Method for manufacturing electronic packages

Abstract

A method of manufacturing electronic packages is provided. The method includes providing a substrate strip including a plurality of substrate assemblies, wherein each substrate assembly includes a first substrate and a second substrate connected by a flexible connector, the first substrate of each substrate assembly includes a first mounting surface and the second substrate includes a second mounting surface, the second mounting surface is not on the same side of the substrate assembly as the first mounting surface; placing the substrate strip on a first stage; attaching a first electronic component on the first mounting surface of the first substrate; placing the substrate strip on a second stage, wherein the second stage includes a plurality of cavities such that the first electronic component attached to each first substrate is received within one of the plurality of cavities; attaching a second electronic component on the second mounting surface of the second substrate; separating the plurality of substrate assemblies from each other; and bending the flexible connector of each substrate assembly to form an angle between the first substrate and the second substrate of each substrate assembly.

Description

Technical Field

[0001] This application relates generally to semiconductor technology, and more specifically to a method for manufacturing electronic packages. Background Technology

[0002] In recent years, wireless communication using millimeter-wave signals (e.g., with frequencies from 24 GHz to 60 GHz or higher) has faced complex challenges because electronic packaging is often limited by cost, size, weight, and performance specifications. Therefore, integrating a 5G antenna-in-package (AIP) with the system and antenna into a single package has been adopted in mobile phones and other portable multimedia devices. However, this 5G AIP requires smaller interface pitch, more interface pins, less thickness, and a higher level of integration within the system base package.

[0003] Therefore, a method for manufacturing electronic packages, such as 5G AIP, is needed. Summary of the Invention

[0004] One object of this application is to provide a method for manufacturing electronic packages.

[0005] According to one aspect of the embodiments of this application, a method for manufacturing an electronic package includes: providing a substrate strip, the substrate strip including a plurality of substrate assemblies, wherein each substrate assembly includes a first substrate and a second substrate, the second substrate being connected to the first substrate via a flexible connector, wherein the first substrate of each substrate assembly includes a first mounting surface and the second substrate includes a second mounting surface, the second mounting surface and the first mounting surface being not on the same side of the substrate assembly; placing the substrate strip on a first stage such that the first mounting surface of each first substrate faces away from the first stage and the second mounting surface of the second substrate faces towards the first stage; attaching a first electronic component to the first mounting surface of the first substrate; placing the substrate strip on a second stage, wherein the second stage includes a plurality of cavities such that the first mounting surface of the first substrate faces towards the second stage and the second mounting surface of the second substrate faces away from the second stage, and the first electronic component attached to each first substrate is accommodated in one of the plurality of cavities; attaching a second electronic component to the second mounting surface of the second substrate; separating the plurality of substrate assemblies from each other; and bending the flexible connector of each substrate assembly to form an angle between the first substrate and the second substrate of each substrate assembly.

[0006] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and not intended to limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. Attached Figure Description

[0007] The accompanying drawings cited herein form part of the specification. The features shown in the drawings are only illustrations of some embodiments of this application, and not all embodiments of this application, unless otherwise expressly stated in the detailed description, and the reader of the specification should not imply the contrary.

[0008] Figure 1 A cross-sectional view of an electronic package 100 according to an embodiment of this application is shown;

[0009] Figure 2 It shows Figure 1 A perspective view of the electronic package 100 shown;

[0010] Figures 3A to 3I The various steps of a method for manufacturing an electronic package according to an embodiment of this application are illustrated;

[0011] Figure 4 yes Figures 3A to 3I The flowchart shown is for an electronic packaging manufacturing method.

[0012] The same reference numerals will be used throughout the accompanying drawings to denote the same or similar parts. Detailed Implementation

[0013] The following detailed description of exemplary embodiments of this application is taken with reference to the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art can further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret it in a limiting manner, and the scope of embodiments of this application is defined only by the appended claims.

