Display module and display device

Abstract

This invention provides a display module and display device. By positioning a second ink layer within a non-display area and between a first ink layer and a sealant, and the first ink layer being positioned between a second ink layer and a third ink layer; the orthographic projection of the sealant on the display panel lies within the orthographic projection of the second ink layer on the display panel, and the distance between the edge of the sealant and the edge of the second ink layer is greater than or equal to 0.1 mm; the orthographic projection of the second ink layer on the display panel lies within the orthographic projection of the first ink layer on the display panel, and the orthographic projection of the first ink layer on the display panel lies within the orthographic projection of the third ink layer on the display panel, and the distance between the edge of the second ink layer and the edge of the third ink layer is greater than the distance between the edge of the second ink layer and the edge of the first ink layer, the probability of the dyne values ​​on the surfaces of the first and third ink layers exceeding the standard is reduced, thereby improving display problems caused by potential issues such as adhesive delamination and separation in the display module.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 202210199017.9, the original application was filed on March 2, 2022, and the original invention was entitled "Display Module and Display Device". Technical Field

[0002] This invention relates to the field of display technology, and more specifically to a display module and display device. Background Technology

[0003] In existing display modules, silicone adhesive is commonly used to bond the panel body to the cover plate. However, silicone adhesive is prone to releasing silicone oil, which can diffuse onto the surface of the main ink on the cover plate. This can cause the dyne value of the main ink surface to exceed the standard, leading to potential delamination or separation of the display module and resulting in display problems. Summary of the Invention

[0004] This invention provides a display module and display device to improve the display problem caused by the excessive dyne value of the first ink layer surface due to the small molecule oily organic matter precipitated from the sealant, which leads to the potential for delamination and peeling of the display module.

[0005] This invention provides a display module, which includes a display area and a non-display area surrounding the display area. The display module includes a display panel, a cover plate, and a sealant.

[0006] The cover plate is located on the display panel. The cover plate includes a first ink layer and a second ink layer located within the non-display area, with the second ink layer located on the side of the first ink layer closer to the display panel. The cover plate also includes a third ink layer located on the side of the first ink layer away from the second ink layer. The sealant is located within the non-display area and between the display panel and the second ink layer. The orthographic projection of the sealant on the display panel lies within the orthographic projection of the second ink layer on the display panel, and the distance between the edge of the sealant and the edge of the second ink layer is greater than or equal to 0.1 mm. The orthographic projection of the second ink layer on the display panel lies within the orthographic projection of the first ink layer on the display panel, and the orthographic projection of the first ink layer on the display panel lies within the orthographic projection of the third ink layer on the display panel. The distance between the edge of the second ink layer and the edge of the third ink layer is greater than or equal to the distance between the edge of the second ink layer and the edge of the first ink layer.

[0007] In some embodiments of the present invention, the interface expansion area ratio of the second ink layer is greater than that of the first ink layer.

[0008] In some embodiments of the present invention, the dyne value of the second ink layer is less than the dyne value of the first ink layer.

[0009] In some embodiments of the present invention, the display panel includes an array substrate and a color filter substrate located on the side of the array substrate near the cover plate. The sealant is located between the array substrate and the second ink layer, and the orthographic projection of the second ink layer on the array substrate is adjacent to the orthographic projection of the color filter substrate on the array substrate.

[0010] In some embodiments of the present invention, the display module further includes a backlight module located on the side of the display panel away from the cover plate. The orthographic projection of the boundary of the second ink layer away from the display area onto the backlight module coincides with the boundary of the backlight module.

[0011] In some embodiments of the present invention, the sealant includes a first sealant and a second sealant spaced apart along a first direction; the display panel further includes a driving chip located within the non-display area and between the first sealant and the second sealant; the second ink layer includes a first sub-ink layer and a second sub-ink layer.

