A double-scale connectable topology optimization method based on material field series expansion
By using a method based on material field series expansion, the problems of long computation time and poor microstructure connectivity in multi-scale structural design were solved, achieving efficient and accurate two-scale topology optimization and improving the load-bearing capacity of aerospace structures.
Patent Information
- Application Number
- CN202310836555.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-10
- Publication Date
- 2026-05-29
- Estimated Expiration
- 2043-07-10
AI Technical Summary
Existing parallel topology optimization design for multi-scale structures suffers from problems such as long computation time, numerous design variables, and poor microstructure connectivity, resulting in low optimization efficiency and large performance prediction errors, making it difficult to apply in practical applications in the aerospace field.
A method based on material field series expansion is adopted, which introduces macroscopic and microscopic material field functions to characterize the structural distribution, and implicitly incorporates the connectivity of microstructures into the optimization model to reduce design variables. The method combines material field series expansion and SIMP interpolation with finite element analysis and gradient optimization algorithms to achieve natural connectivity of microstructures.
It significantly improves the efficiency and accuracy of dual-scale topology optimization, ensures the connectivity between microstructures, has a short optimization time, small performance prediction deviation, and enhances the load-bearing capacity of aerospace structures.