Carrying mechanism with adjustment function and deposition machine

Abstract

The present application is a kind of bearing mechanism with adjustment function, which is suitable for a deposition machine, mainly comprising a bearing disc and a plurality of adjustable alignment devices. The adjustable alignment devices are located around the bearing disc and comprise a seat body and an alignment pin, wherein the alignment pin is used to align the cover ring of the deposition machine. The alignment pin is connected to the bearing disc through the seat body, wherein the alignment pin and the seat body can be displaced relative to the bearing disc, and the position of the alignment pin can be adjusted. In addition, an alignment jig can be placed on the bearing disc, and the adjustable alignment devices around the bearing disc can be aligned to adjust the alignment pin to a predetermined position, which is beneficial to improve the accuracy of the alignment pin aligning the cover ring and improve the stability of the deposition process.

Description

Technical Field

[0001] This invention relates to a support mechanism with adjustment function, suitable for a deposition machine, which helps to improve the accuracy of the alignment pin and the alignment cover ring, thereby improving the stability of the deposition process. Background Technology

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) are all commonly used deposition equipment and are widely used in the manufacturing processes of integrated circuits, light-emitting diodes, and displays.

[0003] The deposition equipment mainly includes a cavity and a support disk, wherein the support disk is located in the cavity and is used to support at least one wafer. Taking physical vapor deposition as an example, a target needs to be placed in the cavity, with the target facing the wafer on the support disk.

[0004] During physical vapor deposition (PVD), a clamp ring secures the wafer to a carrier disk, and inert gas and / or reactive gas are delivered into the cavity. Bias voltages are applied to both the target and the carrier disk, while the carrier disk also heats the wafer. The inert gas within the cavity is ionized by the high-voltage electric field. This ionized inert gas is attracted to the target by the bias voltage and bombards it. Target atoms or molecules sputtered from the target are attracted by the bias voltage on the carrier disk and deposited on the surface of the heated wafer, forming a thin film. Summary of the Invention

[0005] The invention proposes a novel carrier mechanism with adjustment function, including several adjustable alignment devices. Before the deposition process, the positions of each adjustable alignment device can be positioned and adjusted to avoid the alignment devices of the carrier mechanism being in different positions in different batches, which would affect the stability of the deposition process.

[0006] One objective of this invention is to provide a support mechanism with an adjustment function, which mainly includes a support plate and several adjustable alignment devices, wherein the adjustable alignment devices are located around the support plate and can be displaced relative to the support plate, so as to facilitate the user to adjust and correct the position of each adjustable alignment device.

[0007] In practical applications, positioning fixtures of the same or identical specifications can be placed on the carrier plate, and each adjustable alignment device can be positioned separately using the positioning parts of the positioning fixture. Then, each adjustable alignment device is fixed on the carrier plate. In this way, the adjustable alignment devices on different carrier mechanisms are all located in the same position, which helps to improve the accuracy of the alignment of the adjustable alignment device with the cover ring and can improve the stability of the deposition process.

[0008] To achieve the above objectives, the present invention proposes an adjustable support mechanism suitable for a deposition stage. The deposition stage includes a cover ring for covering and fixing a wafer placed on the adjustable support mechanism. The mechanism includes: a support disk with a support surface and at least one positioning hole, wherein the positioning hole is located on the support surface, and the wafer is placed on the support surface and covers the positioning hole; and a plurality of adjustable alignment devices located around the support surface of the support disk, including: a base connected to the support disk; a pair of alignment pins, base bodies for aligning the cover ring of the deposition stage and moving with the base body relative to the support surface of the support disk; and at least one fixing unit connected to the support disk via the base body to fix the base body on the support disk and fix the position of the alignment pins.

