Circuit board corner protector manufacturing method and circuit board corner protector stamping and folding mold

Abstract

This invention relates to a method for manufacturing circuit board corner protectors and a stamping and folding mold for circuit board corner protectors. The method for manufacturing circuit board corner protectors includes the following steps: S1, cutting a piece to be formed from a board material; S2, stamping on a first straight area of ​​the piece to be formed; each side wing of the piece to be formed is folded 90 degrees relative to its first straight area to complete the first fold; S3, stamping at the connection between the first and second straight areas of the piece to be formed to form an arc angle or a right angle to complete the second fold; S4, welding the first straight area and side wing, and the second straight area and side wing of the piece to be formed into one piece. This manufacturing method is simple and easy to implement, conducive to mass production, and the resulting circuit board corner protector structure is relatively stable. The circuit board corner protectors manufactured by this invention can be used to assemble into the corner areas of multilayer circuit boards, such as rigid-flex boards, to ensure the stability of the multilayer circuit board structure and reduce the risk of bending and warping of the multilayer circuit board under environmental and temperature changes.

Description

Technical Field

[0001] This invention relates to the field of circuit board protection technology, and in particular to a method for manufacturing circuit board corner protectors and a stamping and folding mold for circuit board corner protectors. Background Technology

[0002] With the development of the intelligent market, high-tech electronic devices are increasingly moving towards being lighter, thinner, shorter, smaller, and more multifunctional. In particular, the widespread application of flexible boards for high-density interconnect structures has greatly driven the rapid development of flexible printed circuit technology. At the same time, with the development and improvement of circuit board technology, the development and research of rigid-flex boards (combining FPC and PCB) have been carried out and applied extensively.

[0003] Rigid-flex PCBs can reduce the assembly size and weight of electronic products, avoid wiring errors, improve circuit load capacity, reduce the signal transmission limit of contacts and assembly error rate, and realize three-dimensional assembly under different assembly conditions. This is an inevitable requirement for the increasing development of intelligent products. Flexible circuits, as an interconnection technology with the characteristics of being thin, light and flexible, which can meet the needs of three-dimensional assembly, are increasingly widely used in high-tech electronic fields such as electronics and communications, instrumentation, automobiles, medical, industrial control, home appliances and CNC machine tools, camera modules, and intelligent battery management modules.

[0004] Conventional rigid-flex PCBs use multiple layers of adhesive to bond the circuit boards together. However, in practical applications, the circuit boards may warp and twist due to environmental and temperature changes. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for manufacturing circuit board corner protectors and a stamping and folding mold for circuit board corner protectors.

[0006] The technical solution adopted by this invention to solve its technical problem is: to provide a method for manufacturing circuit board corner protectors, which includes the following steps:

[0007] S1. Cut the sheet to be formed from the board material; the sheet to be formed is provided with corner protectors for either the arc-shaped circuit board or the right-angle circuit board.

[0008] The sheet to be formed includes a first straight region, a second straight region, and two side wings with arc-shaped edges; the two side wings are respectively connected to opposite sides in the width direction of the first straight region, and the second straight region is connected to one side in the length direction of the first straight region;

[0009] S2. Stamping is performed on the first straight area of ​​the sheet to be formed; each side wing of the sheet to be formed is folded 90 degrees relative to its first straight area to complete the first folding.

[0010] S3. Stamping is performed at the connection between the first straight area and the second straight area of ​​the sheet to be formed. The second straight area of ​​the sheet to be formed is folded relative to its first straight area, forming an arc angle or right angle between the first straight area and the second straight area of ​​the sheet to be formed, thus completing the second folding.

[0011] S4. Weld the first straight area and side wing of the sheet to be formed, and the second straight area and side wing of the sheet to be formed into one piece.

[0012] Preferably, in step S1, a laser cutting machine is used to cut the sheet material to be formed in one pass.

