Electronic component package

Abstract

The electronic component packaging body of the present application is an electronic component packaging body provided with a base tape having a plurality of recesses, and is an electronic component packaging body in which a protrusion portion capable of abutting against an electronic component housed in the interior of the recess is provided on the inner surface of the recess, and the electronic component is provided with a rectangular parallelepiped-shaped laminate and an external electrode provided on both end surfaces of the laminate.

Description

Technical Field

[0001] This invention relates to electronic component packaging for housing electronic components. Background Technology

[0002] Patent Document 1 discloses a carrier strip (electronic component package) for the purpose of preventing electronic components from adhering to the top strip. However, it does not consider the stability of the position and orientation of the electronic components inside the recess for accommodating the electronic components in the electronic component package.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-155077 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The purpose of this invention is to provide an electronic component packaging that improves the stability of the position and orientation of electronic components inside the recess of the electronic component packaging.

[0008] Technical solutions for solving the problem

[0009] The electronic component packaging body of the present invention is an electronic component packaging body having a base strip having multiple recesses.

[0010] The inner surface of the recess is provided with a protrusion that can abut against electronic components housed inside the recess.

[0011] The electronic component has a cuboid-shaped stack and external electrodes disposed on two end faces of the stack.

[0012] Invention Effects

[0013] According to the present invention, an electronic component package can be provided that improves the stability of the position and orientation of electronic components inside the recess of the electronic component package. Attached Figure Description

[0014] Figure 1 This is a perspective view showing an electronic component assembly having an electronic component package according to an embodiment of the present invention.

[0015] Figure 2 This is a perspective view showing an electronic component housed in an electronic component package according to an embodiment of the present invention.

[0016] Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the electronic component package along line I-I.

[0017] Figure 4 This is a top view of the recess in an embodiment of the present invention.

[0018] Figure 5 This diagram is used to illustrate oblique adsorption and is equivalent to... Figure 1 A sectional view of the I-I line section view.

[0019] Figure 6 This is a graph used to illustrate adsorption failure; it is equivalent to... Figure 1 A sectional view of the I-I line section view.

[0020] Figure 7 This diagram illustrates oblique adsorption and the main reasons for adsorption failure; it is equivalent to... Figure 1 A sectional view of the I-I line section view.

[0021] Figure 8 This diagram is used to illustrate diagonal locking, and is equivalent to... Figure 1 A sectional view of the I-I line section view.

[0022] Figure 9 This diagram illustrates the reason for diagonal locking; it is equivalent to... Figure 1 A sectional view of the I-I line section view.

[0023] Figure 10 This is a top view of the recess in another embodiment of the present invention.

[0024] Figure 11 This is a diagram illustrating an example of the lengths of the various parts in another embodiment of the invention.

[0025] Figure 12 This is a diagram illustrating a recess in another embodiment of the invention, which is equivalent to... Figure 1 The sectional view shown is a section view along line II-II.

[0026] Figure 13 This is a diagram illustrating an example of the lengths of the various parts in another embodiment of the invention.

[0027] Explanation of reference numerals in the attached figures

[0028] 10: Electronic component connection;

[0029] 20: Packaging for electronic components;

[0030] 22: Substrate strip;

[0031] 24: Transfer port;

[0032] 28: Covering strip;

[0033] 30: Sealing part;

[0034] 40: Electronic components;

[0035] 401: Multilayer ceramic capacitor;

[0036] 42: Layered body;

[0037] 44: External electrode;

[0038] 441: External electrode on end face;

[0039] 442: External electrode folded back;

[0040] 50: concave part;

[0041] 52: Opening;

[0042] 54: Side wall;

[0043] 56: Bottom;

[0044] 56A: Baseline outline;

[0045] 70: Protrusion;

[0046] 71: Side wall protrusion;

[0047] 712: Outer end;

[0048] 714: Inner end;

[0049] 716: Bottom end;

[0050] 72: Bottom protrusion;

[0051] 721: Top surface of the bottom protrusion;

[0052] 90: Suction nozzle;

[0053] LS: End face;

[0054] WS: Side view;

[0055] TS: main surface;

[0056] L: Length direction;

[0057] T: Stacking direction;

[0058] W: Width direction;

[0059] X: Short side direction;

[0060] Y: Long side direction;

[0061] Z: Depth direction;

[0062] D1: The length of the recess along the depth direction Z;

[0063] D2: The length of the protrusion in the depth direction Z;

[0064] D3: The length from the end of the protrusion on the bottom side to the bottom surface;

[0065] D4: The length of the bottom protrusion along the depth direction Z;

[0066] L1: The length of the opening along the Y direction of its longer side;

[0067] L2: The length of the protrusion along the Y direction of its long side;

[0068] L3: The length from one end of the bottom surface to the protrusion;

[0069] L5: The length of the long side of the bottom protrusion in the Y direction;

[0070] W1: The length of the short side of the opening in the X direction;

[0071] W2: The length of the protrusion in the X direction along its shorter side;

[0072] W3: The length between the inner ends of the protrusion;

[0073] W4: Length of the base along its shorter side;

[0074] T1: The length of the multilayer ceramic capacitor in the longitudinal direction;

[0075] T2: Length of the multilayer ceramic capacitor in the width direction;

[0076] T3: The length of the external electrode along the longitudinal direction L;

[0077] T4: Thickness of the external electrode;

[0078] T5: The length of the portion of the laminate without external electrodes along the length direction L. Detailed Implementation

[0079] <First Embodiment>

[0080] Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings. Furthermore, in each drawing, the same or equivalent parts are labeled with the same reference numerals.