[0009] This invention proposes another deposition stage, comprising: a cavity including a receiving space; a stop member located within the receiving space of the cavity, wherein one end of the stop member is connected to the cavity, and the other end of the stop member forms an annular protrusion; a cover ring placed on the annular protrusion of the stop member and including a pair of alignment grooves; and a carrier mechanism with adjustment function located within the receiving space, comprising: a carrier plate including a carrier surface and at least one positioning hole, wherein the positioning hole is located on the carrier surface, and the wafer is used to place on the carrier surface and cover the positioning hole on the carrier surface; a plurality of adjustable alignment devices located around the carrier surface of the carrier plate and including: a base body connected to the carrier plate; a pair of alignment pins, a base body used to align the cover ring and displace with the base body relative to the carrier surface of the carrier plate; and at least one fixing unit connected to the carrier plate via the base body to fix the base body on the carrier plate and fix the position of the alignment pins.

[0010] In at least one embodiment of the present invention, the carrier plate includes a plurality of grooves arranged around the carrier surface, and the adjustable alignment device is disposed in the grooves.

[0011] In at least one embodiment of the present invention, a guide rail is provided between the groove and the seat of the adjustable alignment device, and the seat is displaced along the guide rail relative to the bearing surface of the bearing plate.

[0012] In at least one embodiment of the present invention, a positioning fixture is included for connecting a carrier plate and positioning an adjustable alignment device. The positioning fixture includes: a plate; a plurality of alignment portions disposed on the plate, wherein each alignment portion includes: a pair of alignment pin positioning holes located on the plate; at least one through hole located on the plate, wherein when the positioning fixture is connected to the carrier plate, the alignment pins of each adjustable alignment device are located in the alignment pin positioning holes of each alignment portion, and the fixing unit faces the through hole of the alignment portion; and a positioning unit for inserting into the positioning hole of the carrier plate to complete the positioning of the positioning fixture and the carrier plate.

[0013] In at least one embodiment of the present invention, the positioning unit is a protrusion and is disposed on the plate of the positioning fixture.

[0014] In at least one embodiment of the present invention, the plate includes a positioning perforation, and the positioning unit is used to pass through the positioning perforation of the plate and be inserted into the positioning hole of the carrier plate.

[0015] In at least one embodiment of the present invention, the carrier plate includes at least one fixing hole, and the base body is provided with at least one connecting through hole. The fixing unit is used to pass through the connecting through hole of the base body and connect to the fixing hole of the carrier plate to fix the base body to the carrier plate.

[0016] In at least one embodiment of the present invention, the fixing unit includes a rod and a head, the rod of the fixing unit passes through the connecting hole of the base and is connected to the fixing hole of the bearing plate, wherein the cross-sectional area of ​​the connecting hole of the base is larger than the cross-sectional area of ​​the rod of the fixing unit.

[0017] The beneficial effects of the present invention are: it provides a novel carrier mechanism with adjustment function, including several adjustable alignment devices. Before the deposition process, the position of each adjustable alignment device can be positioned and adjusted to avoid the position of the alignment devices of the carrier mechanism produced in different batches being different, which would affect the stability of the deposition process. Attached Figure Description

[0018] Figure 1 This is a perspective view of an embodiment of the adjustable support mechanism of the present invention.

[0019] Figure 2 This is a perspective view of one embodiment of the adjustable bearing mechanism of the present invention during positioning.

[0020] Figure 3 This is an exploded perspective view of an embodiment of the adjustable alignment device of the present invention.

[0021] Figure 4 This is a cross-sectional schematic diagram of an embodiment of the adjustable bearing mechanism of the present invention during positioning.

[0022] Figure 5 This is a cross-sectional schematic diagram of an embodiment of the deposition equipment of the present invention.

[0023] Explanation of reference numerals in the attached drawings: 10 - Adjustable support mechanism; 11 - Support plate; 111 - Support surface; 113 - Positioning hole; 115 - Groove; 1151 - Fixing hole; 1153 - Guide rail; 117 - Connecting ring; 12 - Wafer; 13 - Adjustable alignment device; 131 - Base; 1311 - Guide groove; 132 - Connecting through hole; 133 - Alignment pin; 135 - Fixing unit; 1351 - Rod; 1353 - Head; 15 - Positioning fixture Tool; 151-plate; 152-cutout; 153-alignment part; 1531-alignment pin positioning hole; 1533-perforation; 155-positioning unit; 157-positioning perforation; 17-ring component; 20-depositioning stage; 21-cavity; 211-wafer entry / exit position; 22-accommodation space; 23-stop; 231-ring protrusion; 232-opening; 24-lifting unit; 25-covering ring; 251-alignment groove; 27-target material. Detailed Implementation