[0012] Wherein, the orthographic projection of the first sealant on the display panel is located within the orthographic projection of the first sub-ink layer on the display panel, and the distance between the edge of the first sealant and the edge of the first sub-ink layer is greater than or equal to 0.1 mm; the orthographic projection of the second sealant on the display panel is located within the orthographic projection of the second sub-ink layer on the display panel, and the distance between the edge of the second sealant and the edge of the second sub-ink layer is greater than or equal to 0.1 mm.

[0013] In some embodiments of the present invention, the non-display area includes a first non-display area extending along a first direction and a second non-display area connected to the first non-display area and extending along a second direction, wherein the first direction intersects the second direction.

[0014] The sealant is located within the first non-display area, and the second ink layer includes a main body located within the first non-display area and an extension connected to the main body and located within the second non-display area. The orthographic projection of the sealant onto the second ink layer is located within the boundary of the main body.

[0015] In some embodiments of the present invention, the width of the extension gradually decreases along the direction away from the first non-display area.

[0016] In some embodiments of the present invention, the thickness of the second ink layer is greater than or equal to 4 micrometers and less than or equal to 10 micrometers.

[0017] The present invention also provides a display device comprising any of the above-described display modules.

[0018] This invention provides a display module and display device. A second ink layer is positioned within a non-display area and between a first ink layer and a sealant. The first ink layer is positioned between a second ink layer and a third ink layer. The orthographic projection of the sealant on the display panel lies within the orthographic projection of the second ink layer on the display panel, and the distance between the edge of the sealant and the edge of the second ink layer is greater than or equal to 0.1 mm. The orthographic projection of the second ink layer on the display panel lies within the orthographic projection of the first ink layer on the display panel, and the orthographic projection of the first ink layer on the display panel lies within the orthographic projection of the third ink layer on the display panel. Within the orthographic projection on the panel, the distance between the edge of the second ink layer and the edge of the third ink layer is greater than the distance between the edge of the second ink layer and the edge of the first ink layer. This prevents small-molecule oily organic matter precipitated from the sealant in the non-display area from diffusing to the surface of the first ink layer in the non-display area of ​​the cover plate, and reduces the probability of small-molecule oily organic matter diffusing to the surface of the third ink layer in the non-display area of ​​the cover plate. This reduces the probability of the dyne value of the surfaces of the first and third ink layers exceeding the standard, and improves the display problems caused by potential defects such as delamination and peeling of the display module. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figures 1A-1B This is a schematic diagram of the structure of the display module provided in an embodiment of the present invention;

[0021] Figures 2A to 2D yes Figure 1A The image shown is a magnified view of a portion of the display module at point A.

[0022] Figures 3A-3B This is a comparison chart showing the differences in the blocking effect of ink selection on pollution sources provided in the embodiments of the present invention;

[0023] Figures 4A to 4C These are experimental comparison diagrams provided in the embodiments of the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. In the present invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0025] Specifically, such as Figures 1A-1B This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. The display module includes a display area 100a and a non-display area 100b surrounding the display area 100a. The display module performs display functions within the display area 100a. Optionally, the display module performs sensing functions such as camera, touch, distance, and temperature sensing in at least one of the display area 100a or the non-display area 100b.

[0026] Optionally, the display module includes a liquid crystal display module, an organic light-emitting diode display module, a micro diode display module, a sub-millimeter diode display module, a quantum dot display module, etc.

[0027] The display module includes a display panel 101, a cover plate 102, and a sealant 103.

[0028] The cover plate 102 is located on the display panel 101. The cover plate 102 includes a first ink layer 1021 and a second ink layer 1022 located within the non-display area 100b. The second ink layer 1022 is located on the side of the first ink layer 1021 closest to the display panel 101. The sealant 103 is located within the non-display area 100b and between the display panel 101 and the second ink layer 1022. The sealant 103 can release small molecule oily organic compounds.

[0029] Furthermore, the sealant 103 includes silicone sealant. The main component of the silicone sealant is trimethoxy-terminated polydimethylsiloxane, which, after curing, forms a chemically stable siloxane polymer. The chemical reaction formula is shown below:

[0030]

[0031] When low molecular weight siloxanes (D3-D10) are mixed into polymer macromolecules, they are highly volatile. During and after the curing of silicone, they will volatilize, sublimate, and adhere to the surface of the first ink layer 1021. Since the methyl groups at the chain ends exhibit hydrophobic properties, they will change the surface conditions of the first ink layer 1021 (such as reducing the surface energy, i.e., reducing the dyne value).

