Method for manufacturing anti-glare cover plate, anti-glare cover plate and electronic device

Abstract

The application discloses a preparation method of an anti-glare cover plate, the anti-glare cover plate and an electronic device. The preparation method of the anti-glare cover plate comprises the following steps: forming a photoresist layer provided with a plurality of first through holes on a cover plate glass through a photoetching process; etching the cover plate glass to expose the first through holes through an etching liquid, so as to etch a plurality of grooves corresponding to the positions of the first through holes on the cover plate glass one by one, the etching liquid can make the inner walls of the grooves form free curved surfaces, and the grooves can be interconnected under the etching of the etching liquid; and after the etching of the cover plate glass to expose the first through holes through the etching liquid, the photoresist layer on the cover plate glass is cleaned to obtain the anti-glare cover plate. The application solves the technical problem that the flash point of the existing anti-glare cover plate is relatively serious.

Description

Preparation method of anti-glare cover, anti-glare cover and electronic device Technical Field

[0001] This invention relates to the technical field of sheet metal processing, and in particular to a method for preparing an anti-glare cover, the anti-glare cover, and an electronic device thereof. Background Technology

[0002] Currently, the preparation method for AG anti-glare cover plates generally involves creating several concave and convex microstructures on the glass surface through a frosting process, thereby suppressing glare. The inventors have discovered that existing anti-glare cover plates prepared by the frosting process suffer from significant flash point problems due to the insufficient smoothness of the inner walls of the microstructures, such as the grooves or the outer walls of the protrusions. Summary of the Invention

[0003] In view of this, the present invention provides a method for preparing an anti-glare cover, an anti-glare cover, and an electronic device, to solve the technical problem of the serious flash point of existing anti-glare covers.

[0004] To solve the above-mentioned technical problems, the first technical solution adopted by the present invention is as follows:

[0005] A method for preparing an anti-glare cover plate includes:

[0006] A photoresist layer with several first through holes is formed on the cover glass using a photolithography process.

[0007] The cover glass is exposed by etching with an etchant to expose the first through hole, so that a number of grooves are etched one by one at the position of the first through hole on the cover glass. The etchant can make the inner wall of each groove form a free curved surface, and each groove can be interconnected under the etchant.

[0008] After the cover glass is etched with an etchant to expose the first through hole, the photoresist layer on the cover glass is cleaned to obtain an anti-glare cover.

[0009] In some embodiments of the preparation method, the step of forming a photoresist layer with a plurality of first through holes on the cover glass by photolithography includes:

[0010] Preset patterns are provided;

[0011] A photomask is fabricated based on the positive and negative properties of the photoresist layer and the preset pattern;

[0012] When the photoresist layer is positive, the step of fabricating a photomask based on the positive or negative polarity of the photoresist layer and the preset pattern includes:

[0013] A light-transmitting substrate is provided, the substrate including a first processed surface;

[0014] A light-shielding film is formed on the first processed surface;

[0015] According to the preset pattern, a plurality of second through holes are made along the thickness direction of the light-shielding film to penetrate the light-shielding film, so that each of the first through holes can be obtained one by one when the photoresist layer is processed by exposure and development.

[0016] In some embodiments of the preparation method, the step of forming a photoresist layer with a plurality of first through holes on the cover glass by photolithography includes:

[0017] Preset patterns are provided;

[0018] A photomask is fabricated based on the positive and negative properties of the photoresist layer and the preset pattern;

[0019] When the photoresist layer is negative, the step of fabricating a photomask based on the positive or negative sign of the photoresist layer and the preset pattern includes:

[0020] A light-transmitting substrate is provided, the substrate including a first processed surface;

[0021] According to the preset pattern, a plurality of light-shielding elements are formed on the first processing surface so that each of the first through holes can be obtained one by one when the photoresist layer is processed by exposure and development.

[0022] In some embodiments of the preparation method, the maximum size of the opening of each first through hole is 1um-5um, and the interval between two adjacent first through holes is 5um-50um.

[0023] In some embodiments of the preparation method, each of the first through holes is a circular hole, the diameter of each of the first through holes is 1um-5um, and the center distance between two adjacent first through holes is 5um-50um.

[0024] In some embodiments of the preparation method, the maximum size of the groove opening is 5µm-50µm.

[0025] In some embodiments of the preparation method, the depth of each groove is 0.5µm-2µm.

[0026] In some embodiments of the preparation method, the etching solution is a weak acid solution.

[0027] To solve the above-mentioned technical problems, the second technical solution adopted by the present invention is as follows:

[0028] An anti-glare cover is prepared using the preparation method described in the above embodiments.

[0029] To solve the above-mentioned technical problems, the third technical solution adopted by the present invention is as follows:

[0030] An electronic device includes a main body and an anti-glare cover as described in the above embodiment, the anti-glare cover being disposed on the main body.

