Method for manufacturing a phosphor

Abstract

The phosphor manufacturing method of the present application includes: a step of forming a cutting groove on one side of a phosphor original plate along a grid-shaped cutting line; and a lower surface grinding step (S6) of removing a predetermined thickness from an opposite surface of the original plate on which the cutting groove is formed to individualize the original plate into a plurality of phosphors as color conversion components for light emitting diodes (LEDs). The step of forming the cutting groove (S2, S3) can include: a first upper surface cutting step (S2) of forming the cutting groove using a tapered cutting blade whose width gradually decreases toward the outside, so that the side surface of the cutting groove is inclined to gradually decrease in width toward the inside; and a second upper surface cutting step (S3) of forming a deeper cutting groove on the bottom surface of the cutting groove formed in the first cutting step using a flat cutting blade whose width is constant.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a phosphor. More specifically, it relates to a method for manufacturing a phosphor as a color conversion component for changing the wavelength of light emitted by a light-emitting diode (LED) chip. Background Technology

[0002] Korean Patent No. 2243674 discloses a process in which a color conversion component is manufactured in the form of a thin and wide substrate, and then, as a post-processing step, it is divided into multiple small phosphors. The process of dividing the substrate into very small phosphors, i.e., during cutting or grinding, carries the possibility of damage to the substrate or partial detachment of small phosphor chips from the worktable.

[0003] Especially in the direction of Figure 14 The problem may be exacerbated when the cutting blade 45 is directly applied to the process of dividing the original plate 41. During operation, the original plate 41 is placed on a disc-shaped ultraviolet (UV) tape 49. An adhesive is applied to the upper surface of the UV tape 49 to secure the original plate 41. The original plate 41, with a thickness of approximately 1.5 mm, is first ground to a thickness of 0.1 mm to 0.2 mm, and then cut into a grid pattern using the cutting blade 45. The fluorescent particles of the original plate 41 are cut as they are fragmented by the cutting blade 45, during which the sides of the phosphors 42 are fragmented into uneven shavings. Furthermore, due to the rotational force of the cutting blade 45, the phosphors 42 can detach from the adhesion surface of the UV tape 49. The smaller the size of the phosphors 42, the smaller the contact area with the UV tape 49, thus reducing the adhesion. Due to the low adhesion, the phosphors 42 are flung outwards due to the rotational force while rubbing against the cutting blade 45. Figure 13 As shown, cracks can also be generated.

[0004] Korean Patent No. 1644149 discloses a multi-chip light-emitting diode (LED) package. It attempts to compactly arrange multiple LEDs for use in automotive headlights or projectors. In such applications, LED miniaturization is required to densely pack more LEDs into a limited space. However, smaller LEDs also mean smaller phosphors. If the phosphor is smaller, cracking and chipping increase during phosphor manufacturing, and the phenomenon of phosphor flying away during the dicing process of the original substrate also increases.

[0005] In LEDs used in multi-chip light-emitting diode packages, the directness of the emitted light needs to be improved to minimize mutual interference between the light emitted from multiple LEDs. Furthermore, to improve light quality, smooth and small phosphors without cracks or chipping are required. Summary of the Invention

[0006] Technical issues

[0007] This invention relates to a method for manufacturing a phosphor, which provides a phosphor with high direct light transmission, no cracks or chips, smooth surface, and small size, thereby improving the light quality of LEDs.

[0008] Technical solution

[0009] The phosphor manufacturing method of the present invention for solving the above problems includes: a step of forming a cutting groove on one side of a phosphor substrate along a grid-like cutting line; and a lower surface grinding step S6 of removing a predetermined thickness from the opposite surface of the substrate where the cutting groove is formed using a disc-shaped grinding mill, so that the substrate is individualized into a plurality of phosphors serving as color conversion components for light-emitting diodes. The steps S2 and S3 of forming the cutting groove may include: a first upper surface cutting step S2, in which the cutting groove is formed using a tapered cutting blade with a width that gradually decreases outward, such that the side of the cutting groove is tilted so that the width gradually decreases inward; and a second upper surface cutting step S3, in which a deeper cutting groove is formed on the bottom surface of the cutting groove formed in the first cutting step using a flat cutting blade with a constant width.

