Silicon carbide wafer cutting equipment

Abstract

The present invention belongs to the field of wafer processing technology, and in particular to a silicon carbide wafer cutting device. In view of the problem of wafer cutting waste in the bottom stage and cutting method of the wafer, the following scheme is proposed, including a main box, a front base is fixed by bolts at the front bottom position of the main box, a stage mechanism is arranged on the bottom inner wall of the main box, a wax coating mechanism is arranged on the top of the front base, and a cutting mechanism is arranged on the top inner wall of the main box. The present invention coats a wax layer on the bottom of the wafer body, and a support position can be formed by laser melting the excess wax layer according to the cutting position, and a cutting groove is formed by the cutting head on the top. This series can realize subtle variable adjustment, and the air jet needle can generate instantaneous force through air pressure blowing to protect the uniformity of the cut surface of the wafer body, and can realize the cutting of smaller wafer chips, with a more refined cutting area adjustment effect.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to silicon carbide wafer cutting equipment. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, or wafer. When the wafer body is used, the wafer also needs to be cut into regular chip sizes.

[0003] The existing wafer cutting has the following problems: the current wafer cutting will adopt a manual cutting process, and will also use more sophisticated equipment to cut the wafer. Among them, laser cutting technology is the current mainstream technology, but the current laser cutting platform is a flat platform, that is, the wafer is in direct contact with the platform, so that there is no support at the bottom, and the cutting must rely entirely on the penetration of the laser cutting to complete. In this way, the cutting section of the wafer will produce a section with the same width as the laser beam or even larger than the laser beam. The wafer is relatively precious, so it will cause more waste. Referring to the cutting of glass, it only needs to produce scratches on the surface and then external force can cause fracture. Therefore, the current wafer cutting equipment needs to improve the bottom platform and cutting method of the wafer to solve the problem of waste of the wafer body in the current wafer cutting. The existing technology is not easy to solve this problem. Therefore, silicon carbide wafer cutting equipment is urgently needed to solve the above problems. Summary of the invention

[0004] Based on the technical problem that current wafer cutting has wafer cutting waste in the bottom stage of the wafer and the cutting method, the present invention proposes a silicon carbide wafer cutting device.

[0005] A silicon carbide wafer cutting device proposed in the present invention comprises a main case, a front base is fixed by bolts at the front bottom position of the main case, a platform mechanism is arranged on the bottom inner wall of the main case, a wax coating mechanism is arranged on the top of the front base, a cutting mechanism is arranged on the top inner wall of the main case, the platform mechanism comprises a cutting platform base fixed by bolts at the bottom of the main case, a second electric push rod is fixed by bolts at the top middle of the cutting platform base, a top output shaft of the second electric push rod is fixed by bolts to a cutting platform top seat, a horizontal laser bottom box is arranged at the top middle position of the cutting platform top seat, a transparent top plate is fixed at the top circumferential position of the laser bottom box, and material picking mechanisms are arranged at both sides of the top of the cutting platform top seat.

[0006] Preferably, the wax coating mechanism includes four supporting columns fixed on the top of the front base, a wafer disc is placed on the top of the four supporting columns, a wafer slot is provided in the middle of the wafer disc, a first hole is provided in the middle of the top of the front base, and a horizontal lifting wax disc is slidably fixed on the inner wall of the first hole, and a wax containing groove is provided on the top of the lifting wax disc.

[0007] Preferably, the material picking mechanism includes side grooves opened on both sides of the top of the cutting platform top seat, the bottom of the side groove is hingedly fixed with an inclined bracket by bolts, the top of the inclined bracket is hingedly provided with a horizontally arranged material picking bracket, one end of the material picking bracket is plugged and fixed with a horizontally arranged material picking fork, a third electric push rod is hingedly fixed between the middle of the bottom of the inclined bracket and the bottom of the side groove, four cutting platform limit rods are fixed to the bottom of the cutting platform top seat, and the four cutting platform limit rods are slidably plugged with the top of the cutting platform base.

