A multifunctional air treatment device

Abstract

The present application relates to a kind of multifunctional air treatment equipment, including body, the inside of the body is hollow, the air inlet and air outlet that are communicated with its inside are set on the body;Metal cover, the air duct that the air inlet and the air outlet are communicated is inside the metal cover;Semiconductor refrigeration piece, be set in air duct, the semiconductor refrigeration piece has hot end and cold end, the hot end and cold end of the semiconductor refrigeration piece are spaced apart on the inner peripheral wall of metal cover along the circumference of metal cover;Water pipe, by the metal material of being able to conduct heat is made, the water pipe is set on the outer peripheral wall of metal cover and along the circumference of metal cover extends.The present application can realize the effect of refrigeration, heating air by setting a group of semiconductor refrigeration piece, by the energy guiding effect of metal cover and water pipe, structure is simplified, can simultaneously realize multiple functions, low in cost.

Description

Technical Field

[0001] This invention relates to the field of air treatment technology, and more specifically to a multifunctional air treatment device. Background Technology

[0002] People spend over 80% of their time indoors each day, and the quality and comfort of the indoor air environment directly affect human health and quality of life. This includes functions such as heating, cooling, dehumidifying, humidifying, and purifying the air. While multi-functional air handling equipment is available on the market, such as air purifiers with added heating and cooling modules, these appliances typically use modules stacked together as needed. These modules are independent of each other, resulting in a complex and bulky design that is inconvenient to place in the home. Furthermore, the excessive number of motors and electrical systems leads to high energy consumption and an increased failure rate.

[0003] To address the aforementioned issues, Chinese invention patent CN201910393153.X (publication number CN110118400 A) discloses a "Multifunctional Air Purification Device and Method Based on Low-Temperature Condensation," which includes a shell. From the center to the edge, the shell is sequentially arranged with a spray chamber, a cold flow channel, and a hot flow channel. A cold and hot flow channel separator and a semiconductor cooling chip are arranged between the cold and hot flow channels. The separator and the semiconductor cooling chip are alternately arranged to form a partition layer with a notch. The notch in the partition layer serves as a diversion port, through which the cold flow channel connects to the hot flow channel. The semiconductor cooling chip has cold-end fins and hot-end fins, located in the cold and hot flow channels respectively. The spray chamber connects to the cold flow channel through a cold flow inlet. The shell is provided with an air inlet and an air outlet. The air inlet connects to the spray chamber, and the air outlet connects to the hot flow channel. An ultrasonic humidifier is installed in the spray chamber. This air purifier integrates multiple functions, including eliminating PM2.5, formaldehyde and other water-soluble pollutants, dehumidifying the air, and humidifying the air.

[0004] However, this air purifier only has the functions of purifying, dehumidifying, and humidifying the air. In summer and winter, it is usually necessary to adjust the air temperature to improve the user's comfort. Therefore, the function of this air purifier needs to be further optimized. In addition, this patent requires multiple semiconductor cooling chips to realize its function, which is costly. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a multifunctional air handling device with a simple structure that can simultaneously achieve cooling and heating functions, in light of the current state of the technology.

[0006] The technical solution adopted by the present invention to solve the above-mentioned technical problems is: a multifunctional air handling device, comprising...

[0007] The body is hollow inside, and the body has an air inlet and an air outlet that are in fluid communication with the interior.

[0008] Its characteristic is that: the body is provided with

[0009] A metal sleeve, the interior of which is an air duct connecting the air inlet and the air outlet;

[0010] A semiconductor cooling device is disposed in an air duct. The semiconductor cooling device has a hot end and a cold end, which are disposed on the inner peripheral wall of a metal sleeve.

[0011] A water pipe, made of a heat-conducting metal, is located on the outer peripheral wall of a metal sleeve and extends circumferentially along the metal sleeve.

