An automatic processing device for waste computer circuit board parts

Abstract

The application relates to the technical field of circuit board processing, and provides an automatic processing device for waste computer circuit board parts, which comprises a base serving as a basic bearing component and used for providing a basic mounting plane; a heating mechanism arranged at the rear top end of the base and used for heating and scraping tin-based alloy on the surface of a circuit board; a separation mechanism arranged at the front top end of the base and used for separating the circuit board and electronic elements on the surface of the circuit board; an air suction mechanism arranged in the heating mechanism and used for guiding hot air and treating irritating gas generated when the tin-based alloy is melted; and a quantitative transfer mechanism arranged at the front of the separation mechanism and used for quantitatively transferring the processed circuit board. The heating mechanism can heat and strip the tin-based alloy, the purity of the tin-based alloy is guaranteed, and the electronic elements can be separated from the circuit board in cooperation with the separation mechanism, so that some usable elements are prevented from being wasted.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to an automated processing device for waste computer circuit board parts. Background Technology

[0002] A computer is an electronic device that can operate according to a predetermined program, and the circuit board is one of the basic components that maintain the normal operation of the computer. It connects related electronic components through circuits made of precious metals, thereby forming a reliable electrical connection and path. However, for old computers, in order to save natural resources and avoid waste, it is necessary to recycle components such as circuit boards that contain a variety of precious metal materials. A common recycling method is to crush the circuit board so that the various materials inside are no longer restricted by the outer shell. Further, combined with methods such as air separation, gravity screening, and thermal melting, the target materials can be separated and collected from the mixture.

[0003] However, since most electronic components on the circuit board are connected to the circuit board by wave soldering, they are not easy to separate from the circuit board under the action of tin-based alloy. At this time, some reusable electronic components will be crushed along with the circuit board. In addition, the tin-based alloy used for fixing will produce an irritating odor when heated. When it is crushed and melted along with the circuit board, the tin-based alloy may produce a large amount of irritating odor under continuous heating, which is not conducive to environmental protection. At the same time, after melting, the tin-based alloy may mix with other precious metals, increasing the recycling cost of the tin-based alloy. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an automated processing device for waste computer circuit board parts. It solves the problems of electronic components being difficult to separate from circuit boards due to the action of tin-based alloys, which may lead to the crushing of some still usable and valuable electronic components along with the circuit boards, as well as the generation of a large amount of irritating odor when tin-based alloys are melted along with some materials, and the possibility that the molten tin-based alloys may mix with other materials, increasing the recycling cost.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automated processing device for waste computer circuit board parts, comprising:

[0006] The base, as a basic load-bearing component, is used to provide a basic mounting surface;

[0007] The heating mechanism, located at the rear top of the base, is used to heat and scrape the tin-based alloy on the surface of the circuit board.

[0008] The separation mechanism, located at the front of the top of the base, is used to separate the circuit board and the electronic components on its surface;

[0009] The intake mechanism, located inside the heating mechanism, is used to guide hot air and treat the irritating gases generated during the melting of tin-based alloys.

[0010] The quantitative transfer mechanism, located at the front of the separation mechanism, is used to quantitatively transfer the processed circuit board.

[0011] Preferably, the heating mechanism includes a servo motor, the top of which is fixedly connected to the rear bottom of the base. The output end of the servo motor passes through the base and is fixedly connected to a drive wheel. A hollow column is fixedly connected to the top of the drive wheel, and a transmission wheel is fixedly connected to the top of the hollow column. A drive wheel is meshed on both sides of the rear of the transmission wheel. A rotating cylinder is fixedly connected to the middle of each of the drive wheels on both sides. A limit plate is fixedly connected to the top of each of the rotating cylinders on both sides. Multiple processing grooves are opened on the outer side of each of the limit plates on both sides. A support cylinder is rotatably connected to the lower outer side of each of the rotating cylinders on both sides. Multiple support frames are fixedly connected to the upper inner part of each of the support cylinders on both sides. A heating tube assembly is fixedly connected to one side of the top of each of the multiple support frames. A scraper is fixedly connected to the other side of the top of each of the multiple support frames. The outer side of the bottom of each of the limit plates on both sides is rotatably connected to the top of the support cylinder. A guide plate is fixedly connected to the side of each of the support cylinders on both sides that are close to each other. Multiple through slots are opened in the lower part of each of the rotating cylinders on both sides. Solder boxes are fixedly connected to both sides of the rear top of the base.

[0012] Preferably, the bottom end of the drive wheel is rotatably connected to the rear top of the base, and arc-shaped baffles are fixedly connected to the outer sides of the support cylinders on both sides. The bottom ends of the arc-shaped baffles on both sides are fixedly connected to the rear top of the base. Support rings are fixedly connected inside the arc-shaped baffles on both sides. The top ends of the support rings on both sides are rotatably connected to the outer side of the bottom end of the drive wheel. The solder boxes on both sides are directly opposite the rotating cylinder. Multiple scraper blades are fixedly connected to the upper outer side of the rotating cylinder on both sides. The side of the multiple scraper blades away from the rotating cylinder is slidably connected to the middle of the support cylinder.

