Dynamic interference detection method, device, equipment and storage medium

Abstract

The present application provides a dynamic interference detection method, device, equipment and storage medium, which relate to the field of mass transfer technology, and solve the problem of interference collision that is prone to occur when multiple groups in the whole machine equipment perform compound movements in the related technology. The present solution can obtain the position in real time through dynamic movement to determine the position relationship between the groups, so as to quickly determine whether there is a collision risk, thereby effectively avoiding the situation where interference collision is prone to occur when multiple groups perform compound movements.

Description

Technical Field

[0001] The present application relates to the field of mass transfer technology, and in particular to a dynamic interference detection method, device, equipment and storage medium. Background Art

[0002] MiniLED is the current innovation direction of liquid crystal display technology, and its market prospects are broad. It is mainly used in many fields such as medical display, vehicle display, conference and exhibition, etc. Mass transfer technology is the key technology for MiniLED mass production, which includes Pick&Place transfer technology, needle transfer technology and laser transfer technology.

[0003] In related technologies, needle transfer technology is often used to transfer MiniLEDs. The application scenarios of needle transfer technology are relatively few, but its advantage is that it can produce larger substrate sizes and transfer smaller chips. In addition, its whole equipment occupies a small area, and its transfer efficiency is far higher than that of Pick&Place transfer technology.

[0004] However, in actual production applications, when the footprint of the entire machine is required to be smaller, it is inevitable that the structural design makes its structure more compact. In addition, the equipment also has requirements for high frequency, high speed and high precision. In this regard, when multiple groups in the entire machine perform compound movements, it is easy for some unreasonable motion planning and human operating errors to occur, resulting in interference and collision between groups. Summary of the invention

[0005] The present application provides a dynamic interference detection method, device, equipment and storage medium, which solves the problem of interference collision that is prone to occur when multiple groups in the whole equipment perform compound movements in the related technology. This solution can obtain the position in real time by dynamic dynamics to determine the position relationship between the groups, so as to quickly determine whether there is a collision risk, thereby effectively avoiding the situation where interference collision is prone to occur when multiple groups perform compound movements.

[0006] In a first aspect, the present application provides a dynamic interference detection method, which is applied to a crystal piercing device, wherein the crystal piercing device includes a needle piercing head and a storage table for placing a wafer disk, the crystal piercing device is provided with a first coordinate system corresponding to the needle piercing head, and a second coordinate system corresponding to the wafer disk, the origin of the first coordinate system and the origin of the second coordinate system are both aligned with a fixed marking point of the crystal piercing device, and the dynamic interference detection method includes:

[0007] Acquire coordinate parameters of a plurality of edge points of the needle piercing head on the wafer disk to determine a first center coordinate of a wafer center point of the needle piercing head located on the wafer disk, wherein the first center coordinate is associated with a first coordinate system;

[0008] Based on the first center coordinate and the second center coordinate, determine the coordinate mapping relationship between the first coordinate system and the second coordinate system, the second center coordinate being the coordinate of the wafer center point of the wafer disk in the second coordinate system;

[0009] According to the coordinate mapping relationship, the coordinates of the puncturing head in the first coordinate system and the coordinates of the center point of the wafer in the second coordinate system, a distance relationship equation corresponding to the puncturing head and the center point of the wafer is constructed;

[0010] Acquire a first moving position of the acupuncture head and a second moving position of the center point of the wafer in real time to determine a first position coordinate corresponding to the first moving position of the acupuncture head in the first coordinate system and a second position coordinate corresponding to the second moving position of the center point of the wafer in the second coordinate system;

[0011] Determine the coordinate distance between the needle piercing head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation;

[0012] Based on the coordinate distance and the distance threshold corresponding to the preset risk area, it is determined whether there is a collision risk, so that the thorn crystal device can be controlled according to the preset protection method when there is a collision risk.

[0013] In the second aspect, the present application further provides a dynamic interference detection device, which is applied to a crystal piercing device, the crystal piercing device includes a needle piercing head and a storage table for placing a wafer disc, the crystal piercing device is provided with a first coordinate system corresponding to the needle piercing head, and a second coordinate system corresponding to the wafer disc, the origin of the first coordinate system and the origin of the second coordinate system are both aligned with the fixed marking point of the crystal piercing device, and the dynamic interference detection device includes:

[0014] A fixed-point positioning module is configured to obtain coordinate parameters of a plurality of edge points of the needle piercing head on the wafer disk to determine a first center coordinate of a wafer center point of the needle piercing head located on the wafer disk, wherein the first center coordinate is associated with a first coordinate system;

[0015] A coordinate calibration module is configured to determine a coordinate mapping relationship between the first coordinate system and the second coordinate system based on the first center coordinate and the second center coordinate, wherein the second center coordinate is the coordinate of the wafer center point of the wafer disk in the second coordinate system;

[0016] A relationship building module is configured to build a distance relationship equation corresponding to the acupuncture head and the center point of the wafer according to the coordinate mapping relationship, the coordinates of the acupuncture head in the first coordinate system, and the coordinates of the center point of the wafer in the second coordinate system;

[0017] A coordinate acquisition module is configured to acquire a first moving position of the acupuncture head and a second moving position of the center point of the wafer in real time, so as to determine a first position coordinate corresponding to the first moving position of the acupuncture head in the first coordinate system and a second position coordinate corresponding to the second moving position of the center point of the wafer in the second coordinate system;

[0018] A distance acquisition module is configured to determine the coordinate distance between the acupuncture head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation;

[0019] The risk judgment module is configured to determine whether there is a collision risk based on the coordinate distance and the distance threshold corresponding to the preset risk area, so as to control the thorn crystal device according to the preset protection method when there is a collision risk.