[0024] Please see Figure 1 and Figure 2 These are, respectively, a perspective view of an embodiment of the adjustable support mechanism of the present invention and a perspective view of positioning. The adjustable support mechanism 10 of the present invention is suitable for... Figure 5 The deposition stage 20 shown mainly includes at least one carrier plate 11 and several adjustable alignment devices 13. The carrier plate 11 includes a carrier surface 111 for carrying at least one wafer 12, while the adjustable alignment devices 13 are located around the carrier surface 111 of the carrier plate 11.

[0025] like Figure 1 As shown, the carrier surface 111 of the carrier disk 11 is provided with at least one positioning hole 113. When the wafer 12 is placed on the carrier surface 111, it will block the positioning hole 113 on the carrier surface 111. In this embodiment of the invention, the shape of the carrier surface 111 is similar to that of the wafer 12, for example, approximately circular, and the number of positioning holes 113 is one, which is located at the center or center of the carrier surface 111. In another embodiment of the invention, the number of positioning holes 113 may also be several.

[0026] like Figure 1 and Figure 3 As shown, the adjustable alignment device 13 includes a base 131, a pair of alignment pins 133, and at least one fixing unit 135, wherein the base 131 is used to connect to the carrier plate 11. Specifically, a plurality of grooves 115 may be arranged around the bearing surface 111 of the carrier plate 11, and each adjustable alignment device 13 is respectively disposed in each groove 115 and connected to the groove 115 of the carrier plate 11 via the base 131.

[0027] The aligning pin 133 is positioned on the base body 131 and will move with the base body 131 relative to the bearing surface 111 of the bearing disk 11. For example, the aligning pin 133 is disposed on the upper surface of the base body 131. When the base body 131 is disposed in the groove 115 of the bearing disk 11, the aligning pin 133 will protrude axially along the parallel bearing surface 111. Figure 5 As shown, when the adjustable support mechanism 10 is applied to the deposition stage 20, the cover ring 25 of the deposition stage 20 can be aligned by the alignment pin 133. The detailed structure and alignment method will be described in the following embodiments.

[0028] The fixing unit 135 is connected to the carrier plate 11 via the base 131 and is used to fix the base 131 on the carrier plate 11 to fix the position of the alignment pin 133 set on the base 131. The fixing unit 135 includes a rod 1351 and a head 1353, wherein the rod 1351 is connected to the head 1353, and the cross-sectional area of ​​the head 1353 is larger than that of the rod 1351. For example, the fixing unit 135 can be a screw, wherein the rod 1351 is a screw rod.

[0029] The carrier plate 11 may be provided with at least one fixing hole 1151, for example, the fixing hole 1151 may be provided in the groove 115, while the base 131 is provided with at least one connecting through hole 132. When the base 131 is placed in the groove 115 of the carrier plate 11, the connecting through hole 132 of the base 131 can be aligned with the fixing hole 1151 of the groove 115. Then the rod 1351 of the fixing unit 135 is passed through the connecting through hole 132 of the base 131 and connected to the fixing hole 1151 of the groove 115.

[0030] In one embodiment of the present invention, the cross-sectional area of ​​the connecting hole 132 of the base 131 can be larger than the cross-sectional area of ​​the rod 1351 of the fixing unit 135 and the fixing hole 1151 of the groove 115, while the cross-sectional area of ​​the head 1353 of the fixing unit 135 is larger than the connecting hole 132 of the base 131. For example, the cross-section of the connecting hole 132 can be circular or elongated. When the cross-section of the connecting hole 132 is elongated, the length direction of the connecting hole 132 can be arranged radially along the bearing surface 111. When the rod 1351 of the fixing unit 135 passes through the connecting hole 132 of the base 131, the base 131 can still be displaced relative to the fixing unit 135 and the bearing plate 11, and the position of the alignment pin 133 on the base 131 can be adjusted to align and adjust the alignment pin 133.