[0013] Preferably, the separation mechanism includes a second drive wheel, the rear of which meshes with the front of the drive wheel. A connecting disc is fixedly connected to the top of the second drive wheel, and multiple arc-shaped inclined blocks are fixedly connected to the top of the connecting disc. Push rods are slidably connected to the tops of the multiple arc-shaped inclined blocks. A U-shaped support plate is fixedly connected to the top of the push rods, and a U-shaped sliding plate is fixedly connected to the top of the U-shaped support plate. Multiple inclined grooves are formed in the middle of the bottom of the U-shaped sliding plate.

[0014] Preferably, the bottom end of the second drive wheel is rotatably connected to the front of the top of the base, and the outer sides of the multiple push rods are slidably connected to limit rings. The limit rings are fixedly connected to a limit frame on the side closest to each other, and the bottom end of the limit frame is fixedly connected to the front of the top of the base. The bottom end of the U-shaped slide plate is fixedly connected to multiple protrusions. The sides of the U-shaped slide plate are slidably connected to L-shaped support plates. The bottom ends of the two L-shaped support plates are fixedly connected to the two sides of the front of the top of the base. The top ends of the two L-shaped support plates on the side furthest from each other are provided with collection boxes.

[0015] Preferably, the suction mechanism includes a rotating rod, the top end of which is fixedly connected to the middle of the bottom end of the transmission wheel, an impeller is fixedly connected to the outside of the rotating rod, a plurality of exhaust grooves are opened inside the transmission wheel, a hollow cylinder is rotatably connected to the top end of the transmission wheel, air guide pipes are fixedly connected to both sides of the rear end of the hollow cylinder, the ends of the air guide pipes away from the hollow cylinder are fixedly connected to the front end of the support cylinder, a fixing plate is fixedly connected to the rear end of the hollow cylinder, and both sides of the rear end of the fixing plate are fixedly connected to the front end of the arc-shaped baffle.

[0016] Preferably, a disc is fixedly connected to the center of the hollow column, an exhaust hole is provided in the center of the disc, a partition cylinder is fixedly connected to the top of the disc, multiple through holes are provided at the bottom of the partition cylinder, a partition plate is fixedly connected inside the partition cylinder, the bottom end of the partition plate is fixedly connected to the top of the disc, and multiple exhaust grooves are provided at the bottom of the hollow column.

[0017] Preferably, the quantitative transfer mechanism includes a vertical plate, with both sides of the vertical plate slidably connected to the front of the two sides inside the U-shaped slide plate. Trapezoidal blocks are fixedly connected to both sides of the rear end of the vertical plate, and trapezoidal blocks are slidably connected to the rear ends of trapezoidal blocks on both sides. A counterweight is fixedly connected to the front end of the vertical plate, and the bottom ends of trapezoidal blocks are slidably connected to the bottom ends of the two sides inside the U-shaped slide plate.