[0032] Therefore, in order to prevent the small molecule oily organic matter precipitated from the sealant 103 from contaminating the surface of the first ink layer 1021 and causing the dyne value of the surface of the first ink layer 1021 to exceed the standard, resulting in potential problems such as delamination and separation of the display module, the orthographic projection of the sealant 103 on the display panel 101 is located within the orthographic projection of the second ink layer 1022 on the display panel 101.

[0033] Furthermore, since the orthographic projection of the sealant 103 onto the second ink layer 1022 is located within the second ink layer 1022, if the distance between the edge of the sealant 103 and the edge of the second ink layer 1022 is too small, the small molecule oily organic matter precipitated from the sealant 103 may still diffuse to the surface of the first ink layer 1021, thereby causing the surface dyne value of the first ink layer 1021 to exceed the standard. Therefore, to avoid the small molecule oily substances precipitated from the sealant 103 from diffusing to the surface of the first ink layer 1021 after the second ink layer 1022 is set, the orthographic projection of the sealant 103 on the display panel 101 is located within the orthographic projection of the second ink layer 1022 on the display panel 101, and the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 is greater than or equal to 0.1 mm, so as to further reduce the probability of the small molecule oily organic matter precipitated from the sealant 103 diffusing to the surface of the first ink layer 1021.

[0034] Since the second ink layer 1022 is less conducive to the diffusion of small molecule oily organic matter precipitated from the sealant 103 than the first ink layer 1021, the dyne value of the second ink layer 1022 is less than that of the first ink layer 1021.

[0035] Optionally, the dyne value of the first ink layer 1021 is less than 32 N / m; the dyne value of the second ink layer 1022 is less than 28 N / m.

[0036] Furthermore, the interfacial expansion area ratio Sdr can be used to characterize the characteristic that the second ink layer 1022 is less conducive to the diffusion of small molecule oily organic matter precipitated from the sealant 103 compared to the first ink layer 1021. Specifically, the interfacial expansion area ratio Sdr of the second ink layer 1022 is greater than that of the first ink layer 1021.

[0037] Furthermore, the inventors of this invention have discovered through experiments that when the interface expansion area ratio Sdr of the second ink layer 1022 is greater than 0.1, since the surface area of ​​the second ink layer 1022 is larger than that of the first ink layer 1021, the diffusion path of the small molecule oily organic matter precipitated from the sealant 103 on the second ink layer 1022 becomes longer. This further hinders the diffusion of the small molecule oily organic matter precipitated from the sealant 103, effectively preventing the small molecule oily organic matter precipitated from the sealant 103 from diffusing to the surface of the first ink layer 1021, thus improving the problems of glue separation and delamination in the display module.

[0038] Please continue reading. Figures 1A-1B The display module also includes optical adhesive 104 located between the cover plate 102 and the display panel 101.

[0039] Wherein, there is a gap between the orthographic projection of the sealant 103 on the display panel 101 and the orthographic projection of the optical adhesive 104 on the display panel 101; that is, the orthographic projection of the sealant 103 on the display panel 101 and the orthographic projection of the optical adhesive 104 on the display panel 101 do not intersect, so as to prevent small molecule oily organic matter precipitated from the sealant 103 from diffusing into the optical adhesive 104, causing problems such as delamination and peeling of the display module in the display area 100a, and affecting the display function of the display panel 101.

[0040] Optionally, the first ink layer 1021 is bonded to the optical adhesive 104 to avoid problems such as light leakage in the display module.