[0081] The electronic component package 20 in this embodiment is a component that forms part of the electronic component assembly 10. First, the electronic component assembly 10 will be described.

[0082] <Electronic Components Union>

[0083] like Figure 1As shown, the electronic component assembly 10 includes an electronic component package 20 and an electronic component 40 housed within the electronic component package 20. The electronic component assembly 10 is elongated. Figure 1 The XYZ Cartesian coordinate system is shown. The electronic component package 20 is transported in the X direction.

[0084] <Electronic Component Packaging>

[0085] The electronic component packaging 20 has a base strip 22 and a cover strip 28.

[0086] <Substrate Strip>

[0087] The base strip 22 has a recess 50 and a conveying hole 24. The electronic component 40 is accommodated in the recess 50. Furthermore, in an automatic component feeder, the conveying hole 24 is used for automatic conveying of the electronic component package 20.

[0088] <Concave>

[0089] The recesses 50 are configured to be arranged in a row at given intervals along the long side of the electronic component package 20, that is, in the conveying direction of the electronic component package 20. Figure 1 In the diagram, the direction X indicates the long side direction of the electronic component package 20.

[0090] The recess 50 is offset to one side in the short side direction of the base strip 22. Figure 1 In the diagram, the direction Y indicates the direction of the short side of the electronic component package 20.

[0091] A roughly rectangular parallelepiped-shaped space is formed inside the recess 50. The recess 50 will be described in detail later.

[0092] <Teleportation Hole>

[0093] The transfer hole 24 is a hole that engages with the gears of the automatic component feeder for automatic conveying. Electronic component link 10 is conveyed through the engagement of the transfer hole 24 and the gears.

[0094] <Materials of the Substrate Strip>

[0095] The substrate strip 22 is formed of paper or resin.

[0096] When the base strip 22 is formed of resin, the resin is preferably one of polystyrene, polyethylene terephthalate, polycarbonate, or polypropylene. Forming the recess 50 from such a material facilitates the molding process. Furthermore, it allows for operation in a cleanroom.

[0097] <Covering strip>

[0098] The cover strip 28 is bonded to the surface of the base strip 22, thereby covering the recess 50. The bonding of the cover strip 28 to the base strip 22 is achieved via a sealing material provided in the sealing portion 30. Furthermore, the cover strip 28 is configured not to block the transfer hole 24, which will be described later.

[0099] <Materials for Covering Strips>

[0100] The cover strip 28 is formed, for example, of polyethylene terephthalate. The cover strip 28 may also be formed of the same material as the base strip 22.

[0101] The cover strip 28 is preferably formed of a material with low resistance. By forming it of such a material, it is possible to prevent the cover strip 28 from becoming charged.

[0102] <Electronic Components 40>

[0103] The electronic components 40 housed in the electronic component package 20 include, for example, resistors, capacitors, inductors, switches, connectors, coils, etc. As an example of electronic component 40, a multilayer ceramic capacitor 401 will be described.

[0104] Furthermore, the following description uses the multilayer ceramic capacitor 401 as an example of electronic component 40, but electronic component 40 is not limited to multilayer ceramic capacitor 401.

[0105] <Laminated Ceramic Capacitors>

[0106] like Figure 2 As shown, the multilayer ceramic capacitor 401 includes a multilayer body 42 and external electrodes 44. The multilayer body 42 has a cuboid shape, and the external electrodes 44 are mainly disposed on two opposite sides of the multilayer body 42.

[0107] <Definition of the surface and orientation of a layered body>

[0108] Here, two surfaces of the laminate 42, on which the external electrode 44 is disposed, are designated as end surfaces LS. Furthermore, among the four surfaces orthogonal to the end surfaces LS, the two opposite surfaces are designated as the side surface WS and the main surface TS, respectively.

[0109] In addition, the direction in which the two end faces LS are opposed is set as the length direction L, the direction in which the two side faces WS are opposed is set as the width direction W, and the direction in which the two main faces TS are opposed is set as the stacking direction T.

[0110] <External electrode on end face and external electrode on return>

[0111] The external electrode 44 includes an end-face external electrode 441 and a folded-back external electrode 442.

[0112] The so-called external electrode 441 refers to the portion of the external electrode 44 that is disposed on the end face LS. The external electrode 441 is disposed on the entire surface of the end face LS.

[0113] The external electrode 44 is also disposed on a portion of the side surface WS and a portion of the main surface TS. The so-called folded-back external electrode 442 refers to the portion of the external electrode 44 disposed on the side surface WS or the main surface TS. The external electrode 44 disposed on the side surface WS or the main surface TS extends from the end face external electrode 441.

