Method for manufacturing a chip-type electronic component

By forming spacers on the external electrode surface of chip-type electronic components using a gravure transfer method, the problems of positional misalignment and low productivity in existing technologies are solved, achieving high-precision and high-efficiency spacer manufacturing.

CN116895469BActive Publication Date: 2026-09-15MURATA MFG CO LTD
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Patent Information

Application Number
CN202310239173.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2022-03-30
Filing Date
2023-03-10
Publication Date
2026-09-15
Estimated Expiration
2043-03-10

AI Technical Summary

Technical Problem

Existing technologies make it difficult to precisely offset the spacers in the desired locations when forming chip-type electronic components, and also result in low productivity.

Method used

By employing a gravure transfer method, metal paste is directly supplied to the external electrodes of the electronic component body, which come into contact with the recessed part of the gravure plate. Through multiple transfers, spacers are formed on the surface of the external electrodes, thus avoiding the use of a mask.

Benefits of technology

It enables high-precision formation of spacers on the surface of external electrodes, improving productivity, reducing the risk of positional misalignment and metal paste adhesion to the main body, and allowing adjustment of the height of the spacers.

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Abstract

The present application provides a manufacturing method of a chip-type electronic component capable of forming a spacer at a desired position with high accuracy. The manufacturing method of a chip-type electronic component in which a spacer is provided on the surface of an external electrode of an electronic component main body having a plurality of external electrodes protruding outward from a main body portion includes: a step (S1) of preparing the electronic component main body; a step (S2) of holding the electronic component main body so that the plurality of external electrodes are exposed on the same side of the main body portion; a step (S3) of supplying a metal paste into a plurality of recesses of a recessed plate having the plurality of recesses; and a step (S4) of bringing the held electronic component main body close to the recessed plate so that the plurality of external electrodes exposed on the same side of the main body portion respectively come into contact with the metal paste in the plurality of recesses of the recessed plate, thereby transferring the metal paste to the plurality of external electrodes.
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