[0013] Preferably, step S2 includes the following sub-steps:

[0014] S2.1 Place the sheet material to be formed on the first stamping die;

[0015] The first stamping die includes a first upper die and a first lower die arranged opposite to each other; the first upper die includes a first forming punch; the first lower die is provided with a first forming groove corresponding to a first straight area of ​​the material to be formed; the bottom wall and side wall of the first forming groove are perpendicular to each other; the first forming punch is matched with the first forming groove;

[0016] S2.2 Place the first straight area of ​​the material to be formed directly above the first forming groove;

[0017] S2.3 Start the first upper mold, the first forming punch moves down, and at the same time presses the first straight area of ​​the material to be formed and its two side wings into the first forming groove to complete the first folding.

[0018] Preferably, the length of the first forming groove is greater than or equal to the sum of the lengths of the first straight region and the second straight region of the material to be formed; in step S2.3, the second straight region is also pressed into the first forming groove.

[0019] Preferably, when the blank to be formed corresponds to the corner protector of the arc-shaped circuit board, step S3 includes the following sub-steps:

[0020] S3.1 Place the sheet material to be formed on the second stamping die;

[0021] The second stamping die includes a second upper die and a second lower die arranged opposite to each other; the second upper die includes a second forming punch; the second lower die is provided with a second forming groove corresponding to a second straight area of ​​the material to be formed; the second forming groove is an arc-shaped groove; the second forming punch is matched with the second forming groove;

[0022] S3.2, A bending area is defined on the second straight area of ​​the sheet to be formed, near the first straight area of ​​the sheet to be formed; the bending area of ​​the sheet to be formed is placed directly above the lowest point in the second forming groove;

[0023] S3.3 Start the second upper mold, the second forming punch moves down, and presses the bending area of ​​the material to be formed into the second forming groove to complete the second folding.

[0024] Preferably, the area on the second straight region of the sheet to be formed, excluding the area to be bent, has the same length as the first straight region.

[0025] Preferably, when the sheet to be formed corresponds to the corner protector of the right-angled circuit board, step S3 includes the following sub-steps:

[0026] S3.1 Place the sheet material to be formed on the second stamping die;

[0027] The second stamping die includes a second upper die and a second lower die arranged opposite to each other; the second upper die includes a second forming punch; the second lower die is provided with a second forming groove corresponding to a second straight area of ​​the material to be formed; the second forming groove is a V-shaped groove; the second forming punch is matched with the second forming groove;

[0028] S3.2 The connection between the first straight area and the second straight area of ​​the material to be formed is located directly above the lowest point in the second forming groove;

[0029] S3.3 Start the second upper mold, the second forming punch moves down, and presses the connection between the first straight area and the second straight area of ​​the material to be formed into the second forming groove to complete the second folding.

[0030] Preferably, the sheet to be formed is stainless steel.

[0031] The present invention also provides a circuit board corner protector stamping and folding die, which is used in the circuit board corner protector manufacturing method described in any of the above, and includes a first stamping die and a second stamping die disposed on one side of the first stamping die;

[0032] The first stamping die includes a first upper die and a first lower die arranged opposite to each other; the first upper die includes a first forming punch; the first lower die is provided with a first forming groove corresponding to a first straight area of ​​the material to be formed; the bottom wall and side wall of the first forming groove are perpendicular to each other; the first forming punch is matched with the first forming groove;

[0033] The second stamping die includes a second upper die and a second lower die arranged opposite to each other; the second upper die includes a second forming punch; the second lower die is provided with a second forming groove corresponding to the second straight area of ​​the material to be formed; the second forming groove is an arc groove or a V-shaped groove; the second forming punch is matched with the second forming groove.

[0034] Preferably, when the second forming groove is a V-shaped groove, the two groove walls of the V-shaped groove are perpendicular to each other; the second forming punch includes two mutually perpendicular stamping surfaces;

[0035] The two stamping surfaces of the second forming punch match the two groove walls of the V-shaped groove, and the area of ​​each stamping surface of the second forming punch is greater than the area of ​​each groove wall of the V-shaped groove.

[0036] The present invention has at least the following beneficial effects: After cutting the material to be formed from the board material, the initial shape of the circuit board corner protector is formed by folding the edges twice, and then the edges are welded together to obtain the complete circuit board corner protector structure. This manufacturing method is simple and easy to implement, which is conducive to mass production. The resulting circuit board corner protector structure is relatively stable. The circuit board corner protector made by the present invention can be used to assemble the corner areas of multilayer circuit boards, such as rigid-flex boards, to ensure the stability of the multilayer circuit board structure and reduce the risk of bending and warping of the multilayer circuit board under environmental and temperature changes. Attached Figure Description

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0038] Figure 1 This is a schematic diagram of the corner protector structure of an arc-shaped circuit board;

[0039] Figure 2 This is a schematic diagram of the right-angled circuit board corner protector.