[0114] In addition, the external electrode 442 is not set on the entire side surface WS and the main surface TS, but on a part of them.

[0115] <Size of multilayer ceramic capacitors>

[0116] For the shape of the multilayer ceramic capacitor 401 including the external electrode 44, the length in the length direction L is set as T1, and the length in the width direction W is set as T2.

[0117] For example, the T1 of the multilayer ceramic capacitor 401 is 0.25mm or more and 3.20mm or less, and the T2 is 0.125mm or more and 2.50mm or less.

[0118] Furthermore, the length of the stacked ceramic capacitor 401 in the stacking direction T is, for example, 0.125 mm or more and 2.50 mm or less.

[0119] <Dimensions of the external electrode>

[0120] Let the length of the external electrode 442 in the longitudinal direction L be T3, and let the thickness of the external electrode 442 be T4.

[0121] In addition, the length of the portion of the side surface WS or main surface TS of the laminate 42 that does not have the external electrode 442 set in the length direction L is set as T5.

[0122] The lengths T3 and T4 can be appropriately set according to the type of the multilayer ceramic capacitor 401.

[0123] For example, the length T3 showing the width of the folded-back external electrode 442 can be set to 0.20 mm or more and 0.90 mm or less. Furthermore, the length T4 showing the thickness of the folded-back external electrode 442 can be set to 0.010 mm or more and 0.048 mm or less.

[0124] <Features of the electronic component packaging body in this embodiment>

[0125] In the electronic component packaging body 20 of this embodiment, a protrusion 70 is provided in the recess 50. First, the recess 50 will be described.

[0126] <Definition of the shape and direction of the concave portion>

[0127] like Figure 1 As shown, the recess 50 has a generally rectangular parallelepiped shape.

[0128] exist Figure 1 An XYZ Cartesian coordinate system is shown. The direction indicated by the X-axis is set as the short side direction of the recess 50, the direction indicated by the Y-axis is set as the long side direction of the recess 50, and the direction indicated by the Z-axis is set as the depth direction of the recess 50.

[0129] <Opening of the concave part>

[0130] The recess 50 has an opening 52 on one side in the depth direction Z. The opening 52 is approximately rectangular in shape when viewed from above. Here, "viewing from above" means viewing the opening 52 from the depth direction Z. The appearance of the opening 52 in the view from above is equivalent to the top view of the opening 52.

[0131] <Surface of concave part>

[0132] like Figure 1 As shown, the recess 50 includes 5 inner surfaces.

[0133] In addition, such as Figure 3 as well as Figure 4 As shown, the inner surface includes four sidewalls 54 and a bottom surface 56. The bottom surface 56 is the surface opposite to the opening 52. The sidewalls 54 are the surfaces that extend from the bottom surface 56 to the opening 52.

[0134] <Summary of the protrusion>

[0135] like Figure 3 as well as Figure 4 As shown, two protrusions 70 are provided in the recess 50. A protrusion 70 means a portion that protrudes from the inner surface of the recess 50 toward the interior of the recess 50.

[0136] <Side wall protrusions and bottom protrusions>

[0137] The protrusion 70 includes a side wall protrusion 71 and a bottom protrusion 72.

[0138] The so-called sidewall protrusion 71 refers to the protrusion 70 of the sidewall 54 provided in the inner surface of the recess 50. On the other hand, the so-called bottom protrusion 72 refers to the protrusion 70 of the bottom surface 56 provided in the inner surface of the recess 50.

[0139] <Side wall protrusions>

[0140] In this embodiment, a sidewall protrusion 71 is provided in the recess 50 as a protrusion 70. The sidewall protrusion 71 will be described below.

[0141] <Arrangement of the concave portion in the longitudinal direction>

[0142] like Figure 4 As shown, a sidewall protrusion 71 is provided on the sidewall 54 extending in the long side direction Y of the recess 50. Furthermore, a sidewall protrusion 71 is provided on either of the two opposing sidewalls 54. Moreover, the sidewall protrusion 71 is provided in the central portion of the sidewall 54 in the long side direction Y.

[0143] Therefore, the two side wall protrusions 71 are opposite each other in the short side direction X of the recess 50.

[0144] Furthermore, the side wall protrusion 71 has a generally triangular pyramid shape. The base of the triangular pyramid is located on the side of the opening 52, and the vertex of the triangular pyramid is located on the side of the base 56.

[0145] <Arrangement of the recessed portion in the depth direction>

[0146] like Figure 3 As shown, a sidewall protrusion 71 is provided in the sidewall 54 on the side of the opening 52. That is, the sidewall protrusion 71 extends from the opening 52 toward the bottom surface 56.

[0147] Furthermore, the length of the sidewall protrusion 71 in the short side direction X decreases as it approaches the bottom surface 56 from the opening 52. This is because the triangular pyramidal shape of the sidewall protrusion 71 has a vertex on the bottom surface 56 side. Additionally, the length of the sidewall protrusion 71 in the short side direction X indicates the height of the sidewall protrusion 71.

[0148] <Details of the protrusion>

[0149] The side wall protrusion 71 will be described in more detail below.