[0008] Preferably, two laser bottom box slide grooves are opened on the top of the cutting platform top seat, and two laser bottom box slide seats are fixed to the bottom of the laser bottom box by bolts, and the two laser bottom box slide seats are respectively slidably engaged with the two laser bottom box slide grooves.

[0009] Preferably, the cutting mechanism includes two front end covers fixed by bolts on the top of the main box, and a sliding bracket is fixed on the side where the two front end covers are close to each other, and a first slider is slidably clamped on the side where the two sliding brackets are close to each other, and a horizontally arranged sliding rod is fixed to the bottom between the two first sliders by bolts, and a second slider is slidably clamped on the circumferential outer walls of the two sliding rods, and a rotating round seat is embedded and fixed at the bottom of the second slider, and a vertically arranged cutting top seat is fixed to the bottom of the rotating round seat by bolts, and a vertically arranged first electric push rod is embedded and fixed in the middle of the bottom of the cutting top seat, and a cutting base is fixed to the bottom output shaft of the first electric push rod, and four cutting base limit rods are fixed on the top of the cutting base, and the four cutting base limit rods are slidably plugged with the bottom inner wall of the cutting top seat.

[0010] Preferably, air jet needle slide grooves are provided on both sides of the bottom of the cutting base, and air jet needle slide seats are slidably connected to the inner walls of both sides of the two air jet needle slide grooves, and the same bidirectional screw rod fixed by bearings is inserted between the two air jet needle slide grooves, and the two ends of the bidirectional screw rod are respectively threadedly sleeved with the two air jet needle slide seats, and vertically arranged air jet needles are fixed on the bottom of the two air jet needle slide seats, and a vertically arranged cutting head is fixed at the middle position of the bottom of the cutting base, and the bottom tip of the cutting head is lower than the bottom tip of the air jet needle.

[0011] Preferably, sliding blocks are fixed to the two ends of the sliding bracket by bolts, a slider limit rod is fixed to the top between the two sliding blocks by bearings, and the slider limit rod is slidingly sleeved with the first slider, a slider moving screw is fixed to the bottom between the two sliding blocks by bearings, and the slider moving screw is threadedly sleeved with the first slider.

[0012] Preferably, four fourth electric push rods are hingedly fixed by bolts at the middle position of the bottom inner wall of the laser base box, the top output shafts of the four fourth electric push rods are hingedly connected to the same laser head, and a light guide mirror is fixed on the top of the laser head.

[0013] Preferably, a wafer body is placed on the top of the wafer tray at the location of the wafer slot.

[0014] Preferably, a vertically arranged lifting window is slidably inserted in the middle of the top of the front base, a front mask is fixed to the top of the front base by bolts, and the front mask is sealed and fixed to the main chassis by bolts.

[0015] The beneficial effects of the present invention are:

[0016] 1. The silicon carbide wafer cutting equipment coats a wax layer on the bottom of the wafer body, and melts the excess wax layer by laser according to the cutting position to form a support position. The cutting groove formed by the cutting head on the top can achieve subtle variable adjustments, and the air jet needle can generate instantaneous force through air pressure blowing to protect the uniformity of the cut surface of the wafer body, and can achieve the cutting of smaller wafer chips, with a more refined cutting area adjustment effect.

[0017] 2. The silicon carbide wafer cutting equipment controls the four fourth electric push rods at the bottom to make the laser head melt the wax layer at the bottom of the cutting groove with high energy, forming a melted wax layer at the bottom of the wafer body, and forming an unmelted supporting wax seat at the bottom of the position to be cut. The wafer body forms a wafer retention area and a wafer cutting area on both sides of the cutting groove. At this time, the preliminary preparations for the cutting work have been completed. At this time, the two air jets are aimed at the wafer retention area and the wafer cutting area on both sides of the cutting groove for high-pressure blowing to cut the wafer body.