[0040] Figure 3 This is a schematic diagram of the structure of the sheet material to be formed in the circuit board corner protector manufacturing method of the first embodiment of the present invention;

[0041] Figure 4 This is a schematic diagram of the structure of the sheet material to be formed in the circuit board corner protector manufacturing method of the second embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of step S2 of the circuit board corner protector manufacturing method according to the first embodiment of the present invention;

[0043] Figure 6 yes Figure 5 A schematic diagram of the structure of the sheet to be formed in the A1 direction;

[0044] Figure 7 yes Figure 5A schematic diagram of the structure of the sheet to be formed in the B1 direction;

[0045] Figure 8 This is a schematic diagram of step S3 of the circuit board corner protector manufacturing method according to the first embodiment of the present invention;

[0046] Figure 9 yes Figure 8 A schematic diagram of the structure of the sheet to be formed in the C1 direction;

[0047] Figure 10 This is a schematic diagram of step S2 of the circuit board corner protector manufacturing method according to the second embodiment of the present invention;

[0048] Figure 11 yes Figure 10 A schematic diagram of the structure of the sheet to be formed in the A2 direction;

[0049] Figure 12 yes Figure 10 A schematic diagram of the structure of the sheet to be formed in the B2 direction;

[0050] Figure 13 This is a schematic diagram of step S3 of the circuit board corner protector manufacturing method according to the second embodiment of the present invention;

[0051] Figure 14 yes Figure 13 A schematic diagram of the structure of the sheet to be formed in the C2 direction;

[0052] Figure 15 yes Figure 13 Enlarged schematic diagram of part D. Detailed Implementation

[0053] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0054] like Figure 1 , Figure 2 As shown, commonly used circuit board corner protectors include arc-shaped circuit board corner protectors 51 and right-angle circuit board corner protectors 52. The arc-shaped circuit board corner protectors 51 and right-angle circuit board corner protectors 52 have similar structures, but the difference is that the arc-shaped circuit board corner protector 51 includes four corresponding arc-shaped sides 1; the right-angle circuit board corner protector 52 includes two corresponding arc-shaped sides 1. That is, the arc-shaped circuit board corner protector 51 has two more arc-shaped sides 1 than the right-angle circuit board corner protector 52.

[0055] The circuit board corner protector manufacturing method of the present invention can be used to manufacture arc-shaped circuit board corner protectors 51 or right-angle circuit board corner protectors 52. The main difference between manufacturing arc-shaped circuit board corner protectors 51 and right-angle circuit board corner protectors 52 lies in step S3. The circuit board corner protector manufacturing method of the present invention includes at least steps S1, S2, S3, and S4:

[0056] S1. Cut the sheet to be formed from the board material. The sheet to be formed is set to either the arc-shaped circuit board corner protector 51 or the right-angle circuit board corner protector 52. In this step S1, the shape of the sheet to be formed corresponding to the arc-shaped circuit board corner protector 51 and the shape of the sheet to be formed corresponding to the right-angle circuit board corner protector 52 are not exactly the same. That is, they have common features and also different features.

[0057] like Figures 3 to 4 As shown, the common shape features of the blank to be formed for the arc-shaped circuit board corner protector 51 and the blank to be formed for the right-angle circuit board corner protector 52 are as follows: the blank to be formed includes a first straight region 21, a second straight region 22, and two side wings 23 with arc-shaped edges 1. The two side wings 23 are respectively connected to opposite sides in the width direction of the first straight region 21, and the second straight region 22 is connected to one side in the length direction of the first straight region 21. Specifically, from Figure 3 and Figure 4 Using the indicated orientation as a reference, the first straight region 21 is divided into an upper side and a lower side along its length, and the second straight region 22 is connected to the upper side of the first straight region 21. The two side wings 23 of the sheet to be formed are symmetrically arranged with the first straight region 21 as the center. The sheet to be formed is generally petal-shaped.