[0150] <Definition of position>

[0151] like Figure 4 As shown, when viewed from above, the outermost position of the recess 50 in the short side direction X is designated as the outer end 712. On the other hand, when viewed from above, the innermost position of the recess 50 in the short side direction X is designated as the inner end 714.

[0152] In addition, such as Figure 3 As shown, when the side wall protrusion 71 is viewed in section from the Y direction, the position closest to the bottom surface 56 in the depth direction Z is designated as the bottom end 716.

[0153] <Length of the protrusion in the depth direction>

[0154] First, based on Figure 3 The length of the side wall protrusion 71 in the depth direction Z is explained.

[0155] like Figure 3 As shown, the length in the depth direction Z from the opening 52 to the bottom surface 56 is defined as D1, the length in the depth direction Z from the opening 52 to the bottom end 716 of the recess 50 is defined as D2, and the length in the depth direction Z from the bottom end 716 of the recess 50 to the bottom surface 56 is defined as D3.

[0156] In the side wall protrusion 71, D2 is longer than D3. That is, the side wall protrusion 71 extends beyond half the depth of D1, which is the depth of the recess 50, from the opening 52 toward the bottom surface 56.

[0157] Furthermore, the relationship between D2 and D3, which show the lengths of the sidewall protrusion 71 in the depth direction Z, is preferably D2 > D3. For example, it can be set to D2:D3 = 6:4.

[0158] <Length of the protrusion along its shorter side>

[0159] Next, based on Figure 4 The length of the side wall protrusion 71 in the short side direction will be explained.

[0160] First, such as Figure 4 As shown, the length of the opening 52 in the short side direction X is set as W1, and the length of the side wall protrusion 71 from the outer end 712 to the inner end 714 in the short side direction X is set as W2. Furthermore, for the two opposing side wall protrusions 71, the length between their inner ends 714 in the short side direction X is set as W3, and the length of the bottom surface 56 in the short side direction X is set as W4.

[0161] In the side wall protrusion 71, the length W2 showing the height of the side wall protrusion 71 is preferably 0.01 mm or more and 1.00 mm or less.

[0162] Furthermore, the ratio of W1 to W3, which shows the degree to which the width of the opening 52 is narrowed due to the protrusion 70, is preferably in the range of 1:0.80 to 1:0.95.

[0163] <Relationship with external electrodes>

[0164] The length W2 can be set to be the same as or greater than the thickness T4 of the folded-back external electrode 442 of the stacked ceramic capacitor 401.

[0165] Specifically, the length W2 showing the height of the sidewall protrusion 71 can be set to be higher than at least one of the thickness T4 of the folded-back external electrode 442 on the main surface TS and the thickness T4 of the folded-back external electrode 442 on the side surface WS.

[0166] Therefore, for the stacked ceramic capacitor 401 with the external electrode 442, the positional displacement and tilting of the stacked ceramic capacitor 401 inside the recess 50 can be effectively suppressed.

[0167] <Length of the protrusion along its long side>

[0168] Next, also based on Figure 4 The length of the side wall protrusion 71 in the long side direction Y is explained.

[0169] First, the length of the opening 52 in the long side direction Y is set as L1, and the length of the side wall protrusion 71 in the long side direction Y is set as L2.

[0170] For example, the length of L2 is preferably 0.4 mm or more and 1.0 mm or less.

[0171] Furthermore, the ratio of L1 to L2, which shows the degree to which the size of the protrusion 70 is relative to the length of the opening 52, is preferably in the range of 1:0.01 to 1:0.20.

[0172] <Methods for forming protrusions>

[0173] In addition, including the bottom protrusion 72 described later, the protrusion 70 can be provided by a mold or the like when forming the recess 50.

[0174] For example, when the base strip 22 is formed of paper, a compression mold used to form the recess 50 is used to form a shape corresponding to the protrusion 70. Then, the compression mold is pressed into the base strip 22, thereby forming the recess 50 having the protrusion 70.

[0175] As described above, when the base strip 22 is formed of paper, the side wall protrusions 71 and the bottom protrusions 72 can be realized by a compression mold having a given shape.

[0176] Furthermore, when the base strip 22 is formed of resin, a shape corresponding to the protrusion 70 is formed in a mold used for resin molding. Then, the base strip 22 is molded based on the mold used for resin molding, thereby forming the base strip 22, which includes a recess 50 having the protrusion 70.

[0177] As described above, when the base strip 22 is formed of resin, the side wall protrusions 71 and the bottom protrusions 72 can be realized by a molding die having a given shape.

[0178] <Effect>

[0179] With the above structure, the electronic component packaging body 20 of this embodiment can improve the stability of the position and orientation of the electronic component 40 inside the recess 50 of the electronic component packaging body 20.

[0180] This is because, inside the recess 50, the electronic component 40 abuts against the sidewall protrusion 71, thus making it less prone to change in position and orientation. Therefore, it is possible to suppress defects when removing the electronic component 40 from inside the recess 50 using the suction nozzle 90. Representative defects will be described below.

[0181] <Oblique Adsorption>

[0182] First, based on Figure 5 The oblique adsorption is explained.

