A silicon wafer boxing device and a boxing method thereof

Abstract

This invention discloses a silicon wafer packing device and method, belonging to the field of silicon wafer packing technology. It includes a box body with an opening that is vertically or horizontally positioned; a gripper that grips one end of a silicon wafer; a drive unit that feeds the silicon wafer gripped by the gripper into the horizontally positioned box body; and a guide unit including an upper guide wheel and a lower guide wheel. When the box body opening is horizontal, the drive unit drives the gripper to transport the silicon wafer, the upper guide wheel presses down on the other end of the silicon wafer to make its thickness equal to the packing thickness of the box body, and the lower guide wheel is located below the box body opening to guide the silicon wafer into the box body. This invention achieves automated silicon wafer packing without manual operation, improving efficiency while ensuring packing accuracy and avoiding the impact of manual operation on wafer quality.

Description

Technical Field

[0001] This invention belongs to the field of silicon wafer packaging technology, and particularly relates to a silicon wafer packaging device and packaging method. Background Technology

[0002] Silicon crystal photovoltaic (PV) technology is currently the most widely used photovoltaic technology. Its cells use silicon as the main material and are made of monocrystalline or polycrystalline silicon. Silicon crystal PV offers advantages such as high efficiency, stability, and reliability, but its production cost is high. Thin-film solar cells mainly use materials such as amorphous silicon, copper indium gallium selenide (CIGS), and organic materials, and are characterized by light weight, low production cost, and high flexibility, but their efficiency is relatively lower than that of silicon crystal PV. Polycrystalline silicon PV uses high-purity silicon microcrystalline crystals, comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than that of silicon crystal PV technology. Silicon ingots are a commonly used type of silicon crystal.

[0003] After silicon ingots are sliced, silicon wafers are formed. In order to achieve efficient transportation of silicon wafers, they need to be boxed. Currently, the commonly used boxing methods are manual boxing and robotic arm boxing. The following is an analysis of these two boxing methods.

[0004] 1. For manual packaging of silicon wafers, this method requires manual placement of each wafer into the box, which is time-consuming, labor-intensive, and inefficient. After packaging, the wafers also need to be bagged. Furthermore, manual operation involves a large amount of contact with the silicon wafers, which can affect the quality of the wafers to some extent.

[0005] 2. For robotic arms to pick up and pack boxes, this method has the following drawbacks:

[0006] a. Traditional robotic arms are used for vertical boxing, which means that the robotic arm grabs multiple silicon wafers and puts them into the box while overcoming the weight of the silicon wafers. However, in actual operation, due to the large mass of the silicon wafers, the robotic arm needs to squeeze the silicon wafers with force to stably put them into the box. When squeezing the silicon wafers with force, it is easy to damage the silicon wafers, and in severe cases, it may cause the silicon wafers to break.

[0007] b. Before packing multiple silicon wafers into a box, the wafers need to be stacked. There are spacers such as sponges between adjacent wafers to prevent wear between them. When the robotic arm picks up the wafers, in order to ensure smooth packing, it usually only picks up one end of the wafer and then puts the other end into the box to complete the packing operation. When the robotic arm picks up one end of the wafer, the other end of the wafer usually warps due to the presence of the spacers. The size of the box is often a standard size (usually an integer multiple of the thickness of the wafer). Therefore, this warping will affect the packing process. Forcing packing will damage the box and cause packing failure. Summary of the Invention

[0008] This invention overcomes the shortcomings of the prior art by providing a silicon wafer packing device and packing method to solve the problems existing in the prior art.

[0009] To achieve the above objectives, the technical solution adopted by the present invention is: a silicon wafer packaging device, comprising...

[0010] The enclosure has an opening that is either vertical or horizontal.

[0011] The gripper grips one end of the silicon wafer;

[0012] The drive unit feeds the silicon wafer gripped by the gripper into a box with a horizontally oriented opening.

[0013] The guide section includes an upper guide wheel and a lower guide wheel. When the opening of the housing is horizontally oriented, the drive section drives the gripper section to transport the silicon wafer. The upper guide wheel presses down on the other end of the silicon wafer to make the thickness of the silicon wafer equal to the packing thickness of the housing. The lower guide wheel is located below the opening of the housing and guides the silicon wafer as it is fed into the housing.

[0014] In a preferred embodiment of the present invention, a flip positioning part for positioning the box body is further included. The flip positioning part includes a flip motor, a flip bracket, a positioning cylinder and a positioning block. The box body is movably disposed on the flip bracket. The flip motor drives the box body to rotate through the flip bracket. The positioning cylinder drives the positioning block to press and position the side of the box body.

