Method, device and equipment for determining bridge location in superconducting quantum chip layout

Abstract

The present disclosure provides a method, device and equipment for determining a bridging position in a superconducting quantum chip layout, and relates to the technical field of quantum chip, in particular to the technical field of quantum computer, superconducting quantum chip, quantum chip layout design and the like. The specific implementation scheme is: grouping a plurality of straight line segments in a chip layout, sampling on the plurality of straight line segments in the same group according to a preset grid structure requirement, and obtaining a set of bridging positions on the plurality of straight line segments in the same group; wherein the sampling points are located on the vertices of the preset grid structure, the distance between the bridging positions on the same straight line segment is greater than a specified distance, and the bridging positions on adjacent straight line segments are staggered. In the embodiment of the present disclosure, through the automatic bridging scheme, according to the position of the transmission line, reasonable and efficient bridging operation is performed on the straight line segments in groups, the automation degree of bridging is improved, and the efficiency of layout drawing is also improved, which greatly saves the design and manufacturing cost.

Description

Technical Field

[0001] This disclosure relates to the field of quantum chip technology, and in particular to the fields of quantum computers, superconducting quantum chips, and quantum chip layout design. Background Technology

[0002] In the design of superconducting quantum chips, after all the main pattern layers are drawn, bridging operations are required. The purpose of this operation is to reduce signal crosstalk between transmission lines and eliminate the potential difference across the device caused by etching. As the number of qubits in a superconducting quantum chip increases, the number and complexity of transmission lines also increase. Traditional bridging methods can no longer meet application requirements. Summary of the Invention

[0003] This disclosure provides a method, apparatus, and device for determining the bridging positions in the layout of a superconducting quantum chip.

[0004] According to one aspect of this disclosure, a method for determining the bridging position in the layout of a superconducting quantum chip is provided, comprising:

[0005] Grouping multiple straight line segments in the layout of a superconducting quantum chip;

[0006] According to the preset grid structure requirements, sampling is performed on multiple straight line segments in the same group to obtain a set of bridging positions on multiple straight line segments in the same group. The sampling points are located at the vertices of the preset grid structure, and the distance between bridging positions on the same straight line segment is greater than the specified distance. The bridging positions on adjacent straight line segments are staggered.

[0007] According to another aspect of this disclosure, a device for determining the bridging position in a superconducting quantum chip layout is provided, comprising:

[0008] The grouping module is used to group multiple straight line segments in the layout of a superconducting quantum chip;

[0009] The sampling module is used to sample multiple straight line segments in the same group according to the preset grid structure requirements, and obtain a set of bridging positions on multiple straight line segments in the same group. The sampling points are located at the vertices of the preset grid structure, and the distance between bridging positions on the same straight line segment is greater than a specified distance. The bridging positions on adjacent straight line segments are staggered.

[0010] According to another aspect of this disclosure, an electronic device is provided, comprising:

[0011] At least one processor; and

[0012] The memory is communicatively connected to the at least one processor; wherein,

[0013] The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the methods of any embodiment of the present disclosure.

[0014] According to another aspect of this disclosure, a non-transitory computer-readable storage medium is provided storing computer instructions, wherein the computer instructions are used to cause the computer to perform a method according to any embodiment of this disclosure.

[0015] According to another aspect of this disclosure, a computer program product is provided, including a computer program that, when executed by a processor, implements a method according to any embodiment of this disclosure.

[0016] In this embodiment of the disclosure, an automated bridging scheme is used to perform reasonable and efficient bridging operations on straight sections according to the location of the transmission line, reducing the workload of manual bridging, improving the degree of automation of bridging, and also improving the efficiency of layout drawing, thus greatly saving design and manufacturing costs.

[0017] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0018] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0019] Figure 1 This is a schematic diagram of a superconducting quantum chip layout with couplers provided according to an embodiment of the present disclosure;

[0020] Figure 2 This is a flowchart of a method for determining the bridging position in a superconducting quantum chip layout according to an embodiment of this disclosure;

[0021] Figure 3 This is a schematic diagram of a preset mesh structure provided in one embodiment of the present disclosure;

[0022] Figure 4 This is a schematic diagram of determining a suitable bridge-building location on a straight segment according to an embodiment of the present disclosure;

[0023] Figure 5 This is a schematic diagram of determining a suitable bridging position on a curved segment according to an embodiment of the present disclosure;

[0024] Figure 6 This is a schematic diagram of a straight segment requiring bridging, provided in one embodiment of the present disclosure;

[0025] Figure 7This is a schematic diagram of the straight line where a bridge needs to be built, according to an embodiment of this disclosure;

[0026] Figure 8 This is a flowchart of a method for determining the bridging position in another superconducting quantum chip layout according to another embodiment of this disclosure;

[0027] Figure 9 This is a diagram illustrating the effect of generating a bridge according to an embodiment of this disclosure;

[0028] Figure 10 This is a schematic diagram of the structure of a device for determining the bridging position in a superconducting quantum chip layout according to an embodiment of the present disclosure;

[0029] Figure 11 This is a block diagram of an electronic device used to implement the method for determining the bridging position in the superconducting quantum chip layout according to the embodiments of this disclosure. Detailed Implementation

[0030] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0032] Quantum computing, as a landmark technology of the post-Moore's Law era, is widely considered an important direction for research and development in both academia and industry. Compared to traditional computing, quantum computing shows significant advantages in solving problems such as large number factorization. Furthermore, quantum computing is also of great importance for cutting-edge research such as quantum many-body systems and quantum chemical simulations. In terms of hardware implementation, quantum computing offers various technical solutions, such as superconducting circuits, ion traps, and optical quantum systems. Among these solutions, superconducting circuits are considered the most promising candidate for quantum computing hardware due to their long decoherence time, ease of manipulation and readout, and strong scalability. The use of superconducting circuits is gradually becoming the mainstream technology. Related engineers have also developed superconducting quantum computing chips.

[0033] In quantum chip design, after all the main pattern layers are drawn, bridging operations are required. The purpose of this operation is to reduce signal crosstalk between transmission lines and eliminate potential differences across the device caused by etching. As the number of qubits in a quantum chip increases, the number and complexity of transmission lines also increase. Therefore, bridging on transmission lines is crucial, but improper bridging methods can lead to adjacent bridging locations being too close, thus affecting the performance of the quantum chip.

[0034] In related technologies, the following three methods can be used to determine the bridging positions in the layout of a superconducting quantum chip, which will be introduced one by one below:

[0035] Method 1

[0036] This method is suitable for small-scale quantum chips with simple layouts. To use this method, the position of the control line / read line on each component (including qubits, couplers, etc.) must first be determined, and then the bridging positions must be manually designed according to the rule that bridges do not overlap.

[0037] Method Two

[0038] This scheme primarily focuses on determining the bridging location and direction along the path of the coplanar waveguide, and calculates the path to achieve equidistant bridging on a single line. However, this method only considers the bridging problem of a single line and does not account for the issue of adjacent bridging between multiple lines.

[0039] Method 3

[0040] This scheme can automatically bridge curves sequentially at certain intervals on any given curve, and automatically determine the direction of the bridges. This method is not limited by the shape of the curve and can achieve equidistant bridging of any curved curve, thus meeting the bridging requirements of any single device in the layout. However, this scheme only considers the bridging problem of a single line and focuses only on the bridging strategy of the current curve, without fully considering the conflict between bridges. When two lines are very close, this method often results in bridge overlap. The lack of global bridge layout planning may lead to problems such as signal interference and performance loss.

