Liquid ejecting head and liquid ejecting apparatus

Abstract

An object of the present application is to provide a liquid ejecting head and a liquid ejecting apparatus which can reduce or prevent a decrease in image quality without increasing the chip size. To achieve this object, a configuration is employed in which no adhesive layer is provided between a liquid supply substrate and a channel partition provided between a common supply channel and a common collection channel, and a minute communication portion is provided there.

Description

Technical Field

[0001] The present invention relates to a liquid jet head for spraying circulating liquid, and a liquid jetting device on which the liquid jet head can be mounted. Background Technology

[0002] The problem with liquid jet heads that spray liquid is so-called crosstalk, where pressure fluctuations that occur in response to the ejection of droplets from the nozzle through the pressure chamber propagate through the liquid channel to other pressure chambers and alter the jet characteristics.

[0003] In addition, in recent years, besides the need to achieve higher image quality and resolution, there has also been a demand for liquid jet heads that spray liquids in a pressure chamber and circulate these liquids simultaneously.

[0004] Japanese Patent Application Publication No. 2019-155909 discloses a structure in which a common supply channel and a common collection channel are alternately arranged, and a damper is provided on a portion of the wall forming the common supply channel and the common collection channel to suppress crosstalk. In the structure of Japanese Patent Application Publication No. 2019-155909, the damper member used as the damper is joined to the upper portion of the channel partition between the common supply channel and the common collection channel.

[0005] Constructions such as those described in Japanese Patent Application Publication No. 2019-155909 require sufficient bonding area on the upper portion of the channel partition. However, in this case, the damper region and fluid region may be relatively small. A reduction in the size of the damper region may increase crosstalk, and a reduction in the size of the fluid region may increase voltage drop. This could therefore degrade image quality. On the other hand, with a smaller bonding area, the adhesive layer may protrude from the bonding portion, leading to problems such as channel occlusion. This could also degrade image quality. Furthermore, to provide sufficient damper region, fluid region, and bonding area, it is undesirable to increase the chip size. Summary of the Invention

[0006] In view of the above, the liquid jetting head and liquid jetting device provided by the present invention can reduce or prevent the degradation of image quality without increasing the chip size.

[0007] The liquid injection head of the present invention includes: an injection port from which liquid is injected; a pressure chamber communicating with the injection port; a pressure generating element disposed in the pressure chamber and capable of injecting liquid from the injection port by applying pressure; a separate supply channel communicating with the pressure chamber and capable of supplying liquid to the pressure chamber; a separate collection channel communicating with the pressure chamber and capable of collecting liquid from the pressure chamber; a common supply channel communicating with the separate supply channel; a common collection channel communicating with the separate collection channel; and a channel partition disposed between the common supply channel and the common collection channel, wherein a plurality of the injection ports and a plurality of the pressure chambers are disposed in the channel partition, the common supply channel and the common collection channel communicating with the plurality of separate supply channels and the plurality of separate collection channels respectively, and a communication portion communicating with the common supply channel and the common collection channel is disposed in a region existing between a first substrate forming the channel partition and a second substrate stacked on the first substrate, and corresponding to the channel partition.

[0008] The liquid jetting head and liquid jetting device provided by the present invention can reduce or prevent the degradation of image quality without increasing chip size.

[0009] Further features of the invention will become apparent from the following description of exemplary embodiments, with reference to the accompanying drawings. Attached Figure Description

[0010] Figure 1 This is a schematic perspective view showing a liquid injection device on which a liquid injection head can be mounted;

[0011] Figure 2 This is an external perspective view showing the liquid injection head;

[0012] Figure 3A This is a view showing the liquid jetting substrate;

[0013] Figure 3B This is a view showing the liquid jetting substrate;

[0014] Figure 3C This is a view showing the liquid jetting substrate;

[0015] Figure 3D This is a view showing the liquid jetting substrate;

[0016] Figure 4A This is a view showing the liquid jetting substrate;

[0017] Figure 4BThis is a view showing the liquid jetting substrate;

[0018] Figure 5 This is a view showing the liquid jetting substrate;

[0019] Figure 6 This is a cross-sectional view showing a liquid jetting substrate as a comparative example;

[0020] Figure 7 It is a graph showing the relationship between the height of the tiny connected parts and the viscous resistance ratio;

[0021] Figure 8A This is a view showing the liquid jetting substrate;

[0022] Figure 8B This is a view showing the liquid jetting substrate;

[0023] Figure 9A This is a view showing the liquid jetting substrate;

[0024] Figure 9B This is a view showing the liquid jetting substrate;

[0025] Figure 10A This is a view showing a variation of the liquid jetting substrate; and

[0026] Figure 10B This is a view showing a variation of the liquid jetting substrate. Detailed Implementation

[0027] (First Embodiment)

[0028] The liquid jet head and liquid jetting device according to this embodiment can be applied to devices such as printers, copiers, fax machines with communication systems, and word processors with printing units, as well as industrial printing devices that combine various processing devices.