[0020] In a third aspect, the present application also provides a crystal thorn device, the crystal thorn device comprising:

[0021] one or more processors;

[0022] a storage device for storing one or more programs,

[0023] When one or more programs are executed by one or more processors, the one or more processors implement the dynamic interference detection method of the present application.

[0024] In a fourth aspect, the present application further provides a storage medium storing computer executable instructions, which, when executed by a processor, are used to execute the dynamic interference detection method of the present application.

[0025] The present application establishes a corresponding mapping relationship for the coordinate systems with two aligned origins, further determines the scope of the interference risk area based on the basic size parameters of the wafer disk, and then after determining the dynamically acquired puncture head position and the wafer center point, it can determine the positional relationship between the various parts and groups, and realize dynamic real-time monitoring, so that multiple parts in the equipment can achieve high-frequency, high-speed, and high-precision compound motion while preventing collisions, thereby effectively improving the safety of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the steps of a dynamic interference detection method provided in one embodiment of the present application.

[0027] Figure 2 A schematic diagram of calibrating the same point in two coordinate systems provided in one embodiment of the present application.

[0028] Figure 3 A schematic diagram of the position of the wafer center point and the acupuncture head provided in an embodiment of the present application.

[0029] Figure 4 A schematic diagram of the structure of a dynamic interference detection device provided in one embodiment of the present application.

[0030] Figure 5 A schematic diagram of the structure of a crystal thorn device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0031] The embodiments of the present application are further described in detail below in conjunction with the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are only used to explain the embodiments of the present application, rather than to limit the embodiments of the present application. It should also be noted that, for ease of description, only the parts related to the embodiments of the present application rather than all structures are shown in the accompanying drawings, and those skilled in the art should be able to think of it after reading the specification of this application that as long as the technical features do not contradict each other, any combination of the technical features can constitute an optional implementation method.

[0032] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable when appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally a class, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the objects associated before and after are in an "or" relationship. In the description of the present application, "multiple" means two or more, and "several" means one or more.

[0033] The core technology for MiniLED mass production is mass transfer technology, and the two common die bonding technologies in the market are: Pick&Place transfer technology and needle transfer technology, and others include laser transfer technology, etc. For needle transfer technology, its process and equipment are relatively new, and its application scenarios are relatively few, but its advantages are that it can produce larger substrate sizes, transfer smaller chips, and the whole machine equipment occupies a small area and the transfer efficiency far exceeds the Pick&Place method.

[0034] However, the needle transfer technology also has high requirements for equipment. When the area occupied by the whole equipment is small, the structural design will make the equipment structure more compact. In addition, in the actual production process, there are also high-frequency, high-speed, and high-precision requirements. When multiple groups in the equipment perform compound movements, it is easy to cause interference and collision accidents between groups due to unreasonable action planning and human operation errors.

[0035] Therefore, interference judgment between parts and groups is very necessary, which can effectively prevent or avoid collision accidents in advance and avoid subsequent economic losses. To this end, the present application provides a dynamic interference detection method for preventing or avoiding hardware collisions in advance. The method is applied to a crystal piercing device, which includes a piercing head and a storage table for placing a wafer disc, wherein the crystal piercing device is provided with a first coordinate system corresponding to the piercing head, and a second coordinate system corresponding to the wafer disc. Moreover, in the first coordinate system and the wafer disc coordinates, the origins of the two coordinate systems are aligned with the fixed marking points of the crystal piercing device, so that the two coordinate systems can achieve origin alignment, and avoid the situation where the piercing head cannot be accurately moved to the corresponding position due to coordinate system offset.

[0036] It is conceivable that the thorn crystal device also includes a processor and a memory, wherein the processor and the memory can be connected via a bus or other means. The number of processors is one or more, and the processor may include processing units such as an application processor (AP), a graphics processing unit (GPU) and a central processing unit (CPU). The memory, as a computer-readable storage medium, can be used to store software programs, computer executable programs and modules, such as the program instructions / modules corresponding to the dynamic interference detection method in the embodiment of the present application, so as to implement the dynamic interference detection method in the embodiment of the present application when the processor executes the corresponding program instructions / modules.

[0037] Based on this, Figure 1 FIG. 1 is a schematic diagram of the steps of a dynamic interference detection method provided in an embodiment of the present application. The method can be executed by a processor in a thorn crystal device, such as Figure 1 As shown, the specific steps of the method include step S110 to step S160:

[0038] Step S110, obtaining coordinate parameters of a plurality of edge points of the puncturing head on the wafer disk to determine a first center coordinate of a wafer center point of the wafer disk where the puncturing head is located, the first center coordinate being associated with a first coordinate system.

[0039] It can be understood that the edge point is a point on the side of the wafer, that is, the edge point is a point on the edge of the wafer. By detecting the coordinates of each edge point, the coordinate range corresponding to the wafer in the first coordinate system can be determined. For the acquisition of the coordinate parameters of multiple edge points, optionally, in one embodiment, the position of the acupuncture head can be adjusted by manual control so that the acupuncture head is located at the corresponding edge point, and then the processor records the corresponding coordinates as the coordinate parameters of the edge point. It can be imagined that the coordinates are associated with the first coordinate system. Optionally, in another embodiment, the current position of the acupuncture head can be determined by image recognition, such as using a camera to capture the corresponding image to determine the positional relationship between the acupuncture head and the edge point based on the image, and then the position of the acupuncture head is adjusted so that the acupuncture head is located at the corresponding edge point, and then the processor records the corresponding coordinates as the coordinate parameters of the edge point.