[0014] In this application, unless otherwise expressly stated, the singular is used to include the plural. In this application, unless otherwise stated, the use of “or” means “and / or”. Furthermore, the use of the term “comprising” and other forms such as “including” and “containing” is not restrictive. Furthermore, unless otherwise expressly stated, terms such as “element” or “part” cover elements and parts that comprise one unit, as well as elements and parts that comprise more than one subunit. Moreover, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0015] As used herein, spatially relative terms such as “below,” “under,” “above,” “over,” “upper,” “upper side,” “lower side,” “left side,” “right side,” “horizontal,” “vertical,” “side,” etc., may be used herein to describe the relationship between one element or feature and another element or feature as shown in the accompanying figures. In addition to the orientations depicted in the figures, spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0016] Figure 1 A cross-sectional view of an electronic package 100 according to an embodiment of this application is shown. The electronic package 100 may include various electronic components and a substrate for mounting these electronic components.

[0017] like Figure 1 As shown, the electronic package 100 is L-shaped and includes a curved portion, such as a flexible connector 103 (e.g., having a bending angle of approximately ninety degrees), connecting the first substrate 101 and the second substrate 102. Specifically, a first electronic component 107, such as an antenna assembly, may be disposed on the first substrate 101, and a second electronic component 110, such as a semiconductor package, may be disposed on the second substrate 102. In some embodiments, the flexible connector 103 may be a polymer strip or sheet (e.g., a polyimide film) in which interconnects are embedded or coated. In this way, the first electronic component 107 and the second electronic component 110, mounted on two different substrates 101 and 102, can be electrically connected to each other to form an integrated electronic package. However, it is understood that other alternative interconnect structures, such as flat cables, may be provided between the first substrate 101 and the second substrate 102.

[0018] Figure 2 It shows Figure 1 The diagram shows a perspective view of the electronic package 100. It can be seen that the L-shaped electronic package 100 has a compact structure, significantly reducing the number of layers and thickness compared to traditional multilayer electronic packages. Figure 1 and Figure 2 As shown, the first electronic component 107 and the second electronic component 110 are mounted on both sides of the connected bases 101 and 102 to prevent the flexible connector 103 from bending as shown. Figure 1Interference occurs when the angle is right. However, this non-planar configuration of the electronic package 100 increases the difficulty of assembling and manufacturing the electronic package 100, especially in the large-scale production of such electronic packages. To solve the above problems, embodiments of the present invention propose a new method for manufacturing an L-shaped electronic package.

[0019] Reference Figures 3A to 3I This illustrates the various steps of a method for manufacturing an electronic package according to embodiments of this application. For example, this method can be used to manufacture... Figure 1 The electronic package 100 is shown. In the following text, reference will be made to... Figures 3A to 3I Describe the method in detail.

[0020] Reference Figure 3A A base strip comprising multiple base components is provided. In some embodiments, the multiple base components of the base strip may be arranged in a row and connected together as a chain. In some other embodiments, the multiple base components of the base strip may be arranged in an array having multiple rows and columns. In this way, multiple base components can be processed simultaneously to improve manufacturing efficiency.

[0021] exist Figure 3A In the illustrated embodiment, the base strip comprises two base components separated from each other by a dividing channel 314. The dividing channel 314 provides a cutting area to divide the base strip into two separate base components. In some embodiments, the dividing channel 314 may be made of a rigid material, such as the same material as the base to which it is attached. In some alternative embodiments, the dividing channel 314 may be made of a flexible material, such as polyimide or other similar polymeric materials. Since the dividing channel 314 may need to be cut or otherwise destroyed in subsequent steps, such as using a laser ablation process, it is preferable that the dividing channel 314 is made of a material that is easy to cut.

[0022] Each substrate assembly includes a first substrate 301, a second substrate 302, and a flexible connector 303 disposed between the first substrate 301 and the second substrate 302. The first substrate 301 and the second substrate 302 may be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPC). In some embodiments, the first substrate 301 and the second substrate 302 may include a redistribution structure (RDS) having one or more dielectric layers and one or more conductive layers located between and passing through the dielectric layers. The conductive layers may define pads, traces, and plugs through which electrical signals or voltages can be distributed horizontally and vertically on the RDS. In some embodiments, the RDS may include multiple conductive patterns formed on the surfaces of the first substrate 301 and the second substrate 302.