[0031] After the alignment pin 133 is aligned, the fixing unit 135 can be further tightened, so that the head 1353 of the fixing unit 135 presses against the seat 131 to fix the seat 131 in the fixed position of the carrier plate 11. In a preferred embodiment of the present invention, there may be two fixing units 135, connecting through holes 132 and fixing holes 1151, which are located on both sides of the alignment pin 133, which is beneficial to fix the seat 131 more stably on the carrier plate 11.

[0032] In one embodiment of the present invention, at least one guide rail 1153 may be provided between the seat 131 and the groove 115 of the bearing disk 11. The seat 131 may be displaced along the guide rail 1153 relative to the bearing surface 111 of the bearing disk 11, for example, by radial displacement along the bearing surface 111. Specifically, the guide rail 1153 may be provided on the groove 115, and a corresponding guide groove 1311 may be provided on the seat 131. For example, the guide rail 1153 may be an elongated protrusion provided on the bottom or side of the groove 115, while the guide groove 1311 may be an elongated groove provided on the bottom or side of the seat 131. In other embodiments, the guide rail 1153 may also be provided on the seat 131, and the guide groove 1311 may be provided on the groove 115 of the bearing disk 11.

[0033] In one embodiment of the present invention, the carrier plate 11 may include a connecting ring 117, which is sleeved on the carrier plate 11. The connecting ring 117 surrounds the bearing surface 111 of the carrier plate 11 and can be fixed to the carrier plate 11 by screws. An adjustable alignment device 13 may be disposed on the connecting ring 117 and surround the bearing surface 111 of the carrier plate 11. For example, a groove 115 may be disposed on the connecting ring 117, and the adjustable alignment device 13 may be disposed within the groove 115 of the connecting ring 117.

[0034] like Figure 1 , Figure 2 and Figure 4 As shown, the adjustable bearing mechanism 10 includes a positioning fixture 15 for connecting the bearing plate 11. The positioning fixture 15 can be used to position the positions of each adjustable alignment device 13 on the bearing plate 11 and adjust the alignment pins 133 of each adjustable alignment device 13 to a predetermined position.

[0035] The positioning fixture 15 includes a plate 151, a plurality of alignment portions 153, and at least one positioning unit 155. The alignment portions 153 are disposed on the plate 151, for example, in the peripheral area of ​​the plate 151. The positioning unit 155 is used to insert into the positioning hole 113 of the carrier plate 11 to complete the positioning between the positioning fixture 15 and the carrier plate 11.

[0036] In one embodiment of the present invention, the plate 151 is approximately circular in shape, and the positioning unit 155 is a rod-shaped pin with a positioning through hole 157 at the center or center of the plate 151. Furthermore, several hollow portions 152 can be provided on the plate 151 to reduce the weight of the positioning fixture 15.

[0037] When using the positioning fixture 15 to align the adjustable alignment device 13 on the carrier plate 11, the positioning through hole 157 of the plate 151 can be aligned with the positioning hole 113 on the carrier plate 11. Then, the positioning unit 155 is passed through the positioning through hole 157 of the plate 151 and inserted into the positioning hole 113 of the carrier plate 11 to complete the positioning between the positioning fixture 15 and the carrier plate 11.

[0038] In another embodiment of the present invention, the positioning unit 155 may be a protrusion disposed on the plate 151, for example, disposed on the lower surface of the plate 151 and facing the bearing surface 111 of the bearing disk 11. When the positioning fixture 15 is placed on the bearing disk 11, the positioning unit 155 of the positioning fixture 15 may be inserted into the positioning hole 113 of the bearing disk 11, thereby completing the positioning of the positioning fixture 15 and the bearing disk 11. Furthermore, in the above embodiment, the number of positioning units 155 and / or positioning through holes 157 is one; in practical applications, the number of positioning units 155 and / or positioning through holes 157 may also be multiple.

