capillary plate 2. In this case, since multiple X-ray detection elements 3 are arranged in a specific configuration, it is possible to use small X-ray detection elements 3 and achieve a large area of ​​light-receiving region.

[0096] (5th variation)

[0097] Figure 13 This diagram schematically illustrates the structure of the fifth variation of the above-described embodiment. In the above embodiment, the capillary plate 2 and the X-ray detection element 3 are positioned one-to-one opposite each other. Figure 13 As shown, multiple capillary plates 2 can also be used opposite to one X-ray detection element 3. In this case, since multiple capillary plates 2 are arranged in a configuration, even if the manufacturing yield of large-area capillary plates 2 is low, multiple small-area capillary plates 2 can be used to manufacture X-ray detection devices with good yield.

[0098] (Sixth variation)

[0099] Figure 15 This is a diagram schematically illustrating the structure of the sixth variation of the above-described embodiment. (As shown...) Figure 15 As shown, multiple capillary plates 2 and X-ray detection elements 3 can also be configured separately. In this case, as... Figure 15As shown in part (a), multiple X-ray detection elements 3 can also be positioned opposite a capillary plate 2. Alternatively, as... Figure 15 As shown in part (b), multiple capillary plates 2 can also be used opposite to one X-ray detection element 3. According to this modified example, it is possible to further increase the area of ​​the light-receiving region.

[0100] (Seventh variation)

[0101] Figures 16-18 This diagram schematically illustrates the structure of the seventh modification of the above-described embodiment. As in this modification, the X-ray detection apparatus may also include a first element row 3A and a second element row 3B. The first element row 3A and the second element row 3B are composed of two or more X-ray detection elements 3. The two or more X-ray detection elements 3 in the first element row 3A are arranged along a predetermined direction intersecting the X-ray incident direction. The two or more X-ray detection elements 3 in the second element row 3B are arranged along the first element row 3A. Figure 16 and Figure 17 As shown, the X-ray detection elements 3 in the first element column 3A and the X-ray detection elements 3 in the second element column 3B can also be arranged in an alternating manner. In this case, as... Figure 16 As shown, the capillary plate 2 and the X-ray detection element 3 are also positioned one-to-one. Or, as... Figure 17 As shown, multiple X-ray detection elements 3 can also be used opposite a single capillary plate 2. For example... Figure 18 As shown, the multiple capillary plates 2 on the first element row 3A and the multiple capillary plates 2 on the second element row 3B can also be arranged alternately. In this case, multiple capillary plates 2 can also be opposite to one X-ray detection element 3. According to this modified example, when the X-ray detection device is used as a line sensor, the non-sensing area (dead zone) between the X-ray detection elements 3, which is mainly caused by the protective ring 34, can be reduced or eliminated. Furthermore, when the X-ray detection device is used as a line sensor, the non-sensing area (dead zone) between the capillary plates 2, which is mainly caused by the non-passage area 25 of the capillary plates 2, can be reduced or eliminated.

[0102] (8th variation)

[0103] Figure 19 This is a side view of the capillary lens 2A of the eighth variation of the above embodiment. Figure 19The X-ray XR3 incident on the capillary lens 2A and the X-ray XR4 exiting from the capillary lens 2A are shown together. The capillary lens 2A is an example of a capillary in this modified example, configured to replace the capillary plate 2 in the above embodiment. The capillary lens 2A is generally cylindrical. The cross-section perpendicular to the central axis of the capillary lens 2A is a circle with a center on the central axis. The X-ray XR3, which is a point-like X-ray source D2, is incident on one end face 27 and exits as a parallel X-ray XR4 from the other end face 28. Therefore, the diameter of the capillary lens 2A gradually decreases as it approaches the end face 27 on the incident side. The spacing between the central axes of the multiple X-ray passing regions of the capillary lens 2A is constant near the exit end face 28, and the central axes of the multiple X-ray passing regions are parallel to each other. The spacing between the central axes of the multiple X-ray passing regions gradually decreases as it approaches the end face 27 on the incident side. Even with such a capillary lens 2A, the X-ray detection device can achieve the same effect as the embodiment described above. Furthermore, by using the capillary lens 2A instead of the capillary plate 2 in the above embodiment, the fluorescence X-ray image can be magnified or reduced during imaging.