[0018] 3. When cutting wafers, the silicon carbide wafer cutting equipment first applies a wax layer, the lifting wax plate rises, and the molten wax liquid inside forms a smooth and flat wax layer of the same thickness on the bottom of the wafer body; after the wax layer is coated, the material is fed, the top material picking is directly supported by the third electric push rod, and the picking fork is extended to remove the wafer plate, and the wafer plate is placed on the transparent top plate on the top of the laser bottom box by descending the third electric push rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the internal structure of the overall cutting mechanism of a silicon carbide wafer cutting device proposed by the present invention;

[0020] Figure 2 A schematic diagram of the overall internal structure of a silicon carbide wafer cutting device proposed by the present invention;

[0021] Figure 3 A schematic cross-sectional side view of a silicon carbide wafer cutting device proposed by the present invention;

[0022] Figure 4 This is an enlarged schematic diagram of the internal structure of a cutting mechanism of a silicon carbide wafer cutting device proposed by the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of a laser bottom box of a silicon carbide wafer cutting device proposed by the present invention;

[0024] Figure 6 A schematic diagram of the partial structure of a wax layer of a silicon carbide wafer cutting device proposed by the present invention;

[0025] Figure 7 This is a schematic diagram of the bottom surface structure of the cutting position of a silicon carbide wafer cutting device proposed by the present invention;

[0026] Figure 8 This is a front structural schematic diagram of the cutting position of a silicon carbide wafer cutting device proposed in the present invention.

[0027] In the figure: 1. Main chassis; 2. Front base; 3. Lifting window; 4. Front mask; 5. Laser bottom box; 6. Transparent top plate; 7. Air jet needle; 8. Cutting base; 9. Cutting base limit rod; 10. First electric push rod; 11. Cutting top seat; 12. Oblique bracket; 13. Material pick-up bracket; 14. Support column; 15. Lifting wax tray; 16. Wax tank; 17. Wafer tray; 18. Wafer tank; 19. Material pick-up fork; 20. Front cover; 21. Cutting stage base; 22. Second electric push rod; 23. Cutting stage limit rod; 24. Cutting stage top seat; 25. Sliding block; 2 6. Sliding bracket; 27. First slider; 28. Sliding rod; 29. ​​Second slider; 30. Third electric push rod; 31. Laser base box slide groove; 32. Jet needle slide groove; 33. Jet needle slide seat; 34. Rotating round seat; 35. Slider limit rod; 36. Slider moving lead screw; 37. Cutting head; 38. Laser base box slide seat; 39. Fourth electric push rod; 40. Light guide mirror; 41. Laser head; 42. Wax layer; 4201. Support wax seat; 4202. Melt wax layer; 43. Wafer body; 4301. Wafer reserved area; 4302. Wafer cutting area; 44. Cutting groove. DETAILED DESCRIPTION

[0028] Reference Figure 1-Figure 8 A silicon carbide wafer cutting device comprises a main case 1, a front base 2 is fixed by bolts at the front bottom position of the main case 1, a carrier mechanism is arranged on the bottom inner wall of the main case 1, a wax coating mechanism is arranged on the top of the front base 2, a cutting mechanism is arranged on the top inner wall of the main case 1, the carrier mechanism comprises a cutting carrier base 21 fixed by bolts at the bottom of the main case 1, a second electric push rod 22 is fixed by bolts in the middle of the top of the cutting carrier base 21, a cutting carrier top seat 24 is fixed to the top output shaft of the second electric push rod 22 by bolts, a horizontal laser bottom box 5 is arranged in the middle of the top of the cutting carrier top seat 24, a transparent top plate 6 is fixed on the top circumference of the laser bottom box 5, and material taking mechanisms are arranged on both sides of the top of the cutting carrier top seat 24.