[0058] The different shape features of the blank to be formed corresponding to the arc-shaped circuit board corner protector 51 and the blank to be formed corresponding to the right-angle circuit board corner protector 52 are as follows: each side wing 23 of the blank to be formed corresponding to the arc-shaped circuit board corner protector 51 includes two opposing arc-shaped edges 1. Each side wing 23 of the blank to be formed corresponding to the right-angle circuit board corner protector 52 has only one arc-shaped edge 1.

[0059] Figure 3 and Figure 4 The dashed lines in the diagram are merely auxiliary lines for ease of understanding; the actual outline of the sheet to be formed is the outline enclosed by the solid lines in the diagram. The first straight region 21, the second straight region 22, and the two side wings 23 of the sheet to be formed are integrally formed. The first straight region 21, the second straight region 22, and the two side wings 23 are merely concepts defined for ease of description; the sheet to be formed is actually an indivisible whole. For example, in step S1, a laser cutting machine can be used to cut the sheet to be formed in one pass from the sheet metal.

[0060] Figures 5 to 7 The illustration shows step S2 of the circuit board corner protector manufacturing method according to the first embodiment of the present invention. The first embodiment is used to manufacture arc-shaped circuit board corner protectors 51. Figures 10 to 12 The following describes step S2 of a method for manufacturing a circuit board corner protector according to a second embodiment of the present invention. The second embodiment is used to manufacture a right-angled circuit board corner protector 52.

[0061] S2, such as Figures 5 to 7 , Figures 10 to 12 As shown, stamping is performed on the first straight region 21 of the sheet to be formed. Each side wing 23 of the sheet to be formed is folded 90 degrees relative to its first straight region 21, completing the first fold. Specifically, the stamping boundary is the connection between the first straight region 21 of the sheet to be formed and its side wing 23.

[0062] Figures 8 to 9 Step S3 of the first embodiment of the present invention is shown. Figures 13 to 14 Step S3 of the second embodiment of the present invention is shown.

[0063] S3, such as Figures 8 to 9 As shown, in the first embodiment, stamping is performed between the first straight region 21 and the second straight region 22 of the sheet to be formed. The second straight region 22 of the sheet to be formed is folded relative to its first straight region 21, forming an arc angle between the first straight region 21 and the second straight region 22 of the sheet to be formed, thus completing the second folding. As a result, the prototype of the arc-corner circuit board corner protector 51 is formed.

[0064] Or, such as Figures 13 to 14 As shown, in the second embodiment, stamping is performed between the first straight region 21 and the second straight region 22 of the sheet to be formed. The second straight region 22 of the sheet to be formed is folded relative to its first straight region 21, forming a right angle between the first straight region 21 and the second straight region 22, thus completing the second folding. This forms the prototype of the right-angled circuit board corner protector 52.

[0065] It should be noted that "between the first straight area 21 and the second straight area 22 of the sheet to be formed" can be a position on the first straight area 21 near the second straight area 22, or a position on the second straight area 22 near the first straight area 21, or an additional area connecting the two can be defined between the first straight area 21 and the second straight area 22.

[0066] S4. Weld the first straight area 21 and side wing 23 of the sheet to be formed, and the second straight area 22 and side wing 23 of the sheet to be formed into one piece to form a complete circuit board corner protection structure.

[0067] In summary, after cutting the sheet material to be formed from the board, the initial shape of the circuit board corner protector is formed by two folds. Then, the edges are welded together to obtain the complete circuit board corner protector structure. This manufacturing method is simple and easy to implement, conducive to mass production, and the resulting circuit board corner protector structure is relatively stable. The circuit board corner protectors produced by this invention can be used to assemble into the corner areas of multilayer circuit boards, such as rigid-flex boards, ensuring the stability of the multilayer circuit board structure and reducing the risk of bending and warping of the multilayer circuit board under environmental and temperature changes.

[0068] In some embodiments (including but not limited to the first and second embodiments), step S2 includes sub-steps:

[0069] S2.1 The sheet to be formed is placed on a first stamping die. The first stamping die includes a first upper die and a first lower die arranged opposite to each other. The first upper die includes a first forming punch. The first lower die is provided with a first forming groove 41 corresponding to a first straight area 21 of the sheet to be formed. The bottom wall and side wall of the first forming groove 41 are perpendicular to each other. The first forming punch 31 is matched with the first forming groove 41.