[0015] In a preferred embodiment of the present invention, a guide rail is provided on the flipping bracket, the box is connected to the guide rail by a slider, and the positioning cylinder drives the positioning block to pull the box to move along the length direction of the guide rail.

[0016] In a preferred embodiment of the present invention, the flipping bracket is provided with a plurality of positioning plates for positioning the box body, and the positioning plates and the positioning block form a positioning cavity for positioning the box body.

[0017] In a preferred embodiment of the present invention, the flipping bracket is provided with a limiting part, the limiting part including a limiting drive cylinder, a gripper cylinder and a limiting block, the limiting drive cylinder drives the gripper cylinder, and the gripper cylinder drives the limiting block to move, thereby limiting the silicon wafer loaded into the box.

[0018] In a preferred embodiment of the present invention, the gripper includes a rotary motor, a gripper cylinder, and a gripping block. The gripper cylinder drives the gripping block to grip the silicon wafer, and the rotary motor drives the gripper cylinder to rotate.

[0019] In a preferred embodiment of the present invention, the driving unit includes a truss, a first module mounted on the truss, a second module moving along the length direction of the first module, and a third module moving along the length direction of the second module, wherein the third module drives the gripper to perform linear reciprocating motion.

[0020] In a preferred embodiment of the present invention, the upper guide wheel is connected to the truss via an adjusting cylinder, and the adjusting cylinder drives the upper guide wheel to move closer to or further away from the silicon wafer.

[0021] In a preferred embodiment of the present invention, when the opening of the housing is horizontally arranged, there are at least two sets of upper guide wheels located above the opening of the housing to compress and guide the silicon wafer, and at least two sets of lower guide wheels located below the opening of the housing to guide the silicon wafer.

[0022] The present invention also discloses a packaging method for a silicon wafer packaging device, comprising the following steps:

[0023] S1. The flipping and positioning unit flips and positions the incoming material box so that the opening of the box is set horizontally.

[0024] S2. The gripper grabs the stacked silicon wafers. After grabbing, the drive unit drives the gripper to move so that the silicon wafers are at the opening of the box, completing the pre-packaging process.

[0025] S3. The upper guide wheel presses down on the silicon wafer under the drive of the adjusting cylinder, pressing the thickness of the silicon wafer to be equal to the thickness of the box. The drive unit drives the gripper to move until the silicon wafer is loaded.

[0026] S4. The limiting drive cylinder and the gripper cylinder of the limiting part drive the limiting block to approach the silicon wafer and limit the silicon wafer loaded into the box.

[0027] This invention addresses the shortcomings of the prior art and has the following beneficial effects:

[0028] (1) The silicon wafer packing device of the present invention realizes the automated packing process of silicon wafers without manual operation, which improves efficiency and ensures the packing accuracy of silicon wafers, and avoids the impact of manual operation on the quality of silicon wafers.

[0029] (2) The silicon wafer packing device of the present invention packs silicon wafers in a horizontal packing manner, without having to overcome the weight of the silicon wafers to pack them, effectively avoiding damage to the silicon wafers caused by the mechanical arm squeezing and gripping them.

[0030] (3) The upper guide wheel of the guide part can press down on the silicon wafer in the gripping state, so that the thickness of the silicon wafer is equal to the thickness of the box, effectively avoiding the occurrence of warping, ensuring that the silicon wafer can be stably packed, improving the packing accuracy of the silicon wafer, and also avoiding damage to the box. The lower guide wheel of the guide part can guide the silicon wafer into the box, so that the silicon wafer can be stably packed into the box.

[0031] (4) The flipping and positioning part can flip and position the box before the silicon wafer is packed. The box after flipping and positioning is conducive to the stable packing of silicon wafers and improves the packing accuracy of silicon wafers.