[0104] (9th variation)

[0105] In the above embodiment, when multiple charge carriers generated by the incident X-ray are dispersed and collected by two or more pixel electrode portions B, the detection circuit 5 determines the pixel electrode portion B that collects the most charge carriers as the pixel electrode portion B opposite to the position where the X-ray was incident. The method for determining the pixel electrode portion B is not limited to this; for example, the method of this modified example can also be used.

[0106] Figure 20 This is a diagram illustrating an example of the internal structure of each pixel circuit 5a in this modified example. (See diagram for example.) Figure 20 As shown, the pixel circuit 5a includes: a signal generation unit 51, current output units 52a and 52b, an addition unit 53, a comparison unit 54, a carrier input signal generation unit 55, a carrier input mode discrimination unit 56, and a counting unit 57.

[0107] The signal generation unit 51 is electrically connected to the pixel electrode section B of the plurality of pixel electrode sections B, which corresponds to the pixel circuit 5a to which the signal generation unit 51 belongs. In the following description, this pixel electrode section B is referred to as the self-electrode section B0. The signal generation unit 51 generates an input signal SP1 by performing charge-voltage conversion of charge carriers. The input signal SP1 has a voltage waveform of magnitude corresponding to the number of charge carriers input to the pixel circuit 5a from the self-electrode section B0. In the case where each pixel electrode section B includes multiple electrodes b (see...),... Figure 6 ),like Figure 21As shown in part (a), multiple electrodes b are connected to the input terminal of a signal generation unit 51. Alternatively, as... Figure 21 As shown in part (b), a plurality of signal generation units 51 may also be provided, the same number as the electrodes b. Each of the plurality of electrodes b is connected to a respective of the plurality of signal generation units 51.

[0108] The current output unit 52a is connected to the output terminal of the signal generation unit 51. The current output unit 52a receives the input signal SP1 from the signal generation unit 51. The current output unit 52a generates a current signal SC of a magnitude corresponding to the input signal SP1, which is a voltage signal. The current output unit 52a provides the current signal SC to the pixel circuit 5a connected to the designated pixel electrode section B, which is disposed in the pixel electrode section B surrounding the self-electrode section B0. In the following description, the pixel electrode section B disposed around the self-electrode section B0 will be referred to as the surrounding electrode section.

[0109] Here, refer to Figure 22 . Figure 22 This diagram shows the self-electrode section B0 and the eight surrounding electrode sections B1 to B8 that surround the self-electrode section B0. Figure 22 In the example shown, peripheral electrode sections B1 to B3 are located in the row preceding the self-electrode section B0, peripheral electrode sections B4 and B5 are located in the same row as the self-electrode section B0, and peripheral electrode sections B6 to B8 are located in the row following the self-electrode section B0. Furthermore, peripheral electrode sections B1, B4, and B6 are located in the row preceding the self-electrode section B0, peripheral electrode sections B2 and B7 are located in the same row as the self-electrode section B0, and peripheral electrode sections B3, B5, and B8 are located in the row following the self-electrode section B0. In this modified example, the current output section 52a provides a current signal SC to the pixel circuit 5a connected to the peripheral electrode sections B1, B2, and B4.