[0029] The first embodiment of the present invention will now be described with reference to the accompanying drawings.

[0030] Figure 1This is a schematic perspective view showing a liquid jetting apparatus 101 on which a liquid jetting head 1 can be mounted. The liquid jetting head 1 is the liquid jetting head applicable to this embodiment. The liquid jetting apparatus 101 forms an image on the printing medium 111 by jetting liquid (hereinafter also referred to as "ink") from the liquid jetting head 1 while moving the printing medium 111 to a position opposite to the liquid jetting surface of the liquid jetting head 1. The liquid jetting head 1 mounted on the liquid jetting apparatus 101 includes liquid jetting heads 1Ca and 1Cb for cyan (C) ink and liquid jetting heads 1Ma and 1Mb for magenta (M) ink. The liquid jetting head 1 also includes liquid jetting heads 1Ya and 1Yb for yellow ink and liquid jetting heads 1Ka and 1Kb for black (K) ink.

[0031] Multiple nozzles are arranged in the liquid jet head 1 along the X direction, extending the width of the printing medium 111. The printing medium 111 is conveyed in the A direction by the conveying unit 110, and printing is performed on the printing medium by the liquid jet head 1.

[0032] Figure 2 This is an external perspective view showing the liquid ejector head 1. Each liquid ejector head 1 in this embodiment has four liquid ejector substrates 2 disposed in the head body 4. The liquid ejector substrates 2 are configured such that the end portions of the array of ejector nozzles 3 extending in the X direction overlap each other in the Y direction. This arrangement of the liquid ejector substrates 2 enables printing with a long nozzle array. Ink ejected by the liquid ejector head 1 is supplied from a liquid tank (not shown) through a common supply port (not shown) in the head body 4 to the liquid ejector substrates 2.

[0033] Figure 3A This is a view showing the liquid jetting substrate 2 as seen from the jetting surface side where the jetting nozzle 3 is formed. Figure 3B This is a view showing the liquid jetting substrate 2 as seen from the side opposite to the nozzle surface. A plurality of nozzles 3 formed in the nozzle substrate 201 are arranged along the longitudinal direction of the nozzle substrate 201, forming a plurality of nozzle arrays. A plurality of connecting channels 15 are formed in the channel forming substrate 204. Ink is supplied to the liquid jetting substrate 2 from some of the connecting channels 15 and is ejected from the nozzles 3 through internal channels to be applied to the printing medium 111.

[0034] The head body 4 is provided with an electrical circuit board (not shown) for supplying the power and signals required for liquid injection. This electrical circuit board is connected to terminals 10 on each liquid injection board 2 via wiring (not shown). The liquid injection head 1 can be configured to include... Figure 2 Any form of construction, including examples of , and other forms are unrestricted.

[0035] Figure 3C It is along Figure 3A The image shows a cross-sectional view of the liquid jetting substrate 2 taken along line IIIC-IIIC. The liquid jetting substrate 2 includes a jetting port substrate 201, an actuator substrate 202, a liquid supply substrate 203, and a channel forming substrate 204. The liquid jetting substrate 2 also includes a damper substrate 302, which includes a damper member 300 between the channel forming substrate 204 and the liquid supply substrate 203. Therefore, the liquid jetting substrate 2 comprises five substrates.

[0036] Figure 3D yes Figure 3C The circled portion is an enlarged view of the IIID diagram. Multiple pressure chambers 11 are disposed in the liquid jetting substrate 2. Each pressure chamber 11 is configured to communicate with a jet nozzle 3. In the actuator substrate 202 forming some walls of the pressure chambers 11, piezoelectric elements 18 are disposed facing the jet nozzle 3. Liquid can be jetted from the jet nozzle 3 by actuating the piezoelectric elements 18. By receiving a voltage, the piezoelectric elements 18 deform to pressurize the liquid inside the pressure chamber 11 and jet the liquid from the jet nozzle 3 in the form of droplets. Additionally, separate supply channels 12a and separate collection channels 12b are configured to communicate with the pressure chambers 11. Each separate supply channel 12a communicates with a common supply channel 13a. Each separate collection channel 12b communicates with a common collection channel 13b. The separate supply channels 12a are configured to supply liquid to the pressure chambers 11. The separate collection channels 12b are configured to collect liquid from the pressure chambers 11.

