A scan chain adjusting method and device, electronic equipment and readable storage medium

By adjusting the connections of the chip scan chain, based on the physical location information of the module under test, the problems of wiring congestion and high test power consumption were solved, and a more efficient scan chain design was achieved.

CN116819292BActive Publication Date: 2026-07-21BEIJING SEMIDRIVE TECHNOLOGY LTD
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING SEMIDRIVE TECHNOLOGY LTD
Filing Date
2023-06-15
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

When designing the scan chains for ATE and LBIST tests in the chip, the lack of consideration for physical information led to excessive wiring resource consumption, resulting in wiring congestion and high test power consumption.

Method used

By acquiring the physical location information of the modules to be detected in the scanning chain, the connection of the scanning chain is adjusted based on the principle of proximity, reducing detours and optimizing the length of the scanning chain.

Benefits of technology

The length of the scan link in the mixed test is reduced, the test power consumption is lowered, and the chip area is avoided from increasing.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116819292B_ABST
    Figure CN116819292B_ABST
Patent Text Reader

Abstract

The application discloses a scan chain adjustment method and device, electronic equipment and a readable storage medium. The method comprises the following steps: acquiring first physical position information of each to-be-detected module in a plurality of first scan chains for a first test mode, wherein the plurality of first scan chains are connected in a loop to form a second scan chain for a second test mode; adjusting each first scan chain based on the first physical position information of each to-be-detected module in each first scan chain to obtain an adjusted first scan chain; the length of the adjusted first scan chain is smaller than the length of the first scan chain; taking each adjusted first scan chain as an element to determine second physical position information of each adjusted first scan chain; and adjusting the second scan chain based on the second physical position information of each adjusted first scan chain to obtain an adjusted second scan chain; and the length of the adjusted second scan chain is smaller than the length of the second scan chain.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a scan chain adjustment method, apparatus, electronic device, and readable storage medium. Background Technology

[0002] For chips with high reliability and safety requirements, such as automotive electronic chips, the Design for Testability (DFT) section typically incorporates both traditional ATE (Automatic Test Equipment) testing and LBIST (Logic Built-in Self-Test) testing. ATE testing usually has a longer scan chain due to compression ratio limitations, while LBIST testing requires a shorter scan chain due to time constraints. Therefore, in chips where ATE and LBIST testing coexist, the two test modes cannot reuse the same scan chain; instead, two different scan chains must be designed within the chip circuitry. Currently, when designing scan chains for ATE and LBIST testing, the chip first forms several shorter first scan chains by concatenating the modules under test (e.g., registers) according to the LBIST testing requirements. These shorter sub-scan chains are then concatenated to form a longer second scan chain, which is used for ATE testing. Figure 1 As shown. Each first scan chain's input module is a multiplexer (mux), which is used to select and switch between the two test modes of the scan chain.

[0003] Since the scan chains for ATE and LBIST tests are inserted during the chip logic design phase without considering physical information, the scan chain connections become circuitous during the physical design phase. This leads to excessive routing resources, causing routing congestion, increased chip area, and higher test power consumption. Therefore, optimizing the scan chain structure for ATE and LBIST tests during the physical design phase to reduce the connection length is a crucial issue that needs to be addressed. Summary of the Invention

[0004] In view of this, embodiments of this application provide a scan chain adjustment method, apparatus, electronic device, and readable storage medium to at least solve the above-mentioned technical problems existing in the prior art.

[0005] According to a first aspect of this application, embodiments of this application provide a scan chain adjustment method, including: The process involves: acquiring the first physical location information of each module to be tested in multiple first scan chains for a first test mode, wherein the multiple first scan chains are connected end-to-end to form a second scan chain for a second test mode; adjusting each first scan chain based on the first physical location information of each module to be tested in each first scan chain to obtain an adjusted first scan chain; the length of the adjusted first scan chain is less than the length of the first scan chain; determining the second physical location information of each adjusted first scan chain as an element; adjusting the second scan chain based on the second physical location information of each adjusted first scan chain to obtain an adjusted second scan chain; the length of the adjusted second scan chain is less than the length of the second scan chain.