[0040] After determining multiple edge points on the wafer disk, the corresponding coordinates of the puncturing head when it is located at the wafer center point of the wafer disk can be determined based on the coordinate parameters of the edge points obtained, that is, the first center point coordinates. Of course, the first center point coordinates are associated with the first coordinate system. It can be imagined that in the first coordinate system, two motors with different movement directions (such as the X-axis and Y-axis directions) drive the puncturing head to move, and then the actual motor encoding value can be used as the coordinate parameter of the puncturing head at the corresponding position. Similarly, in the second coordinate system, two motors with different movement directions are used to drive the placement table to move so that the wafer disk on the placement table can also move. Then, when the calibration is completed, the wafer center point of the wafer disk can be associated with the actual motor encoding value to determine the corresponding coordinate parameters.

[0041] For example, in one embodiment, after obtaining the first coordinate of the acupuncture head at each edge point, the first coordinate is associated with the first coordinate system, and then the target edge points in the first axial direction and the second axial direction are selected from the edge points, wherein the first axial direction is parallel to one coordinate axis direction of the first coordinate system, and the second axial direction is parallel to another coordinate axis direction of the first coordinate system, such as the first axial direction is parallel to the X-axis direction, and the second axial direction is parallel to the Y-axis direction.

[0042] In this regard, the second coordinate corresponding to the center point of the wafer in the first coordinate system can be determined based on the first coordinate corresponding to the target edge point. It can be imagined that since the shape of the wafer disk is a disk, there are two target edge points corresponding to the first axial direction and the second axial direction, that is, the first coordinates of the four target edge points can be determined. Furthermore, the two target edge points in the same axial direction can determine the coordinate value of the center point of the wafer in a coordinate axis direction. For example, the coordinates of the two target edge points in the first axial direction parallel to the X-axis are (x1, y1) and (x2, y2), respectively, and the coordinates of the two target edge points in the second axial direction parallel to the Y-axis are (x3, y3) and (x4, y4), respectively. Therefore, the second coordinate corresponding to the center point of the wafer is:

[0043] ( )

[0044] Then, the acupuncture head is moved to the position corresponding to the second coordinate according to the determined second coordinate, and the coordinate corresponding to the acupuncture head at this time is recorded in the first coordinate system, that is, the first center coordinate. It can be understood that after calculating the corresponding second coordinate, the acupuncture head is moved to the corresponding position again, and then the coordinate determined after the movement is used as the first center coordinate. The processor can map and associate the first coordinate system and the second coordinate system according to the actual results, thereby achieving more accurate interference detection.

[0045] Step S120: determining a coordinate mapping relationship between the first coordinate system and the second coordinate system based on the first center coordinate and the second center coordinate, wherein the second center coordinate is the coordinate of the wafer center point of the wafer disk in the second coordinate system.

[0046] It is understandable that, referring to Figure 2 , Figure 2 A schematic diagram of calibrating the same point in two coordinate systems provided in one embodiment of the present application, such as Figure 2As shown, the line segment N1 with an arrow represents the needle puncture head, the first axial direction is represented by the dotted line L1 in the first coordinate system xoy, and the second axial direction is represented by the dotted line L2. In addition, the coordinates of the target edge points thereon are (x1, y1), (x2, y2), (x3, y3) and (x4, y4). Based on the coordinates of the target edge points, the corresponding coordinates are calculated as (X1, Y1), and the first center coordinates can be determined. In the second coordinate system x'o'y', the coordinate range of the wafer disk W1 in the coordinate system is shown in the figure, and the second center coordinate corresponding to the center point of the wafer is (X'2, Y'2). For this purpose, it is necessary to establish a mapping relationship between the first coordinate system and the second coordinate system, that is, a coordinate mapping relationship. Based on the coordinate mapping relationship, the device can determine the difference between the coordinates fed back for the same point in the two coordinate systems, so that the coordinates in the first coordinate system can be mapped to the second coordinate system, or the coordinates in the second coordinate system can be mapped to the first coordinate system.

[0047] Optionally, in one embodiment, according to the coordinate parameters of the same point in different coordinate systems, such as the coordinates of the first center point and the second center point mentioned above, the difference in the direction of the first coordinate axis and the second coordinate axis is calculated, such as the coordinates of the first center point are (X1, Y1), and the coordinates of the second center point are (X'2, Y'2), and the range parameter I1=X'2-X1 in the X-axis direction, and the range parameter I2=Y'2-Y1 in the Y-axis direction, so that the range parameters in the X-axis and Y-axis directions can be determined, and then the coordinate mapping relationship between the first coordinate system and the second coordinate system can be determined. In this regard, it can be imagined that when the origins of the first coordinate system and the second coordinate system are aligned, for the case where the needle piercing head moves to a point on the wafer disk, after determining the coordinates in one of the coordinate systems, based on the coordinate mapping relationship, the coordinates of the point in the other coordinate system can be determined. Therefore, by establishing a coordinate mapping relationship between the two coordinate systems, the device can more quickly determine the distance of the needle piercing head on the wafer disk relative to the center point of the wafer, which is helpful for detecting whether there is a collision risk.