[0041] Since the orthographic projection of the sealant 103 on the display panel 101 does not intersect with the orthographic projection of the optical adhesive 104 on the display panel 101, and the small molecule oily organic matter precipitated from the sealant 103 does not diffuse to the surface of the first ink layer 1021 due to the presence of the second ink layer 1022, it can prevent the small molecule oily organic matter precipitated from the sealant 103 from diffusing into the optical adhesive 104 through the first ink layer 1021. This can improve problems such as delamination and peeling of the display module. At the same time, it can also prevent the small molecule oily organic matter precipitated from the sealant 103 from diffusing into the display panel 101 through the optical adhesive 104, thus affecting the display performance of the display panel.

[0042] Please continue reading. Figures 1A-1BThe display panel 101 includes an array substrate 1011, which includes a substrate, an active layer on the substrate, a first gate insulating layer (GI1) on the active layer, a first gate layer (GE1) on the side of the first gate insulating layer (GI1) away from the active layer, a dielectric insulating layer (ILD) on the first gate layer (GE1), a first source / drain layer (SD1) on the dielectric insulating layer (ILD), and a passivation layer (PV) and a first planarization layer (PLN1) on the first source / drain layer (SD1). The first gate layer (GE1) includes gate traces and a gate electrode aligned with the active layer. The first source / drain layer (SD1) includes source / drain traces and a source and a drain electrode electrically connected to the active layer.

[0043] Optionally, the array substrate 1011 further includes a second gate insulating layer (GI2) located on the first gate layer (GE1) and a second gate layer (GE2) located on the side of the second gate insulating layer (GI2) away from the first gate layer (GE1); the dielectric insulating layer (ILD) is located between the second gate layer (GE2) and the first source / drain layer (SD1). Optionally, the array substrate 1011 further includes a second source / drain layer (SD2) located on the first planarization layer (PLN1) and a second planarization layer (PLN2) located on the second source / drain layer (SD2).

[0044] The array substrate 1011 includes a bonding area located within the non-display area 100b; the array substrate 1011 includes a plurality of bonding terminals located within the bonding area, and the sealant 103 may be located within the bonding area and on the plurality of bonding terminals.

[0045] Optionally, the bonding area is located within the lower border area of ​​the display module. The display module further includes a driving module, which includes a flexible circuit board and a printed circuit board. The flexible circuit board includes a first end and a second end opposite to each other. The first end is electrically connected to the bonding terminal, and the second end is electrically connected to the printed circuit board, thereby realizing the electrical connection between the display panel 101 and the printed circuit board. Optionally, the flexible circuit board includes a flip-chip film.

[0046] If the display module is a liquid crystal display module, the array substrate 1011 further includes pixel electrodes, alignment layers, polarizers, liquid crystal molecules, etc. (not shown).

[0047] Please continue reading. Figures 1A-1BTaking a liquid crystal display module as an example, the display module further includes a color filter substrate 1012, which is located on the side of the array substrate 1011 near the cover plate 102. The sealant 103 is located within the bonding area of ​​the array substrate 1011 and between the array substrate 1011 and the second ink layer 1022. The orthographic projection of the second ink layer 1022 on the array substrate 1011 is in contact with the orthographic projection of the color filter substrate 1012 on the array substrate 1011, ensuring that the orthographic projection of the sealant 103 on the display panel 101 and the orthographic projection of the optical adhesive 104 on the display panel 101 have a certain gap. This prevents small molecule oily organic matter precipitated from the sealant 103 from diffusing to the surface of the first ink layer 1021 and from diffusing into the optical adhesive 104 via the first ink layer 1021, thereby preventing the small molecule oily organic matter precipitated from the sealant 103 from diffusing into the interior of the display panel 101 via the optical adhesive 104 and affecting the display performance of the display panel 101.

[0048] Furthermore, the display module also includes a backlight module 105 and a mid-frame 106. The backlight module 105 is located on the side of the display panel 101 away from the cover plate 102. The mid-frame 106 includes a groove and a stepped portion. The display panel 101 and the backlight module 105 are located in the groove. A portion of the cover plate 102 is disposed on the stepped portion. The cover plate 102 and the mid-frame 106 are bonded together with adhesive 107. The orthographic projection of the sealant 103 onto the backlight module 105 is located within the backlight module 105 to prevent small-molecule oily organic matter precipitated from the sealant 103 from diffusing into the adhesive 107, thus preventing problems such as delamination or detachment of the display module.