[0070] Specifically, the shape and size of the first forming punch 31 are matched with those of the first forming groove 41. The first forming punch 31 can be square, and a bending gap is formed between it and the side wall of the first forming groove 41. The width of the bending gap can be equal to the thickness of the sheet to be formed.

[0071] S2.2 Place the first straight area 21 of the material to be formed directly above the first forming groove 41.

[0072] S2.3 Start the first upper mold, the first forming punch 31 moves down, and at the same time presses the first straight area 21 and the two side wings 23 into the first forming groove 41 until the first straight area 21 is close to the bottom wall of the first forming groove 41 and the two side wings 23 are close to the side wall of the first forming groove 41, thus completing the first folding.

[0073] Furthermore, the length of the first forming groove 41 is greater than or equal to the sum of the lengths of the first straight region 21 and the second straight region 22 of the sheet to be formed. In step S2.3, the second straight region 22 is also pressed into the first forming groove 41. Thus, during the first folding, the second straight region 22 can be pressed into the bottom wall of the first forming groove 41 and receive strong support, improving the stability of the stamping process. Alternatively, in other embodiments, the length of the first forming groove 41 can be equal to the length of the first straight region 21 of the sheet to be formed, as long as the first straight region 21 of the sheet to be formed can be completely pressed into the bottom wall of the first forming groove 41.

[0074] In the first embodiment, the blank to be formed is provided with corner protectors 51 corresponding to the arc-shaped circuit board, such as... Figures 8 to 9 As shown, step S3 includes the following sub-steps:

[0075] S3.1 Place the sheet to be formed on the second stamping die.

[0076] The second stamping die includes a second upper die and a second lower die arranged opposite to each other. The second upper die includes a second forming punch 32. The second lower die has a second forming groove 42 corresponding to the second straight area 22 of the material to be formed. The second forming groove 42 is an arc-shaped groove. The second forming punch 32 is matched with the second forming groove 42. Specifically, the shape and size of the second forming punch 32 match those of the second forming groove 42. The second forming punch 32 can be circular or have an arc-shaped surface.

[0077] S3.2. A bending region 210 is defined on the second straight region 22 of the sheet to be formed, near the first straight region 21 of the sheet to be formed. The bending region 210 of the sheet to be formed is placed directly above the second forming groove 42.

[0078] S3.3 Start the second upper mold, the second forming punch 32 moves down, and presses the bending area 210 of the material to be formed into the second forming groove 42. After the bending area 210 is close to the groove wall of the second forming groove 42, a bending surface is formed, and the second edge folding is completed.

[0079] Furthermore, the area on the second straight region 22 of the sheet to be formed, excluding the bending region 210, has the same length as the first straight region 21. Therefore, when the bending region 210 of the second straight region 22 is pressed into the second forming groove 42, the bending region 210 forms a bent arc surface. The two opposing arc edges 1 on this arc surface correspond to the two arc edges 1 on the arc-shaped circuit board corner protector. Simultaneously, the straight edges connecting the two ends of the arc edge 1 have equal lengths, resulting in a symmetrical arc-shaped circuit board corner protector. In other embodiments, the area on the second straight region 22 of the sheet to be formed, excluding the bending region 210, may have different lengths than the first straight region 21. Therefore, the straight edges connecting the two ends of the arc edge 1 have different lengths, resulting in a non-perfectly symmetrical arc-shaped circuit board corner protector.

[0080] In the second embodiment, the sheet to be formed is provided with corner protectors 52 corresponding to the right-angled circuit board, such as... Figures 13 to 14 As shown, step S3 includes the following sub-steps:

[0081] S3.1 Place the sheet to be formed on the second stamping die.

[0082] The second stamping die includes a second upper die and a second lower die arranged opposite to each other. The second upper die includes a second forming punch 32. The second lower die has a second forming groove 42 corresponding to the second straight area 22 of the material to be formed. The second forming groove 42 is a V-shaped groove. The second forming punch 32 is matched with the second forming groove 42. Specifically, the shape of the second forming punch 32 matches that of the second forming groove 42. The second forming punch 32 includes two surfaces arranged at an included angle, which respectively match the groove wall surface of the V-shaped groove.

