Laser irradiation device, laser irradiation method, and method for manufacturing organic el display

Abstract

The laser irradiation apparatus (1) of the present embodiment includes a light source (21) that generates laser light (L1), a holding unit (35) that holds a workpiece (100) that is laser-irradiated, a holding unit (45) that holds a workpiece (200) that is laser-irradiated, an X-axis mechanism (31) that transports the holding unit (35) in a horizontal direction, an X-axis mechanism (41) that transports the holding unit (45) in a horizontal direction, a Y-axis mechanism (32) that raises and lowers the workpiece (100), and a Y-axis mechanism (42) that raises and lowers the workpiece (200).

Description

Technical Field

[0001] This invention relates to a laser irradiation device, a laser irradiation method, and a method for manufacturing an organic EL display. Background Technology

[0002] Patent Document 1 discloses a laser stripping apparatus. In this apparatus, a linear laser beam is irradiated onto a substrate. Furthermore, the laser beam is irradiated onto the substrate during its transport. This allows the substrate to be separated from the release layer.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2018 / 25495 Summary of the Invention

[0006] In such laser irradiation devices, it is desirable to perform the process efficiently and stably. For example, when using a pulsed laser as the laser, it is preferable to drive the pulsed laser source stably at a certain repetition frequency. However, once the pulsed laser source is turned off, the repetition frequency and output power may become unstable. Therefore, it is preferable to continuously irradiate without stopping the operation of the pulsed laser source. However, if the pulsed laser is continuously output, ineffective emission of the pulsed laser will occur. For example, during the period from the end of irradiation of one workpiece to the start of irradiation of the next workpiece, the pulsed laser is wasted.

[0007] Other topics and new features can be found in the description and figures in this specification.

[0008] According to one embodiment, the laser irradiation device includes: a laser oscillator that generates laser light; a first holding unit and a second holding unit that respectively hold a first workpiece and a second workpiece irradiated by the laser; a first conveying mechanism and a second conveying mechanism that respectively convey the first holding unit and the second holding unit in a horizontal direction; and a first lifting mechanism and a second lifting mechanism that cause the first holding unit and the second holding unit to move up and down in a vertical direction orthogonal to the horizontal direction.

[0009] According to one embodiment, the laser irradiation method includes the following steps: (a) irradiating the first workpiece with a first workpiece held in a first holding unit by moving the first workpiece in a horizontal direction; (b) moving the first workpiece in a horizontal direction after lowering the first workpiece irradiated with the laser; (c) irradiating the second workpiece with a second workpiece held in a second holding unit by moving the second workpiece in a horizontal direction; and (d) moving the second workpiece in a horizontal direction after lowering the second workpiece irradiated with the laser.

[0010] According to one embodiment, a method for manufacturing an organic EL display includes the following steps: (A) a step of forming a release layer on a substrate; (B) a step of forming an element on the release layer; (C) a step of separating the substrate from the release layer; and (D) a step of laminating a film on the release layer. The step of separating the substrate from the release layer is a step of irradiating a workpiece from above during the transport of a workpiece containing the substrate and the release layer, and includes the following steps: (Ca) irradiating a first workpiece with a first workpiece held in a first holding unit by transporting the first workpiece horizontally; (Cb) transporting the first workpiece horizontally after it has been irradiated with the laser, after it has been lowered; (Cc) irradiating a second workpiece with a second workpiece held in a second holding unit by transporting the second workpiece horizontally; and (Cd) transporting the second workpiece horizontally after it has been irradiated with the laser.

[0011] According to one embodiment, the laser irradiation apparatus includes: a tray having a frame and a central stack disposed inside the frame for placing a processing substrate; a holding unit having a groove corresponding to the central stack, the holding unit being inserted into an opening between the frame and the central stack, and adsorbing the processing substrate when the tray is away from the processing substrate; a transport mechanism for transporting the holding unit; and an irradiation optical system for irradiating the processing substrate being transported by the transport mechanism with laser light.

[0012] According to one of the aforementioned embodiments, a stable process can be carried out efficiently. Attached Figure Description

[0013] Figure 1 This is a side view schematically illustrating an embodiment of a laser irradiation apparatus.

[0014] Figure 2 This is a top view schematically illustrating an embodiment of a laser irradiation apparatus.

[0015] Figure 3 This is a YZ cross-sectional view schematically illustrating an embodiment of a laser irradiation apparatus.

[0016] Figure 4 It is a schematic three-dimensional diagram showing the structure of a laser irradiation device.

[0017] Figure 5 It is a three-dimensional diagram used to illustrate the operation of a laser irradiation device.

[0018] Figure 6It is a three-dimensional diagram used to illustrate the operation of a laser irradiation device.

[0019] Figure 7 It is a three-dimensional diagram used to illustrate the operation of a laser irradiation device.

[0020] Figure 8 It is a three-dimensional diagram used to illustrate the operation of a laser irradiation device.

[0021] Figure 9 It is a three-dimensional diagram used to illustrate the operation of a laser irradiation device.

[0022] Figure 10 It is a three-dimensional diagram used to illustrate the operation of a laser irradiation device.

[0023] Figure 11 It is a timing diagram showing the operation of the laser irradiation device.

[0024] Figure 12 It is an exploded view showing the composition of the workpiece.

[0025] Figure 13 It is a cross-sectional view showing the structure of the workpiece.

[0026] Figure 14 It is a cross-sectional view showing the state in which a workpiece is adsorbed in the holding unit.

[0027] Figure 15 This is a schematic cross-sectional view of an organic EL display device manufactured using the manufacturing process of laser irradiation device 1.

[0028] Figure 16 This is a process cross-sectional view illustrating the manufacturing process of the laser irradiation device 1. Detailed Implementation

[0029] The laser irradiation apparatus of this embodiment is a laser lift-off apparatus, such as a laser lift-off (LLO) apparatus. The laser irradiation apparatus performs a laser lift-off process on a workpiece having a release layer by irradiating it with a laser. In other words, the processing substrate and the release layer can be separated by laser irradiation. The laser irradiation apparatus, method, and manufacturing method of this embodiment will be described below with reference to the accompanying drawings.