[0049] Specifically, the orthographic projection of the boundary L3 of the second ink layer 1022 away from the display area 100a on the backlight module 105 is spaced from the boundary L4 of the backlight module 105 away from the display area 100a, or the orthographic projection of the boundary L3 of the second ink layer 1022 away from the display area 100a on the backlight module 105 coincides with the boundary L4 of the backlight module 105 away from the display area 100a, so that there is a gap between the second ink layer 1022 and the adhesive 107, thereby preventing small molecule oily organic matter precipitated from the sealant 103 from diffusing into the adhesive 107 through the second ink layer 1022 or the first ink layer 1021, thereby improving the problem of the display module delamination and detachment.

[0050] Please see Figures 2A to 2D yes Figure 1A The image shows a partial enlarged view of point A in the display module. The display module also includes a driver chip IC, which can be integrated into the driver module (not shown in the figure) or disposed on the display panel 101.

[0051] For details, please continue reading Figure 2A When the driver chip IC is integrated into the driver module, it can be bonded to the bonding area in the form of a flip-chip film. At this time, the sealant 103 is located in the bonding area, and the second ink layer 1022 is also located in the bonding area. The orthographic projection of the sealant 103 on the array substrate 1011 is located within the orthographic projection of the second ink layer 1022 on the array substrate 1011, and the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 is greater than or equal to 0.1 mm.

[0052] Please continue reading. Figure 2B The driver chip IC is still bonded to the bonding area in the form of a flip-chip film. The non-display area 100b includes a first non-display area 1001b extending along a first direction x and a second non-display area 1002b connected to the first non-display area 1001b and extending along a second direction y, wherein the first direction x and the second direction y intersect. The sealant 103 is located within the first non-display area 1001b. The second ink layer 1022 includes a main body portion 1022a located within the first non-display area 1001b and an extension portion 1022b connected to the main body portion 1022a and located within the second non-display area 1002b. The orthographic projection of the sealant 103 onto the second ink layer 1022 is located within the boundary of the main body portion 1022a. Further, the distance L1 of the edge L1 of the sealant 103 from the edge of the main body portion 1022a of the second ink layer 1022 is greater than or equal to 0.1 mm.

[0053] By making the second ink layer 1022 include the main body portion 1022a and the extension portion 1022b, and the orthographic projection of the sealant 103 on the second ink layer 1022 is located within the boundary of the main body portion 1022a, the coverage area of ​​the second ink layer 1022 is increased. This prevents the small molecule oily organic matter precipitated from the sealant 103 from diffusing to the surface of the first ink layer 1021 located in the second non-display area 1002b, thereby preventing the small molecule oily organic matter precipitated from the sealant 103 from affecting the adhesive properties at the junction of the first non-display area 1001b and the second non-display area 1002b, and preventing the display module from experiencing the risk of delamination or detachment at the junction of the first non-display area 1001b and the second non-display area 1002b.

[0054] Optionally, the first non-display area 1001b and the bonding area are the same region. Optionally, the display panel may include a plurality of the bonding areas, at least one of the plurality of bonding areas and the first non-display area 1001b being the same region.

[0055] Furthermore, since the sealant 103 is only located within the first non-display area 1001b, in order to increase the coverage area of ​​the second ink layer 1022 while reducing production costs and adapting to the rounded transition design adopted by the display module at the four corners, the width of the extension 1022b gradually decreases in the direction away from the first non-display area 1001b.

[0056] Please continue reading. Figures 2C to 2D The driver chip IC can also be located within the non-display area 100b. To avoid the small molecule oily organic matter precipitated from the sealant 103 affecting the performance of the driver chip IC, the orthographic projection of the sealant 103 on the array substrate 1011 does not intersect with the orthographic projection of the driver chip IC on the array substrate 1011.