[0006] Optionally, based on the first physical location information of each module to be detected in each first scan chain, each first scan chain is adjusted to obtain an adjusted first scan chain, including: For each first scan chain, based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity, the next level module to be detected corresponding to each module to be detected is determined; The original connections between the modules to be tested in the first scan chain are disconnected, and each module to be tested is connected to the corresponding next-level module to be tested, thus obtaining the adjusted first scan chain.

[0007] Optionally, based on the first physical location information of each module to be detected in the first scanning chain and the principle of proximity, the next-level module to be detected corresponding to each module to be detected is determined, including: The first-level module to be detected in the first scan chain is determined; based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity, the second-level module to be detected corresponding to the first-level module to be detected is determined; based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity, the third-level module to be detected corresponding to the second-level module to be detected is determined; until there is no corresponding next-level module to be detected in the first scan chain.

[0008] Optionally, after obtaining the adjusted first scan chain, the scan chain adjustment method further includes: if it is determined that there are still intersecting lines in the adjusted first scan chain, adjusting the adjusted first scan chain based on the first physical position information of each module to be detected in the first scan chain.

[0009] Optionally, each adjusted first scan chain is treated as an element to determine the second physical location information of each adjusted first scan chain, including: Treat each adjusted first scan chain as an element, and determine the first-level module to be detected in each element; Based on the first physical location information of the first-level module to be detected in each element, the second physical location information of each element is determined, and the second physical location information of each adjusted first scan chain is obtained.

[0010] Optionally, based on the second physical location information of each adjusted first scan chain, the second scan chain is adjusted to obtain an adjusted second scan chain, including: Based on the second physical position information of each adjusted first scan chain in the second scan chain and the principle of proximity, the next level element corresponding to each element is determined; the original connections between each element in the second scan chain are disconnected, and each element is connected to its corresponding next level element to obtain the adjusted second scan chain.

[0011] Optionally, based on the second physical location information of each adjusted first scan chain in the second scan chain and the proximity principle, the next-level element corresponding to each element is determined, including: Determine the first-level element in the second scan chain; based on the second physical position information of each adjusted first scan chain in the second scan chain and the proximity principle, determine the second-level element corresponding to the first-level element; based on the second physical position information of each adjusted first scan chain in the second scan chain and the proximity principle, determine the third-level element corresponding to the second-level element; until there is no corresponding next-level element in the second scan chain.

[0012] Optionally, the scan chain adjustment method further includes: if it is determined that there are still intersecting lines in the adjusted second scan chain, adjusting the adjusted second scan chain based on the second physical position information of each adjusted first scan chain.

[0013] According to a second aspect of this application, embodiments of this application provide a scan chain adjustment device, comprising: The acquisition unit is used to acquire the first physical location information of each module to be tested in a plurality of first scan chains for a first test mode, wherein the plurality of first scan chains are connected end to end to form a second scan chain for a second test mode. The first adjustment unit is used to adjust each first scan chain based on the first physical position information of each module to be detected in each first scan chain to obtain an adjusted first scan chain; the length of the adjusted first scan chain is less than the length of the first scan chain. A determining unit is used to determine the second physical location information of each adjusted first scan chain as an element; The second adjustment unit is used to adjust the second scan chain based on the second physical position information of each adjusted first scan chain to obtain the adjusted second scan chain; the length of the adjusted second scan chain is less than the length of the second scan chain.

[0014] According to a third aspect of this application, embodiments of this application provide an electronic device, including: At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to cause the at least one processor to perform the scan chain adjustment method as described in the first aspect or any embodiment of the first aspect.

[0015] According to a fourth aspect of this application, embodiments of this application provide a computer-readable storage medium storing computer instructions for causing a computer to perform the scan chain adjustment method as described in the first aspect or any embodiment of the first aspect.