[0018] Working Principle: During operation, waste computer circuit boards are sequentially transported by a conveyor belt to processing slots located on the surfaces of the two side limit plates. A servo motor is then activated, causing the drive wheel to rotate clockwise via a hollow column. The meshing between the drive wheel and the first drive wheel causes the first drive wheel to rotate the drum and limit plates counter-clockwise. Supported by the support cylinder, the computer circuit boards placed inside the limit plates rotate through the evenly distributed processing slots. Because the support cylinder contains multiple evenly distributed support frames, with heating elements and scrapers on either side of the top of each support frame, the tin-based alloy at the bottom of the circuit board sequentially contacts the heating elements as the limit plates rotate. The scrapers then melt the tin. The tin-based alloy is gradually scraped off from the circuit board surface, and the spatial height of each set of support frames, heating tube assemblies, and scraper blades increases sequentially to prevent subsequent heating tube assemblies and scraper blades from failing to effectively contact the tin-based alloy. Furthermore, the liquid tin-based alloy scraped off by scraper blades can drip down into the support cylinder under the influence of residual heat. At this point, gravity allows the liquid tin-based alloy to enter the rotating cylinder through evenly distributed channels, and further drip into the solder box. For partially cooled and solidified tin-based alloy, scraper blades can scrape it off from the inner wall of the support cylinder, allowing it to fall into the solder box through the channels as well. This achieves the purpose of recovering the tin-based alloy from the circuit board surface, avoiding waste, and preventing the tin-based alloy from mixing with other waste materials, thus reducing the reduction of subsequent tin-based alloy recovery and purification costs. In addition to the workload of the alloy, since there is a gap on the side where the two support cylinders are close to each other, when the circuit board, after passing through multiple heating tube groups and scraper, moves to the gap with the limiting plate, it can fall from the inside of the processing groove to the guide plate due to the loss of support from the support cylinder. Furthermore, the circuit board and its surface electronic components, which are no longer fixed, can slide down to the U-shaped slide plate under the action of gravity. When the drive wheel rotates, the drive wheel two meshing with it can also transmit power to the connecting plate. At this time, under the restriction of the limiting ring and the limiting frame, the arc-shaped inclined blocks evenly distributed on the surface of the connecting plate can use their inclined surfaces to push the push rod upward, thereby causing the U-shaped support plate and U-shaped slide plate to move accordingly. As the push rod falls from the highest point of the surface of the arc-shaped inclined block to the lowest point of the surface of the next arc-shaped inclined block, the U-shaped support plate and U-shaped slide plate can also move. Guided by the L-shaped support plate, the U-shaped slide rapidly descends, thus utilizing the vibration generated by its descent to separate electronic components from the circuit board. Multiple inclined grooves trap the detached electronic components as the circuit board continues to slide forward along the U-shaped slide. Furthermore, the trapped components slide to the sides into the collection box with the help of the inclined surfaces within the grooves, achieving active separation of the circuit board and electronic components. This prevents high-value, still-usable electronic components from being crushed along with the circuit board. The electronic components can then be collected separately through subsequent air separation and gravity screening, reducing the difficulty of recycling. As the drive wheel rotates continuously, the connected rod transmits power to the impeller, which in turn generates suction through its rotation.The system, in conjunction with the exhaust duct, hollow cylinder, and air guide pipe, continuously draws the hot air generated during the heating of the heating tube assembly into the support cylinder. This prevents the solidification of a large amount of liquid tin-based alloy inside the support cylinder due to the low temperature, reducing the resistance encountered by the scraper and rotating drum. Furthermore, the hot air, passing through the exhaust duct, hollow cylinder, and air guide pipe, can also enter the lower part of the hollow column and come into contact with the activated carbon on the surface of the disc. Therefore, some of the pungent odor generated when the heating tube assembly heats the tin-based alloy can also come into contact with the activated carbon along with the hot air. The activated carbon can then adsorb and purify the pungent odor, preventing its accumulation and potential health threats to nearby workers. Additionally, the upright plate can block the circuit board after the electronic components have been separated. When the boards accumulate to a certain extent, the pushing force they exert on trapezoidal block two can be transferred to trapezoidal block one through the inclined plane between trapezoidal block two and trapezoidal block one. This allows the vertical plate to overcome the resistance generated by the counterweight and move vertically upwards along the U-shaped sliding plate. Circuit boards blocked by the vertical plate can then pass over it and enter the subsequent crushing and recycling stage. Simultaneously, as a large number of circuit boards are discharged along the U-shaped sliding plate, the force on trapezoidal block two decreases, allowing the counterweight to drive the vertical plate back to its initial position. This achieves the purpose of quantitatively releasing circuit boards, preventing excessive circuit boards from entering the crushing step at once and affecting the crushing effect. In summary, the coordination between these mechanisms can improve the recycling efficiency of waste circuit boards, save resources, and reduce the harm to the environment during recycling.

[0019] This invention provides an automated processing device for waste computer circuit board parts. It includes the following features:

[0020] Beneficial effects:

[0021] 1. This invention uses a heating mechanism to heat the tin-based alloy on the surface of the circuit board, thereby peeling and collecting the tin-based alloy from the surface of the waste circuit board, avoiding waste. Furthermore, it ensures that the tin-based alloy can be reused with relatively high purity after a few processing steps, reducing recycling costs. In addition, the separation mechanism can actively separate the loose electronic components from the surface of the circuit board after the tin-based alloy is peeled off, and then use subsequent air separation and gravity screening to classify and collect each electronic component, preventing the mixing of different material components after centralized crushing, which would increase the difficulty of separation. At the same time, some high-value and still usable electronic components can also be selected and reused, avoiding their crushing and waste.

[0022] 2. The present invention uses an air suction mechanism to draw the hot air generated when the heating mechanism heats the tin-based alloy into the support cylinder. This prevents a large amount of liquid tin-based alloy from cooling and solidifying during the transfer process due to the low temperature inside the support cylinder. This reduces the resistance encountered when the rotating cylinder and scraper rotate. In addition, the irritating odor generated when heating the tin-based alloy can also flow with the hot air, allowing it to come into contact with activated carbon to adsorb and purify the air. This prevents a large amount of irritating odor from spreading into the air and polluting the surrounding environment, and also protects nearby workers.