[0012] To facilitate better energy exchange between the water in the pipe and the hot and cold ends, the water pipe is spirally wound around the outer wall of the metal sleeve, and the water pipe is wound around the metal sleeve at least twice. This results in a large contact area between the water pipe and the metal sleeve, leading to better heat exchange.

[0013] The water pipe must be connected to the water source. If the water source is located outside the machine body, the water pipe needs to be longer and a perforation needs to be made on the machine body for the water pipe to pass through, which can easily damage the machine body. Therefore, the machine body is also equipped with a water tank that can supply water to the water pipe. The water tank is equipped with a pump body, and the pump body is fluidly connected to the water inlet end of the water pipe.

[0014] To enable the air handling unit to also dehumidify, the pump body is equipped with a regulating valve that controls the flow rate of water entering the water pipe. The hot end of the semiconductor cooling element generates hot air. Air inside the metal sleeve, guided by a fan, flows through the hot end of the semiconductor cooling element, heating the pure air. At this time, the cold end of the semiconductor element absorbs energy. The regulating valve keeps the water flow in the water pipe partially open, allowing some of the energy to be circulated away by the water in the pipe, while the remaining energy stays on the metal sleeve, lowering its temperature. The hot air flowing through the metal sleeve then condenses upon contact with the cold air, thus reducing humidity.

[0015] To prevent condensate from flowing into the machine body and damaging electrical components, a support platform is provided within the machine body. The metal sleeve is mounted on the platform surface, which has an air vent connecting the metal sleeve and the air inlet. A guide hole extends downwards from the platform surface, and the top of the water tank is open and located directly below the guide hole. Condensate forming on the metal sleeve drips onto the platform surface and then flows into the water tank through the guide hole.

[0016] In order to recycle the water in the pipes, the outlet of the pipes is also fluidly connected to the water tank. In this way, the water in the tank enters the pipes and then flows back into the tank, allowing for reuse.

[0017] In order to guide the airflow from the air inlet to the air outlet, a fan is provided in the body. Along the airflow path, the fan is located upstream of the metal sleeve. The air inlet of the fan is fluidly connected to the air outlet, and the air outlet of the fan is fluidly connected to the metal sleeve.

[0018] To enable the air handling unit to also purify the air, a filter is installed between the air inlet and the metal sleeve, positioned along the airflow path. The filter can be a HEPA filter, an activated carbon filter, or a composite of both.

[0019] To enable the air handling unit to also have a humidification function, an atomizer is installed in the water tank, and the atomized water outlet of the atomizer is fluidly connected to the air outlet. When the atomizer is working, water mist is generated and enters the room through the air outlet, thus achieving the effect of humidification.

[0020] To enable the air handling equipment to also sterilize and kill viruses, a conductive wire is installed in the air duct, and a high-voltage transformer is fixed to it within the unit. The conductive wire is electrically connected to the negative terminal of the high-voltage transformer. The high-voltage transformer carries a negative voltage of 10,000V, and the conductive wire, made of steel, continuously generates high-energy ions such as negative ions, hydroxyl ions, and negative oxygen ions under high-voltage stimulation, resulting in a sterilization and virus-killing effect on the air. Furthermore, the sterilization effect is enhanced when the heating function of the semiconductor cooling component is activated, as the temperature rise helps the conductive wire generate high-energy ions, further improving the sterilization effect.

[0021] To increase the concentration of high-energy ions and further improve the sterilization effect, a grounded metal plate is also installed in the air duct. The metal plate, conductive wire, and high-voltage transformer form a closed circuit. Grounding the metal plate provides a low potential for the generation of high-energy ions, while negative ions are at a high potential. The high and low potentials create an electric field, which helps generate negative ions, thereby increasing the ion concentration.