[0016] The scan chain adjustment method, apparatus, electronic device, and readable storage medium provided in this application, for chips requiring mixed testing of a first test mode and a second test mode, firstly adjust each first scan chain based on the first physical location information of each module to be tested in each first scan chain under the first test mode. This connects adjacent modules to be tested in each first scan chain as much as possible, avoiding detours in the connections and reducing the length of each first scan chain under the first test mode. Then, treating each first scan chain in the second scan chain under the second test mode as an element, the second scan chain is adjusted based on the second physical location information of each element. This connects adjacent elements in the second scan chain as much as possible, avoiding detours in the connections and reducing the length of the second scan chain under the second test mode. This significantly reduces the connection length of the scan chain in this mixed test, lowers test power consumption, and avoids the additional chip area increase caused by this mixed test.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] Figure 1 A schematic diagram of the scan chain structure for the ATE test and LBIST test; Figure 2 This is a flowchart illustrating a scan chain adjustment method according to an embodiment of this application; Figure 3 This is a schematic diagram of the connections between the modules to be detected in the first scanning chain in the embodiments of this application; Figure 4This is a schematic diagram of the connections between the modules to be detected in the first scan chain after the adjustment in this application embodiment; Figure 5 This is a schematic diagram of the adjusted first scan chain as an element in an embodiment of this application; Figure 6 This is a schematic diagram of the connection of the second scan chain in the embodiments of this application; Figure 7 This is a schematic diagram of the connection of the adjusted second scan chain in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of a scanning chain adjustment device in an embodiment of this application; Figure 9 This is a schematic diagram of the hardware structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] This application provides a scan chain adjustment method, such as... Figure 2 As shown, it includes: S201, Obtain the first physical location information of each module to be tested in multiple first scan chains for the first test mode, wherein the multiple first scan chains are connected end to end to form a second scan chain for the second test mode.

[0021] In this embodiment, both the first test mode and the second test mode are test modes based on scanning test technology, which means that the modules to be tested are connected end to end to form one or more serial scanning chains, and then test vectors are injected into the scanning chains by shifting to perform the test.

[0022] In this embodiment, under the first test mode, the length of the scan chain cannot be too long. Therefore, multiple modules to be tested form multiple first scan chains, and each first scan chain includes multiple modules to be tested connected end to end.

[0023] In this embodiment, under the second test mode, the number of scan chains cannot be too large. Therefore, multiple first scan chains are connected end-to-end to form a second scan chain. It should be noted that this embodiment only uses one second scan chain as an example to illustrate the adjustment method of the scan chain, but it is not a limitation on the number of second scan chains. For cases with multiple second scan chains, adjustments can be made for each second scan chain separately.

[0024] In some embodiments, the first test mode can be the LBIST test mode, and the second test mode can be the ATE test mode.

[0025] In some embodiments, the module to be detected can be a register in a chip.

[0026] In practice, the original scan chain information can be obtained first, including the name of each module to be detected on each first scan chain, the interconnection relationships between the modules to be detected, and the interconnection relationships between multiple first scan chains in the second scan chain. Then, based on the name of each module to be detected in each first scan chain, the first physical location information of each module to be detected in each first scan chain can be found from the lookup table between physical location information and modules.

[0027] S202, based on the first physical position information of each module to be detected in each first scan chain, each first scan chain is adjusted to obtain an adjusted first scan chain; the length of the adjusted first scan chain is less than the length of the first scan chain.

[0028] In this embodiment, since the first physical location information of each module to be detected in the first scan chain was not considered when the first scan chain was formed, the connection between each module to be detected in the first scan chain may have a circuitous connection, such as... Figure 3 As shown. Therefore, after obtaining the first physical location information of each module to be detected in the first scan chain, the connections of each module to be detected in the first scan chain can be readjusted based on principles such as proximity and non-intersecting connections, resulting in the adjusted first scan chain, as shown. Figure 4 As shown. This reduces the length of the first scan chain.

[0029] S203, taking each adjusted first scan chain as an element, determine the second physical location information of each adjusted first scan chain.