[0010] In the above-mentioned cutting groove forming processes S2 and S3, the following step of upper surface grinding S4 is also included: in order to remove the chipping and chipping portions formed on the surface of the above-mentioned original plate, the surface on which the above-mentioned cutting groove is formed is ground with a uniform thickness.

[0011] The width of the outermost part of the tapered cutting blade used in the first cut S2 on the upper surface is the same as the width of the planar cutting blade used in the second cut S3 on the upper surface. In the cutting groove, the width is gradually narrowed from the surface of the original plate to a predetermined depth, and the width is constant until the predetermined depth thereafter.

[0012] The present invention also includes a step of filling the cutting groove formed by the first cutting S2 and the second cutting S3 steps with a fluid adhesive material; a step of curing the adhesive material; the lower surface grinding step S6 is a step of reducing the thickness of the opposite surface of the surface on which the cutting groove is formed, thereby forming a form in which a plurality of phosphors divided along the cutting line are integrated with the adhesive material connecting them; the present invention may also include a step S7 of removing the adhesive material to leave only the divided individual phosphors.

[0013] The aforementioned adhesive material is wax. In the step of filling the adhesive material, the wax, which is heated and has fluidity, is filled into the aforementioned cutting groove. In the aforementioned curing step, the wax is left at room temperature for a period of time. In the step of removing the aforementioned adhesive material, the adhesive material is melted by applying a solvent to the aforementioned adhesive material.

[0014] The aforementioned adhesive material is a UV-curable adhesive material, and in the aforementioned curing step, ultraviolet light is applied to the adhesive material.

[0015] Invention Effects

[0016] According to the present invention, small, durable, and transmissive phosphors with smooth morphology can be manufactured. Attached Figure Description

[0017] Figure 1 The present invention illustrates a method for manufacturing a phosphor according to an embodiment of the present invention.

[0018] Figure 2 This is a cross-sectional view of the phosphor substrate used in a phosphor manufacturing method according to an embodiment of the present invention.

[0019] Figure 3 This is the product of the first cutting process in the phosphor manufacturing method of an embodiment of the present invention.

[0020] Figure 4 This is the product of the second cutting process in the phosphor manufacturing method of an embodiment of the present invention.

[0021] Figure 5 This is the product of the upper surface grinding process in the phosphor manufacturing method of an embodiment of the present invention.

[0022] Figure 6 This is the product of the upper surface filling process in the phosphor manufacturing method of an embodiment of the present invention.

[0023] Figure 7 , Figure 8 This is the product of the lower surface grinding process in the phosphor manufacturing method of an embodiment of the present invention.

[0024] Figure 9 A perspective view of an icosahedral phosphor produced by a phosphor manufacturing method according to an embodiment of the present invention.

[0025] Figure 10 , Figure 11 This is a schematic diagram illustrating the light transmission path of the phosphor in the first comparative example and an embodiment of the present invention.

[0026] Figure 12 This is a front view showing an LED chip with a phosphor mounted on it, representing a second comparative example.

[0027] Figure 13 An image showing a phosphor manufactured using background techniques.

[0028] Figure 14 This is a schematic diagram illustrating the phenomenon of a phosphor flying away when it is manufactured using the background technique.