[0023] 3. The present invention can release the processed circuit boards quantitatively within a certain range by setting a quantitative transfer mechanism, so as to prevent the pulverization effect from being affected by the excessive number of circuit boards when they are transferred to the subsequent pulverization step, thereby avoiding affecting the subsequent recycling efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the front structure of the present invention;

[0025] Figure 2 This is a cross-sectional view of the base connection structure of the present invention;

[0026] Figure 3 This is a cross-sectional schematic diagram of the push rod connection structure of the present invention;

[0027] Figure 4 This is a cross-sectional schematic diagram of the U-shaped sliding plate connection structure of the present invention;

[0028] Figure 5 This is a cross-sectional schematic diagram of the rotary drum connection structure of the present invention;

[0029] Figure 6 This is a cross-sectional schematic diagram of the support cylinder connection structure of the present invention;

[0030] Figure 7 This is a cross-sectional schematic diagram of the U-shaped tray connection structure of the present invention;

[0031] Figure 8 For the present invention Figure 4 Enlarged schematic diagram of the structure at point A;

[0032] Figure 9 For the present invention Figure 6 Enlarged schematic diagram of the structure at point B;

[0033] Figure 10 For the present invention Figure 1 A magnified schematic diagram of the structure at point C.

[0034] The components include: 1. Base; 2. Heating mechanism; 201. Servo motor; 202. Drive wheel; 203. Hollow column; 204. Transmission wheel; 205. Drive wheel one; 206. Rotary drum; 207. Limiting plate; 208. Machining groove; 209. Support cylinder; 210. Support frame; 211. Heating tube assembly; 212. Scraper one; 213. Guide plate; 214. Through groove; 215. Solder box; 216. Arc-shaped baffle; 217. Support ring; 218. Scraper two; 3. Separation mechanism; 301. Drive wheel two; 302. Connecting plate; 303. Arc-shaped inclined block; 304. Push rod; 305. 306. U-shaped support plate; 307. U-shaped sliding plate; 308. Inclined groove; 309. Limiting ring; 310. Limiting frame; 311. Protrusion; 312. L-shaped support plate; 313. Collection box; 4. Suction mechanism; 401. Rotating rod; 402. Impeller; 403. Exhaust trough one; 404. Hollow cylinder; 405. Air guide pipe; 406. Fixing plate; 407. Disc; 408. Exhaust hole; 409. Divider cylinder; 410. Through hole; 411. Partition plate; 412. Exhaust trough two; 5. Quantitative transfer mechanism; 501. Vertical plate; 502. Trapezoidal block one; 503. Trapezoidal block two; 504. Counterweight block. Detailed Implementation

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see the appendix Figure 1 Appendix Figure 2 Appendix Figure 5 Appendix Figure 6 and attached Figure 9 This invention provides an automated processing device for waste computer circuit board parts, including a base 1, which serves as a basic support component and provides a basic mounting surface; and a heating mechanism 2, which is located at the rear top of the base 1 and is used to heat and scrape the tin-based alloy on the surface of the circuit board.

[0037] Heating mechanism 2 includes a servo motor 201. The top of the servo motor 201 is fixedly connected to the rear bottom of the base 1. The output end of the servo motor 201 passes through the base 1 and is fixedly connected to a drive wheel 202. A hollow column 203 is fixedly connected to the top of the drive wheel 202. A transmission wheel 204 is fixedly connected to the top of the hollow column 203. Drive wheels 205 are meshed on both sides of the rear of the transmission wheel 204. Rotary drums 206 are fixedly connected to the middle of both drive wheels 205. Limiting discs 207 are fixedly connected to the top of both rotating drums 206. Multiple processing grooves 208 are opened on the outer side of both limiting discs 207. Support cylinders 209 are rotatably connected to the lower outer side of the side rotating cylinder 206. Multiple support frames 210 are fixedly connected to the upper inner part of the support cylinders 209 on both sides. Heating tubes 211 are fixedly connected to one side of the top of the multiple support frames 210. Scrapers 212 are fixedly connected to the other side of the top of the multiple support frames 210. The bottom outer side of the limit plates 207 on both sides is rotatably connected to the top of the support cylinder 209. Guide plates 213 are fixedly connected to the side of the support cylinders 209 that are close to each other. Multiple through slots 214 are opened in the lower part of the side rotating cylinders 206 on both sides. Solder boxes 215 are fixedly connected to the rear side of the top of the base 1.