[0041] Therefore, the above three methods face problems such as complexity, limitations, and neighboring bridge conflicts when dealing with large-scale quantum chip bridging, and there is a need to find more effective automated bridging solutions to address these shortcomings.

[0042] In view of this, embodiments of the present disclosure provide a method for automatically determining the bridge-building location.

[0043] To facilitate understanding of the technical solutions provided in this disclosure, a "superconducting quantum chip layout with coupler" is used as an example for illustration. However, it should be understood that the scope of application of this disclosure includes, but is not limited to, "superconducting quantum chips with couplers," and is equally applicable to other types of quantum chips.

[0044] In the layout of superconducting quantum chips with couplers, there are generally three structures, such as... Figure 1 As shown. The cross-shaped black structure represents a qubit. Figure 1 The quantum chip shown contains a total of 2 qubits, and Figure 1 In this context, "qubit 1" and "qubit 2" are used to refer to them. Additionally, there is a black arrow-shaped structure representing the coupler. Figure 1 In this context, it is referred to as "coupler 12". Above the qubit is a groove and a long straight wire structure. Figure 1 In Chinese, it is referred to as a "readout cavity". There are control lines at the right end of the qubit. Figure 1 In Chinese, it is referred to as "control line". Figure 1 The black part represents the air zone, while the white part represents the grounding metal plate.

[0045] Next, combined Figure 1 Specify the area where bridging will be carried out:

[0046] like Figure 1 As shown, at least three straight-line structures require bridging. First is the qubit-coupler-qubit structure, where bridging primarily occurs on both sides of the coupler. A ring of etched-out air surrounds the coupler. This air creates a potential difference between the grounded metal plates on either side of the coupler, affecting chip performance. Therefore, bridging is necessary on both sides of the coupler. Second is the read cavity-read line structure... Figure 1 The first structure (not shown) uses a bridging mechanism on both sides of the read cavity and read line. The reason is the same as above: to reduce the impact of potential difference on the quantum chip's performance, bridging is needed on both sides of the read cavity and read line. The third structure is a control line structure, where the bridging is located on both sides of the control line in an array. Besides the reasons mentioned above, another purpose is to reduce energy dissipation caused by crosstalk between control lines.

[0047] Bridging at the bends in the three structures described above is also particularly necessary. Bridging at bends not only ensures the continuity of the ground connection on both sides of the control line but also suppresses radiation from the bend's tip. By performing bridging operations in these structures, problems such as signal crosstalk, potential difference, and energy dissipation can be reduced, thereby improving the chip's performance and stability.

[0048] Based on this, in order to effectively determine the bridging position, embodiments of this disclosure provide a method for determining the bridging position in the layout of a superconducting quantum chip. This method is applicable to both quantum chips and ordinary chips. The quantum chip can be a small-scale quantum chip or a superconducting quantum chip; this disclosure does not limit this. The method for determining the bridging position in the layout of a superconducting quantum chip according to embodiments of this disclosure can be used to bridge quantum chips of any size. Figure 2 The diagram shown illustrates the process of this method, which includes the following steps:

[0049] S201 groups multiple straight line segments in the layout of the superconducting quantum chip.

[0050] Based on the wiring information in the superconducting quantum chip layout, the bridging structures required include straight segments. For these straight segments, interference between bridging positions needs to be considered. For example, ... Figure 1 As shown, the readout cavity, control line, and coupler 12 connecting qubit 1 and qubit 2 can all be decomposed into multiple straight line segments. Grouping these decomposed straight line segments allows for batch determination of bridging positions within each group. This improves bridging efficiency compared to determining bridging positions line by line and allows for consideration of the influence of bridging positions between different lines within the same group. Therefore, this embodiment proposes a preset grid structure based on bridging requirements. Determining bridging positions according to this preset grid structure allows for batch determination of bridging positions within the same group and also considers the influence between adjacent straight lines. Specifically, as shown in S202.

[0051] S202, according to the preset grid structure requirements, sampling is performed on multiple straight line segments in the same group to obtain a set of bridging positions on multiple straight line segments in the same group. The sampling points are located at the vertices of the preset grid structure, and the spacing between bridging positions on the same straight line segment is greater than the specified distance. The bridging positions on adjacent straight line segments are staggered.

[0052] In this embodiment of the disclosure, in order to sample multiple straight line segments in the same group according to the preset grid structure requirements and obtain the bridge location set on multiple straight line segments in the same group, a method for obtaining the bridge location set is constructed using grouping and sampling techniques.

[0053] In this embodiment, the automated generation of relevant bridging positions can reduce the workload of manual bridging. As the complexity of the superconducting quantum chip layout increases, automatically determining the bridging positions allows for faster, more convenient, accurate, and efficient bridging, thereby improving the automation level of bridging. Furthermore, bridging positions determined according to a preset grid structure are more uniform, with the spacing between air bridges exceeding a specified distance, reducing interference between adjacent bridges on the same line segment. Simultaneously, the staggered distribution of bridging positions reduces signal crosstalk between bridges on different lines, improving bridging quality and better meeting practical needs.

[0054] In this embodiment of the disclosure, due to the increasingly complex structure of quantum chip versions, ordinary manual bridging methods are difficult to reasonably and efficiently control the interference between air bridges on different lines. When the layout design is changed, continuous manual operation will also lead to increased time and cost. Therefore, in the layout of superconducting quantum chips, the automatic method to accurately determine the bridging position on the quantum chip can not only accurately determine the bridging position and avoid the influence of air bridges on different lines, but also greatly reduce the cost of manual operation and time, and improve the efficiency of superconducting quantum chip layout design.

[0055] Of course, in addition to decomposing the superconducting quantum chip layout into straight line segments, it can also be decomposed into curved line segments. Different methods are used to determine the bridging positions for straight line segments and curved line segments, so that bridging operations can be performed at the bridging positions. The following explains the methods for determining the bridging positions for different line segments.

[0056] 1. Determine the bridge location on the straight section:

[0057] As explained earlier, grouping multiple straight line segments in the superconducting quantum chip layout allows for the batch determination of bridging positions within the same group and reduces crosstalk between different straight line segments. Specifically, this can be achieved through the following operations:

[0058] Step A1: Obtain the start and end point pairs of multiple straight line segments in the superconducting quantum chip layout;

[0059] In this context, the start-end pair, as the name suggests, refers to the starting point and ending point of a straight line segment, or the two endpoints of the straight line segment. The superconducting quantum chip layout records the start-end pairs of straight line segments; therefore, the start-end pairs of multiple straight line segments can be automatically extracted from the code file that generates the quantum chip layout. Of course, they can also be manually input. Furthermore, they can be obtained through image analysis based on the superconducting quantum chip layout image. Any method capable of obtaining the start-end pairs of straight line segments is applicable to the embodiments of this disclosure, and this disclosure does not impose specific limitations on them.

[0060] Step A2: Based on the start and end point pairs of multiple line segments, construct the linear equations of multiple line segments in the superconducting quantum chip layout;

[0061] In this embodiment of the disclosure, the coordinates of the collected and recorded start-end point pairs are used as input. All line segments are traversed, and the equation of the line containing each line segment (Ax+By+C=0) is calculated based on the coordinates of the start-end point pairs of the line segments. For example, if the coordinates of the start-end point pairs of the known line segments are (x1, y1) and (x2, y2), the equation of the line segment is obtained as Ax+By+C=0.

[0062] It should be noted that the linear equation Ax+By+C=0 in the embodiments of this disclosure can be transformed into the form y=kx+b, and the embodiments of this disclosure do not impose any restrictions on this.