[0039] The number of grooves 115 and adjustable alignment devices 13 on the carrier plate 11 is the same as the number of alignment parts 153 on the positioning fixture 15. When the positioning fixture 15 is placed on the carrier plate 11, each adjustable alignment device 13 on the carrier plate 11 will be aligned with the alignment part 153 on the positioning fixture 15.

[0040] The alignment part 153 may include a pair of positioning pin holes 1531 and at least one through hole 1533, wherein the positioning pin holes 1531 and the through hole 1533 are located on the plate 151. For example, the through hole 1533 may penetrate the top and bottom surfaces of the plate 151, and the positioning pin holes 1531 may penetrate the top and bottom surfaces of the plate 151, or may be grooves provided on the bottom surface of the plate 151. In addition, the number of positioning pin holes 1531 is the same as the number of positioning pins 133 in the adjustable alignment device 13, and the number of through holes 1533 is the same as the number of fixing units 135. For example, the number of through holes 1533 may be two, located on both sides of the positioning pin holes 1531.

[0041] In one embodiment of the present invention, the cross-sectional area of ​​the positioning pin positioning hole 1531 is similar to or the largest cross-sectional area of ​​the positioning pin 133. When positioning the adjustable positioning device 13 on the carrier plate 11 by the positioning fixture 15, the fixing unit 135 of the adjustable positioning device 13 can be loosened or removed first, so that the seat 131 and the positioning pin 133 of the adjustable positioning device 13 can be displaced relative to the carrier plate 11, for example, displaced relative to the bearing surface 111 of the carrier plate 11 along the guide rail 1153.

[0042] Then, the positioning fixture 15 is placed on the carrier plate 11, and the two are aligned using the positioning unit 155, such as... Figure 2 and Figure 4 As shown. The alignment pin 133 is located within the alignment pin positioning hole 1531 of the positioning fixture 15, while the fixing unit 135 is either a through hole 1533 facing the alignment part 153 or located within the through hole 1533. Since the cross-sectional area of ​​the alignment pin positioning hole 1531 and the alignment pin 133 are similar, the alignment pin positioning hole 1531 guides the alignment pin 133 and the seat 131 to a predetermined position.

[0043] In another embodiment of the present invention, the cross-sectional area of ​​the positioning pin positioning hole 1531 can be slightly larger than that of the positioning pin 133. During the positioning of the positioning pin 133, the positioning pin 133 can be made to fit tightly against the inner edge of the positioning pin positioning hole 1531, and the positioning of the positioning pin 133 can also be completed.

[0044] After the positioning pin 133 is positioned, the fixing unit 135 can be locked onto the fixing hole 1151 of the base 131 and the carrier plate 11 through the through hole 1533 of the positioning fixture 15. For example, the head 1353 of the fixing unit 135 can be pressed against the base 131 to fix the base 131 and the positioning pin 133 onto the carrier plate 11. In one embodiment of the present invention, the fixing unit 135 can be a screw, and a screwdriver passes through the through hole 1533 on the plate 151 to lock the fixing unit 135 onto the fixing hole 1151 of the carrier plate 11. Specifically, the through hole 1533 on the plate 151 is the working space for the locking tool to lock or loosen the fixing unit 135.

[0045] In one embodiment of the present invention, such as Figure 1 and Figure 4 As shown, an annular member 17 may be provided around the bearing surface 111 of the bearing plate 11, wherein the annular member 17 may be located between the bearing surface 111 and the positioning pin 133.

[0046] Please see Figure 5This is a cross-sectional schematic diagram of an embodiment of the deposition stage of the present invention. The deposition stage 20 includes a cavity 21, a stop 23, a cover ring 25, and a support mechanism 10 with adjustment function, wherein the cavity 21 has an accommodating space 22, and the stop 23, the cover ring 25, and the support mechanism 10 with adjustment function are disposed within the accommodating space 22 of the cavity 21.

[0047] One end of the baffle 23 is connected to the cavity 21, while the other end forms an annular protrusion 231 in the accommodating space 22, and an opening 232 is formed on the inner side of the annular protrusion 231. For example, the annular protrusion 231 can be a hollow column.