[0032] (5) The limiting part can limit and block the silicon wafer after it is packed. Together with the flipping positioning part, it can achieve full limiting of the box, which is conducive to the box being rotated from horizontal to vertical. Attached Figure Description

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0034] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0035] Figure 2 This is a partial structural diagram of a preferred embodiment of the present invention;

[0036] Figure 3 for Figure 2 Enlarged view of section A in the middle;

[0037] Figure 4 A schematic diagram of the gripper portion of a preferred embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the drive unit according to a preferred embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the structure of the flipping positioning part according to a preferred embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram of the limiting part according to a preferred embodiment of the present invention;

[0041] Figure 8 This is a schematic diagram of the upper guide wheel in a preferred embodiment of the present invention;

[0042] Figure 9 A flowchart of a preferred embodiment of the present invention;

[0043] In the diagram: 10. Box body; 20. Gripper; 21. Rotary motor; 22. Gripper cylinder; 23. Grip block; 30. Drive unit; 31. Truss; 32. First module; 33. Second module; 34. Third module; 40. Guide unit; 41. Upper guide wheel; 42. Lower guide wheel; 50. Tilting and positioning unit; 51. Tilting motor; 52. Tilting bracket; 521. Guide rail; 522. Slider; 523. Positioning piece; 53. Positioning cylinder; 54. Positioning block; 60. Limiting unit; 61. Limiting drive cylinder; 62. Gripper cylinder; 63. Limiting block; 70. Adjusting cylinder. Detailed Implementation

[0044] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0045] Example 1

[0046] This embodiment provides a silicon wafer packing device that automates the packing process of silicon wafers without manual operation. This improves efficiency while ensuring packing accuracy and avoids the impact of manual operation on wafer quality. Furthermore, this embodiment uses a horizontal packing method to pack the silicon wafers, eliminating the need to overcome the weight of the wafers during packing and effectively preventing damage to the wafers caused by the robotic arm squeezing and gripping them.

[0047] Combination Figures 1 to 8 As shown, the silicon wafer packing device of this embodiment includes a box body 10, a gripper 20, a drive unit 30, and a guide unit 40. The box body 10 accommodates the silicon wafers, the gripper 20 grips the silicon wafers, and the drive unit 30 drives the gripper 20 to pack the silicon wafers into the box body 10. The guide unit 40 can squeeze and guide the silicon wafers so that the thickness of the silicon wafers is equal to the packing thickness of the box body 10, effectively preventing the silicon wafers from warping, ensuring that the silicon wafers can be packed stably, and also preventing damage to the box body 10.

[0048] In this embodiment, the box 10 is a foam box. The opening of the box 10 is set vertically or horizontally. When set vertically, the box 10 is used to transport incoming materials. When set horizontally, the box 10 has completed the positioning process and is waiting for the silicon wafer packing operation.

[0049] Combination Figure 1 and Figure 4As shown, the gripper 20 grips one end of the silicon wafer. In this embodiment, the gripper 20 includes a rotary motor 21, a gripper cylinder 22, and a gripping block 23. The gripper cylinder 22 drives the gripping block 23 to grip the silicon wafer, and the rotary motor 21 drives the gripper cylinder 22 to rotate. In this embodiment, there are two gripping blocks 23, one of which is a fixed block and the other is a movable block. The gripper cylinder 22 drives one gripping block 23 to move. Under the cooperative action of the two gripping blocks 23, the silicon wafer is gripped. After the gripping is completed, the rotary motor 21 can drive the gripping block 23 to deflect its direction and change the orientation of the silicon wafer, which facilitates the smooth progress of subsequent packaging operations.

[0050] Specifically, in this embodiment, the gripping block 23 grips the silicon wafer in the horizontal direction, thereby avoiding the impact of vertical clamping.

[0051] Combination Figure 1 and Figure 5 As shown, the drive unit 30 feeds the silicon wafer gripped by the gripper unit 20 into the box 10 with the opening arranged horizontally. The drive unit 30 includes a truss 31, a first module 32 mounted on the truss 31, a second module 33 moving along the length direction of the first module 32, and a third module 34 moving along the length direction of the second module 33. The third module 34 drives the gripper unit 20 to perform linear reciprocating motion. With the cooperation of the first module 32, the second module 33, and the third module 34, the gripper unit 20 realizes the movement of the silicon wafer in multiple directions, which is beneficial for the gripper unit 20 to grip the silicon wafer and load it into the box 10.

[0052] Specifically, in this embodiment, the first module 32, the second module 33, and the third module 34 are all electric cylinder modules with high control precision. Together with the rotary motor 21 of the gripper 20, a rotary axis is added to the XYZ three axes to realize the adjustment of the silicon wafer in four directions and meet the packing precision of the silicon wafer.