[0057] Furthermore, since the orthographic projection of the sealant 103 on the array substrate 1011 does not intersect with the orthographic projection of the driver chip IC on the array substrate 1011, in order to save costs and avoid the small molecule oily organic matter precipitated from the sealant 103 affecting the performance of the driver chip IC through the second ink layer 1022, the orthographic projection of the second ink layer 1022 on the array substrate 1011 does not intersect with the orthographic projection of the driver chip IC on the array substrate 1011.

[0058] Specifically, the sealant 103 includes a first sealant 1031 and a second sealant 1032 spaced apart along the first direction x. The driver chip IC is located within the non-display area 100b and between the first sealant 1031 and the second sealant 1032. The second ink layer 1022 includes a first sub-ink layer 1022c and a second sub-ink layer 1022d. The orthographic projection of the first sealant 1031 onto the display panel 101 lies within the orthographic projection of the first sub-ink layer 1022c onto the display panel 101, and the distance between the edge L5 of the first sealant 1031 and the edge L6 of the first sub-ink layer 1022c is greater than or equal to 0.1 mm. The orthographic projection of the second sealant 1032 onto the display panel 101 lies within the orthographic projection of the second sub-ink layer 1022d onto the display panel 101, and the distance between the edge L7 of the second sealant 1032 and the edge L7 of the second sub-ink layer 1022d is greater than or equal to 0.1 mm. The distance L8 is greater than or equal to 0.1 mm, so as to prevent the small molecule oily organic matter precipitated from the first sealant 1031 from diffusing to the surface of the first ink layer 1021 by utilizing the first sub-ink layer 1022c, and to prevent the small molecule oily organic matter precipitated from the second sealant 1032 from diffusing to the surface of the first ink layer 1021 by utilizing the second sub-ink layer 1022d, and to prevent the small molecule oily organic matter precipitated from the first sealant 1031 and the second sealant 1032 from diffusing through the first ink layer 1021 into the driver chip IC, thereby affecting the performance of the driver chip IC.

[0059] Furthermore, the driving chip is located within the first non-display area 1001b. Both the first sub-ink layer 1022c and the second sub-ink layer 1022d include the main body portion 1022a and the extension portion 1022b to increase the coverage area of ​​the second ink layer 1022. This prevents small molecule oily organic matter precipitated from the first sub-ink layer 1022c and the second sub-ink layer 1022d from diffusing to the surface of the first ink layer 1021 located at the junction of the first non-display area 1001b and the second non-display area 1002b, thus avoiding adhesive failure or delamination of the display module at the junction of the first non-display area 1001b and the second non-display area 1002b.

[0060] Optionally, the driver chip IC, the first sealant 1031, and the second sealant 1032 are all located within the first non-display area 1001b.

[0061] Optionally, the display module may include a plurality of driver chip ICs, all of which are located within the non-display area 100b; wherein, at least some of the driver chip ICs have sealant 103 at both ends, the second ink layer 1022 is disposed corresponding to the sealant 103, and the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 is greater than or equal to 0.1 mm.

[0062] For details, please continue reading Figure 2D The display module includes a first driver chip IC1 and a second driver chip IC2. The sealant 103 includes a first sealant 1031, a second sealant 1032, and a third sealant 1033 spaced apart along a first direction x. The first driver chip IC1 and the second driver chip IC2 are located within the non-display area 100b and between the first sealant 1031 and the second sealant 1032; the third sealant 1033 is located between the driver chip IC1 and the second driver chip IC2. The second ink layer 1022 includes a first sub-ink layer 1022c, a second sub-ink layer 1022d, and a third sub-ink layer 1022e.