[0023] Various electronic components can be mounted on the first substrate 301 and the second substrate 302. Specifically, the first substrate 301 includes a first mounting surface 3011, and the second substrate 302 includes a second mounting surface 3021, wherein the second mounting surface 3021 and the first mounting surface 3011 are not on the same side of the substrate assembly. Figure 3A As shown, when the base strip is placed on the first stage 304, such as a metal or glass stage, the first mounting surface 3011 of the first base 301 faces away from the first stage 304, i.e., upwards, and the second mounting surface 3021 of the second base 302 faces the first stage 304, i.e., downwards. One or more signals can be transmitted through the flexible connector 303, including but not limited to power signals and control signals. In some embodiments, signals are transmitted through one or more individual wires or cables of the flexible connector 303, and signal transmission in the flexible connector 303 can be bidirectional. For example, the flexible connector 303 can be a flexible cable or a flexible circuit board. It is understood that the flexible connector 303 can be connected to the first base 301 and the second base 302 by any suitable known technology, without limitation.

[0024] After that, as Figure 3B As shown, a plurality of bumps 306 are formed on the first mounting surface 3011 of each first substrate 3011. The bumps 306 can be formed using one or any combination of the following processes: evaporation, electrolytic plating, electroless plating, droplet plating, or screen printing. The conductive bump material can be Al, Sn, Ni, Au, Ag, lead (Pb), bismuth (Bi), Cu, solder, or a combination thereof, with an optional flux solution. For example, the bump material can be eutectic Sn / Pb, high-lead solder, or lead-free solder. In some embodiments, the bump material can be bonded to the first mounting surface 3011 of each first substrate 301 using a suitable attachment or bonding process. In one embodiment, the bump material can be reflowed to form conductive balls or bumps by heating the material above its melting point. In some embodiments, the plurality of bumps 306 can also be press-fitted or thermo-press-fitted to the first mounting surface 3011.

[0025] After that, as Figure 3CAs shown, a first electronic component 307 is attached to a first mounting surface 3011 of each first substrate 301. In some embodiments, before attaching the first electronic component 307, a first substrate mask 308 having a plurality of first openings is placed on the first mounting surface 3011 of the first substrate 301. Each first opening is aligned with the first substrate 301 of the substrate assembly to expose the first mounting surface 3011 of the first substrate 301. This allows the first electronic component 307 to be precisely mounted onto the first mounting surface 3011 of the first substrate 301 through the corresponding first opening. Simultaneously, during attachment, the second substrate 302 can be covered by the first substrate mask 308.

[0026] In some embodiments, the first electronic component 307 may be an antenna mounted on the first substrate 301. In some embodiments, the antenna may be a dielectric resonator antenna (DRA) including a dielectric resonator and an antenna feed structure. The dielectric resonator is used to transmit and receive millimeter-wave antenna signals of different frequencies and / or communication protocols, and is typically made of materials with low loss and high dielectric constant; for example, the dielectric resonator may be made of a polymer material. In some embodiments, the dielectric resonator antenna (DRA) may be designed in any three-dimensional shape, including cylinders, rectangles, spheres, or rings. Rectangular dielectric resonators... Figure 3C The examples shown are for illustrative purposes only. In some embodiments, the antenna feed structure is used to couple the input electromagnetic signal to the dielectric resonator. Common antenna feeds include microstrip direct-coupled feeds, microstrip slot-coupled feeds, coplanar waveguide feeds, coaxial probe feeds, and dual-fed structures.

[0027] In some embodiments, the first substrate mask 308 is a metal cover made of a metallic material (e.g., stainless steel, aluminum, etc.) or any other suitable material (e.g., plastic) or a combination of these materials to prevent substrate warping during attachment. The first substrate mask 308 can be removed from the substrate strip after the attachment process, in such a way that the first substrate mask 308 can be reused on other substrate strips to mount first electronic components on corresponding first substrates.