[0022] To improve the mixing degree of high-energy ions and airflow, and further enhance the sterilization effect, a guide vane is provided in the air duct of the metal sleeve. This guide vane extends spirally from one end of the metal sleeve along its axial direction to the other end. Both the metal vane and the conductive wire extend spirally along the extension trajectory of the guide vane, and are respectively located on opposite walls of the guide vane. The electric field guides negative ions towards the grounded end, forming an ion wind. The direction of the ion wind is from bottom to top. The airflow drawn by the fan spirals upwards along the axial direction. During its rotation, the airflow comes into perpendicular contact with the ion wind, causing collisions and thus better mixing. Without the ion wind, negative ions would mostly linger around the conductive wire and would not collide and mix with the airflow drawn by the fan, resulting in poor mixing.

[0023] To further enhance the sterilization effect, the machine body is equipped with a water tank containing an atomizer. The atomized water outlet of the atomizer is fluidly connected to the air duct of the metal sleeve and is located upstream of the airflow path. When the atomization function is activated, the sterilization function is also enhanced because atomization increases the water molecule concentration in the air duct, thus providing raw materials for the generation of high-energy particles. This results in the formation of hydrated negative oxygen ions and a higher concentration of hydroxyl ions, which, while enhancing sterilization capabilities, are released into the air, providing beneficial "air vitamins"—water and oxygen ions—to the human body.

[0024] Compared with the prior art, the advantages of the present invention are: the present invention provides a metal sleeve that connects the air inlet and the air outlet, the air duct formed by the metal sleeve is provided with the hot end and cold end of the semiconductor cooling element, and the outer peripheral wall of the metal sleeve is surrounded by a water pipe that can perform heat exchange.

[0025] When the hot end of the thermoelectric cooler is turned on, the air in the air duct flows through the hot end of the thermoelectric cooler and is heated before entering the room, thus providing heating. At the same time, the water flow in the water pipe is fully open, and the cold end of the thermoelectric cooler absorbs energy and exchanges heat with the water in the water pipe, completing the cooling process. This allows the hot end of the thermoelectric cooler to continuously heat the air.

[0026] When the cold end of the thermoelectric cooler is turned on, the air in the duct flows through the cold end of the thermoelectric cooler, its temperature is lowered, and it enters the room, thus achieving a cooling effect. At the same time, the water flow in the water pipe is fully open, the hot end of the thermoelectric cooler absorbs energy and exchanges heat with the water in the water pipe, completing heat conduction, so that the cold end of the thermoelectric cooler can continuously generate cooling air.

[0027] As can be seen from the above, the present invention can achieve the effects of cooling and heating air by setting a set of semiconductor cooling components and conducting energy through the metal sleeve and water pipe. The structure is simple, can realize multiple functions at the same time, and has low cost. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0029] Figure 2 for Figure 1 A sectional view;

[0030] Figure 3 for Figure 1 A schematic diagram of the structure without the body;

[0031] Figure 4 for Figure 3 A schematic diagram of the structure from another direction;

[0032] Figure 5 for Figure 4 A partial structural diagram;

[0033] Figure 6 for Figure 5 A schematic diagram of the structure without the air guide vanes, conductive wires, and metal sheets;

[0034] Figure 7 for Figure 5 A schematic diagram of the structure of the air guide vane, conductive wire, and metal sheet in the image;

[0035] Figure 8 for Figure 7 A schematic diagram of the decomposition process;

[0036] Figure 9 for Figure 8 A schematic diagram of the air guide vane in the diagram. Detailed Implementation

[0037] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0038] like Figures 1-9 As shown, the multifunctional air handling equipment of this preferred embodiment includes a body 1, which contains a metal sleeve 2, a semiconductor cooling component, a water pipe 4, a water tank 41, a pump body 42, an atomizer 5, an air guide plate 6, a conductive wire 61, a metal sheet 62, a fan 7, a filter, etc.

[0039] like Figure 1 , 2 As shown, the body 1 is hollow inside, and has an air inlet 11 and an air outlet 12 that are in fluid communication with its interior. In this embodiment, the air outlet 12 is located on the top wall of the body 1, and the air inlet 11 is located on the side wall of the body 1. The front of the body 1 is open, and a door 10 is rotatably provided at the opening to facilitate the installation of components inside the body 1.