[0110] Refer again Figure 20The current output unit 52b is connected to the output terminal of the signal generation unit 51. The current output unit 52b receives the input signal SP1 from the signal generation unit 51. The current output unit 52b generates a current signal SC of the same magnitude as the input signal SP1, which is a voltage signal. The current output unit 52b provides the current signal SC to the addition unit 53. The addition unit 53 is connected to the current output units 52a of three pixel circuits 5a connected to designated electrode units B5, B7, and B8 among the surrounding electrode units B1 to B8. The addition unit 53 receives the current signals SC from the current output units 52a of these three pixel circuits 5a. The addition unit 53 adds the three received current signals SC to the current signal SC provided from the current output unit 52b of the pixel circuit 5a to which the addition unit 53 belongs. The addition unit 53 generates a voltage signal SP2 of the same magnitude as the current after addition. The voltage signal SP2 has a voltage waveform corresponding to the sum of the number of charge carriers input to the self-electrode section B0 and the designated electrode sections B5, B7, and B8. The designated electrode sections B5, B7, and B8 are peripheral electrode sections considered to be included within the dispersion range of charge carriers caused by the incident X-rays when each pixel circuit 5a counts the number of photons of the incident X-rays. The designated electrode sections B5, B7, and B8 are arbitrarily and predetermined from the peripheral electrode sections B1 to B8. For example, in multiple pixel circuits 5a, the self-electrode section B0 may exist at the row or column ends, thus there may be pixel circuits 5a where a portion of the specific electrode sections B5, B7, and B8 relative to the self-electrode section B0 are absent. In such pixel circuits 5a, the addition unit 53 may not add the current signal SC from the absent designated electrode sections. For example, in multiple pixel circuits 5a, the self-electrode section B0 may exist at both the row and column ends, thus there may be pixel circuits 5a where all the designated electrode sections B5, B7, and B8 relative to the self-electrode section B0 are absent. In such a pixel circuit 5a, the addition unit 53 and the subsequent circuitry are not necessary and can be omitted.

[0111] The comparator 54 is connected to the output terminal of the adder 53. The comparator 54 receives the voltage signal SP2 from the adder 53. The comparator 54 determines whether the peak voltage of the voltage signal SP2 exceeds a predetermined threshold. That is, the comparator 54 determines whether a number of charge carriers equivalent to one or more photons being measured are generated around the self-electrode B0. If the peak voltage of the voltage signal SP2 exceeds the predetermined threshold, the comparator 54 outputs a high-level valid value as the determination result signal S1. If the peak voltage of the voltage signal SP2 does not exceed the predetermined threshold, the comparator 54 outputs a low-level invalid value as the determination result signal S1.

[0112] The carrier input signal generation unit 55 is connected to the output terminal of the signal generation unit 51. The carrier input signal generation unit 55 receives the input signal SP1 from the signal generation unit 51. When an input signal SP1 exceeding a certain threshold is input, the carrier input signal generation unit 55 outputs a high-level valid value as the carrier input signal S2 to indicate the presence of carrier input to the self-electrode unit B0. The threshold is, for example, a value slightly larger than the noise level. When an input signal SP1 not exceeding the aforementioned threshold is input, the carrier input signal generation unit 55 outputs a low-level invalid value as the carrier input signal S2. The carrier input signal S2 is provided to the seven pixel circuits 5a connected to the peripheral electrode units B2 to B8.

[0113] The carrier input mode discrimination unit 56 receives carrier input signals S2 from the seven pixel circuits 5a respectively connected to the surrounding electrode sections B1 to B7. Based on these carrier input signals S2, the carrier input mode discrimination unit 56 determines whether the carrier input mode is consistent with any of the plurality of discrimination modes. The carrier input mode indicates whether there is an input of carriers to the electrode section B0 and the surrounding electrode sections B1 to B7 for each electrode. In the carrier input mode, the case of which pixel electrode section B among the electrode section B0 and the surrounding electrode sections B1 to B8 receives the carrier input is patterned. If the carrier input mode is consistent with any of the plurality of discrimination modes and an effective value such as a high level is input as the determination result signal S1, the carrier input mode discrimination unit 56 outputs an effective value such as a high level as the discrimination signal S3. The carrier input mode discrimination unit 56 outputs a low-level invalid value as the discrimination signal S3 when the carrier input mode is inconsistent with any of the multiple discrimination modes, and / or when an invalid value such as a low level is input as the determination result signal S1. In the counting unit 57, when the carrier input mode discrimination unit 56 determines that the carrier input mode is consistent with any of the multiple discrimination modes, and the peak voltage of the voltage signal SP2 exceeds a predetermined threshold, that is, when an valid value such as a high level is input as the discrimination signal S3, the addition of X-ray photon counts is performed. In this modified example, the presence or absence of incident carriers in the peripheral electrode section B8 does not affect the discrimination. Therefore, the carrier input mode discrimination unit 56 does not need to receive the carrier input signal S2 from the pixel circuit 5a connected to the peripheral electrode section B8. In this modified example, one counting unit 57 is provided for each pixel electrode section B. Alternatively, only one counting unit 57 may be provided for two or more pixel electrode sections B.