[0183] In the order of state (A), state (B), state (C), that is, in order to Figure 5 The electronic component 40 is removed from the recess 50 by adsorption, in the order of sub-graphs (A), (B), and (C).

[0184] In state (A), the electronic component 40 is accommodated in the recess 50.

[0185] In state (B), the cover strip 28 is peeled off in the direction of arrow B. Then, the nozzle 90 travels in the direction of arrow D and adsorbs the electronic component 40. During adsorption, for example, if the position of the electronic component 40 inside the recess 50 is offset, the electronic component 40 is sometimes adsorbed in a rotating state as shown by arrow R.

[0186] Then, as shown in state (C), the electronic component 40 is held in a rotating state and the nozzle moves in the direction of arrow U. This is oblique adsorption.

[0187] <Adsorption Failure>

[0188] Next, based on Figure 6 Explanation of adsorption failure.

[0189] In the order of state (A), state (B), state (C), state (D), that is, in order to Figure 6 The electronic component 40 is removed from the recess 50 by adsorption, in the order of sub-diagrams (A), (B), (C), and (D).

[0190] State (A) to State (C) and Figure 5 The oblique adsorption shown is the same.

[0191] In cases where oblique adsorption occurs as in state (C), for example, when the rotation angle of electronic component 40 is large, electronic component 40 may sometimes fall off the nozzle 90.

[0192] State (D) indicates that the electronic component 40 has fallen from the nozzle 90 in the direction of arrow D. This is adsorption failure.

[0193] <Oblique adsorption and reasons for adsorption failure>

[0194] Next, based on Figure 7 The reasons for this oblique adsorption and adsorption failure are explained.

[0195] For example, when the electronic component 10 is transported by an automatic component feeder, the following situation may occur due to vibration: the position of the electronic component 40 may shift or the electronic component 40 may tilt inside the recess 50.

[0196] Furthermore, if the nozzle 90 attempts to adsorb the electronic component 40 when the electronic component 40 is misaligned or tilted, the aforementioned tilted adsorption or adsorption failure is likely to occur.

[0197] In particular, such as Figure 7 As shown, when the internal shape of the recess 50 gradually expands in a cone shape from the bottom surface 56 to the opening 52, oblique adsorption and adsorption failure are likely to occur.

[0198] For example, in Figure 7 In the recess 50 shown, the sidewall 54 extends from the bottom surface 56 in the direction of arrow a to the opening 52. Therefore, the width W1 of the opening 52 becomes wider than the width W4 of the bottom surface 56.

[0199] When the interior of the recess 50 is shaped to extend toward the opening 52, the position of the electronic component 40 becomes easily shifted or the electronic component 40 becomes easily tilted inside the recess 50.

[0200] As a result, it becomes prone to oblique adsorption and adsorption failure.

[0201] <Adsorption failure caused by diagonal locking>

[0202] Next, based on Figure 8 This section explains adsorption failure caused by diagonal locking. Adsorption failure caused by diagonal locking is another defect that occurs when using the nozzle 90 to adsorb electronic components 40.

[0203] In the order of state (A), state (B), state (C), that is, in order to Figure 8 The electronic component 40 is removed from the recess 50 by adsorption, in the order of sub-graphs (A), (B), and (C).

[0204] In state (A), the electronic component 40 is accommodated in the recess 50. However, the electronic component 40 is accommodated in the recess 50 in an inclined state.

[0205] In state (B), the cover strip 28 is peeled off in the direction of arrow B, and the nozzle 90 moves in the direction of arrow D to adsorb electronic components 40.

[0206] Then, as shown in state (C), without adsorbing electronic component 40, the nozzle moves in the direction of arrow U. This is adsorption failure caused by diagonal locking.

[0207] In state (A), the electronic component 40 rotates inside the recess 50, thus the electronic component 40 is embedded in the two opposing sidewalls 54 of the recess 50. Therefore, the suction force of the nozzle 90 fails to attract the electronic component 40, resulting in adsorption failure due to diagonal locking.

[0208] based on Figure 9 The following explains the situations where diagonal locking is likely to occur.

[0209] exist Figure 9 Arrow b indicates the diagonal length of electronic component 40. Additionally, arrow c indicates the width of the middle portion of the recess 50 in the depth direction Z and the width in the short side direction X.

[0210] When the lengths of arrow b and arrow c are close, electronic component 40 is easily embedded in recess 50. As a result, the aforementioned diagonal locking is likely to occur.

[0211] <The recess in this embodiment>

[0212] In the recess 50 of this embodiment, the aforementioned adverse conditions are less likely to occur.

[0213] First, we will explain oblique adsorption and adsorption failure.

[0214] In the recess 50 of this embodiment, a sidewall protrusion 71 is provided near the opening 52. Therefore, even if the internal shape of the recess 50 is as described... Figure 7 The cone-shaped configuration shown prevents the electronic component 40 from shifting position within the recess 50, and also prevents it from tilting. As a result, oblique adsorption and adsorption failure are less likely to occur.

[0215] Furthermore, diagonal locking is also less likely to occur. Like based on Figure 9 As explained, diagonal locking is prone to occur when the length b of the diagonal of the electronic component 40 and the width c of the middle portion in the depth direction Z and short side direction X of the recess 50 are close. To avoid this, it is advisable to increase the width c.