[0029] Furthermore, the wax coating mechanism includes four support columns 14 fixed on the top of the front base 2, a wafer plate 17 is placed on the top of the four support columns 14, a wafer groove 18 is opened in the middle of the wafer plate 17, a first hole is opened in the middle of the top of the front base 2, and a horizontal lifting wax plate 15 is slidably fixed on the inner wall of the first hole, and a wax containing groove 16 is opened on the top of the lifting wax plate 15;

[0030] Furthermore, the material-retrieving mechanism includes side grooves opened on both sides of the top of the cutting platform top seat 24, the bottom of the side groove is hingedly fixed with an oblique bracket 12 by bolts, the top of the oblique bracket 12 is hingedly connected with a horizontally arranged material-retrieving bracket 13, one end of the material-retrieving bracket 13 is plugged and fixed with a horizontally arranged material-retrieving fork 19, the same third electric push rod 30 is hingedly fixed between the middle of the bottom of the oblique bracket 12 and the bottom of the side groove, four cutting platform limiting rods 23 are fixed to the bottom of the cutting platform top seat 24, and the four cutting platform limiting rods 23 are slidably plugged with the top of the cutting platform base 21;

[0031] Furthermore, two laser bottom box slide grooves 31 are provided on the top of the cutting platform top seat 24, and two laser bottom box slide seats 38 are fixed to the bottom of the laser bottom box 5 by bolts, and the two laser bottom box slide seats 38 are respectively slidably engaged with the two laser bottom box slide grooves 31;

[0032] Further, the cutting mechanism includes two front end covers 20 fixed by bolts on the top of the main box 1, and a sliding bracket 26 is fixed on the side where the two front end covers 20 are close to each other, and a first slider 27 is slidably clamped on the side where the two sliding brackets 26 are close to each other, and a horizontally arranged sliding rod 28 is fixed to the bottom between the two first sliders 27 by bolts, and a second slider 29 is slidably clamped on the circumferential outer walls of the two sliders 28, and a rotating round seat 34 is embedded and fixed at the bottom of the second slider 29, and a vertically arranged cutting top seat 11 is fixed to the bottom of the rotating round seat 34 by bolts, and a vertically arranged first electric push rod 10 is embedded and fixed in the middle of the bottom of the cutting top seat 11, and a cutting base 8 is fixed to the bottom output shaft of the first electric push rod 10, and four cutting base limiting rods 9 are fixed on the top of the cutting base 8, and the four cutting base limiting rods 9 are slidably plugged with the bottom inner wall of the cutting top seat 11;

[0033] Furthermore, both sides of the bottom of the cutting base 8 are provided with air jet needle slide grooves 32, and the inner walls of both sides of the two air jet needle slide grooves 32 are slidably connected with air jet needle slide seats 33, and the same bidirectional screw rod fixed by a bearing is inserted between the two air jet needle slide grooves 32, and the two ends of the bidirectional screw rod are respectively threadedly sleeved with the two air jet needle slide seats 33, and the bottoms of the two air jet needle slide seats 33 are fixed with vertically arranged air jet needles 7, and the middle position of the bottom of the cutting base 8 is fixed with a vertically arranged cutting head 37, and the bottom tip of the cutting head 37 is lower than the bottom tip of the air jet needle 7;

[0034] Further, the two ends of the sliding bracket 26 are fixed with sliding blocks 25 by bolts, the top between the two sliding blocks 25 is fixed with a slider limiting rod 35 by a bearing, and the slider limiting rod 35 is slidably sleeved with the first slider 27, and the bottom between the two sliding blocks 25 is fixed with a slider moving screw rod 36 by a bearing, and the slider moving screw rod 36 is threadedly sleeved with the first slider 27;

[0035] Furthermore, four fourth electric push rods 39 are hingedly fixed to the middle position of the bottom inner wall of the laser bottom box 5 by bolts, and the top output shafts of the four fourth electric push rods 39 are hingedly connected to the same laser head 41, and a light guide mirror 40 is fixed to the top of the laser head 41;

[0036] Furthermore, a wafer body 43 is placed on the top of the wafer plate 17 at the position of the wafer slot 18;

[0037] Furthermore, a vertically arranged lifting window 3 is slidably inserted in the middle of the top of the front base 2, a front mask 4 is fixed to the top of the front base 2 by bolts, and the front mask 4 and the main box 1 are sealed and fixed by bolts.