[0031] Implementing the embodiments of the present invention will have at least the following beneficial effects:

[0032] The above-mentioned method for preparing an anti-glare cover plate combines photolithography to form a photoresist layer with several first through holes on the cover glass, and then uses an etching solution to etch the cover glass through the first through holes, thereby obtaining grooves. Since the grooves are formed by etching, the inner walls of the grooves are smooth free-form surfaces. At the same time, under the flow of the etching solution, it can enter the gap between the photoresist layer and the second processing surface, thereby enabling the grooves to communicate with each other and reducing the plateau surface between the grooves. Compared with the prior art, the anti-glare cover plate prepared by the method of this invention has a lower flash point, solving the technical problem of the serious flash point of existing anti-glare cover plates.

[0033] The anti-glare cover plate prepared by the above-described method, and the electronic device using the above-described anti-glare cover plate, have the technical effect of reducing the flash point, thus solving the technical problem of the serious flash point of existing anti-glare cover plates. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 is a partial top view of a photomask in one embodiment where the photoresist layer is positive;

[0036] Figure 2 is a schematic diagram of a partial cross-sectional structure of a photomask in one embodiment where the photoresist layer is positive;

[0037] Figure 3 is a schematic diagram of the cover glass and photoresist layer after exposure and development in one embodiment;

[0038] Figure 4 is a schematic diagram of the cross-sectional changes of the cover glass and photoresist layer during the etching process of the etchant in one embodiment.

[0039] Figure 5 is a top view of the changes in the cover glass during the corrosion process of the corrosive liquid in one embodiment;

[0040] Figure 6 is a cross-sectional line drawing of the groove in one embodiment;

[0041] Figure 7 is a flowchart of a method for preparing an anti-glare cover plate according to an embodiment.

[0042] The components are: 1. Photomask; 11. Substrate; 12. Light-shielding film; 13. Second through hole; 2. Cover glass; 3. Photoresist layer; 4. First through hole; 5. Groove. Detailed Implementation

[0043] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0044] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0046] Existing anti-glare covers made by frosting process have a serious flash point problem because the inner wall of the microstructures such as grooves or the outer wall of protrusions is not smooth enough.

[0047] As shown in Figures 1-7, in one embodiment of a method for preparing an anti-glare cover, the method includes:

[0048] A cover glass 2 is provided, the cover glass 2 including a second processed surface;

[0049] A photoresist layer 3 is formed on the second processing surface;

[0050] A preset pattern is provided, which is used to delineate the portion of the photoresist layer 3 that needs to be retained.

[0051] The photomask 1 is fabricated based on the positive and negative properties of the photoresist layer 3 and the preset pattern;

[0052] A photomask 1 is placed on the side of the photoresist layer 3 away from the cover glass 2 to form the component to be processed;

[0053] The component to be processed is processed by exposure and development to form a plurality of first through holes 4 penetrating the photoresist layer 3 on the photoresist layer 3;

[0054] Remove the photomask 1 from the cover glass 2;

[0055] A photoresist layer 3 with several first through holes 4 is formed on the cover glass 2 by photolithography.

[0056] The cover glass 2 with the first through hole 4 is exposed by etching with an etchant, so that a number of grooves 5 are etched one by one at the position of the first through hole 4 on the cover glass 2. The inner wall of each groove 5 can form a free curved surface by etching with an etchant, and each groove 5 can be connected to each other under the etching of the etchant.

[0057] After etching the cover glass 2 to expose the first through hole 4 with an etchant, the photoresist layer on the cover glass 2 is cleaned to obtain an anti-glare cover.

[0058] The anti-glare cover preparation method of this embodiment combines photolithography to form a photoresist layer 3 with several first through holes 4 on the cover glass. Then, the cover glass 2 with the first through holes 4 is exposed by etching solution, thereby obtaining a series of grooves 5. Since the grooves 5 are formed by etching solution, the inner wall of the grooves 5 is a smooth free-form surface. At the same time, under the flow of etching solution, it can enter the gap between the photoresist layer 3 and the second processing surface, thereby enabling the grooves 5 to be interconnected and reducing the plateau surface between the grooves 5. Compared with the prior art, the anti-glare cover prepared by the preparation method of this invention has a lower flash point, solving the technical problem of the serious flash point of the existing anti-glare cover.

[0059] In one embodiment of a method for preparing an anti-glare cover plate, the formation of a photoresist layer 3 with a plurality of first through holes 4 on the cover glass 2 by photolithography specifically includes the following steps:

[0060] A cover glass 2 is provided, the cover glass 2 including a second processed surface;

[0061] A photoresist layer 3 is formed on the second processing surface;

[0062] A preset pattern is provided, which is used to delineate the portion of the photoresist layer 3 that needs to be retained.