[0030] Implementation method 1.

[0031] use Figures 1-3 The configuration of the laser irradiation device in this embodiment will be explained. Figure 1 This is a side view schematically showing the configuration of the laser irradiation device 1. Figure 2 This is a top view schematically showing the configuration of the laser irradiation device 1. Figure 3 This is a schematic YZ cross-sectional view showing the configuration of the laser irradiation device 1.

[0032] It should be noted that, for the sake of simplicity, the following figures appropriately show a three-dimensional orthogonal XYZ coordinate system. The Y direction is the vertical direction, and the X direction is the transport direction of workpieces 100 and 200. The Z direction is along the linear irradiation area 15. That is, the Z direction is the length direction of the linear irradiation area 15, and the X direction is the width direction orthogonal to the length direction. The laser irradiation device 1 transports workpiece 100 in the X direction while irradiating workpiece 100 with laser L2. Thus, laser L2 can be irradiated onto approximately the entire workpiece 100.

[0033] like Figure 1 As shown, the laser irradiation device 1 includes a chamber 10, a light source 21, and an irradiation optical system 20. (As indicated...) Figure 2 , Figure 3 As shown, the laser irradiation device 1 has two drive mechanisms 30 and 40 within the chamber 10. Drive mechanism 30 drives workpiece 100, and drive mechanism 40 drives workpiece 200. Drive mechanism 30 moves workpiece 100 in the X and Y directions. Drive mechanism 40 moves workpiece 200 in the X and Y directions. It should be noted that drive mechanisms 30 and 40 are fixed to, for example, a support frame (in... Figures 1-3 (Not shown in the image) Above.

[0034] Holding unit 35 holds workpiece 100. Drive mechanism 30 movably supports holding unit 35. Workpiece 100 moves by moving holding unit 35 via drive mechanism 30. Holding unit 45 holds workpiece 200. Drive mechanism 40 movably supports holding unit 45. Workpiece 200 moves by moving holding unit 45 via drive mechanism 40. When viewed from above, workpieces 100 and 200 are larger than holding units 35 and 45. That is, workpiece 100 extends from holding unit 35 in both the X and Z directions. Workpiece 200 extends from holding unit 45 in both the X and Z directions.

[0035] Light source 21 is a laser oscillator that generates laser L1. Light source 21 is a pulsed laser source. As light source 21, an excimer laser with a wavelength of 308 nm or a solid-state laser with a wavelength of 343 nm can be used. Light source 21 generates laser L1 at a certain repetition frequency.

[0036] A laser L1 from light source 21 enters the irradiation optical system 20. The irradiation optical system 20 has an optical system that guides the laser L1 toward the workpiece 100. A laser L2 emitted from the irradiation optical system 20 irradiates the workpiece 100. For example, the irradiation optical system 20 has a cylindrical lens (not shown) for forming a linear irradiation area 15. The workpiece is irradiated by a linear laser L2 (line beam), specifically, a laser beam whose focal point extends in the Z direction.

[0037] Furthermore, an optical shutter 22 is provided in the irradiation optical system 20. The optical shutter 22 is detachably disposed in the optical path of the laser L1. That is, during the period when the laser L2 is irradiating the workpiece 100 or the workpiece 200, the optical shutter 22 is removed from the optical path. On the other hand, during the period when the laser L2 is not irradiating the workpiece 100 or the workpiece 200, the optical shutter 22 is inserted in the optical path.

[0038] An irradiation optical system 20 is disposed on the +Y side of the chamber 10. A transparent window 6 is provided on the upper wall of the chamber 10. Laser L2 is introduced into the chamber 10 through the window 6. Laser L2 is then used to irradiate the workpiece 100 located at the irradiation height H1. The internal space of the chamber 10 may also be filled with an inactive gas such as nitrogen.

[0039] like Figure 1 As shown, a valve 5 is installed on the side wall of the chamber 10 on the -X side. By opening the valve 5, the internal space of the chamber 10 is connected to the external space, enabling the transfer of workpieces 100 and 200. The end of the chamber 10 on the -X side becomes the loading and unloading position for workpieces 100 and 200.

[0040] For example, a transfer robotic arm 4 is disposed outside the chamber 10. With the gate valve 5 open, the transfer robotic arm 4 transfers workpieces 100 and 200 into the chamber 10. With the gate valve 5 open, the transfer robotic arm 4 removes workpieces 100 and 200 from the laser irradiation device 1 within the chamber 10. The transfer robotic arm 4 moves the workpieces 100 and 200 before processing into the chamber 10. Furthermore, the transfer robotic arm 4 moves the workpieces 100 and 200 after laser irradiation out of the chamber 10. Once the loading and unloading are complete, the gate valve 5 closes.

[0041] Specifically, the transfer robotic arm 4 places workpieces 100 and 200 on holding units 35 and 45. Then, the laser irradiation device 1 irradiates workpieces 100 and 200 with laser L2. Once the irradiation process is complete, the transfer robotic arm 4 removes workpieces 100 and 200 from the holding units 35 and 45 and transfers them to the external space of the chamber 10. It should be noted that the holding units 35 and 45 serve as a worktable for adsorbing and holding workpieces 100 and 200.

[0042] In the Z-direction, the spacing between the hands of the transfer robot arm 4 is wider than the width of the holding units 35 and 45. Therefore, the transfer robot arm 4 contacts both ends of the workpieces 100 and 200 in the Z-direction. As a result, the transfer robot arm 4 can move the workpieces 100 and 200 in and out without interfering with the holding units 35 and 45.