[0029] Figure 15 , Figure 16 The images shown are a perspective view and a front view, respectively, illustrating a phosphor produced by a phosphor manufacturing method according to another embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures

[0031] 1: Original plate; 2: Fluorescent material

[0032] 3: Cutting groove; 9: Adhesive material

[0033] 20: Cutting blade 21: Grinding machine

[0034] 31: LED chip

[0035] S1: First grinding of the upper surface

[0036] S2: First cut on the upper surface

[0037] S3: Second cut on the upper surface

[0038] S4: Second grinding of the upper surface

[0039] S5: Upper surface filling

[0040] S6: Lower surface grinding

[0041] S7: Remove filler material. Detailed Implementation

[0042] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The drawings illustrate exemplary aspects of the present invention and are provided only for the purpose of describing the invention in more detail; the scope of the invention is not limited thereto.

[0043] Furthermore, regardless of the reference numerals in the accompanying drawings, the same or corresponding structural elements are given the same reference numerals, and repeated descriptions of them are omitted. For ease of explanation, the size and shape of the various structural components shown in the drawings are exaggerated or reduced.

[0044] In addition, terms including ordinal numbers such as first or second can be used to describe various structural elements, which are not limited to the terms mentioned above, but are only used to distinguish one structural element from another.

[0045] The method for manufacturing a phosphor according to an embodiment of the present invention, such as Figure 1As shown, the first step is to prepare a base plate 1, which is divided into individual phosphors 2. The base plate 1 can also be manufactured in a circular or quadrilateral shape. Manufacturing a wide base plate 1 and dividing it to manufacture phosphors 2 in the form of small chips is more efficient than initially manufacturing small phosphors 2 the size of the actual product. The phosphors 2 used are usually small in size and not suitable for processing by hand or machine; therefore, the above method is used. After mixing powdered fluorescent materials with glass crystals or silicone resin, etc., the base plate 1 can be obtained by applying processes such as sintering, compression, and drying.

[0046] The original plate 1 is not the size suitable for the actual product; therefore, it should be separated into smaller phosphors 2. Furthermore, the surface is rough or formed by curves, therefore, a planarization process is required.

[0047] like Figure 1 and Figure 2 As shown, in the first upper surface grinding process S1, the upper surface of the original plate is ground. It is manufactured as follows... Figure 2 The bottom surface B of the original plate 1 shown is flat, but the upper surface T is uneven or sloping. Because it is thinner in the middle and thicker on the outside, the upper surface T typically has a curved shape. As in process S1, if the upper surface T is ground smooth using a grinding machine 21, a flat upper surface T can be obtained. If fine unevenness remains on the upper surface T, i.e., the surface roughness does not reach the desired level, fine grinding can be repeated to make it smooth.

[0048] Grinding operations can be performed using a surface grinding machine 21. The grinding machine 21 cuts the surface of the original plate 1 while rotating a wide disc. Through the grinding operation, the thickness of the original plate 1 is reduced uniformly and gradually. The grinding system can be constructed from a support that allows the grinding machine 21 to move, a support bed for placing the original plate 1, and mechanical equipment with a control unit.

[0049] Subsequently, as in processes S2 and S3, cutting grooves 3 are formed on the original plate 1. Multiple straight lines with a certain interval are formed along the cutting line 24 using a cutting blade 20, and multiple cutting lines 24 perpendicular to these lines are also formed, thus creating a grid shape. Without completely dividing the original plate 1, the original plate 1 is only cut to a specified depth, such as by making slits with a knife, thereby forming the cutting grooves 3. Between the cutting grooves 3, protrusions form the original plate 1, which will become the sites for forming individual phosphors 2.

[0050] In process S2, a bevel cutting blade 25, whose width gradually decreases outwards, can be used. Thus, as... Figure 1 and Figure 3 As shown, the width of the cutting groove 3 also gradually widens outwards. If a tapered cutting blade 25 is used, then as... Figure 11As shown, a tilted surface 39 can be formed in the final manufactured phosphor 2.

[0051] In process S3, the bottom surface of the cutting groove 3 formed in process S2 is also cut. This time, instead of using the tapered cutting blade 25 with its inclined side, a flat cutting blade 27 is used. The outermost tapered cutting blade 25 used in the first cut has the narrowest width. A cutting blade 27 with the same or slightly larger width can be used for the second cut. Figure 1 and Figure 4 As shown, after the first and second cuts in processes S2 and S3, the cutting groove 3 is completed.