[0037] The wall of the common supply channel 13a facing the individual supply channel 12a is formed by a damper member 300. The wall of the common collection channel 13b facing the individual collection channel 12b is also formed by a damper member 300. Some of the surfaces of the damper member 300 opposite to its surface facing the individual collection channel 12b form damper regions 301. The common supply channel 13a is connected to a connecting channel 15a, and liquid is supplied from the outside to the common supply channel 13a through the connecting channel 15a. The common collection channel 13b is connected to the connecting channel 15b, and liquid is collected from the common collection channel 13b to the outside through the connecting channel 15b.

[0038] The jet nozzle substrate 201, actuator substrate 202, liquid supply substrate 203, and channel forming substrate 204 can all be silicon substrates or similar substrates. They are not limited to individual substrates.

[0039] The damper component 300 is made of an elastic material. For example, resin materials such as polyimide and polyamide can be used. Regarding the damper substrate 302, the damper component 300 is attached to one surface of the silicon substrate, and openings are formed in the damper component 300 by means such as etching, according to the shape of the channels in the channel forming substrate 204. Then, the damper substrate 302 is attached to the channel forming substrate 204, and the surface opposite to the damper component 300 is etched. In this way, a common supply channel 13a and a common collection channel 13b can be formed. The means for forming openings in the damper component 300 can be dry etching, or, if the damper component 300 is a photosensitive resin, patterning using exposure.

[0040] In this embodiment, a configuration for ejecting liquid from the injection port 3 by actuating the piezoelectric element 18 has been exemplarily described. However, the configuration is not limited to this, and the configuration may also enable liquid to be ejected from the injection port by actuating a pressure generating element (e.g., a heating element).

[0041] Figure 4A This is an enlarged planar perspective view showing a portion of the liquid jetting substrate 2. Figure 4B It is along Figure 4A The cross-section of the IVB-IVB line is shown. In the liquid jetting substrate 2, a plurality of jetting ports 3 are provided, and pressure chambers 11 are provided in communication with and corresponding to the jetting ports 3. Furthermore, in the liquid jetting substrate 2, a plurality of jetting port arrays are formed side-by-side along the Y direction, each jetting port array being formed by arranging the jetting ports 3 in the X direction, and a separate supply channel 12a and a separate collection channel 12b are formed for each pressure chamber 11. A common supply channel 13a and a common collection channel 13b are formed to extend in the X direction, which is the longitudinal direction of the substrate. Furthermore, a damper region 301 is arranged to overlap with the positions of the separate supply channels 12a and the separate collection channels 12b. Additionally, the separate supply channels 12a are connected to the supply connection channel 15a via the common supply channel 13a, and the separate collection channels 12b are connected to the collection connection channel 15b via the common collection channel 13b.

[0042] Pressure chambers 11 corresponding to the nozzles are adjacent to each other in the X direction, which is the transverse direction of the pressure chambers 11. By being adjacent in this manner, the nozzles communicating with the pressure chambers 11 form a nozzle array. This allows for increased density. For example, in this embodiment, each pressure chamber 11 has a length of 110 μm in its transverse direction (X direction), and the pressure chambers 11 and nozzles 3 are arranged at 150 dpi intervals. Multiple nozzle arrays are arranged offset from each other in the Y direction. This arrangement enables a high nozzle density of 600 dpi to be achieved on the printing medium. In this embodiment, four nozzle arrays are provided to achieve 600 dpi. Alternatively, the configuration could allow for eight nozzle arrays to achieve 1200 dpi.