[0063] The photomask 1 is fabricated based on the positive and negative properties of the photoresist layer 3 and the preset pattern;

[0064] A photomask 1 is placed on the side of the photoresist layer 3 away from the cover glass 2 to form the component to be processed;

[0065] The component to be processed is processed by exposure and development to form a plurality of first through holes 4 penetrating the photoresist layer 3 on the photoresist layer 3;

[0066] Remove the photomask 1 from the cover glass 2.

[0067] In this embodiment, the specific formation process of the first through hole 4 is given. By providing and designing a preset pattern, the part that needs to be retained and the part that needs to be removed in the photoresist layer 3 can be defined. The above method combines photolithography process and photoresist layer 3 processing method, which can facilitate the design and processing of the first through hole 4. It has high consistency and is easy to mass-produce. Then, under the corrosion of the etching liquid, an uneven anti-glare structure can be formed on the cover glass 2.

[0068] Preferably, the photoresist layer 3 can be removed by using an alkaline solution such as KOH.

[0069] In an embodiment of a method for preparing an anti-glare cover plate, as shown in Figures 1-2, when the photoresist layer 3 is positive, a photomask 1 is fabricated according to the positive or negative polarity of the photoresist layer 3 and a preset pattern, including:

[0070] A light-transmitting substrate 11 is provided, the substrate 11 including a first processed surface;

[0071] A light-shielding film 12 is formed on the first processing surface;

[0072] According to the preset pattern, a number of second through holes 13 are made along the thickness direction of the light-shielding film 12 to penetrate the light-shielding film 12, so that each first through hole 4 can be obtained one by one when the component to be processed is processed by exposure and development.

[0073] In one embodiment of a method for preparing an anti-glare cover, when the photoresist layer 3 is negative, a photomask 1 is fabricated according to the positive or negative polarity of the photoresist layer 3 and a preset pattern, including:

[0074] A light-transmitting substrate 11 is provided, the substrate 11 including a first processed surface;

[0075] According to a preset pattern, a number of light-shielding elements are formed on the first processing surface so that each first through hole 4 can be obtained one by one when the component to be processed is processed by exposure and development.

[0076] In the two embodiments described above, it is understood that the positive and negative properties of the photoresist layer 3 are different after exposure and development. The unexposed portion that remains is the positive photoresist layer 3, while the unexposed portion that is dissolved is the negative photoresist layer 3. The two embodiments described above provide the processing steps when the photoresist layer 3 is positive and negative. It should be noted that the photomask 1 is made according to the positive and negative properties of the photoresist layer 3 and a preset pattern. The preset pattern can be the same pattern, such as pattern one and pattern two. For example, pattern one corresponds to the hole of the first through hole 4, and pattern two corresponds to the shape of the rest of the photoresist layer 3 that is complementary to the first through hole 4. Therefore, no matter how it is designed, the purpose is to remove the photoresist at the position of the first through hole 4. The positive and negative properties of the photoresist layer 3 affect whether the light-shielding film 12 retains the pattern shape corresponding to pattern one or pattern two.

[0077] Preferably, both the light-shielding film 12 and the light-shielding element are chromium films.

[0078] In one embodiment of the method for preparing an anti-glare cover, as shown in Figures 3-4, the maximum size of the opening of each first through hole 4 is 1um-5um, and the interval between two adjacent first through holes 4 is 5um-50um.

[0079] In this embodiment, the maximum size of each first through hole 4 and the interval between two adjacent first through holes 4 are defined. Correspondingly, it can be understood that the first through hole 4 of the present invention is mainly formed by a preset pattern and a photomask 1. Therefore, the shape of the preset pattern is the same as the above parameters. The shape of the first through hole 4 can be any shape, such as a polygonal hole, an irregular hole, or any type of hole that can be designed. Similarly, the photomask 1 is also corresponding. Taking the photoresist layer 3 as an example, the maximum size of the opening of each second through hole 13 is 1um-5um, and the interval between two adjacent second through holes 13 is 5um-50um.

[0080] It is also understandable that the second through hole 13 and the first through hole 4 on the photomask 1 are randomly arranged with the above-mentioned size and spacing restrictions. However, due to the size and spacing restrictions, they are not disordered on a macroscopic scale. Therefore, the clarity of the prepared anti-glare cover can be improved, rainbow patterns can be suppressed, and the display effect can be enhanced.

[0081] In one embodiment of the method for preparing an anti-glare cover, as shown in Figures 1-3, each first through hole 4 is a circular hole with a diameter of 1µm-5µm and a center-to-center distance of 5µm-50µm between two adjacent first through holes 4.

[0082] In this embodiment, the round hole is easy to process and easy to design a preset pattern. When the first through hole 4 is a round hole, the groove 5 formed under the corrosion of the corrosive liquid is roughly circular, which is more conducive to forming a regular spherical groove and also conducive to forming a smooth free surface.