[0114] Here, refer to Figure 23 . Figure 23Parts (a) to (j) are examples of multiple discrimination modes set in the carrier input mode discrimination unit 56, showing a diagram of 10 discrimination modes P1 to P10. Figure 23 In the diagram, the pixel electrode section corresponding to the pixel circuit 5a with input carriers (outputting the carrier-carrier input signal S2) is marked "H". To facilitate understanding of the discrimination modes P1 to P10, the self-electrode section B0 and the specific electrode sections B5, B7, and B8 are indicated with thick boxes. The symbols for the self-electrode section B0 and the surrounding electrode sections B1 to B7 are only shown in... Figure 23 Part (a) in Figure 23 Parts (b) to (j) are omitted. The carrier input mode discrimination unit 56 can also be composed of a combination of multiple logic circuits. In this case, the combined multiple logic circuits determine whether it is valid based on the combination of the carrier input signals S2 from the surrounding electrode sections B1 to B7 and the carrier input signal S2 from the self-electrode section B0. Thus, in the carrier input mode discrimination unit 56, it is determined whether the carrier input mode is consistent with any one of the multiple discrimination modes, such as discrimination modes P1 to P10. The detection circuit 5 can also include a memory storing multiple discrimination modes, such as discrimination modes P1 to P10. In this case, the carrier input mode discrimination unit 56 determines whether any one of the multiple discrimination modes stored in the memory is consistent with the carrier input mode. When the carrier input mode discrimination unit 56 is composed of a combination of multiple logic circuits, physical structures such as memory are not required, simplifying the structure of the detection circuit 5.

[0115] Figure 23The 10 discrimination modes P1 to P10 shown are determined according to several rules. The carrier input mode, where carriers are input to pixel electrodes B1 to B4 and B6 other than designated electrodes B5, B7, and B8 in the peripheral electrode sections B1 to B8, is inconsistent with discrimination modes P1 to P10. In other words, these discrimination modes P1 to P10 do not include modes corresponding to the following carrier input mode: the peripheral electrode sections B1 to B3 included in one row (the front row in this variation) containing the row before and after the row containing the electrode section B0, and any one of the peripheral electrode sections B1, B4, and B6 included in one column (the front column in this variation) containing the column containing the electrode section B0. Therefore, when any of the peripheral electrode sections B1 to B4, B6 have charge carriers at their inputs, the charge carrier input mode discrimination unit 56 connected to the pixel circuit 5a connected to the self-electrode section B0 determines that the charge carrier input mode is inconsistent with all of the discrimination modes P1 to P10. When any of these peripheral electrode sections B1 to B4, B6 have charge carriers at their inputs, the pixel circuit 5a connected to any pixel electrode section B other than the self-electrode section B0 sets the discrimination modes P1 to P10 in such a way that the charge carrier input mode necessarily matches any of the discrimination modes P1 to P10. Therefore, by setting the discrimination modes P1 to P10 according to the above discrimination rules, it is possible to appropriately avoid performing photon addition operations on the number of photons for the incident photon in multiple pixel circuits 5a. To facilitate understanding of the discrimination modes P1 to P10, an × mark is provided on the peripheral electrode sections B1 to B4, B6. The pixel circuit 5a, connected to the surrounding electrode sections B1 to B4 and B6 marked with ×, actually outputs a "low" carrier input signal S2, which is the same as that of a blank pixel. As in this modified example, the discrimination rule is valid when the surrounding electrode sections B5, B7, and B8, which are not included in either the row before or after the row containing the self-electrode section B0 (the front row in this modified example) or the column before or after the column containing the self-electrode section B0 (the front column in this modified example), become designated electrodes.