[0030] In this embodiment, each adjusted first scan chain can be considered as an element. The input pin of the first-stage module to be detected in the adjusted first scan chain is used as the SI input pin of that element, and the output of the last-stage module to be detected is used as the output SO of that element. Figure 5 As shown.

[0031] In one implementation, since each adjusted first scan chain is treated as an element, and the second scan chain is formed by connecting the ends of these elements, the first-level detection module in each element can be considered as the second physical location information of that element. Therefore, determining the second physical location information of each adjusted first scan chain can specifically include: determining the first-level detection module in each element; and determining the second physical location information of each element based on the first physical location information of the first-level detection module, thus obtaining the second physical location information of each adjusted first scan chain. This implementation method for determining the second physical location information of each adjusted first scan chain is relatively simple.

[0032] In one implementation, since each adjusted first scan chain is treated as an element, a circle with the smallest diameter or a quadrilateral with the smallest area can be determined based on the first physical position information of each module to be detected in the adjusted first scan chain, and the circle or the quadrilateral covers all the modules to be detected. Then, the center point of the circle or the quadrilateral is calculated as the second physical position information of the adjusted first scan chain.

[0033] S204, based on the second physical position information of each adjusted first scan chain, the second scan chain is adjusted to obtain the adjusted second scan chain; the length of the adjusted second scan chain is less than the length of the second scan chain.

[0034] In this embodiment, since the physical position information of each first scan chain was not considered when the second scan chain was formed, the connection order between the adjusted first scan chains in the second scan chain may be as follows: Figure 6 As shown, there are circuitous connections. After determining the second physical location information of each adjusted first scan chain in step S203, the connections of each adjusted first scan chain in the second scan chain can be readjusted based on principles such as proximity and non-intersecting connections, resulting in the adjusted second scan chain, as shown below. Figure 7 As shown. This reduces the length of the second scan chain.

[0035] The scan chain adjustment method provided in this application, for chips requiring mixed testing of a first test mode and a second test mode, firstly adjusts each first scan chain based on the first physical location information of each module to be tested in each first scan chain under the first test mode. This connects adjacent modules to be tested in each first scan chain as much as possible, avoiding detours and reducing the length of each first scan chain under the first test mode. Then, treating each first scan chain in the second scan chain under the second test mode as an element, the second scan chain is adjusted based on the second physical location information of each element. This connects adjacent elements in the second scan chain as much as possible, avoiding detours and reducing the length of the second scan chain under the second test mode. This significantly reduces the connection length of the scan chain in this mixed test, lowers test power consumption, and avoids the additional chip area increase caused by this mixed test.

[0036] In an optional embodiment, step S202, based on the first physical location information of each module to be detected in each first scan chain, adjusts each first scan chain to obtain an adjusted first scan chain, including: S2021, For each first scan chain, based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity, determine the next level module to be detected corresponding to each module to be detected; S2022, disconnect the original connections between the modules to be tested in the first scan chain, and connect each module to be tested with the corresponding next-level module to be tested to obtain the adjusted first scan chain.

[0037] In this embodiment, for S2021, based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity, the next-level module to be detected corresponding to each module to be detected is determined. Specifically, this may include: determining the first-level module to be detected in the first scan chain; determining the second-level module to be detected corresponding to the first-level module to be detected based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity; determining the third-level module to be detected corresponding to the second-level module to be detected based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity; until there is no corresponding next-level module to be detected in the first scan chain.

[0038] In specific implementation, firstly, based on the connection relationships between the modules to be detected in the first scan chain, the modules to be detected used for external input in the first scan chain can be identified as the first-level modules to be detected. Generally, the modules to be detected used for external input in the first scan chain are multiplexers; therefore, the multiplexers in the first scan chain can be identified as the first-level modules to be detected. Then, based on the first physical location information of each module to be detected in the first scan chain, the distance between the first-level modules to be detected and the remaining modules to be detected is calculated. Based on the distance between the first-level modules to be detected and the remaining modules to be detected, and the principle of proximity, the second-level modules to be detected corresponding to the first-level modules to be detected are determined, and the remaining modules to be detected are updated. Based on the first physical location information of each module to be detected in the first scan chain, the distance between the second-level modules to be detected and the remaining modules to be detected is calculated. Based on the distance between the second-level modules to be detected and the remaining modules to be detected, and the principle of proximity, the third-level modules to be detected corresponding to the second-level modules to be detected are determined, and the remaining modules to be detected are updated. This process continues until there are no remaining modules to be detected in the first scan chain.