[0038] The servo motor 201 enables the drive wheel 202 to rotate the hollow column 203 and the transmission wheel 204 clockwise. The meshing between the transmission wheel 204 and the drive wheel 205 causes the rotating drum 206 to rotate the limiting disk 207 counterclockwise. Simultaneously, because the limiting disk 207 has multiple U-shaped machining grooves 208 evenly distributed on its surface, and each machining groove 208 has protruding parts on both sides, the top surface of the support cylinder 209 and the protruding parts inside the machining grooves 208 can be used to process waste materials. The old circuit board is supported so that after being placed inside the processing tank 208 by an external conveyor belt and robotic arm, it can rotate synchronously with the limiting plate 207. Furthermore, the heating tube assembly 211 and scraper 212 are supported by evenly distributed support frames 210. Each support frame 210, heating tube assembly 211, and scraper 212 is slightly raised in space. Therefore, as the limiting plate 207 rotates, the circuit board can come into contact with each heating tube assembly 211 in sequence, thereby melting layer by layer. The tin-based alloy solidified on the bottom surface of the circuit board, along with the scrapers 212, can gradually scrape the molten tin-based alloy off the bottom surface of the circuit board. The scraped liquid tin-based alloy can drip from the surface of the scrapers 212 into the support cylinder 209 under the action of residual heat. Then it can move along the support cylinder 209 to approach the evenly distributed through grooves 214, and enter the interior of the rotating cylinder 206 through the through grooves 214 during the rotation of the rotating cylinder 206, until it falls into the solder box 215. This achieves the purpose of effectively recovering the tin-based alloy, avoiding the tin-based alloy from mixing with various materials after the circuit board is crushed, thereby reducing the separation steps and recovery costs of the tin-based alloy. In addition, it can also avoid the tin-based alloy from producing too much irritating odor during subsequent hot melting. After the circuit board is processed by multiple heating tube groups 211 and scrapers 212, as it moves to the notch on the side close to the support cylinder 209, since the support cylinder 209 no longer supports the circuit board, the circuit board can fall into the guide plate 213 under the action of gravity, so as to actively leave the processing tank 208.

[0039] Please see the appendix Figure 4 and attached Figure 5 The bottom end of the drive wheel 202 is rotatably connected to the rear top of the base 1. Arc-shaped baffles 216 are fixedly connected to the outer sides of the two support cylinders 209. The bottom ends of the two arc-shaped baffles 216 are fixedly connected to the rear top of the base 1. Support rings 217 are fixedly connected to the inside of the two arc-shaped baffles 216. The top ends of the two support rings 217 are rotatably connected to the outer side of the bottom end of the drive wheel 205. The two solder boxes 215 are directly opposite the rotating cylinder 206. Multiple scrapers 218 are fixedly connected to the upper outer side of the rotating cylinder 206. The side of the multiple scrapers 218 away from the rotating cylinder 206 is slidably connected to the middle of the support cylinder 209.

[0040] The base 1 can limit the drive wheel 202 to prevent it from deviating from the predetermined position. The arc-shaped baffle 216 can fix the support cylinder 209 and prevent the drive wheel 205 from contacting foreign objects. This can prevent the circuit board from being unable to actively detach from the processing groove 208 after the support cylinder 209 rotates with the rotating drum 206. At the same time, the support ring 217 can fix the drive wheel 205 to ensure that the drive wheel 205 and the transmission wheel 204 always maintain effective engagement. In addition, since the solder box 215 is directly opposite the rotating drum 206, it can ensure that the tin-based alloy can fall into the solder box 215 for collection. The evenly distributed scraper 218 can scrape off the tin-based alloy that may solidify on the inner wall of the support cylinder 209 when the rotating drum 206 rotates, preventing it from being not recycled.

[0041] Please see the appendix Figure 2 Appendix Figure 3 Appendix Figure 4 and attached Figure 7 Separation mechanism 3, which is located at the front of the top of the base 1, is used to separate the circuit board and the electronic components on its surface;

[0042] The separation mechanism 3 includes a second drive wheel 301, the rear of which meshes with the front of the drive wheel 202. A connecting plate 302 is fixedly connected to the top of the second drive wheel 301. Multiple arc-shaped inclined blocks 303 are fixedly connected to the top of the connecting plate 302. Push rods 304 are slidably connected to the top of each of the multiple arc-shaped inclined blocks 303. A U-shaped support plate 305 is fixedly connected to the top of the push rod 304. A U-shaped slide plate 306 is fixedly connected to the top of the U-shaped support plate 305. Multiple inclined grooves 307 are opened in the middle of the bottom end of the U-shaped slide plate 306.

