Mini-led full-color direct display method

By using sub-millimeter-level RGB chips for pixel pitch adjustment and positioning in MINI-LED full-color direct display technology, combined with modular packaging and drive control circuits, the problems of precise control and color uniformity in MINI-LED full-color direct display technology are solved, achieving efficient and reliable display effects.

CN117746749BActive Publication Date: 2026-06-19XINYANG CENT SEMICON TECH CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XINYANG CENT SEMICON TECH CO LTD
Filing Date
2023-12-21
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing MINI-LED full-color direct-display technology faces challenges in mass packaging and real-time control, especially in ensuring precise control and color uniformity of tens of thousands of LEDs, resulting in poor display performance.

Method used

By using sub-millimeter-level MINI-LED RGB chips as pixel control points, pixel pitch adjustment and positioning are performed. Combined with modular COB packaging technology and drive control circuits, including constant current chips, communication chips, digital decoding control circuits and FPGA cores, precise control and real-time refresh of LED beads are achieved, and RGB color gamut correction is performed.

Benefits of technology

It achieves high pixel density and color reproduction, ensures the energy efficiency and reliability of display devices, provides smoothness and real-time performance, and improves the overall quality of display effects.

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Abstract

This invention relates to the field of display technology, and more particularly to a method for direct-viewing a full-color MINI-LED display. The method includes the following steps: using sub-millimeter-level MINI-LED RGB chips as pixel control points for a MINI-LED array direct-viewing screen, and performing pixel pitch control adjustment and chip positioning processing to obtain MINI-LED chip positioning data; based on the MINI-LED chip positioning data, soldering and packaging LED beads onto a PCB substrate to obtain MINI-LED bead soldering and packaging results; performing soldering defect detection and packaging optimization processing on the MINI-LED bead soldering and packaging results to obtain MINI-LED bead packaging optimization results; and generating a driving control circuit for precise control refresh and color gamut correction processing to generate a MINI-LED full-color direct-viewing correction effect. This invention can improve the full-color effect of a direct-viewing screen.
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