[0048] Step S130, constructing a distance relationship equation corresponding to the puncturing head and the wafer center point according to the coordinate mapping relationship, the coordinates of the puncturing head in the first coordinate system and the coordinates of the wafer center point in the second coordinate system.

[0049] After the coordinate mapping relationship is determined, the coordinates of the puncturing head in the first coordinate system can be mapped to the second coordinate system, and then combined with the coordinates of the center point of the wafer in the second coordinate system, the distance relationship equation between the puncturing head and the center point of the wafer can be constructed. It can be understood that based on the Pythagorean theorem, in the same coordinate system, the distance between two points can be determined by the spacing between the two points in the X-axis direction and the spacing on the Y-axis. In this regard, after mapping the acquired coordinates to the same coordinate system according to the coordinate mapping relationship, the distance relationship equation between the corresponding puncturing head and the center point of the wafer can be established based on the coordinates of the two points (i.e., the coordinates of the corresponding puncturing head and the coordinates of the corresponding wafer center point mentioned above).

[0050] Step S140, acquiring the first moving position of the puncturing head and the second moving position of the wafer center point in real time to determine the first position coordinates corresponding to the first moving position of the puncturing head in the first coordinate system and the second position coordinates corresponding to the second moving position of the wafer center point in the second coordinate system.

[0051] In actual application, it is necessary to obtain the positions of the puncturing head and the center point of the wafer in real time. For the first moving position of the puncturing head, it can be determined according to the actual encoder values ​​of the motors in two different moving directions that drive the puncturing head to move, and then determine its coordinate parameters in the first coordinate system, that is, the first position coordinates; for the second moving position of the center point of the wafer, it can be determined according to the actual encoder values ​​of the motors in two different moving directions that drive the storage table to move, and then determine its coordinate parameters in the second coordinate system, that is, the second coordinate position. In this regard, the processor obtains the actual encoder value of the motor in real time to determine the above-mentioned first moving position and second moving position, so as to obtain the first position coordinates and the second position coordinates. Of course, in some embodiments, the center point of the wafer can be kept stationary, and then the puncturing head is moved to achieve puncture transfer. In this regard, the coordinates of the center point of the wafer remain unchanged and do not need to be obtained in real time.

[0052] Step S150, determining the coordinate distance between the acupuncture head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation.

[0053] Based on the first position coordinates and the second position coordinates obtained above, they are substituted into the constructed distance relationship equation, and then the two coordinates are mapped to the same coordinate system to calculate the coordinate distance between the acupuncture head and the center point of the wafer. It can be imagined that as the acupuncture head moves, its position also changes, and the calculated coordinate distance also changes. In this regard, after the processor obtains the first position coordinates and the second position coordinates in real time, based on the distance relationship equation, the processor can obtain the coordinate distance between the current position of the acupuncture head and the center point of the wafer in real time.

[0054] Step S160: Determine whether there is a collision risk based on the coordinate distance and the distance threshold corresponding to the preset risk area, so as to control the thorn crystal device according to the preset protection mode when there is a collision risk.

[0055] It can be imagined that a risk area is set for the plane where the wafer disk is located, and the risk area corresponds to a distance threshold, which is the distance relative to the center point of the wafer, that is, the center of the risk area coincides with the center point of the wafer of the wafer disk. Then, after determining the coordinate distance, it is judged whether there is a collision risk based on the distance threshold. For situations where there is a collision risk, the equipment is provided with a preset protection method to protect the crystallization equipment. For example, optionally, in one embodiment, the corresponding protection method is to brake the moving parts so that the moving parts stop moving. If the coordinate distance is greater than or equal to the distance threshold, it can be determined that there is a collision risk at present, and then the crystallization equipment is controlled according to the preset protection method to avoid collision of parts inside the crystallization equipment.

[0056] In one embodiment, the distance threshold corresponding to the risk area includes a first threshold, and the first threshold is less than the radius of the wafer. In this regard, after determining the coordinate distance, the coordinate distance is compared with the first threshold. When the coordinate distance is less than the first threshold, it is determined that the puncture head is located in the safe area and there is no collision risk; when the coordinate distance is greater than or equal to the first threshold, it is determined that the puncture head is located in the interference risk area and there is a collision risk.

[0057] In one embodiment, the distance threshold corresponding to the risk area also includes a second threshold, and the second threshold is greater than the radius of the wafer disk, thereby further dividing the interference risk area into an interference risk warning area and an interference risk triggering area. In this regard, specifically, after determining the coordinate distance, the coordinate distance is also compared with the second threshold. When the coordinate distance is greater than or equal to the first threshold and less than the second threshold, it is determined that the acupuncture head is located in the interference risk warning area. The interference risk warning area is an area for triggering a buffer warning prompt. Optionally, in one embodiment, when the acupuncture head enters the interference risk warning area, a risk prompt can be triggered accordingly, such as by using an audible and visual alarm. Optionally, in one embodiment, when the acupuncture head enters the interference risk warning area, the motion axis that drives the acupuncture head to move can also be triggered to decelerate for buffering.

[0058] When the coordinate distance is greater than or equal to the second threshold, it is determined that the acupuncture head is located in the interference risk triggering area, and it is determined that there is a collision risk, and the acupuncture head is in a more dangerous area and more prone to collision. Optionally, in one embodiment, when the acupuncture head is located in the interference risk triggering area, a control scheme for stopping the movement of the acupuncture head can be triggered accordingly, so that the motion shaft stops driving the acupuncture head to move.