[0043] The engagement between drive wheel 201 and drive wheel 202 transmits the power output from servo motor 201 to connecting plate 302, causing the evenly distributed arc-shaped inclined blocks 303 on its surface to rotate counterclockwise. The inclination of each arc-shaped inclined block 303 drives its corresponding push rod 304 upwards. As drive wheel 201 and connecting plate 302 rotate, when the push rod 304 falls from the highest point of the previous arc-shaped inclined block 303 to the lowest point of the next arc-shaped inclined block 303, the hollow U-shaped support plate 305 connected to the evenly distributed push rods 304 falls under gravity, thus driving the U-shaped slide plate 306 to reciprocate up and down. During this process, the circuit board sliding from guide plate 213 to the U-shaped slide plate 306 loses its circuitry due to the vibration of the U-shaped slide plate 306. The tin-based alloy-fixed electronic components are separated from the circuit board. Furthermore, since there are multiple inclined grooves 307 inside the U-shaped slide plate 306, and the width of the inclined grooves 307 is limited, only the electronic components can be trapped, while the circuit board can cross the inclined grooves 307 and continue to move forward along the U-shaped slide plate 306 under continuous vibration. In summary, the purpose of actively separating the circuit board and the electronic components can be achieved, preventing the electronic components from entering the subsequent crushing step with the circuit board, which would lead to the waste of some usable and high-value electronic components. In addition, since the inclined groove 307 is frustum-shaped, the electronic components can slide to both sides along the slope of its inner surface, which prevents the inclined groove 307 from being filled with a large number of electronic components. After the various separated electronic components are subjected to subsequent air separation, gravity screening and other steps, they can be collected in a centralized manner according to their type, avoiding them from mixing and increasing the difficulty of recycling.

[0044] Please see the appendix Figure 2 Appendix Figure 3 and attached Figure 7 The bottom end of the drive wheel 301 is rotatably connected to the front of the top of the base 1. Multiple push rods 304 are slidably connected to limit rings 308 on their outer sides. Limiting rings 308 are fixedly connected to a limit frame 309 on the side closest to each other. The bottom end of the limit frame 309 is fixedly connected to the front of the top of the base 1. Multiple protrusions 310 are fixedly connected to the bottom of the U-shaped slide plate 306. L-shaped support plates 311 are slidably connected to both sides of the U-shaped slide plate 306. The bottom ends of the two L-shaped support plates 311 are fixedly connected to both sides of the front of the top of the base 1. Collection boxes 312 are provided on the side of the top of the two L-shaped support plates 311 that are far apart from each other.

[0045] The base 1 can limit the second drive wheel 301, thereby ensuring effective engagement between the second drive wheel 301 and the drive wheel 202. The limiting frame 309 and the evenly distributed limiting rings 308, in conjunction with the base 1, can guide each push rod 304 to prevent horizontal displacement that would affect the normal use of the U-shaped support plate 305 and the U-shaped slide plate 306. At the same time, the multiple protrusions 310 can extend the time for the circuit board to pass through the area of ​​the inclined groove 307 to a certain extent, preventing the circuit board from sliding too fast and causing some electronic components to fall off the surface of the circuit board in time when the U-shaped slide plate 306 vibrates. In addition, the L-shaped support plate 311 can guide the movement direction of the U-shaped slide plate 306 to prevent the U-shaped slide plate 306 and the U-shaped support plate 305 from deviating from the predetermined movement trajectory. Furthermore, the collection box 312 can collect various electronic components that slide off the U-shaped slide plate 306 from the inclined groove 307.

[0046] Please see the appendix Figure 4 and attached Figure 8 The suction mechanism 4 is located inside the heating mechanism 2 and is used to guide hot air and treat the irritating gases generated during the melting of tin-based alloys.

[0047] The suction mechanism 4 includes a rotating rod 401, the top of which is fixedly connected to the middle of the bottom of the transmission wheel 204. An impeller 402 is fixedly connected to the outside of the rotating rod 401. Multiple exhaust grooves 403 are opened inside the transmission wheel 204. A hollow cylinder 404 is rotatably connected to the top of the transmission wheel 204. Air guide pipes 405 are fixedly connected to both sides of the rear end of the hollow cylinder 404. The ends of the air guide pipes 405 away from the hollow cylinder 404 are fixedly connected to the front end of the support cylinder 209. A fixing plate 406 is fixedly connected to the rear end of the hollow cylinder 404. Both sides of the rear end of the fixing plate 406 are fixedly connected to the front end of the arc-shaped baffle 216.

[0048] The impeller 402 can be rotated by the drive wheel 204 via the rotating rod 401, thereby generating suction through the rotation of the impeller 402. Under the action of the hollow cylinder 404, the air guide pipe 405, and the evenly distributed exhaust grooves 403, the suction is transmitted to the inside of the support cylinder 209. Furthermore, the high-temperature air near the heating tube assembly 211 can move into the inside of the support cylinder 209 to ensure that the temperature inside the support cylinder 209 is relatively high. This prevents a large amount of liquid tin-based alloy from cooling and solidifying due to rapid heat loss when moving along the inner wall of the support cylinder 209. This achieves the purpose of reducing the resistance encountered by the scraper 218 and the rotating cylinder 206 when rotating, and makes the rotating cylinder 206 and the limiting plate 207 more stable when rotating. In addition, the fixed plate 406 can be used to connect the hollow cylinder 404 to the arc-shaped baffle 216 to achieve the effect of supporting the hollow cylinder 404 and preventing the air guide pipe 405 from being subjected to shearing force due to the rotation of the hollow cylinder 404 with the drive wheel 204.