[0040] like Figure 2As shown, the body 1 is provided with a support platform 9, which is hollow inside. A metal sleeve 2 is set on the platform 91 of the support platform 9. The inside of the metal sleeve 2 is an air duct 20 that connects the air inlet 11 and the air outlet 12. The fan 7 is set in the support platform 9 and located below the platform 91 of the support platform 9. The platform 91 of the support platform 9 is provided with an air outlet 92 for connecting the metal sleeve 2 and the air inlet 11. It can be seen that along the airflow path, the fan 7 is located upstream of the metal sleeve 2. The air inlet of the fan 7 is fluidly connected to the air inlet 11, and the air outlet of the fan 7 is fluidly connected to the air duct 20 of the metal sleeve 2. The fan 7 can adopt an existing structure.

[0041] A filter screen is installed at the bottom of the support platform 9. The filter screen includes a frame 93 and a filter element (not shown in the figure). The frame 93 is fixedly connected to the support platform 9, and the area enclosed by the frame 93 is fluidly connected to the air inlet of the fan 7. The filter element is placed in the area enclosed by the frame 93. The filter screen can be a HEPA filter, an activated carbon filter, or a composite filter of both, which can remove particulate matter and harmful substances such as VOCs and formaldehyde. As can be seen, the filter screen is set between the air inlet 11 and the air duct 20 of the metal sleeve 2. The air entering the unit 1 is first purified by the filter screen and then flows out from the air duct 20 of the metal sleeve 2.

[0042] The semiconductor cooling device has a hot end 31 and a cold end 32, which are disposed on the inner peripheral wall of the metal sleeve 2, i.e., the hot end 31 and cold end 32 are disposed in the air duct 20. The metal sleeve 2 can be made of copper because copper has strong thermal conductivity and low cost, making it suitable for mass production development. If cost is not a consideration, silver is a better material. The semiconductor cooling device can adopt an existing structure, so it will not be described in detail here.

[0043] The air duct 20 of the metal sleeve 2 is provided with an air guide vane 6, which spirally extends from one end of the metal sleeve 2 along the axial direction of the metal sleeve 2 to the other end of the metal sleeve 2. The spiral air guide vane 6 increases the airflow distance, allowing the airflow to make better contact with the hot end 31 and cold end 32 of the semiconductor cooling element, thereby improving the heat exchange effect. The air guide vane 6 is preferably coaxially arranged with the metal sleeve 2.

[0044] like Figure 3 , 4 As shown in Figures 5 and 6, the water pipe 4 is made of a heat-conducting metal. It is recommended that the water pipe 4 be made of a metal, such as copper, because metal has good thermal conductivity and metal pipes are readily available. If availability is not a concern, carbon steel pipes or other pipes with good thermal conductivity can also be used. The metal sleeve 2 is provided with a positioning plate 43 for positioning the water pipe 4. At least two slots 431 are formed along the axial direction of the metal sleeve 2 on the wall surface of the positioning plate 43 facing the water pipe 4. The water pipe 4 is partially and correspondingly engaged in the slots 431. To avoid affecting the heat exchange of the water pipe 4, the positioning plate 43 is preferably also made of metal.

[0045] The water pipe 4 is disposed on the outer peripheral wall of the metal sleeve 2 and extends along the circumference of the metal sleeve 2. In this embodiment, the water pipe 4 is spirally wound on the outer peripheral wall of the metal sleeve 2, and the water pipe 4 is wound on the metal sleeve 2 at least twice. In this way, the contact area between the water pipe 4 and the metal sleeve 2 is large, and the heat exchange effect is good.