[0043] As previously described, the piezoelectric element 18 deforms upon receiving a voltage, thereby pressurizing the liquid inside the pressure chamber 11 and ejecting the liquid as droplets from the nozzle 3. At this time, pressure fluctuations occur in the pressure chamber 11. Increasing the density of the nozzles 3 not only brings the pressure chambers 11 closer together but also brings the common supply channel 13a and common collection channel 13b closer together. This results in so-called crosstalk, where pressure fluctuations in response to the ejection of droplets from the nozzles propagate through the corresponding pressure chamber 11, common supply channel 13a, and common collection channel 13b to other pressure chambers. The pressure generated in the pressure chamber 11 during ejection propagates from the pressure chamber 11 through the corresponding individual supply channel 12a and individual collection channel 12b to the corresponding common supply channel 13a and common collection channel 13b. The pressure then propagates through the common supply channel 13a and common collection channel 13b to other pressure chambers.

[0044] The damper substrate 302 forms a portion of the common supply channel 13a and the common collection channel 13b, and a channel partition 16 is disposed between the common supply channel 13a and the common collection channel 13b. In this embodiment, the channel partition 16 is made relatively thin. This shortens the distance between the common supply channel 13a and the common collection channel 13b without narrowing the common supply channel 13a and the common collection channel 13b in the Y direction. Furthermore, the damper region 301 is configured to extend along the longitudinal direction (i.e., the X direction) of the liquid jet substrate 2. This increases the size of the damper region 301 without increasing the size of the liquid jet substrate 2.

[0045] A damper region 301 is positioned opposite the separate supply channel 12a and the separate collection channel 12b. The damper region 301 is configured to allow the damper member 300 to receive pressure propagated through the separate supply channel 12a and the separate collection channel 12b and to deform to absorb pressure fluctuations. In the channel forming substrate 204, the damper region 301, which allows the damper member 300 to deform, and either the supply connection channel 15a or the collection connection channel 15b are alternately formed.

[0046] Figure 5 It is along Figure 4A A cross-sectional view taken from the IVB-IVB line, but showing the cross-section from the IVB-IVB line. Figure 4B The cross-section seen from the opposite direction. Figure 6 This is a cross-sectional view showing a liquid jetting substrate as a comparative example.

[0047] In each liquid jetting substrate 2 of this embodiment, a common supply channel 13a and a common collection channel 13b are formed by attaching and laminating a liquid supply substrate 203 and a damper substrate 302 including a damper member 300 using an adhesive layer 19. The adhesive layer 19 is provided with an adhesive region including an adhesive material and a non-adhesive region not including an adhesive material. When the liquid supply substrate 203 and the damper substrate 302 are attached to each other, the region between the liquid supply substrate 203 and the channel partition 16 located between the common supply channel 13a and the common collection channel 13b is a non-adhesive region, and the adhesive layer 19 is not provided there. The adhesive layer 19 is not provided between the liquid supply substrate 203 and the channel partition 16, and a small connecting portion 20 is provided there. The portion of the damper substrate 302 where the common supply channel 13a, the common collection channel 13b, or the channel partition 16 is not provided is an adhesive region, and the adhesive layer 19 is provided there.

[0048] When the substrate is attached in a conventional manner using an adhesive layer, this configuration allows the adhesive layer 19 to also be disposed on the channel partition 16, such as... Figure 6 As shown. It should be noted that when the channel partition is made thinner as in this embodiment, the channel partition does not have a sufficient area for the adhesive layer to be applied. Therefore, the adhesive layer can extend into the common supply channel and the common collection channel. With the adhesive layer extending into the common supply channel and the common collection channel, there is a possibility of blockage of the common supply channel and the common collection channel or a reduction in the size of the channel area, which may lead to increased pressure loss.

[0049] By employing a construction where the adhesive layer 19 is not provided on the channel partition 16 between the common supply channel 13a and the common collection channel 13b, as in this embodiment, sufficient area is provided for the common supply channel 13a and the common collection channel 13b, thereby reducing pressure loss. Furthermore, a small connecting portion 20 is provided to allow flow in the stagnation area in the upper portion (lower portion along the direction of gravity during use) of the common supply channel 13a and the common collection channel 13b, thus reducing stagnation. This facilitates the flow of bubbles and the like within the common supply channel 13a and the common collection channel 13b through circulating flow.

[0050] Incidentally, when the size of the micro-connecting portion 20 is large, the circulating flow rate through the separate supply channel 12a, pressure chamber 11, and collection channel 12b in sequence will be smaller. Therefore, the size of the micro-connecting portion 20 is preferably small, and the channel resistance of the micro-connecting portion 20 is preferably large.