[0116] Among these discrimination modes P1 to P10, there are modes that are equivalent to all carrier input modes where none of the rows preceding and following the row containing the self-electrode section B0 (in this variation, the preceding row) and one of the columns preceding and following the column containing the self-electrode section B0 (in this variation, the preceding column) contain carriers, and at least one of the surrounding electrode sections B5 and B7 included in the row or column containing the self-electrode section B0 has carriers input, and carriers are input to the self-electrode section B0. In other words, the carrier input mode where at least one of the designated electrode sections B5 and B7 included in the row or column containing the self-electrode section B0 has carriers input, and carriers are input to the self-electrode section B0, must be consistent with any one of the multiple discrimination modes P1 to P10. Specifically, all modes where carriers are input to the surrounding electrode section B5 and the self-electrode section B0 are represented by discrimination modes P2, P5, P7, and P8. All modes when charge carriers are input to the peripheral electrode section B7 and the self-electrode section B0 are represented by discrimination modes P3, P6, P7, and P8. By setting the discrimination modes according to such discrimination rules, it is possible to appropriately determine whether the addition operation of the number of X-rays of the pixel circuit 5a can be performed.

[0117] Among these discrimination modes P1 to P10, there is a mode that corresponds to the following: a mode in which the peripheral electrode section B5, which is not included in one of the columns before and after the row containing the self-electrode section B0 (in this modified example, the front column), is included in the row containing the self-electrode section B0, and a mode in which the peripheral electrode section B7, which is not included in one of the rows before and after the row containing the self-electrode section B0 (in this modified example, the front row), is included in the column containing the self-electrode section B0, and a mode in which no carrier is input at the self-electrode section B0. Specifically, all modes in which carriers are input at both the peripheral electrode sections B5 and B7, and no carriers are input at the self-electrode section B0, are represented by discrimination modes P9 and P10. By setting the discrimination modes according to such discrimination rules, it is possible to appropriately determine whether the addition operation of the number of X-ray photons in the pixel circuit 5a can be performed. In the discrimination modes P1 to P10, there is almost no effect of charge sharing, and the discrimination mode P1 is included only when there are charge carriers input at the self-electrode section B0.

[0118] According to this modification, when multiple charge carriers generated by the incident X-rays are dispersed and collected by two or more pixel electrode portions B, the detection circuit 5 can determine the pixel electrode portion B corresponding to the position of the incident X-rays, and correct and evaluate the amount of charge carriers in the pixel electrode portion B. Details of this modification are described in Patent Document 2.

[0119] The X-ray detection apparatus disclosed herein is not limited to the embodiments described above, and various other modifications are possible. For example, the above embodiments and modifications can be combined with each other according to desired purposes and effects. In the above embodiments, an example is illustrated where multiple X-ray passing regions 23 of the capillary plate 2 are arranged on a triangular grid, and multiple pixel electrode portions B of the X-ray detection element 3 are arranged in both row and column directions. The arrangement of the X-ray passing regions 23 and the pixel electrode portions B is not limited to this. For example, the X-ray passing regions 23 and the pixel electrode portions B may have the same arrangement. For example, the X-ray passing regions 23 and the pixel electrode portions B may be arranged together on the triangular grid, and the X-ray passing regions 23 and the pixel electrode portions B may be arranged together in both row and column directions.

[0120] Explanation of symbols

[0121] 1…X-ray detection device, 2…capillary plate, 2A…capillary lens, 3…X-ray detection element, 3A…first element row, 3B…second element row, 4…semiconductor integrated element, 5…detection circuit, 5a…pixel circuit, 6…base component, 7…heat sink, 8…Peltier element, 9…circuit board, 10…container, 11, 12…space, 13…partition, 13a…opening, 14…window component, 15…support, 16…fan, 17…adhesive, 18…support body, 21…surface (first side), 22…back side (second side), 23…X-ray passing area, 24…X-ray shielding area, 25…non-passing area, 26…side, 27, 28…end face, 31…transformation part, 31a…surface, 31b…back side, 31c…side, 33…bias electrode, 3 4…protective ring, 41…protrusion, 42, 43…bonding wire, 51…signal generation unit, 52a, 52b…current output unit, 53…addition unit, 54…comparison unit, 55…carrier input signal generation unit, 56…carrier input mode discrimination unit, 57…counting unit, 61…mounting surface, 62…back side, 71…upper surface, 72…fin, 110…opening, A…dark current, B…pixel electrode unit, b…electrode, B0…self-electrode unit, B1~B8…surrounding electrode unit, C…target object, D1, D2…X-ray source, S1…judgment result signal, S2…carrier input signal, S3…discrimination signal, SC…current signal, SP1…input signal, SP2…voltage signal, XR, XR3, XR4…X-rays, XR1…excitation X-rays, XR2…fluorescent X-rays.