[0043] Furthermore, an electrostatic eliminator 8 is provided around the removal position within the chamber 10. For example, workpieces 100 and 200 are removed to the external space of the chamber 10 by passing under the electrostatic eliminator 8. The electrostatic eliminator 8 is an electrostatic removal device that irradiates workpieces 100 and 200 with X-rays or the like from above. The electrostatic eliminator 8 removes static electricity from workpieces 100 and 200 that have been desorbed from the holding units 35 and 45. This prevents the workpieces from becoming charged after peeling. It should be noted that the electrostatic eliminator 8 is not limited to electrostatic eliminators using X-rays, but can also be an electrostatic eliminator (ionizer) based on corona discharge, etc.

[0044] In the Y direction, workpiece 100 and workpiece 200 are in different positions. That is, workpiece 100 is transported at a higher position than workpiece 200. Figure 1 , Figure 3 In the process, workpiece 100 is located at irradiation height H1, and workpiece 200 is located at transport height H2. Workpiece 100, after being moved into chamber 10, is transported at irradiation height H1. At irradiation height H1, workpiece 100 is transported in the +X direction, thereby being irradiated by laser L2. Workpiece 200, after being irradiated by laser L2, descends to transport height H2. At transport height H2, workpiece 200 is transported in the -X direction. Thus, the processed workpiece 200 moves to the exit position near valve 5.

[0045] In the Z direction, workpiece 100 and workpiece 200 are positioned identically. Furthermore, workpiece 100 is positioned above workpiece 200. That is, workpieces 100 and 200 are driven so that the processed workpiece 200 passes beneath the unprocessed workpiece 100. Specifically, during the irradiation of workpiece 100 with laser L2, workpiece 200 passes beneath workpiece 100. This prevents the processed workpiece 200 from being irradiated with laser L2 during transport in the -X direction.

[0046] The laser irradiation device 1 can simultaneously accommodate two workpieces 100 and 200. Furthermore, the laser irradiation device 1 continuously performs laser irradiation on both workpieces 100 and 200. During the processing of one workpiece, it is moved out to allow the new workpiece to be moved in. This shortens the waiting time for moving in and out, thus reducing the production cycle time. In addition, since workpieces 100 and 200 can be continuously irradiated with laser, ineffective laser pulses are reduced. Therefore, pulsed laser irradiation can be performed efficiently. During the irradiation process, workpiece 100 is moved at an irradiation height H1. A stable process can be performed efficiently.

[0047] The following describes the drive mechanisms 30 and 40 used to drive workpieces 100 and 200. Drive mechanism 30 movably supports holding unit 35. Drive mechanism 30 supports holding unit 35 on the -Z side. Drive mechanism 40 movably supports holding unit 45. Drive mechanism 40 supports holding unit 45 on the +Z side.

[0048] The drive mechanism 30 includes an X-axis mechanism 31, a Y-axis mechanism 32, and a guide 33. The guide 33 is positioned on the -Z side relative to the workpieces 100 and 200. The guide 33 is positioned along the X-direction. The X-axis mechanism 31 is mounted to be movable relative to the guide 33. The X-axis mechanism 31 moves linearly along the guide 33 in the X-direction. The X-axis mechanism 31 serves as a transport mechanism for moving the workpiece 100 and the holding unit 35 in the X-direction. The Y-axis mechanism 32 is mounted to be able to move up and down relative to the X-axis mechanism 31. The holding unit 35 is fixed to the Y-axis mechanism 32. The Y-axis mechanism 32 serves as a lifting mechanism for raising and lowering the workpiece 100 and the holding unit 35. The X-axis mechanism 31 and the Y-axis mechanism 32 each include a motor and a drive mechanism.

[0049] The drive mechanism 40 includes an X-axis mechanism 41, a Y-axis mechanism 42, and a guide 43. The guide 43 is positioned on the +Z side relative to the workpieces 100 and 200. The guide 43 is positioned along the X-direction. The X-axis mechanism 41 is mounted to be movable relative to the guide 43. The X-axis mechanism 41 moves linearly along the guide 43 in the X-direction. The X-axis mechanism 41 serves as a transport mechanism for moving the workpiece 200 and the holding unit 45 in the X-direction. The Y-axis mechanism 42 is mounted to be able to move up and down relative to the X-axis mechanism 41. The holding unit 45 is fixed to the Y-axis mechanism 42. The Y-axis mechanism 42 serves as a lifting mechanism for raising and lowering the workpiece 200 and the holding unit 45. The X-axis mechanism 41 and the Y-axis mechanism 42 each include a motor and a drive mechanism.

[0050] In the Z direction, workpieces 100 and 200 are located at the same position. Holding units 35 and 45 hold workpieces 100 and 200 at the same Z position. When viewed from above, workpieces 100 and 200 overlap during transport. Laser L2 irradiates workpieces 100 and 200 at the same irradiation position.

[0051] Furthermore, the drive mechanism 30 is disposed on the -Z side of workpieces 100 and 200, and the drive mechanism 40 is disposed on the +Z side of workpiece 200. That is, the drive mechanism 30 supports the holding unit 35 on the -Z side relative to workpiece 100, and the drive mechanism 40 supports the holding unit 45 on the +Z side relative to workpiece 200. Workpieces 100 and 200 are disposed between the drive mechanism 30 and the drive mechanism 40 in the Z direction. More specifically, the guide 33 is disposed on the -Z side relative to the transport position of workpieces 100 and 200, and the guide 43 is disposed on the +Z side relative to the transport position of workpieces 100 and 200.

[0052] In this embodiment, the laser irradiation device 1 has a three-dimensional structure capable of transporting workpieces 100 and 200 at different heights. This reduces the area occupied by the laser irradiation device 1. Specifically, in the Z-direction, a drive mechanism 30 is arranged at one end of the workpieces 100 and 200, and a drive mechanism 40 is arranged at the other end. This reduces the dimensions in the Z-direction, thereby reducing the occupied area.