[0046] Water tank 41 is installed on the bottom wall of the machine body 1. Water tank 41 is used to supply water to water pipe 4. Water tank 41 needs to be offset from air inlet 11 to prevent water tank 41 from blocking airflow into machine body 1. Pump body 42 is installed in water tank 41. Pump body 42 is fluidly connected to the water inlet end of water pipe 4, and water outlet end of water pipe 4 is fluidly connected to water tank 41. In this way, water in water tank 41 is pumped into water pipe 4 by pump body 42 and then flows back into water tank 41, which can be reused.

[0047] The pump body 42 is equipped with a regulating valve that can control the flow rate of water entering the water pipe 4, so that the flow rate of water in the water pipe 4 is in a half-open or fully open state. The pump body 42 and the regulating valve can adopt existing structures, which will not be described in detail here.

[0048] The working process of the air handling equipment in this embodiment is as follows:

[0049] Heating: When the hot end 31 of the semiconductor cooling device is turned on, the air in the air duct 20 is heated as it flows through the hot end 31 of the semiconductor cooling device and enters the room, thus playing a role in heating. At this time, the water flow in the water pipe 4 is fully opened under the control of the regulating valve. The cold end 32 of the semiconductor cooling device absorbs energy and exchanges heat with the water in the water pipe 4 to complete the cooling, so that the hot end 31 of the semiconductor cooling device can continuously generate the effect of heating the air.

[0050] Cooling: When the cold end 32 of the semiconductor cooling device is turned on, the air in the air duct 20 is cooled as it flows through the cold end 32 of the semiconductor cooling device and enters the room, thus achieving the effect of cooling. At this time, the water pipe 4 is fully opened under the control of the regulating valve. The hot end 31 of the semiconductor cooling device absorbs energy and exchanges heat with the water in the water pipe 4 to complete the heat conduction, so that the cold end 32 of the semiconductor cooling device can continuously generate the effect of cooling air.

[0051] Dehumidification: The hot end 31 of the semiconductor cooling device generates hot air. When the air in the air duct 20 flows through the hot end 31 of the semiconductor cooling device, the air is heated. At this time, the cold end 32 of the semiconductor device absorbs energy. The regulating valve makes the water flow in the water pipe 4 half open. Part of the energy is carried away by the water circulation in the water pipe 4, and the other part remains on the metal sleeve 2, which lowers the temperature of the metal sleeve 2. At this time, the hot air flows through the metal sleeve 2 and produces condensation when it encounters the cold air, thus achieving the effect of reducing humidity.

[0052] To prevent condensate from flowing into the machine body 1 and damaging electrical components, such as... Figure 4As shown, a guide hole 94 extends downward from the platform 91 on the support platform 9, and the top of the water tank 41 is open and located directly below the guide hole 94. In this way, the condensate formed on the metal sleeve 2 drips onto the platform 91 and then flows into the water tank 41 along the guide hole 94.

[0053] In addition, the water tank 41 is equipped with an atomizer 5, and the atomized water outlet of the atomizer 5 is in fluid communication with the air outlet 12. When the atomizer 5 is working, water mist is generated and enters the room through the air outlet 12, thus humidifying the room. The atomizer 5 can adopt existing structures, such as ultrasonic atomization, which will not be described in detail here.

[0054] The air handling equipment in this embodiment also has a sterilization function:

[0055] like Figure 4 , 7 As shown in Figure 9, a conductive wire 61 is provided on the air guide vane 6. A high-voltage transformer 8 is also fixed to it within the body 1. The high-voltage transformer 8 is fixedly mounted on the platform 91 of the support base 9. The conductive wire 61 is electrically connected to the negative terminal of the high-voltage transformer 8. The high-voltage transformer 8 carries a negative voltage of 10000V. The conductive wire 61 is made of steel wire and can continuously generate high-energy ions such as negative ions, hydroxyl ions, and negative oxygen ions under high-voltage stimulation, producing a sterilization and virus-killing effect on the air. Furthermore, the sterilization effect is even stronger when the heating function of the semiconductor cooling component is activated, because the temperature rise helps the conductive wire 61 generate high-energy ions, further enhancing the sterilization effect.