[0059] Figure 3A schematic diagram of the position of the wafer center point and the puncture head provided for an embodiment of the present application, as shown in the figure, the distance threshold corresponding to the risk area includes a first threshold F and a second threshold H, wherein the first threshold F is less than the radius E of the wafer disk W1, and the second threshold H is greater than the radius E of the wafer disk W1. In the figure, point P1 represents the position of the puncture head N1 on the wafer disk W1, and the distance S represents the coordinate distance between the puncture head and the wafer center point. In this regard, when the coordinate distance S is less than the first threshold F, it is determined that the puncture head N1 is located in the safe area, and it is determined that there is no collision risk; when the coordinate distance S is greater than or equal to the first threshold F and less than the second threshold H, it is determined that the puncture head N1 is located in the interference risk area, and it is determined that there is a collision risk; when the coordinate distance S is greater than or equal to the second threshold H, it is determined that the puncture head N1 is located in the safe area, and it is determined that there is no collision risk.

[0060] It can be seen from the above scheme that this scheme establishes a corresponding mapping relationship for the coordinate systems with two origins aligned, further determines the scope of the interference risk area based on the basic size parameters of the wafer disk, and then after determining the dynamically acquired puncture head position and the wafer center point, it can determine the positional relationship between the various groups and realize dynamic real-time monitoring, so that multiple groups in the equipment can achieve high-frequency, high-speed, and high-precision compound motion while preventing collisions, effectively improving the safety of the equipment.

[0061] In one embodiment, the constructed coordinate mapping relationship includes range parameters in the first coordinate axis direction and in the second coordinate axis direction, such as the range parameters include a first range corresponding to the first coordinate axis direction and a second range corresponding to the second coordinate axis direction. Furthermore, when constructing the distance relationship equation, the mapping position of the acupuncture head in the second coordinate system is determined according to the range parameters, that is, the coordinates of the acupuncture head in the first coordinate system are mapped to the second coordinate system to determine the corresponding mapping position. It can be imagined that the mapping position is associated with the second coordinate system. For example, the first coordinate axis direction is the X-axis direction, and the second coordinate axis direction is the Y-axis direction. Based on the above-mentioned first range, the first mapping coordinate in the X-axis direction is determined; based on the above-mentioned second range, the second mapping coordinate in the Y-axis direction is determined, and then combined with the first mapping coordinate and the second mapping coordinate, the mapping position of the position of the acupuncture head in the first coordinate system mapped to the second coordinate system can be determined.

[0062] When the coordinates corresponding to the mapping position are determined, the corresponding distance expression can be determined for the same coordinate axis, that is, the corresponding distance expression is established for two points in the same coordinate axis direction. For example, the first range is I1, the second range is I2, and the coordinates of the needle head in the first coordinate system are (X1, Y1), and the coordinates of the center point of the wafer in the second coordinate system are (X2, Y2). For this, the distance expression in the X-axis direction is: , the distance expression in the Y-axis direction is: .

[0063] It can be understood that based on the range parameters corresponding to the two coordinate axes, the coordinates of the puncturing head in the first coordinate system are mapped to the second coordinate system, such as (X1-I1) and (Y1-I2) mentioned above, and the distance between the center point of the wafer and the puncturing head in the X-axis direction and the Y-axis direction is calculated using the coordinates (X2, Y2) corresponding to the center point of the wafer in the second coordinate system. It can be imagined that when the wafer disk remains stationary, the coordinates (X2, Y2) are fixed values, and the above distance expression has two variables X1 and Y1. After determining the coordinates of the puncturing head, the distance between the center point of the wafer and the puncturing head in the X-axis direction and the Y-axis direction in the second coordinate system can also be determined accordingly. Similarly, when the position of the wafer disk changes, that is, the above distance expression has four variables X1, X2, Y1 and Y2, it is necessary to determine the coordinates of the puncturing head and the coordinates of the center point of the wafer.

[0064] In addition, in the same coordinate system, the distance between two points can be determined by the distance between the two points in the X-axis direction and the distance between the two points in the Y-axis direction, that is, the sum of the squares of the distances in the two coordinate axis directions is equal to the square of the distance between the two points. Therefore, combined with the distance expressions in the two coordinate axis directions, the distance relationship equation constructed is as follows:

[0065]

[0066] Therefore, by constructing a distance relationship equation, the processor can determine the coordinate distance between the puncture head and the center point of the wafer, and then judge whether there is a collision risk at present according to the determined coordinate distance, thereby effectively avoiding interference collisions that are prone to occur when multiple groups perform compound movements.

[0067] After determining the coordinate mapping relationship, when the first position coordinate and the second position coordinate are obtained, the processor can map the obtained coordinates to the same coordinate system according to the coordinate mapping relationship. Therefore, it can be imagined that based on the coordinate mapping relationship, the first position coordinate can be mapped to the second coordinate system, or the second position coordinate can be mapped to the first coordinate system. Then the mapped coordinate system can be preset to calculate the corresponding coordinate distance on the coordinate system. Optionally, in one embodiment, the distance relationship equation is an equation established in the second coordinate system. Accordingly, when the first position coordinate and the second position coordinate are substituted into the distance relationship equation, the first distance in the direction of the first coordinate axis (such as the above-mentioned CoordX) and the second distance in the direction of the second coordinate axis (such as the above-mentioned CoordY) can be calculated based on the second coordinate system, and then the coordinate distance between the acupuncture head and the center point of the wafer in the second coordinate system is determined according to the constructed distance relationship equation. In this regard, the coordinates of the acupuncture head are mapped to the second coordinate system, so that the extreme difference of the two coordinate systems corresponding to the same axial direction can be eliminated, and the coordinate distance between the acupuncture head and the center point of the wafer can be better determined, so as to accurately determine whether there is a collision risk.