[0052] The cutting groove 3 is formed by the first cut up to a specified depth d1, and the subsequent depth d2 is formed by the second cut. The bottom surface of the cutting groove 3 is separated from the ground by a specified thickness d3. The portion formed by the first cut is formed at an angle with a gradually decreasing width, while the width below it remains constant.

[0053] like Figure 3 and Figure 4 As shown, a chipping area is formed simultaneously with the formation of the cutting groove 3. During the cutting of the original plate 1 using the cutting blade 20, the surface of the original plate 1 becomes rough and fragmented. The original plate 1 is manufactured by mixing multiple particles. Therefore, during the cutting of the surface of the original plate 1 using the cutting blade 20, the material forming the original plate 1 breaks down, forming the cutting groove 3, but simultaneously, chipping also occurs. Typically, chipping mainly occurs at the edges of the cutting groove 3. Figure 4 As shown, an upper shaving portion 4 can be formed at the widest outer edge of the upper end of the cutting groove 3, and a lower shaving portion 5 can be formed at the lower end. If the LED is turned on with the phosphor 2 mounted on the LED chip 31, light is scattered through this shaving portion, and heat can be concentrated. Therefore, it is best to remove it.

[0054] Reference Figure 1 , Figure 4 , Figure 5 As part of process S4, the upper surface T of the original plate 1, which has cutting grooves 3, is ground using a surface grinding machine 21. This results in a uniform reduction in the thickness of the original plate 1. During process S4, grinding is performed, thereby removing the upper chipped portion 4. Grinding is performed with the aim of removing the chipped portion; therefore, as... Figure 4 As shown, grinding continues until a specified depth d4 is reached on the surface, to partially remove the inclined surface formed during the first cut S2 on the upper surface. Thus, as... Figure 5 As shown, the upper chipping portion 4 can be removed. The lower chipping portion 5 remains.

[0055] like Figure 1 and Figure 6As shown, in process S5, adhesive material 9 is filled into the cutting groove 3. In subsequent operations, the interior of the cutting groove 3 is filled until the individual phosphors 2 in chip form are completely separated, thereby supporting the original board 1. Wax, UV-curable adhesive materials, etc., can be used as adhesive material 9.

[0056] Wax is a substance that exhibits a certain degree of viscosity and fluidity at relatively high temperatures, but solidifies when exposed to relatively low temperatures. In this embodiment, heat is applied to the wax in a manner that brings it to a specified temperature, causing it to flow. The wax is then applied to and fills the cutting groove 3. Afterward, the process is maintained at room temperature to perform process S5. While applying the heated, fluidized wax to the cutting groove 3, the surface is smoothed with a scraper, as shown... Figure 6 As shown, the surface of the wax can be flattened to the surface of the original plate 1.

[0057] After being left at room temperature for a period of time, the wax solidifies. The wax that solidifies inside the cutting groove 3 is used to connect the grid-like protrusions that will later be divided into individual phosphor chips 2. Therefore, these protrusions are connected by an adhesive material 9.

[0058] UV-curable adhesives are materials that are fluid under normal conditions but cure upon exposure to ultraviolet (UV) light. At room temperature, if the UV-curable adhesive is applied to the cutting groove 3 and then irradiated with UV light, it will cure. Similar to wax, it can be planarized using a scraper. The cured UV-curable adhesive is then used to connect the grid-like protrusions that will later be divided into individual phosphor chips 2. Instead of being left at room temperature like wax, the curing process is accelerated by UV irradiation, thus reducing the time required for the adhesive to solidify and ensuring uniformity in each step.

[0059] Alternatively, paraffin wax can be used as a binder, or synthetic resins such as acrylic acid can be used.