[0056] The air guide vane 6 is also equipped with a groundable metal sheet 62. The metal sheet 62 can be made of aluminum. The metal sheet 62, the conductive wire 61, and the high-voltage transformer 8 can form a closed circuit. In this embodiment, both the metal sheet 62 and the conductive wire 61 extend spirally along the extension trajectory of the air guide vane 6, and the conductive wire 61 and the metal sheet 62 are respectively disposed on opposite wall surfaces of the air guide vane 6. Figure 7 In the direction of the air guide plate 6, the metal sheet 62 is set on the lower end face of the air guide plate 6, and multiple mounting brackets 63 are spaced apart along its extension direction on the upper end face of the air guide plate 6. The conductive wire 61 passes through and is positioned on the mounting bracket 63. The structure of the conductive wire 61 being electrically connected to the high voltage transformer 8 and the metal sheet 62 being grounded can both adopt conventional technology, and will not be described in detail here.

[0057] After the metal plate 62 is grounded, it provides a low potential for the generation of high-energy ions, while negative ions are at a high potential. The high and low potentials form an electric field, which helps generate negative ions and thus increases the ion concentration. In addition, the electric field guides negative ions towards the grounded end, forming an ion wind. The direction of the ion wind is from bottom to top (between the two layers of the air guide plate 6, with the metal plate 62 located above the conductive wire 61). The airflow drawn by the fan 7 spirals upward along the axial direction of the air duct 20. During the rotation, the airflow comes into perpendicular contact with the ion wind, and the two collide, resulting in better mixing. Without the ion wind, negative ions would mostly surround the conductive wire 61 and would not be able to collide and mix with the airflow drawn by the fan 7, resulting in poor mixing and affecting the sterilization effect of the airflow.

[0058] The atomizing water outlet of the atomizer 5 is in fluid communication with the air duct 20 of the metal sleeve 2, and is located upstream of the airflow path. When the atomization function is activated, the sterilization function is also enhanced because atomization increases the water molecule concentration in the air duct 20, thereby providing raw materials for the generation of high-energy particles, which in turn form hydrated negative oxygen ions and higher concentrations of hydroxyl ions. While enhancing the sterilization ability, these are released into the air, providing "air vitamins" such as water and oxygen ions that are beneficial to human health.

[0059] As can be seen from the above, the air handling equipment in this embodiment utilizes the principle that when the cold end of a semiconductor refrigeration device cools or the hot end heats, a reaction energy change will occur at the other end. To avoid this energy change affecting the user's needs, a metal sleeve 2 is designed to fix the cold end 32 and the hot end 31 of the semiconductor refrigeration device, and the cold end 32 and the hot end 31 are placed opposite each other. A water pipe 4 is provided outside the metal sleeve 2 to conduct away the reaction energy generated by the hot end 31 or the cold end 32 of the semiconductor refrigeration device. Thus, a simple structure can simultaneously achieve the functions of cooling, heating, dehumidification, humidification, sterilization, and air purification. It is low in cost, has a simple structure, and will not cause defects such as excessively large models or complex components.

[0060] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Since the embodiments disclosed in this invention can be arranged in different directions, these terms indicating direction are only for illustration and should not be regarded as limitations. For example, "upper" and "lower" are not necessarily limited to directions opposite to or consistent with the direction of gravity.

[0061] The term "fluid connectivity" as used in this invention refers to the spatial relationship between two components or parts (hereinafter collectively referred to as the first part and the second part, respectively). Specifically, it means that a fluid (gas, liquid, or a mixture of both) can flow from the first part along a flow path and / or be transported to the second part. This can be a direct connection between the first and second parts, or an indirect connection between them through at least one third party. This third party can be a fluid channel such as a pipe, channel, conduit, flow guide, hole, or groove, or a chamber or a combination thereof that allows fluid flow.