[0068] Figure 4 This is a schematic diagram of the structure of a dynamic interference detection device provided in one embodiment of the present application. The device is applied to a crystal piercing device and is used to execute the dynamic interference detection method provided in the above embodiment, and has functional modules and beneficial effects corresponding to the execution method. Among them, the crystal piercing device includes a needle piercing head and a storage table for placing a wafer disc. The crystal piercing device is provided with a first coordinate system corresponding to the needle piercing head, and a second coordinate system corresponding to the wafer disc. The origin of the first coordinate system and the origin of the second coordinate system are both aligned with the fixed marking point of the crystal piercing device. As shown in the figure, the device includes a fixed-point positioning module 401, a coordinate calibration module 402, a relationship construction module 403, a coordinate acquisition module 404, a distance acquisition module 405 and a risk judgment module 406.

[0069] Specifically, the fixed-point positioning module 401 is configured to obtain coordinate parameters of a plurality of edge points of the needle piercing head on the wafer disk to determine a first center coordinate of a wafer center point of the needle piercing head located on the wafer disk, the first center coordinate being associated with a first coordinate system;

[0070] The coordinate calibration module 402 is configured to determine a coordinate mapping relationship between the first coordinate system and the second coordinate system based on the first center coordinate and the second center coordinate, wherein the second center coordinate is the coordinate of the wafer center point of the wafer disk in the second coordinate system;

[0071] The relationship building module 403 is configured to build a distance relationship equation corresponding to the acupuncture head and the center point of the wafer according to the coordinate mapping relationship, the coordinates of the acupuncture head in the first coordinate system and the coordinates of the center point of the wafer in the second coordinate system;

[0072] The coordinate acquisition module 404 is configured to acquire the first moving position of the acupuncture head and the second moving position of the wafer center point in real time to determine the first position coordinates corresponding to the first moving position of the acupuncture head on the first coordinate system and the second position coordinates corresponding to the second moving position of the wafer center point on the second coordinate system;

[0073] The distance acquisition module 405 is configured to determine the coordinate distance between the acupuncture head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation;

[0074] The risk judgment module 406 is configured to determine whether there is a collision risk based on the coordinate distance and the distance threshold corresponding to the preset risk area, so as to control the thorn crystal device according to the preset protection method when there is a collision risk.

[0075] Based on the above embodiment, the edge point is a point on the edge of the wafer disk, and the fixed point positioning module 401 is specifically configured as follows:

[0076] Obtain first coordinates corresponding to a plurality of edge points in a first coordinate system;

[0077] Selecting target edge points in a first axial direction and a second axial direction, where the first axial direction and the second axial direction are respectively parallel to two coordinate axis directions of the first coordinate system;

[0078] Determine a second coordinate corresponding to the center point of the wafer in the first coordinate system according to the first coordinates corresponding to the plurality of target edge points;

[0079] According to the second coordinate, the needle piercing head is moved to the center point of the wafer to determine the first center coordinate when the needle piercing head is located at the center point of the wafer.

[0080] Based on the above embodiment, the coordinate calibration module 402 is specifically configured as follows:

[0081] Calculate the difference between the first center coordinate and the second center coordinate in the same coordinate axis direction as the range parameter;

[0082] The coordinate mapping relationship is determined according to the range parameters in the direction of the first coordinate axis and in the direction of the second coordinate axis.

[0083] Based on the above embodiment, the coordinate mapping relationship includes the range parameters in the first coordinate axis direction and in the second coordinate axis direction, and the relationship construction module 403 is specifically configured as follows:

[0084] According to the range parameter, the mapping position of the coordinates corresponding to the acupuncture head on the second coordinate system is calculated;

[0085] Based on the coordinates corresponding to the mapping position, determining the distance expressions between the coordinates of the center point of the wafer in the second coordinate system and the mapping position in different coordinate axis directions;

[0086] The distance relationship equation is constructed by combining the distance expressions in the direction of the first coordinate axis and the direction of the second coordinate axis.

[0087] Based on the above embodiment, the distance acquisition module 405 is specifically configured as follows:

[0088] Substituting the first position coordinate and the second position coordinate into the distance relationship equation;

[0089] In the case where the distance relationship equation is an equation established in the second coordinate system, determining a first distance in the direction of the first coordinate axis and a second distance in the direction of the second coordinate axis;

[0090] The coordinate distance between the acupuncture head and the center point of the wafer in the second coordinate system is determined according to the first distance and the second distance.

[0091] On the basis of the above embodiment, the distance threshold corresponding to the risk area includes a first threshold, the first threshold is smaller than the radius of the wafer disk, and the risk judgment module 406 is specifically configured as follows:

[0092] When the coordinate distance is less than the first threshold, it is determined that the acupuncture head is located in a safe area and that there is no collision risk;

[0093] When the coordinate distance is greater than or equal to the first threshold, it is determined that the acupuncture head is located in the interference risk area, and it is determined that there is a collision risk.