[0063] When B = 1: A = -(y2-y1) / (x2-x1), C = -((y1-y2)*x1+(x2-x1)*y1) / (x2-x1);

[0064] When B = 0: the equation of the line is x = x1.

[0065] Step A3: Based on the slope of the linear equation, group the multiple line segments in the superconducting quantum chip layout.

[0066] In this embodiment of the disclosure, the linear equation of the linear segment is constructed based on the characteristics of the linear segment and the position of the start and end points. Then, multiple linear segments are grouped based on the slope of the linear equation. The grouping method is simple and easy to implement, which can simplify the calculation process and improve the efficiency of determining the bridge location.

[0067] In some possible implementations, line segments can be grouped according to the slope of the line to which each line segment belongs, allowing line segments with the same slope to be grouped together. Therefore, in this embodiment of the disclosure, grouping line segments with the same slope into the same group simplifies data processing, reduces computational complexity, and improves the efficiency of determining bridge location.

[0068] In other possible implementations, line segments with slopes less than a preset threshold can be grouped into the same group.

[0069] In this embodiment of the disclosure, if there is a large number of straight line segments with different slopes in the superconducting quantum chip layout, grouping them according to the principle of the same slope may result in a large number of groupings. Therefore, grouping them according to the slope being less than a preset threshold can reduce the number of groupings, simplify the processing and analysis of large amounts of data, save computational load, and improve the efficiency of determining the bridging position.

[0070] Furthermore, after grouping multiple line segments according to the slope of the line equation, the line segments within the same group can be sorted for easier calculation. The specific sorting method can be based on the size of the intersection points between the line segments and the coordinate axes. The coordinate axes can be either the x-axis or the y-axis. The sorting can proceed from largest to smallest or smallest to largest. Taking the line equation Ax + By + C = 0 and the coordinate axis as the y-axis as an example: when A = 1 and B = -1, compare the size of -C and sort according to the size of -C (where -C is the intersection point of the line segment and the y-axis). When A = 1 and B = 0, x = x1, and sort according to the size of x1. It should be noted that if at least one line segment shares the same line equation, its sequence number is the same. Based on the sorting results, record the line segments corresponding to these line equations within the same group as L1, L2, L3, ...

[0071] In this embodiment, sampling can be performed on multiple straight line segments within the same group according to a preset mesh structure requirement to obtain a set of bridging positions on the multiple straight line segments within the same group. Specifically, for the same group, the vertices of the preset mesh structure are the intersection points of multiple reference lines and the lines containing the multiple straight line segments within that group. The multiple reference lines are perpendicular to the multiple straight line segments within the same group, and the spacing between adjacent reference lines is a preset spacing. In practice, when the slopes within the same group are the same, each reference line is perpendicular to the multiple straight line segments within that group. If the slope difference within the same group is less than a threshold, one of the straight line segments can be selected so that the reference line is perpendicular to that straight line segment.

[0072] For ease of understanding, combined with Figure 3 The preset mesh structure is explained. The spacing (gap) between bridges on the same straight line segment is consistent; this spacing can be customized. Within each group of straight lines, they are sorted according to the size relationship between the intersection points of the line containing the segment and the coordinate axes, such as L1, L2, L3... as described earlier. Then, a series of reference lines perpendicular to these lines are created and numbered, such as...H(-1), H(0), H(1)... Figure 3 In the diagram, H(-2), H(-1), H(0), H(1), H(2), and so on are labeled. This forms a grid distribution. To minimize interference between air bridges on different straight segments, the preset spacing between reference lines can be gap / 2. Alternatively, it can be the critical distance at which a collision occurs between bridges; this embodiment does not limit this. Furthermore, Figure 3 The solid black dots and hollow white dots in the image are vertices of a pre-defined mesh structure. To achieve an alternating distribution of bridging positions on different straight line segments, the resulting bridging positions are: Figure 3 The solid black dots shown.

[0073] In this embodiment of the disclosure, a reasonable bridge design can be automatically completed based on the preset grid structure. Determining suitable bridge locations according to the regularity of the preset grid structure simplifies the bridge design process and improves the efficiency of determining bridge locations.

[0074] In some embodiments, sampling is performed on multiple straight line segments in the same group according to preset grid structure requirements to obtain a set of bridging positions on multiple straight line segments in the same group. Specifically, this can be performed as follows:

[0075] Step B1: Select one line segment from multiple line segments in the same group as the first baseline. The first baseline can be determined using the following methods:

[0076] Step C1: Determine the intersection points of the lines containing multiple line segments in the same group with the specified coordinate axes.

[0077] The specified coordinate axis can be either the x-axis or the y-axis, and this embodiment does not limit it.

[0078] Step C2: Select the line corresponding to the intersection point of the extreme values ​​as the first baseline.

[0079] The extreme value can be either the maximum or the minimum value, and this disclosure does not limit this.

[0080] For example, Figure 3 In this context, L1, L2, L3... represent multiple line segments grouped together. Figure 3 As can be seen, the line containing the straight line segment intersects the y-axis. In this embodiment, the line containing either the straight line segment with the largest corresponding number or the straight line segment with the smallest corresponding number is selected as the first baseline. For example... Figure 3 As shown, L1 can be selected as the first baseline.

[0081] In this embodiment of the disclosure, selecting the straight line corresponding to the intersection point of the extreme values ​​as the first baseline can simplify subsequent operations, reduce the amount of calculation, and improve the efficiency of determining the bridge location.

[0082] Step B2: Select one reference line from the multiple reference lines as the second baseline.

[0083] Specifically, the method for determining the second baseline can be as follows: select a reference line that is perpendicular to the first baseline and passes through the intersection of the first baseline and a specified coordinate axis, and use it as the second baseline.

[0084] As explained above, Figure 3 When L1 is defined as the first baseline, the reference line perpendicular to the first baseline and passing through the intersection point A of the first baseline L1 and the y-axis is H(0). Therefore, in Figure 3 H(0) is the second baseline.

[0085] In this embodiment, the second baseline is perpendicular to the first baseline, and the coordinates of its intersection with the y-axis are known, allowing for a simple and quick calculation of the equation of the second baseline. This facilitates the rapid determination of the coordinates of the intersections between the second baseline and other line segments. The simple calculation method reduces the consumption of computer resources and improves the efficiency of determining the bridge location.

[0086] Step B3: Determine the intersection point of the first baseline and the second baseline, and use it as the reference sampling point.

[0087] For example, such as Figure 3 As shown, L1 is the first baseline, H(0) is the second baseline, and the intersection point A of the first baseline and the second baseline is the reference sampling point.

[0088] Step B4: Based on the benchmark sampling points, sampling is performed on multiple straight line segments in the same group to obtain the set of bridge construction locations.

[0089] During implementation, based on the first baseline, the second baseline, and the requirements of sampling the preset grid structure, a calculation formula can be derived to sample the straight line segments and obtain the bridge location. Of course, the specific calculation method varies depending on the selected baseline in this embodiment. However, regardless of the chosen baseline (including the first and second baselines), the location of the sampling points can be determined using mathematical methods. A feasible implementation method will be exemplarily described later.

[0090] In this embodiment of the disclosure, by using the first baseline, the second baseline, and the baseline sampling point, other sampling points on multiple straight line segments in the same group can be determined as bridging positions. This simplifies the calculation process of generating a set of bridging positions, improves the efficiency of obtaining the set of bridging positions, and thus improves the efficiency of determining the bridging positions on straight line segments.