[0053] Combination Figure 2 , Figure 3 as well as Figure 8As shown, the guide section 40 includes an upper guide wheel 41 and a lower guide wheel 42. When the opening of the housing 10 is horizontally oriented, the drive section 30 drives the gripper section 20 to transport the silicon wafer. The upper guide wheel 41 presses down on the other end of the silicon wafer, pressing the thickness of the silicon wafer to be equal to the packing thickness of the housing 10. The lower guide wheel 42 is located below the opening of the housing 10, guiding the silicon wafer into the housing 10. In this embodiment, when the gripper section 20 grips the silicon wafer, it grips one end of the silicon wafer, causing the other end of the silicon wafer to warp. The upper guide wheel 41 then presses down on the other end of the silicon wafer until the thickness of the silicon wafer is equal to the packing thickness of the housing 10. The thickness of the housing 10 is equal. Under the guidance of the upper guide wheel 41 and the lower guide wheel 42, the silicon wafer is guided to move and smoothly enter the housing 10. In this embodiment, the upper guide wheel 41 of the guide part 40 can press down on the silicon wafer in the gripping state, so that the thickness of the silicon wafer is equal to the thickness of the housing 10, which effectively avoids the occurrence of warping, ensures that the silicon wafer can be stably packed, improves the packing accuracy of the silicon wafer, and also avoids damage to the housing 10. The lower guide wheel 42 of the guide part 40 can guide the silicon wafer to be loaded into the housing, so that the silicon wafer is smoothly loaded into the housing 10.

[0054] In this embodiment, the upper guide wheel 41 is connected to the truss 31 via an adjusting cylinder 70. The adjusting cylinder 70 drives the upper guide wheel 41 to move closer to or further away from the silicon wafer. Under the driving action of the adjusting cylinder 70, the upper guide wheel 41 moves vertically and squeezes the silicon wafer during the silicon wafer packing process, so that the thickness of the silicon wafer is equal to the packing thickness of the box 10, so as to ensure the smooth progress of the packing operation and avoid damage to the box 10.

[0055] Specifically, when the opening of the housing 10 is horizontally oriented, there are at least two sets of upper guide rollers 41 located above the opening of the housing 10, which compress and guide the silicon wafers. There are at least two sets of lower guide rollers 42 located below the opening of the housing 10, which guide the silicon wafers. With the cooperation of the upper guide rollers 41 and the lower guide rollers 42, the silicon wafers are stably compressed and their movement is stably guided, thereby ensuring the packing accuracy of the silicon wafers.

[0056] Combination Figure 1 and Figure 6As shown, the silicon wafer packing device of this embodiment also includes a flip positioning part 50 for positioning the box 10. The flip positioning part 50 includes a flip motor 51, a flip bracket 52, a positioning cylinder 53, and a positioning block 54. The box 10 is movably mounted on the flip bracket 52. The flip motor 51 drives the box 10 to rotate through the flip bracket 52. The positioning cylinder 53 drives the positioning block 54 to press and position the side of the box 10. In this embodiment, the box 10 enters the flip bracket 52 during the material receiving process. After the box 10 enters the predetermined position, the positioning cylinder 53 drives the positioning block 54 to move and press and position the side of the box 10. The flip bracket 52 is provided with a guide rail 521. The box 10 is connected to the guide rail 521 through a slider 522. The positioning cylinder 53 drives the positioning block 54 to pull the box 10 to move along the length direction of the guide rail 521. Under the cooperation of the guide rail 521 and the slider 522, the movement of the box 10 is guided.

[0057] Furthermore, the flipping bracket 52 is provided with a number of positioning pieces 523 for positioning the box 10. The positioning pieces 523 and the positioning block 54 form a positioning cavity for positioning the box 10. With the cooperation of the positioning block 54 and the positioning pieces 523, the box 10 is accurately positioned from all directions, which is conducive to the smooth progress of subsequent packing operations and ensures packing accuracy.

[0058] Combination Figures 1 to 7 As shown, a limiting part 60 is provided on the flipping bracket 52. The limiting part 60 includes a limiting drive cylinder 61, a gripper cylinder 62, and a limiting block 63. The limiting drive cylinder 61 drives the gripper cylinder 62, and the gripper cylinder 62 drives the limiting block 63 to move, thereby limiting the silicon wafers loaded into the box 10. In the initial state, the limiting block 63 is open. At this time, the limiting block 63 and the gripping block 23 are misaligned and will not affect the boxing operation of the gripper 20 on the silicon wafers. After the silicon wafers are boxed, the limiting drive cylinder 61 and the gripper cylinder 62 drive the limiting block 63 to move, so that the limiting block 63 limits the silicon wafers.