[0053] The following uses Figures 4 to 10 Explain the operation of laser irradiation device 1. Figure 4 This is a perspective view showing the composition of the main parts of the laser irradiation device 1. Specifically, Figure 4 The main components within chamber 10 are shown. Figures 5-9 The main components of each process are shown.

[0054] exist Figure 4 In this configuration, drive mechanisms 30 and 40 are mounted on the platform 25. Specifically, guide members 33 and 43 are fixed on the platform 25. As described above, X-axis mechanisms 31 and 41 move along guide members 33 and 43 in the X direction. It should be noted that the moving end of X-axis mechanism 31 is the same as the moving end of X-axis mechanism 41.

[0055] Furthermore, lifting rails along the Y direction are provided on the X-axis mechanisms 31 and 41 respectively. The Y-axis mechanisms 32 and 42 move up and down along these lifting rails. In the vertical direction, the moving end of the Y-axis mechanism 32 is the same as that of the Y-axis mechanism 42. Additionally, the Y-axis mechanisms 32 and 42 support holding units 35 and 45 respectively. The holding units 35 and 45 may also have chuck tables for vacuum adsorption of workpieces 100 and 200. When workpieces 100 and 200 are removed, the holding units 35 and 45 release their adsorption.

[0056] Figure 5 This shows the state where workpiece 100 is transferred onto holding unit 35. Workpiece 100 is in the loading position (loading position). The loading position corresponds to the moving end of X-axis mechanism 31 on the -X side. Additionally, workpiece 100 is at irradiation height H1 (see...). Figure 1 (etc.). Additionally, the X-axis mechanism 41 becomes the moving end on the +X side. The workpiece 200 becomes the transport height H2.

[0057] Figure 6 This shows the state where laser L2 is irradiated onto workpiece 100. If the X-axis mechanism 31... Figure 5 Moving the state shown in the diagram towards the +X direction will result in... Figure 6 The state shown. Additionally, in Figure 6 In the middle, the X-axis mechanism 41 stops moving in the -X direction. That is, the X-axis mechanism 41 moves to the -X direction's moving end. The workpiece 200 is transported at a transport height H2. Figure 6 In this configuration, workpiece 200 is located in the loading / unloading position. It should be noted that the loading / unloading position and the loading / unloading position are the same X-position. It should also be noted that the X-axis mechanism 41 moves at a faster transport speed than the X-axis mechanism 31.

[0058] Figure 7 This shows the state after laser irradiation of workpiece 100 is completed. Therefore, workpiece 100 is moved to a position +X closer than the irradiation position of laser L2. If the X-axis mechanism 31 moves from... Figure 6 The state shown is further moved in the +X direction, and then becomes Figure 7 The state shown. In Figure 7 In the middle, the X-axis mechanism 31 moves to the moving end on the +X side. In Figures 5-7 During the process, workpiece 100 moves at an irradiation height H1. Figure 7 In the middle, the Y-axis mechanism 42 rises, and the workpiece 200 becomes the irradiation height H1.

[0059] Figure 8 This shows the state where workpiece 100 has descended to the transport height H2. That is, if the Y-axis mechanism 32 moves from... Figure 7 The state shown decreases, then becomes Figure 8 The state shown. Additionally, in Figures 6-8In between, the workpiece 200 is moved in and out of the holding unit 45. That is, the transfer robot arm 4 transfers the processed workpiece 200 from the holding unit 45, and transfers a new workpiece 200, before processing, onto the holding unit 45. Figure 5 The state shown and Figure 8 In the state shown, the positions of holding unit 45 and holding unit 35 are swapped.

[0060] Figure 9 This shows the state where laser L2 is irradiated onto workpiece 200. If the X-axis mechanism 41... Figure 8 Moving the state shown in the diagram towards the +X direction will result in... Figure 9 The state shown. Additionally, in Figure 9 In the middle, the X-axis mechanism 31 ends its movement in the -X direction. That is, the X-axis mechanism 31 moves to the moving end in the -X direction. Meanwhile, the workpiece 100 is transported at a transport height H2. Figure 9 In this configuration, workpiece 100 is located in the unloading position. X-axis mechanism 31 moves at a faster transport speed than X-axis mechanism 41. Figure 9 In the state shown, with Figure 6 Compared to the state shown, the positions of holding unit 35 and holding unit 45 are swapped.

[0061] Figure 10 This shows the state after laser irradiation of workpiece 200 is completed. Therefore, workpiece 200 is moved to a position +X closer than the irradiation position of laser L2. If the X-axis mechanism 41 moves from... Figure 9 The state shown is further moved in the +X direction, and then becomes Figure 10 The state shown. In Figure 10 In the middle, the X-axis mechanism 41 moves to the moving end on the +X side. As a result, the workpiece 200 moves to a position where it is not irradiated by laser L2. Figures 8-10 During this process, workpiece 200 moves at an irradiation height H1. Figure 10 In the middle, the Y-axis mechanism 32 rises, and the workpiece 100 becomes the irradiation height H1. Figure 10 In the state shown, with Figure 7 Compared to the state shown, the positions of holding unit 35 and holding unit 45 are swapped.

[0062] Then, if the Y-axis mechanism 42 descends, it returns to normal. Figure 5 The state shown. From Figure 9 The state is restored to Figure 5During this process, workpiece 100 is moved in and out of the holding unit 35. That is, the processed workpiece 100 is transferred from the holding unit 35, and a new workpiece 100 before processing is transferred onto the holding unit 35. Furthermore, by repeating the above process, multiple workpieces can be continuously irradiated with laser.

[0063] In this way, when transporting in the +X direction, workpieces 100 and 200 are at an irradiation height H1. When transporting in the -X direction, workpieces 100 and 200 are at a transport height H2. It is possible to make the transport height in the -X direction lower than the irradiation height. Therefore, laser irradiation can be prevented when transporting in the -X direction. The transport height of workpieces 100 and 200 is simply the height below the irradiation height. Therefore, the transport height when transporting workpieces in the -X direction can be non-constant. Alternatively, the transport heights of workpieces 100 and 200 can also be different.