Claims

1. A multifunctional air handling unit, comprising: The body (1) is hollow inside, and the body (1) is provided with an air inlet (11) and an air outlet (12) that are in fluid communication with the interior. Its features are: The body (1) is provided with Metal sleeve (2), the interior of which is an air duct (20) connecting the air inlet (11) and the air outlet (12); A semiconductor cooling device is disposed in the air duct (20). The semiconductor cooling device has a hot end (31) and a cold end (32). The hot end (31) and the cold end (32) of the semiconductor cooling device are disposed on the inner peripheral wall of the metal sleeve (2). Water pipe (4) is made of a heat-conducting metal material and is located on the outer peripheral wall of the metal sleeve (2) and extends along the circumference of the metal sleeve (2); The air duct (20) of the metal sleeve (2) is provided with an air guide plate (6), which extends spirally from one end of the metal sleeve (2) along the axial direction of the metal sleeve (2) to the other end of the metal sleeve (2); The metal sleeve (2) has a conductive wire (61) in its air duct (20), and the body (1) also has a high voltage transformer (8) fixed to it. The conductive wire (61) is electrically connected to the negative terminal of the high voltage transformer (8). The air duct (20) of the metal sleeve (2) is also provided with a groundable metal sheet (62), which can form a closed circuit with the conductive wire (61) and the high voltage transformer (8); The metal sheet (62) and the conductive wire (61) extend spirally along the extension trajectory of the air guide plate (6), and the conductive wire (61) and the metal sheet (62) are respectively disposed on opposite wall surfaces of the air guide plate (6).

2. The multifunctional air handling equipment according to claim 1, characterized in that: The water pipe (4) is spirally wound around the outer peripheral wall of the metal sleeve (2), and the water pipe (4) is wound around the metal sleeve (2) for at least two turns.

3. The multifunctional air handling equipment according to claim 1, characterized in that: The machine body (1) is also provided with a water tank (41), and the water tank (41) is provided with a pump body (42), which is in fluid communication with the water inlet end of the water pipe (4).

4. The multifunctional air handling equipment according to claim 3, characterized in that: The pump body (42) is equipped with a regulating valve that can control the flow rate of water entering the water pipe (4).

5. The multifunctional air handling equipment according to claim 4, characterized in that: The body (1) is also provided with a support platform (9), the metal sleeve (2) is installed on the table surface (91) of the support platform (9), the table surface (91) of the support platform (9) is provided with an air passage (92) for connecting the metal sleeve (2) and the air inlet (11), the support platform (9) extends downward from the table surface (91) to form a guide hole (94), the top of the water tank (41) is open and located directly below the guide hole (94).

6. The multifunctional air handling equipment according to claim 3, characterized in that: The outlet of the water pipe (4) is also in fluid communication with the water tank (41).

7. The multifunctional air handling equipment according to claim 1, characterized in that: The body (1) is equipped with a fan (7). Along the airflow path, the fan (7) is located upstream of the metal sleeve (2). The air inlet and air outlet (11) of the fan (7) are fluidly connected. The air outlet of the fan (7) is fluidly connected to the air duct (20) of the metal sleeve (2).

8. The multifunctional air handling equipment according to claim 1, characterized in that: The air inlet (11) and the metal sleeve (2) are equipped with filters located in the airflow path.

9. The multifunctional air handling device according to any one of claims 3 to 6, characterized in that: The water tank (41) is equipped with an atomizer (5), and the atomized water outlet of the atomizer (5) is in fluid communication with the air outlet (12).

10. The multifunctional air handling equipment according to claim 1, characterized in that: The body (1) is provided with a water tank (41), and the water tank (41) is provided with an atomizer (5). The atomized water outlet of the atomizer (5) is in fluid communication with the air duct (20) of the metal sleeve (2) and along the airflow path, the atomizer (5) is located upstream of the air duct (20).

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