Imaging module and method for manufacturing an imaging module
By creating a cavity on the circuit board and using a metal bonding layer and thermoplastic resin lenses, the problem of large imaging module size was solved, and the effect of efficiently installing lenses in a small cavity was achieved.
CN117692732BActive Publication Date: 2026-06-16HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
- Filing Date
- 2022-08-24
- Publication Date
- 2026-06-16
AI Technical Summary
⚠Technical Problem
Existing methods for manufacturing imaging modules result in large module sizes and limitations in mounting lenses within the recesses of high-density circuit boards.
⚗Method used
A receiving cavity is opened on the circuit board, penetrating the first and second surfaces, and a metal connecting layer is used. The lens is fixed in the small receiving cavity by thermoplastic resin lens and electroplating technology, avoiding additional adhesive layers and lens barrels.
🎯Benefits of technology
The size of the imaging module has been reduced, making it possible to install lenses in a smaller cavity and improving the efficiency of lens installation.
✦ Generated by Eureka AI based on patent content.
Smart Images
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Abstract
The application provides an imaging module, which comprises a circuit board and an imaging assembly. The circuit board comprises a first surface and a second surface opposite to each other. The circuit board comprises a first conductive circuit layer, and the first conductive circuit layer comprises the first surface. The circuit board is provided with a receiving cavity penetrating through the first surface and the second surface. A connecting layer is arranged on the side wall of the receiving cavity, and the material of the connecting layer is a metal material. The imaging assembly comprises a photosensitive chip, a filter and at least two lenses. The at least two lenses are stacked in the receiving cavity, the material of the lenses comprises a thermoplastic resin, the lenses are connected to the connecting layer, the photosensitive chip is arranged on the first surface and electrically connected to the first conductive circuit layer, the filter is arranged on the second surface, and the photosensitive chip and the filter both cover the receiving cavity. The imaging module provided by the application is beneficial to reducing the volume of the imaging module and installing the lenses in a smaller receiving cavity. The application also provides a preparation method of the imaging module.
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