[0049] Please see the appendix Figure 3 and attached Figure 8 A disc 407 is fixedly connected to the center of the hollow column 203. An exhaust hole 408 is provided in the center of the disc 407. A partition cylinder 409 is fixedly connected to the top of the disc 407. Multiple through holes 410 are provided at the bottom of the partition cylinder 409. A partition plate 411 is fixedly connected inside the partition cylinder 409. The bottom end of the partition plate 411 is fixedly connected to the top of the disc 407. Multiple exhaust grooves 412 are provided at the bottom of the hollow column 203.

[0050] The activated carbon can be blocked on the upper surface of the disc 407, while the evenly distributed through holes 410 allow the air drawn into the hollow column 203 by the impeller 402 to pass through the activated carbon and enter the internal space of the separator 409. The height of the partition 411 can block the activated carbon while allowing the air to leave through the top hole, preventing the activated carbon from falling into the area below the disc 407 through the exhaust hole 408 after entering the separator 409. Similarly, some of the irritating gases generated when the heating tube assembly 211 comes into contact with the tin-based alloy can also come into contact with the activated carbon along the support cylinder 209, the air guide pipe 405, the hollow cylinder 404, and the first exhaust groove 403. After being adsorbed and purified by the activated carbon, they can be discharged away from the hollow column 203 along the through holes 410, the top hole of the partition 411, the exhaust hole 408, and the second exhaust groove 412, thereby reducing the impact of irritating gases on the environment and protecting nearby workers.

[0051] Please see the appendix Figure 4 and attached Figure 10 The quantitative transfer mechanism 5 is located at the front of the separation mechanism 3 and is used to quantitatively transfer the processed circuit board.

[0052] The quantitative transfer mechanism 5 includes a vertical plate 501, with both sides of the vertical plate 501 slidably connected to the front of both sides of the U-shaped slide plate 306. Trapezoidal blocks 502 are fixedly connected to both sides of the rear end of the vertical plate 501, and trapezoidal blocks 503 are slidably connected to the rear ends of both trapezoidal blocks 502. A counterweight 504 is fixedly connected to the front end of the vertical plate 501, and the bottom ends of both trapezoidal blocks 503 are slidably connected to both sides of the bottom end of the U-shaped slide plate 306.

[0053] The movement direction of the upright plate 501 can be restricted by the U-shaped sliding plate 306, while the weight of the upright plate 501 can be increased by the counterweight 504. When the circuit board passes through the area where the inclined groove 307 is located, it can contact the upright plate 501 and the trapezoidal block 503. As the circuit board continues to gather, the pushing force applied by the trapezoidal block 503 to the trapezoidal block 502 through the inclined surface also increases. This further allows the upright plate 501 to overcome the gravity of the counterweight 504 and gradually rise with the trapezoidal block 502. At this time, a certain number of circuit boards can quickly pass through the area where the upright plate 501 is located and enter the next crushing step. When the pushing force on the trapezoidal block 503 decreases significantly, the upright plate 501 can return by itself under the action of gravity, so as to achieve the purpose of quantitatively releasing the processed circuit boards and preventing excessive circuit boards from entering the subsequent crushing steps and affecting the crushing effect.