[0060] In the S5 process, the cutting groove 3 is filled with adhesive material 9 and the adhesive material 9 is cured, thereby strengthening the overall rigidity of the original plate 1 and connecting the parts that will be divided into individual phosphors 2 in the future.

[0061] like Figure 1 and Figure 6 , Figure 7As shown, in process S6, the original plate 1 is flipped over, and grinding is performed on the lower surface where the cutting groove 3 is not formed. Grinding is performed on the opposite surface where the cutting groove 3 filled with adhesive material 9 is formed, so that the thickness of the original plate 1 is gradually reduced. The original plate 1 is flipped over with the adhesive material 9 facing downwards, and the surface is ground using a surface grinder 21. The thickness of the original plate 1 is reduced by performing rough grinding. This process can be performed by gradually lowering the surface grinder 21 toward the worktable side, so that the surface of the surface grinder 21 gradually cuts the lower surface of the original plate. Figure 6 As shown, lower shaving portions 5 are formed on both sides of the bottom surface of the cutting groove to remove a specified thickness d5 by completely removing these portions. This also removes the lower part of the adhesive material 9. The grinding thickness of the lower surface can be adjusted to achieve the final desired thickness.

[0062] As in process S6, if one side of the original plate 1 is cut to reduce the thickness, then the final result is as follows: Figure 7 , Figure 8 As shown, the substrate 1 is in a state where multiple phosphors 2 are connected by filling the space between them with adhesive material 9. That is, the substrate 1 is already divided into multiple phosphors 2, and the adhesive material 9 connects the divided phosphors 2. In other words, multiple phosphor 2 chips are embedded in a row between the adhesive material 9.

[0063] Due to the rotational force of the grinding machine 21, even when a lateral force is applied to the phosphor 2, the adhesive material 9 supports the phosphor 2, thus preventing the phosphor 2 from detaching from the column and maintaining its shape. No matter how small the phosphor 2 is manufactured, detachment will not occur. Furthermore, without the adhesive material 9, the position of the phosphor 2 would be movable, and this position would be different for each phosphor 2, potentially leading to uneven grinding. However, in this embodiment, the phosphor 2 and the adhesive material 9 are bonded together, thus avoiding such problems.

[0064] Finally, as Figure 1 As shown, in process S7, the bonding material 9 between the phosphors 2 is removed.

[0065] When the adhesive material 9 is wax, a solvent such as alcohol can be sprayed onto the wax-forming area to remove it. If alcohol is sprayed evenly onto the entire substrate 1, the phosphor 2 will later separate into individual chips. When paraffin or acrylic resin is used as the adhesive material 9, isopropyl alcohol can be used as the solvent.

[0066] If the adhesive material 9 is a UV-curable adhesive material, it can be removed by irradiating with ultraviolet light. Previously, ultraviolet light was irradiated to cure the adhesive material 9; if ultraviolet light is irradiated again during process S7, the adhesive material 9 will be further cured and completely separated from the phosphor 2. If the worktable is made of UV-curable tape, it can be removed along with the tape.

[0067] As described above, by using a solvent-based or UV-based method instead of a physical method, damage to the phosphor 2 can be prevented compared to physically removing the adhesive material 9 from the phosphor 2. Furthermore, it prevents the formation of spots or unevenness on the side surfaces of the phosphor 2 caused by residual adhesive material 9.

[0068] Through the process described above, even small-sized phosphors 2 can be manufactured with a smooth shape. Specifically, in processes S4 and S6, the flaked portions 4 and 5 on the surface of the original plate 1 are removed while forming the cutting groove 3. In process S5, after removing the flaked portions 4 and 5, the smooth cutting groove 3 is filled with the adhesive material 9. In process S6, grinding is performed, separating the original plate 1 into individual phosphors 2 while simultaneously forming the phosphors 2 and the adhesive material 9 together, thereby preventing the phosphors 2 from detaching or deforming. In process S7, only the adhesive material 9 can be removed without damaging or deforming the phosphors 2. Typically, it is difficult to manufacture phosphors with a square shape less than 1 mm in length and width, but by using the adhesive material 9, phosphors smaller than 0.75 micrometers can be manufactured. At least 0.45 micrometers can be manufactured.