[0048] The cover ring 25 has an annular structure, wherein the diameter of the cover ring 25 is larger than the opening 232, and is used to rest on the annular protrusion 231 of the stop 23. At least one pair of alignment grooves 251 may be provided on the surface of the cover ring 25 facing the carrier plate 11.

[0049] The adjustable support mechanism 10 is located on the vertical projection of the opening 232 formed by the stop 23, and the detailed structure of the adjustable support mechanism 10 is as follows: Figure 1 , Figure 2 , Figure 3 , Figure 4 As described above, wafer 12 can be placed on the carrier surface 111 of carrier disk 11 and cover the positioning hole 113 on carrier surface 111.

[0050] The carrier plate 11 can be connected to a lifting unit 24, and the lifting unit 24 can drive the carrier plate 11 and the wafer 12 to move relative to the stop 23 and the cover ring 25. For example, the lifting unit 24 can be a linear actuator.

[0051] In practical applications, the lifting unit 24 can drive the carrier plate 11 located below the stop 23 and the cover ring 25 to approach the stop 23 and the cover ring 25 from below. For example, the carrier plate 11 can be located at the wafer entry / exit position 211, and the lifting unit 24 can drive the carrier plate 11 and the wafer 12 to move from the wafer entry / exit position 211 toward the stop 23 and the cover ring 25.

[0052] The lifting unit 24 continuously drives the carrier plate 11 through the opening 232 formed by the stop member 23, so that the alignment pin 133 of the adjustable alignment device 13 contacts the alignment groove 251 at the bottom of the cover ring 25. During the process of contacting the alignment groove 251, the alignment pin 133 guides the cover ring 25 to a predetermined position on the carrier plate 11, so that the cover ring 25 covers the edge of the wafer 12 and fixes the wafer 12 placed on the carrier plate 11.

[0053] In one embodiment of the present invention, the top of the alignment pin 133 has an inclined surface, such that the cross-sectional area of ​​the top of the alignment pin 133 is smaller than that of the bottom. During the alignment process, the inclined surface of the top of the alignment pin 133 first contacts the alignment groove 251 of the cover ring 25, and guides the cover ring 25 through the alignment groove 251 and the alignment pin 133, so that the alignment pin 133 enters into the alignment groove 251. Then, the vertical surface of the alignment groove 251 aligns with the vertical surface of the bottom of the alignment pin 133, and the alignment between the cover ring 25 and the carrier disk 11 is completed. The aligned cover ring 25 covers the edge of the wafer 12 on the carrier disk 11 and covers the annular member 17 located between the carrier surface 111 and the alignment pin 133.

[0054] However, in practical applications, errors during manufacturing often result in differences in the position of the alignment pins 133 on the carrier disks 11 produced in different batches. This causes the alignment pins 133 on different carrier disks 11 to have different alignment positions with the same cover ring 25, which in turn leads to differences in the deposition process conditions.

[0055] To address the aforementioned problems, the present invention proposes a support mechanism 10 with an adjustment function, and a deposition stage 20 employing this support mechanism 10. For example... Figure 1 , Figure 2 and Figure 4 As described above, before performing the deposition process, the user can use the same positioning fixture 15 to position the positions of each alignment pin 133 on the carrier plate 11, so that the alignment pins 133 on each carrier plate 11 are in the same position, thereby avoiding problems caused by tolerances during manufacturing.

[0056] In one embodiment of the present invention, the deposition stage 20 may be a physical vapor deposition apparatus, and a target 27 is disposed in the cavity 21, wherein the target 27 faces the bearing surface 111 of the bearing disk 11 and / or the wafer 12.

[0057] Advantages of this invention:

[0058] A novel adjustable support mechanism is provided, comprising several adjustable alignment devices. Before the deposition process, the positions of each adjustable alignment device can be positioned and adjusted to avoid the alignment devices of the support mechanism produced in different batches being in different positions, thus affecting the stability of the deposition process.