[0216] However, when the width c is increased, the electronic component 40 becomes more prone to displacement and tilting inside the recess 50. Therefore, it is difficult to increase the width c.

[0217] In this respect, in the recess 50 of this embodiment, a sidewall protrusion 71 is provided near the opening 52. Therefore, even if the width c is widened, the positional displacement and tilting of the electronic component 40 inside the recess 50 can be suppressed.

[0218] Therefore, by widening the width c, it is possible to suppress diagonal locking while suppressing oblique adsorption and adsorption failure.

[0219] <Second Implementation>

[0220] Next, based on Figure 10 A second embodiment of the electronic component packaging 20 will be described. In the following description, the differences from the first embodiment will be the main focus.

[0221] like Figure 10 As shown, in this embodiment, unlike the first embodiment, two sidewall protrusions 71 are provided on each of the opposite sidewalls 54, for a total of four sidewall protrusions 71. Furthermore, the shape of the sidewall protrusions 71 in top view is approximately rectangular.

[0222] <Arrangement of the concave portion in the longitudinal direction>

[0223] like Figure 10 As shown, the sidewall protrusions 71 are provided with two on each of the sidewalls 54 along the long side direction Y, for a total of four.

[0224] Here, focusing on a sidewall protrusion 71, the outline of the two outlines on the short side direction X of the bottom surface 56 that is closer to the sidewall protrusion 71 is set as the reference outline.

[0225] For example, in Figure 10 In the middle, focus on the side wall protrusion 71 (i.e., side wall protrusion 71A) on the lower left. The reference outline in this case is shown as reference outline 56A.

[0226] Furthermore, at the outer end 712 of the side wall protrusion 711, the outer end 712 closest to the reference outline 56A is designated as the reference outer end 712A.

[0227] Furthermore, the length in the long side direction Y between the reference outer end 712A and the reference outline 56A is defined as L3. L3 indicates the length from one end of the bottom surface 56 to the side wall protrusion 71.

[0228] In this embodiment, L2 and L3 are equal. That is, the length of the sidewall protrusion 71 in the long side direction Y is equal to the length from one end of the bottom surface 56 to the sidewall protrusion 71.

[0229] Furthermore, two side wall protrusions 71 are provided on each of the two side walls 54 extending along the long side direction Y, which are in the same position, for a total of four.

[0230] In addition, the ratio of L2 to L3 is not limited to 1:1; for example, it can be set to a range of 1:1.5 to 1.5:1.

[0231] <Relationship with external electrodes>

[0232] Furthermore, the values ​​of L2 and L3 can be set to be the same as the length T3 in the length direction L of the folded-back external electrode 442 of the multilayer ceramic capacitor 401.

[0233] Therefore, for the stacked ceramic capacitor 401 with the external electrode 442, the positional displacement and tilting of the stacked ceramic capacitor 401 inside the recess 50 can be effectively suppressed.

[0234] <Effect>

[0235] In the electronic component package 20 of the second embodiment, for the multilayer ceramic capacitor 401, especially for the multilayer ceramic capacitor 401 which has external electrodes 44 extending to the side surface WS and the main surface TS on both sides of the opposite end face LS, the stability of the position and orientation of the multilayer ceramic capacitor 401 inside the recess 50 can be further improved.

[0236] <Three-dimensional structure of the side wall protrusions>

[0237] In the first embodiment, the sidewall protrusion 71 has a generally triangular pyramidal shape. In contrast, in this embodiment, the sidewall protrusion 71 has a generally triangular prism shape.

[0238] like Figure 10 As shown, the sidewall protrusion 71 has a rectangular shape when viewed from above. That is, the sidewall protrusion 71 has a rectangular shape in the same plane as the opening 52.

[0239] Furthermore, the width W2 of the sidewall protrusion 71 gradually decreases from the opening 52 toward the bottom end 716 of the sidewall protrusion 71. Moreover, at the bottom end 716, the width W2 becomes 0.

[0240] As described above, the side wall protrusion 71 has a triangular prism-shaped three-dimensional structure, that is, it has a rectangular shape when viewed in cross-section from the depth direction Z, and a triangular shape when viewed in cross-section from the long side direction Y.

[0241] In this embodiment, the three-dimensional structure of the sidewall protrusion 71 is a triangular prism. Therefore, the stability of the position and orientation of the stacked ceramic capacitor 401 inside the recess 50 can be further improved.

[0242] Furthermore, the three-dimensional structure of the side wall protrusion 71 is not limited to a triangular pyramid or a triangular prism, but can be various three-dimensional structures.

[0243] <Example>

[0244] exist Figure 11 The preferred relationship between the lengths T1 and T2 of the outer shape of the stacked ceramic capacitor 401 housed in the recess 50 and the lengths D2 and W2 of each part of the side wall protrusion 71 is recorded.

[0245] <Third Implementation>

[0246] Next, based on Figure 12 A third embodiment of the electronic component packaging 20 will be described. The following description will focus on the differences from the embodiments described above.

[0247] In the third embodiment, the difference from the first embodiment is that the protrusion 70 is not provided on the side wall 54, but on the bottom surface 56.