[0059] In this embodiment, there are two limiting blocks 63 to limit the silicon wafer from multiple positions, and the limiting blocks 63 are provided with buffer sponges to prevent excessive limiting from damaging the silicon wafer.

[0060] In practical use, the silicon wafer packing device of this embodiment uses the flipping and positioning unit 50 to flip and position the incoming box 10, so that the opening of the box 10 is horizontally positioned. This ensures that subsequent horizontal packing operations of the box 10 do not require overcoming the weight of the silicon wafers for vertical packing operations, effectively avoiding damage to the silicon wafers caused by the robotic arm squeezing and gripping them. After the position of the box 10 is fixed, the gripper 20 grips the incoming silicon wafers, and the gripped silicon wafers are horizontally positioned. During the silicon wafer packing process, the driving unit 30 drives the gripper 20 to move the silicon wafers horizontally. As the silicon wafer approaches the box 10 laterally, the upper guide wheel 41 of the guide part 40 presses down on the silicon wafer when it is near the opening of the box 10, making the thickness of the silicon wafer equal to the packing thickness of the box 10. At the same time, the lower guide wheel 42 guides the silicon wafer from below. With the cooperation of the upper guide wheel 41 and the lower guide wheel 42, the silicon wafer is smoothly loaded into the box 10. After the silicon wafer is loaded, the gripper part 20 resets, and the limiting drive cylinder 61 and the gripper cylinder 62 of the limiting part 60 drive the limiting block 63 to move, limiting the silicon wafer loaded into the box 10, thus completing the packing operation of the silicon wafer.

[0061] Example 2

[0062] like Figure 9 As shown in the figure, this embodiment discloses a packaging method for a silicon wafer packaging device, which includes the following steps:

[0063] S1. The flipping and positioning unit 50 flips and positions the incoming material box 10 so that the opening of the box 10 is set horizontally, forming a position for horizontal packing of silicon wafers. It does not need to overcome the weight of the silicon wafers to pack them, and can also effectively avoid damage to the silicon wafers caused by the robot arm squeezing and gripping them.

[0064] S2. The gripper 20 grips the stacked silicon wafers. After gripping, the drive unit 30 drives the gripper 20 to move, so that the silicon wafer is in the opening position of the box 10, completing the pre-packaging process. At this time, there are separation layers such as sponge between the stacked silicon wafers. When the gripper 20 grips one end of the silicon wafer, the other end of the silicon wafer will warp. Therefore, the thickness of the other end of the silicon wafer will be greater than the packing thickness of the box 10, which will affect the smooth progress of the packing operation.

[0065] S3. Under the drive of the adjusting cylinder 70, the upper guide wheel 41 presses down on the silicon wafer, pressing the thickness of the silicon wafer to be equal to the packing thickness of the box 10. The drive unit 30 drives the gripper 20 to move until the silicon wafer is loaded. The upper guide wheel 41 presses down on the silicon wafer to make the thickness of the silicon wafer equal to the packing thickness of the box 10, ensuring stable packing. At the same time, the upper guide wheel 41 and the lower guide wheel 42 can also guide the upper and lower surfaces of the silicon wafer, so that the silicon wafer enters the box 10 smoothly and improves the packing accuracy of the silicon wafer.

[0066] S4. The limiting drive cylinder 61 and the gripper cylinder 62 of the limiting part 60 drive the limiting block 63 to approach the silicon wafer and limit the silicon wafer loaded into the box 10. In the initial state, the limiting block 63 is set open. At this time, the limiting block 63 and the gripping block 23 are staggered and will not affect the boxing operation of the gripper part 20 on the silicon wafer. After the silicon wafer is boxed, the limiting drive cylinder 61 and the gripper cylinder 62 drive the limiting block 63 to move, so that the limiting block 63 limits the silicon wafer.

[0067] In summary, the silicon wafer packing device of the present invention uses a horizontal packing method to pack silicon wafers, eliminating the need to overcome the weight of the silicon wafers during packing. This effectively avoids damage to the silicon wafers caused by the squeezing and gripping by the robotic arm. Furthermore, the upper guide wheel 41 of the guide part 40 can press down on the silicon wafers in the gripping state, making the thickness of the silicon wafers equal to the packing thickness of the box 10, effectively preventing warping and ensuring stable packing of the silicon wafers. This improves the packing accuracy of the silicon wafers and also avoids damage to the box 10. The lower guide wheel 42 of the guide part 40 can guide the movement of the silicon wafers into the box 10, allowing the silicon wafers to be smoothly loaded into the box 10.