[0063] Wherein, the orthographic projection of the first sealant 1031 on the display panel 101 is located within the orthographic projection of the first sub-ink layer 1022c on the display panel 101, and the distance between the edge of the first sealant 1031 and the edge of the first sub-ink layer 1022c is greater than or equal to 0.1 mm; the orthographic projection of the second sealant 1032 on the display panel 101 is located within the orthographic projection of the second sub-ink layer 1022d on the display panel 101, and the distance between the edge of the second sealant 1032 and the edge of the second sub-ink layer 1022d is greater than or equal to 0.1 mm; the orthographic projection of the third sealant 1033 on the display panel 101 is located within the orthographic projection of the third sub-ink layer 1022e on the display panel 101, and the distance between the edge of the third sealant 1033 and the edge of the third sub-ink layer 1022e is greater than or equal to 0.1 mm.

[0064] Optionally, the junctions of the first sub-ink layer 1022c and the second sub-ink layer 1022d near the first non-display area 1001b and the second non-display area 1002b may be designed with an arc shape to accommodate the arc transition design of the display module in the four corner areas.

[0065] Alternatively, please continue reading Figures 1A-1BThe area of ​​the first ink layer 1021 in the non-display area 100b is larger than the area of ​​the second ink layer 1022 in the non-display area 100b. The cover plate 102 also includes a substrate 1023 and a third ink layer 1024. The third ink layer 1024 is located on the side of the first ink layer 1021 away from the second ink layer 1022. The first ink layer 1021, the second ink layer 1022, and the third ink layer 1024 are formed on the substrate 1023. The light-shielding performance is improved by setting the first ink layer 1021 and the third ink layer 1024.

[0066] Optionally, the main components of the first ink layer 1021 and the third ink layer 1024 include resin, diluent, toner, etc., and the main components of the second ink layer 1022 include resin, diluent, titanium dioxide, etc.

[0067] The second ink layer 1022 can be prepared on the first ink layer 1021 using a printing process. The thickness of the second ink layer 1022 is greater than or equal to 4 micrometers and less than or equal to 10 micrometers, to avoid the second ink layer 1022 being too thin and unable to prevent the small molecule oily organic matter precipitated from the sealant 103 from diffusing to the surface of the first ink layer 1021, while also avoiding the second ink layer 1022 being too thick, which would increase manufacturing costs. Further, the thickness of the second ink layer 1022 is equal to 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 8 micrometers, or 10 micrometers.

[0068] Optionally, the second ink layer 1022 may also directly cover the surface of the sealant 103, and the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 is greater than or equal to 0.1 mm.

[0069] like Figures 3A-3B This is a comparison chart showing the differences in the blocking effect of ink selection on pollution sources provided in this embodiment of the invention; the first ink layer 1021 can be selected as matte black ink, and the second ink layer 1022 can be selected as high-gloss ink. That is, the dyne value of the first ink layer 1021 is less than 32 N / m; the dyne value of the second ink layer 1022 is less than 28 N / m; the interface expansion area ratio Sdr of the second ink layer 1022 is greater than the interface expansion area ratio Sdr of the first ink layer 1021.

[0070] Different high-gloss inks exhibit significantly different blocking effects against contaminants. Therefore, when selecting high-gloss inks, it is essential to ensure a smooth surface after printing, with the surface texture remaining dense and smooth even under microscopic observation at 800x or higher magnification. Figure 3A As shown. Figure 3BThe selected high-gloss ink resulted in a rough surface after printing; microscopic images at 800x or higher magnification showed a rough surface texture, failing to meet the requirements.

[0071] like Figures 4A to 4C These are experimental comparison diagrams provided in the embodiments of the present invention. The sealant 103 and the second ink layer 1022 are adopted. Figure 2B The design shown. The inventors of this invention have determined that the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 is equal to 0.05 mm (e.g., ...). Figure 4A (as shown), 0.1 mm (e.g.) Figure 4B (as shown), 0.2 mm (e.g.) Figure 4C As shown, tests were conducted. Specifically, firstly, in a Class 1000 cleanroom, the sealant 103 was applied to the cover plate 102 sample printed with the second ink layer 1022. The application width of the sealant 103 was 1.0 ± 0.05 mm. Then, test strokes (such as...) were drawn on the surface of the first ink layer 1021 using a dyne pen. Figures 4A to 4C (As shown in T in the diagram); After a 50-day test, it was proven that when the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 was 0.05 mm, the dyne ink on the surface of the first ink layer 1021 shrank (shrinkage distance was 0.1104 mm); the second ink layer 1022 was not very effective in preventing the diffusion of small molecule oily organic matter precipitated from the sealant 103 on the surface of the first ink layer 1021, and the dyne value on the surface of the first ink layer 1021 decreased. However, when the distance between the edge L1 of the sealant 103 and the edge L2 of the second ink layer 1022 was greater than or equal to 0.1 mm, the second ink layer 1022 could effectively prevent the diffusion of small molecule oily organic matter precipitated from the sealant 103 on the surface of the first ink layer 1021, and the dyne value test on the surface of the first ink layer 1021 after 50 days still met the design requirements, and the dyne ink on the surface of the first ink layer 1021 did not shrink.