[0248] <Bottom protrusion>

[0249] like Figure 12 As shown, in this embodiment, a protrusion 70 is provided on the bottom surface 56. This protrusion 70 provided on the bottom surface 56 is designated as a bottom surface protrusion 72. In the bottom surface protrusion 72, at least a portion of the bottom surface 56 protrudes in the direction of the opening 52.

[0250] The bottom protrusion 72 has a generally rectangular shape when viewed in cross-section along the short side direction X. The surface of the bottom protrusion 72 facing the opening 52 is designated as the top surface 721 of the bottom protrusion. The top surface 721 of the bottom protrusion is generally parallel to the bottom surface 56.

[0251] <Configuration of bottom protrusions>

[0252] like Figure 12As shown, the bottom protrusion 72 is provided in the central portion of the bottom surface 56 along the long side direction Y. Furthermore, the bottom protrusion 72 is not provided across the entire extent of the bottom surface 56 along the long side direction Y.

[0253] Therefore, in the recess 50, there exists a bottom surface 56 without the bottom protrusion 72. The bottom surface 56 without the bottom protrusion 72 exists on both sides in the long side direction Y of the bottom protrusion 72, that is, it exists between the two ends of the bottom protrusion 72 and the bottom surface 56.

[0254] Here, the length of the bottom surface 56 of the recess 50 in the long side direction Y is set to L6. Furthermore, the length of the bottom surface protrusion 72 in the long side direction Y is set to L5. Additionally, in the bottom surface 56, the length of the portion without the bottom surface protrusion 72 in the long side direction Y is set to L4.

[0255] In addition, the length along the depth direction Z from the bottom surface 56 to the top surface 721 of the bottom protrusion is set as D4.

[0256] <Length of the bottom protrusion>

[0257] The length L5 of the bottom protrusion 72 can be set to, for example, 0.50 mm or more and 3.00 mm or less.

[0258] <Relationship with external electrodes>

[0259] Furthermore, the length L5 can be set to be the same as or less than the length T5 of the multilayer ceramic capacitor 401 housed in the recess 50. The length T5, as explained above, is the length in the length direction L of the portion of the multilayer 42 in which the external electrode 442 is not provided.

[0260] By making the length L5 the same as or less than the length T5, it is possible to prevent the stacked ceramic capacitor 401 inside the recess 50 from shifting or tilting. This is because the stability of the stacked ceramic capacitor 401 is improved by the contact between the top surface 721 of the bottom protrusion and the portion of the stacked body 42 where the external electrode 442 is not provided.

[0261] Furthermore, in the bottom surface 56, the ratio of the length L6 to the length L5, which shows the proportion of the length of the bottom surface protrusion 72, can be set to, for example, 1:0.4 to 1:0.7.

[0262] Furthermore, the ratio of lengths L5 and L4 can be set, for example, between 1:0.5 and 1:0.8.

[0263] <Height of the bottom protrusion>

[0264] The length D4, which shows the height of the bottom protrusion 72, can be set to, for example, 0.01 mm or more and 0.10 mm or less.

[0265] <Relationship with external electrodes>

[0266] The length D4 can be set to be the same as or greater than the length T4 in the multilayer ceramic capacitor 401 housed in the recess 50. The length T4, as explained above, is the length equivalent to the thickness of the folded-back outer electrode 442 disposed in the multilayer 42.

[0267] Specifically, the length D4 showing the height of the bottom protrusion 72 can be set to be higher than at least one of the thickness T4 of the folded-back external electrode 442 on the main surface TS and the thickness T4 of the folded-back external electrode 442 on the side surface WS.

[0268] By making the length D4 the same as or greater than the length T4, it is possible to prevent the positional shift or tilting of the stacked ceramic capacitor 401 inside the recess 50 from occurring.

[0269] By setting the length D4 as described above, it becomes easier for both the bottom surface 56 and the top surface 721 of the bottom protrusion to come into contact with the multilayer ceramic capacitor 401. Specifically, it becomes easier for the bottom surface 56 to come into contact with the folded-back external electrode 442, and for the top surface 721 of the bottom protrusion to come into contact with the portion of the multilayer 42 where the folded-back external electrode 442 is not located. As a result, the stability of the multilayer ceramic capacitor 401 is improved.

[0270] <Example>

[0271] exist Figure 13 The preferred relationship between the lengths T1 and T2 of the outer shape of the multilayer ceramic capacitor 401 housed in the recess 50 and the lengths L5 and D4 of each part of the bottom protrusion 72 is recorded.

[0272] <Protrusions and bottom protrusions>

[0273] Alternatively, both a sidewall protrusion 71 and a bottom protrusion 72 may be provided in the recess 50. Or, only one of them may be provided.

[0274] For example, an electronic component package with only a bottom protrusion 72 provided in the recess 50 can be represented as follows.

[0275] That is, the electronic component packaging body is an electronic component packaging body with a base strip having multiple recesses.

[0276] The recess has an opening and a bottom surface parallel to the opening.

[0277] The bottom surface is provided with a bottom surface protrusion that rises from the bottom surface towards the opening.