[0083] S3.2 The connection between the first straight region 21 and the second straight region 22 of the material to be formed is located directly above the lowest point in the second forming groove 42.

[0084] S3.3 Start the second upper mold, the second forming punch 32 moves down, and presses the connection between the first straight area 21 and the second straight area 22 of the material to be formed into the second forming groove 42. Part of the first straight area 21 and part of the second straight area 22 are in close contact with the groove wall of the second forming groove 42. The first straight area 21 and the second straight area 22 are folded 90 degrees relative to each other to complete the second folding.

[0085] Furthermore, the sheet to be formed can be stainless steel.

[0086] like Figure 5 , Figure 8 , Figure 10 , Figure 13 As shown, the circuit board corner protector stamping and folding mold of the present invention is used in the circuit board corner protector manufacturing method of any embodiment of the present invention, which includes a first stamping mold and a second stamping mold disposed on one side of the first stamping mold.

[0087] The first stamping die includes a first upper die and a first lower die arranged opposite to each other. The first upper die includes a first forming punch 31. The first lower die has a first forming groove 41 corresponding to a first straight area 21 of the material to be formed. The bottom wall and side wall of the first forming groove 41 are perpendicular to each other. The first forming punch 31 is matched with the first forming groove 41.

[0088] The second stamping die includes a second upper die and a second lower die arranged opposite to each other. The second upper die includes a second forming punch 32. The second lower die is provided with a second forming groove 42 corresponding to the second straight area 22 of the material to be formed. The second forming groove 42 is an arc groove or a V-shaped groove. The second forming punch 32 is matched with the second forming groove 42.

[0089] like Figure 13 , Figure 15As shown, in some embodiments, when the second forming groove 42 is a V-shaped groove, the two groove walls of the V-shaped groove are perpendicular; the second forming punch 32 includes two mutually perpendicular stamping surfaces; the two stamping surfaces of the second forming punch 32 match the two groove walls of the V-shaped groove, and the area of ​​each stamping surface of the second forming punch 32 is larger than the area of ​​each groove wall of the V-shaped groove. That is, each stamping surface of the second forming punch 32 includes a connected first portion 321 and a second portion 322. The first portion 321 of each stamping surface of the second forming punch 32 has the same area as each groove wall of the V-shaped groove, and this portion is used to form a tip to press the sheet to be formed completely into the V-shaped groove, so that the connection between the first straight area 21 and the second straight area 22 of the sheet to be formed is close to the lowest point in the V-shaped groove; the second portion 322 of each stamping surface of the second forming punch 32 is used to support the extruded sheet to be formed, and to help the sheet to be formed smoothly form a 90-degree fold.