[0039] In some implementations, regarding steps S2021 and S2022, taking registers in the chip as an example, the connections between the SI input pins, Q output pins, and multiplexer output pins of all registers in the first scan chain can be disconnected first. Then, starting from the first multiplexer in the first scan chain, find the register in the first scan chain that is physically closest to the multiplexer, and connect the SI input pin of this register to the output pin of the multiplexer. Next, based on the physical location information of this register, find the next-level register in the scan chain that is closest to this register, and connect the SI input pin of this next-level register to the Q output pin of this register. This process continues until all registers in the first scan chain are reconnected. After reordering and connecting all the first scan chains in the same way, the adjustment of each first scan chain is complete.

[0040] In this embodiment, the first scanning chain is adjusted based on the first physical location information of each module to be detected in the first scanning chain and the principle of proximity. This allows the modules to be detected that are closer to each other to be connected first, avoids detours in the connection of the first scanning chain, and makes the connection of the first scanning chain the shortest possible.

[0041] In an optional embodiment, after obtaining the adjusted first scan chain, the scan chain adjustment method further includes: if it is determined that there are still intersecting lines in the adjusted first scan chain, adjusting the adjusted first scan chain based on the first physical location information of each module to be detected in the first scan chain.

[0042] In practice, after obtaining the adjusted first scan chain, it is possible to check whether there are still intersecting lines in the adjusted first scan chain. If there are still intersecting lines, the adjusted first scan chain can be adjusted multiple times, starting from the intersecting lines or starting directly from the beginning, so that the lines in the adjusted first scan chain are the shortest.

[0043] In an optional pair embodiment, step S204, adjusting the second scan chain based on the second physical location information of each adjusted first scan chain to obtain an adjusted second scan chain, includes: S2041, Based on the second physical position information of each adjusted first scan chain in the second scan chain and the principle of proximity, determine the next level element corresponding to each element; S2042, disconnect the original connections between each element in the second scan chain, and connect each element with the corresponding next-level element to obtain the adjusted second scan chain.

[0044] In this embodiment, for step S2041, based on the second physical position information of each adjusted first scan chain in the second scan chain and the proximity principle, the next-level element corresponding to each element is determined. Specifically, this may include: determining the first-level element in the second scan chain; determining the second-level element corresponding to the first-level element based on the second physical position information of each adjusted first scan chain in the second scan chain and the proximity principle; determining the third-level element corresponding to the second-level element based on the second physical position information of each adjusted first scan chain in the second scan chain and the proximity principle; until there is no corresponding next-level element in the second scan chain.

[0045] In practice, the process begins by determining the first-level elements in the second scan chain based on the connection relationships between the first scan chains. Then, based on the second physical position information of each adjusted first scan chain in the second scan chain, the distance between the first-level elements and the remaining elements is calculated. Next, based on the distance between the first-level elements and the remaining elements and the principle of proximity, the second-level elements corresponding to the first-level elements are determined, and the remaining elements are updated. The distance between the second-level elements and the remaining elements is calculated based on the second physical position information of each adjusted first scan chain in the second scan chain. Finally, based on the distance between the second-level elements and the remaining elements and the principle of proximity, the third-level elements corresponding to the second-level elements are determined, and the remaining elements are updated. This process continues until there are no remaining elements in the second scan chain.