[0051] Figure 7 This is a graph where the horizontal axis represents the height of the micro-connection portion 20, and the vertical axis represents the ratio between the viscous resistance of the micro-connection portion 20 and the viscous resistance of the injection channel (the channel from the separate supply channel 12a through the pressure chamber 11 to the separate collection channel 12b). The viscous resistance of the channel at the micro-connection portion 20 is more than 100 times, and ideally more than 1000 times, that of the injection channel. The height of the micro-connection portion 20 is less than 7 μm, and ideally less than 3 μm.

[0052] As described above, this configuration eliminates the need for an adhesive layer 19 between the liquid supply substrate 203 and the channel partition 16 located between the common supply channel 13a and the common collection channel 13b, and instead provides a micro-connection portion 20 there. This allows for the provision of a liquid jetting head and liquid jetting device that can reduce or prevent image quality degradation without increasing chip size.

[0053] (Second Embodiment)

[0054] The second embodiment of the present invention will now be described with reference to the accompanying drawings. It should be noted that the basic structure of this embodiment is similar to that of the first embodiment, therefore, the feature structure will be described below.

[0055] Figure 8A This is a partial cross-sectional view of the liquid jetting substrate 2 in this embodiment. Figure 8BThis is a cross-sectional view of the liquid jetting substrate 2. In the liquid jetting substrate 2 of this embodiment, separate supply channels 12a, separate collection channels 12b, and a common supply channel 13a and a common collection channel 13b are provided in the liquid supply substrate 203. This configuration eliminates the need for the damper substrate 302 in the first embodiment and reduces the number of substrates, thereby allowing for cost reduction.

[0056] In this embodiment, the damper component 300 is disposed between the liquid supply substrate 203 and the channel forming substrate 204, and the adhesive layer 19 is disposed between the damper component 300 and the liquid supply substrate 203. Furthermore, a channel partition 16 is disposed on the liquid supply substrate 203, and no adhesive layer 19 is disposed between the channel partition 16 and the damper component 300; a micro-connection portion 20 is disposed there.

[0057] By employing the construction described above, where the adhesive layer 19 is not provided on the channel partition 16 between the common supply channel 13a and the common collection channel 13b, sufficient area is provided for the common supply channel 13a and the common collection channel 13b, thereby reducing pressure loss. Furthermore, a small connecting portion 20 is provided to allow circulating flow in the damper region 301 and reduce stagnation. This facilitates the flow of bubbles and the like within the common supply channel 13a and the common collection channel 13b through circulating flow.

[0058] (Third Embodiment)

[0059] The third embodiment of the present invention will now be described with reference to the accompanying drawings. It should be noted that the basic structure of this embodiment is similar to that of the first embodiment, therefore, the feature structure will be described below.

[0060] Figure 9A This is a partial cross-sectional view of the liquid jetting substrate 2 in this embodiment. Figure 9B This is a cross-sectional view of the liquid jetting substrate 2. In the liquid jetting substrate 2 of this embodiment, the damper region 301 is provided at a position opposite to the individual collection channel 12b, but not at a position opposite to the individual supply channel 12a. In the configuration where the liquid circulates through the pressure chamber 11, the pressure in the individual collection channel 12b is set lower than the pressure in the individual supply channel 12a to generate a circulating flow. Therefore, pressure fluctuations occurring in the pressure chamber 11 in response to jetting propagate to a greater extent to the individual collection channel 12b. Thus, by providing the damper region 301 at a position opposite to the individual collection channel 12b and not providing the damper region 301 at a position opposite to the individual supply channel 12a, advantageous effects can be achieved.

[0061] Furthermore, the absence of a damper region 301 at the location opposite the separate supply channel 12a allows for the expansion of the damper region 301 at the location opposite the separate collection channel 12b.

[0062] Typically, damping performance depends on the thickness, surface area, and Young's modulus of the damper component 300. The smaller the thickness and Young's modulus of the damper component 300, the greater the crosstalk suppression effect. However, in this case, the mechanical strength of the damper component 300 becomes a concern. Therefore, from the perspective of mechanical strength reliability, increasing the surface area of ​​the damper component 300 is effective.

[0063] Figure 10A This is a partial cross-sectional view showing a variation of the liquid jet substrate 2 in this embodiment. Figure 10B This is a cross-sectional view of the liquid jetting substrate 2. (See diagram below.) Figure 10A and 10B As shown, the structure in this embodiment can be applied to a structure in which the liquid supply substrate 203 and the damper substrate 302 are integrally formed as described in the second embodiment.