[0072] The present invention also provides a display device, wherein the display device comprises any of the above-described display modules.

[0073] Understandably, the display device includes portable display devices (such as laptops, mobile phones, etc.), fixed terminals (such as desktop computers, televisions, etc.), measuring devices (such as fitness trackers, thermometers, etc.), etc.

[0074] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A display module, characterized in that, The display module includes a display area and a non-display area surrounding the display area. The non-display area includes a first non-display area extending along a first direction and a second non-display area connected to the first non-display area and extending along a second direction, wherein the first direction intersects the second direction. The display module includes: Display panel; A cover plate, located on the display panel, the cover plate including a first ink layer and a second ink layer located within the non-display area, the second ink layer being located on the side of the first ink layer closer to the display panel; the cover plate also including a third ink layer located on the side of the first ink layer away from the second ink layer; and, The sealant is located within the first non-display area and between the display panel and the second ink layer; Wherein, the orthographic projection of the sealant on the display panel is located within the orthographic projection of the second ink layer on the display panel, and the distance between the edge of the sealant and the edge of the second ink layer is greater than or equal to 0.1 mm; the orthographic projection of the second ink layer on the display panel is located within the orthographic projection of the first ink layer on the display panel; The second ink layer includes a main body located within the first non-display area and an extension connected to the main body and located within the second non-display area. The orthographic projection of the sealant on the second ink layer is located within the boundary of the main body. The second ink layer has an arc transition near the junction of the first and second non-display areas, and the width of the extension gradually decreases in the direction away from the first non-display area.

2. The display module according to claim 1, characterized in that, The interface expansion area ratio of the second ink layer is greater than that of the first ink layer.

3. The display module according to claim 1, characterized in that, The dyne value of the second ink layer is less than that of the first ink layer.

4. The display module according to claim 1, characterized in that, The display panel includes an array substrate and a color filter substrate located on the side of the array substrate near the cover plate; The sealant is located between the array substrate and the second ink layer, and the orthographic projection of the second ink layer on the array substrate is in contact with the orthographic projection of the color filter substrate on the array substrate.

5. The display module according to claim 1, characterized in that, The display module also includes a backlight module located on the side of the display panel away from the cover plate; Wherein, the orthographic projection of the boundary of the second ink layer away from the display area onto the backlight module coincides with the boundary of the backlight module.

6. The display module according to claim 1, characterized in that, The sealant includes a first sealant and a second sealant spaced apart along a first direction; the display panel also includes a driver chip located within the non-display area and between the first sealant and the second sealant; the second ink layer includes a first sub-ink layer and a second sub-ink layer. Wherein, the orthographic projection of the first sealant on the display panel is located within the orthographic projection of the first sub-ink layer on the display panel, and the distance between the edge of the first sealant and the edge of the first sub-ink layer is greater than or equal to 0.1 mm; the orthographic projection of the second sealant on the display panel is located within the orthographic projection of the second sub-ink layer on the display panel, and the distance between the edge of the second sealant and the edge of the second sub-ink layer is greater than or equal to 0.1 mm.

7. The display module according to claim 1, characterized in that, The thickness of the second ink layer is greater than or equal to 4 micrometers and less than or equal to 10 micrometers.

8. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 7.

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