[0064] Furthermore, the transport speed in the +X direction used for laser irradiation is limited by the laser irradiation process. In contrast, the transport speed in the -X direction used to return the processed workpiece to the transport position is not limited. The transport speed in the -X direction is faster than the transport speed in the +X direction. This shortens the production cycle time. In other words, since the processed workpiece can be quickly moved to the loading / unloading position, the loading and unloading time can be ensured. Moreover, while laser L2 is irradiating one workpiece at irradiation height H1, another workpiece at transport height H2 passes directly below the irradiation area 15. This prevents laser L2 from irradiating the workpiece at transport height H2.

[0065] Figure 11 This is a diagram illustrating an example of the timing diagram of the laser irradiation device 1. Figure 11 In the diagram, from top to bottom, the opening and closing actions of valve 5, the transfer action of transfer robot arm 4, the switching action of electrostatic precipitator 8, the opening and closing actions of shutter 22, the action of drive mechanism 30, and the action of drive mechanism 40 are shown in sequence. An example with a production cycle time of 100 seconds is shown here. That is, a new workpiece is accommodated in the chamber every 100 seconds.

[0066] The actions of the transfer robot arm 4 are represented by three categories: loading (transferring the workpiece into the cavity), unloading (transferring the workpiece out of the cavity), and standby. The actions of the drive mechanism 30 are represented by three categories: X-movement (carrying the workpiece 100 in the X direction), Y-movement (lifting and lowering the workpiece 100), and standby. Similarly, the actions of the drive mechanism 40 are represented by three categories: X-movement (carrying the workpiece 200 in the X direction), Y-movement (lifting and lowering the workpiece 200), and standby.

[0067] First, if valve 5 is opened at time t1, the transfer robot arm 4 will unload / load workpiece 100 until time t2. Once the unloading / loading of workpiece 100 is complete, valve 5 will close. During the transfer of workpiece 100, drive mechanism 30 is in standby mode at the loading position. Drive mechanism 40 moves in the X direction. That is, workpiece 200 is moved in the +X direction to irradiate it with a laser.

[0068] Then, at time t3, the drive mechanism 30 begins to move workpiece 100 in the +X direction. Also at time t3, laser irradiation of workpiece 200 ends. Then, at time t4, since the drive mechanism 40 reaches the moving end on the +X side, it lowers workpiece 200. Also at time t4, laser irradiation of workpiece 100 begins. At time t5, since the descent of workpiece 200 is complete, the moving mechanism 40 moves workpiece 200 in the -X direction. At time t6, since the drive mechanism 40 reaches the moving end on the -X side, it raises workpiece 200. At time t7, the raising of workpiece 200 is complete, and the drive mechanism 40 enters a standby state.

[0069] Then, at time t8, if valve 5 opens, workpiece 200 is unloaded / loaded during the period up to time t9. It should be noted that during the period from time t7 to t8, the precipitator 8 de-energizes the moved workpiece 200. At time t10, the drive mechanism 40 begins transporting the workpiece in the +X direction. Additionally, at time t10, laser irradiation of workpiece 100 ends.

[0070] From time t3 to t11, the drive mechanism 30 moves the workpiece 100 in the X direction. As a result, laser L2 is irradiated onto the entire surface of the workpiece 100. At time t11, since the drive mechanism 30 reaches its moving end in the +X direction, it lowers the workpiece 100. Also at time t11, laser irradiation of the workpiece 200 begins. At time t12, since the descent of the workpiece 100 is complete, the drive mechanism 30 moves the workpiece 100 in the -X direction. At time t13, since the drive mechanism 30 reaches its moving end in the -X direction, it raises the workpiece 100. At time t14, the raising of the workpiece 100 is complete.

[0071] Then, at time t15, valve 5 opens. Time t15 corresponds to time t1. Therefore, the actions after t15 are the same as those after t1, so the explanation is omitted. It should be noted that during the period from time t14 to t15, the electrostatic precipitator 8 uses X-rays to de-electrostatically remove the current from the workpiece 100 located in the loading position.

[0072] Furthermore, shutter 22 is closed from time point t3 to time point t4. Shutter 22 is closed from time point t10 to time point t11. Shutter 22 is closed during the period between the end of laser irradiation on one workpiece and the beginning of laser irradiation on another workpiece. This allows for continuous handling and efficient use of pulsed lasers. Here, relative to a production cycle time of 100 seconds, the shutter 22 is closed for 4 seconds. That is, the laser irradiation time for one workpiece becomes 96 seconds. Therefore, wasted pulsed laser light is suppressed.

[0073] (Workpiece 100)

[0074] The following uses Figure 12 , Figure 13 This illustrates an example of workpiece 100. Figure 12 This is an exploded perspective view showing the structure of workpiece 100. Figure 13 This is a side sectional view schematically showing the configuration of a portion of workpiece 100. It should be noted that the configuration of workpiece 200 is the same as that of workpiece 100, therefore its description is omitted. Workpiece 100 is the object of the laser lift-off process.

[0075] Workpiece 100 includes a panel substrate 110, a tray 120, and a mask 130. The panel substrate 110 becomes a display panel through processes such as laser lift-off. The panel substrate 110 includes a processing substrate 111 and a peripheral substrate 112. The panel substrate 110 is, for example, 65 inches in size. Figure 13 As shown, the processing substrate 111 has a glass substrate 111a, a polyimide film 111b and a PET film 111c in sequence from top to bottom.

[0076] The glass substrate 111a serves as a support glass for holding the polyimide film 111b and the PET film 111c. The polyimide film 111b becomes a release layer that can be peeled off by laser irradiation. Elements for forming display pixels are formed between the PET film 111c and the polyimide film 111b. By irradiating the polyimide film 111b with a laser through the glass substrate 111a, the polyimide film 111b and the PET film 111c can be separated from the glass substrate 111a.