[0069] The method for manufacturing a phosphor according to an embodiment of the present invention, such as Figure 9 As shown, an icosahedral phosphor 2 can be produced. Typically, phosphors are formed as hexahedrons. It can be formed as shown... Figure 10 The cuboid 32 shown can also be formed as follows: Figure 12 The hexahedron 33 shown has four tilted sides. Figure 12 The cross section of the hexahedron 33 will be trapezoidal.

[0070] like Figure 10 As shown, the phosphor 32 disposed on the LED chip 31 converts the wavelength of the light emitted from the LED chip 31. However, the cuboid phosphor 32 does not focus the light, but emits it, so the light diffuses. Figure 11 The diagram illustrates a phosphor 2, manufactured as an icosahedron, disposed on an LED chip 31 according to an embodiment of the present invention. Figure 11 As shown, an inclined surface 39 is formed on the side of phosphor 2, thus changing the light path traveling towards this location. That is, the angle of light emitted after passing through the inclined surface 39 is towards the center of the phosphor. Therefore, compared to... Figure 10 The rectangular phosphor 32 can improve the directness of light.

[0071] Figure 12 The hexahedron 33 with its tilted sides shown can also improve the directness of light. However, the thickness of the tilted hexahedron 33 gradually decreases towards the outermost part, causing a problem. The thickness of the outermost part of the tilted hexahedron 33 converges to 0. In the case of the decahedral phosphor 2 manufactured according to an embodiment of the present invention, compared with... Figure 11 The outermost thickness d6 shown is not 0, which presents a difference.

[0072] like Figure 12 As shown, if the phosphor 33, which is a tilted hexahedron, is mounted on the LED chip 31, high heat is generated at the outermost edge. Given that the amount of light emitted from the LED chip 31 is constant across the entire area, the thinner portions of the phosphor 33 should receive the same amount of light as the thicker portions at the center. If the LED chip 31 is driven, energy is concentrated in the thinner outer portions, causing overheating.

[0073] Furthermore, during processing, a shaving portion 36 can be created at the outermost edge of the phosphor 33, which can further increase the temperature when driving the LED. This is because if light fails to pass through the shaving portion 36 and is scattered, heat energy is accumulated. This shaving portion 36 can also be created during cutting with a cutting blade, or even if it is not created during cutting, it can be created during the transfer of the phosphor 33. The process of mounting the phosphor 33 onto the LED chip 31 is called "mounting". If this process is performed quickly, the phosphor 33 may be damaged by impact when placed on the LED chip 31. The thinnest outermost edge is the most vulnerable.

[0074] If the outermost part of phosphor 33 overheats, it will not only affect the light quality but also have a detrimental impact on durability. Typically, if... Figure 12 As shown, the LED chip 31 and the phosphor 33 are fixed by an adhesive layer 35, which can melt or deform due to heat. According to an embodiment of the present invention, a smooth-surfaced decahedral phosphor 2 can be manufactured, which is superior in light quality and durability compared to the phosphors 32 and 33 of the comparative examples. This is because the outermost portion also has a certain thickness d6 and no flaked portion, thus exhibiting excellent durability, and the formation of the inclined surface 39 results in excellent light directness. Furthermore, miniaturization of the phosphor 2 can be achieved. Therefore, multiple LED chips 31 can be densely arranged.

[0075] also, Figure 15 , Figure 16The diagram illustrates a phosphor manufactured according to another embodiment of the present invention. In the aforementioned embodiment, during the second cutting of the upper surface S3, a second cut was performed using a cutting blade 27 with the same or slightly larger width as the outermost part of the tapered cutting blade 25 used in the first cut. Therefore, an icosahedral phosphor 2 is obtained.