[0059] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A load-bearing mechanism with an adjustment function, characterized in that, A deposition equipment includes a cover ring for covering and securing a wafer placed on an adjustable support mechanism. The equipment comprises: a support tray including a support surface and at least one positioning hole located on the support surface, wherein the wafer is placed on the support surface and covers the positioning hole; and a plurality of adjustable alignment devices located around the support surface of the support tray, including: a base connected to the support tray; alignment pins connected to the base for aligning the cover ring of the deposition equipment and moving with the base relative to the support surface of the support tray; and at least one fixing unit connected to the support tray via the base. The fixture is configured to fix the base to the carrier plate and fix the position of the alignment pin; a positioning fixture is configured to connect the carrier plate and position the adjustable alignment device, the positioning fixture comprising: a plate; a plurality of alignment portions disposed on the plate, wherein each alignment portion includes: alignment pin positioning holes located on the plate; at least one through hole located on the plate, wherein when the positioning fixture is connected to the carrier plate, the alignment pins of each adjustable alignment device will be located in the alignment pin positioning holes of each alignment portion, and the fixing unit faces the through hole of the alignment portion; and a positioning unit is configured to be inserted into the positioning hole of the carrier plate to position the positioning fixture and the carrier plate.

2. The adjustable bearing mechanism according to claim 1, characterized in that, The carrier plate includes several grooves arranged around the carrier surface, and the adjustable alignment device is disposed in the grooves.

3. The adjustable bearing mechanism according to claim 2, characterized in that, The groove and the seat of the adjustable alignment device are connected by a guide rail, and the seat moves along the guide rail relative to the bearing surface of the bearing plate.

4. The adjustable bearing mechanism according to claim 1, characterized in that, The positioning unit is a protrusion and is disposed on the plate of the positioning fixture.

5. The adjustable bearing mechanism according to claim 1, characterized in that, The plate includes a positioning perforation, and the positioning unit is used to pass through the positioning perforation of the plate and be inserted into the positioning hole of the carrier plate.

6. The adjustable bearing mechanism according to claim 2, characterized in that, The carrier plate includes at least one fixing hole, and the base body is provided with at least one connecting through hole. The fixing unit is used to pass through the connecting through hole of the base body and connect to the fixing hole of the carrier plate to fix the base body to the carrier plate.

7. The adjustable bearing mechanism according to claim 6, characterized in that, The fixing unit includes a rod and a head. The rod of the fixing unit passes through the connecting hole of the base and is connected to the fixing hole of the bearing plate. The cross-sectional area of ​​the connecting hole of the base is larger than the cross-sectional area of ​​the rod of the fixing unit.

8. A deposition equipment, characterized in that, include: Cavity, including accommodating space; A stop is located within the accommodating space of the cavity, wherein one end of the stop is connected to the cavity, and the other end of the stop forms an annular protrusion; A cover ring, placed on the annular protrusion of the stop, and including an alignment groove; and An adjustable support mechanism, located within the accommodating space, includes: A carrier tray includes a carrier surface and at least one positioning hole, wherein the positioning hole is located on the carrier surface, and a wafer is used to place on the carrier surface and cover the positioning hole on the carrier surface; Several adjustable alignment devices are located around the bearing surface of the bearing plate, and include; The base body connects to the support plate; Alignment pin, connected to the seat body, for aligning the cover ring, and as the seat body moves relative to the bearing surface of the bearing plate; At least one fixing unit is connected to the carrier plate via the base body to fix the base body on the carrier plate and fix the position of the alignment pin; A positioning fixture for placement on the carrier plate includes: a plate body; a plurality of alignment portions disposed on the plate body, wherein each alignment portion includes: alignment pin positioning holes located on the plate body; at least one through hole located on the plate body, wherein when the positioning fixture is connected to the carrier plate, the alignment pins of each adjustable alignment device are located in the alignment pin positioning holes of each alignment portion, and the fixing unit faces the through hole of each alignment portion; and a positioning unit for insertion into the positioning hole of the carrier plate to position the positioning fixture and the carrier plate.

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