[0077] A peripheral substrate 112 is mounted in the peripheral area of ​​the processing substrate 111. The peripheral substrate 112 includes a PCB (Printed Circuit Board) 112a and an FPC (Flexible Printed Circuit) 112b. The PCB 112a is mounted on the processing substrate 111 via the FPC 112b. Drive circuits and the like can also be mounted on the PCB 112a.

[0078] The panel substrate 110 is placed on the tray 120. The tray 120 is formed of a metal such as aluminum. The tray 120 includes a frame portion 121 and a central stack portion 123. The frame portion 121 is formed in a rectangular frame shape and corresponds to the peripheral portion of the panel substrate 110. The frame portion 121 holds the peripheral portion of the processing substrate 111 and the peripheral substrate 112. The frame portion 121 may also have recesses or the like for arranging the panel substrate 110.

[0079] On the XZ plane, a central stack 123 is provided inside the frame portion 121. The central stack 123 is configured in a lattice shape. That is, the central stack 123 is a beam extending in both the X and Z directions. The central stack 123 extends from one end of the frame portion 121 to the other end. The area enclosed by the central stack 123 and the frame portion 121 is called an opening 124. Multiple openings 124 are formed here.

[0080] The mask 130 is provided to cover the peripheral substrate 112. The mask 130 is disposed on the peripheral substrate 112. The mask 130 may also be fixed to the tray 120 by bolts or the like. The mask 130 is formed in a frame shape and has a rectangular opening 130a. The laser L2 irradiates the processed substrate 111 through the opening 130a. The mask 130 is provided to prevent the laser L2 from irradiating the peripheral substrate 112. In addition, it can prevent scattered ultraviolet rays from irradiating the peripheral substrate 112.

[0081] A panel substrate 110 is held on a tray 120. A mask 130 is mounted on the tray 120. The panel substrate 110, tray 120, and mask 130 are integrated to form a workpiece 100. The workpiece 100, having the panel substrate 110, tray 120, and mask 130, is transferred into the laser irradiation apparatus 1. The panel substrate 110, along with the tray 120 and mask 130, is transferred into the laser irradiation apparatus 1.

[0082] use Figure 14 Explain the configuration of workpiece 100 and holding unit 35. Figure 14 This is a cross-sectional view showing the configuration of the holding unit 35 and the workpiece 100. Specifically, Figure 14 This shows the state in which workpiece 100 is held in holding unit 35.

[0083] The holding unit 35 serves as a chuck stage for vacuum suction. For example, the holding unit 35 may be a porous material. Alternatively, the holding unit 35 may have a suction port on its upper surface 35a. The holding unit 35 is connected to an exhaust mechanism such as a vacuum pump. Furthermore, by drawing gas from the holding unit 35, the workpiece 100 is adsorbed onto the upper surface 35a of the holding unit 35.

[0084] A groove 35b is formed on the upper surface 35a of the retaining unit 35 in a manner that does not interfere with the middle stack portion 123. That is, the groove 35b is lattice-shaped corresponding to the middle stack portion 123. The width of the groove 35b is wider than the width of the middle stack portion 123. Therefore, the middle stack portion 123 is embedded in the groove 35b. The retaining unit 35 is inserted into the opening 124 between the frame portion 121 and the middle stack portion 123.

[0085] The upper surface 35a of the holding unit 35 abuts against the PET film 111c of the processing substrate 111. That is, the holding unit 35 lifts the panel substrate 110 from the tray 120. A gap is formed between the processing substrate 111 and the tray 120. The holding unit 35 holds the workpiece 100 when the lower surface of the processing substrate 111 is not in contact with the tray 120. When the tray 120 is removed from the processing substrate 111, the holding unit 35 adsorbs the processing substrate 111. The flatness of the processing substrate 111 depends on the flatness of the upper surface 35a of the holding unit 35. The flatness of the processing substrate 111 can be improved.

[0086] In order to ensure stable laser irradiation, it is preferable to improve the flatness of the processing substrate 111 during transport. On the other hand, since the processing substrate 111 has a multilayer structure, warping caused by film stress and the like can occur. In this embodiment, since the holding unit 35 performs vacuum adsorption, warping of the processing substrate 111 can be suppressed. That is, the processing substrate 111 is vacuum adsorbed on the portion other than the middle stack portion 123. As a result, the flatness of the processing substrate 111 can be improved by suppressing warping.

[0087] The height of the processing substrate 111 can be aligned with the focal plane of the laser L2 based on the irradiation optical system 20. Therefore, even when it is difficult to increase the depth of focus of the irradiation optical system 20, a stable laser irradiation process can be achieved. This enables efficient and stable processing.

[0088] (Organic EL display)

[0089] The aforementioned laser irradiation device 1 is suitable for laser lift-off apparatus for organic EL (Electroluminescence) displays. In other words, the laser irradiation method of the laser irradiation device 1 is used as a laser lift-off process in the manufacturing process of organic EL displays.

[0090] The following describes the configuration of an organic EL display manufactured using the laser irradiation apparatus 1 of this embodiment. Figure 15 Explain the structure of an organic EL (Electroluminescence) display. Figure 15 This is a cross-sectional view showing an example of an organic EL display. Figure 15The organic EL display 300 shown is an active matrix display device in which TFTs are arranged in each pixel PX.

[0091] The organic EL display 300 comprises a film 301, a release layer 302, a TFT (Thin Film Transistor) layer 311, an organic layer 312, a color filter layer 313, and a protective layer 314. Figure 15 The diagram shows a top-emitting organic EL display where the protective layer 314 side serves as the visual recognition side. It should be noted that the following description illustrates one configuration example of an organic EL display, and this embodiment is not limited to the configuration described below. For example, this embodiment can also be applied to a bottom-emitting organic EL display.