[0091] In some possible implementations, the method for obtaining the bridge-building location set based on the first baseline, the second baseline, and the baseline sampling points can be specifically executed as follows:

[0092] Since the reference lines and the lines containing the line segments in the same group can extend infinitely, but the wiring area of ​​the superconducting quantum chip layout is finite, in order to simplify the calculation, in step D1, within a preset range, based on the reference sampling points, the intersection points of the lines containing multiple line segments in the same group and multiple reference lines can be determined to obtain the vertex coordinate set of the preset mesh structure; the preset range is greater than or equal to the area composed of multiple line segments in the same group.

[0093] In some possible implementations, the preset range can be determined based on the distribution of line segments within the same group. For example, the minimum bounding box of all line segments within the same group can be defined as the preset range. One side of this minimum bounding box is parallel to the line segments within the same group, and the other side is parallel to the reference line of the same group. Of course, the minimum bounding box can also have one side parallel to the x-axis and the other side parallel to the y-axis. In specific implementations, the minimum bounding box can be determined according to actual needs.

[0094] In this embodiment of the disclosure, the vertex coordinate set of the preset mesh structure can be obtained based on the equation of the straight line and the gap between bridges on the same straight line segment. For example, based on... Figure 3 The preset grid structure shown, for the equation of line L1 as A1x + B1y + C1 = 0, with A = 1 and B1 = -1, the coordinate point A(0, C1) is the intersection of L1 and the y-axis, and also the intersection of H(0) and the y-axis. Starting from point A, based on the reasoning formula constructed from the first baseline, the second baseline, and the baseline coordinate points, other relevant intersection coordinates can be generated. For example, for... Figure 3 For line segments with odd numbers, the specific formulas for calculating the vertices of the preset mesh structure are shown in expressions (1) and (2);

[0095] x i =gap*(i) / sqrt(A) 2 +1) (1)

[0096] y i = gap*(i)*(-A) / sqrt(A) 2 +1)+C (2)

[0097] In expressions (1) and (2), gap is the predefined spacing between bridges, which is determined according to process parameter requirements; i is the reference line number, i = ... -3, -2, -1, 0, 1...; x i y is the x-coordinate of the intersection point of the reference line with index i and the line Ln containing the odd-numbered line segment, which is also the x-coordinate value of the vertex of the preset mesh structure; i The ordinate of the intersection point of the reference line with index i and L1 is the ordinate value of the vertex of the preset mesh structure; A and C come from An and Cn in the linear equation Anx + Bny + Cn = 0 of Ln; where n is an odd number.

[0098] In this embodiment of the disclosure, the coordinates of the intersection points of the odd-numbered Ln line and all reference lines within the preset range can be obtained according to the above calculation formula, and added to the vertex coordinate set of the preset mesh structure.

[0099] In this embodiment, after obtaining the coordinates of the intersection point of H(0) and the y-axis, the equation of line H(0) can be obtained. The coordinates of the intersection point of line Lm and the reference line can then be obtained using the equations of lines H(0) and Lm, where m is an even number. Figure 3 Line segments numbered evenly. For example, the equation of line Lm is Amx + Bmy + Cm = 0. During implementation, the coordinates m' of the intersection point of H(0) and Lm can be located. Figure 3 (Not shown in the image), and then based on m' and the following calculation formula, the vertex positions of other preset mesh structures on line Lm can be located. For example Figure 3 As shown, the coordinates of the intersection point of H(0) and L2 are B(a, b). Other relevant intersection point coordinates are generated starting from point B. The specific calculation formulas are shown in expressions (3) and (4):

[0100] x i =gap*(i) / sqrt(A) 2 +1)+a (3)

[0101] y i = gap*(i)*(-A) / sqrt(A) 2 +1)+C+b (4)

[0102] In expressions (3) and (4), gap is the user-defined spacing between bridges; i is the reference line number, i = ... -3, -2, -1, 0, 1...; x i y is the x-coordinate of the intersection point of the reference line with index i and Lm, which is the x-coordinate value of the vertex of the preset mesh structure; i The ordinate of the intersection point of the reference line with index i and Lm is the ordinate value of the vertex of the preset mesh structure; A and C come from Am and Cm in the equation Amx+Bmy+Cm=0; a and b come from the intersection point coordinates B(a,b).

[0103] In this embodiment of the disclosure, the coordinates of the intersection points of the even-numbered Lm line within the preset range and all reference lines can be obtained according to the above calculation formula. These coordinates are then used as the vertex coordinates of the preset mesh structure and added to the vertex coordinate set.

[0104] In summary, the coordinates of the intersection points of the lines with odd numbers and the corresponding reference lines are solved in the manner of odd-numbered lines (as in expressions (1) and (2)), and the coordinates of the intersection points of the lines with even numbers and the corresponding reference lines are solved in the manner of even-numbered lines (as in expressions (3) and (4)), thereby obtaining the set of vertex coordinates of the preset mesh structure.

[0105] In order to minimize the interference between adjacent straight segments on the bridge, in step D2 of this embodiment, the vertex coordinates on the straight line where each straight segment is located will be sampled according to a preset sampling rule to obtain a set of sampling points. The preset sampling rule includes: the vertex coordinates on the same straight line are sampled at equal intervals, and the vertex coordinates sampled on adjacent straight lines are staggered.

[0106] In this embodiment of the disclosure, the sampling point set can be obtained using the odd-even crossover method, that is, sampling is performed on a straight line segment within the same group, with a gap of one vertex. 2k+1 and H 2k H 2j and H 2j+1 The intersection of (k = ... -2, -1, 0, 1, 2, ..., j = ... -2, -1, 0, 1, 2, ...) is identified as the sampling point. For example, Figure 3 As shown, the vertices marked with solid black dots, such as the intersection of L1 and H(-2) and the intersection of L2 and H(-1), can all be used as sampling points to form a sampling point set.

[0107] Furthermore, in this embodiment of the disclosure, equal-interval sampling can be performed at intervals of one vertex, such that the distance between two adjacent bridges is the required gap value.

[0108] Since sampling is performed along the line segment, and the length of the line segment is less than the length of the line it lies on, even with a preset range (which is greater than the length of the line segment), some sampling points within the preset range will be located on the same group of line segments, while others will not. To obtain accurate bridging locations, in step D3 of this embodiment, sampling points located on the same group of line segments are selected from the set of sampling points to obtain a set of bridging locations.

[0109] In this embodiment, the vertex coordinates on the same straight line are sampled at equal intervals, with a constant interval between sampling points. This eliminates the need for additional calculations, improving the efficiency of automatically determining the bridging position. Furthermore, the staggered distribution of sampled vertex coordinates automatically avoids signal crosstalk between bridges on the same or adjacent straight line segments, saving time and cost in correcting conflicts between bridges and increasing the automation level of bridging position confirmation. Additionally, sampling the vertex positions of a preset grid structure using a preset range, reference line, and the straight line containing the straight line segment simplifies the calculation process and further improves the efficiency of automatically determining the bridging position.

[0110] Continuing from the previous description, in order to accurately determine the bridging location on the straight segments, the straight segments within the same group can be used as the straight segments to be processed. For each straight segment to be processed in the same group, sampling points located on that straight segment are selected. Specifically, the following steps can be performed:

[0111] Step E1: Obtain the first and second endpoints of the line segment to be processed.

[0112] In this context, the first endpoint is either the starting point or the ending point, and the second endpoint is either the starting point or the ending point. That is, if the first endpoint is the starting point, the second endpoint is the ending point. If the first endpoint is the ending point, the second endpoint is the starting point.