[0038] When the present invention is used: the entire cutting device is fixed in the working position, the front cover 4 and the lifting window 3 in the front can maintain the dust-free environment inside, the feeding process can be carried out through the lifting window 3, when cutting, the operator places the wafer body 43 in the wafer groove 18 on the top of the wafer tray 17, the wafer groove 18 can support the wafer body 43, close the lifting window 3, and the wafer cutting process is carried out inside. When cutting the wafer, the wax layer 42 is first coated, the lifting wax tray 15 is raised, and the molten wax liquid inside is on the wafer body. A smooth wax layer 42 of the same thickness is formed on the bottom of the body 43; after the wax layer 42 is coated, the material is fed, the top material taking device 13 is propped up by the third electric push rod 30, and the material taking fork 19 is extended to remove the wafer disc 17, and the wafer disc 17 is placed on the transparent top plate 6 on the top of the laser bottom box 5 by the third electric push rod 30 descending. In the cutting process, firstly, the top cutting mechanism moves and the bottom cutting head 37 cuts at the position where cutting is required, and a cutting groove 44 is formed on the top of the wafer body 43. At this time, through the control of the four fourth electric push rods 39 at the bottom, the laser head 41 is made to melt the wax layer 42 at the bottom of the cutting groove 44 with high energy, and a melted wax layer 4202 is formed at the bottom of the wafer body 43, and an unmelted supporting wax seat 4201 is formed at the bottom of the position to be cut. The wafer body 43 forms a wafer reserved area 4301 and a wafer cutting area 4302 on both sides of the cutting groove 44. At this time, the preliminary preparations for the cutting work have been completed. At this time, the two air jets 7 are aligned with the wafer reserved areas 4301 and the wafer cutting areas 4302 on both sides of the cutting groove 44. The circular cutting area 4302 is subjected to high-pressure blowing to cut the wafer body 43; a supporting position can be formed by coating a wax layer 42 on the bottom of the wafer body 43 and melting the excess wax layer 42 by laser according to the cutting position, and a cutting groove 44 is formed by the cutting head 37 on the top. This series can achieve subtle variable adjustments, and the air jet needle 7 can generate instantaneous force through air pressure blowing to protect the uniformity of the cut surface of the wafer body 43, and can achieve the cutting of smaller wafer chips, with a more refined cutting area adjustment effect.

[0039] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A silicon carbide wafer cutting device, comprising a main box (1), a front base (2) being fixed at the front bottom of the main box (1) by bolts, and a platform mechanism being arranged on the bottom inner wall of the main box (1), characterized in that: A wax coating mechanism is arranged on the top of the front base (2), and a cutting mechanism is arranged on the top inner wall of the main box (1), the cutting mechanism comprising two front end covers (20) fixed to the top of the main box (1) by bolts, and a sliding bracket (26) is fixed to the adjacent sides of the two front end covers (20), and a first slider (27) is slidably engaged with the adjacent sides of the two sliding brackets (26), and a horizontally arranged sliding rod (28) is fixed to the bottom between the two first sliders (27) by bolts, and a second slider (29) is slidably engaged with the circumferential outer walls of the two sliding rods (28), A rotating round seat (34) is embedded and fixed at the bottom of the second sliding block (29); a vertically arranged cutting top seat (11) is fixed to the bottom of the rotating round seat (34) by bolts; a vertically arranged first electric push rod (10) is embedded and fixed in the middle of the bottom of the cutting top seat (11); a cutting base (8) is fixed to the bottom output shaft of the first electric push rod (10); four cutting base limiting rods (9) are fixed to the top of the cutting base (8); and the four cutting base limiting rods (9) are slidably plugged into the bottom inner wall of the cutting top seat (11); the bottom of the cutting base (8) is fixed to the bottom output shaft of the first electric push rod (10); Both sides of the part are provided with jet needle slide grooves (32), and the inner walls of both sides of the two jet needle slide grooves (32) are slidably connected with jet needle slide seats (33), and the same bidirectional screw rod fixed by a bearing is inserted between the two jet needle slide grooves (32), and the two ends of the bidirectional screw rod are respectively threadedly sleeved with the two jet needle slide seats (33), and the bottoms of the two jet needle slide seats (33) are fixed with vertically arranged jet needles (7), and the middle position of the bottom of the cutting base (8) is fixed with a vertically arranged cutting head (37), and the bottom tip of the cutting head (37) is lower than the jet needle (7). The bottom tip of the cutting platform mechanism comprises a cutting platform base (21) fixed by bolts to the bottom of the main box (1); a second electric push rod (22) is fixed by bolts to the middle of the top of the cutting platform base (21); the top output shaft of the second electric push rod (22) is fixed by bolts to a cutting platform top seat (24); a horizontal laser bottom box (5) is arranged at the middle position of the top of the cutting platform top seat (24); a transparent top plate (6) is fixed at the top circumferential position of the laser bottom box (5); and material taking mechanisms are arranged at both sides of the top of the cutting platform top seat (24); The wax coating mechanism comprises four support columns (14) fixed on the top of the front base (2), a wafer disc (17) is placed on the top of the four support columns (14), a wafer groove (18) is provided in the middle of the wafer disc (17), a first hole is provided in the middle of the top of the front base (2), and a horizontal lifting wax disc (15) is slidably fixed on the inner wall of the first hole, and a wax containing groove (16) is provided on the top of the lifting wax disc (15).