[0054] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated processing device for waste computer circuit board parts, characterized in that, include: The base (1) serves as a foundation support component, providing a foundation mounting surface; A heating mechanism (2), located at the rear top of the base (1), is used to heat and scrape the tin-based alloy on the surface of the circuit board; a separation mechanism (3), located at the front top of the base (1), is used to separate the circuit board and the electronic components on its surface; a suction mechanism (4), located inside the heating mechanism (2), is used to guide hot air and treat the irritating gas generated when the tin-based alloy melts; a quantitative transfer mechanism (5), located at the front inside the separation mechanism (3), is used to quantitatively transfer the processed circuit board; the heating mechanism (2) includes a servo motor (201), the top of which is fixedly connected to the rear bottom of the base (1), and so on. The output end of the servo motor (201) passes through the base (1) and is fixedly connected to a drive wheel (202). A hollow column (203) is fixedly connected to the top of the drive wheel (202). A transmission wheel (204) is fixedly connected to the top of the hollow column (203). Drive wheels (205) are meshed on both sides of the rear of the transmission wheel (204). Rotary drums (206) are fixedly connected to the middle of the drive wheels (205) on both sides. Limiting plates (207) are fixedly connected to the top of the rotating drums (206) on both sides. Multiple processing grooves (208) are opened on the outer side of the limiting plates (207) on both sides. Support cylinders (209) are rotatably connected to the lower outer side of the rotating drums (206) on both sides. Multiple support frames (210) are fixedly connected to the upper part of the side support cylinder (209). A heating tube assembly (211) is fixedly connected to one side of the top of each of the multiple support frames (210). A scraper (212) is fixedly connected to the other side of the top of each of the multiple support frames (210). The bottom outer sides of the limit plates (207) on both sides are rotatably connected to the top of the support cylinder (209). Guide plates (213) are fixedly connected to the side of the two support cylinders (209) that are close to each other. Multiple through slots (214) are opened in the lower part of the two rotating cylinders (206). Solder boxes (215) are fixedly connected to the rear sides of the top of the base (1). The bottom of the drive wheel (202) is rotatably connected to At the rear top of the base (1), arc-shaped baffles (216) are fixedly connected to the outer sides of the support cylinders (209) on both sides. The bottom ends of the arc-shaped baffles (216) on both sides are fixedly connected to the rear top of the base (1). Support rings (217) are fixedly connected inside the arc-shaped baffles (216) on both sides. The top ends of the support rings (217) on both sides are rotatably connected to the outer side of the bottom end of the drive wheel (205). The solder boxes (215) on both sides are directly opposite the rotating cylinder (206). Multiple scraper blades (218) are fixedly connected to the upper outer side of the rotating cylinders (206) on both sides. The scraper blades (218) on the side away from the rotating cylinder (206) are slidably connected to the middle of the support cylinder (209).The separation mechanism (3) includes a second drive wheel (301), the rear of which meshes with the front of the drive wheel (202). A connecting plate (302) is fixedly connected to the top of the second drive wheel (301), and multiple arc-shaped inclined blocks (303) are fixedly connected to the top of the connecting plate (302). Push rods (304) are slidably connected to the tops of the multiple arc-shaped inclined blocks (303). A U-shaped support plate (305) is fixedly connected to the top of the push rod (304), and a U-shaped sliding plate (306) is fixedly connected to the top of the U-shaped support plate (305). Multiple inclined grooves (307) are opened in the middle of the bottom end of the U-shaped sliding plate (306). The bottom end is rotatably connected to the front of the top of the base (1). Multiple push rods (304) are slidably connected to limit rings (308) on their outer sides. Limiting rings (308) are fixedly connected to a limiting frame (309) on the side closest to each other. The bottom end of the limiting frame (309) is fixedly connected to the front of the top of the base (1). Multiple protrusions (310) are fixedly connected to the bottom of the inner end of the U-shaped slide plate (306). L-shaped support plates (311) are slidably connected to both sides of the U-shaped slide plate (306). The bottom ends of the L-shaped support plates (311) on both sides are fixedly connected to the front of the top of the base (1). Collection boxes (312) are provided on the side of the top of the L-shaped support plates (311) that are furthest apart.

2. The automated processing device for waste computer circuit board parts according to claim 1, characterized in that, The suction mechanism (4) includes a rotating rod (401), the top end of which is fixedly connected to the middle of the bottom end of the transmission wheel (204). An impeller (402) is fixedly connected to the outside of the rotating rod (401). Multiple exhaust grooves (403) are opened inside the transmission wheel (204). A hollow cylinder (404) is rotatably connected to the top end of the transmission wheel (204). Air guide pipes (405) are fixedly connected to both sides of the rear end of the hollow cylinder (404). The end of the air guide pipe (405) away from the hollow cylinder (404) is fixedly connected to the front end of the support cylinder (209). A fixing plate (406) is fixedly connected to the rear end of the hollow cylinder (404). Both sides of the rear end of the fixing plate (406) are fixedly connected to the front end of the arc-shaped baffle (216).

3. The automated processing device for waste computer circuit board parts according to claim 2, characterized in that, A disc (407) is fixedly connected to the center of the hollow column (203). An exhaust hole (408) is provided in the center of the disc (407). A partition cylinder (409) is fixedly connected to the top of the disc (407). Multiple through holes (410) are provided at the bottom of the partition cylinder (409). A partition plate (411) is fixedly connected inside the partition cylinder (409). The bottom end of the partition plate (411) is fixedly connected to the top of the disc (407). Multiple exhaust grooves (412) are provided at the bottom of the hollow column (203).

4. The automated processing device for waste computer circuit board parts according to claim 1, characterized in that, The quantitative transfer mechanism (5) includes a vertical plate (501), which is slidably connected to the front of the two sides of the U-shaped slide plate (306) on both sides. Trapezoidal blocks (502) are fixedly connected to the rear sides of the vertical plate (501), and trapezoidal blocks (503) are slidably connected to the rear ends of trapezoidal blocks (502) on both sides. A counterweight (504) is fixedly connected to the front end of the vertical plate (501), and the bottom ends of trapezoidal blocks (503) on both sides are slidably connected to the bottom ends of the U-shaped slide plate (306).

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