[0113] Step E2: The sampling points obtained from the line where the line segment to be processed is located are taken as vertices to be processed. If the first direction from the vertex to be processed to the first endpoint is consistent with the second direction from the second endpoint to the first endpoint, the vertex to be processed is added to the bridge location set.

[0114] In this case, where the first endpoint is the endpoint and the second endpoint is the starting point, the first direction from the vertex to be processed to the first endpoint can be considered the direction from the vertex to the endpoint, and the second direction from the second endpoint to the first endpoint can be considered the direction from the starting point to the endpoint. If the direction from the sampling point to the endpoint is the same as the direction from the starting point to the endpoint, it indicates that the vertex to be processed lies on a straight line segment, and the sampling point to be processed can be added to the bridging location set.

[0115] With the first endpoint as the starting point and the second endpoint as the ending point, the first direction from the vertex to be processed to the first endpoint can be considered the direction from the vertex to be processed to the starting point, and the second direction from the second endpoint to the first endpoint can be considered the direction from the ending point to the starting point. If the direction from the sampling point to the starting point is the same as the direction from the ending point to the starting point, it indicates that the vertex to be processed lies on a straight line segment, and the sampling point to be processed can be added to the bridging location set.

[0116] In this embodiment of the disclosure, using direction confirmation to determine whether the vertex to be processed is on a straight line segment can quickly obtain the set of bridging positions, reducing additional unnecessary calculations, saving computer resources, and improving the efficiency of determining bridging positions.

[0117] In some embodiments, the dot product can be used to determine whether the first direction and the second direction are consistent. For example, for a line segment with the coordinates of its start and end points (x1, y1) and (x2, y2), the sampling points on the line can be obtained as described above. Traverse all the sampling points on the line, and each sampling point is distributed as a vertex to be processed. Assuming the coordinates of the vertex to be processed are (x, y), calculate the dot product of the vectors, and the calculation formula is shown in expression (5):

[0118] dot_product = (x - x1) * (x2 - x1) + (y - y1) * (y2 - y1) (5)

[0119] If the dot product is greater than or equal to 0, it means that the vertex (x, y) to be processed lies on the line segment to be processed, indicating that the sampling point is a necessary bridging location. Conversely, if the dot product is less than 0, it means that the vertex (x, y) to be processed does not lie on the line segment to be processed, indicating that the vertex to be processed is not a necessary bridging location.

[0120] The effect of this process is as follows: Figure 4 As shown, straight line segments represent the straight line segments that need bridging, black dashed lines represent the straight lines containing the bridging segments, solid black dots represent suitable bridging locations, and hollow black dots represent unsuitable bridging locations that are outside the wiring range requiring bridging. Recording the suitable bridging locations and the slope of the corresponding straight line segments allows for subsequent bridging operations to be performed by passing this information to the bridge structure module.

[0121] In other embodiments, vectors can also be used to determine whether the first direction and the second direction are consistent. For example, using... Figure 4 Taking a straight line segment as an example, select a vertex C to be processed on the current line segment, obtain the vectors C->B and C->A from the current vertex to the second endpoint B / first endpoint A of the line segment, and the vectors A->B from the first endpoint A to the second endpoint B / B->A from the second endpoint B to the first endpoint A on the line segment. Compare the directions of vector C->B and vector A->B / the directions of vector C->A and vector B->A. If the directions of the two vectors are the same, it means that the current vertex to be processed is located on the current line segment. If the directions of the two vectors are not the same, it means that the current vertex to be processed has exceeded the current line segment.

[0122] It should be noted that the method for determining whether the first direction and the second direction are consistent in the embodiments of this disclosure is not limited to the two methods described in the above embodiments. Any method that can determine whether a point lies on a known straight line segment is applicable to the embodiments of this disclosure.

[0123] 2. Determining the location of the bridge on the curved section

[0124] In the layout of superconducting quantum chips, transitions between straight line segments are typically achieved using circular arcs to change the direction of the straight line segments. Besides straight line segments, bridging is also required on curved segments in the superconducting quantum chip layout. Therefore, this embodiment of the present disclosure also requires determining the bridging positions on the curved segments, which can be implemented as follows:

[0125] Step F1: Obtain the curve segment in the superconducting quantum chip layout.

[0126] Step F2: Determine the bridge location on the curved segment.

[0127] In this embodiment, bridging on the curved segment not only ensures the continuity of the straight segments on both sides, but also suppresses sharp-point radiation at the bend. By bridging on the curved segment, problems such as signal crosstalk, potential difference, and energy dissipation can be reduced, thereby improving the chip's performance and stability.

[0128] In this embodiment of the disclosure, determining the bridging position on the curved segment can be achieved by the following steps:

[0129] Step G1: Determine the total radian of the curve segment.

[0130] Step G2: Determine the bridge location at half the total arc.

[0131] In this embodiment, the bridge erection position is defined as a point with an arc radius equal to half the total arc radius, the bridge center is on the centerline of the curve segment, and the long side of the bridge deck is perpendicular to the turning radius pointing towards the bridge center. To obtain this series of coordinate points and directions, in this embodiment, when drawing the curve segment groove, each turning operation is split into two turning commands with an angle equal to half the total turning angle. After the first turn is completed, the coordinates of the termination point of its centerline are obtained as the bridge erection position coordinates. For example... Figure 5 As shown, for a circular arc segment with an arc radius of θ, the bridge is placed at an arc radius of θ / 2, with the radial position being the average of the inner and outer radii of the arc.

[0132] In this embodiment, the location at half the total arc is determined as the bridging position. This allows for the rapid determination of a reasonable bridging position for each curve segment, minimizing interference between the bridging positions of the connected straight segments. Furthermore, the center position is easy to calculate, avoiding the use of other complex calculation methods, thus saving computational resources and improving the efficiency of determining the bridging position.

[0133] 3. Selection of bridging locations between curved and straight segments

[0134] In some embodiments, the bridging positions on straight segments and curved segments are determined independently. To avoid conflicts between the bridging positions on straight segments and the bridging positions on curved segments connecting the straight segments, the bridging positions on curved segments can be determined first, followed by the bridging positions on straight segments. The following steps can be performed:

[0135] Step H1: Determine the straight line segment that connects to the curve segment, and use it as the target straight line segment.

[0136] Step H2: Before sampling multiple straight line segments in the same group according to the preset grid structure requirements, i.e. before executing S202, shrink the target straight line segment inward by a specified length.

[0137] In this embodiment of the disclosure, shrinking the target straight line segment inward by a specified length before sampling ensures that no conflict occurs between bridges during the subsequent bridging process, reduces the need for subsequent correction of bridging positions, saves operation time and cost, improves the efficiency of determining bridging positions, and thus improves the performance of the quantum chip.

[0138] In some possible implementations, after identifying the target straight segment connected by the curve segment, the target straight segment can be contracted inward to avoid the bridging position on the straight segment being too close to the bridging position on the curve segment, thus preventing crosstalk.

[0139] In other possible implementations, straight segments can be conditionally contracted. For example, the bridge location on the curved segment can be determined first, and the coordinates of the bridge location on the curved segment can be obtained. The straight segment connected to it is the target straight segment. The coordinates of the vertices on the target straight segment are obtained, and the distance between the vertex coordinates of the target straight segment and the coordinates of the bridge location on the curved segment is calculated. If this distance is less than a specified distance, the start and end points of the target straight segment are contracted inward by a specified length so that the distance between the bridge location on the curved segment and the vertex coordinates of the target straight segment is greater than or equal to the specified distance, ensuring that there is no conflict between the bridges.