[0046] In some implementations, steps S2021 and S2022 are specifically illustrated using a register in the chip as an example. Each adjusted first scan chain can be considered as an element, with each element having an SI input pin and an SO output pin. The SI input pin corresponds to the B pin of the multiplexer in the adjusted first scan chain, used to receive the second mode test signal. The SO pin corresponds to the Q pin of the last-level register in the adjusted first scan chain. Next, all connections between elements in the second scan chain are disconnected. Starting from the first-level element, based on the physical location information of the SO pin of the first-level element, the SI pin of the second-level element closest to the SO pin of the first-level element is found and connected. Similarly, based on the position of the SO pin of the second-level element, the SI pin of the nearest next-level element is found and connected, and so on, until all elements in the second scan chain are rearranged and connected.

[0047] In this embodiment, the second scanning chain is adjusted based on the second physical location information of each adjusted first scanning chain in the second scanning chain and the principle of proximity. This allows the adjusted first scanning chains that are closer to each other to be connected first, avoids detours in the connections of the second scanning chain, and minimizes the length of the connections in the second scanning chain.

[0048] In an optional embodiment, the scan chain adjustment method further includes: if it is determined that there are still intersecting lines in the adjusted second scan chain, adjusting the adjusted second scan chain based on the second physical location information of each adjusted first scan chain.

[0049] In practice, after obtaining the adjusted second scan chain, it can be checked whether there are still intersecting connections. If there are, the adjusted second scan chain can be adjusted multiple times, starting from the intersecting connection or starting directly from the beginning, until the connections in the adjusted second scan chain are minimized. At this point, the connection lengths of all first and second scan chains are the shortest and most optimal solution, without affecting the original test logic functionality of the first and second test modes.

[0050] This application also provides a scan chain adjustment device, such as... Figure 8 As shown, it includes: The acquisition unit 61 is used to acquire the first physical location information of each module to be detected in a plurality of first scan chains for the first test mode, wherein the plurality of first scan chains are connected end to end to form a second scan chain for the second test mode. The first adjustment unit 62 is used to adjust each first scan chain based on the first physical position information of each module to be detected in each first scan chain to obtain an adjusted first scan chain; the length of the adjusted first scan chain is less than the length of the first scan chain. The determining unit 63 is used to determine the second physical position information of each adjusted first scan chain as an element; The second adjustment unit 64 is used to adjust the second scan chain based on the second physical position information of each adjusted first scan chain to obtain the adjusted second scan chain; the length of the adjusted second scan chain is less than the length of the second scan chain.

[0051] The scan chain adjustment device provided in this application, for chips requiring mixed testing of a first test mode and a second test mode, first adjusts each first scan chain based on the first physical location information of each module to be tested in each first scan chain under the first test mode. This connects adjacent modules to be tested in each first scan chain as much as possible, avoiding detours and reducing the length of each first scan chain under the first test mode. Then, treating each first scan chain in the second scan chain under the second test mode as an element, the second scan chain is adjusted based on the second physical location information of each element. This connects adjacent elements in the second scan chain as much as possible, avoiding detours and reducing the length of the second scan chain under the second test mode. This significantly reduces the connection length of the scan chain in this mixed test, lowers test power consumption, and avoids the additional chip area increase caused by this mixed test.

[0052] In some embodiments, the first adjustment unit 62 is used to determine the next-level module to be detected corresponding to each first scan chain based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity; disconnect the original connection between each module to be detected in the first scan chain, and connect each module to be detected with the corresponding next-level module to be detected to obtain the adjusted first scan chain.

[0053] In some embodiments, the first adjustment unit 62 is used to determine the first-level module to be detected in the first scan chain; determine the second-level module to be detected corresponding to the first-level module to be detected based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity; determine the third-level module to be detected corresponding to the second-level module to be detected based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity; until there is no corresponding next-level module to be detected in the first scan chain.

[0054] In some embodiments, after obtaining the adjusted first scan chain, the first adjustment unit 62 is further configured to adjust the adjusted first scan chain based on the first physical location information of each module to be detected in the first scan chain if it is determined that there are still intersecting lines in the adjusted first scan chain.

[0055] In some embodiments, the determining unit 63 is configured to treat each adjusted first scan chain as an element, determine the first-level module to be detected in each element, and determine the second physical location information of each element based on the first physical location information of the first-level module to be detected in each element, thereby obtaining the second physical location information of each adjusted first scan chain.