[0092] Film 301 is a flexible plastic film that can be bent by applying stress. A release layer 302 and a TFT layer 311 are provided on film 301. TFT layer 311 has TFTs 311a disposed in each pixel PX. Furthermore, TFT layer 311 has wiring (not shown) connected to TFTs 311a. TFTs 311a and wiring constitute a pixel circuit.

[0093] An organic layer 312 is provided above the TFT layer 311. The organic layer 312 has organic EL light-emitting elements 312a configured for each pixel PX. The organic EL light-emitting element 312a has a stacked structure, for example, consisting of an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode. In the case of a top-emitting type, the anode is a metal electrode, and the cathode is a transparent conductive film such as ITO (Indium Tin Oxide). Furthermore, on the organic layer 312, partitions 312b are provided between the pixels PX for separating the organic EL light-emitting elements 312a.

[0094] A color filter layer 313 is provided above the organic layer 312. The color filter layer 313 has color filter sections 313a for color display. That is, each pixel PX has a resin layer colored as R (red), G (green), or B (blue) as a color filter section 313a. White light emitted from the organic layer 312 is converted into RGB color light when passing through the color filter section 313a. It should be noted that in the case of a three-color mode where the organic layer 312 is provided with organic EL light-emitting elements that emit various colors of RGB light, the color filter layer 313 may be omitted.

[0095] A protective layer 314 is provided above the color filter layer 313. The protective layer 314 is made of resin material and is provided to prevent the organic EL light-emitting element of the organic layer 312 from deteriorating.

[0096] The current flowing into the organic EL light-emitting element 312a of the organic layer 312 varies according to the display signal supplied to the pixel circuit. Therefore, by supplying a display signal corresponding to the displayed image to each pixel PX, the amount of light emitted in each pixel PX can be controlled. This allows the display of the desired image.

[0097] <Manufacturing Process of Organic EL Displays>

[0098] Next, use Figure 16 The manufacturing process of the organic EL display described above is explained. In manufacturing an organic EL display, the first step is to prepare a processing substrate 331 (step A). ​​For example, the processing substrate 331 uses a glass substrate through which laser light passes. The processing substrate 331 and... Figure 12 The processing substrate 111 corresponds to the etc.

[0099] Next, a release layer 302 is formed on the processing substrate 331 (step B). The release layer 302 can be, for example, made of polyimide. The release layer 302 corresponds to the polyimide film 111b. Then, circuit elements 332 are formed on the release layer 302 (step C). Here, the circuit elements 332 include... Figure 15 The diagram shows a TFT layer 311, an organic layer 312, and a color filter layer 313. Circuit element 332 can be formed using photolithography and film deposition techniques. Then, a protective layer 314 for protecting circuit element 332 is formed on top of circuit element 332 (step D). Protective layer 314 corresponds to PET film 111c.

[0100] Next, the processing substrate 331 is flipped with the processing substrate 331 on top (step E) and placed into the laser irradiation apparatus 1. Laser L2 is irradiated from the processing substrate 331 side towards the release layer 302 (step F). Laser L2 can be a line beam. Figure 16 In the illustrated case, since the processing substrate 331 is transported in the X direction, laser L2 is irradiated from the right side of the processing substrate 331 toward the left side. Then, the processing substrate 331 is separated from the release layer 302 (step G). Finally, film 318 is laminated onto the release layer 302 (step H). For example, film 318 is a flexible plastic film, which is a film that can be bent by applying stress. By using such a manufacturing process, a bendable organic EL display 300 can be manufactured.

[0101] It should be noted that the laser irradiation device 1 mentioned above is not limited to a stripping device for laser stripping processes, but can also be applied to excimer laser annealing devices, etc.

[0102] It should be noted that the present invention is not limited to the above embodiments, and appropriate modifications can be made without departing from the spirit of the invention.

[0103] This application claims priority based on Japanese Application Special Purpose 2021-36889, filed on March 9, 2021, the entire contents of which are incorporated herein by reference.

[0104] Explanation of reference numerals in the attached figures

[0105] 1. Laser irradiation device

[0106] 4. Transfer robotic arm

[0107] 5. Valve

[0108] 6 windows

[0109] 8. Electricity Remover

[0110] 10 chambers

[0111] 20 Illumination Optical System

[0112] 21 Light Source

[0113] 25 racks

[0114] 30 Drive mechanism

[0115] 31 X-axis mechanism

[0116] 32 Y-axis mechanism

[0117] 33. Guide

[0118] 35 Holding Unit

[0119] 40 Drive mechanism

[0120] 41 X-axis mechanism

[0121] 42 Y-axis mechanism

[0122] 43. Guide

[0123] 45 Holding Unit

[0124] 100 workpieces

[0125] 110 Panel substrate

[0126] 111 Processing substrate

[0127] 112 Peripheral substrate

[0128] 120 pallets

[0129] 130 mask

[0130] 200 workpieces

[0131] 300 Organic EL Display

[0132] 310 base plate

[0133] 311 TFT layer

[0134] 311a TFT

[0135] 312 Organic Layer

[0136] 312a Organic EL Light Emitting Element

[0137] 312b next door

[0138] 313 Color Filter Layer

[0139] 313a Color Filter (CF)

[0140] 314 Protective Layer

[0141] PX pixels

[0142] H1 Irradiation Height

[0143] H2 Handling Height

Claims

1. A laser irradiation device, characterized in that, include: A laser oscillator that generates laser light; The first holding unit and the second holding unit respectively hold the first workpiece and the second workpiece irradiated by the laser; The first and second conveying mechanisms respectively convey the first and second holding units horizontally; and The first and second lifting mechanisms cause the first and second holding units to rise and fall respectively in a vertical direction orthogonal to the horizontal direction. The laser is irradiated onto the first workpiece by transporting the first workpiece at a first height in a first direction. During the irradiation of the first workpiece with the laser, a second workpiece located at a second height, which is lower than the first height, is transported in a second direction opposite to the first direction.