Claims

1. An X-ray detection device, wherein, have: At least one capillary has: a first surface, a second surface opposite to the first surface, a plurality of X-ray passing regions, and an X-ray shielding region, the plurality of X-ray passing regions extending from the first surface to the second surface, and the X-ray shielding region disposed between the plurality of X-ray passing regions; At least one X-ray detection element has a conversion section and a plurality of pixel electrode sections. The conversion section has a third surface opposite to the second surface of the capillary and a fourth surface opposite to the third surface. The conversion section absorbs X-rays to generate charge carriers, and the plurality of pixel electrode sections are arranged in a two-dimensional manner on the fourth surface. The detection circuit, which detects carriers collected from the conversion unit via the plurality of pixel electrode units, has a plurality of pixel circuits corresponding to each of the plurality of pixel electrode units. Each of the plurality of pixel circuits includes a circuit element that compares a signal based on the amount of carriers collected via the corresponding pixel electrode unit with a threshold and inputs a signal representing the comparison result to an adjacent pixel circuit among the plurality of pixel circuits. Radiator, and A container that houses the capillary, the at least one X-ray detection element, the detection circuit, and the heat sink. The capillary tube is located on one side of the detection circuit, and the heat sink is located on the other side of the detection circuit. The inner diameter of each X-ray passage area, viewed from the X-ray incident direction, is smaller than the width of the arrangement direction of each pixel electrode portion, viewed from the same direction. Each of the plurality of pixel circuits, based on the signals of that pixel circuit and adjacent pixel circuits, determines whether the plurality of charge carriers generated by the incident X-rays are partially dispersed and collected by two or more of the pixel electrodes. When multiple charge carriers generated by the incident X-ray are dispersed and collected by two or more pixel electrodes, the detection circuit determines the pixel electrode corresponding to the position of the incident X-ray, corrects and evaluates the amount of charge carriers in the pixel electrode, or ignores the incident X-ray.

2. The X-ray detection device according to claim 1, wherein, The plurality of X-ray passing regions of the capillary are arranged on a triangular lattice on the first and second surfaces. The plurality of pixel electrodes of the X-ray detection element are arranged along the row and column directions on the fourth surface.

3. The X-ray detection device according to claim 1, wherein, The second and third surfaces are separated from each other by a gap.

4. The X-ray detection device according to claim 2, wherein, The second and third surfaces are separated from each other by a gap.

5. The X-ray detection device according to claim 1, wherein, The second and third surfaces are joined together by an adhesive.

6. The X-ray detection device according to claim 2, wherein, The second and third surfaces are joined together by an adhesive.

7. The X-ray detection apparatus according to any one of claims 1 to 6, wherein, The central axes of the multiple X-ray passing regions are parallel to each other.

8. The X-ray detection apparatus according to any one of claims 1 to 6, wherein, The container has a window member that allows X-rays directed toward the capillary to pass through.

9. The X-ray detection device according to claim 7, wherein, The container has a window member that allows X-rays directed toward the capillary to pass through.

10. The X-ray detection apparatus according to any one of claims 1 to 6 and 9, wherein, It also includes a support portion, which is fixed to the side of the capillary and supports the capillary.

11. The X-ray detection apparatus according to claim 7, wherein, It also includes a support portion, which is fixed to the side of the capillary and supports the capillary.

12. The X-ray detection apparatus according to claim 8, wherein, It also includes a support portion, which is fixed to the side of the capillary and supports the capillary.

13. The X-ray detection apparatus according to any one of claims 1 to 6 and 9, wherein, It also has: A base component, which mounts the X-ray detection element; and A support body, which is erected on the base component, supports the capillary tube.