[0068] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A silicon wafer packaging device, characterized in that, include The box (10) has an opening that is either vertical or horizontal. The gripper (20) grips one end of the silicon wafer; The drive unit (30) feeds the silicon wafer gripped by the gripper unit (20) into the box (10) with the opening arranged horizontally. The guide part (40) includes an upper guide wheel (41) and a lower guide wheel (42). When the opening of the box (10) is horizontally arranged, the drive part (30) drives the gripper part (20) to transport the silicon wafer. The upper guide wheel (41) presses down on the other end of the silicon wafer to press the thickness of the silicon wafer to be equal to the packing thickness of the box (10). The lower guide wheel (42) is located below the opening of the box (10) and guides the silicon wafer into the box (10).

2. The silicon wafer packaging device according to claim 1, characterized in that, It also includes a flip positioning part (50) for positioning the box (10). The flip positioning part (50) includes a flip motor (51), a flip bracket (52), a positioning cylinder (53), and a positioning block (54). The box (10) is movably mounted on the flip bracket (52). The flip motor (51) drives the box (10) to rotate through the flip bracket (52). The positioning cylinder (53) drives the positioning block (54) to press and position the side of the box (10).

3. A silicon wafer packaging device according to claim 2, characterized in that, The flipping bracket (52) is provided with a guide rail (521), and the box (10) is connected to the guide rail (521) through a slider (522). The positioning cylinder (53) drives the positioning block (54) to pull the box (10) to move along the length direction of the guide rail (521).

4. A silicon wafer packaging device according to claim 2 or 3, characterized in that, The flipping bracket (52) is provided with a plurality of positioning pieces (523) for positioning the box (10), and the positioning pieces (523) and the positioning block (54) form a positioning cavity for positioning the box (10).

5. A silicon wafer packaging device according to claim 2, characterized in that, The flipping bracket (52) is provided with a limiting part (60), which includes a limiting drive cylinder (61), a gripper cylinder (62), and a limiting block (63). The limiting drive cylinder (61) drives the gripper cylinder (62), and the gripper cylinder (62) drives the limiting block (63) to move, thereby limiting the silicon wafers loaded into the housing (10).

6. A silicon wafer packaging device according to claim 1, characterized in that, The gripper (20) includes a rotary motor (21), a gripper cylinder (22), and a gripping block (23). The gripper cylinder (22) drives the gripping block (23) to grip the silicon wafer, and the rotary motor (21) drives the gripper cylinder (22) to rotate.

7. A silicon wafer packaging device according to claim 1, characterized in that, The drive unit (30) includes a truss (31), a first module (32) mounted on the truss (31), a second module (33) moving along the length direction of the first module (32), and a third module (34) moving along the length direction of the second module (33). The third module (34) drives the gripper (20) to perform linear reciprocating motion.

8. A silicon wafer packaging device according to claim 7, characterized in that, The upper guide wheel (41) is connected to the truss (31) via an adjusting cylinder (70), and the adjusting cylinder (70) drives the upper guide wheel (41) to move closer to or further away from the silicon wafer.

9. A silicon wafer packaging device according to claim 1, characterized in that, When the opening of the housing (10) is horizontally arranged, there are at least two sets of upper guide wheels (41) located above the opening of the housing (10) to compress and guide the silicon wafer, and there are at least two sets of lower guide wheels (42) located below the opening of the housing (10) to guide the silicon wafer.

10. A method for packing a silicon wafer packing device, applied to the silicon wafer packing device according to any one of claims 1-9, characterized in that, Includes the following steps: S1. The flipping and positioning part (50) flips and positions the incoming material box (10) so that the opening of the box (10) is set horizontally. S2. The gripper (20) grips the stacked silicon wafers. After gripping, the drive (30) drives the gripper (20) to move, so that the silicon wafers are in the opening position of the box (10), completing the pre-packaging process. S3. The upper guide wheel (41) presses down on the silicon wafer under the drive of the regulating cylinder (70) to press the thickness of the silicon wafer to be equal to the packing thickness of the box (10). The drive unit (30) drives the gripper (20) to move until the silicon wafer is loaded. S4. The limiting drive cylinder (61) and the gripper cylinder (62) of the limiting part (60) drive the limiting block (63) to approach the silicon wafer and limit the silicon wafer loaded into the box (10).

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