[0056] In some embodiments, the second adjustment unit 64 is used to determine the next-level element corresponding to each element based on the second physical location information of each adjusted first scan chain in the second scan chain and the principle of proximity; disconnect the original connection between each element in the second scan chain, and connect each element with the corresponding next-level element to obtain the adjusted second scan chain.

[0057] In some embodiments, the second adjustment unit 64 is configured to: determine the first-level element in the second scan chain; determine the second-level element corresponding to the first-level element based on the second physical location information of each adjusted first scan chain in the second scan chain and the proximity principle; determine the third-level element corresponding to the second-level element based on the second physical location information of each adjusted first scan chain in the second scan chain and the proximity principle; until there is no corresponding next-level element in the second scan chain.

[0058] In some embodiments, the second adjustment unit 64 is further configured to adjust the adjusted second scan chain based on the second physical location information of each adjusted first scan chain if it is determined that there are still intersecting lines in the adjusted second scan chain.

[0059] According to embodiments of this application, this application also provides an electronic device and a readable storage medium.

[0060] Figure 9 A schematic block diagram of an example electronic device 800 that can be used to implement embodiments of this application is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the application described and / or claimed herein.

[0061] like Figure 9 As shown, the electronic device 800 includes a computing unit 801, which can perform various appropriate actions and processes based on a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. The RAM 803 may also store various programs and data required for the operation of the electronic device 800. The computing unit 801, ROM 802, and RAM 803 are interconnected via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0062] Multiple components in electronic device 800 are connected to I / O interface 805, including: input unit 806, such as keyboard, mouse, etc.; output unit 807, such as various types of displays, speakers, etc.; storage unit 808, such as disk, optical disk, etc.; and communication unit 809, such as network card, modem, wireless transceiver, etc. Communication unit 809 allows electronic device 800 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0063] The computing unit 801 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 801 performs the various methods and processes described above, such as the scan chain adjustment method. For example, in some embodiments, the scan chain adjustment method may be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 808. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 800 via ROM 802 and / or communication unit 809. When the computer program is loaded into RAM 803 and executed by the computing unit 801, one or more steps of the scan chain adjustment method described above may be performed. Alternatively, in other embodiments, the computing unit 801 may be configured to perform the scan chain adjustment method by any other suitable means (e.g., by means of firmware).

[0064] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0065] The program code used to implement the methods of this application may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing device, such that when executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0066] In the context of this application, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. Machine-readable media can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0067] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0068] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as a data server), or computing systems that include middleware components (e.g., an application server), or computing systems that include frontend components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., a communication network). Examples of communication networks include local area networks (LANs), wide area networks (WANs), and the Internet.

[0069] Computer systems can include clients and servers. Clients and servers are generally located far apart and typically interact via communication networks. Client-server relationships are created by computer programs running on the respective computers and having a client-server relationship with each other. Servers can be cloud servers, servers in distributed systems, or servers incorporating blockchain technology.

[0070] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0071] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0072] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A scan chain adjustment method, characterized in that, include: Obtain the first physical location information of each module to be detected in multiple first scan chains for a first test mode, wherein multiple first scan chains are connected end to end to form a second scan chain for a second test mode; Based on the first physical location information of each module to be detected in each first scan chain, each first scan chain is adjusted to obtain an adjusted first scan chain; the length of the adjusted first scan chain is less than the length of the first scan chain. Taking each of the adjusted first scan chains as an element, the second physical position information of each of the adjusted first scan chains is determined, including: taking each of the adjusted first scan chains as an element, determining the first-level module to be detected in each element; and determining the second physical position information of each element based on the first physical position information of the first-level module to be detected in each element, thereby obtaining the second physical position information of each of the adjusted first scan chains. Based on the second physical position information of each of the adjusted first scan chains, the second scan chain is adjusted to obtain an adjusted second scan chain, including: determining the next-level element corresponding to each element based on the second physical position information of each of the adjusted first scan chains in the second scan chain and the principle of proximity; disconnecting the original connections between each element in the second scan chain and connecting each element with its corresponding next-level element to obtain the adjusted second scan chain; the length of the adjusted second scan chain is less than the length of the second scan chain.