[0094] On the basis of the above embodiment, the distance threshold corresponding to the risk area further includes a second threshold, and the second threshold is greater than the radius of the wafer disk. The risk judgment module 406 is specifically configured as follows:

[0095] When the coordinate distance is greater than or equal to the first threshold and less than the second threshold, it is determined that the acupuncture head is located in the interference risk prompting area, and the interference risk prompting area is an area for triggering a buffer warning prompt;

[0096] When the coordinate distance is greater than or equal to the second threshold, it is determined that the acupuncture head is located in the interference risk triggering area, and it is determined that there is a collision risk.

[0097] It is worth noting that in the embodiment of the above-mentioned device, the modules included are only divided according to functional logic, but are not limited to the above-mentioned division, as long as the corresponding functions can be achieved; in addition, the specific names of the modules are only for the convenience of distinguishing each other, and are not used to limit the protection scope of the embodiments of the present application.

[0098] Figure 5The schematic diagram of the structure of the thorn crystal device provided in one embodiment of the present application is used to execute the dynamic interference detection method provided in the above embodiment, and has the functional modules and beneficial effects corresponding to the execution method. As shown in the figure, the thorn crystal device includes a processor 501, a memory 502, an input device 503 and an output device 504. The number of processors 501 can be one or more, and one processor 501 is taken as an example in the figure; the processor 501, the memory 502, the input device 503 and the output device 504 can be connected through a bus or other means, and the connection through a bus is taken as an example in the figure. The memory 502, as a computer-readable storage medium, can be used to store software programs, computer executable programs and modules, such as program instructions / modules corresponding to the dynamic interference detection method in the embodiment of the present application. The processor 501 executes various corresponding functional applications and data processing by running the software programs, instructions and modules stored in the memory 502, that is, realizing the above-mentioned dynamic interference detection method.

[0099] The memory 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required for a function; the data storage area may store data recorded or created during use, etc. In addition, the memory 502 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 502 may further include a memory remotely arranged relative to the processor 501, and these remotely arranged memories may be connected to the device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0100] The input device 503 can be used to input corresponding digital or character information to the processor 501, and to generate key signal inputs related to the user settings and function control of the device; the output device 504 can be used to send or display key signal outputs related to the user settings and function control of the device.

[0101] An embodiment of the present application further provides a storage medium storing computer executable instructions, which, when executed by a processor, are used to perform relevant operations in the dynamic interference detection method provided in any embodiment of the present application.

[0102] Computer-readable storage media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0103] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0104] Note that the above are only preferred embodiments of the present application and the technical principles used. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application is described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A dynamic interference detection method, characterized in that: Applied to a crystal piercing device, the crystal piercing device includes a piercing head and a storage table for placing a wafer disk, the crystal piercing device is provided with a first coordinate system corresponding to the piercing head, and a second coordinate system corresponding to the wafer disk, the origin of the first coordinate system and the origin of the second coordinate system are both aligned with the fixed marking point of the crystal piercing device, and the dynamic interference detection method includes: Acquire coordinate parameters of a plurality of edge points of the puncture head on the wafer disk to determine a first center coordinate of a wafer center point of the puncture head located on the wafer disk, wherein the first center coordinate is associated with the first coordinate system; Based on the first center coordinate and the second center coordinate, determining a coordinate mapping relationship between the first coordinate system and the second coordinate system, wherein the second center coordinate is a coordinate of a wafer center point of the wafer disk in the second coordinate system; Constructing a distance relationship equation corresponding to the acupuncture head and the center point of the wafer according to the coordinate mapping relationship, the coordinates of the acupuncture head in the first coordinate system, and the coordinates of the center point of the wafer in the second coordinate system; Acquire the first moving position of the acupuncture head and the second moving position of the center point of the wafer in real time to determine the first position coordinates corresponding to the first moving position of the acupuncture head on the first coordinate system and the second position coordinates corresponding to the second moving position of the center point of the wafer on the second coordinate system; Determine the coordinate distance between the acupuncture head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation; Based on the distance threshold between the coordinate distance and the preset risk area, determining whether there is a collision risk, so as to control the thorn crystal device according to a preset protection mode when there is a collision risk; Wherein, the edge point is a point on the edge of the wafer disk, and the coordinate parameters of the plurality of edge points of the puncturing head on the wafer disk are obtained to determine the first center coordinate of the wafer center point of the puncturing head located on the wafer disk, and the first center coordinate is associated with the first coordinate system, including: Obtaining first coordinates corresponding to a plurality of the edge points in the first coordinate system; Selecting a target edge point in a first axial direction and a second axial direction, wherein the first axial direction and the second axial direction are respectively parallel to two coordinate axis directions of the first coordinate system; Determine the second coordinate corresponding to the center point of the wafer in the first coordinate system according to the first coordinates corresponding to the plurality of target edge points; According to the second coordinate, the puncture head is moved to the center point of the wafer to determine the first center coordinate when the puncture head is located at the center point of the wafer.

2. The dynamic interference detection method according to claim 1, characterized in that: The determining, based on the first center coordinate and the second center coordinate, a coordinate mapping relationship between the first coordinate system and the second coordinate system, wherein the second center coordinate is associated with the second coordinate system and the second center coordinate is a coordinate of a wafer center point of the wafer disk in the second coordinate system, comprises: Calculate the difference between the first center coordinate and the second center coordinate in the same coordinate axis direction as a range parameter; The coordinate mapping relationship is determined according to the range parameters in the direction of the first coordinate axis and in the direction of the second coordinate axis.