[0028] In some embodiments, the first stage 304 may have a flat top surface, such that the first base mask 308 can be directly supported by the base strip. However, in some alternative embodiments, for example... Figure 3C In the illustrated embodiment, the first stage 304 may include a base strip cavity 3041 for receiving the base strip. The depth of the base strip cavity 3041 is greater than the height of the base strip to accommodate the entire base strip. Thus, the first substrate mask 308 can be supported by the first stage 304 without direct contact with the base strip and without potential contamination of the base strip's surface. Figure 3DAs shown, each first electronic component 307 is clamped onto a corresponding first mounting surface 3011 to secure it to the respective first mounting surface 3011. For example, the corners of the first electronic component 307 can be pressed against the protrusions 306. Next, a sealant, such as an underfill material 309, is injected into the gap between the first electronic component 307 and the first mounting surface 3011 of the first base 301 to ensure that the sealant 309 completely fills the space surrounding the plurality of protrusions 306. The sealant 309 is cured or heated after injection to ensure that the first electronic component 307 is firmly fixed to the first mounting surface 3011. In some embodiments, the encapsulation material 309 may be a polymer composite material, such as a combination of epoxy resin, adhesives, and other fillers. The sealant 309 is non-conductive and protects the first electronic component 307 from external components and contaminants, and enhances the robustness of the first resistive component after the assembly process is completed.

[0029] like Figure 3E As shown, the first substrate mask 308 is removed from the first stage 304. Then, the substrate strip is flipped and placed on the second stage 312, which has a plurality of cavities 3121. Thus, the first mounting surface 3011 of each first substrate 301 faces the second stage 312, i.e., downwards, and the second mounting surface 3021 of the second substrate 302 faces away from the second stage 312, i.e., upwards. Each first electronic component 307 is then accommodated within one of the plurality of cavities 3121. Figure 3E The second stage 312 shown can have the same characteristics as... Figure 3A The first stage 304 shown has the same structure and materials, and will not be described again here. In some embodiments, the depth of each of the plurality of cavities 3121 is greater than the height of the first electronic component 307 to completely accommodate the first electronic component 307 therein. Therefore, the first substrate 301 can substantially cover the opening of the cavity 3121, and its outer edge is supported by the edge of the cavity 3121. In this way, the first substrate 301 can be at the same level as the second substrate 302, which is beneficial for further processing of the substrate strip (e.g., solder printing). Figures 3A to 3I In the illustrated embodiment, the first substrate 301 and the second substrate 302 may have the same thickness. In some alternative embodiments, the first substrate 301 and the second substrate 302 may have different thicknesses. In this case, the depth of the cavity 3121 can be adjusted to ensure that the first substrate 301 and the second substrate 302 are at the same level.

[0030] like Figure 3EAs shown, since the cavity 3121 of the second stage 312 accommodates the protruding structure (i.e., the first electronic component) on one side of the substrate, a substantially flat profile can be formed on the other side of the substrate during the manufacturing process, thereby enabling mass production on various substrate assemblies simultaneously.

[0031] After that, as Figure 3F As shown, a plurality of protrusions 315 are formed on the second mounting surface 3021 of the second substrate 302, such as Figure 3F As shown, a plurality of protrusions 315 are formed on the second mounting surface 3021 of the second base 302. Figure 3F The bump 306 can have the same Figure 3B The multiple bumps 306 shown have the same or similar structures, which will not be described in detail here.

[0032] like Figure 3G As shown, a second electronic component 310 is attached to a second mounting surface 3021 of a second substrate 302. In some embodiments, similar to a first substrate mask 308, a second substrate mask 313 having a plurality of second openings is also placed on the second mounting surface of the second substrate 302, each second opening being aligned with the second substrate 302 of the substrate assembly. The second openings expose the second mounting surface 3021. The second electronic component 310 is then mounted on the second mounting surface 3021 of the second substrate 302 through the corresponding second openings.