2. The laser irradiation device according to claim 1, characterized in that, When the laser is irradiated onto the first workpiece, the second workpiece is located below the first workpiece.

3. The laser irradiation device according to claim 1 or 2, characterized in that, The system further includes an irradiation optical system that positions the laser beam as a line to irradiate the first and second workpieces being transported from above. When viewed from above, the first transport mechanism and the second transport mechanism transport the first workpiece and the second workpiece respectively in a direction that intersects with the linear laser.

4. The laser irradiation device according to claim 1 or 2, characterized in that, When viewed from above, The first conveying mechanism supports the first holding unit at one end in a direction orthogonal to the conveying direction. The second transport mechanism supports the second holding unit at its other end in a direction orthogonal to the transport direction.

5. The laser irradiation device according to claim 1, characterized in that, After the second workpiece is transported in the second direction, the second workpiece of the second holding unit is replaced.

6. The laser irradiation device according to claim 1 or 2, characterized in that, The first holding unit vacuum adsorbs the first workpiece. The second holding unit vacuum adsorbs the second workpiece.

7. The laser irradiation device according to claim 6, characterized in that, The first workpiece and the second workpiece each include: A substrate is processed and irradiated with the laser; A peripheral substrate disposed around the processing substrate; and A tray that holds the processing substrate and the peripheral substrate. With the first workpiece placed on the first holding unit, the first holding unit is disposed within an opening provided on the tray. The first holding unit vacuum-adsorbs the first workpiece while the processing substrate is removed from the tray. With the second workpiece placed on the second holding unit, the second holding unit is positioned within an opening provided on the tray. The second holding unit vacuum-adsorbs the second workpiece while the processing substrate is away from the tray.

8. A laser irradiation method, characterized in that, Includes the following steps: (a) A step of irradiating the first workpiece with a laser by moving the first workpiece in the horizontal direction while the first workpiece is held in the first holding unit; (b) The step of moving the first workpiece in the horizontal direction after lowering the first workpiece that has been irradiated by the laser; (c) In the state where the second workpiece is held by the second holding unit, the second workpiece is irradiated with laser by moving the second workpiece in the horizontal direction; as well as (d) The step of moving the second workpiece horizontally after lowering it after it has been irradiated with the laser. In step (a), the laser is irradiated onto the first workpiece by transporting the first workpiece at a first height in a first direction. During the irradiation of the first workpiece with the laser in step (a), the second workpiece, which is located at a second height in step (d) and is lower than the first height, is transported in a second direction opposite to the first direction.

9. The laser irradiation method according to claim 8, characterized in that, When the laser is irradiated onto the first workpiece in step (a), the second workpiece is located below the first workpiece.

10. The laser irradiation method according to claim 8 or 9, characterized in that, The first and second workpieces being transported from above are irradiated with a linear laser beam. In steps (a) and (c), when viewed from above, the first workpiece and the second workpiece are respectively transported in a direction that intersects with the linear laser.

11. The laser irradiation method according to claim 8 or 9, characterized in that, When viewed from above, The first holding unit is supported at one end in a direction orthogonal to the transport direction. The second holding unit is supported at the other end in a direction orthogonal to the transport direction.

12. The laser irradiation method according to claim 8, characterized in that, In step (d), after the second workpiece is transported in the second direction, the second workpiece of the second holding unit is replaced.

13. The laser irradiation method according to claim 8 or 9, characterized in that, The first holding unit vacuum adsorbs the first workpiece. The second holding unit vacuum adsorbs the second workpiece.

14. A method for manufacturing an organic EL display, characterized in that, Includes the following processes: (A) The process of forming a release layer on a substrate; (B) The process of forming elements on the release layer; (C) The process of separating the substrate from the release layer; as well as (D) The process of laminating a film on the release layer, (C) The process of separating the substrate from the release layer is a process of irradiating the workpiece from above with a laser during the handling of the workpiece containing the substrate and the release layer, and includes the following steps: (Ca) The step of irradiating the first workpiece with a laser by moving the first workpiece in the horizontal direction while the first workpiece is held in the first holding unit; (Cb) The step of moving the first workpiece in the horizontal direction after lowering the first workpiece that has been irradiated by the laser; (Cc) The step of irradiating the second workpiece with a laser by moving the second workpiece in the horizontal direction while the second workpiece is held in the second holding unit; as well as (Cd) The step of moving the second workpiece horizontally after lowering the second workpiece that has been irradiated by the laser. In step (Ca), the laser is irradiated onto the first workpiece by transporting the first workpiece at a first height in a first direction. During the process of irradiating the first workpiece with the laser in step (Ca), in step (Cd), the second workpiece, located at a second height, is transported in a second direction opposite to the first direction, which is lower than the first height.

15. The method for manufacturing an organic EL display according to claim 14, characterized in that, When the first workpiece is irradiated with a laser in step (Ca), the second workpiece is located below the first workpiece.

16. The method for manufacturing an organic EL display according to claim 14 or 15, characterized in that, The first and second workpieces being transported from above are irradiated with a linear laser beam. In steps (Ca) and (Cc), when viewed from above, the first workpiece and the second workpiece are transported in directions that intersect with the linear laser beam, respectively.

17. The method for manufacturing an organic EL display according to claim 14 or 15, characterized in that, When viewed from above, The first holding unit is supported at one end in a direction orthogonal to the transport direction. The second holding unit is supported at the other end in a direction orthogonal to the transport direction.

18. The method for manufacturing an organic EL display according to claim 14, characterized in that, In step (Cd), after the second workpiece is transported in the second direction, the second workpiece of the second holding unit is replaced.

19. The method for manufacturing an organic EL display according to claim 14 or 15, characterized in that, The first holding unit vacuum adsorbs the first workpiece. The second holding unit vacuum adsorbs the second workpiece.

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