3. The dynamic interference detection method according to claim 1 or 2, characterized in that: The coordinate mapping relationship includes range parameters in the first coordinate axis direction and in the second coordinate axis direction; According to the coordinate mapping relationship, the coordinates of the puncturing head in the first coordinate system and the coordinates of the center point of the wafer in the second coordinate system, a distance relationship equation corresponding to the puncturing head and the center point of the wafer is constructed, including: According to the range parameter, calculating the mapping position of the coordinates corresponding to the acupuncture head on the second coordinate system; Based on the coordinates corresponding to the mapping position, determining distance expressions between the coordinates of the center point of the wafer in the second coordinate system and the mapping position in different coordinate axis directions; The distance relationship equation is constructed by combining the distance expressions in the first coordinate axis direction and in the second coordinate axis direction.

4. The dynamic interference detection method according to claim 1, characterized in that: The step of determining the coordinate distance between the puncturing head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation includes: Substituting the first position coordinates and the second position coordinates into the distance relationship equation; In a case where the distance relationship equation is an equation established in the second coordinate system, determining a first distance in the direction of the first coordinate axis and a second distance in the direction of the second coordinate axis; The coordinate distance between the puncturing head and the center point of the wafer in the second coordinate system is determined according to the first distance and the second distance.

5. The dynamic interference detection method according to claim 1, characterized in that: The distance threshold corresponding to the risk area includes a first threshold, and the first threshold is smaller than the radius of the wafer disk; The determining whether there is a collision risk based on the distance between the coordinate distance and a distance threshold corresponding to a preset risk area, so as to control the thorn crystal device in a preset protection mode when there is a collision risk, includes: When the coordinate distance is less than the first threshold, determining that the acupuncture head is located in a safe area and determining that there is no collision risk; When the coordinate distance is greater than or equal to the first threshold, it is determined that the acupuncture head is located in an interference risk area, and it is determined that there is a collision risk.

6. The dynamic interference detection method according to claim 5, characterized in that: The distance threshold corresponding to the risk area further includes a second threshold, and the second threshold is greater than the radius of the wafer disk. The method further includes: When the coordinate distance is greater than or equal to the first threshold and less than the second threshold, it is determined that the acupuncture head is located in an interference risk warning area, and the interference risk warning area is an area for triggering a buffer warning prompt; When the coordinate distance is greater than or equal to the second threshold, it is determined that the acupuncture head is located in the interference risk triggering area, and it is determined that there is a collision risk.

7. A dynamic interference detection device, characterized in that: Applied to a crystal piercing device, the crystal piercing device includes a piercing head and a storage table for placing a wafer disk, the crystal piercing device is provided with a first coordinate system corresponding to the piercing head, and a second coordinate system corresponding to the wafer disk, the origin of the first coordinate system and the origin of the second coordinate system are both aligned with the fixed marking point of the crystal piercing device, and the dynamic interference detection device includes: A fixed-point positioning module, configured to obtain coordinate parameters of a plurality of edge points of the puncturing head on the wafer disk to determine a first center coordinate of a wafer center point of the puncturing head located on the wafer disk, wherein the first center coordinate is associated with the first coordinate system; A coordinate calibration module, configured to determine a coordinate mapping relationship between the first coordinate system and the second coordinate system based on the first center coordinate and the second center coordinate, wherein the second center coordinate is a coordinate of a wafer center point of the wafer disk in the second coordinate system; a relationship building module configured to build a distance relationship equation corresponding to the acupuncture head and the center point of the wafer according to the coordinate mapping relationship, the coordinates of the acupuncture head in the first coordinate system, and the coordinates of the center point of the wafer in the second coordinate system; a coordinate acquisition module configured to acquire a first moving position of the acupuncture head and a second moving position of the wafer center point in real time, so as to determine a first position coordinate corresponding to the first moving position of the acupuncture head on the first coordinate system and a second position coordinate corresponding to the second moving position of the wafer center point on the second coordinate system; A distance acquisition module, configured to determine the coordinate distance between the acupuncture head and the center point of the wafer at the same coordinate according to the first position coordinate, the second position coordinate and the distance relationship equation; A risk judgment module is configured to determine whether there is a collision risk based on the coordinate distance and a distance threshold corresponding to a preset risk area, so as to control the thorn crystal device according to a preset protection mode when there is a collision risk; Wherein, the edge point is a point on the edge of the wafer disk, and the fixed-point positioning module is specifically configured as follows: Obtaining first coordinates corresponding to a plurality of the edge points in the first coordinate system; Selecting a target edge point in a first axial direction and a second axial direction, wherein the first axial direction and the second axial direction are respectively parallel to two coordinate axis directions of the first coordinate system; Determine the second coordinate corresponding to the center point of the wafer in the first coordinate system according to the first coordinates corresponding to the plurality of target edge points; According to the second coordinate, the puncture head is moved to the center point of the wafer to determine the first center coordinate when the puncture head is located at the center point of the wafer.

8. A crystal piercing device, characterized in that: include: one or more processors; A storage device for storing one or more programs, when the one or more programs are executed by the one or more processors, the one or more processors implement the dynamic interference detection method as described in any one of claims 1-6.

9. A storage medium storing computer executable instructions, characterized in that: When the computer executable instructions are executed by a processor, they are used to perform the dynamic interference detection method according to any one of claims 1 to 6.

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