An automatic coupling dispensing system and method for FA and silicon optical chip

CN116967082BActive Publication Date: 2026-07-21NANO TECHNOLOGY (BEIJING) CO LTD
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Patent Information

Application Number
CN202310956645.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-08-01
Publication Date
2026-07-21
Estimated Expiration
2043-08-01

AI Technical Summary

Technical Problem

Existing FA coupling processes suffer from low coupling yield, long operation cycles, and high dependence on coupling personnel, resulting in poor coupling accuracy and consistency.

Method used

An automated coupling and dispensing system for FA and silicon photonics chips is adopted, including a coupling module, a dispensing module, an image recognition module, and a control module. The system achieves automatic alignment of the silicon photonics chip and the fiber array through a six-dimensional adjustment unit, and automatically completes the application and curing of adhesive using the dispensing module.

Benefits of technology

This improved coupling speed and efficiency, reduced the impact of human intervention on coupling accuracy and consistency, and ensured consistent product quality.

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Abstract

The application discloses a kind of FA and silicon optical chip automatic coupling dispensing systems, including: coupling module, dispensing module, image recognition module and control module;The application also discloses a kind of FA and silicon optical chip automatic coupling dispensing method.Coupling module is adjusted to realize six dimensions between silicon optical chip and optical fiber array Automatic alignment, coupling speed is faster, and through dispensing module, the remaining process steps are automatically completed, improve the coupling efficiency of silicon optical device, reduce the influence of personnel participation on coupling precision and consistency.
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Citation Information

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