[0076] In another embodiment, a second cut can be performed using a cutting blade 27 with a smaller amplitude than the cutting blade 25 used in the first cut. In this case, as... Figure 15 , Figure 16 As shown, on the outer side of the phosphor 2, not only is an inclined surface 39 formed, but a horizontal surface 38 is also formed in a stepped manner. That is, as in the first comparative example, the cuboid 53 is integrated with the inclined cuboid 51 of the second comparative example, and the lower end of the inclined cuboid 51 is narrower than the width of the cuboid 53. Similar to the phosphor 2 manufactured according to the foregoing embodiment, the phosphor 2 manufactured according to this other embodiment of the present invention also has the characteristics of high direct emission and high durability.

[0077] The embodiments of the present invention have been described above. However, as long as those skilled in the art can make various modifications and alterations to the present invention by adding, changing, deleting or adding structural elements without exceeding the scope of the invention's concept as described in the claims, these modifications and alterations will also be included within the scope of the invention's claims.

Claims

1. A method for manufacturing a phosphor, characterized in that, include: Cutting grooves are formed on the upper surface of the phosphor substrate along the grid-like cutting lines; The upper surface with the cutting groove is ground to a uniform thickness to remove the chipped portion formed on the upper surface of the original plate. Fill the aforementioned cutting groove with a fluid adhesive material; Allow the above-mentioned adhesive material to cure; The lower surface grinding step is performed by grinding the opposite bottom surface of the upper surface of the original plate with the above-mentioned cutting groove to a predetermined thickness using a disc-shaped grinding machine, so that the original plate is divided into multiple phosphors that serve as color conversion components for light-emitting diodes. as well as Remove the aforementioned adhesive material, leaving only the segmented individual phosphors; The steps for forming the cutting groove mentioned above include: In the first cutting step of the upper surface, a tapered cutting blade with a width that gradually decreases outward is used to form the aforementioned cutting grooves, such that the sides of each cutting groove are inclined so that the width gradually decreases inward; and In the second cutting step on the upper surface, a deeper cutting groove is formed on the bottom surface of the cutting groove formed in the first cutting step using a flat cutting blade with a constant width. The aforementioned lower surface grinding step is as follows: reducing the thickness of the upper surface with the aforementioned cutting groove relative to the bottom surface, so that each phosphor segmented along the aforementioned cutting line is integrated only by the cured adhesive material; The width of the planar cutting blade used in the second cut on the upper surface is smaller than the width of the outermost part of the tapered cutting blade used in the first cut on the upper surface. From the upper surface of the original plate to the first depth, the cutting groove is formed at an angle so that the width gradually narrows, and is formed to have a second width, the second width being smaller than the first width formed by the tapered cutting blade at the first depth, and is uniformly formed by the planar cutting blade from the first depth to the next second depth; The phosphors obtained by removing the aforementioned binder material include: An inclined portion formed on one side of each phosphor; and A stepped portion continuously formed from the inclined portion on one side of each phosphor.

2. The method for manufacturing a phosphor according to claim 1, characterized in that, The aforementioned adhesive material is wax. In the step of filling the above-mentioned adhesive material, the heated and fluidized wax is filled into the above-mentioned cutting groove. In the above curing step, the wax is left at room temperature for a period of time. In the step of removing the above-mentioned adhesive material, the adhesive material is melted by applying a solvent to it.

3. The method for manufacturing a phosphor according to claim 1, characterized in that, The above-mentioned adhesive material is a UV-cured adhesive material. In the curing step described above, ultraviolet light is applied to the bonding material.

4. The method for manufacturing a phosphor according to claim 1, characterized in that, The aforementioned adhesive material is a synthetic resin. In the step of filling the above-mentioned adhesive material, a heated and fluidized synthetic resin is filled into the above-mentioned cutting groove. In the above curing step, the synthetic resin is placed at room temperature for a period of time. In the step of removing the above-mentioned adhesive material, the adhesive material is melted by applying isopropanol to it.

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