[0083] In one embodiment of the method for preparing an anti-glare cover, as shown in Figures 4-6, the maximum size of the opening of each groove 5 is 5µm-50µm. The depth of each groove 5 is 0.5µm-2µm.

[0084] In this embodiment, the relevant dimensions of the groove 5 can be achieved by controlling the etching time and etching rate of the etchant. It can be seen that the maximum size of the groove opening of the groove 5 is larger than the diameter of the first through hole 4. Therefore, during the etching process, the groove opening of the groove 5 is larger than that of the first through hole 4. The center distance between two adjacent first through holes 4 is 5um-50um, which allows two adjacent grooves 5 to communicate with each other and allows the etchant to enter the gap between the photoresist layer 3 and the second processing surface, reducing the area of ​​the platform. The connection between the two grooves 5 is also formed by the etching of the etchant and has a certain curvature, which has the effect of reducing the flash point.

[0085] As can be understood, as shown in Figure 6, where d is the size of the groove opening and h is the groove depth, the groove 5 is cut along the line connecting the centers of the two first through holes 4. The line formed by connecting the cross-sections of the inner walls of the two grooves 5 is a wavy line shape, and of course, multiple grooves are also wavy line shapes.

[0086] In one embodiment of the method for preparing an anti-glare cover, the etching solution is a weak acid solution. Preferably, the etching solution is hydrofluoric acid, which is highly corrosive.

[0087] The present invention also relates to an anti-glare cover plate, which is prepared by the preparation method in the above embodiments.

[0088] The present invention also relates to an electronic device, including a main body and the aforementioned anti-glare cover, wherein the anti-glare cover is disposed on the main body.

[0089] The anti-glare cover plate prepared by the above-described method, and the electronic device using the above-described anti-glare cover plate, have the technical effect of reducing the flash point, thus solving the technical problem of the serious flash point of existing anti-glare cover plates.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A method for preparing an anti-glare cover, characterized in that, include: A photoresist layer with several first through holes is formed on the processing surface of the cover glass using a photolithography process. The cover glass with the first through holes is then etched with an etchant to expose the cover glass, thereby etching several grooves at the positions corresponding to the first through holes. The etchant can penetrate into the gap between the photoresist layer and the processing surface, making the inner wall of each groove a smooth free-form surface and connecting adjacent grooves to reduce the plateau surface between the grooves. After the cover glass with the first through holes is exposed by etching with the etchant, the photoresist layer on the cover glass is cleaned to obtain an anti-glare cover.

2. The preparation method according to claim 1, characterized in that, The process of forming a photoresist layer with a plurality of first through holes on a cover glass using photolithography includes: providing a preset pattern; fabricating a photomask according to the positive and negative properties of the photoresist layer and the preset pattern; when the photoresist layer is positive, the fabrication of the photomask according to the positive and negative properties of the photoresist layer and the preset pattern includes: providing a light-transmitting substrate, the substrate including a first processing surface; forming a light-shielding film on the first processing surface; and forming a plurality of second through holes penetrating the light-shielding film along the film thickness direction according to the preset pattern, so that each of the first through holes can be obtained one-to-one when the photoresist layer is processed by exposure and development.

3. The preparation method according to claim 1, characterized in that, The process of forming a photoresist layer with a plurality of first through holes on a cover glass using photolithography includes: providing a preset pattern; fabricating a photomask according to the positive and negative properties of the photoresist layer and the preset pattern; when the photoresist layer is negative, the fabrication of the photomask according to the positive and negative properties of the photoresist layer and the preset pattern includes: providing a light-transmitting substrate, the substrate including a first processing surface; forming a plurality of light-shielding elements on the first processing surface according to the preset pattern, so that each of the first through holes can be obtained one-to-one when the photoresist layer is processed by exposure and development.

4. The preparation method according to any one of claims 1-3, characterized in that, The maximum size of the opening of each of the first through holes is 1um-5um, and the interval between two adjacent first through holes is 5um-50um.

5. The preparation method according to claim 4, characterized in that, Each of the first through holes is a circular hole with a diameter of 1µm-5µm and a center-to-center distance of 5µm-50µm between two adjacent first through holes.

6. The preparation method according to any one of claims 1-3, characterized in that, The maximum size of the groove opening of each of the grooves is 5um-50um.

7. The preparation method according to claim 1, characterized in that, The groove depth of each groove is 0.5um-2um.

8. The preparation method according to claim 1, characterized in that, The corrosive solution is a weak acid solution.

9. An anti-glare cover, characterized in that, It is prepared by the preparation method described in any one of claims 1-8.

10. An electronic device, characterized in that, It includes a main body and the anti-glare cover plate as described in claim 9, wherein the anti-glare cover plate is disposed on the main body.

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