[0140] In some other possible implementations, instead of shrinking the straight segments, bridging locations on the straight segments that cause crosstalk with the curved segments can be deleted. For example, if a bridging location on the target straight segment conflicts with a bridging location on the curved segment, the conflicting bridging location on the target straight segment can be discarded, thereby avoiding crosstalk caused by bridges being too close together.

[0141] The following example illustrates the method for determining the bridging position in the layout design of a superconducting quantum chip provided in this disclosure, to demonstrate the effectiveness of the solution:

[0142] The first step is to input a map to obtain the coordinates of the start and end points of the line segments. The input is a map or a code file that generates the map. The start and end points of the line segments to be bridged are then extracted from this map and recorded as input to the program. Additionally, the spacing between bridges on the same line segment also needs to be input. like Figure 6 As shown, the straight line segments represent the areas where bridging needs to be constructed. There are four line segments in total, with black dots indicating the start and end points of each segment. Their coordinates are as follows:

[0143] line1: a(-1,4), b(7,12);

[0144] line2: c(0,3), d(8,11);

[0145] line3: e(-4,-4), f(4,4);

[0146] line4: g(6,6), h(14,14).

[0147] The second step is to group and sort the data. Traverse all line segments and calculate their equations, where:

[0148] Line segment line1 belongs to line L1, the equation of the line is y = x + 5, and C = 5;

[0149] Line segment line2 belongs to line L2, the equation of the line is y = x + 3, and C = 3;

[0150] Line segments line3 and line4 belong to line L3, whose equation is y = x and C = 0.

[0151] Sort the lines with the same slope. Since B≠0, sort them according to the size of C. The lines will then be L1, L2, L3 in that order. Figure 7 As shown.

[0152] The third step is to generate a set of sampling points. Based on the input bridge spacing gap, the set of sampling points is calculated using a preset grid structure.

[0153] For line L1, the equation is A1x + B1y + C1 = 0, where A1 = 1, B1 = -1, and C1 = 5.

[0154] (0, C1) is the coordinate of the intersection of L1 and the y-axis, and also the coordinate of the intersection with H(0). From this point, other relevant intersection coordinates are generated. In actual implementation, to facilitate calculation and generate other relevant intersection coordinates, expressions (1) and (2) can be transformed into the following expressions (6) and (7) for calculation:

[0155]

[0156]

[0157] Where i = ..., -3, -2, -1, 0, 1, 2, 3, ..., substitute into A = 1, B = -1, C = 5.

[0158] Next, we continue to calculate the coordinates of the intersection point of the line L2 with line H, whose equation is A2x + B2y + C2 = 0. From the previous step, we can easily obtain the equation of line H(0) (y = -x + 5), and then calculate the coordinates of the intersection point (a, b) = (1, 4) of H(0) and L2, thus generating the intersection points of other lines on L2 and H. 2k+1The coordinates of the intersection points of the lines. In practical implementation, to facilitate calculation and generate other relevant intersection point coordinates, expressions (3) and (4) can be transformed into the following expressions (8) and (9) for calculation:

[0159] x i = gap*(i+1 / 2) / sqrt(A) 2 +1)+a (8)

[0160] y i =-(A / B)*x i -(C / B) (9)

[0161] Where i = ..., -3, -2, -1, 0, 1, 2, 3, ..., substitute into A=1, B=-1, C=3, a=1.

[0162] Unlike L1, (i+1 / 2) is used here to avoid intersecting with the intersection point of line L1, thus obtaining the coordinates L2 and H. 2k+1 The coordinates of the intersection points are used to achieve staggered bridging. The coordinates of the bridging sequence on the remaining straight line equations are obtained similarly, thus yielding the coordinates of the intersection points of lines L and H. A schematic diagram of the generated coordinates is shown below. Figure 3 The black hollow dots in the image are shown. The process of generating the sample point set can be based on the odd-even crossover method described above, i.e., L... 2k+1 and H 2k L 2j and H 2j+1 Bridges are constructed at the intersections of (k = ... -2, -1, 0, 1, 2, ..., j = ... -2, -1, 0, 1, 2, ...), which form the desired set of sampling points. The coordinates of the locations where bridges should be constructed are given in Table 1 below. Locations that do not conform to the odd-even crossover method are marked with "×".

[0163] Table 1

[0164]

[0165] The fourth step is to determine whether the set of sampling points is suitable, thus obtaining the set of bridge construction locations. Traverse all line segments line1, line2, line3, and line4, and based on their starting point coordinates and sampling point coordinates, determine which points are inside the line segments and which are outside. Specifically, this can be calculated using the dot product formula (expression (5)) mentioned earlier. Taking line1 as an example, determine whether points (-4,1), (0,5), and (4,9) are within the sequence: (x1,y1) and (x2,y2) correspond to the starting points a(-1,4) and b(7,12) of line1, respectively.

[0166] Point (-4,1): dot_product = -48 < 0

[0167] Point (0,5): dot_product = 16 > 0

[0168] Point (4,9): dot_product = 80 > 0

[0169] This indicates that points (0,5) and (4,9) are on line 1, while point (-4,1) is not on line 1. Similarly, suitable bridging locations can be obtained on lines 2, 3, and 4.

[0170] like Figure 4 As shown, points outside the line segment are marked with hollow black dots, and points inside the line segment are marked with solid black dots, indicating suitable bridging locations.

[0171] The fifth step involves bridging the bridges based on the determined coordinates of the straight and curved sections, generating a micro-nano identifiable air bridge layout on the design.

[0172] Based on the above description, the process for determining the bridge location in this embodiment of the disclosure is as follows: Figure 8 As shown. The entire process involves three key technologies: key technology 1 grouping and sorting, key technology 2 generating bridge erection location combinations, key technology 3 determining the bridge erection location on curve segments, and key technology 4 location judgment.

[0173] For the straight segments requiring bridging, key technologies 1 and 2 are used to obtain a set of bridging locations. Based on the start and end coordinates of each straight segment, the equation of the line containing that segment is obtained. Multiple straight lines are then grouped according to the slope of their equations. For multiple straight segments within the same group, they are sorted based on the intersections of their equations with the coordinate axes. Simultaneously, a series of reference lines perpendicular to the same group of straight segments are constructed, forming a pre-defined grid structure. The set of bridging locations is obtained based on this pre-defined grid structure. The specific implementation method has been explained previously and will not be repeated here.

[0174] For the curved segments requiring bridging, key technology 3 is used to obtain the bridging coordinates on the curved segments. The start and end points and arc angles of the curved segments are obtained, and the halfway point of the arc of the curved segment is determined as the bridging location. The bridging direction is determined based on the direction of the line connecting the center point of the arc and the center of the circle containing the arc.

[0175] After obtaining the bridging positions for the straight and curved segments, key technology 4 is used for position determination. It checks whether the bridging position on the curved segment conflicts with the bridging position on the connecting straight segment. If a conflict occurs, the bridging position on the straight segment is adjusted, ultimately outputting the appropriate bridging coordinates and direction.

[0176] The bridge-building effect diagram generated using the embodiments of this disclosure is as follows: Figure 9 As shown, the double horizontal lines represent the straight sections where bridging is required, and the gray rectangular blocks represent the bridge deck. It can be seen that in practical applications, the bridging between adjacent lines is staggered, which aligns with the design expectations.

[0177] Based on the same technical concept, this disclosure also provides a device 1000 for determining the bridging position in a superconducting quantum chip layout, such as... Figure 10 As shown, it includes:

[0178] Grouping module 1001 is used to group multiple straight line segments in the layout of a superconducting quantum chip;

[0179] The sampling module 1002 is used to sample multiple straight line segments in the same group according to the preset grid structure requirements, and obtain a set of bridging positions on multiple straight line segments in the same group. The sampling points are located at the vertices of the preset grid structure, and the spacing between bridging positions on the same straight line segment is greater than a specified distance. The bridging positions on adjacent straight line segments are staggered.