2. The silicon carbide wafer cutting device according to claim 1, characterized in that: The material picking mechanism comprises side grooves opened on both sides of the top of the cutting platform top seat (24); an inclined bracket (12) is hingedly fixed to the bottom of the side groove by bolts; a horizontally arranged material picking bracket (13) is hingedly connected to the top of the inclined bracket (12); a horizontally arranged material picking fork (19) is plugged and fixed to one end of the material picking bracket (13); a third electric push rod (30) is hingedly fixed between the middle of the bottom of the inclined bracket (12) and the bottom of the side groove; four cutting platform limiting rods (23) are fixed to the bottom of the cutting platform top seat (24), and the four cutting platform limiting rods (23) are slidably plugged with the top of the cutting platform base (21).

3. The silicon carbide wafer cutting device according to claim 1, characterized in that: The top of the cutting platform top seat (24) is provided with two laser bottom box slide grooves (31), the bottom of the laser bottom box (5) is fixed with two laser bottom box slide seats (38) by means of bolts, and the two laser bottom box slide seats (38) are respectively slidably engaged with the two laser bottom box slide grooves (31).

4. The silicon carbide wafer cutting device according to claim 1, characterized in that: The two ends of the sliding bracket (26) are fixed with sliding blocks (25) by bolts, a slider limiting rod (35) is fixed to the top between the two sliding blocks (25) by a bearing, and the slider limiting rod (35) is slidably sleeved with the first slider (27), and a slider moving screw rod (36) is fixed to the bottom between the two sliding blocks (25) by a bearing, and the slider moving screw rod (36) is threadedly sleeved with the first slider (27).

5. The silicon carbide wafer cutting device according to claim 1, characterized in that: Four fourth electric push rods (39) are hingedly fixed by bolts at the middle position of the bottom inner wall of the laser base box (5); the top output shafts of the four fourth electric push rods (39) are hingedly connected to the same laser head (41); and a light guide mirror (40) is fixed to the top of the laser head (41).

6. The silicon carbide wafer cutting device according to claim 1, characterized in that: A wafer body (43) is placed on the top of the wafer plate (17) at the position of the wafer groove (18).

7. The silicon carbide wafer cutting device according to claim 1, characterized in that: A vertically arranged lifting window (3) is slidably inserted in the middle of the top of the front base (2), a front mask (4) is fixed to the top of the front base (2) by bolts, and the front mask (4) and the main box (1) are sealed and fixed by bolts.

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