2. The scan chain adjustment method according to claim 1, characterized in that, Based on the first physical location information of each module to be detected in each of the first scan chains, each of the first scan chains is adjusted to obtain an adjusted first scan chain, including: For each of the first scan chains, based on the first physical location information of each module to be detected in the first scan chain and the principle of proximity, the next level module to be detected corresponding to each module to be detected is determined; The original connections between the modules to be detected in the first scan chain are disconnected, and each module to be detected is connected to the corresponding next-level module to be detected, thus obtaining the adjusted first scan chain.

3. The scan chain adjustment method according to claim 2, characterized in that, Based on the first physical location information of each module to be detected in the first scanning chain and the principle of proximity, the next-level module to be detected corresponding to each module to be detected is determined, including: Identify the first-level module to be detected in the first scanning chain; Based on the first physical location information of each module to be detected in the first scanning chain and the principle of proximity, the second-level module to be detected corresponding to the first-level module to be detected is determined. Based on the first physical location information of each module to be detected in the first scanning chain and the principle of proximity, the third-level module to be detected corresponding to the second-level module to be detected is determined; until there is no corresponding next-level module to be detected in the first scanning chain.

4. The scan chain adjustment method according to claim 1, characterized in that, After obtaining the adjusted first scan chain, the following is also included: If it is determined that there are still intersecting connections in the adjusted first scan chain, the adjusted first scan chain is adjusted based on the first physical position information of each module to be detected in the first scan chain.

5. The scan chain adjustment method according to claim 1, characterized in that, Based on the second physical location information of each of the adjusted first scan chains in the second scan chain and the principle of proximity, the next-level element corresponding to each element is determined, including: Determine the first-level element in the second scan chain; Based on the second physical location information of each of the adjusted first scan chains in the second scan chain and the principle of proximity, the second-level element corresponding to the first-level element is determined. Based on the second physical location information of each of the adjusted first scan chains in the second scan chain and the principle of proximity, the third-level element corresponding to the second-level element is determined; until there is no corresponding next-level element in the second scan chain.

6. The scan chain adjustment method according to claim 1, characterized in that, Also includes: If it is determined that there are still intersecting connections in the adjusted second scan chain, the adjusted second scan chain is adjusted based on the second physical location information of each of the adjusted first scan chains.

7. A scanning chain adjustment device, characterized in that, include: The acquisition unit is used to acquire the first physical location information of each module to be detected in a plurality of first scan chains for a first test mode, wherein the plurality of first scan chains are connected end to end to form a second scan chain for a second test mode. The first adjustment unit is used to adjust each first scan chain based on the first physical location information of each module to be detected in each first scan chain to obtain an adjusted first scan chain; the length of the adjusted first scan chain is less than the length of the first scan chain. The determining unit is configured to take each of the adjusted first scan chains as an element and determine the second physical position information of each of the adjusted first scan chains, including: taking each of the adjusted first scan chains as an element and determining the first-level detection module in each element; determining the second physical position information of each element based on the first physical position information of the first-level detection module in each element, thereby obtaining the second physical position information of each of the adjusted first scan chains; The second adjustment unit is used to adjust the second scan chain based on the second physical position information of each of the adjusted first scan chains to obtain an adjusted second scan chain. The adjustment includes: determining the next-level element corresponding to each element based on the second physical position information of each of the adjusted first scan chains in the second scan chain and the principle of proximity; disconnecting the original connections between each element in the second scan chain and connecting each element with its corresponding next-level element to obtain the adjusted second scan chain; the length of the adjusted second scan chain is less than the length of the second scan chain.

8. An electronic device, characterized in that, include: At least one processor; And a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to cause the at least one processor to perform the scan chain adjustment method as described in any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing a computer to perform the scan chain adjustment method as described in any one of claims 1-6.