[0033] In some embodiments, the second electronic component 310 is an electronic package, such as a system-in-package (SIP) device. The electronic package may include connectors, such as board-to-board (B2B) connectors, which allow the second electronic component 310 to be electrically coupled to one or more external devices. In some embodiments, the electronic package may include multiple semiconductor dies, semiconductor devices, and discrete devices covered by certain sealants. In some embodiments, the electronic package is mounted using surface mount technology (SMT). The second electronic component 310 may be a passive or active device, as needed, to perform any given electrical function within the formed semiconductor package. The second electronic component 310 may be an active device, such as a semiconductor die, semiconductor package, discrete transistor, discrete diode, etc. The second electronic component 310 may also be a passive device, such as a capacitor, inductor, or resistor. In some embodiments, an electromagnetic interference (EMI) shielding layer is formed on the top and sides of the electronic package to encapsulate the electronic package.

[0034] like Figure 3HAs shown, each second electronic component 310 is clamped onto a corresponding second mounting surface 3021 by a plurality of protrusions 315. For example, the corners of the second electronic component 310 may press against the protrusions 315. Next, a sealant 316 may be injected into the gap between the second electronic component 310 and the second mounting surface 3021 of the second substrate 302 to ensure that the sealant 316 completely fills the space around the protrusions 315. The sealant 316 is cured or heated after injection. The sealant 316 may be, for example, […]. Figure 3D The sealant 309 shown is made of the same or similar material, and will not be described in detail here.

[0035] like Figure 3I As shown, the second substrate mask 313 is removed from the second stage 312, and the substrate strip can be unloaded from the second stage 312. The substrate strip can then be segmented into various substrate assemblies at each segmentation channel. Specifically, a laser ablation tool 311 can be used to... Figure 3I The base strip shown is divided into base components. In some embodiments, a mechanical saw blade can also be used to mechanically divide the segmentation channel.

[0036] Subsequently, the flexible connector between the first and second bases of each base assembly can be bent at an angle of approximately 90 degrees, similar to... Figure 1-2 The electronic package is shown in the diagram. Thus, the first substrate can be substantially perpendicular to the second substrate. It is understood that the flexible connector can be bent at another angle as needed, for example, an angle from 15 degrees to 165 degrees. In some embodiments, the process of bending the flexible connector may be as follows: (a) mounting the substrate assembly on a base holder, for example, the second electronic component may be facing away from the surface of the base holder and the first electronic component may be facing the surface of the base holder; (b) clamping the substrate assembly to a fixed substrate assembly, the flexible connector of the substrate assembly being heated by a conductive heating rod on the base to facilitate bending of the flexible connector; (c) as a first bend, the first substrate is pushed upward by the bottom cylinder, such that the first and second substrates form an L-shaped configuration between 90 and 180 degrees; then (d) as a second bend, the first substrate is pushed by the left cylinder, such that the first and second substrates form an L-shaped configuration at approximately 90 degrees. The position and angle between the first and second substrates are fixed, and (e) the substrate assembly is finally removed from the base holder.

[0037] Reference Figures 3A to 3IA method for manufacturing an electronic package is described exemplarily. However, various modifications or adjustments can be made to this method and the electronic package manufactured using this method. For example, a second electronic component may be disposed on a second substrate first, and then a first electronic component may be disposed on a first substrate. Furthermore, one or more first electronic components may be mounted on a first substrate, and one or more second electronic components may be mounted on a second substrate.

[0038] refer to Figure 4 This illustrates the manufacture of, according to embodiments of the present application, as shown in the example. Figure 1 The flowchart shows the method 400 for electronic packaging 100. (See attached flowchart.) Figure 4 As shown, method 400 begins at block 410, providing a base strip comprising a plurality of base assemblies. Then, at block 420, the base strip is placed on a first stage. At block 430, a first electronic component is attached to the first base. At block 440, the base strip is placed on a second stage having a plurality of cavities. At block 450, a second electronic component is attached to a second base. At block 460, the base strip is divided into a plurality of base assemblies. Subsequently, at block 470, the base assemblies are bent.