[0180] In some embodiments, the grouping module includes:

[0181] The acquisition submodule is used to acquire the start and end point pairs of multiple straight line segments in the layout of the superconducting quantum chip;

[0182] A submodule is constructed to build the linear equations of multiple line segments in the superconducting quantum chip layout based on the start-end pairs of multiple line segments;

[0183] The grouping submodule is used to group multiple line segments in the layout of a superconducting quantum chip based on the slope of the linear equation.

[0184] In some embodiments, the grouping submodule is specifically used for:

[0185] Line segments with the same slope are grouped into the same group.

[0186] In some embodiments, within the same group, the vertices of the preset mesh structure are the intersection points of multiple reference lines and the lines containing multiple line segments within the same group;

[0187] Among them, multiple reference lines are perpendicular to multiple straight line segments in the same group, and the spacing between adjacent reference lines is a preset spacing.

[0188] In some embodiments, the sampling module includes:

[0189] The first selection submodule is used to select one line segment from multiple line segments in the same group as the first baseline.

[0190] The second selection submodule is used to select one reference line from multiple reference lines as the second baseline;

[0191] The first determining submodule is used to determine the intersection point of the first baseline and the second baseline, which is used as the reference sampling point;

[0192] The sampling submodule is used to sample multiple straight line segments in the same group based on the reference sampling points to obtain a set of bridge construction locations.

[0193] In some embodiments, the first selection submodule is specifically used for:

[0194] Determine the intersection points of the lines containing multiple line segments in the same group with a specified coordinate axis;

[0195] Choose the line corresponding to the intersection of the extreme points as the first baseline.

[0196] In some embodiments, the second selection submodule is specifically used for:

[0197] Select a reference line that is perpendicular to the first baseline and passes through the intersection of the first baseline and the specified coordinate axis as the second baseline.

[0198] In some embodiments, the sampling submodule is specifically used for:

[0199] Within a preset range, based on the reference sampling points, the intersection points of multiple line segments in the same group and multiple reference lines are determined, resulting in the vertex coordinate set of the preset mesh structure; the preset range is greater than or equal to the region composed of multiple line segments in the same group.

[0200] According to the preset sampling rules, the vertex coordinates on the line containing each line segment are sampled to obtain a set of sampling points. The preset sampling rules include: the vertex coordinates on the same line are sampled at equal intervals, and the vertex coordinates sampled on adjacent lines are staggered.

[0201] From the set of sampling points, sampling points located on the same group of straight line segments are selected to obtain the set of bridge construction locations.

[0202] In some embodiments, the sampling submodule is specifically used for:

[0203] For each line segment to be processed in the same group, perform the following operations:

[0204] Obtain the first and second endpoints of the line segment to be processed;

[0205] The vertex sampled from the line containing the line segment to be processed is taken as the vertex to be processed. If the first direction from the vertex to be processed to the first endpoint is consistent with the second direction from the second endpoint to the first endpoint, the vertex to be processed is added to the bridge location set.

[0206] In some embodiments, it also includes:

[0207] The acquisition module is used to acquire curve segments in the layout of the superconducting quantum chip;

[0208] The first determining module is used to determine the bridge location on the curved segment.

[0209] In some embodiments, the determining module includes:

[0210] The second determination submodule is used to determine the total radian of the curve segment;

[0211] The third determining submodule is used to determine the bridge-building position at half the total arc.

[0212] In some embodiments, it also includes:

[0213] The second determining module is used to determine the straight line segment connected to the curve segment as the target straight line segment;

[0214] The shrinking module is used to shrink the target straight line segment inward by a specified length before sampling on multiple straight line segments in the same group according to the preset grid structure requirements.

[0215] The specific functions and examples of each module and submodule of the apparatus in this disclosure can be found in the relevant descriptions of the corresponding steps in the above method embodiments, and will not be repeated here.

[0216] According to embodiments of this disclosure, this disclosure also provides an electronic device, a readable storage medium, and a computer program product.

[0217] Figure 11 A schematic block diagram of an example electronic device 1100 that can be used to implement embodiments of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0218] like Figure 11As shown, device 1100 includes a computing unit 1101, which can perform various appropriate actions and processes according to a computer program stored in read-only memory (ROM) 1102 or a computer program loaded from storage unit 1108 into random access memory (RAM) 1103. The RAM 1103 may also store various programs and data required for the operation of device 1100. The computing unit 1101, ROM 1102, and RAM 1103 are interconnected via bus 1104. Input / output (I / O) interface 1105 is also connected to bus 1104.

[0219] Multiple components in device 1100 are connected to I / O interface 1105, including: input unit 1106, such as keyboard, mouse, etc.; output unit 1107, such as various types of monitors, speakers, etc.; storage unit 1108, such as disk, optical disk, etc.; and communication unit 1109, such as network card, modem, wireless transceiver, etc. Communication unit 1109 allows device 1100 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0220] The computing unit 1101 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 1101 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1101 performs the various methods and processes described above, such as the method for determining bridge locations in a chip layout. For example, in some embodiments, the method for determining bridge locations in a chip layout can be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 1108. In some embodiments, part or all of the computer program can be loaded and / or installed on device 1100 via ROM 1102 and / or communication unit 1109. When the computer program is loaded into RAM 1103 and executed by the computing unit 1101, one or more steps of the method for determining bridge locations in a chip layout described above can be performed. Alternatively, in other embodiments, the computing unit 1101 may be configured by any other suitable means (e.g., by means of firmware) to perform a method for determining the bridging location in the chip layout.

[0221] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0222] Program code used to implement the methods of this disclosure may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus, such that when executed by the processor or controller, the program code causes the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0223] In the context of this disclosure, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0224] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0225] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as a data server), or computing systems that include middleware components (e.g., an application server), or computing systems that include frontend components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with embodiments of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., a communication network). Examples of communication networks include local area networks (LANs), wide area networks (WANs), and the Internet.

[0226] Computer systems can include clients and servers. Clients and servers are generally located far apart and typically interact via communication networks. Client-server relationships are created by computer programs running on the respective computers and having a client-server relationship with each other. Servers can be cloud servers, servers in distributed systems, or servers incorporating blockchain technology.

[0227] According to embodiments of this disclosure, the electronic device can be integrated with the communication component, display screen, and information acquisition device, or it can be separately configured with the communication component, display screen, and information acquisition device.

[0228] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0229] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A method for determining the bridging position in the layout of a superconducting quantum chip, comprising: Grouping multiple straight line segments in the superconducting quantum chip layout includes: grouping based on the slope of the linear equations of the multiple straight line segments; wherein the slope of the linear equations in the same group is less than a preset threshold; According to the preset grid structure requirements, sampling is performed on multiple straight line segments in the same group to obtain the set of bridging positions on the multiple straight line segments in the same group. The sampling points are located at the vertices of the preset grid structure, and the distance between the bridging positions on the same straight line segment is greater than the specified distance. The bridging positions on adjacent straight line segments are staggered. For the same group, the vertices of the preset mesh structure are the intersection points of multiple reference lines and the lines containing multiple line segments of the same group; The multiple reference lines are perpendicular to the multiple straight line segments in the same group, and the spacing between adjacent reference lines is a preset spacing.

