An automatic coupling dispensing system and method for FA and silicon optical chip
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANO TECHNOLOGY (BEIJING) CO LTD
- Filing Date
- 2023-08-01
- Publication Date
- 2026-07-21
AI Technical Summary
Existing FA coupling processes suffer from low coupling yield, long operation cycles, and high dependence on coupling personnel, resulting in poor coupling accuracy and consistency.
An automated coupling and dispensing system for FA and silicon photonics chips is adopted, including a coupling module, a dispensing module, an image recognition module, and a control module. The system achieves automatic alignment of the silicon photonics chip and the fiber array through a six-dimensional adjustment unit, and automatically completes the application and curing of adhesive using the dispensing module.
This improved coupling speed and efficiency, reduced the impact of human intervention on coupling accuracy and consistency, and ensured consistent product quality.
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