[0039] Although the process for manufacturing electronic packages has been described in conjunction with the accompanying drawings, those skilled in the art will understand that modifications and adjustments can be made to the process without departing from the scope of the invention.

[0040] The discussion herein includes numerous illustrative figures illustrating various parts of a semiconductor device and methods of its fabrication. For clarity, these figures do not show all aspects of each example component. Any example device and / or method provided herein may share any or all features with any or all other devices and / or methods provided herein. It will be understood that embodiments described in the context of one device or method are similarly effective for other devices or methods. Similarly, embodiments described in the context of a device are equally effective for a method, and vice versa. Features described in the context of one embodiment may be adapted accordingly to the same or similar features in other embodiments. Features described in the context of one embodiment may be adapted accordingly to other embodiments, even if not explicitly described in those other embodiments. Furthermore, additions and / or combinations and / or substitutions described for a feature in the context of one embodiment may be adapted accordingly to the same or similar features in other embodiments.

[0041] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made thereto, and other embodiments can be implemented without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of the practice of one or more embodiments of the invention disclosed herein. Therefore, the embodiments in this application and herein are intended to be considered exemplary only, and the true scope and spirit of the invention are indicated by the list of exemplary claims appended.

Claims

1. A method for manufacturing electronic packages, characterized in that, The method includes: A base strip is provided, the base strip including a plurality of base components, wherein each base component includes a first base and a second base, the second base being connected to the first base via a flexible connector, wherein the first base of each base component includes a first mounting surface and the second base includes a second mounting surface, the second mounting surface and the first mounting surface being not on the same side of the base component; The base strip is placed on the first platform such that the first mounting surface of each first base faces away from the first platform, and the second mounting surface of the second base faces the first platform. The first electronic component is attached to the first mounting surface of each of the first substrates; The base strip is placed on a second platform, wherein the second platform includes a plurality of cavities such that the first mounting surface of the first base faces the second platform and the second mounting surface of the second base faces away from the second platform, and the first electronic component attached to each of the first bases is accommodated in one of the plurality of cavities. The second electronic component is attached to the second mounting surface of each of the second substrates; Separate the plurality of base components from each other; and The flexible connector of each of the base components is bent to form an angle between the first base and the second base of each base component.

2. The method according to claim 1, characterized in that, Before attaching the first electronic component to the first mounting surface of each of the first substrates, the method further includes: Multiple bumps are formed on the first mounting surface of each of the first substrates.

3. The method according to claim 1, characterized in that, The first stage includes a base strip cavity to accommodate the base strip.

4. The method according to claim 1, characterized in that, The first mounting surface for attaching the first electronic component to each of the first substrates further includes: A first base mask having a plurality of first openings is placed on the base strip, wherein each first opening is aligned with the first base of each base assembly to expose the first mounting surface; The first electronic component is mounted on the first mounting surface of each first substrate through a corresponding opening; and Remove the first base mask from the first platform.

5. The method according to claim 1, characterized in that, Before attaching the second electronic component to the second mounting surface of each of the second substrates, the method further includes: Multiple bumps are formed on the second mounting surface of each second substrate.

6. The method according to claim 1, characterized in that, Attaching the second electronic component to the second mounting surface of each of the second substrates further includes: A second base mask having a plurality of second openings is placed on the base strip, wherein each second opening is aligned with the second base of the base assembly to expose the second mounting surface; The second electronic component is mounted on the second mounting surface of each second substrate through the corresponding opening; and Remove the second base mask from the second stage.

7. The method according to claim 1, characterized in that, The first electronic component is an antenna.

8. The method according to claim 1, characterized in that, The second electronic component is an electronic package.

9. The method according to claim 1, characterized in that, The depth of each of the plurality of cavities is greater than the height of the first electronic component.

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