[0064] In this embodiment, an example has been described where the damper region 301 is located opposite the separate collection channel 12b but not opposite the separate supply channel 12a. However, this embodiment is not limited to this example. Specifically, the configuration may allow the damper region 301 to be located opposite either the separate collection channel 12b or the separate supply channel 12a.

[0065] Although the invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims should be accorded the broadest interpretation so as to cover all such variations and equivalent structures and functions.

Claims

1. A liquid injection head, comprising: A nozzle from which liquid is ejected; A pressure chamber, which is connected to the injection port; A pressure generating element, which is disposed in the pressure chamber and is capable of ejecting liquid from the injection port by applying pressure; A separate supply channel, which communicates with the pressure chamber and is capable of supplying liquid to the pressure chamber; A separate collection channel, which communicates with the pressure chamber and is capable of collecting liquid from the pressure chamber; A public supply channel, which is connected to the separate supply channel; A public collection channel, which is connected to the individual collection channel; as well as A channel partition is disposed between the common supply channel and the common collection channel, and the channel partition contains a plurality of injection ports and a plurality of pressure chambers. The public supply channel and the public collection channel are respectively connected to the multiple individual supply channels and the multiple individual collection channels. A connecting portion communicating with the public supply channel and the public collection channel is disposed in the region between the first substrate forming the channel partition and the second substrate stacked on the first substrate, and corresponds to the channel partition, and An adhesive layer is disposed between the first substrate and the second substrate, wherein the adhesive layer includes an adhesive region provided with an adhesive material and a non-adhesive region without an adhesive material. The channel partition is positioned at a location corresponding to the non-adhesive area of ​​the adhesive layer.

2. The liquid jet head according to claim 1, wherein the circulating flow flows sequentially through the common supply channel, the separate supply channel, the pressure chamber, the separate collection channel and the common collection channel.

3. The liquid jet head of claim 1, wherein the viscous resistance of the connecting portion is at least 100 times the viscous resistance of the channel from the separate supply channel through the pressure chamber to the separate collection channel.

4. The liquid jet head of claim 1, wherein the viscous resistance of the connecting portion is at least 1000 times the viscous resistance of the channel from the separate supply channel through the pressure chamber to the separate collection channel.

5. The liquid injection head according to claim 1, wherein the height of the connecting portion is 7 μm or less.

6. The liquid injection head according to claim 1, wherein the height of the connecting portion is less than 3 μm.

7. The liquid injection head according to claim 1, wherein the pressure generating element is a piezoelectric element.

8. The liquid injection head according to claim 1, further comprising a damper member at least in one of the common supply channel or the common collection channel, the damper member being capable of absorbing pressure fluctuations occurring in the pressure chamber.

9. The liquid jet head according to claim 1, further comprising a damper component at the common collection channel, the damper component being capable of absorbing pressure fluctuations occurring in the pressure chamber.

10. The liquid injection head according to claim 8, wherein The plurality of injection nozzles are configured to form an array, and The damper components are configured to extend along an array of the injection nozzles.

11. The liquid jet head of claim 1, wherein the separate supply channel, the separate collection channel, the common supply channel, and the common collection channel are formed in the first substrate.

12. A liquid injection device, configured such that a liquid injection head can be mounted thereon, the liquid injection head comprising: A nozzle from which liquid is ejected; A pressure chamber, which is connected to the injection port; A pressure generating element, which is disposed in the pressure chamber and is capable of ejecting liquid from the injection port by applying pressure; A separate supply channel, which communicates with the pressure chamber and is capable of supplying liquid to the pressure chamber; A separate collection channel, which communicates with the pressure chamber and is capable of collecting liquid from the pressure chamber; A public supply channel, which is connected to the separate supply channel; A public collection channel, which is connected to the individual collection channel; as well as A channel partition is disposed between the common supply channel and the common collection channel, and the channel partition contains a plurality of injection ports and a plurality of pressure chambers. The public supply channel and the public collection channel are respectively connected to the multiple individual supply channels and the multiple individual collection channels. A connecting portion communicating with the public supply channel and the public collection channel is disposed in the region between the first substrate forming the channel partition and the second substrate stacked on the first substrate, and corresponds to the channel partition, and An adhesive layer is disposed between the first substrate and the second substrate, wherein the adhesive layer includes an adhesive region provided with an adhesive material and a non-adhesive region without an adhesive material. The channel partition is positioned at a location corresponding to the non-adhesive area of ​​the adhesive layer.

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