14. The X-ray detection apparatus according to claim 7, wherein, It also has: A base component, which mounts the X-ray detection element; and A support body, which is erected on the base component, supports the capillary tube.

15. The X-ray detection apparatus according to claim 8, wherein, It also has: A base component, which mounts the X-ray detection element; and A support body, which is erected on the base component, supports the capillary tube.

16. The X-ray detection apparatus according to any one of claims 1 to 6, 9, 11, 12, 14, and 15, wherein, The detection circuit is built into a semiconductor integrated device. The fourth surface of the X-ray detection element is opposite to the semiconductor integrated element, and each pixel electrode is connected to the semiconductor integrated element via a metal protrusion.

17. The X-ray detection apparatus according to claim 7, wherein, The detection circuit is built into a semiconductor integrated device. The fourth surface of the X-ray detection element is opposite to the semiconductor integrated element, and each pixel electrode is connected to the semiconductor integrated element via a metal protrusion.

18. The X-ray detection apparatus according to claim 8, wherein, The detection circuit is built into a semiconductor integrated device. The fourth surface of the X-ray detection element is opposite to the semiconductor integrated element, and each pixel electrode is connected to the semiconductor integrated element via a metal protrusion.

19. The X-ray detection apparatus according to claim 10, wherein, The detection circuit is built into a semiconductor integrated device. The fourth surface of the X-ray detection element is opposite to the semiconductor integrated element, and each pixel electrode is connected to the semiconductor integrated element via a metal protrusion.

20. The X-ray detection apparatus according to claim 13, wherein, The detection circuit is built into a semiconductor integrated device. The fourth surface of the X-ray detection element is opposite to the semiconductor integrated element, and each pixel electrode is connected to the semiconductor integrated element via a metal protrusion.

21. The X-ray detection apparatus according to any one of claims 1 to 6, 9, 11, 12, 14, 15, 17 to 20, wherein, Each capillary has a plurality of X-ray detection elements.

22. The X-ray detection apparatus according to claim 7, wherein, Each capillary has a plurality of X-ray detection elements.

23. The X-ray detection apparatus according to claim 8, wherein, Each capillary has a plurality of X-ray detection elements.

24. The X-ray detection apparatus according to claim 10, wherein, Each capillary has a plurality of X-ray detection elements.

25. The X-ray detection apparatus according to claim 13, wherein, Each capillary has a plurality of X-ray detection elements.

26. The X-ray detection apparatus according to claim 16, wherein, Each capillary has a plurality of X-ray detection elements.

27. The X-ray detection apparatus according to any one of claims 1 to 6, 9, 11, 12, 14, 15, and 17 to 20, wherein, A plurality of capillaries are relative to one of the X-ray detection elements.

28. The X-ray detection apparatus according to claim 7, wherein, A plurality of capillaries are relative to one of the X-ray detection elements.

29. The X-ray detection apparatus according to claim 8, wherein, A plurality of capillaries are relative to one of the X-ray detection elements.

30. The X-ray detection apparatus according to claim 10, wherein, A plurality of capillaries are relative to one of the X-ray detection elements.

31. The X-ray detection apparatus according to claim 13, wherein, A plurality of capillaries are relative to one of the X-ray detection elements.

32. The X-ray detection apparatus according to claim 16, wherein, A plurality of capillaries are relative to one of the X-ray detection elements.

33. The X-ray detection apparatus according to any one of claims 1-6, 9, 11, 12, 14, 15, 17-20, 22-26, 28-32, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

34. The X-ray detection apparatus according to claim 7, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

35. The X-ray detection apparatus according to claim 8, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

36. The X-ray detection apparatus according to claim 10, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

37. The X-ray detection apparatus according to claim 13, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

38. The X-ray detection apparatus according to claim 16, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

39. The X-ray detection apparatus according to claim 21, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

40. The X-ray detection apparatus according to claim 27, wherein, have: The first element column consists of two or more of the aforementioned X-ray detection elements arranged in a predetermined direction; and The second element column consists of two or more of the X-ray detection elements arranged along the first element column. The X-ray detection elements in the first element column and the X-ray detection elements in the second element column are arranged alternately.

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