2. The method according to claim 1 further includes determining the linear equations of the plurality of line segments based on the following method: Obtain the start and end point pairs of multiple straight line segments in the layout of the superconducting quantum chip; Based on the start and end point pairs of the multiple line segments, the linear equations of the multiple line segments in the superconducting quantum chip layout are constructed.

3. The method according to claim 1, wherein, The grouping based on the slopes of the equations of the multiple line segments includes: Line segments with the same slope are grouped into the same group.

4. The method according to claim 1, wherein, The step of sampling on multiple straight segments in the same group according to the preset grid structure requirements to obtain the set of bridging positions on the multiple straight segments in the same group includes: Select one line segment from the multiple line segments in the same group as the first baseline; Select one of the multiple reference lines as the second baseline; The intersection point of the first baseline and the second baseline is determined as the reference sampling point; Based on the reference sampling points, sampling is performed on multiple straight line segments in the same group to obtain the set of bridge construction locations.

5. The method according to claim 4, wherein, The step of selecting one line segment from multiple line segments in the same group as the first baseline includes: Determine the intersection points of the lines containing multiple line segments of the same group with the specified coordinate axes; The line corresponding to the intersection point of the extreme values ​​is selected as the first baseline.

6. The method according to claim 4, wherein, The step of selecting one reference line as the second baseline from the plurality of reference lines includes: Select a reference line that is perpendicular to the first baseline and passes through the intersection of the first baseline and the specified coordinate axis as the second baseline.

7. The method according to any one of claims 4-6, wherein, The method of sampling based on reference sampling points on multiple straight line segments in the same group to obtain the bridge construction location set includes: Within a preset range, based on the reference sampling points, the intersection points of the lines containing multiple line segments in the same group and the multiple reference lines are determined, thereby obtaining the vertex coordinate set of the preset mesh structure; the preset range is greater than or equal to the region composed of multiple line segments in the same group; According to the preset sampling rules, the vertex coordinates on the line where each line segment is located are sampled to obtain a set of sampling points; the preset sampling rules include: the vertex coordinates on the same line are sampled at equal intervals, and the vertex coordinates sampled on adjacent lines are staggered. From the set of sampling points, sampling points located on the straight segments of the same group are selected to obtain the set of bridge-building locations.

8. The method according to claim 7, wherein, The step of selecting sampling points from the set of sampling points that are located on the straight segments of the same group to obtain the set of bridge-building locations includes: For each line segment to be processed in the same group, perform the following operations respectively: Obtain the first and second endpoints of the line segment to be processed; The vertex sampled from the line where the line segment to be processed is located is taken as the vertex to be processed. If the first direction from the vertex to be processed to the first endpoint is consistent with the second direction from the second endpoint to the first endpoint, the vertex to be processed is added to the bridge location set.

9. The method according to claim 1, further comprising: Obtain the curve segment in the layout of the superconducting quantum chip; The bridge location was determined on the curved segment.

10. The method according to claim 9, wherein, Determining the bridge location on the curved segment includes: Determine the total radian of the curve segment; The bridge-building position is determined at half the total arc.

11. The method according to claim 9 or 10, further comprising: Identify the straight line segment that connects to the curve segment as the target straight line segment; Before sampling on multiple straight line segments in the same group according to the preset grid structure requirements, the target straight line segment is shrunk inward by a specified length.

12. A device for determining the bridging position in the layout of a superconducting quantum chip, comprising: The grouping module is used to group multiple straight line segments in the layout of the superconducting quantum chip, including: grouping based on the slope of the linear equations of the multiple straight line segments; wherein the slope of the linear equations in the same group is less than a preset threshold; The sampling module is used to sample multiple straight line segments in the same group according to the preset grid structure requirements, and obtain the set of bridging positions on the multiple straight line segments in the same group. The sampling points are located at the vertices of the preset grid structure, and the distance between the bridging positions on the same straight line segment is greater than a specified distance. The bridging positions on adjacent straight line segments are staggered. For the same group, the vertices of the preset mesh structure are the intersection points of multiple reference lines and the lines containing multiple line segments of the same group; The multiple reference lines are perpendicular to the multiple straight line segments in the same group, and the spacing between adjacent reference lines is a preset spacing.

13. The apparatus according to claim 12, wherein, The grouping module includes: The acquisition submodule is used to acquire the start and end point pairs of multiple straight line segments in the layout of the superconducting quantum chip; A submodule is constructed to construct the linear equations of the multiple line segments in the superconducting quantum chip layout based on the start-end pairs of the multiple line segments.

14. The apparatus according to claim 12, wherein, The grouping module is specifically used for: Line segments with the same slope are grouped into the same group.

15. The apparatus according to claim 14, wherein, The sampling module includes: The first selection submodule is used to select one line segment from multiple line segments in the same group as the first baseline. The second selection submodule is used to select one reference line from the plurality of reference lines as the second baseline; The first determining submodule is used to determine the intersection point of the first baseline and the second baseline as a reference sampling point; The sampling submodule is used to sample multiple straight line segments in the same group based on the reference sampling points to obtain the bridge location set.

16. The apparatus according to claim 15, wherein, The first selection submodule is specifically used for: Determine the intersection points of the lines containing multiple line segments of the same group with the specified coordinate axes; The line corresponding to the intersection point of the extreme values ​​is selected as the first baseline.

17. The apparatus according to claim 15, wherein, The second selection submodule is specifically used for: Select a reference line that is perpendicular to the first baseline and passes through the intersection of the first baseline and the specified coordinate axis as the second baseline.

18. The apparatus according to any one of claims 15-17, wherein, The sampling submodule is specifically used for: Within a preset range, based on the reference sampling points, the intersection points of the lines containing multiple line segments in the same group and the multiple reference lines are determined, thereby obtaining the vertex coordinate set of the preset mesh structure; the preset range is greater than or equal to the region composed of multiple line segments in the same group; According to the preset sampling rules, the vertex coordinates on the line where each line segment is located are sampled to obtain a set of sampling points; the preset sampling rules include: the vertex coordinates on the same line are sampled at equal intervals, and the vertex coordinates sampled on adjacent lines are staggered. From the set of sampling points, sampling points located on the straight segments of the same group are selected to obtain the set of bridge-building locations.

19. The apparatus according to claim 18, wherein, The sampling submodule is specifically used for: For each line segment to be processed in the same group, perform the following operations respectively: Obtain the first and second endpoints of the line segment to be processed; The vertex sampled from the line where the line segment to be processed is located is taken as the vertex to be processed. If the first direction from the vertex to be processed to the first endpoint is consistent with the second direction from the second endpoint to the first endpoint, the vertex to be processed is added to the bridge location set.

20. The apparatus of claim 12, further comprising: The acquisition module is used to acquire curve segments in the layout of the superconducting quantum chip; The first determining module is used to determine the bridge-building location on the curved segment.

21. The apparatus according to claim 20, wherein, The determining module includes: The second determining submodule is used to determine the total radian of the curve segment; The third determining submodule is used to determine the bridge-building position at half the total arc.

22. The apparatus according to claim 20 or 21, further comprising: The second determining module is used to determine the straight line segment connected to the curve segment as the target straight line segment; The shrinking module is used to shrink the target straight line segment inward by a specified length before sampling on multiple straight line segments in the same group according to the preset grid structure requirements.

23. An electronic device, comprising: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-11.

24. A non-transitory computer-readable storage medium storing computer instructions, wherein, The computer instructions are used to cause the computer to perform the method according to any one of claims 1-11.

25. A computer program product comprising a computer program that, when executed by a processor, implements the method according to any one of claims 1-11.

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