[0090] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A method for manufacturing corner protectors for circuit boards, characterized in that, Includes the following steps: S1. Cut out the material to be formed from the board material; the material to be formed is set with the arc-shaped circuit board corner protector (51) or the right-angle circuit board corner protector (52); The sheet to be formed includes a first straight region (21), a second straight region (22), and two side wings (23) with arc-shaped edges (1); the two side wings (23) are respectively connected to opposite sides in the width direction of the first straight region (21), and the second straight region (22) is connected to one side in the length direction of the first straight region (21). S2, stamping on the first straight area (21) of the sheet to be formed; each side wing (23) of the sheet to be formed is folded 90 degrees relative to its first straight area (21) to complete the first folding; S3. Stamping is performed at the connection between the first straight area (21) and the second straight area (22) of the sheet to be formed. The second straight area (22) of the sheet to be formed is folded relative to its first straight area (21), forming an arc angle or a right angle between the first straight area (21) and the second straight area (22) of the sheet to be formed, thus completing the second folding. Step S3 includes the following sub-steps: S3.1 Place the sheet material to be formed on the second stamping die; The second stamping die includes a second upper die and a second lower die arranged opposite to each other; the second upper die includes a second forming punch (32); the second lower die is provided with a second forming groove (42) corresponding to the second straight area (22) of the material to be formed; the second forming groove (42) is an arc groove or a V-shaped groove; the second forming punch (32) matches the second forming groove (42); S3.2 When the blank to be formed is set to the arc-shaped circuit board corner protector (51), the bending area (210) is defined on the second straight area (22) of the blank to be formed near the first straight area (21) of the blank to be formed; the bending area (210) of the blank to be formed is placed directly above the lowest point in the second forming groove (42); Alternatively, when the sheet to be formed is set to the right-angled circuit board corner protector (52), the connection between the first straight area (21) and the second straight area (22) of the sheet to be formed is located directly above the lowest point in the second forming groove (42); S3.3 When the blank to be formed corresponds to the arc-shaped circuit board corner protector (51), the second upper mold is started, the second forming punch (32) moves down, and the bending area (210) of the blank to be formed is pressed into the second forming groove (42) to complete the second folding. Alternatively, when the sheet to be formed is set to the right-angled circuit board corner protector (52), the second upper mold is started, the second forming punch (32) moves down, and the connection between the first straight area (21) and the second straight area (22) of the sheet to be formed is pressed into the second forming groove (42) to complete the second folding; Wherein, when the second forming groove (42) is a V-shaped groove, the two groove walls of the V-shaped groove are perpendicular to each other; the second forming punch (32) includes two stamping surfaces that are perpendicular to each other; the two stamping surfaces of the second forming punch (32) match the two groove walls of the V-shaped groove, and the area of ​​each stamping surface of the second forming punch (32) is greater than the area of ​​each groove wall of the V-shaped groove; S4. Weld the first straight area (21) and side wing (23) of the sheet to be formed, and the second straight area (22) and side wing (23) of the sheet to be formed into one piece.

2. The method for manufacturing circuit board corner protectors according to claim 1, characterized in that, In step S1, a laser cutting machine is used to cut the sheet material to be formed into a single piece.

3. The method for manufacturing circuit board corner protectors according to claim 1, characterized in that, Step S2 includes the following sub-steps: S2.1 Place the sheet material to be formed on the first stamping die; The first stamping die includes a first upper die and a first lower die arranged opposite to each other; the first upper die includes a first forming punch (31); the first lower die is provided with a first forming groove (41) corresponding to the first straight area (21) of the material to be formed; the bottom wall and the side wall of the first forming groove (41) are perpendicular to each other; the first forming punch (31) is matched with the first forming groove (41); S2.2 Place the first straight area (21) of the sheet to be formed directly above the first forming groove (41); S2.3 Start the first upper mold, the first forming punch (31) moves down, and at the same time presses the first straight area (21) of the material to be formed and its two side wings (23) into the first forming groove (41) to complete the first folding.

4. The method for manufacturing circuit board corner protectors according to claim 3, characterized in that, The length of the first forming groove (41) is greater than or equal to the sum of the lengths of the first straight region (21) and the second straight region (22) of the sheet to be formed; in step S2.3, the second straight region (22) is also pressed into the first forming groove (41).

5. The method for manufacturing circuit board corner protectors according to claim 1, characterized in that, The area of ​​the second straight region (22) of the sheet to be formed, excluding the bending region (210), has the same length as the first straight region (21).

6. The method for manufacturing circuit board corner protectors according to any one of claims 1 to 5, characterized in that, The sheet to be formed is made of stainless steel.

7. A stamping and folding die for circuit board corner protectors, characterized in that, The method for manufacturing circuit board corner protectors according to any one of claims 1 to 6 includes a first stamping die and a second stamping die disposed on one side of the first stamping die; The first stamping die includes a first upper die and a first lower die arranged opposite to each other; the first upper die includes a first forming punch (31); the first lower die is provided with a first forming groove (41) corresponding to the first straight area (21) of the material to be formed; the bottom wall and the side wall of the first forming groove (41) are perpendicular to each other; the first forming punch (31) is matched with the first forming groove (41); The second stamping die includes a second upper die and a second lower die arranged opposite to each other; the second upper die includes a second forming punch (32); the second lower die is provided with a second forming groove (42) corresponding to the second straight area (22) of the material to be formed; the second forming groove (42) is an arc groove or a V-shaped groove; the second forming punch (32) matches the second forming groove (42).

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