[0278] The electronic component has a cuboid-shaped stack and external electrodes disposed on two end faces of the stack.

[0279] Furthermore, the embodiments of the present invention are not limited to the above description. That is, various modifications can be made to the embodiments described above regarding the mechanism, shape, material, quantity, position, or arrangement without departing from the technical concept and purpose of the present invention, and these modifications are included in the present invention.

[0280] For example, the sidewall protrusion 71 may also be provided on the sidewall 54 in the short side direction X of the recess 50. Furthermore, the sidewall protrusion 71 may be provided on both the sidewall 54 in the long side direction Y and the sidewall 54 in the short side direction X of the recess. Alternatively, the sidewall protrusion 71 may not be provided in opposing positions on either of the two opposing sidewalls 54. Furthermore, the number of sidewall protrusions 71 provided on the two opposing sidewalls 54 may be different.

[0281] The electronic component packaging body of the present invention is an electronic component packaging body having a base strip having multiple recesses.

[0282] The inner surface of the recess is provided with a protrusion that can abut against electronic components housed inside the recess.

[0283] The electronic component has a cuboid-shaped stack and external electrodes disposed on two end faces of the stack.

[0284] According to the above structure, a protrusion capable of abutting against the electronic component is provided on the inner surface of the recess. Therefore, an electronic component package can be provided that improves the stability of the position and orientation of the electronic component inside the recess.

[0285] In the electronic component packaging of the present invention, it may also be,

[0286] The inner surface includes sidewalls and a bottom surface.

[0287] The protrusion is provided on the side wall.

[0288] According to the above structure, the protrusion is provided on the sidewall. Therefore, for example, even if the shape of the recess extends toward the opening, the stability of the position and orientation of the electronic components inside the recess can be improved.

[0289] In the electronic component packaging of the present invention, it may also be,

[0290] The recess has an opening.

[0291] The protrusion provided on the side wall extends from the opening on the side wall.

[0292] According to the structure described above, the protrusion extends from the opening. Therefore, it is possible to suppress the upward movement of electronic components inside the recess towards the opening side.

[0293] In the electronic component packaging of the present invention, it may also be,

[0294] The protrusion is provided on at least one of the side wall and the bottom surface.

[0295] Based on the above structure, for example, when a protrusion is provided on the bottom surface, the shape of the bottom surface can be adapted to the shape of the electronic component being housed. Therefore, the stability of the position and orientation of the electronic component can be further improved.

[0296] In the electronic component packaging of the present invention, it may also be,

[0297] The recess has an opening.

[0298] The protrusion provided on the bottom surface has a surface parallel to the opening.

[0299] According to the structure described above, the protrusion on the bottom surface has a surface parallel to the opening. Therefore, the stability of the position and orientation of electronic components with steps on the surface can be further improved.

[0300] In the electronic component packaging of the present invention, it may also be,

[0301] The laminated body comprises: two main faces, orthogonal to the end faces and opposite to each other; and two side faces, orthogonal to the end faces and opposite to each other.

[0302] The external electrode extends from the end face to at least a portion of the main face, and from the end face to at least a portion of the side face.

[0303] The height of the protrusion is greater than at least one of the thickness of the external electrode on the main surface and the thickness of the external electrode on the side surface.

[0304] Based on the above structure, the height of the protrusion is greater than the thickness of the external electrode on the main surface. Therefore, the stability of the position and orientation of electronic components with external electrodes formed on surfaces other than the end face can be further improved.

[0305] In the electronic component packaging of the present invention, it may also be,

[0306] The substrate tape is formed of resin.

[0307] Based on the above structure, the substrate tape is formed of resin. Therefore, it becomes easy to use electronic component packaging in cleanrooms.

Claims

1. An electronic component packaging body comprising a base strip having multiple recesses, wherein, The inner surface of the recess is provided with a protrusion that can abut against electronic components housed inside the recess. The electronic component comprises a cuboid-shaped laminate and external electrodes disposed on two end faces of the laminate. The inner surface includes sidewalls and a bottom surface. The recess has an opening. The interior of the recess extends in a conical shape from the bottom surface to the opening. The protrusion includes a sidewall protrusion disposed on the sidewall. The sidewall protrusion is provided continuously only on a portion of the sidewall in the depth direction from the opening, and the height of the sidewall protrusion decreases as it approaches the bottom surface from the opening.

2. The electronic component packaging body according to claim 1, wherein, The protrusion also includes a bottom protrusion disposed on the bottom surface.

3. The electronic component packaging body according to claim 2, wherein, The bottom protrusion has a surface parallel to the opening.

4. The electronic component packaging body according to any one of claims 1 to 3, wherein, The laminated body comprises: Two main faces, orthogonal to the end faces, and opposite to each other; and The two side faces are orthogonal to the end face and are opposite to each other. The external electrode extends from the end face to at least a portion of the main face and from the end face to at least a portion of the side face. The height of the protrusion is greater than at least one of the thickness of the external electrode on the main surface and the thickness of the external electrode on the side surface.

5. The electronic component packaging body according to any one of claims 1 to 3, wherein, The substrate tape is formed of resin.

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